Heat dissipation structure and imaging device

Abstract

The present application discloses a heat dissipation structure and an imaging device, which are used to reduce the risk of dust accumulation and water ingress. The present application includes: a heat dissipation body, a heat pipe and a radiator; a plurality of heat dissipation fins are arranged in the heat dissipation body, a heat dissipation air duct is formed between adjacent heat dissipation fins, the heat dissipation air duct runs through the heat dissipation body, a heat dissipation slot is arranged on the heat dissipation body, the heat dissipation slot extends from the side of the heat dissipation body toward the heat dissipation fins, and the heat dissipation slot is connected to the heat dissipation air duct; the heat pipe is embedded in the heat dissipation slot and is sealed with the heat dissipation body, the heat absorption side of the heat pipe is in contact with the heating element inside the imaging device, the heat conduction side of the heat pipe is located in the heat dissipation air duct and is connected to a plurality of heat dissipation fins, and the heat pipe is used to transfer the heat of the heating element to a plurality of heat dissipation fins; the radiator is arranged at the end of the heat dissipation body and is aligned with the heat dissipation air duct, and the radiator is used to control the air flow in the heat dissipation air duct.

Description

Technical Field

[0001] The present application relates to the technical field of equipment heat dissipation, and in particular to a heat dissipation structure and an imaging device. Background Art

[0002] At present, imaging devices such as cameras and imaging colorimeters are widely used, and the requirements for equipment performance, stability and accuracy are gradually increasing during the application process. These imaging devices generate a lot of heat during operation, such as when a high-performance camera performs high-speed continuous shooting, or when an imaging colorimeter performs long-term color analysis. Traditionally, in order to ensure the stable operation of the instrument and prevent performance degradation or damage caused by overheating, a built-in heat dissipation method is often used. This method sets an air duct and a radiator in the imaging device, and drives the air circulation in the heat dissipation duct through the radiator, thereby achieving heat dissipation of the heating components in the imaging device.

[0003] However, in the traditional cooling method with built-in cooling ducts, although the built-in ducts can effectively guide the air flow, the built-in ducts are connected to the heating elements and the PCB motherboard. As the cooling work proceeds, some dust and moisture remain on the heating elements or the PCB motherboard. Long-term accumulation will affect the cooling efficiency and measurement accuracy, and there is a situation where water enters the duct, causing damage to internal components.

[0004] Based on this, a heat dissipation structure is urgently needed to solve the deficiencies in the above imaging device. Summary of the invention

[0005] In order to solve the above technical problems, the present application provides a heat dissipation structure and an imaging device, which can reduce the risk of dust accumulation and water ingress in the imaging device and improve the heat dissipation efficiency.

[0006] A first aspect of the present application provides a heat dissipation structure, comprising:

[0007] The heat dissipation device is a heat dissipation device, a heat dissipation device, a heat dissipation device and a heat dissipation device. The heat dissipation device is a heat dissipation device, a heat dissipation device and a heat dissipation device. The heat dissipation device is a heat dissipation device, a heat dissipation device and a heat dissipation device. The heat dissipation device is a heat dissipation device, a heat dissipation device and a heat dissipation device.

[0008] Optionally, the heat absorbing side of the heat pipe is flush with the outer surface of the heat dissipation body.

[0009] Optionally, a sealing member is provided on a side surface of the heat dissipation slot, and when the heat pipe is embedded in the heat dissipation slot, the sealing member abuts against the heat pipe.

[0010] Optionally, the heat dissipation body is composed of two heat dissipation components that are sealed and connected, and the two heat dissipation components are combined to form the heat dissipation air duct, and the two heat dissipation components are respectively provided with the heat dissipation slots and the heat pipes embedded in the heat dissipation slots.

[0011] Optionally, the two heat sinks are connected via a snap-fit ​​structure.

[0012] Optionally, the heat-conducting side of the heat pipe is connected to the heat-dissipating fins in the heat-dissipating element by welding.

[0013] Optionally, the radiator is a turbofan, a housing of the imaging device is provided with a ventilation hole, the turbofan is arranged between the ventilation hole and the heat dissipation body, and the turbofan is aligned with the heat dissipation air duct and the ventilation hole respectively;

[0014] or,

[0015] Both ends of the heat dissipation body are respectively connected to the outer shell of the imaging device, the heat dissipation air duct is aligned with the ventilation hole, and the turbo fan is arranged at the outer side of the ventilation hole and connected to the outer shell of the imaging device.

[0016] Optionally, turbo fans are respectively provided at both ends of the heat dissipation body, and the air intake directions of the two turbo fans are the same.

[0017] Optionally, a heat-conducting material is provided between the heating element and the heat-absorbing side of the heat pipe.

[0018] The second aspect of the present application provides an imaging device, comprising a PCB mainboard, a housing, and the first aspect and any optional heat dissipation structure in the first aspect, wherein the heat dissipation structure is fixed in the housing, and both ends of the heat dissipation structure are sealed and connected to the housing, the PCB mainboard is located in the housing and is arranged on the side of the heat dissipation structure, and the heating element on the PCB mainboard is in contact with the heat pipe on the heat dissipation structure, and the heat dissipation structure is used to dissipate heat from the heating element.

[0019] It can be seen from the above technical solutions that this application has the following effects:

[0020] The heat dissipation factor is the same as the heat dissipation factor in the example embodiment of the present invention, and the heat dissipation factor is the same as the heat dissipation factor in the example embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution in the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of a heat dissipation structure provided in this application;

[0023] Figure 2 An exploded schematic diagram of a heat dissipation structure provided in the present application;

[0024] Figure 3 A schematic diagram of the cooperation of two heat sinks in a heat dissipation structure provided in the present application;

[0025] Figure 4 A schematic diagram of a heat pipe and a heat sink in a heat dissipation structure provided in the present application;

[0026] Figure 5 A schematic diagram of a clamping structure in a heat dissipation structure provided in the present application;

[0027] Figure 6 A schematic diagram of a sealing member in a heat dissipation structure provided in the present application;

[0028] Figure 7 A schematic diagram of an imaging device of the present application;

[0029] Among them, the heat dissipation body 01, the heat pipe 02, the radiator 03, the heat dissipation fins 04, the heat dissipation slot 05, the first heating element 06, the seal 07, the heat dissipation element 08, the clamping structure 09, the ventilation hole 10, the shell 11, the first PCB main board 12, the clamping column 13, the groove 14, the second heating element 15, and the second PCB main board 16. DETAILED DESCRIPTION

[0030] In the present invention, the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front”, “back”, “top”, “bottom”, “inside”, “outside”, “middle”, “vertical”, “horizontal”, “lateral” and “longitudinal” are based on the directions or positional relationships shown in the accompanying drawings, and are only used to illustrate the relative positional relationships between the various components or components, and do not particularly limit the specific installation directions of the various components or components.

[0031] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0032] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] In addition, the structures, proportions, sizes, etc. drawn in the drawings in the present application are only used to match the contents disclosed in the specification for the technical personnel in this field to understand and read, and are not used to limit the restrictive conditions under which the present application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in the present application without affecting the effects and purposes that can be achieved by the present application.

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] The present application provides a heat dissipation structure and an imaging device, which are used to reduce the risk of dust accumulation and water ingress in the imaging device and improve the heat dissipation efficiency. The specific implementation process of the present application is described as follows.

[0036] See also Figures 1 to 6 The first aspect of the present application provides a heat dissipation structure, which is arranged in an imaging device and includes:

[0037] A heat dissipation body 01, a heat pipe 02 and a radiator 03; a plurality of heat dissipation fins 04 are arranged in the heat dissipation body 01, a heat dissipation duct is formed between adjacent heat dissipation fins 04, the heat dissipation duct runs through the heat dissipation body 01, a heat dissipation slot 05 is arranged on the heat dissipation body 01, the heat dissipation slot 05 extends from the side of the heat dissipation body 01 toward the heat dissipation fins 04, and the heat dissipation slot 05 is connected with the heat dissipation duct; the heat pipe 02 is embedded in the heat dissipation slot 05 and is sealed with the heat dissipation body 01, the heat absorption side of the heat pipe 02 is in contact with the heating element inside the imaging device, the heat conduction side of the heat pipe 02 is located in the heat dissipation duct and is connected with the plurality of heat dissipation fins 04, the heat pipe 02 is used to transfer the heat of the heating element to the plurality of heat dissipation fins 04; the radiator 03 is arranged at the end of the heat dissipation body 01 and is aligned with the heat dissipation duct, and the radiator 03 is used to control the air flow in the heat dissipation duct.

[0038] Multiple layers of heat sink fins 04 are arranged inside the heat sink body 01. The heat sink fins 04 are usually made of high thermal conductivity materials (such as aluminum alloy, copper) and have good thermal conductivity. Appropriate spacing is maintained between the heat sink fins 04 to form multiple independent heat sink air ducts. The heat sink air ducts run through both ends of the entire heat sink body 01 to provide air circulation channels, so that the heat on the heat sink fins 04 can be discharged when the air circulates.

[0039] The heat dissipation duct formed between adjacent heat dissipation fins 04 first increases the heat dissipation area, and secondly promotes natural convection or forced convection of air (strong air convection driven by a fan). External air can enter the heat dissipation body 01 through the heat dissipation duct, and after heat exchange with the heat dissipation fins 04, the hot air carrying heat is discharged to achieve effective heat dissipation.

[0040] A heat dissipation slot 05 is provided on the heat dissipation body 01. The heat dissipation slot 05 first penetrates the heat dissipation body 01 and extends from the side of the heat dissipation body 01 toward the heat dissipation fins 04. After extension, the heat dissipation slot 05 is connected to the internal heat dissipation air duct. Specifically, the heat dissipation slot 05 can extend inward on one side of the heat dissipation body 01, or can extend inward on two sides, or can extend inward on three or four sides. The specific number of sides is not limited here, and is subject to actual achievable. The size and shape of the heat dissipation slot 05 match the heat pipe 02, so that the heat pipe 02 can be inserted into the heat dissipation slot 05. The heat pipe 02 is embedded in the heat dissipation slot 05 and fits tightly to the heat dissipation slot 05. The heat pipe 02 can effectively transfer the heat of the heating element to the heat dissipation fins 04.

[0041] The heating element includes a first heating element 06 and a second heating element 15 . The first heating element 06 is located on the side and top of the heat dissipation body 01 , and the second heating element 15 is located on the bottom of the heat dissipation body 01 .

[0042] The heat pipe 02 is provided with a heat absorbing side and a heat conducting side. The heat absorbing side is used to absorb the heat of the heating element, and the heat conducting side is used to transfer the heat to the heat dissipation fins 04. In this embodiment, the heat absorbing side of the heat pipe 02 is directly in contact with the heating element (the first heating element 06 and the second heating element 15) inside the imaging device to ensure that the heat can be quickly transferred from the heating element to the heat pipe 02. The heat pipe 02 is filled with an easily evaporable working medium. When the heating element generates heat, the heat absorbing side of the heat pipe 02 (i.e., the side in contact with the heating element) is heated, and the working medium evaporates and flows along the microchannel inside the heat pipe 02 to the heat conducting side (i.e., the side connected to the heat dissipation fins 04). On the heat conducting side of the heat pipe 02, the working medium releases heat and condenses, and then flows back to the heat absorbing side, forming a closed-loop evaporation-condensation cycle. During this cycle, the heat pipe 02 effectively transfers the heat of the heating element to the heat dissipation fins 04.

[0043] The radiator 03 is arranged at the end of the heat dissipation body 01 and is aligned with the heat dissipation duct. When the radiator 03 is in operation, the air flow in the heat dissipation duct is controlled to accelerate the heat dissipation. The radiator 03 can generate a forced airflow. When the radiator 03 is working, a strong airflow will be generated. The airflow flows along the heat dissipation duct and fully exchanges heat with the heat dissipation fins 04. The air flow is accelerated through the radiator 03, which significantly improves the heat dissipation efficiency, so that the heat is taken away from the heat dissipation body 01 more quickly and dissipated into the surrounding environment.

[0044] The heat dissipation structure of the present application, through the coordinated work of the heat dissipation body 01, the heat pipe 02 and the radiator 03, separates the heat dissipation duct from the components inside the imaging device through the heat dissipation body 01, which can not only effectively reduce the temperature inside the imaging device, but also ensure that problems such as dust accumulation and water ingress caused by the heat dissipation duct are avoided.

[0045] Please continue reading Figure 6 In an optional embodiment, the heat absorbing side of the heat pipe 02 is flush with the outer surface of the heat dissipation body 01. When the heat dissipation slots are arranged around the heat dissipation body 01, the heat absorbing side of the heat pipe 02 is flush with each outer surface of the surrounding area. In addition, the cross section of the heat pipe 02 is set in a conical shape, that is, the heat absorbing side of the heat pipe 02 is gradually reduced to the heat conducting side. In this embodiment, the heat absorbing side of the heat pipe 02 is flush with the outer surface of the heat dissipation body 01, so that the heat pipe 02 is more compact when installed, which can not only reduce the overall volume of the heat dissipation structure, but also facilitate the arrangement of multiple heat pipes 02 in the limited space of the heat dissipation body 01 to improve the heat dissipation capacity; at the same time, it is also conducive to the integration of the heat pipe 02 with other components inside the imaging device, and reduce the mutual interference between the components inside the imaging device.

[0046] The heat absorbing side of the heat pipe 02 has a larger area, so as to increase the contact area with the heating element, and the heat can be transferred to the heat pipe 02 more quickly, thereby improving the heat transfer efficiency. In addition, the heat absorbing side area is larger than the heat conducting side area, so that the heat pipe 02 is easier to get stuck in the heat dissipation slot 05 and is not easy to fall off.

[0047] Please continue reading Figure 6 In an optional embodiment, a seal 07 is provided on the side of the heat dissipation slot 05. When the heat pipe 02 is inserted into the heat dissipation slot 05, the seal 07 abuts against the heat pipe 02. In this embodiment, the seal 07 is mounted on the side of the heat dissipation slot 05, that is, on both sides of the insertion path of the heat pipe 02. The seal 07 can be made of an elastic material, such as silicone, rubber or a high-temperature resistant elastomer. The seal 07 has certain compressibility and resilience, and can be deformed and tightly attached to the surface of the heat pipe 02 when subjected to pressure. By providing the seal 07, the connection sealing between the heat pipe 02 and the heat dissipation slot 05 can be improved, thereby preventing dust and moisture from entering the interior of the imaging device from the heat dissipation air duct and the heat dissipation slot 05, and further reducing the risk of dust accumulation and water ingress.

[0048] The side of the heat dissipation slot 05 can be set as an inclined surface, and the seal 07 is fixed on the inclined surface. The corresponding heat pipe 02 is also provided with an inclined surface. The inclined surface on the heat pipe 02 and the inclined surface on the heat dissipation slot 05 match and contact each other, and the sealing between the two inclined surfaces is improved by the seal 07. The inclined surface can also limit the embedding depth of the heat pipe 02 to avoid embedding too deep and failing to contact the heating element.

[0049] The heat dissipation body 01 described above is a whole, with heat dissipation fins 04 inside, and heat dissipation air ducts formed between the heat dissipation fins 04. The heat dissipation fins 04 and the heat dissipation air ducts are connected by heat pipes 02, that is, the heat absorption side of the heat pipe 02 is in contact with the heating element, and the heat conduction side is in contact with the heat dissipation fins 04, so that heat can be better transferred to the heat dissipation fins 04.

[0050] In actual work, a single radiator can usually only dissipate heat for heat sources in a specific area. If there are multiple PCB mainboards or multiple heat sources with uneven distribution inside the imaging device, multiple radiators are required to dissipate heat separately. This not only increases the manufacturing cost, but also increases the complexity of the air duct design. The complex air duct layout will reduce the air flow efficiency and affect the heat dissipation effect.

[0051] Based on this, the present application provides an optional embodiment, in which the heat dissipation body 01 is composed of two heat dissipation components 08 that are sealed and connected. The two heat dissipation components 08 are combined to form a heat dissipation duct. The two heat dissipation components 08 have the same structure, and each heat dissipation component 08 is respectively provided with a heat dissipation slot 05 and a heat pipe 02 embedded in the heat dissipation slot 05.

[0052] Please continue reading Figure 2-Figure 5 In this embodiment, the two heat sinks 08 can be connected together by welding or by gluing together to improve the sealing of the connection between the two; the two heat sinks 08 have the same structure, and each heat sink 08 is provided with a heat sink slot 05 and a heat pipe 02. Except for one side and two ends for mutual connection, the other three sides of the heat sink 08 can be provided with heat sink slots 05, and the heat pipe 02 is inserted into the heat sink slot 05. At this time, the three sides of a single heat sink 08 can contact different heating elements respectively, so that multiple heat sink elements can be cooled at the same time. In order to increase the heat dissipation efficiency, the number of heat pipes 02 can be increased to adapt to the heat dissipation of multiple heating elements and the heat dissipation of large areas of heating elements. At this time, there is no need to add an additional radiator or additional heat dissipation channel, which can not only improve the heat dissipation effect, but also reduce the production cost.

[0053] In this optional embodiment, when there are multiple heating elements on the side of the heat sink 08, multiple heat pipes 02 are provided to contact the heating elements, thereby improving the heat dissipation efficiency and heat dissipation effect. Specifically, four heat dissipation slots 05 can be provided on the heat sink 08 to accommodate four heat pipes 02, and the four heat pipes 02 are arranged in a dispersed manner on the surface of the heat sink 08 to increase the coverage area of ​​heat dissipation and the contact area with the heating elements. The three heat-absorbing sides of the heat pipe 02 are respectively flush with the three surfaces of the heat sink 08 to contact the heating elements at three different positions.

[0054] Please continue reading Figure 5In this optional embodiment, the two heat sinks 08 are connected via a snap-fit ​​structure 09. To ensure accurate alignment and tight connection between the two heat sinks 08, the snap-fit ​​structure 09 is provided to achieve connection between the two. Specifically, a groove 14 is provided on one heat sink 08, and a clamping column 13 is provided on the other heat sink 08. When the two heat sinks 08 are connected to each other, the clamping column 13 is embedded in the groove 14. In addition, glue can be provided in the groove 14 to improve the connection sealing between the clamping column 13 and the groove 14. The combination of the clamping column 13 and the groove 14 forms a snap-fit ​​structure 09.

[0055] When the present application is assembled into the interior of an imaging device, in an optional embodiment, the radiator 03 is a turbofan, a ventilation hole 10 is provided on the outer shell of the imaging device, the turbofan is provided between the ventilation hole 10 and the heat dissipation body 01, and the turbofan is aligned with the heat dissipation duct and the ventilation hole 10 respectively; specifically, the ventilation hole 10 on the outer shell 11 is aligned with the heat dissipation duct on the heat dissipation body 01, and the turbofan is fixed between the ventilation hole 10 and the heat dissipation duct. To improve the sealing performance, the turbofan and the heat dissipation body 01 can be bonded by glue, or tightly fitted by providing a sealing gasket. Similarly, the turbofan and the inner side of the outer shell 11 are connected in the same way.

[0056] In an optional embodiment, in order to increase the rapid transfer of heat from the heat pipe 02 to the heat sink fins 04 , in the heat sink 08 , the heat sink fins 04 in the heat sink 08 are connected to the heat conduction side of the heat pipe 02 by welding.

[0057] When only one turbofan is provided in the present application, one end of the heat dissipation body 01 is sealed and connected to the outer casing 11 of the imaging device, and a turbofan is provided between the other end and the outer casing 11 of the imaging device. The air flow in the heat dissipation duct is realized by one turbofan. At this time, the turbofan and the outer casing 11 are sealed and the turbofan and the heat dissipation body 01 are also sealed.

[0058] In addition, the turbofan may be arranged outside the housing 11 of the imaging device, that is, both ends of the heat dissipation body 01 are respectively connected to the housing 11 of the imaging device, the heat dissipation air duct is aligned with the ventilation hole 10, and the turbofan is arranged outside the ventilation hole 10 and connected to the housing of the imaging device. The housing and the heat dissipation body 01 are sealed, and the turbofan and the housing 11 can be detachably connected, such as bolted connection, snap-on connection, etc.

[0059] When only two turbofans are provided in the present application, the edges of the two turbofans are respectively sealed and connected to the two ends of the heat dissipation body 01, the heat dissipation air duct is aligned with the center of the turbofan, the heat dissipation body 01 and the turbofan are arranged together in the outer casing 11, at this time, the edge of the turbofan is also sealed and connected to the outer casing 11, and the turbofan is aligned with the ventilation holes 10 on the outer casing 11.

[0060] In this optional embodiment, turbo fans are respectively provided at both ends of the heat dissipation body 01, and the air intake directions of the two turbo fans are the same. In this embodiment, by providing two turbo fans, the air flow rate in the heat dissipation duct can be increased, thereby improving the heat exchange efficiency between the heat dissipation fins 04 and the air, and improving the heat dissipation effect and heat dissipation efficiency.

[0061] In an optional embodiment, a heat-conducting material is provided between the heating element and the heat pipe 02. The heat-conducting material may be silicone grease, heat-conducting paste, graphite, heat-conducting silica gel, etc. By providing the heat-conducting material, the heat transfer efficiency between the heating element and the heat pipe 02 can be improved, and the heat transfer is facilitated.

[0062] Please continue reading Figure 2 and Figure 7 The second aspect of the present application provides an imaging device, which includes a PCB mainboard, a housing 11 and the above Figures 1 to 6 The heat dissipation structure described in any one of the embodiments, wherein the heat dissipation structure is fixed in the housing 11, the two ends of the heat dissipation structure are respectively sealed and connected to the housing 11, the PCB mainboard is located in the housing 11 and is arranged on several sides of the heat dissipation structure, and the heating element on the PCB mainboard is in contact with the heat pipe 02 on the heat dissipation structure, the heat dissipation structure is used to dissipate heat from the heating element, the heat pipe 02 is located on at least two surfaces on the heat dissipation body 01, and can dissipate heat from at least two heating elements at the same time. The heat dissipation air duct in the heat dissipation structure is aligned with the ventilation hole 10 on the housing 11, and the heat dissipation body 01 and the housing 11 are directly sealed and connected or indirectly sealed and connected through the radiator 03, thereby ensuring that no moisture or dust will enter the components inside the imaging device at the connection.

[0063] The PCB main board includes two first PCB main boards 12 and two second PCB main boards 16, one first PCB main board 12 is located on the left side of the heat dissipation structure, the other first PCB main board 12 is located on the right side of the heat dissipation structure, one second PCB main board 16 is located on the upper side of the heat dissipation structure, and the other second PCB main board 16 is located on the lower side of the heat dissipation structure.

[0064] The imaging device provided in the present application may specifically be a camera, a colorimeter, etc. By providing a heat dissipation body 01 isolated from the air duct, dust accumulation and water ingress inside the imaging device can be reduced, and multiple heating elements can be cooled at the same time, thereby improving the sealing and heat dissipation efficiency of the imaging device and achieving higher space utilization.

[0065] It should be noted that the above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the present application. Various modifications to these embodiments will be apparent to professionals and technicians in the field, and the general principles defined herein can be implemented in other embodiments without departing from the scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure, arranged in an imaging device, characterized in that: The heat dissipation structure comprises: Heat dissipation body, heat pipe and radiator; A plurality of heat dissipation fins are arranged in the heat dissipation body, and an independent heat dissipation air duct is formed between adjacent heat dissipation fins, and the heat dissipation air duct runs through the heat dissipation body. A heat dissipation slot is arranged on the heat dissipation body, and the heat dissipation slot extends from the side of the heat dissipation body toward the heat dissipation fins, and the heat dissipation slot is connected to the heat dissipation air duct; The heat dissipation body is composed of two heat dissipation elements that are sealed and connected, the two heat dissipation elements are combined to form the heat dissipation air duct, and the two heat dissipation elements are respectively provided with the heat dissipation slots and the heat pipes embedded in the heat dissipation slots; The heat pipe is embedded in the heat dissipation slot and is sealed with the heat dissipation body. The heat absorption side of the heat pipe is in contact with the heating element inside the imaging device. The heat conduction side of the heat pipe is located in the heat dissipation air duct and is connected with a plurality of the heat dissipation fins. The heat pipe is used to transfer the heat of the heating element to the plurality of the heat dissipation fins. The radiator is arranged at the end of the radiator body and aligned with the radiator air duct, and the radiator is used to control the air flow in the radiator air duct; The radiator is a turbofan, the imaging device is provided with a housing, the housing is provided with ventilation holes, the turbofan is provided between the ventilation holes and the heat dissipation body, and the turbofan is aligned with the heat dissipation air duct and the ventilation holes respectively, the turbofan is sealedly connected to the housing, and the turbofan is also sealedly connected to the heat dissipation body; or, Both ends of the heat dissipation body are respectively sealed and connected to the outer shell of the imaging device, the heat dissipation air duct is aligned with the ventilation hole, and the turbo fan is arranged at the outer side of the ventilation hole and connected to the outer shell of the imaging device.

2. The heat dissipation structure according to claim 1, characterized in that: The heat absorbing side of the heat pipe is flush with the outer surface of the heat dissipation body.

3. The heat dissipation structure according to claim 1, characterized in that: A sealing member is provided on the side surface of the heat dissipation slot. When the heat pipe is embedded in the heat dissipation slot, the sealing member abuts against the heat pipe.

4. The heat dissipation structure according to claim 1, characterized in that: The two heat sinks are connected via a clamping structure.

5. The heat dissipation structure according to claim 1, characterized in that: The heat conducting side of the heat pipe is connected to the heat dissipation fins in the heat dissipation element by welding.

6. The heat dissipation structure according to claim 1, characterized in that: Turbofans are respectively arranged at both ends of the heat dissipation body, and the air intake directions of the two turbofans are the same.

7. The heat dissipation structure according to any one of claims 1 to 3, characterized in that: A heat conducting material is arranged between the heating element and the heat absorbing side of the heat pipe.

8. An imaging device, characterized in that: The invention comprises a PCB mainboard, a shell and a heat dissipation structure according to any one of claims 1 to 7, wherein the heat dissipation structure is fixed in the shell, and both ends of the heat dissipation structure are sealed and connected to the shell, the PCB mainboard is located in the shell and is arranged on the side of the heat dissipation structure, and the heating element on the PCB mainboard is in contact with the heat pipe on the heat dissipation structure, and the heat dissipation structure is used to dissipate heat from the heating element.

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