Electronic device

Abstract

An electronic device (100) is provided with a first circuit board (10), a second circuit board (20), a first housing member (30) provided with a first housing part (SP1) for housing the first circuit board (10), and a second housing member (40) provided with a second housing part (SP2) for housing the second circuit board (20). When the first frame member (30) and the second frame member (40) are assembled, a hollow portion (SP3) through which cooling water (CW1) flows is formed by the opposing surfaces (SF32, SF42) of the first frame member (30) and the second frame member (40). Furthermore, the housing parts (SP1, SP2) and the hollow part (SP3) are separated by the first frame member (30) and the second frame member (40), and the circuit board can be prevented from being wetted.

Description

Technical Field

[0001] The present disclosure relates to electronic devices. Background Art

[0002] As an example of an electronic device, there is a technology disclosed in Patent Document 1. Patent Document 1 discloses a circuit board, an electronic component arranged on the circuit board, and a heat conducting member arranged on the electronic component.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2022 / 192031 Summary of the invention

[0006] However, the electronic device may also be configured such that a cooling unit for allowing liquid refrigerant to flow is arranged in a space for accommodating the circuit board. In this case, the electronic device may have a risk of the liquid refrigerant leaking from the cooling unit wetting the circuit board.

[0007] An object of the disclosure is to provide an electronic device capable of suppressing a circuit substrate from getting wet.

[0008] The electronic device disclosed herein is characterized in that it comprises:

[0009] at least one circuit substrate; and

[0010] The frame includes a first frame member and a second frame member, and at least one of the first frame member and the second frame member is provided with a receiving portion for receiving the circuit substrate.

[0011] The first frame member and the second frame member, in the assembled state, form a hollow portion through which the liquid refrigerant flows by using the opposing surfaces of each other.

[0012] At least one of the first frame member and the second frame member is provided with an inlet and outlet connected to the hollow portion.

[0013] The receiving portion and the hollow portion are separated by a first frame member and a second frame member.

[0014] In this way, the housing portion of the electronic device that houses the circuit substrate and the hollow portion through which the liquid refrigerant flows are separated by the first frame member and the second frame member. Therefore, even if the electronic device leaks liquid refrigerant from the hollow portion, the liquid refrigerant can be prevented from entering the housing portion. That is, the electronic device can prevent the circuit substrate from getting wet.

[0015] The various embodiments disclosed in this specification adopt different technical means to achieve each purpose. The purposes, features and effects disclosed in this specification will become more apparent by referring to the following detailed description and the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view showing a schematic structure of an electronic device.

[0017] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0018] Figure 3 It is along Figure 1 Cross-sectional view along line III-III.

[0019] Figure 4 It is a perspective view showing a schematic configuration of the first circuit substrate side.

[0020] Figure 5 It is a perspective view showing a schematic configuration of the mounting surface side of the first housing member.

[0021] Figure 6 It is a perspective view showing a schematic structure of the facing surface side of the first frame member.

[0022] Figure 7 It is a perspective view showing a schematic configuration of the second circuit substrate side.

[0023] Figure 8 It is a perspective view showing a schematic configuration of the mounting surface side of the second frame member.

[0024] Fig. 9 It is a perspective view showing a schematic structure of the opposing surface side of the second frame member.

[0025] Fig.10 It is an exploded perspective view showing a schematic structure of an electronic device. DETAILED DESCRIPTION

[0026] Hereinafter, a plurality of modes for implementing the present disclosure will be described with reference to the drawings. In addition, in the following, three directions orthogonal to each other are represented as an X direction, a Y direction, and a Z direction.

[0027] use Figures 1 to 10, an electronic device 100 of the present embodiment is described. The electronic device 100 mainly includes a first circuit substrate 10, a second circuit substrate 20, a first frame member 30, and a second frame member 40. In addition, in the present embodiment, as an example, an electronic device 100 including a first cover 51, a second cover 52, a third cover 53, and a fourth cover 54 is used. The electronic device 100 is configured to cool the first circuit substrate 10 and the second circuit substrate 20 using cooling water CW1. The cooling water CW1 is equivalent to a liquid refrigerant.

[0028] The electronic device 100 is configured to be mounted on a mobile body such as a vehicle. For example, the electronic device 100 can be applied to an electronic control device. In addition, the electronic device 100 can be applied to an integrated control device that integrates multiple functions. Moreover, the electronic device 100 can be applied to an electronic control device for automatic driving. The following describes each component.

[0029] <First circuit board>

[0030] like Figure 2 , Figure 3 As shown in the figures, the first circuit substrate 10 includes a wiring substrate 11, a mounting component 12, a heat conducting component 13, a first connector 14, etc. The wiring substrate 11 includes, for example, an electrically insulating base material such as resin and conductive wiring such as copper. The wiring substrate 11 is a so-called printed wiring substrate. The wiring substrate 11 includes a mounting surface SF11 on which the mounting component 12 is mounted and a back surface SF12 opposite to the mounting surface SF11. In addition, the wiring substrate 11 is arranged along the XY plane.

[0031] The mounting component 12 is mounted on the mounting surface SF11. The mounting component 12 is electrically connected to the wiring of the wiring substrate 11. The mounting component 12 can be a SoC or the like. Thus, the first circuit substrate 10 is configured so that the mounting component 12 performs calculation processing. The first circuit substrate 10 can also be regarded as an electronic control device. SoC is the abbreviation of System on a Chip.

[0032] In addition, the wiring substrate 11 may be mounted with circuit components other than the mounting components 12. The number of mounting components 12 mounted on the wiring substrate 11 is not particularly limited. The wiring substrate 11 may be mounted with circuit components on the back surface SF12.

[0033] The mounting component 12 is a circuit component that generates heat by operation. The mounting component 12 is equivalent to a heat generating component. Therefore, in the present embodiment, an example is adopted in which a heat conducting component 13 is provided on the mounting component 12. The mounting component 12 is arranged opposite to a mounting surface SF31 of the first frame body component 30 described later. The mounting component 12 is mounted on the first frame body component 30 via the heat conducting component 13. Moreover, the heat conducting component 13 is in contact with the first frame body component 30.

[0034] The heat conducting member 13 is a member for reducing the thermal resistance between the mounting member 12 and the first frame member 30. The heat conducting member 13 can be a heat dissipation gel, a heat sink, etc. The heat conducting member 13 is sometimes referred to as a thermal interface material. The mounting surface SF31 corresponds to the reverse surface.

[0035] The first connector 14 is mounted on the mounting surface SF11. The first connector 14 is electrically connected to the wiring of the wiring substrate 11. The first connector 14 is an interface for electrically connecting the first circuit substrate 10 and the second circuit substrate 20.

[0036] <Second circuit board>

[0037] like Figure 2 , Figure 3 As shown in the figures, the second circuit board 20 includes a wiring board 21, a mounting member 22, a heat conducting member 23, a second connector 24, etc. The second circuit board 20 is configured in the same manner as the first circuit board 10. That is, components with the same names but different reference numerals are the same as those of the first circuit board 10.

[0038] The mounting member 22 is disposed so as to face a mounting surface SF41 of the second frame member 40 described later. The mounting member 22 is mounted on the second frame member 40 via the heat conducting member 23. The mounting surface SF41 corresponds to the opposite surface.

[0039] The second circuit board 20 is electrically connected to the first circuit board 10 by connecting the second connector 24 to the first connector 14. The first connector 14 and the second connector 24 may also be referred to as board connection connectors.

[0040] The second circuit board 20 is different from the first circuit board 10 in the number of mounting components 22 and the content of the calculation processing of the mounting components 22. The wiring board 21 includes a mounting surface SF21 on which the mounting components 22 are mounted and a back surface SF22 opposite to the mounting surface SF21. The mounting components 22 are equivalent to heat generating components.

[0041] In the present embodiment, an electronic device 100 including a first circuit substrate 10 and a second circuit substrate 20 is used. However, the electronic device 100 may also be configured to include only one of the first circuit substrate 10 and the second circuit substrate 20. Furthermore, the electronic device 100 may also be configured to include only one of the first circuit substrate 10 and the second circuit substrate 20 with a heat generating component. Hereinafter, when there is no need to distinguish between the first circuit substrate 10 and the second circuit substrate 20, the first circuit substrate 10 and the second circuit substrate 20 are also collectively referred to as circuit substrates 10 and 20.

[0042] <Frame>

[0043] like Figure 1 , Figure 2 , Figure 3 As shown, the frame includes a first frame member 30 and a second frame member 40. In addition, the frame includes a first cover 51, a second cover 52, a third cover 53, and a fourth cover 54. The frame is formed by assembling the first frame member 30, the second frame member 40, the first cover 51, the second cover 52, the third cover 53, and the fourth cover 54.

[0044] First, use Figure 2 to Figure 6 , the first frame member 30 is described. Figure 2 , Figure 3 , Figure 4 As shown, the first frame member 30 is a member that accommodates the first circuit substrate 10. In addition, the first frame member 30 may also be referred to as a member that mounts the first circuit substrate 10. Therefore, the first frame member 30 may also be referred to as a mounted member or a first mounted member.

[0045] like Figure 5 , Figure 6 As shown in the figures, the first frame body component 30 includes a base 31, side walls 32, 33. The base 31 includes a mounting surface SF31 on which the first circuit substrate 10 is mounted and an opposing surface SF32 which is the opposite surface of the mounting surface SF31. The opposing surface SF32 is a surface that faces the second frame body component 40 when the first frame body component 30 and the second frame body component 40 are assembled.

[0046] The base 31 is provided with side walls 32 and 33 at both ends in the Y direction. The side walls 32 and 33 are provided to protrude in the Z direction relative to the base 31. The side walls 32 and 33 are provided in the X direction. The first frame member 30 is provided with a first housing portion SP1 for housing the first circuit substrate 10 in an area sandwiched by the side walls 32 and 33. The first housing portion SP1 is an area facing the mounting surface SF31 and is an area between the side walls 32 and 33.

[0047] In addition, the mounting surface SF11 is opposite to the mounting surface SF31 when the first circuit substrate 10 is accommodated in the first frame body component 30. On the other hand, the back surface SF12 is exposed. Therefore, the first frame body component 30 is installed with the first cover 51 in the opposite area of ​​the mounting surface SF31. That is, the first cover 51 is installed on the first frame body component 30 in a manner that covers the back surface SF12.

[0048] Furthermore, the first frame member 30 is provided with a third cover 53 and a fourth cover 54 at the end portion along the Y direction of the base 31. However, the first frame member 30 may also be provided with a side wall portion at the end portion in the X direction that surrounds the first circuit substrate 10 together with the side wall portions 32 and 33. In addition, the first frame member 30 may also be provided with a side wall portion only at one end portion in the X direction.

[0049] The base 31 includes a cooling portion 31a. The cooling portion 31a is a part that forms a hollow portion SP3 described later. The facing surface SF32 of the cooling portion 31a is provided with a first recessed portion 31b that is recessed relative to the periphery. The facing surface SF32 of the cooling portion 31a is a portion that contacts the cooling water CW1. The first recessed portion 31b corresponds to the recessed portion.

[0050] like Figure 2 , Figure 5 , Figure 6 As shown in the figures, the base 31 is provided with a first opening 34. The first opening 34 is a through hole extending from the mounting surface SF31 to the facing surface SF32. The first opening 34 is provided to be closer to the side wall 33 than the side wall 32. The first opening 34 is provided for a part of the first connector 14 and the second connector 24 to be connected.

[0051] like Figure 6 As shown, the base 31 is provided with a sealing portion 35 around the first opening 34. The sealing portion 35 is provided on the facing surface SF32. The sealing portion 35 is a portion where a connector sealing member 80 described later is arranged. Here, as an example, a groove-shaped sealing portion 35 for the connector sealing member 80 is used.

[0052] Next, use Figure 2 , Figure 3 , Figure 7 to Figure 9 , the second frame member 40 is described. Figure 2 , Figure 3 , Figure 7 As shown, the second frame member 40 is a member that accommodates the second circuit board 20. In addition, the second frame member 40 can also be said to be a member on which the second circuit board 20 is mounted. Therefore, the second frame member 40 can also be said to be a mounted member or a second mounted member.

[0053] like Figure 7 , Figure 8 As shown in the figures, the second frame body component 40 includes a base 41, side wall portions 42, 43. The base 41 includes a mounting surface SF41 for mounting the second circuit substrate 20 and an opposing surface SF42 which is the opposite surface of the mounting surface SF41. The opposing surface SF42 is a surface that faces the first frame body component 30 when the first frame body component 30 and the second frame body component 40 are assembled.

[0054] The base 41 is provided with side walls 42 and 43 at both ends in the Y direction. The side walls 42 and 43 are provided to protrude in the Z direction relative to the base 41. The side walls 42 and 43 are provided in the X direction. The second frame member 40 is provided with a second housing portion SP2 for housing the second circuit substrate 20 in an area sandwiched by the side walls 42 and 43. The second housing portion SP2 is an area opposite to the mounting surface SF41 and is an area between the side walls 42 and 43.

[0055] In addition, the mounting surface SF21 is opposite to the mounting surface SF41 when the second circuit substrate 20 is accommodated in the second frame member 40. On the other hand, the back surface SF22 is exposed. Therefore, the second frame member 40 is provided with the second cover 52 in the area opposite to the mounting surface SF41. That is, the second cover 52 is provided to the second frame member 40 in a manner covering the back surface SF22.

[0056] Furthermore, the second frame body member 40 is provided with a third cover 53 and a fourth cover 54 at the end portion along the Y direction of the base 41. In this way, the third cover 53 and the fourth cover 54 are provided in common to the first frame body member 30 and the second frame body member 40. However, the present disclosure may not be provided with the third cover 53 and the fourth cover 54. In addition, the present disclosure may also be provided with electrical components such as external connection connectors instead of the third cover 53 and the fourth cover 54.

[0057] The second frame member 40 may include a side wall portion at the end portion in the X direction to surround the second circuit board 20 together with the side wall portions 42 and 43. The second frame member 40 may include a side wall portion only at one end portion in the X direction.

[0058] The base 41 includes a cooling portion 41a. The cooling portion 41a is a portion that forms the hollow portion SP3 described later. That is, the cooling portion 41a is a portion that forms the hollow portion SP3 together with the cooling portion 31a. The opposing surface SF42 of the cooling portion 41a is provided with a second recessed portion 41b that is recessed relative to the surrounding area. The opposing surface SF42 of the cooling portion 41a is a portion that is in contact with the cooling water CW1. The second recessed portion 41b is equivalent to a recessed portion.

[0059] In this way, the hollow portion SP3 is formed by making the first recess 31b and the second recess 41b face each other. Thus, the electronic device 100 can form a hollow portion SP3 wider than a hollow portion formed by a flat surface of one of the first recess 31b and the second recess 41b. Therefore, the electronic device 100 can increase the amount of cooling water CW1. Thus, the electronic device 100 can efficiently cool the circuit substrate.

[0060] like Figure 2 , Figure 8 , Fig. 9As shown in the figures, the base 41 is provided with a second opening 44. The second opening 44 is a through hole extending from the mounting surface SF41 to the facing surface SF42. The second opening 44 is provided to be closer to the side wall 43 than the side wall 42. The second opening 44 is provided for a part of the first connector 14 and the second connector 24 to be connected.

[0061] like Fig. 9 As shown, the base 41 is provided with a sealing portion 45 around the second opening 44. The sealing portion 45 is provided on the facing surface SF42. The sealing portion 45 is a portion where a connector sealing member 80 described later is disposed. Here, as an example, a groove-shaped sealing portion 45 is used where the connector sealing member 80 is disposed.

[0062] Moreover, if Fig. 9 As shown, an outflow portion 42a and an inflow portion 42b connected to the side wall portion 42 are provided. In addition, the outflow portion 42a and the inflow portion 42b are provided as an integral body with the side wall portion 42. Thus, it can also be said that the outflow portion 42a and the inflow portion 42b are provided adjacent to the same side wall portion 42.

[0063] The outflow portion 42a is a portion where an outflow pipe for the cooling water CW1 flowing therethrough is installed. The outflow portion 42a is provided with an outflow port 42c which is a through hole connected to the hollow portion SP3. The cooling water CW1 flowing through the hollow portion SP3 is discharged to the outflow pipe through the outflow port 42c.

[0064] The inflow portion 42b is a portion where an inflow pipe for flowing cooling water CW1 is installed. The inflow portion 42b is provided with an inflow port 42d which is a through hole connected to the hollow portion SP3. The cooling water CW1 is supplied from the inflow pipe to the hollow portion SP3 through the inflow port 42d.

[0065] In addition, the second frame member 40 has a wall portion 41c protruding toward the hollow portion SP3. The wall portion 41c is a portion protruding relative to the opposing surface SF42 in the cooling portion 41a. The wall portion 41c has a height, for example, of the depth of the second recess 41b. However, the wall portion 41c may also have a height of the depth of the hollow portion SP3 in the Z direction. The height is the length in the Z direction. The length of the hollow portion SP3 is equivalent to the interval between the opposing surfaces SF32 and 42 in the hollow portion SP3.

[0066] The wall portion 41c is disposed between the outflow port 42c and the inflow port 42d. That is, the wall portion 41c is connected to the outflow port 42c and the inflow port 42d in the wall on the side of the side wall portion 42 of the second recess 41b. Moreover, the wall portion 41c is arranged along the Y direction without reaching the wall on the side of the side wall portion 43 of the second recess 41b. In this way, the wall portion 41c partially divides the hollow portion SP3 into the outflow port 42c side and the inflow port 42d side. The wall portion 41c only needs to be provided on at least one of the first frame member 30 and the second frame member 40. In addition, the wall portion 41c can also be called a rectifying portion or rectifying wall for adjusting the flow of the liquid refrigerant.

[0067] In addition, the outflow port 42c and the inflow port 42d are equivalent to the outflow and inflow ports. The outflow pipe and the inflow pipe are equivalent to the pipe. The outflow pipe can also be said to be installed at the outflow port 42c. The inflow pipe can also be said to be installed at the inflow port 42d.

[0068] In the present embodiment, as an example, an example is adopted in which the outflow portion 42a and the inflow portion 42b are provided in the second frame body member 40. However, the outflow portion 42a and the inflow portion 42b may also be provided in the first frame body member 30. In addition, the outflow portion 42a may be provided in one of the first frame body member 30 and the second frame body member 40, and the inflow portion 42b may be provided in the other.

[0069] Alternatively, one of the outflow portion 42a and the inflow portion 42b may be provided on the side wall portion 42, and the other may be provided on the side wall portion 43. That is, the electronic device 100 may be configured so that the cooling water CW1 flows linearly.

[0070] Thus, the electronic device 100 has a first receiving portion SP1 and a second receiving portion SP2 as receiving portions. In addition, the first frame member 30 and the second frame member 40 have receiving portions SP1 and SP2. Therefore, the first frame member 30 and the second frame member 40 are equivalent to receiving frame members. However, the present disclosure may also adopt a configuration in which receiving portions SP1 and SP2 are provided on at least one of the first frame member 30 and the second frame member 40.

[0071] In addition, the first frame body component 30 and the second frame body component 40 are mainly composed of metal such as aluminum. However, the present disclosure is not limited to this. It is also possible that only one of the first frame body component 30 and the second frame body component 40 is mainly composed of metal. Moreover, the first frame body component 30 and the second frame body component 40 can also be used when they are mainly composed of resin.

[0072] <Electronic devices>

[0073] Here, the electronic device 100 in which the components are assembled as described above and the assembled state will be described.

[0074] like Fig.10 As shown, the electronic device 100 includes a first circuit board 10, a second circuit board 20, a first frame member 30, a second frame member 40, a first cover 51, and a second cover 52 as independent components. In addition, the electronic device 100 includes a sealing member 60, a gasket 70, and a connector sealing member 80 as independent components.

[0075] The electronic device 100 is formed by stacking and assembling these components. The electronic device 100 is assembled so that the facing surface SF32 of the first frame member 30 faces SF42 of the second frame member 40. The first frame member 30 and the second frame member 40 are fixed by a screw member 1 that is an external thread. Figure 6 As shown in FIG. 1 , a screw opening 1a is provided for inserting the screw member 1. On the other hand, the second frame member 40 is as shown in FIG. Fig. 9 As shown, a screw hole 1b is provided for tightening the screw member 1. The screw hole 1b is formed with an internal thread. The first frame member 30 and the second frame member 40 are fixed by tightening the screw hole 1b with the screw member 1 inserted into the screw opening 1a.

[0076] In addition, the first frame member 30 and the second frame member 40 form a hollow portion SP3 by their mutually facing surfaces SF32 and SF42 in the assembled state. The hollow portion SP3 is a space through which the cooling water CW1 flows. Therefore, the hollow portion SP3 can also be called a refrigerant flow path.

[0077] like Figure 2 , Figure 3 , Figure 6 , Fig. 9 As shown, a sealing member 60 is provided between the first frame member 30 and the second frame member 40, surrounding the hollow portion SP3 on the entire circumference. The sealing member 60 can also be said to be provided in the opposing region of the first frame member 30 and the second frame member 40. That is, the first frame member 30 and the second frame member 40 are fixed in a state where the sealing member 60 is arranged in the opposing region.

[0078] The sealing member 60 is a member for suppressing leakage of the cooling water CW1 from the hollow portion SP3. The sealing member 60 can be an O-ring, a packing material, or the like.

[0079] The sealing member 60 is in contact with the first frame member 30 and the second frame member 40. In detail, the sealing member 60 is in contact with the opposing surfaces SF32 and SF42. Moreover, the sealing member 60 is fixed by the screw member 1 as described above, so as to be configured in a state pressed from the opposing surfaces SF32 and SF42. Thus, the electronic device 100 can suppress the cooling water CW1 from leaking from the hollow portion SP3.

[0080] like Figure 6 , Fig. 9 As shown, the screw member 1 is provided at multiple positions in the outer periphery of the sealing member 60. That is, the screw member 1 is provided at multiple positions in a manner of surrounding the sealing member 60. The screw member 1 is provided at multiple positions on each side of the sealing member 60 along the Y direction. In addition, the screw member 1 is provided at multiple positions on each side of the sealing member 60 along the X direction. Moreover, the screw member 1 is provided at two positions sandwiching the outflow port 42c and two positions sandwiching the inflow port 42d.

[0081] Thus, the electronic device 100 can press the entire circumference of the sealing member 60 with the first frame member 30 and the second frame member 40 , thereby improving the sealing performance. In other words, the electronic device 100 can improve the leakage prevention function of the sealing member 60 .

[0082] In addition, the electronic device 100 does not need to include the sealing member 60. For example, by welding the first frame member 30 and the second frame member 40 so as to surround the entire circumference of the hollow portion SP3, leakage of the cooling water CW1 from the hollow portion SP3 can be suppressed.

[0083] In addition, if Figure 2 , Figure 3 , Figure 6 , Fig. 9 As shown, a gasket 70 is provided in the opposing region of the first frame body member 30 and the second frame body member 40, surrounding the sealing member 60 over the entire circumference. It can also be said that the gasket 70 is provided on the outer circumference of the sealing member 60. That is, the first frame body member 30 and the second frame body member 40 are fixed in a state where the gasket 70 is arranged in the opposing region.

[0084] As described above, the electronic device 100 includes the sealing member 60 to suppress leakage of the cooling water CW1 from the hollow portion SP3. However, it is also possible that the cooling water CW1 leaks due to deterioration of the sealing member 60. The gasket 70 is a member for preventing the leaked cooling water CW1 from scattering violently even if the cooling water CW1 leaks. The gasket 70 is equivalent to a scattering prevention member.

[0085] The material of the gasket 70 is not particularly limited. The gasket 70 is preferably in contact with both opposing surfaces SF32 and SF42. However, the gasket 70 only needs to be in contact with at least one of the opposing surfaces SF32 and SF42. In addition, the gasket 70 may be a portion protruding from at least one of the opposing surfaces SF32 and SF42.

[0086] Thus, even if the cooling water CW1 leaks from the hollow portion SP3, the electronic device 100 can suppress the leaked liquid refrigerant from flowing out violently. In addition, the screw members 1 may be provided at multiple locations on the outer periphery of the washer 70. In addition, the electronic device 100 may not include the washer 70.

[0087] As described above, the second frame member 40 includes the wall portion 41c. Therefore, in a state where the first frame member 30 and the second frame member 40 are assembled, the wall portion 41c is arranged in the hollow portion SP3. Thus, the cooling water CW1 flows in a U-shape in the hollow portion SP3. Therefore, the electronic device 100 can be configured so that the cooling water CW1 can easily flow through the entire area of ​​the hollow portion SP3.

[0088] To describe in detail, in this embodiment, as an example, a structure in which an inlet 42d and an outlet 42c are provided on one side of a side wall portion 42 is adopted. Therefore, the cooling water CW1 easily flows into the hollow portion SP3 from the inlet 42d, flows through the entire area of ​​the hollow portion SP3, and is discharged from the outlet 42c. Thus, it is possible to suppress the cooling water CW1 from being retained in a part of the hollow portion SP3. Thus, the electronic device 100 can expand the cooling space. However, the electronic device 100 may not have the wall portion 41c.

[0089] In addition, if Figure 2 , Figure 3 As shown, a gap SP4 connected to the external space is provided between the opposing surfaces SF32 and SF42 on the periphery of the sealing component 60. That is, when the electronic device 100 is assembled with the first frame body component 30 and the second frame body component 40, the opposing surfaces SF32 and SF42 on the periphery of the sealing component 60 are in a non-contact state. The gap SP4 can also be said to be the opposing area of ​​the opposing surfaces SF32 and SF42 around the sealing component 60.

[0090] In addition, the external space refers to a space where the electronic device 100 is arranged. In addition, the external space can also be referred to as the peripheral space of the electronic device 100. Thus, even if the cooling water CW1 leaks from the hollow portion SP3 of the electronic device 100, the cooling water CW1 can be discharged to the external space. However, the electronic device 100 may not be provided with the gap SP4. In addition, the gap SP4 may be provided only in a part of the periphery of the sealing member 60.

[0091] Furthermore, a connector seal member 80 is provided between the first frame member 30 and the second frame member 40 around the first opening 34 and the second opening 44. That is, the first frame member 30 and the second frame member 40 are fixed with the connector seal member 80 disposed on the seal portions 35 and 45.

[0092] The connector sealing member 80 is in contact with the sealing portions 35 and 45. Specifically, the connector sealing member 80 is fixed by the screw member 1 as described above, and is arranged in a state pressed from the sealing portions 35 and 45. Thus, even if the cooling water CW1 leaks from the hollow portion SP3 of the electronic device 100, it is possible to suppress the first connector 14 and the second connector 24 from getting wet.

[0093] In this way, the first frame member 30 and the second frame member 40 are fixed by the screw member 1 to form a base portion of the frame having a hollow portion SP3 and a gap SP4. Figure 4 , Figure 7 As shown in FIG. 1 and FIG. 2 , the first circuit substrate 10 and the second circuit substrate 20 are mounted on the base portion. That is, the first circuit substrate 10 is mounted on the first frame member 30. The second circuit substrate 20 is mounted on the second frame member 40. The frame members 30, 40 and the circuit substrates 10, 20 are fixed by screws or the like.

[0094] Therefore, if Figure 2 , Figure 3 As shown, the first circuit substrate 10 and the second circuit substrate 20 are fixed in a manner of clamping the base 31 of the first frame member 30 and the base 41 of the second frame member 40. Moreover, cooling parts 31a and 41a are arranged between the first circuit substrate 10 and the second circuit substrate 20. Thus, the hollow part SP3 is provided between the first circuit substrate 10 and the second circuit substrate 20. Therefore, the electronic device 100 can cool the first circuit substrate 10 and the second circuit substrate 20 by the cooling water CW1 flowing in the hollow part SP3. That is, the hollow part SP3 can also be said to be a refrigerant space provided in common for the first circuit substrate 10 and the second circuit substrate 20.

[0095] Furthermore, it is preferable that the mounting components 12 and 22 of each circuit substrate 10 and 20 are arranged to face the cooling portions 31 a and 41 a . Thus, the electronic device 100 can cool the mounting components 12 and 22 efficiently.

[0096] In particular, the electronic device 100 includes a first circuit substrate 10 and a second circuit substrate 20. In addition, regarding the electronic device 100, it is considered that the number of mounting components 12, 22 and the amount of calculation of each mounting component 12, 22 increase with the integration of functions. As a result, the electronic device 100 is likely to generate more heat. In contrast, the electronic device 100 can cool the first circuit substrate 10 and the second circuit substrate 20 using cooling water CW1. Therefore, the electronic device 100 can operate the first circuit substrate 10 and the second circuit substrate 20 at an appropriate temperature. That is, the electronic device 100 can withstand an increase in the number of mounting components 12, 22 and the amount of calculation of each mounting component 12, 22. Moreover, the electronic device 100 can maintain stable operation even if the number of mounting components 12, 22 and the amount of calculation of each mounting component 12, 22 increase.

[0097] In addition, in the present embodiment, as an example, the first frame member 30 and the second frame member 40 mainly composed of metal are used. Therefore, the electronic device 100 can improve the cooling effect of the cooling water CW1 on the circuit boards 10 and 20.

[0098] However, the present disclosure is not limited to this. Alternatively, only one of the first frame body component 30 and the second frame body component 40 may be composed of metal as a main component. In a configuration in which a circuit substrate is mounted on only one of the first frame body component 30 and the second frame body component 40, it is preferred that the side on which the circuit substrate is mounted is composed of metal as a main component. That is, it is preferred that the side of the first frame body component 30 and the second frame body component 40 on which the housing portions SP1 and SP2 are formed is composed of metal as a main component. Thus, the electronic device 100 can improve the cooling effect of the cooling water CW1 on the circuit substrate.

[0099] The first frame member 30 includes two side walls 32 and 33 sandwiching the first receiving portion SP1. Similarly, the second frame member 40 includes two side walls 42 and 43 sandwiching the second receiving portion SP2. Thus, even if the cooling water CW1 leaks from the hollow portion SP3 of the electronic device 100, it is possible to further prevent the cooling water CW1 from entering the receiving portions SP1 and SP2.

[0100] However, pipes through which the cooling water CW1 flows are attached to the outflow portion 42a and the inflow portion 42b. Therefore, there is a possibility that the cooling water CW1 flows through the outflow portion 42a, the inflow portion 42b, and the portion where the pipes are attached.

[0101] However, if Figure 2 , Figure 7 As shown in FIG. 1 and FIG. 2 , the second frame member 40 is provided with a side wall portion 42 between the second housing portion SP2 and the outflow portion 42a and the inflow portion 42b. Figure 2 , Figure 4As shown in the figures, the first frame member 30 is provided with a side wall portion 32 between the first housing portion SP1 and the outflow portion 42a and the inflow portion 42b. That is, the side wall portion 32 divides the outflow portion 42a, the inflow portion 42b and the first housing portion SP1. The side wall portion 42 divides the outflow portion 42a, the inflow portion 42b and the second housing portion SP2. Therefore, the electronic device 100 can prevent the cooling water CW1 leaking from the outflow portion 42a, the inflow portion 42b and the installation portion of the pipe from wetting each circuit substrate 10, 20.

[0102] <Effect>

[0103] As described above, the housing parts SP1 and SP2 of the electronic device 100 housing the circuit substrates 10 and 20 and the hollow part SP3 through which the cooling water CW1 flows are separated by the first frame member 30 and the second frame member 40. That is, the housing parts SP1 and SP2 and the hollow part SP3 are divided at least by the bases 31 and 41. In addition, the housing parts SP1 and SP2 and the hollow part SP3 are different spaces.

[0104] Therefore, even if the cooling water CW1 leaks from the hollow portion SP3, the electronic device 100 can suppress the cooling water CW1 from entering the housing portions SP1 and SP2. That is, the electronic device 100 can suppress the circuit boards 10 and 20 from getting wet.

[0105] The present disclosure is described based on the embodiments, but it is understood that the present disclosure is not limited to the embodiments and structures. The present disclosure also includes various modifications and deformations within the equivalent range. In addition, although various combinations and methods are shown in the present disclosure, other combinations and methods including only one element, more than one element, or less than one element among them also fall within the scope of the present disclosure and the scope of thought.

Claims

1. An electronic device, characterized in that: have: at least one circuit substrate; and The frame includes a first frame member and a second frame member, and at least one of the first frame member and the second frame member is provided with a receiving portion for receiving the circuit substrate. The first frame member and the second frame member, in an assembled state, form a hollow portion through which liquid refrigerant flows by using mutually facing surfaces. At least one of the first frame member and the second frame member is provided with an inlet and outlet connected to the hollow portion. The receiving portion and the hollow portion are separated by the first frame member and the second frame member.

2. The electronic device according to claim 1, characterized in that: A sealing member surrounding the hollow portion is provided between the first frame member and the second frame member. The sealing member is in contact with the first frame member and the second frame member.

3. The electronic device according to claim 2, characterized in that: A scattering prevention member surrounding the sealing member is provided in a region where the first frame member and the second frame member face each other.

4. The electronic device according to claim 3, characterized in that: A gap connected to the external space is provided between the facing surfaces on the outer periphery of the sealing member.

5. The electronic device according to claim 2 or 3, characterized in that: The first frame member and the second frame member are fixed by screw members in an assembled state.

6. The electronic device according to claim 5, characterized in that: The screw members are provided at a plurality of locations on the outer circumference of the sealing member.

7. The electronic device according to any one of claims 1 to 4, characterized in that: Of the first frame member and the second frame member, the housing frame member in which the housing portion is formed is composed of metal as a main component.

8. The electronic device according to any one of claims 1 to 4, characterized in that: The housing frame member in which the housing portion is formed, of the first frame member and the second frame member, includes two side wall portions sandwiching the housing portion.

9. The electronic device according to any one of claims 1 to 4, characterized in that: The opposing surface has a concave portion that is recessed relative to the periphery. The hollow portion is formed by the opposing recesses.

10. The electronic device according to any one of claims 1 to 4, characterized in that: The circuit substrate includes a first circuit substrate and a second circuit substrate. The first frame member includes a first housing portion for housing the first circuit substrate as the housing portion. The second frame member includes a second housing portion for housing the second circuit substrate as the housing portion. The hollow portion is provided between the first circuit substrate and the second circuit substrate.

11. The electronic device according to claim 10, characterized in that: At least one of the circuit substrates is mounted with a heat generating component, The heat generating component is arranged to face the opposite surface of the facing surface.

12. The electronic device according to claim 10, characterized in that: The first circuit substrate includes a first connector. The second circuit substrate includes a second connector electrically connected to the first connector. The first frame member is provided with a first opening portion for arranging a part of the first connector and the second connector to be connected. The second frame member is provided with a second opening portion for arranging a part of the first connector and the second connector to be connected. A connector sealing member provided around the first opening and the second opening is provided between the first frame member and the second frame member.

13. The electronic device according to any one of claims 1 to 4, characterized in that: A pipe through which the liquid refrigerant flows is installed at the inlet and outlet.

14. The electronic device according to any one of claims 1 to 4, characterized in that: The first frame member and the second frame member include a wall portion protruding toward the hollow portion. The wall portion is disposed between the inlet and outlet of the outflow and inflow.

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