Rod-actuated cold plate

Abstract

The invention relates to a rod-actuated cold plate. The cooling module includes a mounting element, a force applying member, a rod, and a cold plate movably regionally connected to the mounting element. A mounting element having an engagement feature is coupled to a cradle of an electronic device, wherein the cradle is configured to receive a removable electronic device at the cradle. A force application part with a spring contact finger is arranged between the mounting element and the cold plate and can move relative to the mounting element. The lever is connected to the mounting element and the force applying member and is displaceable between actuated and unactuated states. In an actuated state, the lever urges the force applying member in a first direction, causing the engagement member to move the force applying member in a second direction perpendicular to the first direction, causing the cold plate to compress the spring contact finger, and establishing thermal contact between the cold plate and the removable electronic module.

Description

Background Art

[0001] Removable electronic modules (such as power supply units, small form-factor detachable (SFP) transceivers, non-volatile memory express (NVMe) storage, etc.) may be connected to electronic devices (such as servers) whenever they are needed to perform their respective functions. In addition, such removable electronic modules may generate heat when performing their respective functions. If a sufficient amount of heat is not removed from the removable electronic modules, it may exceed the thermal specifications of the removable electronic modules and thus reduce the performance, reliability and / or life expectancy of the removable electronic modules, and may also cause failure thereof. Therefore, the electronic device may be configured to provide a cooling function to regulate the heat generated by the removable electronic modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Various examples will be described below with reference to the accompanying drawings.

[0003] Figure 1 A block diagram of an electronic device having a support structure, a cooling module, and a detachable electronic module according to an example of the present disclosure is shown.

[0004] Figure 2A An exploded perspective view of another example cooling module and support structure according to examples of the present disclosure is shown.

[0005] Figure 2B An example according to the present disclosure is shown. Figure 2A A perspective view of the assembly of the cooling module in the support structure.

[0006] Figure 3 An example according to the present disclosure is shown. FIG. 2A to FIG. 2B An enlarged perspective view of the support structure.

[0007] Figure 4A An example according to the present disclosure is shown. FIG. 2A to FIG. 2B An enlarged perspective top view of the mounting elements of a cooling module.

[0008] Figure 4B An example according to the present disclosure is shown. Figure 4A An enlarged perspective bottom view of the mounting elements of the cooling module.

[0009] Figure 5 An example according to the present disclosure is shown. FIG. 2A to FIG. 2B An enlarged perspective view of the cold plate of the cooling module.

[0010] Fig. 6A An example according to the present disclosure is shown. FIG. 2A to FIG. 2B An enlarged perspective top view of a force-applying component of a cooling module.

[0011] Figure 6B An example according to the present disclosure is shown. Fig. 6A An enlarged perspective bottom view of a force-applying component of a cooling module.

[0012] Fig. 7A An example according to the present disclosure is shown. FIG. 2A to FIG. 2B An enlarged perspective exploded view of the rod assembly of the cooling module.

[0013] Figure 7B An example according to the present disclosure is shown. Fig. 7A An enlarged assembly perspective view of the rod assembly.

[0014] Figure 8 A perspective view of a detachable electronic module according to an example of the present disclosure is shown.

[0015] Fig. 9 An example of the present disclosure is shown in FIG. Figure 2B Assembly of cooling modules and support structures Figure 8 A perspective view of the removable electronic module.

[0016] Fig.10 A perspective view of a housing of an electronic device according to an example of the present disclosure is shown.

[0017] Fig.11A A perspective view of an electronic device in an unactuated state according to an example of the present disclosure is shown, the electronic device having Fig.10 The shell and Figure 8 A detachable electronic module is provided on Figure 2B During assembly of the cooling module in the support structure.

[0018] Fig. 11B 1-1' according to an example of the present disclosure. Fig.11A A cross-sectional view of a portion of an electronic device.

[0019] Fig. 12A A perspective view of an electronic device in an actuated state according to an example of the present disclosure is shown, the electronic device having Fig.10 The shell and Figure 8 A detachable electronic module is provided on Figure 2B During the assembly of the cooling module in the support structure.

[0020] Fig. 12B 2A-2A' according to an example of the present disclosure. Fig. 12A A cross-sectional view of a portion of an electronic device.

[0021] Fig.13AA perspective view of a portion of an electronic device having a controller, a support structure, a cooling module, and a detachable electronic module having a mechanical switch in an open position according to an example of the present disclosure is shown.

[0022] Fig. 13B An example according to the present disclosure is shown. Fig.13A A perspective view of a portion of an electronic device having a controller, a support structure, a cooling module, and a removable electronic module, wherein the removable electronic module has a mechanical switch in a closed position.

[0023] Fig.14 is a flow chart describing a method of thermally coupling a cooling module to a detachable electronic module according to examples of the present disclosure. DETAILED DESCRIPTION

[0024] The following detailed description refers to the accompanying drawings. For the purpose of explanation, reference will be made to the accompanying drawings. Figures 1 to 14 Some examples are described by referring to the components shown in the figure. However, the functions of the components shown may overlap and may be presented with fewer or more elements and components. In addition, the disclosed examples can be implemented in various environments and are not limited to the examples shown. Where possible, the same reference numerals are used in the drawings and the following description to refer to the same or similar parts. However, it should be clearly understood that the drawings are only for the purpose of illustration and description. Although several examples are described herein, modifications, adjustments and other implementations are also possible. Therefore, the following detailed description does not limit the disclosed examples. On the contrary, the appropriate scope of the disclosed examples may be defined by the appended claims.

[0025] The electronic device may include a cold plate to remove heat from the removable electronic module. In such examples, when the removable electronic module is connected to the electronic device, the cold plate may establish thermal contact with the removable electronic module and enable heat to be transferred from the removable electronic module to the cold plate, and then from the cold plate to a cooling medium of the system (e.g., a liquid coolant in a coolant loop coupled to the cold plate). However, establishing good thermal contact between the cold plate and the removable electronic module (i.e., between the two interface surfaces) may be difficult, particularly due to the removable nature of the removable electronic module.

[0026] Good thermal contact (i.e., contact that results in high thermal conductivity at the contact interface) depends on a variety of factors, including surface flatness / smoothness, surface alignment (e.g., the degree of parallelism to the surfaces), and the pressure with which the surfaces are pressed against each other. In some cases, applying contact pressure can correct or offset the negative effects of defects in surface flatness / smoothness and / or alignment. For example, applying sufficient contact pressure can force two interface surfaces that may initially be misaligned to align. As another example, if defects in surface flatness / smoothness reduce thermal conductivity below a desired level, applying contact pressure can increase thermal conductivity and offset the reduction in thermal conductivity caused by surface defects. Another way to offset the negative effects of defects in surface flatness / smoothness and / or alignment is to use a thermal interface material (TIM) placed between the interface surfaces, such as a thermal gap pad, thermal grease, thermal foam, etc. A TIM is typically a compliant material that can conform to two interface surfaces regardless of surface defects and / or misalignment of the interface surfaces, thereby improving the overall thermal conductivity of the interface.

[0027] However, in some removable electronic module environments, the above two methods of improving thermal contact, i.e., applying high contact pressure and using TIM, may be difficult or even impossible in some cases. Typically, a removable electronic module is installed in or removed from a larger electronic device by sliding the removable electronic module into or out of a bracket in a direction parallel to the interface surface of the removable electronic module. When the removable electronic module is inserted into or removed from the bracket, the interface surface may contact and slide against the cold plate of the larger electronic device. However, the sliding contact between the interface surfaces may generate friction forces that may hinder the insertion / removal of the removable electronic module, and these friction forces may increase with increasing contact pressure and / or with increasing interface surface size (area). Therefore, in systems that attempt to improve thermal contact by applying greater pressure, this may also result in difficulty in inserting or removing the removable electronic module. In some cases, the combination of large surface area and large contact pressure may result in excessive insertion / removal force being required. For example, some removable electronic modules, such as power supply units (PSUs), have been determined to require up to 0.08 pounds of force to insert and / or remove, which in some cases may be considered too great for an average person to comfortably or safely apply repeatedly (e.g., if multiple modules are being inserted / removed in series).

[0028] In addition, if a TIM is used, sliding contact between the interface surfaces may result in damage and / or displacement of the TIM. For example, if the TIM is a gap pad or similar type of material that can be mounted on a cold plate for establishing thermal contact with a removable electronic module, the TIM may be rubbed by the removable electronic module, thereby damaging (e.g., tearing, wearing, etc.) or displacing the TIM, especially when the TIM is small and / or fragile in nature. In addition, repeated connection and / or disconnection of the removable electronic module may result in peeling of the TIM over a period of time. Similarly, if the TIM is a thermal grease or paste, repeated connection and / or disconnection of the removable electronic module may make the TIM easy to be scraped off the cold plate. In addition, when the removable electronic module is not connected to the electronic device, or when the bracket of the electronic device is empty, or when the electronic device is not in use, the cold plate with the TIM may be directly exposed to the external environment. This may result in the accumulation of foreign matter, debris, etc. on the TIM, thereby damaging the TIM.

[0029] A technical solution to the above problem includes providing a cooling module in a bracket of an electronic device in which a removable electronic module can be installed, wherein the cooling module includes a cold plate that can be moved toward or away from the removable electronic module by a rod. In addition, the cooling module can apply a biasing force to the cold plate to urge the cold plate toward the removable electronic module, and the cooling module can be changed between two states by actuation of the rod: in a first state (e.g., an unactuated state), a small biasing force or no biasing force is applied to the cold plate, so that there is almost no contact pressure between the cold plate and the removable module (assuming that the removable module is in the bracket); in a second state (e.g., an actuated state), a relatively large biasing force is applied to the cold plate, and the cold plate is pressed against the removable electronic module, resulting in a relatively large contact pressure applied between the two. During the insertion or removal of the removable electronic module into or from the electronic device, the cooling module can be placed in the first state (i.e., in an unmounted position of the removable electronic device) to reduce the amount of friction generated during such movement of the removable electronic module into or out of the electronic device. On the other hand, when the detachable electronic module is in the installation position, due to the relatively large contact pressure applied between the cold plate and the detachable module, the cooling module can be placed in a second state to obtain good thermal contact between the interface surface of the cold plate and the detachable electronic module. In some cases, the cooling module may include a mounting element coupled to a support structure of the electronic device. The mounting element can mount the cooling module to the electronic device and physically support other components of the cooling module. The cold plate can be movably coupled to the mounting element so that the cold plate can move toward or away from the detachable module (e.g., up or down). The cooling module may also include a force-applying component disposed between the mounting element and the cold plate, wherein the force-applying component can move relative to the mounting element. The force-applying component is configured to apply a biasing force to the cold plate and move relative to the mounting element between a first position where no biasing force or a very small biasing force is applied and a second position where a relatively large biasing force is applied. The first position of the force-applying component corresponds to a first state of the cooling module, and the second position of the force-applying component corresponds to a second state of the cooling module.

[0030] In some examples, the force applying member may include a plurality of spring contact fingers engaged with the cold plate, wherein the spring contact fingers generate a biasing force. In the second position, the force applying member is closer to the cold plate (compared to the first position), and the spring contact fingers are compressed due to contact with the cold plate, while in the first position, the force applying member is away from the cold plate, and the spring contact fingers are less compressed (compared to the second position) or not compressed at all. Therefore, a greater biasing force is generated in the second position than in the first position.

[0031] In one or more examples, a lever is coupled to the mounting element and the force applying member and is configured to move the force applying member between the second and first positions in response to the lever being displaced between the actuated state and the unactuated state.

[0032] In some cases, when the rod is shifted from an unactuated state to an actuated state, the rod moves the force-applying member in a first direction, and simultaneously the mounting element moves the force-applying member in a second direction perpendicular to the first direction (via engagement with a plurality of engagement members) so that the force-applying member moves to a second position. More specifically, the rod applies a force that actuates the motion in the first direction, which is converted by the mounting element into a motion of the force-applying member in a diagonal direction having a directional component in the first direction and another directional component in the second direction. This causes the force-applying member to move to the second position. The engagement member may include an inclined (ramp) surface inclined relative to the first direction, which engages with a complementary inclined surface of the force-applying member so that the motion in the diagonal direction via the inclined surface slides along each other. In some examples, the complementary inclined surface of the force-applying member may be formed by a portion of a spring contact finger. Thus, in some examples, when the removable electronic module is received in the bracket, the rod is in an actuated state, and the force-applying component is in the second position: the plurality of spring contact fingers are compressed and apply a spring force (e.g., from about 40 pounds-force to about 60 pounds-force) to the cold plate, causing the cold plate to press against the removable electronic module to establish thermal contact between the cold plate and the removable electronic module.

[0033] In some examples, when the lever is displaced from the actuated state to the unactuated state, the lever moves the force applying member in a third direction opposite to the first direction, while the plurality of engagement members allow the force applying member to be moved by the plurality of spring contact fingers in a fourth direction opposite to the second direction, thereby displacing the force applying member to the first position. More specifically, the force applying member moves in another diagonal direction having the third and fourth directions as its directional components. In such an example, in a condition where the removable electronic module is received in the bracket, the lever is in the unactuated state, and the force applying member is in the first position: the plurality of spring contact fingers are less compressed (in some cases, not compressed at all) than in the second condition, thereby applying little or no spring force to press the cold plate against the removable electronic module.

[0034] In some examples, the removable electronic module may further include a mechanical switch that is communicatively coupled to a controller of the electronic device. In such an example, when the lever is moved to an actuated state, the lever may push the mechanical switch to a closed position, thereby sending a first signal to the controller to indicate that the cooling module is engaged to the removable electronic module. Similarly, when the lever is moved to an unactuated state, the lever may allow the mechanical switch to move from the closed position back to an open position, thereby sending a second signal to the controller to indicate that the cooling module is disengaged from the removable electronic module.

[0035] Since the cooling module is configured to decompress when the removable electronic module is removably placed in and removed from the electronic device, the cooling module does not interfere with (or interrupt) the movement of the removable electronic module into and out of the electronic device. Therefore, the removable electronic module can be easily connected to or disconnected from the electronic device, thereby preventing damage associated with repeated forces (such as insertion force or removal force). In addition, the spring contact finger can apply and maintain sufficient contact force on the cold plate to establish thermal contact (i.e., dry contact) between the cold plate and the removable electronic module. In other words, the spring contact finger can be compressed to generate an optimal force to allow the cold plate to contact the removable electronic module and maintain heat transfer between these components. Since the spring contact finger is configured to apply a force to establish thermal contact between the removable electronic module and the cold plate, the need for a TIM to establish a thermal interface between the interface surfaces (as in conventional electronic devices) can be avoided. In addition, since the mechanical switch is used to determine the physical state of the cooling module (i.e., an actuated state or an unactuated state) to remove heat from the removable electronic module and to communicate with the controller of the electronic device, the controller can notify the user and prevent overheating problems of the removable electronic module.

[0036] Figure 1 A block diagram of an electronic device 2100 is described. It should be understood that Figure 1 It is not intended that specific shapes, sizes, or other structural details be shown accurately or to scale, and implementations of the electronic device 2100 may have different numbers and arrangements of components shown, and may also include other components not shown. In some examples, the electronic device 2100 may be a computer (e.g., a server, a storage device), a networking device (e.g., a switch), etc. Figure 1 In some examples, the electronic device 2100 is a server. In some examples, the electronic device 2100 includes a support structure 2102, a cooling module 2104, and a detachable electronic module 2106.

[0037] Support structure 2102 includes one or more mechanical supports that can be configured to support cooling module 2104. In some examples, support structure 2102 can define a bracket 2108 for electronic device 2100. Figure 1 In the example of FIG. 2 , the bracket 2108 extends between the first end 2101 of the support structure 2102 and the second end 2103 of the support structure 2102 .

[0038] The cooling module 2104 is mounted to the support structure 2102 at the bracket 2108. The cooling module 2104 may include one or more cooling components that may be configured to remove heat from the removable electronic module 2106. In one or more examples, the cooling module 2104 may be movable between a first position and a second position relative to the support structure 2102. It may be noted that the first position may be associated with a state in which there is little (or no) contact pressure between the cooling module 2104 and the removable electronic module 2106, while the second position may be associated with a position in which there is a relatively large contact pressure between the cooling module 2104 and the removable electronic module 2106. More specifically, in some examples, such as Figure 1 As shown, when in the first position, the cooling module 2104 can be separated from the removable electronic module 2106 by a distance "D1", resulting in no contact pressure. In other examples, when in the first position, the cooling module 2104 can be relatively lightly pressed against the removable electronic module 2106 (e.g., due to gravity), resulting in a relatively small contact pressure. In contrast, in the second position, a spring force (described below) presses the cooling module 2104 against the removable electronic module 2106 and generates a relatively large contact pressure. In some examples, the cooling module 2104 includes components such as a mounting element 2110 and other components such as a cold plate 2112, a force applying member 2114, and a rod 2182.

[0039] The mounting element 2110 provides support for other components of the cooling module 2104 and is coupled to the support structure 2102 to mount the other components of the cooling module 2104 to the support structure 2102 at the bracket 2108. In some examples, the mounting element 2110 includes a plurality of engagement members 2118 that can be configured to guide movement of the force-applying member 2114 relative to the mounting element 2110 or the support structure 2102.

[0040] The cold plate 2112 is part of the cooling module 2104, and the cold plate 2112 contacts the removable electronic module 2106 and removes heat from the removable electronic module 2106. The cold plate 2112 may include an interface element (e.g., a flat metal plate) that contacts the removable electronic module 2106 and a cooling conduit (not shown), wherein the cooling conduit is in thermal contact with the interface element and is configured to flow a cooling fluid therethrough to remove heat from the interface element and, in turn, from the removable electronic module 2106 in contact therewith. The cold plate 2112 is movably coupled to the mounting element 2110, such as via one or more support arms 2120. The support arms 2120 are configured to allow the cold plate 2112 to move toward or away from the removable electronic module 2106 (e.g., Figure 1 up or down in the .

[0041] In some examples, the support arm 2120 or some other element (not shown) may apply a force to the cold plate 2112 that urges the cold plate 2112 upward so that when the cooling module 2104 is in the first position and the cold plate 2112 is not pressed downwardly against the removable electronic module 2106, the cold plate 2112 is suspended above the removable electronic module 2106 by a distance "D1". For example, a spring, a balancer, or a mechanical linkage may apply this upward force to the cold plate 2112. This spacing may allow the removable electronic module 2106 to be inserted or removed without any sliding contact with the cold plate 2112, and therefore without the friction added by the cooling module 2104. However, when the removable electronic module 2106 is installed and the cooling module 2104 is in the second position, a downward force greater than the upward force is applied to the cold plate 2112, so the cold plate 2112 moves downwardly into contact with the removable electronic module 2106, thereby generating a relatively large contact pressure that establishes good thermal contact.

[0042] In some other examples, no upward force is applied to the cold plate 2112, so when the cooling module 2104 is in the first position, gravity can hold the cold plate 2112 downward in a position where the cold plate 2112 can contact and press against the removable electronic module 2106. However, the weight of the cold plate 2112 may be relatively light, so the cold plate 2112 may rub against the removable electronic module 2106 during insertion or removal, and the amount of friction generated by such contact may be relatively small. Similar to other examples, when the removable electronic module 2106 is installed and the cooling module 2104 is in the second position, a downward force is applied to the cold plate 2112, thereby generating a relatively large contact pressure to establish good thermal contact.

[0043] When in the first position, whether the cold plate 2112 is raised above the removable electronic module 2106 or pressed against the removable electronic module 2106, in both cases, the movement of the cold plate 2112 and the amount of contact pressure applied by the cold plate 2112 to the removable electronic module 2106 are controlled by the force applying member 2114. The force applying member 2114 is placed between the mounting element 2110 and the cold plate 2112. In addition, the force applying member 2114 can be moved relative to the mounting element 2110 between the second position and the first position to change the downward force applied to the cold plate 2112, thereby controlling the movement and contact pressure of the cold plate 2112. Specifically, when the force applying member 2114 is moved to the second position, the force applying member 2114 can forcefully push the cold plate 2112 downward, thereby causing the cold plate 2112 to move into contact with the removable electronic module 2106 and / or generate a large contact pressure with the removable electronic module 2106. Conversely, when the force applying member 2114 moves to the first position, the force applying member 2114 may stop pressing the cold plate 2112 downward, thereby allowing the cold plate 2112 to move upward to a raised position above the removable electronic module 2106 or to press against the removable electronic module 2106 without generating a large contact pressure therebetween.

[0044] For example, the force-applying member 2114 may include a plurality of spring contact fingers 2122. The spring contact fingers 2122 are configured to press against the cold plate 2112 when the force-applying member 2114 is moved to the second position, thereby applying a downward spring force to the cold plate 2112 that forces the cold plate 2112 to press against the removable electronic module 2016. Conversely, when the force-applying member 2114 is moved to the first position, the spring contact fingers 2122 are partially or completely decompressed, thereby eliminating or reducing the downward spring force applied to the cold plate 2112.

[0045] In some examples, when the force-applying member 2114 moves to the second position, the plurality of spring contact fingers 2122 may engage with the plurality of engagement members 2118 of the mounting element 2110 to guide the movement of the force-applying member 2114 and translate each spring contact finger 2122 to be compressed. Similarly, when the force-applying member 2114 moves to the first position, the plurality of spring contact fingers 2122 may disengage from the plurality of engagement members 2118 of the mounting element 2110 to guide the movement of the force-applying member 2114 and translate each spring contact finger 2122 to be decompressed. Figure 1 In the example, the force applying member 2114 is in the first position.

[0046] The rod 2182 is connected to the mounting element 2110 and the force applying member 2114. The rod 2182 is actuated to move the force applying member 2114 relative to the mounting element 2110. In one or more examples, the rod 2182 can be actuated to shift between an actuated state and an unactuated state. Figure 1In the example shown in FIG. 2 , rod 2182 is in an unactuated state.

[0047] The removable electronic module 2106 (such as a power supply unit, a small form-factor detachable (SFP) transceiver, a non-volatile memory express (NVMe) storage) can be slidably placed in the bracket 2108 of the electronic device 2100 and electrically connected to at least one electronic component, such as a main circuit board (not shown) of the electronic device 2100. Figure 1 In the example of , the cold plate 2112 of the cooling module 2104 is located above the removable electronic module 2106 so that a distance “D1” is maintained between the removable electronic module 2106 and the cold plate 2112. Since the cold plate 2112 is maintained at a distance “D1” from the removable electronic module 2106, the removable electronic module 2106 can be easily inserted into and removed from the bracket 2108, thereby making it easier to connect the removable electronic module 2106 to the electronic device 2100 or remove the removable electronic module 2106 from the electronic device 2100, thereby preventing damage associated with repeated forces. In other examples, when the removable electronic module 2106 is inserted into or removed from the bracket 2108, the cold plate 2112 may be slightly pressed against the removable electronic module 2106, but because the contact pressure is relatively low, the removable electronic module 2106 can still be relatively easily inserted or removed.

[0048] In one or more examples, the rod 2182 can be actuated (e.g., the rod 2182 is pushed in the first direction 10) to shift the rod 2182 from the unactuated state to the actuated state and move the force applying member 2114 from the first position to the second position. In particular, when the rod 2182 is pushed in the first direction 10, the force applying member 2114 is also pushed in the first direction 10. In such an example, in response to such movement of the force applying member 2114 in the first direction 10, the plurality of engagement members 2118 can engage with the plurality of spring contact fingers 2122 and simultaneously move the force applying member 2114 in a second direction 20 perpendicular to the first direction 10, thereby moving the force applying member 2114 from the first position to the second position. In one or more examples, when the force-applying member 2114 is in the second position, the plurality of spring contact fingers 2122 may be compressed by the plurality of engagement members 2118 to apply a spring force to the cold plate 2112 that forces the cold plate 2112 to press against the removable electronic module 2106 to establish thermal contact with the removable electronic module 2106. Since the spring contact fingers 2122 apply a spring force to the cold plate 2112 to contact the removable electronic module 2106 and establish thermal contact with the removable electronic module 2106, the need for a TIM to establish thermal contact between the cold plate 2112 and the removable electronic module 2106 may be avoided.

[0049] In one or more examples, the rod 2182 can be actuated (e.g., the rod 2182 is pulled in a third direction 30 opposite to the first direction 10) to shift the rod 2182 from the actuated state to the unactuated state and move the force applying member from the second position to the first position. In particular, when the rod 2182 is pulled in the third direction 30, the force applying member 2114 is also pulled in the third direction 30. In such an example, in response to the movement of the force applying member 2114 in the third direction 30, the plurality of engagement members 2118 can disengage from the plurality of spring contact fingers 2122 and cause the force applying member 2114 to be simultaneously moved by the plurality of spring contact fingers 2122 in a fourth direction 40 opposite to the second direction 20, thereby moving the force applying member 2114 from the second position back to the first position. In one or more examples, when the force applying member 2114 is in the first position, the plurality of spring contact fingers 2122 can be substantially decompressed and no spring force is applied to press the cold plate 2112 against the removable electronic module 2106. Specific examples of the cooling module 2104 and the steps involved in moving the force applying member 2114 of the cooling module 2104 between the first position and the second position are discussed in more detail below.

[0050] See attached figure, Figure 2A An exploded perspective view of cooling module 104 is depicted. Cooling module 104 is an example configuration of cooling module 2104 described above. Cooling module 104 may include components that are specific examples of components of cooling module 2104 described above, and these corresponding components are given similar reference numbers with the same last two digits, such as 2112 and 212. Although cooling module 104 is an example of cooling module 2104, cooling module 2104 is not limited to cooling module 104. Figure 2B Describes Figure 2A The support structure 102 and the cooling module 104 are assembled in perspective view. FIG. 2A to FIG. 2B .

[0051] As described herein, the support structure 102 includes a set of brackets 124 that can provide support for the cooling module 104. Referring to the drawings, Figure 3An enlarged perspective view of a bracket group 124 of the support structure 102 is depicted. The bracket group 124 is placed at a certain distance from each other, and this distance may correspond to the width of the removable electronic module 106 and / or the width of the cooling module 104. Similarly, each bracket in the bracket group 124 can have a certain height, and this height may correspond to the cumulative height of the cooling module 104 and the removable electronic module 106. In addition, each bracket in the bracket group 124 is placed face to face to define a bracket 108 therebetween, and the bracket 108 can be configured to accommodate the cooling module 104 and the removable electronic module 106. The bracket 108 extends from the first end 101 of the support structure 102 to the second end 103. In some examples, each bracket in the bracket group 124 has a "U" shaped profile. In addition, each bracket 124 has a top flange 128, a bottom flange 132, and a middle body 126, wherein the top flange 128 extends from a first peripheral end portion 130 of the middle body 126, and the bottom flange 132 extends from a second peripheral end portion 134 of the middle body 126. In some examples, the top flange 128 and the bottom flange 132 of the first bracket 124A in the bracket group 124 extend along a fifth direction 50. Similarly, the top flange 128 and the bottom flange 132 of the second bracket 124B in the bracket group 124 extend along a sixth direction 60 opposite to the fifth direction 50. In addition, the top flange 128 of each of the first bracket 124A and the second bracket 124B includes a plurality of first holes 136A, and the bottom flange 132 of each of the first bracket 124A and the second bracket 124B includes a plurality of second holes 136B. In some examples, the plurality of first fasteners 137 may be actuated into the plurality of first holes 136A and the plurality of third holes 136C (see FIG. 4A to FIG. 4B ) to couple the bracket set 124 of the support structure 102 to the mounting element 110, thereby coupling the cooling module 104 to the support structure 102. Similarly, a plurality of second fasteners (not shown) can be actuated into the plurality of second holes 136B to allow the support structure 102 to be coupled to the housing 1000 of the electronic device 1100 (see Fig.10 )(See FIG. 11A to FIG. 11B and FIG. 12A to FIG. 12B ). In some examples, the first direction 10 and the third direction 30 may correspond to the longitudinal direction of the electronic device 1100. The second direction 20 and the fourth direction 40 may correspond to the radial direction of the electronic device 1100. In addition, the fifth direction 50 and the sixth direction 60 may correspond to the lateral direction of the electronic device 1100.

[0052] Come back for reference FIG. 2A to FIG. 2B, the cooling module 104 includes a mounting element 110, a cold plate 112, a force applying member 114, and a rod 182. The cooling module 104 is disposed at a bracket 108 of the support structure 102 and is coupled to a top flange 128 of the support structure 102. The cooling module 104 is movable relative to the support structure 102 and is configured to contact the detachable electronic module 106 or maintain a distance from the detachable electronic module 106, respectively, for establishing thermal contact with the detachable electronic module 106 or maintaining a considerable distance "D1" from the detachable electronic module 106.

[0053] With reference to the accompanying drawings, Figure 4A depicts an enlarged perspective top view of the mounting element 110, Figure 4B An enlarged perspective bottom view of the mounting element 110 is depicted. In the following description, for ease of explanation, the FIG. 4A to FIG. 4BThe mounting element 110 includes a base 140, a set of flanges 142, a plurality of hooks 144, a plurality of third holes 136C, and a plurality of engagement members 118. The base 140 extends between a first end 109 and a second end 111 of the base 140 and includes an upper surface 140A and a lower surface 140B. The base 140 may have a certain width, which may correspond to the width of the force-applying member 114. The first flange 142A in the flange set 142 extends from a first peripheral end portion 148 of the base 140, and the second flange 142B in the flange set 142 extends from a second peripheral end portion 150 of the base 140. In particular, each of the first flange 142A and the second flange 142B extends along the fourth direction 40. In some examples, the base 140 and the flange set 142 may together provide a "U"-shaped profile for the mounting element 110. A plurality of hooks 144 are disposed at the peripheral end portion of each of the first flange 142A and the second flange 142B at intervals from each other. In some examples, the plurality of hooks 144 disposed in the first flange 142A extend along the fifth direction 50, while the plurality of hooks 144 disposed in the second flange 142B extend along the sixth direction 60. The plurality of hooks 144 can be configured to engage with the cold plate 112 to movably couple the cold plate 112 to the mounting element 110 and allow the cold plate 112 to freely move along the second direction 20 and the fourth direction 40 (during the unactuated state of the rod 182). A plurality of third holes 136C are disposed on the base 140 at intervals from each other along the first peripheral end portion 148 and the second peripheral end portion 150 of the base 140. The plurality of third holes 136C can be aligned with the plurality of first holes 136A in the bracket group 124. In such an example, a first fastener 137 of the plurality of first fasteners can extend through the corresponding first hole 136A and third hole 136C to couple the mounting element 110 to the support structure 102. A plurality of engagement members 118 are disposed spaced apart from one another and formed on the base 140. In some examples, each of the plurality of engagement members 118 can be formed by stamping the base 140. In other examples, each of the plurality of engagement members 118 can be coupled to a lower surface 140B of the base 140. In one or more examples, each of the plurality of engagement members 118 is a relief having an inclined main body portion 146 protruding from the base 140 toward the force applying member 114 at a first angle "α", which can be in a range of about 30 to 60 degrees relative to the base 140. In one or more examples, the inclined main body portion 146 extends along the first direction 10.

[0054] With reference to the accompanying drawings, Figure 5 An enlarged perspective view of the cold plate 112 is depicted. Figure 51 is a perspective exploded view of the cold plate 112. In one or more examples, the cold plate 112 is configured to remove heat from the removable electronic module 106. In some examples, the cold plate 112 includes a first interface component 152 and a cooling conduit 154. The first interface component 152 includes a base 156, a set of flanges 158, and a plurality of recesses 160. The base 156 extends between a first end 113 and a second end 115 of the base 156 and includes an upper surface 156A and a lower surface 156B. The base 156 may have a certain width, which may correspond to the width of the force applying member 114. The first flange 158A in the flange set 158 ​​extends from the first peripheral end portion 162 of the base 156, and the second flange 158B in the flange set 158 ​​extends from the second peripheral end portion 164 of the base 156. In particular, each of the first flange 158A and the second flange 158B extends from the base 156 along the fourth direction 40. In some examples, the base 156 and the flange set 158 ​​can collectively provide a "U" shaped profile for the first interface element 152 of the cold plate 112. A plurality of notches 160 spaced apart from one another are formed on each flange between the first flange 158A and the second flange 158B. Each notch 160 in the first flange 158A can be aligned with a corresponding notch 160 in the second flange 158B. In some examples, each notch in the plurality of notches 160 can have an "L" shaped profile. In addition, the plurality of notches 160 can be aligned with the plurality of hooks 144 (see FIG. 14) of the mounting element 110. FIG. 4A to FIG. 4B ) are aligned. In some examples, when the mounting element 110 is disposed on the cold plate 112, the plurality of hooks 144 may be slidably engaged with the plurality of recesses 160 to movably couple the first interface element 152 of the cold plate 112 to the base 140 of the mounting element 110 and allow the cold plate 112 to freely move in the second direction 20 and the fourth direction 40 (during the unactuated state of the rod 182). The base 156 of the first interface element 152 may have a planar structure with a high degree of flatness / smoothness. In some examples, the base 156 may be made of a thermally conductive material, such as aluminum, copper, or the like. The cooling conduit 154 may be disposed on and coupled to the upper surface 156A of the base 156. In some examples, the cooling conduit 154 includes an inlet 166 connected to an inlet pipe 168 of a cooling system (not shown) and an outlet 170 connected to an outlet pipe 172 of the cooling system. In Figure 5In the example of the embodiment, the inlet tube 168 and the outlet tube 172 are disposed at the second end 115 of the cold plate 112. The cooling conduit 154 may have a circuitous path to increase the surface contact with the base 156 of the first interface element 152. The cooling conduit 154 may be made of a thermally conductive material, such as aluminum, copper, or the like. The inlet tube 168 and the outlet tube 172 may be made of a flexible material, such as a polymer, etc. In one or more examples, the cooling conduit 154 may receive a cooling fluid (not shown) via an inlet 166 connected to the inlet tube 168. The cooling fluid may flow in a circuitous path defined by the cooling conduit 154 to remove heat from the first interface element 152 and generate a hot fluid. In addition, the cooling conduit 154 may lead the hot fluid from the cold plate 112 to the outlet tube 172 via the outlet 170. In other words, the cooling conduit 154 is configured to circulate the cooling fluid between the inlet 166 and the outlet 170 of the cooling conduit 154 to remove heat from the removable electronic module 106.

[0055] With reference to the accompanying drawings, Fig. 6A depicts an enlarged perspective top view of the force applying member 114, Figure 6B The enlarged perspective bottom view of the force applying member 114 is described. FIG. 6A to FIG. 6B . The force applying member 114 has a planar structure with a base 174, a plurality of openings 176, a fourth hole 136D, and a plurality of spring contact fingers 122. The base 174 extends between a first end 117 and a second end 119 of the force applying member 114. The base 174 may have a certain width, which may correspond to the width of the cold plate 112 and the mounting element 110. A plurality of openings 176 are formed on the base 174 and are arranged spaced apart from each other along the base 174. In some examples, each of the plurality of openings 176 may have a main length along the first direction 10. The plurality of spring contact fingers 122 are arranged spaced apart from each other on the base 140. In particular, one end 122A (or a fixed end) of each of the plurality of spring contact fingers 122 extends from an edge 180 of one of the plurality of openings 176. In addition, the other end 122B (or free end) of each of the plurality of spring contact fingers 122 is bent toward the cold plate 112 at a second angle "β", which may be in a range of approximately 30 to 60 degrees relative to the base 174. In addition, each of the plurality of spring contact fingers 122 extends along the first direction 10. In one or more examples, when the lever 182 is in an unactuated state and the force applying member 114 is in the second position, the first angle "α" and the second angle "β" may be substantially equal.

[0056] With reference to the accompanying drawings, Fig. 7A depicts an enlarged exploded perspective view of the rod assembly 116, Figure 7BAn enlarged perspective assembly view of the rod 182 is depicted. In some examples, the rod assembly 116 includes the rod 182 and the mechanical link 184. The rod 182 is a drive assembly having a handle 186 and a faceplate 188 extending from the handle 186. The faceplate 188 includes a fifth hole 136E and a sixth hole 136F spaced apart from each other. In some examples, the rod 182 is configured to be disposed below the first flange 142A of the mounting element 110 at the first end 109 so that the fifth hole 136E is aligned with one of the third holes 136C. In this example, the third fastener 139 (see FIG. 2A to FIG. 2B ) may extend through one of the third hole 136C and the fifth hole 136E to pivotally connect the rod 182 to the mounting element 110, thereby allowing the rod 182 to shift between an actuated state and an unactuated state. The mechanical link 184 may be a transmission component configured to drive the movement of the rod 182 to the force-applying component 114. In some examples, the mechanical link 184 includes a seventh hole 136G and an eighth hole 136H. The mechanical link 184 is used to connect the rod 182 to the force-applying component 114. In particular, a portion of the mechanical link 184 is disposed below the panel 188 of the rod 182 so that the sixth hole 136F of the mechanical link 184 is aligned with the seventh hole 136G of the rod 182. In such an example, the fourth fastener 141 (see FIG. 2A to FIG. 2B ) can extend through the sixth hole 136F and the seventh hole 136G to connect the mechanical link 184 to the rod 182. In addition, another portion of the mechanical link 184 can be disposed below the force applying member 114 at the first end 117 of the force applying member 114 so that the eighth hole 136H is aligned with the fourth hole 136D of the force applying member 114. In such an example, a fifth fastener (not shown) can extend through the eighth hole 136H and the fourth hole 136D to further connect the mechanical link 184 to the force applying member 114. In one or more examples, the rod assembly 116 can be pushed in the first direction 10 and pulled in the third direction 30 to shift the rod 182 between the actuated state and the unactuated state, respectively.

[0057] Come back for reference FIG. 2A to FIG. 2B, the mounting element 110 is disposed at the bracket 108 of the support structure 102 so that the plurality of first holes 136A in the bracket set 124 are aligned with the plurality of third holes 136C in the mounting element 110. In such an example, the plurality of first fasteners 137 are inserted into the plurality of first holes 136A and the plurality of third holes 136C to couple the mounting element 110 to the support structure 102. As described herein, a portion of the mechanical link 184 is disposed below the rod 182 so that the sixth hole 136F of the rod 182 is aligned with the seventh hole 136G of the mechanical link 184. In such an example, the fourth fastener 141 is inserted into the sixth hole 136F and the seventh hole 136G to connect the mechanical link 184 to the rod 182. In addition, another portion of the mechanical link 184 is disposed below the force applying member 114 so that the eighth hole 136H in the mechanical link 184 is aligned with the fourth hole 136D of the force applying member 114. In such an example, a fifth fastener (not shown) is inserted into the eighth hole 136H in the mechanical link 184 and the fourth hole 136D in the force applying member 114 to connect the mechanical link 184 of the rod assembly 116 to the force applying member 114. Therefore, the rod 182 is connected to the force applying member 114 via the mechanical link 184. In addition, the assembly of the rod 182, the mechanical link 184, and the force applying member 114 is disposed in the bracket 108 so that at the first end 109 of the mounting element 110, the force applying member 114 is located below the mounting element 110 and the rod assembly 116 is located below the first flange 142A of the mounting element 110. In such an example, when the force applying member 114 is located below the base 140 of the mounting element 110, the plurality of engagement members 118 of the mounting element 110 are disposed within the plurality of openings 176 of the force applying member 114. In addition, the base 174 of the force applying member 114 contacts the base 140 of the mounting element 110. Likewise, when the rod assembly 116 is positioned below the first flange 142A of the mounting element 110 at the first end 109 of the mounting element 110, the sixth hole 136F is aligned with one of the third holes 136C in the mounting element 110. In such an example, the third fastener 139 is inserted into one of the third holes 136C in the mounting element 110 and the fifth hole 136E of the rod 182 to pivotally connect the rod 182 to the mounting element 110. In addition, the cold plate 112 is disposed below the force applying member 114 and mounted to the mounting element 110 such that the flange set 142 of the mounting element 110 contacts the flange set 158 ​​of the cold plate 112, and the plurality of spring contact fingers 122 of the force applying member 114 are disposed above the cold plate 112. In such an example, the plurality of hooks 144 of the mounting element 110 are slidably engaged with the plurality of notches 160 of the cold plate 112 to movably couple the cold plate 112 to the mounting element 110. In Figure 2BIn the example of , the rod 182 is in the unactuated state. In one or more examples, when the rod 182 is in the unactuated state, the rod 182 holds the force-applying member 114 in the first position to allow the plurality of spring contact fingers 122 to be substantially decompressed and not apply a spring force that presses the cold plate 112. Therefore, in such an example, the cold plate 112 can freely move in the second direction 20 and the fourth direction 40, thereby allowing the removable electronic module 106 to be easily set in the bracket 108 of the support structure 102.

[0058] Figure 8 A perspective view of a removable electronic module 106 is depicted. The removable electronic module 106 may be a power supply unit, a small form factor detachable (SFP) transceiver, a non-volatile memory express (NVMe) storage, or a similar device. Figure 8 In the example of, the detachable electronic module 106 is a power supply unit. The detachable electronic module 106 includes a handle 190, a housing 192, and a connector (not shown). The handle 190 is connected to a first end 194 of the housing 192, and the connector is connected to a second end 196 of the housing 192. In addition, the housing 192 also has an internal space (not shown) with a plurality of electronic components (not shown) connected to the connector and a second interface element 198 (e.g., a heat sink) disposed at an upper surface (not marked) of the housing 192. The second interface element 198 may have a planar structure with high flatness / smoothness. In some examples, the second interface element 198 may be made of a thermally conductive material, such as aluminum, copper, or the like. The second interface element 198 may be arranged to be in thermal contact with a plurality of electronic components of the detachable electronic module 106 and configured to remove heat from the plurality of electronic components. In one or more examples, the handle 190 may be used to slidably place the housing 192 of the detachable electronic module 106 in the bracket 108 of the support structure 102.

[0059] Fig. 9 Describes the placement Figure 2B The cooling module 104 and the support structure 102 are Figure 8106 in a perspective view of the removable electronic module 106 in the support structure 102. In one or more examples, the removable electronic module 106 can be placed in the bracket 108 of the support structure 102 when the rod 182 is in the unactuated state and the force applying member 114 is in the first position. In particular, when the rod 182 is in the unactuated state and the force applying member 114 is in the first position, the cold plate 112 can move freely in the second direction 20 and the fourth direction 40. Therefore, in such an example, when the removable electronic module 106 is placed in the bracket 108, the second interface element 198 of the removable electronic module 106 can be placed facing the first interface element 152 of the cold plate 112 and these interface elements can maintain a considerable distance "D1" therebetween. Therefore, the removable electronic module 106 can be easily connected to and disconnected from the electronic device 1100, thereby preventing damage associated with repeated forces.

[0060] Fig.10 A perspective view of a housing 1000 of an electronic device 1100 is depicted (see FIG. 11A to FIG. 11B and FIG. 12A to FIG. 12B ). The housing 1000 includes a bottom wall 1002 and a set of side walls 1004 extending perpendicularly from the bottom wall 1002. For example, each side wall in the side wall set 1004 extends from the bottom wall 1002 along a fourth direction 40. Each side wall in the side wall set 1004 includes a flange 1010 extending perpendicularly from the corresponding side wall. For example, a first flange 1010A extends from a first side wall 1004A in the side wall set 1004 along a fifth direction 50. Similarly, a second flange 1010B extends from a second side wall 1004B in the side wall set 1004 along a sixth direction 60. Each of the first flange 1010A and the second flange 1010B includes a plurality of first housing holes 1036A. In addition, the bottom wall 1002 includes a plurality of second housing holes 1036B arranged in a plurality of rows between a first end 1006 and a second end 1008 of the housing 1000 along the first direction 10. For example, the bottom wall 1002 includes a first row 1012A of the plurality of second housing holes 1036B, a second row 1012B of the plurality of second housing holes 1036B, a third row 1012C of the plurality of second housing holes 1036B, and a fourth row 1012D of the plurality of second housing holes 1036B. Fig.10In the example of , the housing 1000 is configured to accommodate three support structures 102, which hold three cooling modules 104. For example, the plurality of first housing holes 1036A in the first side wall 1004A and the plurality of second housing holes 1036B in the first row 1012A may be configured to support one of the support structures 102 (having only the second bracket 124B) for holding the cooling module 104. Similarly, the plurality of second housing holes 1036B in the second row 1012B and the third row 1012C may be configured to support another support structure 102 for holding the cooling module 104. In addition, the plurality of first housing holes 1036A in the second side wall 1004B and the plurality of second housing holes 1036B in the fourth row 1012D may be configured to support one of the support structures 102 (having only the first bracket 124A) for holding the cooling module 104.

[0061] Fig.11A A perspective view of an electronic device 1100 is depicted, the electronic device 1100 having Fig.10 The housing 1000 and Fig. 9 The detachable electronic module 106 is placed in Figure 2B In the assembly of the support structure 102 and the cooling module 104. Fig. 11B Describes the section taken along line 1-1' Fig.11A 1 is a cross-sectional view of a portion of an electronic device 1100. In the following description, for the convenience of explanation, FIG. 11A to FIG. 11B .exist FIG. 11A to FIG. 11B In the example of FIG. 1 , the rod 182 of the cooling module 104 is in an unactuated state and the cooling module 104 is in the first position. Fig.11A In the example of FIG. 1 , the support structure 102 for holding the cooling module 104 is arranged in the housing 1000 so that the plurality of second holes 136B (see Figure 3 ) and a plurality of second housing holes 1036B of the second row 1012B of the housing 1000 (see Fig.10 ) are aligned with each other, and the plurality of second holes 136B of the second bracket 124B (see Figure 3 ) and a plurality of second housing holes 1036B of the third row 1012C of the housing 1000 (see Fig.10) are aligned with each other. In such an example, a plurality of second fasteners (not shown) may extend through the plurality of second holes 136B in the first bracket 124A and the plurality of second housing holes 1036B in the second row 1012B to couple the first bracket 124A to the housing 1000. Similarly, another plurality of second fasteners (not shown) may extend through the plurality of second holes 136B in the second bracket 124B and the plurality of second housing holes 1036B in the third row 1012C to couple the second bracket 124B to the housing 1000. Thus, the support structure 102 for holding the cooling module 104 is coupled to the housing 1000. In addition, the detachable electronic module 106 may be slidably placed in the bracket 108 of the support structure by pushing the detachable electronic module 106 along the first direction 10.

[0062] Reference Fig. 11B , when the rod 182 is in the unactuated state, the force applying member 114 of the cooling module 104 is in the first position. In addition, the base 140 of the mounting element 110 contacts the base 174 of the force applying member 114, and each of the plurality of engagement members 118 of the mounting element 110 is placed in a corresponding opening of the plurality of openings 176 of the force applying member 114. In addition, the plurality of spring contact fingers 122 are substantially decompressed and do not apply a spring force that presses the cold plate 112 against the removable electronic module 106. In particular, the inclined body portion 146 of each of the plurality of engagement members 118 protrudes into a corresponding opening of the plurality of openings 176 to allow the plurality of spring contact fingers 122 to be decompressed without applying a spring force that presses the cold plate 112 against the removable electronic module 106. Therefore, the cold plate 112 maintains a considerable distance “D1” from the removable electronic module 106. Furthermore, the cold plate 112 may be freely movable in the second direction 20 and the fourth direction 40 , thereby allowing the removable electronic module 106 to be easily placed in the bracket 108 of the support structure 102 .

[0063] Fig. 12A A perspective view of an electronic device 1100 is depicted, the electronic device 1100 having Fig.10 The housing 1000 and Fig. 9 The detachable electronic module 106 is placed in Figure 2B In the assembly of the support structure 102 and the cooling module 104. Fig. 12B Describes a section taken along line 2-2' Fig. 12A 1 is a cross-sectional view of a portion of an electronic device 1100. In the following description, for the convenience of explanation, FIG. 12A to FIG. 12B .exist FIG. 12A to FIG. 12B In the example of FIG. 1 , the rod 182 of the cooling module 104 is in the actuated state and the cooling module 104 is in the second position.

[0064] Reference Fig. 12B , in particular, when the rod 182 is displaced from the unactuated state to the actuated state, the force applying member 114 is moved from the first position to the second position. When the rod 182 is displaced from the unactuated state to the actuated state, the rod 182 moves the force applying member 114 along the first direction 10. In response to the movement of the force applying member 114 along the first direction 10, the plurality of engagement members 118 of the mounting element 110 move the force applying member 114 to move along a second direction 20 perpendicular to the first direction 10, so as to move the force applying member 114 to the second position. In particular, the rod 182 and the plurality of engagement members 118 are configured to move the force applying member 114 from the first position to the second position in response to the rod 182 being displaced from the unactuated state to the actuated state. In some examples, in the transition state of the rod 182 from the unactuated state to the actuated state, a portion of each spring contact finger 122 slides along the inclined main body portion 146 of the corresponding engagement member 118 to allow each spring contact finger 122 to be translated to be compressed. In some examples, in the actuated state of the lever 182, the inclined body portion 146 of each engagement member 118 engages with the base 140 of the force applying member 114 to compress the plurality of spring contact fingers 122 and apply a spring force that presses the cold plate 112 against the removable electronic module 106. Thus, each spring contact finger 122 applies a spring force to the cold plate 112 that urges the cold plate 112 to press against the removable electronic module 106 to establish thermal contact between the cold plate 112 and the removable electronic module 106. In some examples, thermal contact is established between a dry thermal interface of the cold plate 112 and the removable electronic module 106. In other words, a thermal interface material (TIM) may not be required between the interface surface of the cold plate 112 and the removable electronic module 106 to establish the thermal contact. Thus, when the lever 182 is in the actuated state and the force applying member 114 is in the second position, the cold plate 112 may not be able to maintain a substantial distance “D1” from the removable electronic module 106 and may not be able to freely move in the second direction 20 and the fourth direction 40. Therefore, the removable electronic module 106 may not be easily removed from the bracket 108 of the support structure 102. In some examples, when the cold plate 112 is in thermal contact with the removable electronic module 106, the second interface component 198 of the removable electronic module 106 may transfer heat from the plurality of electronic components of the removable electronic module 106 to the first interface component 152 of the cold plate 112. In addition, the cooling conduit 154 disposed on the first interface component 152 is configured to circulate a cooling fluid between the inlet 166 and the outlet 170 of the cooling conduit 154 to remove heat transferred to the first interface component 152 of the cold plate 112.

[0065] However, the lever 182 can be shifted from the actuated state back to the unactuated state to move the force applying member 114 from the second position to the first position, thereby allowing the removable electronic module 106 to be easily removed from the bracket 108 of the support structure 102. In some examples, when the lever 182 is shifted from the actuated state to the unactuated state, the lever 182 moves the force applying member 114 along a third direction 30 opposite to the first direction 10. In response to this movement of the force applying member 114 along the third direction 30, the plurality of engagement members 118 of the mounting element 110 allow the force applying member 114 to be moved by the plurality of spring contact fingers 122 along a fourth direction 40 opposite to the second direction 20 so that the force applying member 114 moves to the first position. In some examples, in the transition state of the lever 182 from the actuated state to the unactuated state, a portion of each spring contact finger 122 slides rearward along the inclined body portion 146 to allow each spring contact finger to be translated to decompress. Therefore, the removable electronic module 106 can be easily removed from the bracket 108 of the support structure 102.

[0066] Fig.13A A perspective view of a portion of an electronic device 1300 is depicted with a controller 1335, a support structure 1302, a cooling module 1304, and a removable electronics module 1306 with a mechanical switch 1333 in an open position. The cooling module 1304 is one example configuration of the cooling module 2104 described above. Fig. 13B Describes Fig.13A A perspective view of an electronic device 1300 in which the electronic device 1300 has a controller 1335, a support structure 1302, a cooling module 1304, and a removable electronic module 1306 having a mechanical switch 1333 in a closed position.

[0067] Support structure 1302 and cooling module 1304 are the same as support structure 102 and cooling module 104 (eg, FIG. 2A to FIG. 2B ). Therefore, for the sake of simplicity of description, support structure 1302 and cooling module 1304 are not discussed herein, and such non-discussion of support structure 1302 and cooling module 1304 should not be construed as a limitation of the present disclosure. In addition, detachable electronic module 1306 is substantially the same as detachable electronic module 106 (e.g. Figure 8), except that the detachable electronic module 1306 includes a mechanical switch 1333 disposed on the second interface element 1398 and is configured to be communicatively coupled to the controller 1335. The mechanical switch 1333 is movable along the second direction 20 and the fourth direction 40. In some examples, the mechanical switch 1333 is movable along the second direction 20 to switch from an open position to a closed position. Similarly, the mechanical switch 1333 is movable along the fourth direction 40 to switch from a closed position to an open position. In one or more examples, the mechanical switch 1333 can be spring-loaded, and in a relaxed state, the mechanical switch 1333 can be moved to an open position by one or more springs (not shown). In some examples, when the mechanical switch 1333 is in a closed position (such as Fig. 13B ), the mechanical switch 1333 can be connected to the controller 1335 via the communication path 1337. However, when the mechanical switch 1333 is in the open position, the mechanical switch 1333 can be disconnected from the controller 1335. For example, a circuit connection can be established by moving the mechanical switch 1333 to the closed position (as shown in the figure). Therefore, the circuit can provide a signal 1339 to the controller 1335 via the communication path 1337. However, the circuit connection can be disconnected by moving the mechanical switch 1333 to the open position. Therefore, the circuit can no longer provide the signal 1339 to the controller 1335 via the communication path 1337. In one or more examples, the controller 1335 receiving the signal 1339 can indicate that the removable electronic module 1306 has been slidably placed in the bracket 1308 of the support structure 1302. In other words, when the signal 1339 is sent to the controller 1335, it indicates that the cold plate 1312 is engaged to the removable electronic module 1306. Likewise, the controller 1335 does not receive the signal 1339, indicating that the removable electronic module 1306 is not placed in the bracket 1308 of the support structure 1302. In other words, when no signal 1339 is sent to the controller 1335, it indicates that the cold plate 1312 is detached from the removable electronic module 1306.

[0068] In some examples, when the rod 1382 is switched to the actuated state to move the cooling module 1304 from the first position to the second position, the rod 1382 contacts the mechanical switch 1333 and moves the mechanical switch 1333 to the closed position (see Fig. 13B ) to allow the circuit to send a signal 1339 to the controller 1335. In such an example, the signal 1339 indicates that the first interface element 1356 of the cold plate 1312 is engaged to the second interface element 1398 of the removable electronic module 1306.

[0069] In some examples, when the lever 1382 is switched to the unactuated state to move the cooling module 1304 from the second position to the first position, the lever 1382 moves away from the mechanical switch 1333 to allow the mechanical switch 1333 to move back to the open position (see Fig.13A ) to prevent the circuit from sending a signal to the controller 1335. In such an example, the absence of a signal sent to the controller 1335 indicates that the first interface component 1356 of the cold plate 1312 is disengaged from the second interface component 1398 of the removable electronic module 1306.

[0070] Thus, in one or more examples, the mechanical switch 1333 determines the physical state (i.e., the first position or the second position) of the cooling module 1304, and the controller 1335 can further indicate to the user such physical state of the cooling module 1304. Thus, the mechanical switch can prevent overheating issues associated with the detachable electronic module 1306, where the detachable electronic module 1306 is not engaged with the cooling module 1304 to remove heat from the detachable electronic module 1306.

[0071] Fig.14 A flow chart describing a method 1400 for establishing a thermal connection between a cooling module and a detachable electronic module of an electronic device is described. It can be noted here that, for example, in combination with Figure 1 , FIG. 2A to FIG. 2B , Figure 3 , FIG. 4A to FIG. 4B , Figure 5 , FIG. 6A to FIG. 6B , FIG. 7A to FIG. 7B , Figures 8 to 10 , FIG. 11A to FIG. 11B and FIG. 12A to FIG. 12B The method 1400 is described below. The method 1400 begins at block 1402 and continues to block 1404.

[0072] At block 1404 , method 1400 includes placing the removable electronic module in a carrier of an electronic device, wherein the electronic device includes a cooling module mounted to a support structure of the electronic device at the carrier. Method 1400 continues at block 1406 .

[0073] At block 1406, method 1400 includes shifting a rod connected to a mounting element and a force applying member of the cooling module from an unactuated position to an actuated position such that: i) the rod moves the force applying member in a first direction; ii) in response to the movement of the force applying member in the first direction, a plurality of engagement members of the mounting element move the force applying member in a second direction perpendicular to the first direction such that the force applying member moves to the first position, and iii) in response to the movement of the force applying member in the second direction, a plurality of spring contact fingers of the force applying member are compressed and apply a spring force to a cold plate of the cooling module movably coupled to the mounting element, causing the cold plate to press against the removable electronic module to establish thermal contact between the cold plate and the removable electronic module. Method 1400 continues to block 1408.

[0074] At block 1408, method 1400 also includes shifting the rod from the actuated position to the unactuated position so that: 1) the rod moves the force-applying member in a third direction opposite to the first direction; ii) in response to movement of the force-applying member in the third direction, the plurality of engaging members allow the force-applying member to be moved in a fourth direction opposite to the second direction by the plurality of spring contact fingers so that the force-applying member moves to the second position; and iii) in response to movement of the force-applying member in the fourth direction, the plurality of spring contact fingers remain substantially decompressed and do not apply a spring force to press the cold plate against the removable electronic module.

[0075] In some examples, method 1400 also includes switching the mechanical switch to a closed position by the lever when the lever is displaced to the actuated position to send a signal to a controller of the electronic device, wherein the signal indicates that the cold plate is engaged to the removable electronic module. In addition, method 1400 includes switching the mechanical switch to an open position by the lever when the lever is displaced to the unactuated position to not send a signal to the controller, wherein not sending a signal indicates that the cold plate is disengaged from the removable electronic module. Method 1400 ends at block 1410.

[0076] Since the cooling module is configured to decompress when the removable electronic module is removably placed in and removed from the electronic device, the cooling module does not interfere with (or interrupt) the movement of the removable electronic module being placed in and removed from the electronic device. Therefore, the removable electronic module can be easily connected to and disconnected from the electronic device, thereby preventing damage associated with repeated forces (such as insertion force or removal force). In addition, the spring contact fingers can apply and maintain sufficient contact force to the cold plate to establish thermal contact (i.e., dry contact) between the cold plate and the removable electronic module. In other words, the spring contact fingers can be compressed to generate an optimal force to allow the cold plate to contact the removable electronic module and maintain heat transfer between these components. Since the spring contact fingers are configured to apply force to establish thermal contact between the removable electronic module and the cold plate, the need for a TIM to establish a thermal interface between interface surfaces (as in conventional electronic devices) can be avoided. In addition, since the mechanical switch is used to determine the physical state of the cooling module (i.e., the first position or the second position) to remove heat from the detachable electronic module and to communicate with the controller of the electronic device, the controller can notify the user and prevent overheating problems of the detachable electronic module.

[0077] In the foregoing description, many details are set forth to provide an understanding of the subject matter disclosed herein. However, implementations may be implemented without some or all of these details. Other embodiments may include modifications, combinations, and variations of the above details. The following claims are intended to cover such modifications and variations.

Claims

1. A cooling module, comprising: a mounting element configured to couple to a support structure of an electronic device to mount the cooling module to the support structure at a bracket of the electronic device, the bracket being configured to removably receive a removable electronic module therein, the mounting element comprising a plurality of engagement members; a cold plate movably coupled to the mounting element; a force-applying component, the force-applying component comprising a plurality of spring contact fingers, the force-applying component being disposed between the mounting element and the cold plate and being movable relative to the mounting element; as well as a rod connected to the mounting element and the force applying member and configured to be displaced between an actuated state and an unactuated state, wherein the lever and the plurality of engagement members are configured to move the force applying member between a first position and a second position in response to the lever being displaced between the unactuated state and the actuated state, wherein when the lever is displaced from the unactuated state to the actuated state, the lever moves the force applying member in a first direction, and in response, the plurality of engagement members move the force applying member in a second direction perpendicular to the first direction, thereby moving the force applying member to the second position, Wherein, when the detachable electronic module is received in the bracket, the rod is in the actuated state, and the force-applying component is in the second position: the plurality of spring contact fingers are compressed and apply a spring force to the cold plate, causing the cold plate to press against the detachable electronic module, so as to establish thermal contact between the cold plate and the detachable electronic module.

2. The cooling module according to claim 1, in, When the lever is displaced from the actuated state to the non-actuated state, the lever moves the force applying member in a third direction opposite to the first direction, and in response, the plurality of engagement members allow the force applying member to be moved by the plurality of spring contact fingers in a fourth direction opposite to the second direction, thereby moving the force applying member to the first position; as well as Wherein, when the detachable electronic module is received in the bracket, the lever is in the unactuated state, and the force-applying component is in the first position: the plurality of spring contact fingers are substantially decompressed and do not apply a spring force to press the cold plate against the detachable electronic module. 3 . The cooling module according to claim 1 , wherein a portion of the mounting element includes an embossed portion to define each of the plurality of engagement members, and wherein the embossed portion has an inclined body portion that protrudes toward the force applying member.

4. The cooling module of claim 3, wherein the force applying member comprises a base and a plurality of openings defined in the base, and wherein one end of each of the plurality of spring contact fingers extends from an edge of one of the plurality of openings.

5. The cooling module according to claim 4, wherein: In the unactuated state of the lever, the angled body portion protrudes into a corresponding one of the plurality of openings to allow the plurality of spring contact fingers to decompress and not apply a spring force pressing the cold plate against the removable electronic module.

6. The cooling module according to claim 4, wherein: In the actuated state of the lever, the angled body portion of each engagement member engages the base of the force applying member to compress the plurality of spring contact fingers and apply a spring force that presses the cold plate against the removable electronic module.

7. The cooling module according to claim 4, wherein: When the lever is in a transition state between the actuated state and the unactuated state, a portion of each spring contact finger slides along the inclined body portion to allow translation of each spring contact finger to be compressed or decompressed.

8. The cooling module of claim 1 further comprising a mechanical linkage interconnecting the rod and the force applying member, and wherein the rod is also pivotally connected to the mounting element to allow the rod to be shifted between the actuated state and the unactuated state.

9. The cooling module of claim 1 , further comprising a cooling conduit disposed on the cold plate to establish the thermal contact with the detachable electronic module via the cold plate, and wherein the cooling conduit is configured to circulate a cooling fluid between an inlet and an outlet of the cooling conduit.

10. An electronic device, comprising: Support structure; A cooling module, the cooling module being mounted on the support structure at a bracket of the electronic device, the cooling module comprising: a mounting element coupled to the support structure to mount the cooling module to the support structure, the mounting element comprising a plurality of engagement features; a cold plate movably coupled to the mounting element; a force applying member, the force applying member including a plurality of spring contact fingers, the force applying member being disposed between the mounting element and the cold plate and being movable relative to the mounting element, and a rod connected to the mounting element and the force applying member and configured to be displaced between an actuated state and an unactuated state, wherein the lever and the plurality of engagement members are configured to move the force applying member between a first position and a second position in response to the lever being displaced between the unactuated state and the actuated state, wherein when the lever is displaced from the unactuated state to the actuated state, the lever moves the force applying member in a first direction, and in response, the plurality of engagement members move the force applying member in a second direction perpendicular to the first direction, thereby moving the force applying member to the second position, a removable electronic module removably receivable in the support structure such that the removable electronic module defines another portion of the bracket, Wherein, when the detachable electronic module is received in the bracket, the rod is in the actuated state, and the force-applying component is in the second position: the plurality of spring contact fingers are compressed and apply a spring force to the cold plate, causing the cold plate to press against the detachable electronic module, so as to establish thermal contact between the cold plate and the detachable electronic module.

11. The electronic device according to claim 10, in, When the lever is displaced from the actuated state to the non-actuated state, the lever moves the force applying member in a third direction opposite to the first direction, and in response, the plurality of engagement members allow the force applying member to be moved by the plurality of spring contact fingers in a fourth direction opposite to the second direction, thereby moving the force applying member to the first position; as well as Wherein, when the detachable electronic module is received in the bracket, the lever is in the unactuated state, and the force-applying component is in the first position: the plurality of spring contact fingers are substantially decompressed and do not apply a spring force to press the cold plate against the detachable electronic module. 12 . The electronic device according to claim 10 , wherein a portion of the mounting element includes an embossed portion to define each of the plurality of engagement members, and wherein the embossed portion has an inclined body portion that protrudes toward the force applying member.

13. The electronic device of claim 12, wherein the force applying member comprises a base and a plurality of openings defined in the base, and wherein one end of each of the plurality of spring contact fingers extends from an edge of one of the plurality of openings.

14. The electronic device according to claim 13, in, In the unactuated state of the lever, the angled body portion projects into a corresponding one of the plurality of openings to allow the plurality of spring contact fingers to decompress and not apply a spring force pressing the cold plate against the removable electronic module; wherein, in the actuated state of the lever, the inclined body portion of each engagement member engages with the base of the force-applying member to compress the plurality of spring contact fingers and apply a spring force that presses the cold plate against the removable electronic module; and Wherein, when the lever is in a transition state between the actuated state and the non-actuated state, a portion of each spring contact finger slides along the inclined body portion to allow translation of each spring contact finger to be compressed or decompressed.

15. The electronic device of claim 10, further comprising a mechanical linkage interconnecting the lever and the force applying member, and wherein the lever is further pivotally connected to the mounting element to allow the lever to be displaced between the actuated state and the unactuated state.

16. The electronic device of claim 10, wherein the detachable electronic module further comprises a mechanical switch configured to be communicatively coupled to a controller of the electronic device, wherein: In the actuated state of the lever, the mechanical switch is moved to a closed position to send a signal to the controller, wherein the signal indicates that the cold plate is engaged to the removable electronic module, and in the unactuated state of the lever, the mechanical switch is moved to an open position to not send the signal to the controller, wherein not sending the signal indicates that the cold plate is disengaged from the removable electronic module.

17. The electronic device of claim 10, wherein the thermal contact is established between a dry thermal interface of the cold plate and the detachable electronic module.

18. A method comprising: placing a removable electronic module in a carrier of an electronic device, wherein the electronic device includes a cooling module mounted to a support structure of the electronic device at the carrier; as well as A rod connected to the mounting element and the force applying member of the cooling module is displaced from an unactuated position to an actuated position such that: The rod moves the force applying member along a first direction; In response to the movement of the force applying member along the first direction, the plurality of engagement members of the mounting element move the force applying member along a second direction perpendicular to the first direction so that the force applying member moves to a first position; as well as In response to the movement of the force-applying component along the second direction, the plurality of spring contact fingers of the force-applying component are compressed and apply spring force to a cold plate of the cooling module that is movably coupled to the mounting element, causing the cold plate to press against the detachable electronic module to establish thermal contact between the cold plate and the detachable electronic module.

19. The method of claim 18, further comprising shifting the lever from the actuated position to the unactuated position such that: The rod moves the force applying member along a third direction opposite to the first direction; In response to the movement of the force applying member along the third direction, the plurality of engagement members allow the force applying member to be moved by the plurality of spring contact fingers along a fourth direction opposite to the second direction so that the force applying member moves to a second position; as well as In response to the movement of the force applying member in the fourth direction, the plurality of spring contact fingers remain substantially decompressed and do not apply a spring force pressing the cold plate against the removable electronic module.

20. The method of claim 18, further comprising: When the lever is displaced to the actuated position, the lever moves a mechanical switch to a closed position to send a signal to a controller of the electronic device, wherein the signal indicates that the cold plate is engaged to the removable electronic module, and When the lever is displaced to the unactuated position, the mechanical switch is moved by the lever to an open position to not send the signal to the controller, wherein not sending the signal indicates that the cold plate is disengaged from the removable electronic module.

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