Circuit board processing pressing device and use method thereof

Abstract

The present invention discloses a circuit board processing and pressing device and a method for using the same, and relates to the field of circuit board processing and pressing devices. The circuit board processing and pressing device comprises a pressing machine, a pressing cylinder, a hot pressing plate and a pressing plate, the hot pressing plate is provided with a positioning unit and a pushing unit, and the pressing plate is provided with an adjusting unit and a pressure unit. The circuit board processing and pressing device defines the circuit board by a first positioning plate, contacts and presses the two sides of the circuit board by a second positioning plate, and pushes the circuit board to a suitable position on the hot pressing plate. The spacing between the positioning seat and the pressure unit, the spacing between adjacent pressure units, and the spacing between the pressure unit and the connecting seat are the same, and the position of the pressing seat is adjusted so that a plurality of pressing seats are distributed at equal distances, which has a better pressing effect on the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing and pressing devices, and in particular to a circuit board processing and pressing device and a use method thereof. Background Art

[0002] The circuit board processing pressing device is used to press and solidify the various layers of materials of the multi-layer circuit board.

[0003] When laminating the circuit board, the adhesive between the multi-layer boards is melted and flowed by heating and pressurizing, so as to achieve a close bond between different layers. During the lamination process, parameters such as temperature, pressure and time need to be precisely controlled to ensure the lamination quality and circuit board performance.

[0004] In the prior art, the multilayer board is accurately positioned according to the design requirements, aligned by positioning pins, etc., and preliminarily pressed at low temperature and low pressure to make the interlayer materials preliminarily bonded. After the pre-pressing is completed, the multilayer board is moved into the hot press and formally pressed under high temperature and high pressure. The prior art uses positioning pins to position the multilayer board covered on the circuit board, which requires manual positioning operation in the pressing device, which has certain safety hazards. When the positioning is skewed, the pressing plate contacts the positioning pins during the pressing process, resulting in poor pressing effect. At the same time, when pressing circuit boards of different sizes, the same pressing plate is used, and there is uneven pressing force. The multilayer board on the circuit board will be used many times. When the multilayer board is worn or deformed, it will also affect the pressing effect of the circuit board, making the colloid material flow incomplete, resulting in poor bonding effect of the interlayer materials. Therefore, we propose a circuit board processing pressing device and its use method. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a circuit board processing pressing device and a method for using the same, which solves the problem of safety hazards caused by manual positioning operations in the pressing device. When the positioning is skewed, the positioning pins come into contact during the pressing process of the pressing plate, resulting in poor pressing effect. When pressing circuit boards of different sizes using the same pressing plate, uneven pressing force occurs. The multilayer board on the circuit board will be used multiple times. When the multilayer board is worn or deformed, it will also affect the pressing effect of the circuit board, causing incomplete flow of the colloid material and poor bonding effect between the layers.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a circuit board processing pressing device and a method of using the same, comprising a pressing machine, a pressing cylinder, a hot pressing plate and a pressing plate, wherein the pressing cylinder is installed on the top of the pressing machine, the hot pressing plate is fixedly installed on the pressing machine, the pressing plate is connected to the output end of the pressing cylinder, the pressing plate is located directly above the hot pressing plate, a positioning unit and a pushing unit are provided on the hot pressing plate, and an adjusting unit and a pressure unit are provided on the pressing plate.

[0007] The positioning unit comprises a first positioning plate, a second positioning plate and a rotating rod, the first positioning plate and the second positioning plate are both slidably connected to the hot pressing plate, the bottom end surface of the first positioning plate is rotatably connected to the rotating rod, the two rotating rods are located on both sides of the first positioning plate, and the rotating rod is rotatably connected to the second positioning plate at one end away from the first positioning plate;

[0008] The pushing unit comprises a pushing rod, one end of which is rotatably connected to the second positioning plate, and the other end of which is rotatably connected to a sliding seat, and the sliding seat is slidably connected to the inner wall of the pressing machine;

[0009] The adjustment unit includes a positioning seat and a connecting seat, wherein the positioning seat is slidably connected to the inner wall of the pressing plate, the connecting seat is fixedly connected to the bottom of the pressing plate, the connecting seat is located between the positioning seats, and a pressing seat is arranged between the positioning seat and the connecting seat;

[0010] The pressure unit comprises a second spring and a telescopic rod, wherein the telescopic rod is located between the positioning seat and the pressing seat, between the pressing seat and the pressing seat, and between the pressing seat and the connecting seat, and the second spring is sleeved on the outer peripheral wall of the telescopic rod.

[0011] Preferably, a positioning cylinder is fixedly installed on the pressing machine, and an output end of the positioning cylinder is fixedly connected to a push plate, and one side of the push plate is in contact with the first positioning plate.

[0012] Preferably, a fixed seat is fixedly connected to the inner wall of the pressing machine, a sliding rod is slidably connected to the inner wall of the fixed seat, the top end surface of the sliding rod is fixedly connected to the sliding seat, a first spring is sleeved on the outer peripheral wall of the sliding rod, and both sides of the first spring are respectively fixedly connected to the fixed seat and the sliding seat.

[0013] Preferably, the second positioning plate is located directly below the pressing plate, an adjustment seat is slidably connected to the inner wall of the pressing plate, the adjustment seat is fixedly connected to the positioning seat, a bidirectional screw is threadedly connected to the inner wall of the adjusting seat, and the bidirectional screw is rotatably connected to the inner wall of the pressing plate.

[0014] Preferably, one end of the bidirectional screw rod is outside the pressing plate, and a driving mechanism is connected to the end of the bidirectional screw rod.

[0015] Preferably, a fixing block is fixedly connected to the outer walls of the positioning seat, the connecting seat and the pressing seat, a rotating seat is rotatably connected to the inner wall of the fixing block, and two corresponding rotating seats are fixedly connected to both ends of the telescopic rod.

[0016] Preferably, the corresponding rotating seat is fixedly connected to both ends of the second spring, and the rotating seat is in a compressed state.

[0017] A method for using a circuit board processing and pressing device comprises the following steps:

[0018] According to the size of the circuit board, the initial position of the first positioning plate is adjusted, and the positioning cylinder is started to drive the push plate to move. At this time, the push plate pushes the first positioning plate to move, and the first positioning plate is moved to a suitable position on the hot pressing plate;

[0019] The driving mechanism drives the bidirectional screw rod to rotate, and the positions of the adjusting seat and the positioning seat are adjusted. When the positioning seat drives the fixed block to move, the fixed block pushes the rotating seat to move and rotate. At this time, the spacing between the positioning seat and the pressing seat, the pressing seat and the pressing seat, and the pressing seat and the connecting seat are the same, and the position of the pressing seat is adjusted so that multiple pressing seats are distributed at equal distances.

[0020] The circuit board is placed on the hot press plate. When the hot press plate contacts the first positioning plate, the positioning cylinder is started to drive the push plate to separate from the first positioning plate. Under the rebound of the first spring, the sliding seat moves to push the push rod to rotate, so that the second positioning plate slides along the inner wall of the hot press plate. At this time, the two second positioning plates move toward each other, and the second positioning plates contact and squeeze the two sides of the circuit board to push the circuit board to a suitable position on the hot press plate, so that the hot press plate is directly below the pressing plate.

[0021] When the pressing cylinder is started to drive the pressing plate to move downward, the positioning seat moves downward accordingly. When the positioning seat contacts the second positioning plate, the second positioning plate is pushed to slide along the inner wall of the hot pressing plate, so that the second positioning plate is away from the circuit board. At this time, the connecting seat and the pressing seat on the pressing plate contact the multilayer board on the circuit board, and then the circuit board is pressed through the connecting seat and the pressing seat;

[0022] When the pressing plate moves, the pressing seat contacts the multilayer board. When unevenness appears on the multilayer board, the pressing seat is pushed to move, so that the pressing seat moves relative to the other pressing seats, so that the fixed block on the pressing seat moves. Under the relative movement of the fixed block, the telescopic rod is telescoped and rotated. At this time, the other pressing seats continue to move and contact the multilayer board on the circuit board to press the circuit board.

[0023] The present invention discloses a circuit board processing and pressing device and a method for using the same, which have the following beneficial effects:

[0024] 1. The circuit board processing and pressing device and its use method, start the positioning cylinder to drive the push plate to move, at this time the push plate pushes the first positioning plate to move, under the movement of the first positioning plate, the first positioning plate drives the rotating rod to rotate, under the rotation of the rotating rod, the rotating rod pushes the second positioning plate to slide along the inner wall of the hot pressing plate, by moving the first positioning plate to a suitable position on the hot pressing plate, the circuit board is limited by the first positioning plate, so that the circuit board is in a suitable position;

[0025] 2. The circuit board processing pressing device and its use method, when the circuit board is placed on the hot pressing plate, the hot pressing plate contacts the first positioning plate, and performs preliminary positioning. Under the rebound of the first spring, the sliding seat drives the sliding rod to move, so that the second positioning plate slides along the inner wall of the hot pressing plate. At this time, the two second positioning plates move toward each other, and the second positioning plates contact and squeeze the two sides of the circuit board to push the circuit board to a suitable position on the hot pressing plate, so that the hot pressing plate is directly below the pressing plate, which is convenient for the pressing effect of the hot pressing plate, and avoids the situation where manual positioning leads to the existence of safety hazards;

[0026] 3. The circuit board processing pressing device and its use method, when the positioning seat moves, the positioning seat drives the fixed block to move, so that the fixed block pushes the rotating seat to move and rotate, so that the telescopic rod is extended and retracted. At this time, the spacing between the positioning seat and the pressure unit, the spacing between adjacent pressure units, and the spacing between the pressure unit and the connecting seat are the same. The position of the pressing seat is adjusted so that multiple pressing seats are distributed at equal distances, so that the pressing seats are set corresponding to the circuit board, which is convenient for setting circuit boards of different sizes. The pressing effect of the circuit board is better through multiple pressing seats;

[0027] 4. The circuit board processing pressing device and the use method thereof, when the pressing plate moves, the pressing seat contacts with the multilayer board, when the multilayer board becomes uneven, the pressing seat is pushed to move, so that the pressing seat moves relative to the remaining pressing seats, so that the fixed block on the pressing seat moves, and under the relative movement of the fixed block, the telescopic rod is extended and rotated, and at this time the remaining pressing seats continue to move to contact with the multilayer board on the circuit board to press the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a schematic diagram of the structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the internal structure of the pressing machine of the present invention;

[0031] Figure 3 This is a schematic diagram of the connection of the hot pressing plate of the present invention;

[0032] Figure 4 This is a schematic diagram of the positioning unit structure of the present invention;

[0033] Figure 5 This is a schematic diagram of the structure of the propulsion unit of the present invention;

[0034] Figure 6 It is a schematic diagram of the structure of the pressed plate of the present invention;

[0035] Figure 7 This is a schematic diagram of the structure of the regulating unit of the present invention;

[0036] Figure 8 For the present invention Figure 7 A magnified view of the structure in the middle;

[0037] Fig. 9 It is a schematic diagram of the structure of the pressure unit of the present invention.

[0038] In the figure: 1. Pressing machine; 2. Pressing cylinder; 3. Hot pressing plate; 4. Pressing plate; 5. Positioning unit; 501. First positioning plate; 502. Second positioning plate; 503. Rotating rod; 504. Positioning cylinder; 505. Pushing plate; 6. Pushing unit; 601. Pushing rod; 602. Sliding seat; 603. First spring; 604. Fixed seat; 605. Sliding rod; 7. Adjusting unit; 701. Positioning seat; 702. Bidirectional screw rod; 703. Connecting seat; 704. Pressing seat; 705. Adjusting seat; 8. Pressure unit; 801. Second spring; 802. Telescopic rod; 803. Rotating seat; 804. Fixed block. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The embodiment of the present application provides a circuit board processing and pressing device and a method for using the same, which solves the problem that manual positioning operation in the pressing device has certain safety hazards. When the positioning is skewed, the positioning pins may contact during the pressing process of the pressing plate 4, resulting in poor pressing effect. At the same time, when pressing circuit boards of different sizes, the same pressing plate 4 is used, and uneven pressing force occurs. The multilayer board on the circuit board will be used many times. When the multilayer board is worn or deformed, the pressing effect of the circuit board will be affected, so that the colloid material does not flow completely, resulting in poor bonding effect between the layers. The positioning cylinder 504 drives the push plate 505 to move, pushes the first positioning plate 501 to move, drives the rotating rod 503 to rotate, so that the rotating rod 503 drives the second positioning plate 502 to slide along the inner wall of the hot pressing plate 3, and moves the first positioning plate 501 to a suitable position on the hot pressing plate 3, and limits the circuit board by the first positioning plate 501, so that the circuit board is in a suitable position.

[0041] When the circuit board is placed on the hot pressing plate 3, the hot pressing plate 3 is in contact with the first positioning plate 501 for preliminary positioning. Under the rebound of the first spring 603, the sliding seat 602 is pushed to drive the sliding rod 605 to move. At this time, the two second positioning plates 502 move toward each other, and the second positioning plates 502 contact and squeeze the two sides of the circuit board, pushing the circuit board to a suitable position on the hot pressing plate 3, so that the hot pressing plate 3 is directly below the pressing plate 4, which is convenient for the pressing effect of the hot pressing plate 3 and avoids the situation where manual positioning leads to safety hazards.

[0042] When the positioning seat 701 moves, the positioning seat 701 drives the fixed block 804 to move, so that the fixed block 804 pushes the rotating seat 803 to move and rotate, so that the telescopic rod 802 is telescoped. At this time, the spacing between the positioning seat 701 and the pressure unit 8, the spacing between adjacent pressure units 8, and the spacing between the pressure unit 8 and the connecting seat 703 are the same. The position of the pressing seat 704 is adjusted so that the multiple pressing seats 704 are distributed at equal distances, so that the pressing seats 704 are set corresponding to the circuit board, which is convenient for setting circuit boards of different sizes. The pressing effect of the circuit board is better through the multiple pressing seats 704.

[0043] When the pressing plate 4 moves, the pressing seat 704 contacts the multilayer board. When unevenness appears on the multilayer board, the pressing seat 704 is pushed to move, so that the pressing seat 704 moves relative to the other pressing seats 704, so that the fixed block 804 on the pressing seat 704 moves. Under the relative movement of the fixed block 804, the telescopic rod 802 is telescoped and rotated. At this time, the other pressing seats 704 continue to move and contact the multilayer board on the circuit board to press the circuit board.

[0044] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0045] The embodiment of the invention discloses a circuit board processing and pressing device and a use method thereof.

[0046] According to the attached Figure 1-9 As shown, it includes a pressing machine 1, a pressing cylinder 2, a hot pressing plate 3 and a pressing plate 4. The pressing cylinder 2 is installed on the top of the pressing machine 1, and the hot pressing plate 3 is fixedly installed on the pressing machine 1. The pressing plate 4 is connected to the output end of the pressing cylinder 2. The pressing plate 4 is directly above the hot pressing plate 3. The hot pressing plate 3 is provided with a positioning unit 5 and a pushing unit 6. The pressing plate 4 is provided with an adjusting unit 7 and a pressure unit 8.

[0047] The positioning unit 5 includes a first positioning plate 501, a second positioning plate 502 and a rotating rod 503. The first positioning plate 501 and the second positioning plate 502 are both slidably connected to the hot pressing plate 3. The bottom end surface of the first positioning plate 501 is rotatably connected to the rotating rod 503. The two rotating rods 503 are located on both sides of the first positioning plate 501. The rotating rod 503 is rotatably connected to the second positioning plate 502 at one end away from the first positioning plate 501. The positioning cylinder 504 is started to drive the pushing plate 505 to move. At this time, the pushing plate 505 pushes the first positioning plate 501 to move. Under the movement of the first positioning plate 501, the first positioning plate 501 drives the rotating rod 503 to rotate. Under the rotation of the rotating rod 503, the rotating rod 503 pushes the second positioning plate 502 to slide along the inner wall of the hot pressing plate 3. By moving the first positioning plate 501 to a suitable position on the hot pressing plate 3, the circuit board is defined by the first positioning plate 501 so that the circuit board is in a suitable position.

[0048] The pushing unit 6 includes a pushing rod 601, one end of which is rotatably connected to the second positioning plate 502, and the other end of the pushing rod 601 is rotatably connected to a sliding seat 602, which is slidably connected to the inner wall of the pressing machine 1. When the circuit board is placed on the hot pressing plate 3, the hot pressing plate 3 is in contact with the first positioning plate 501 for preliminary positioning. Under the rebound of the first spring 603, the sliding seat 602 is pushed to drive the sliding rod 605 to move, so that the second positioning plate 502 slides along the inner wall of the hot pressing plate 3. At this time, the two second positioning plates 502 move toward each other, and the second positioning plates 502 contact and squeeze the two sides of the circuit board to push the circuit board to a suitable position on the hot pressing plate 3, so that the hot pressing plate 3 is directly below the pressing plate 4, which is convenient for the pressing effect of the hot pressing plate 3 and avoids manual positioning, resulting in safety hazards.

[0049] The adjusting unit 7 includes a positioning seat 701 and a connecting seat 703. The positioning seat 701 is slidably connected to the inner wall of the pressing plate 4, and the connecting seat 703 is fixedly connected to the bottom of the pressing plate 4. The connecting seat 703 is between the positioning seats 701, and a pressing seat 704 is arranged between the positioning seat 701 and the connecting seat 703. When the positioning seat 701 moves, the positioning seat 701 drives the fixing block 804 to move, so that the fixing block 804 pushes the rotating seat 803 to move and rotate, so that the telescopic rod 802 is telescoped. At this time, the spacing between the positioning seat 701 and the pressure unit 8, the spacing between adjacent pressure units 8, and the spacing between the pressure unit 8 and the connecting seat 703 are the same. The position of the pressing seat 704 is adjusted so that a plurality of pressing seats 704 are distributed at equal distances, so that the pressing seat 704 is arranged corresponding to the circuit board, which is convenient for the arrangement of circuit boards of different sizes. The pressing effect of the circuit board is better through the plurality of pressing seats 704.

[0050] The pressure unit 8 includes a second spring 801 and a telescopic rod 802. The telescopic rod 802 is located between the positioning seat 701 and the pressing seat 704, the pressing seat 704 and the pressing seat 704, and the pressing seat 704 and the connecting seat (703). The second spring 801 is sleeved on the outer peripheral wall of the telescopic rod 802. When the pressing plate 4 moves, the pressing seat 704 contacts the multilayer board. When unevenness occurs on the multilayer board, the pressing seat 704 is pushed to move, so that the pressing seat 704 moves relative to the remaining pressing seats 704, so that the fixed block 804 on the pressing seat 704 moves. Under the relative movement of the fixed block 804, the telescopic rod 802 is telescoped and rotated. At this time, the remaining pressing seats 704 continue to move to contact the multilayer board on the circuit board to press the circuit board.

[0051] A positioning cylinder 504 is fixedly installed on the pressing machine 1, and a pushing plate 505 is fixedly connected to the output end of the positioning cylinder 504. One side of the pushing plate 505 is in contact with the first positioning plate 501. The positioning cylinder 504 is started to drive the pushing plate 505 to move. At this time, the pushing plate 505 pushes the first positioning plate 501 to move. Under the movement of the first positioning plate 501, the first positioning plate 501 drives the rotating rod 503 to rotate. Under the rotation of the rotating rod 503, the rotating rod 503 pushes the second positioning plate 502 to slide along the inner wall of the hot pressing plate 3. By moving the first positioning plate 501 to a suitable position on the hot pressing plate 3, the circuit board is limited by the first positioning plate 501, so that the circuit board is in a suitable position.

[0052] A fixed seat 604 is fixedly connected to the inner wall of the pressing machine 1, and a sliding rod 605 is slidably connected to the inner wall of the fixed seat 604. The top end surface of the sliding rod 605 is fixedly connected to the sliding seat 602, and a first spring 603 is sleeved on the outer peripheral wall of the sliding rod 605. The two sides of the first spring 603 are respectively fixedly connected to the fixed seat 604 and the sliding seat 602. When the first positioning plate 501 pushes the second positioning plate 502 to move, the second positioning plate 502 pushes the push rod 601 to rotate. Under the rotation of the push rod 601, the sliding seat 602 and the sliding rod 605 are pushed to move. At this time, the sliding rod 605 slides along the inner wall of the fixed seat 604, and the sliding seat 602 compresses the first spring 603.

[0053] Specifically disclosed, when the circuit board is placed on the hot pressing plate 3, when the hot pressing plate 3 contacts the first positioning plate 501, the positioning cylinder 504 is started to drive the push plate 505 to move in the opposite direction and separate from the first positioning plate 501, and under the rebound of the first spring 603, the sliding seat 602 is pushed to drive the sliding rod 605 to move, and under the movement of the sliding seat 602, the push rod 601 is pushed to rotate, so that the second positioning plate 502 slides along the inner wall of the hot pressing plate 3. At this time, the two second positioning plates 502 move toward each other, and the second positioning plates 502 contact and squeeze the two sides of the circuit board to push the circuit board to a suitable position on the hot pressing plate 3, so that the hot pressing plate 3 is directly below the pressing plate 4, which is convenient for the pressing effect of the hot pressing plate 3.

[0054] The second positioning plate 502 is located directly below the pressing plate 4, and an adjusting seat 705 is slidably connected to the inner wall of the pressing plate 4, and the adjusting seat 705 is fixedly connected to the positioning seat 701. A bidirectional screw rod 702 is threadedly connected to the inner wall of the pressing plate 4, and the bidirectional screw rod 702 is rotatably connected to the inner wall of the pressing plate 4. The bidirectional screw rod 702 rotates, and the adjusting seat 705 rotates along the inner wall of the bidirectional screw rod 702 under the rotation of the bidirectional screw rod 702. At this time, the adjusting seat 705 slides along the inner wall of the pressing plate 4, and the positioning seat 701 moves accordingly under the sliding of the adjusting seat 705. The two adjusting seats 705 move toward each other, so that the positioning seat 701 moves toward each other, and the positioning seat 701 is set corresponding to the second positioning plate 502;

[0055] Furthermore, when the pressing cylinder 2 drives the pressing plate 4 to move downward, the positioning seat 701 moves downward accordingly. When the positioning seat 701 contacts the second positioning plate 502, the second positioning plate 502 is pushed to slide along the inner wall of the hot pressing plate 3, so that the second positioning plate 502 is away from the circuit board. At this time, the connecting seat 703 and the pressing seat 704 on the pressing plate 4 contact the multilayer board on the circuit board, and then the circuit board is pressed through the connecting seat 703 and the pressing seat 704.

[0056] One end of the bidirectional screw rod 702 is outside the pressing plate 4, and a driving mechanism is connected to the end of the bidirectional screw rod 702, which drives the bidirectional screw rod 702 to rotate. When the bidirectional screw rod 702 rotates, the positions of the adjustment seat 705 and the positioning seat 701 are adjusted, so that the positioning seat 701 is adjusted to correspond to the second positioning plate 502, so that the positioning seat 701 can be limited to circuit boards of different sizes.

[0057] The outer walls of the positioning seat 701, the connecting seat 703 and the pressing seat 704 are all fixedly connected with a fixed block 804, and the inner wall of the fixed block 804 is rotatably connected with a rotating seat 803, and the two corresponding rotating seats 803 are fixedly connected to the two ends of the telescopic rod 802. When the positioning seat 701 moves, the positioning seat 701 drives the fixed block 804 to move, so that the fixed block 804 pushes the rotating seat 803 to move and rotate, so that the telescopic rod 802 is telescoped. At this time, the spacing between the positioning seat 701 and the pressure unit 8, the spacing between adjacent pressure units 8, and the spacing between the pressure unit 8 and the connecting seat 703 are the same. The position of the pressing seat 704 is adjusted so that multiple pressing seats 704 are distributed at equal distances, so that the pressing seat 704 is set corresponding to the circuit board, which is convenient for setting circuit boards of different sizes, and the pressing effect of the circuit board is better through multiple pressing seats 704.

[0058] The corresponding rotating seat 803 is fixedly connected to both ends of the second spring 801, and the rotating seat 803 is in a compressed state. Under the rebound of the second spring 801, the second spring 801 generates a thrust on the rotating seat 803 and the fixed block 804 to the specified pressure unit 8. At this time, the pressure unit 8 squeezes the fixed block 804 on the other side, so that the fixed block 804 generates a thrust on the rotating seat 803, so that the rotating seat 803 compresses the second spring 801 connected thereto, so that the telescopic rod 802 is extended and retracted. Under the action of the pressure unit 8, the compression degree of multiple second springs 801 is the same;

[0059] It should be particularly emphasized that when the pressing plate 4 moves, the pressing seat 704 contacts the multilayer board. When the multilayer board is uneven, the pressing seat 704 is pushed to move, so that the pressing seat 704 moves relative to the other pressing seats 704, so that the fixed block 804 on the pressing seat 704 moves. Under the relative movement of the fixed block 804, the telescopic rod 802 is telescoped and rotated. At this time, the other pressing seats 704 continue to move to contact the multilayer board on the circuit board to press the circuit board.

[0060] Furthermore, multiple pressing seats 704 are in contact with the multi-layer boards on the circuit board, so that multiple pressing seats 704 press the circuit board, ensuring the pressing effect of the circuit board, avoiding uneven multi-layer boards and poor pressing effect, improving the full flow of glue, filling the gaps between the inner layer circuits, and at the same time tightly combining with the inner core board and the outer copper foil to provide the necessary electrical insulation and impedance control, ensuring the glue filling and bonding between the inner layer circuits, as well as the dimensional stability and flatness of the board.

[0061] Working principle: According to the size of the circuit board, the initial position of the first positioning plate 501 is adjusted, and the positioning cylinder 504 is started to drive the push plate 505 to move. At this time, the push plate 505 pushes the first positioning plate 501 to move, and the first positioning plate 501 is moved to a suitable position on the hot pressing plate 3;

[0062] The driving mechanism drives the bidirectional screw rod 702 to rotate, and the positions of the adjusting seat 705 and the positioning seat 701 are adjusted. When the positioning seat 701 drives the fixing block 804 to move, the fixing block 804 pushes the rotating seat 803 to move and rotate. At this time, the spacing between the positioning seat 701 and the pressing seat 704, the pressing seat 704 and the pressing seat 704, and the pressing seat 704 and the connecting seat 703 are the same, and the position of the pressing seat 704 is adjusted so that multiple pressing seats 704 are distributed at equal distances.

[0063] The circuit board is placed on the hot pressing plate 3. When the hot pressing plate 3 contacts the first positioning plate 501, the positioning cylinder 504 is started to drive the push plate 505 to separate from the first positioning plate 501. Under the rebound of the first spring 603, the sliding seat 602 moves to push the push rod 601 to rotate, so that the second positioning plate 502 slides along the inner wall of the hot pressing plate 3. At this time, the two second positioning plates 502 move toward each other, and the second positioning plates 502 contact and squeeze the two sides of the circuit board to push the circuit board to a suitable position on the hot pressing plate 3, so that the hot pressing plate 3 is directly below the pressing plate 4.

[0064] When the pressing cylinder 2 is started to drive the pressing plate 4 to move downward, the positioning seat 701 moves downward accordingly. When the positioning seat 701 contacts the second positioning plate 502, the second positioning plate 502 is pushed to slide along the inner wall of the hot pressing plate 3, so that the second positioning plate 502 is away from the circuit board. At this time, the connecting seat 703 and the pressing seat 704 on the pressing plate 4 contact the multilayer board on the circuit board, and then the circuit board is pressed through the connecting seat 703 and the pressing seat 704;

[0065] When the pressing plate 4 moves, the pressing seat 704 contacts the multilayer board. When unevenness appears on the multilayer board, the pressing seat 704 is pushed to move, so that the pressing seat 704 moves relative to the other pressing seats 704, so that the fixed block 804 on the pressing seat 704 moves. Under the relative movement of the fixed block 804, the telescopic rod 802 is telescoped and rotated. At this time, the other pressing seats 704 continue to move and contact the multilayer board on the circuit board to press the circuit board.

[0066] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A circuit board processing and pressing device, comprising a pressing machine (1), a pressing cylinder (2), a hot pressing plate (3) and a pressing plate (4), characterized in that: The pressing cylinder (2) is installed on the top of the pressing machine (1), the hot pressing plate (3) is fixedly installed on the pressing machine (1), the pressing plate (4) is connected to the output end of the pressing cylinder (2), the pressing plate (4) is located directly above the hot pressing plate (3), the hot pressing plate (3) is provided with a positioning unit (5) and a pushing unit (6), and the pressing plate (4) is provided with an adjusting unit (7) and a pressure unit (8); The positioning unit (5) comprises a first positioning plate (501), a second positioning plate (502) and a rotating rod (503); the first positioning plate (501) and the second positioning plate (502) are both slidably connected to the hot pressing plate (3); the bottom end surface of the first positioning plate (501) is rotatably connected to the rotating rod (503); the two rotating rods (503) are located on both sides of the first positioning plate (501); and the end of the rotating rod (503) away from the first positioning plate (501) is rotatably connected to the second positioning plate (502); The pushing unit (6) comprises a pushing rod (601), one end of the pushing rod (601) is rotatably connected to the second positioning plate (502), the other end of the pushing rod (601) is rotatably connected to a sliding seat (602), and the sliding seat (602) is slidably connected to the inner wall of the pressing machine (1); The adjustment unit (7) comprises a positioning seat (701) and a connecting seat (703), wherein the positioning seat (701) is slidably connected to the inner wall of the pressing plate (4), the connecting seat (703) is fixedly connected below the pressing plate (4), the connecting seat (703) is located between the positioning seats (701), and a pressing seat (704) is provided between the positioning seat (701) and the connecting seat (703); The pressure unit (8) comprises a second spring (801) and a telescopic rod (802); the telescopic rod (802) is located between the positioning seat (701) and the pressing seat (704), between the pressing seat (704) and the pressing seat (704), and between the pressing seat (704) and the connecting seat (703); the second spring (801) is sleeved on the outer peripheral wall of the telescopic rod (802).

2. A circuit board processing and pressing device according to claim 1, characterized in that: A positioning cylinder (504) is fixedly mounted on the pressing machine (1), and an output end of the positioning cylinder (504) is fixedly connected to a push plate (505), and one side of the push plate (505) is in contact with the first positioning plate (501).

3. A circuit board processing and pressing device according to claim 2, characterized in that: A fixed seat (604) is fixedly connected to the inner wall of the pressing machine (1), a sliding rod (605) is slidably connected to the inner wall of the fixed seat (604), the top end surface of the sliding rod (605) is fixedly connected to the sliding seat (602), a first spring (603) is sleeved on the outer peripheral wall of the sliding rod (605), and two sides of the first spring (603) are respectively fixedly connected to the fixed seat (604) and the sliding seat (602).

4. A circuit board processing and pressing device according to claim 3, characterized in that: The second positioning plate (502) is located directly below the pressing plate (4); an adjustment seat (705) is slidably connected to the inner wall of the pressing plate (4); the adjustment seat (705) is fixedly connected to the positioning seat (701); a bidirectional screw rod (702) is threadedly connected to the inner wall of the adjusting seat (705); and the bidirectional screw rod (702) is rotatably connected to the inner wall of the pressing plate (4).

5. A circuit board processing and pressing device according to claim 4, characterized in that: One end of the bidirectional screw rod (702) is located outside the pressing plate (4), and a driving mechanism is connected to the end of the bidirectional screw rod (702).

6. A circuit board processing and pressing device according to claim 5, characterized in that: The outer walls of the positioning seat (701), the connecting seat (703) and the pressing seat (704) are all fixedly connected with a fixing block (804), the inner wall of the fixing block (804) is rotatably connected with a rotating seat (803), and two corresponding rotating seats (803) are fixedly connected to the two ends of the telescopic rod (802).

7. A circuit board processing and pressing device according to claim 6, characterized in that: The corresponding rotating seat (803) is fixedly connected to both ends of the second spring (801), and the rotating seat (803) is in a compressed state.

8. A method for using a circuit board processing and pressing device according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1: According to the size of the circuit board, the initial position of the first positioning plate (501) is adjusted, and the positioning cylinder (504) is started to drive the push plate (505) to move. At this time, the push plate (505) pushes the first positioning plate (501) to move, and the first positioning plate (501) is moved to a suitable position on the hot pressing plate (3); S2: The bidirectional screw rod (702) is driven to rotate by the driving mechanism to adjust the positions of the adjustment seat (705) and the positioning seat (701). When the positioning seat (701) drives the fixed block (804) to move, the fixed block (804) pushes the rotating seat (803) to move and rotate. At this time, the spacing between the positioning seat (701) and the pressing seat (704), the pressing seat (704) and the pressing seat (704) and the connecting seat (703) is the same. The position of the pressing seat (704) is adjusted so that the multiple pressing seats (704) are distributed at equal distances. S3: placing the circuit board on the hot pressing plate (3), when the hot pressing plate (3) contacts the first positioning plate (501), starting the positioning cylinder (504) to drive the push plate (505) to separate from the first positioning plate (501), and under the rebound of the first spring (603), the sliding seat (602) moves to push the push rod (601) to rotate, so that the second positioning plate (502) slides along the inner wall of the hot pressing plate (3), and at this time, the two second positioning plates (502) move towards each other, and the second positioning plates (502) contact and squeeze the two sides of the circuit board, so that the circuit board is pushed to a suitable position on the hot pressing plate (3), so that the hot pressing plate (3) is directly below the pressing plate (4); S4: When the pressing cylinder (2) is started to drive the pressing plate (4) to move downward, the positioning seat (701) moves downward accordingly. When the positioning seat (701) contacts the second positioning plate (502), the second positioning plate (502) is pushed to slide along the inner wall of the hot pressing plate (3), so that the second positioning plate (502) is away from the circuit board. At this time, the connecting seat (703) and the pressing seat (704) on the pressing plate (4) contact the multilayer board on the circuit board, and then the circuit board is pressed through the connecting seat (703) and the pressing seat (704); S5: When the pressing plate (4) moves, the pressing seat (704) contacts the multilayer board. When unevenness appears on the multilayer board, the pressing seat (704) is pushed to move, so that the pressing seat (704) moves relative to the other pressing seats (704), so that the fixed block (804) on the pressing seat (704) moves. Under the relative movement of the fixed block (804), the telescopic rod (802) is telescoped and rotated. At this time, the other pressing seats (704) continue to move to contact the multilayer board on the circuit board, and the circuit board is pressed.

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