Mounting apparatus, manufacturing system for electronic device, mounting method, and manufacturing method for electronic device

Abstract

A teaching process on a three-dimensional substrate is easily implemented. The mounting device is provided with: a stage for supporting a three-dimensional substrate; a mounting head for mounting a component on the three-dimensional substrate; a measurement data acquisition unit that acquires measurement data of the three-dimensional shape of the surface of the three-dimensional substrate; a data comparison unit that compares the design data and the measurement data of the surface of the three-dimensional substrate, and extracts a mounting position in the measurement data corresponding to a predetermined mounting position in the design data; a substrate data calculation unit that calculates substrate data including a rotation angle for making the surface of the three-dimensional substrate at the mounting position horizontal, on the basis of the difference between the coordinates of the design data and the measurement data for the mounting position; a stage control unit that controls the stage on the basis of the substrate data so that the surface of the three-dimensional substrate at the mounting position is horizontal; and a mounting head control unit that controls the mounting head so as to mount the component to the mounting position in a state in which the surface of the three-dimensional substrate at the mounting position is horizontal.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a mounting device, a manufacturing system for electronic equipment, a mounting method, and a manufacturing method for electronic equipment. Background Art

[0002] In the technical field related to mounting devices, a three-dimensional mounting device for mounting components on a three-dimensional substrate as disclosed in Patent Document 1 is known.

[0003] Patent Document 1: International Publication No. 2018 / 207313

[0004] When mounting components on a three-dimensional substrate, it is necessary to control the workbench supporting the three-dimensional substrate so that the mounting position of the components on the three-dimensional surface becomes horizontal. For example, when a three-dimensional substrate is formed by bonding a substrate having a curved surface and a film, the position of the electrical circuit provided on the film is offset due to the bonding error between the substrate and the film, causing fluctuations in the mounting position. Therefore, in the existing mounting device, it is necessary to perform teaching processing for each point based on the curvature of the curved substrate using a camera provided adjacent to the mounting head, which is cumbersome. Summary of the invention

[0005] An object of the technology disclosed in this specification is to easily implement a teaching process on a three-dimensional substrate.

[0006] This specification discloses an installation device. The installation device comprises: a workbench that supports a three-dimensional substrate; a mounting head that mounts a component on the three-dimensional substrate; a measurement data acquisition unit that acquires measurement data of a three-dimensional shape of a surface of the three-dimensional substrate; a data comparison unit that compares design data of the surface of the three-dimensional substrate with the measurement data and extracts a mounting position in the measurement data corresponding to a specified mounting position in the design data; a substrate data calculation unit that calculates substrate data including a rotation angle for setting the surface of the three-dimensional substrate at the mounting position to be horizontal based on a difference in coordinates between the design data and the measurement data of the mounting position; a workbench control unit that controls the workbench based on the substrate data so that the surface of the three-dimensional substrate at the mounting position is set to be horizontal; and a mounting head control unit that controls the mounting head so that the component is mounted at the mounting position when the surface of the three-dimensional substrate at the mounting position is horizontal.

[0007] Effects of the Invention

[0008] According to the technology disclosed in this specification, it is possible to easily implement a teaching process on a three-dimensional substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective view showing a substrate and components involved in the embodiment.

[0010] Figure 2 It is a perspective view showing a tray that supports a substrate according to the embodiment.

[0011] Figure 3 It is an exploded perspective view showing a substrate and a tray according to the embodiment.

[0012] Figure 4 It is a diagram schematically showing a production system of an electronic device according to an embodiment.

[0013] Figure 5 The three-dimensional measuring device and the mounting device according to the embodiment are schematically shown respectively.

[0014] Figure 6 It is a top view schematically showing the mounting device involved in the embodiment.

[0015] Figure 7 It is a perspective view showing the conveying device and the workbench involved in the embodiment.

[0016] Figure 8 It is an exploded perspective view showing the conveying device and the workbench involved in the embodiment.

[0017] Fig. 9 It is a perspective view showing a pallet and a workbench according to the embodiment.

[0018] Fig.10 It is an exploded perspective view showing a pallet and a workbench according to an embodiment.

[0019] Fig.11 It is a figure which shows schematically the mounting head which concerns on embodiment.

[0020] Fig.12 The figures schematically show the preheating device and the laser irradiation device according to the embodiment.

[0021] Fig.13 This is a diagram schematically showing the configuration of a management device according to an embodiment.

[0022] Fig.14 It is a diagram for explaining substrate data involved in the embodiment.

[0023] Fig.15 It is a diagram for explaining substrate data involved in the embodiment.

[0024] Fig.16 This is a flowchart showing a method for manufacturing an electronic device according to an embodiment.

[0025] Fig.17 It is a figure for demonstrating the mounting process performed by the mounting head involved in embodiment.

[0026] Fig.18 It is a figure for demonstrating the mounting process performed by the mounting head involved in embodiment.

[0027] Fig.19 This is a diagram for explaining the control method of the workbench. DETAILED DESCRIPTION

[0028] Below, the implementation method is described with reference to the accompanying drawings. In the implementation method, an XYZ orthogonal coordinate system is specified, and the positional relationship of each part is described with reference to the XYZ orthogonal coordinate system. The direction of the X-axis parallel to the specified plane is set to the X-axis direction. The direction of the Y-axis parallel to the specified plane and perpendicular to the X-axis is set to the Y-axis direction. The direction parallel to the Z-axis perpendicular to the specified plane is set to the Z-axis direction. The rotation direction or tilt direction centered on the X-axis direction is set to the θX direction. The rotation direction or tilt direction centered on the Y-axis direction is set to the θY direction. The rotation direction or tilt direction centered on the Z-axis direction is set to the θZ direction. In the implementation method, the specified plane is parallel to the horizontal plane. The Z axis is parallel to the vertical axis, and the Z axis direction is the up and down direction. The +Z side is the upper side, and the -Z side is the lower side. In addition, the specified plane can also be inclined relative to the horizontal plane. In addition, in the implementation method, the specified plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0029] [Substrate]

[0030] Figure 1 1 is a perspective view showing a substrate 1 and a component 2 involved in an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include a corner. A protrusion may be provided on the surface of the substrate 1.

[0031] An electrical circuit is provided on the surface of the substrate 1. In the embodiment, the substrate 1 is formed by an in-mold forming technique. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electrical circuit. The electrical circuit includes electrodes such as pads and pads (for example, electrodes described later). Fig.14 The electrode 1C is shown in FIG. 1B . In the thin film 1B, the position (plane coordinate) of each electrode is assumed to be known. The surface of the substrate 1 includes the surface of the thin film 1B.

[0032] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may also be a chip-type electronic component having no leads. The component 2 is mounted on the surface of the substrate 1, thereby manufacturing an electronic device.

[0033] [tray]

[0034] Figure 2 It is a perspective view showing the tray 3 that supports the substrate 1 according to the embodiment. Figure 3 1 is an exploded perspective view showing a substrate 1 and a tray 3 according to the embodiment. The tray 3 supports the substrate 1. In the embodiment, the substrate 1 is processed while being supported by the tray 3. The tray 3 has a supporting member 4 for supporting the substrate 1 and a clamping mechanism 5 for fixing the substrate 1.

[0035] The supporting member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, a protection portion 4B that is provided on the +Y side and the -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side.

[0036] The base portion 4A is in a plate shape having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper surface and the lower surface of the base portion 4A.

[0037] The protection part 4B is long in the X-axis direction. A pair of protection parts 4B is provided. The pair of protection parts 4B is separated from each other in the Y-axis direction. One protection part 4B protrudes from the end of the +Y side of the upper surface of the base part 4A to the +Z side. The other protection part 4B protrudes from the end of the -Y side of the upper surface of the base part 4A to the +Z side.

[0038] The plurality of pins 4C protrude from the upper surface of the base 4A toward the +Z side. A portion of the pins 4C is disposed on the +Y side relative to the center of the base 4A. A portion of the pins 4C is disposed on the -Y side relative to the center of the base 4A. The plurality of pins 4C disposed on the +Y side relative to the center of the base 4A supports the end portion of the substrate 1 on the +Y side. The plurality of pins 4C disposed on the -Y side relative to the center of the base 4A supports the end portion of the substrate 1 on the -Y side.

[0039] The clamping mechanism 5 is provided on the supporting member 4. The clamping mechanism 5 fixes the substrate 1 to the supporting member 4. The clamping mechanism 5 includes: a pair of supporting portions 5A that support the end portion on the -X side of the substrate 1; and a movable portion 5B that supports the end portion on the +X side of the substrate 1. The movable portion 5B is movable in the X-axis direction on the upper surface of the base portion 4A. In a state where the substrate 1 is arranged between the supporting portion 5A and the movable portion 5B, the movable portion 5B moves in the -X direction, whereby the substrate 1 is clamped by the supporting portion 5A and the movable portion 5B. The substrate 1 is clamped by the supporting portion 5A and the movable portion 5B, and is thereby fixed to the tray 3.

[0040] In an embodiment, the tray 3 has an information medium 80. The information medium 80 stores substrate data related to the substrate 1. In an embodiment, the information medium 80 is a 2D code. In addition, the information medium 80 may also be a 1D barcode. The information medium 80 may be an RF tag. In an embodiment, the information medium 80 is mounted on a portion of the upper surface of the base portion 4A. The information medium 80 is configured not to overlap with the substrate 1.

[0041] [Production system]

[0042] Figure 4 Schematically shows a production system 10 of an electronic device according to an embodiment. Figure 4 As shown, the production system 10 includes a 3D measuring device 11, a mounting device 12, a preheating device 13, a laser irradiation device 14, an inspection device 15, and a management device 16. The 3D measuring device 11, the mounting device 12, the preheating device 13, the laser irradiation device 14, and the inspection device 15 form a production line 17 of electronic devices.

[0043] Figure 5 The three-dimensional measuring device 11 and the mounting device 12 according to the embodiment are schematically shown respectively. Figure 6 It is a top view schematically showing the mounting device 12 according to the embodiment.

[0044] The three-dimensional measuring device 11 measures the three-dimensional shape of the surface of the substrate 1. The three-dimensional measuring device 11 includes a base member 18, a conveying device 19 for conveying the tray 3, a sensor 20 for measuring the three-dimensional shape of the surface of the substrate 1, and a chamber 21.

[0045] The base member 18 supports the conveying device 19. The conveying device 19 conveys the tray 3 supporting the substrate 1 in the X-axis direction. The conveying device 19 includes a conveyor belt 19A for conveying the tray 3 and a guide member 19B for guiding the tray 3.

[0046] The sensor 20 measures the three-dimensional shape of the surface of the substrate 1. The sensor 20 includes, for example, a three-dimensional laser scanner. The sensor 20 obtains the Z coordinate of the surface of the substrate 1 fixed on the tray 3 transported along the X-axis direction by the transport device 19. The sensor 20 outputs the measured Z coordinate in association with the X-coordinate and Y-coordinate of the measurement position. The sensor 20 can, for example, measure the Y-axis direction at the same time. Thus, the sensor 20 obtains point group data of the surface of the substrate 1. The sensor 20 has at least an electrode (for example, a structure described later) that can be configured on the thin film 1B on the surface of the substrate 1. Fig.14 The resolution of the sensor 20 is 2 μm.

[0047] The 3D measuring device 11 can measure the 3D shape of the surface of the substrate 1 based on the phase shift method, for example. In the embodiment, the 3D measuring device 11 measures the 3D shape of the surface of the substrate 1 fixed to the tray 3. The substrate 1 is measured by the 3D measuring device 11 while being fixed to the tray 3. The 3D measurement data indicating the 3D shape of the surface of the substrate 1 measured by the 3D measuring device 11 is sent to the management device 16. The substrate 1 measured by the 3D measuring device 11 is conveyed to the mounting device 12 while being fixed to the tray 3.

[0048] The mounting device 12 mounts the component 2 on the substrate 1. At least one mounting device 12 is provided in the production line 17. In addition, a plurality of mounting devices 12 may be provided.

[0049] The mounting device 12 has a base component 22, a conveying device 23, a workbench 24, a workbench moving device 25, a component supply device 26, a mounting head 28 including a suction nozzle 27, a substrate camera 29, a height sensor 30, a mounting head moving device 31, a suction nozzle moving device 32, a chamber 33, an opening and closing cover 34, a window 35, a display device 36 and an input device 37.

[0050] The base member 22 supports the conveying device 23 , the work table 24 , the work table moving device 25 , the component supply device 26 , the mounting head 28 , the mounting head moving device 31 , and the nozzle moving device 32 , respectively.

[0051] Figure 7 and Figure 8 It is a perspective view and an exploded perspective view showing the conveying device 23 and the table 24 according to the embodiment.

[0052] The conveyor 23 conveys the tray 3 supporting the substrate 1 in the X-axis direction. The conveyor 23 conveys the tray 3 supplied from the three-dimensional measuring device 11 to a processing position of the mounting device 12. The processing position is defined in the conveyance path of the conveyor 23.

[0053] The conveyor device 23 includes a conveyor belt 23A that conveys the tray 3 in the X-axis direction and a guide member 23B that guides the tray 3 .

[0054] The guide member 23B is long in the X-axis direction. A pair of guide members 23B is provided. The pair of guide members 23B is separated from each other in the Y-axis direction. One guide member 23B is arranged on the +Y side of the tray 3. The other guide member 23B is arranged on the -Y side of the tray 3.

[0055] The conveyor belt 23A is annular. A pair of conveyor belts 23A are provided. The conveyor belt 23A is supported on the guide member 23B via a driving pulley and a driven pulley. The conveyor belt 23A is mounted on the driving pulley and the driven pulley. One conveyor belt 23A is supported on one guide member 23B. The other conveyor belt 23A is supported on the other guide member 23B.

[0056] The conveyor belt 23A disposed on the +Y side of the pair of conveyor belts 23A supports the end portion on the +Y side of the lower surface of the tray 3. The conveyor belt 23A disposed on the -Y side supports the end portion on the -Y side of the lower surface of the tray 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the tray 3 in the X-axis direction.

[0057] The one guide member 23B can be moved relative to the other guide member 23B in the Y-axis direction by an actuator (not shown). When the one guide member 23B and the other guide member 23B are separated in the Y-axis direction, the support of the conveyor belt 23A for the tray 3 is released.

[0058] Fig. 9 It is a perspective view showing the tray 3 and the table 24 according to the embodiment. Fig.10 It is an exploded perspective view showing the tray 3 and the table 24 according to the embodiment.

[0059] The workbench 24 supports the substrate 1 via the tray 3. The workbench 24 supports the tray 3 transported to the processing position from the -Z side. Two positioning components 24A are provided on the upper surface of the workbench 24. The positioning component 24A is inserted into the hole 4D of the tray 3. The positioning component 24A is inserted into the hole 4D from the -Z side of the tray 3, thereby positioning the workbench 24 and the tray 3. A hook is provided at the upper end of the positioning component 24A. The hook is hung on the tray 3. The hook includes a ball that moves by air pressure. After the positioning component 24A is inserted into the hole 4D from the -Z side of the tray 3, the ball is hung on the tray 3, thereby fixing the workbench 24 and the tray 3.

[0060] The worktable moving device 25 moves the worktable 24. In the embodiment, the worktable moving device 25 moves the worktable 24 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The worktable moving device 25 includes: a Y-axis motor that generates power to move the worktable 24 in the Y-axis direction; a Z-axis motor that generates power to move the worktable 24 in the Z-axis direction; a θX motor that generates power to rotate the worktable 24 in the θX direction; and a θY motor that generates power to rotate the worktable 24 in the θY direction.

[0061] After the tray 3 is transported to the processing position by the conveying device 23, the guide member 23B on the +Y side is moved in the +Y direction so as to be separated from the other guide member 23B, and the worktable 24 is moved in the +Z direction by the worktable moving device 25. The guide member 23B on the +Y side is moved in the Y-axis direction so as to be separated from the other guide member 23B, thereby releasing the support of the tray 3 by the conveyor belt 23A. The support of the tray 3 by the conveyor belt 23A is released, and the worktable 24 is moved in the +Z direction, thereby the tray 3 is sent from the conveying device 23 to the worktable 24. The worktable moving device 25 moves in the +Y direction in a state where the tray 3 is supported by the worktable 24 so that the worktable 24 reaches the center of the two guide members 23B, thereby enabling the worktable 24 to be moved in the Z-axis direction, the θX direction, and the θY direction.

[0062] When the pallet 3 is sent from the workbench 24 to the conveyor device 23, the workbench 24 moves in the -Y direction until one side of the pallet 3 reaches the conveyor belt 23A, and the guide member 23B on the +Y side moves in the -Y direction until the opposite side of the pallet 3 reaches the conveyor belt 23A. After the fixing of the hook provided at the upper end of the positioning member 24A is released, the workbench 24 is moved in the -Z direction by the workbench moving device 25. As a result, the support of the pallet 3 by the workbench 24 is released, and the pallet 3 is supported by the conveyor belt 23A.

[0063] The component supply device 26 supplies the component 2. The component supply device 26 includes a plurality of tape feeders. The tape feeders hold the plurality of components 2. The component supply device 26 supplies at least one component 2 among the plurality of components 2 to the supply position. The component supply device 26 is arranged on the -Y side of the conveyor 23. In addition, the component supply device 26 can be arranged on the +Y side and the -Y side of the conveyor 23, respectively.

[0064] The mounting head 28 mounts the component 2 on the substrate 1. The mounting head 28 supports a plurality of suction nozzles 27. The mounting head 28 holds the component 2 supplied from the component supply device 26 by the suction nozzles 27 and mounts it on the substrate 1. The mounting head 28 can move between a supply position where the component 2 is supplied from the component supply device 26 and a processing position where the substrate 1 is arranged. The mounting head 28 holds the component 2 supplied to the supply position by the suction nozzles 27, and after moving to the processing position, mounts it on the surface of the substrate 1 arranged at the processing position.

[0065] The mounting head moving device 31 moves the mounting head 28. In the embodiment, the mounting head moving device 31 moves the mounting head 28 in the X-axis direction and the Y-axis direction, respectively. The mounting head moving device 31 includes an X-axis moving device 31X that moves the mounting head 28 in the X-axis direction and a Y-axis moving device 31Y that moves the mounting head 28 in the Y-axis direction. The X-axis moving device 31X and the Y-axis moving device 31Y each include an actuator. The X-axis moving device 31X is connected to the mounting head 28. The mounting head 28 moves in the X-axis direction by the operation of the X-axis moving device 31X. The Y-axis moving device 31Y is connected to the mounting head 28 via the X-axis moving device 31X. The X-axis moving device 31X moves in the Y-axis direction by the operation of the Y-axis moving device 31Y, thereby moving the mounting head 28 in the Y-axis direction.

[0066] Fig.11 2 is a diagram schematically showing a mounting head 28 according to an embodiment. Fig.11 As shown, the mounting head 28 has a plurality of suction nozzles 27. The suction nozzle 27 holds the component 2 in a detachable manner. The suction nozzle 27 is a suction nozzle that holds the component 2 by suction. An opening is provided at the lower end of the suction nozzle 27. The opening of the suction nozzle 27 is connected to a vacuum system. In a state where the lower end of the suction nozzle 27 is in contact with the component 2, a suction action is performed from the opening provided at the lower end of the suction nozzle 27, thereby holding the component 2 by suction at the lower end of the suction nozzle 27. The component 2 is released from the suction nozzle 27 by releasing the suction action from the opening. In addition, the suction nozzle 27 may also be a clamping nozzle that holds the component 2 by clamping it.

[0067] The nozzle moving device 32 moves the nozzle 27. In an embodiment, the nozzle moving device 32 moves the nozzle 27 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 32 is supported on the mounting head 28. The nozzle 27 is connected to the lower end of the shaft 27A. A plurality of shafts 27A are provided. A plurality of nozzles 27 are connected to a plurality of shafts 27A, respectively. A plurality of nozzle moving devices 32 are provided. A plurality of nozzle moving devices 32 are connected to a plurality of shafts 27A, respectively. The nozzle 27 is supported on the mounting head 28 via the shaft 27A and the nozzle moving device 32. The nozzle moving device 32 moves the shaft 27A in the Z-axis direction and the θZ direction, thereby moving the nozzle 27.

[0068] The suction nozzle 27 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction by the mounting head moving device 31 and the suction nozzle moving device 32. When the suction nozzle 27 moves, the component 2 held by the suction nozzle 27 can also be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0069] The substrate camera 29 photographs the substrate 1. In the embodiment, the substrate camera 29 photographs the surface of the substrate 1 from the +Z side of the substrate 1. The substrate camera 29 is provided on the mounting head 28. The substrate camera 29 moves in the X-axis direction and the Y-axis direction together with the mounting head 28. The substrate camera 29 can photograph, for example, a positioning mark provided on the surface of the substrate 1.

[0070] The height sensor 30 detects the height of the position in the Z-axis direction of the surface of the substrate 1. The height sensor 30 is provided on the mounting head 28. The height sensor 30 moves in the X-axis direction and the Y-axis direction together with the mounting head 28. In the embodiment, the height sensor 30 is a laser positioning sensor. The height sensor 30 irradiates the surface of the substrate 1 with laser light from the +Z side of the substrate 1, and receives the laser light reflected from the surface of the substrate 1, thereby being able to detect the distance from the mounting head 28 to the substrate 1. By detecting the distance from the mounting head 28 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0071] The chamber 33 has an internal space for accommodating the base component 22 , the conveying device 23 , the worktable 24 , the worktable moving device 25 , the component supply device 26 , the mounting head 28 , the mounting head moving device 31 , and the nozzle moving device 32 .

[0072] The opening and closing cover 34 opens and closes an opening provided in the upper portion of the chamber 33. The opening and closing cover 34 is rotatably supported on at least a portion of the chamber 33 via a folding portion.

[0073] The window 35 is provided in the opening and closing cover 34 . The window 35 is substantially transparent, and the operator can visually recognize the state of the internal space of the chamber 33 through the window 35 .

[0074] The display device 36 is provided on the outer surface of the cavity 33. The display device 36 displays display data. As the display device 36, a flat panel display such as a liquid crystal display or an organic EL display is exemplified.

[0075] The input device 37 is operated by the operator to generate input data. Examples of the input device 37 include a touch sensor, a computer keyboard, or a mouse. In the embodiment, the display device 36 is a touch screen including a touch sensor. The input device 37 includes the touch screen of the display device 36.

[0076] In the embodiment, the mounting device 12 has a dispenser 38 for applying cream solder to the substrate 1. The dispenser 38 moves in the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side compared to the conveying device 23. The dispenser 38 and the mounting head 28 can move separately. After the cream solder is applied to the surface of the substrate 1 by the dispenser 38, the component 2 is mounted on the substrate 1 by the mounting head 28. The substrate 1 with the component 2 mounted by the mounting device 12 is transported to the preheating device 13 in a state fixed to the tray 3.

[0077] Fig.12 The figures schematically show the preheating device 13 and the laser irradiation device 14 according to the embodiment.

[0078] The preheating device 13 reduces the liquid content of the cream solder applied to the substrate 1. The cream solder contains flux and metal solder balls dispersed in the flux. The preheating device 13 activates the flux and vaporizes at least a part of the liquid content, thereby reducing the liquid content of the cream solder. The preheating device 13 includes a base member 39, a conveying device 40 for conveying the tray 3, a heater 41 for heating the substrate 1, and a chamber 42.

[0079] The base member 39 supports the conveyance device 40. The conveyance device 40 conveys the tray 3 supporting the substrate 1 in the X-axis direction. The conveyance device 40 includes a conveyance belt 40A for conveying the tray 3 and a guide member 40B for guiding the tray 3.

[0080] The heater 41 heats the substrate 1 so as to vaporize at least a part of the liquid component of the flux of the cream solder.

[0081] The chamber 42 has an internal space for accommodating the base member 39 , the conveying device 40 , and the heater 41 .

[0082] The preheating device 13 heats the substrate 1 supported on the tray 3 so that the liquid component of the cream solder is reduced. The preheating device 13 heats the substrate 1 at a temperature lower than the melting point of the cream solder. The preheating device 13 heats the substrate 1 at a temperature greater than or equal to 80° C. and less than or equal to 100° C. for 10 minutes, for example. The substrate 1 preheated by the preheating device 13 is transported to the laser irradiation device 14 while being fixed to the tray 3.

[0083] The laser irradiation device 14 irradiates the solder paste with laser light to melt the solder paste. The laser irradiation device 14 includes a base member 43, a conveying device 44 for conveying the tray 3, a worktable 45 for supporting the tray 3, a worktable moving device 46 for moving the worktable 45, a laser head 47 for emitting laser light, a chamber 48, an opening and closing cover 49, and a window 50.

[0084] The base member 43 supports the conveying device 44, the worktable 45, the worktable moving device 46 and the laser head 47 respectively. The conveying device 44 conveys the tray 3 supporting the substrate 1 in the X-axis direction. The conveying device 44 has a conveyor belt 44A for conveying the tray 3 and a guide member 44B for guiding the tray 3. The structure and function of the conveying device 44 are substantially equal to those of the conveying device 23.

[0085] The table 45 supports the tray 3 from the −Z side. The table moving device 46 moves the table 45 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the table 45 are substantially the same as those of the table 24 .

[0086] The laser head 47 irradiates the cream solder with laser light to melt the cream solder. The laser head 47 moves in the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the conveying device 44 .

[0087] The chamber 48 has an internal space for accommodating the base member 43 , the conveying device 44 , the stage 45 , the stage moving device 46 , and the laser head 47 .

[0088] The opening and closing cover 49 opens and closes an opening provided in the upper portion of the chamber 48. The opening and closing cover 49 is rotatably supported by at least a portion of the chamber 48 via a folded portion.

[0089] The window 50 is provided in the opening and closing cover 49. The window 50 reduces the amount of light transmitted. The operator can visually recognize the state of the internal space of the chamber 48 through the window 50. The window 50 has a light reduction function and an anti-glare function, thereby preventing the reflection of the laser from damaging the eyes of the operator.

[0090] In the laser irradiation device 14, the laser emitted from the laser head 47 is irradiated to the cream solder. The cream solder is heated by the laser and melted. The molten cream solder is cooled, and thus the component 2 is soldered to the substrate 1. In the embodiment, the laser is irradiated to the cream solder after the liquid component of the cream solder is reduced in the preheating device 13. The laser is irradiated to the cream solder in a state where the liquid component of the cream solder is reduced, thereby suppressing the solder balls generated by the sudden boiling of the cream solder.

[0091] The inspection device 15 includes a substrate appearance inspection device (AOI: Automated Optical Inspection) that inspects the state of the substrate 1 after the components 2 are mounted.

[0092] A reading device 101 is provided in the three-dimensional measuring device 11. A reading device 102 is provided in the mounting device 12. A reading device 103 is provided in the preheating device 13. A reading device 104 is provided in the laser irradiation device 14. The reading device 101 reads the substrate data stored in the information medium 80. When the information medium 80 is a two-dimensional code, the reading device 101 is a two-dimensional code reader. When the information medium 80 is an RF tag, the reading device 101 is an RFID reader. Similar to the reading device 101, the reading device 102, the reading device 103, and the reading device 104 respectively read the substrate data stored in the information medium 80. Although not shown in the figure, a reading device for reading the substrate data stored in the information medium 80 is also provided in the inspection device 15.

[0093] [Management Device]

[0094] Fig.13 This is a diagram schematically showing the structure of the management device 16 involved in the embodiment. The management device 16 may be present in the three-dimensional measuring device 11, the mounting device 12, the preheating device 13, the laser irradiation device 14, and the inspection device 15, or may be present separately via a network. The management device 16 includes a computer system. The management device 16 controls the production line 17.

[0095] The management device 16 has at least one processor 51, a main memory 52, a storage 53 and an interface 54. The processor 51 is a CPU (Central Processing Unit). The main memory 52 includes a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory). Examples of the storage 53 include a hard disk drive (HDD: Hard Disk Drive), a solid state drive (SSD: Solid State Drive), a magnetic disk, an optical magnetic disk, a CD-ROM and a DVD-ROM. The interface 54 includes an input and output circuit. The functions of the processor 51 are stored in the storage 53 as a program. The processor 51 reads the program from the storage 53 and expands it in the main memory 52, and executes the processing according to the program. In addition, the program can also be transmitted to the management device 16 via a network.

[0096] The processor 51 has at least one functional unit. In the embodiment, the processor 51 has a measurement data acquisition unit 55, a data comparison unit 56, a substrate data calculation unit 57, a display control unit 59, a mounting head control unit 60, a table control unit 61, an NC data conversion unit 62, and a substrate data conversion unit 63. The storage 53 has an NC data storage unit 64, a substrate data storage unit 65, and a table data storage unit 66.

[0097] The measurement data acquisition unit 55 acquires the measurement data of the three-dimensional shape of the surface of the substrate 1 measured by the three-dimensional measurement device 11. The data comparison unit 56 compares the design data and the measurement data of the surface of the substrate 1, and extracts the mounting position in the measurement data corresponding to the predetermined mounting position in the design data. The design data is, for example, Gerber data of the film 1B.

[0098] The substrate data calculation unit 57 calculates the substrate data based on the design data and the measurement data of the three-dimensional measurement device 11. The display control unit 59 causes the display device 36 to display the display data.

[0099] The mounting head control unit 60 controls the mounting head 28. In the embodiment, controlling the mounting head 28 includes controlling the suction nozzle 27, controlling the mounting head moving device 31, and controlling the suction nozzle moving device 32. The workbench control unit 61 controls the workbench 24. Controlling the workbench 24 includes controlling the workbench moving device 25.

[0100] The NC data conversion unit 62 creates NC data, which is motion coordinate data of each device, based on the board data and the mechanism parameters of each device. The board data conversion unit 63 creates board data based on the NC data and the mechanism parameters of each device.

[0101] In the NC data storage unit 64, the motion coordinate data of the drive axes of the mounting device 12, the preheating device 13, the laser irradiation device 14, and the inspection device 15, that is, the NC data of each device are stored. The NC data is generated based on the substrate data and the mechanism parameters of each device. The substrate data is stored in the substrate data storage unit 65. The substrate data calculated by the substrate data calculation unit 57 is stored in the substrate data storage unit 65. The outer shape, size, position of the rotation axis Rm of the workbench 24 in the mechanical coordinate system, and the mechanism parameters representing the positional relationship between the mechanical coordinate system and the substrate coordinate system are calculated in advance and stored in the workbench data storage unit 66.

[0102] [Substrate data]

[0103] Fig.14 and Fig.15 It is a figure used to explain the substrate data involved in the embodiment. In addition, Fig.15 In the figure, the deflection angles θ and φ are exaggerated for the purpose of explanation. The substrate data includes design data such as the mounting position Pp (xp, yp, zp) of the component 2 on the surface of the substrate 1, the rotation angle (θxp, θyp) for setting the surface of the substrate 1 at the mounting position Pp to be horizontal, the surface data of the surface of the substrate 1, and the texture data of the circuit pattern on the surface data.

[0104] The mounting position Pp is based on the measurement data obtained by the three-dimensional measuring device 11. In the embodiment, the design data is the Gerber data of the film 1B. The design data includes a plurality of mounting positions Pp0 (xp0, yp0, zp0) respectively provided on the plurality of electrodes 1C. The design data of the substrate 1A and the measurement data are compared by the data comparison unit 56, thereby extracting the mounting position Pp corresponding to the mounting position Pp0 of the design data from the measurement data.

[0105] In the embodiment, the mounting position Pp0 and the mounting position Pp are transformed from three-dimensional orthogonal coordinates to three-dimensional polar coordinates by the substrate data calculation unit 57. The substrate data calculation unit 57 performs differential calculation using the coordinates of the mounting position Pp and the coordinates of the mounting position Pp0, thereby calculating the differential deflection angles θ and φ. The substrate data calculation unit 57 calculates the rotation angles (θxp, θyp) for making the surface of the substrate 1 at the mounting position Pp horizontal based on the differential deflection angles θ and φ.

[0106] In addition, the substrate data is represented by a substrate coordinate system (Xp, Yp, Zp) with the substrate coordinate reference point Pr fixed to the substrate 1 or the tray 3 as the origin. In the embodiment, the substrate coordinate reference point Pr is set at the center of the back side of the substrate 1. In the embodiment, the Z coordinate of the mounting position Pp0 in the design data is a value obtained by adding the thickness of the substrate 1A and the thickness of the film 1B. In addition to the above, the substrate data also includes the number of the component to be mounted, the pad position to apply the paste solder, the preheating temperature, the preheating time, the laser power, the laser irradiation time, etc., which are used for each device of the production line 17.

[0107] [NC data]

[0108] The workbench 24 can rotate in the θX and θY directions around the rotation axis Rm. The workbench 24 supports the substrate 1 via the tray 3. If the workbench 24 rotates in the θX and θY directions around the rotation axis Rm and the substrate 1 tilts, the mounting position Pp rotates around the rotation axis Rm. Fig.14 Although the above diagram is expressed by points, the rotation axes may be independently set in the θX and θY directions.

[0109] The mechanical coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12, and serves as a reference for the movement of the mounting head 28. The origin of the mechanical coordinate system can be located at any position of the mounting device 12. If the worktable 24 rotates in the θX and θY directions with the rotation axis Rm as the center and the substrate 1 is tilted, the mounting position Pp rotates with the rotation axis Rm as the center. The mounting position Pm (xm, ym, zm) in the mechanical coordinate system of the rotated mounting position Pp is calculated, and the substrate camera 29, the height sensor 30, and the suction nozzle 27 of the mounting head 28 are moved using the mounting position Pm (xm, ym, zm). The mounting position Pm (xm, ym, zm) in the mechanical coordinate system and the rotation angle of the worktable 24 are stored as NC data, and are used as the command position of the drive system motor when the mounting device 12 is actuated. NC data is also created and used in the laser irradiation device 14 and the inspection device 15 other than the mounting device 12. Since the NC data is calculated using the mechanism parameters such as the position of the rotation axis Rm of the table 24 , the NC data in each device is different.

[0110] [Method for manufacturing electronic device]

[0111] Fig.16 1 is a flowchart showing a method for manufacturing an electronic device according to an embodiment of the present invention. A substrate 1 is fixed to a tray 3. The substrate 1 fixed to the tray 3 is carried into a 3D measuring device 11. The 3D measuring device 11 measures the 3D shape of the surface of the substrate 1 fixed to the tray 3. The 3D measurement data indicating the 3D shape of the surface of the substrate 1 measured by the 3D measuring device 11 is sent from the 3D measuring device 11 to the management device 16 (step S1).

[0112] An electric circuit is provided on the surface of the substrate 1. The three-dimensional data of the surface of the substrate 1 sent to the management device 16 and acquired by the measurement data acquisition unit 55 includes the surface data of the substrate 1 and design data such as texture data representing the pattern of the electric circuit provided on the surface of the substrate 1 (the film 1B in the embodiment).

[0113] The data comparison unit 56 compares the 3D measurement data of the circuit pattern of the substrate 1 measured by the 3D measurement device 11 with the 3D design data of the circuit pattern of the design data. The data comparison unit 56 compares the 3D measurement data of the circuit pattern of the substrate 1 measured by the 3D measurement device 11 with the 3D design data of the circuit pattern of the design data, for example, using a pattern matching method.

[0114] The 3D design data of the circuit pattern of the design data is pre-constructed based on the design data of the electronic device, for example. In addition, in the circuit pattern of the design data, the target position of the mounting position Pp0 of the component 2 is specified. A plurality of mounting positions Pp0 are specified in one substrate 1. The data comparison unit 56 extracts the mounting position Pp in the 3D measurement data corresponding to the specified mounting position Pp0 specified in the design data by comparing the 3D measurement data with the 3D design data (step S2).

[0115] The substrate data calculation unit 57 can calculate the coordinates (xp, yp, zp) of the mounting position Pp of the component 2 on the surface of the substrate 1 and the substrate data indicating the rotation angle (θxp, θyp) for setting the surface of the substrate 1 at the mounting position Pp to be horizontal. The substrate data calculation unit 57 calculates the coordinates (xp, yp, zp) of the mounting position Pp of the component 2 on the surface of the substrate 1 based on the comparison result obtained by the data comparison unit 56 and the three-dimensional measurement data. The substrate data calculation unit 57 calculates the rotation angle (θxp, θyp) for setting the surface of the substrate 1 at the mounting position Pp to be horizontal based on the difference between the mounting position Pp0 (xp0, yp0, zp0) of the three-dimensional design data and the coordinates of the mounting position Pp of the three-dimensional measurement data. In addition to the mounting position Pp, the substrate data also includes the mounting components, the soldering pad position, etc. (step S3).

[0116] The substrate data calculated in step S3 is stored in the substrate data storage unit 65. In addition, the substrate data calculated in step S3 is stored in the information medium 80. In the case where the information medium 80 is a two-dimensional code, the two-dimensional code representing the substrate data is created in the three-dimensional measurement device 11 and installed on the tray 3 (step S4). Only the identification number is recorded in the information medium 80 stored in the tray 3, and the substrate data stored in the substrate data storage unit 65 on the server that manages the production system 10 can be referenced.

[0117] The substrate data is created and stored for each substrate put into the production system 10. Therefore, for a three-dimensional substrate such as the substrate 1 formed by the in-mold molding technology and having difficulty in aligning the base material 1A and the film 1B including the circuit pattern, electronic devices can be manufactured using the substrate data of the accurate mounting position Pp measured for each substrate.

[0118] When the alignment accuracy between the base material 1A and the thin film 1B including the circuit pattern can be within a predetermined standard, the measurement by the three-dimensional measuring device 11 of the second and subsequent substrates 1 can be omitted, and efficiency can be achieved by recording the same substrate data on the information medium 80.

[0119] The tray 3 with the information medium 80 mounted thereon is conveyed to the mounting device 12 while supporting the substrate 1. The reading device 102 reads the information medium 80 mounted on the tray 3. NC data is created by the substrate data and the mechanism parameters read from the information medium 80 by the reading device 102, and the dispenser 38 of the mounting device 12 applies the cream solder to the substrate 1 based on the created NC data. The dispenser 38 applies the cream solder to the pad position for the component mounted at the mounting position Pp (step S5).

[0120] After applying the cream solder to the substrate 1, the workbench control unit 61 controls the workbench 24 so that the component 2 is mounted on the substrate 1, and the mounting head control unit 60 controls the mounting head 28. The workbench 24 is controlled by the workbench control unit 61 so that the surface of the substrate 1 at the mounting position Pp becomes horizontal. The mounting head 28 mounts the component 2 on the substrate 1 supported by the workbench 24 controlled based on the NC data created by the substrate data and the mechanism parameters. The mounting head 28 mounts the component 2 at the mounting position Pp (step S6). The aforementioned application of the cream solder and installation of the components are repeated for all the components to be mounted on the substrate 1. The application of the cream solder and the installation of the components can be performed collectively after the cream solder is applied to all parts, or the application of the cream solder and the installation of the components can be repeated for each component.

[0121] After the component 2 is mounted on the substrate 1, the tray 3 is transported to the preheating device 13 while supporting the substrate 1. The reading device 103 reads the information medium 80 mounted on the tray 3. The preheating device 13 preheats the cream solder applied to the substrate 1 based on the preheating temperature and preheating time of the substrate data read from the information medium 80 by the reading device 103 (step S7).

[0122] After the cream solder is preheated, the tray 3 is transported to the laser irradiation device 14 while supporting the substrate 1. The reading device 104 reads the information medium 80 mounted on the tray 3. The NC data is created by the substrate data read from the information medium 80 by the reading device 104 and the mechanism parameters of the worktable data storage unit 66, and the laser head 47 and the worktable 45 are controlled based on the created NC data. The laser head 47 is controlled based on the NC data so that the cream solder applied to the substrate 1 is irradiated with laser, and the position of the worktable 45 in the Z-axis direction, the θX direction, and the θY direction is controlled. The cream solder is melted by the laser and cooled, thereby soldering the component 2 to the substrate 1 (step S8). The NC data for component mounting is created in such a way that the surface of the substrate 1 at the target component mounting position Pp becomes horizontal, but the surface of the substrate 1 during laser irradiation can also be tilted within a range where the component does not cause positional displacement due to gravity. By deliberately tilting the surface of the substrate 1 during laser irradiation, the direction of the laser reflected light on the solder surface can be restricted to prevent the substrate 1 from being burned. The tiltable angle is determined by the weight of the component 2 and the adhesive force of the cream solder, and is stored in advance in the board data.

[0123] After the component 2 is soldered to the substrate 1, the tray 3 is transported to the inspection device 15 while supporting the substrate 1. The reading device provided in the inspection device 15 reads the information medium 80 mounted on the tray 3. The inspection device 15 inspects the substrate 1 based on the substrate data read from the information medium 80 by the reading device of the inspection device 15 (step S9).

[0124] [Installation Process]

[0125] Fig.17 and Fig.18 Each of the figures is used to explain the mounting process performed by the mounting head 28 involved in the embodiment. The mounting position Pp of the component 2 on the substrate 1 and the substrate data indicating the rotation angle for making the surface of the substrate 1 at the mounting position Pp horizontal are calculated. In addition, in the embodiment, the outer shape and size of the worktable 24 and the position of the rotation axis Rm of the worktable 24 in the machine coordinate system, and the worktable data indicating the positional relationship between the machine coordinate system and the substrate coordinate system are obtained in advance and stored in the worktable data storage unit 66.

[0126] The substrate data including the mounting position Pp and the rotation angle on the substrate coordinates are read from the substrate data storage unit 65. Based on the read substrate data and the table data, the rotation angles θX and θY of the table 24 for making the surface of the substrate 1 horizontal are calculated for each mounting position Pp. When the table 24 is rotated at θX and θY, the mounting position Pp becomes horizontal.

[0127] In addition, the rotation angle (θxp, θyp) for setting the surface of the substrate 1 at the mounting position Pp to be horizontal is a rotation angle relative to the posture measured by the three-dimensional measuring device 11, that is, a rotation angle from the state where the tray 3 is in a horizontal posture. Therefore, the rotation angle θX based on the horizontal posture of the worktable 24 is equal to θxp, and the rotation angle θY based on the horizontal posture of the worktable 24 is equal to θyp. When the worktable 24 is rotated at θX and θY, the mounting position Pp on the mechanical coordinate is moved at the position of XY, and the height in the Z direction is calculated. The XY coordinates to which the mounting head 28 should move when the component is mounted, the rotation angles θX and θY of the worktable 24, and the height in the Z direction of the worktable 24 are stored as NC data.

[0128] like Fig.18 As shown, the stage control unit 61 controls the stage 24 based on the NC data. The mounting head control unit 60 controls the mounting head 28 based on the NC data, whereby the mounting head 28 can mount the component 2 at the mounting position Pp on the surface of the substrate 1 parallel to the XY plane.

[0129] Fig.19 This is a diagram for illustrating a control method for the workbench 24. The installation position Pp is defined in a substrate coordinate system fixed to the substrate 1. For example, the substrate coordinate reference point Pr is used as the origin to form a coordinate system fixed to the substrate 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The installation position is represented by Pp (xp, yp, zp) on the substrate coordinate system. At the same time, the installation position is also represented by a mechanical coordinate system fixed to the mounting device 12. In the mechanical coordinate system, the installation position is represented by Pm (xm, ym, zm). The origin of the mechanical coordinate system can be fixed to any position in the machine. It is usually mostly set at the movable end of the XYZ movable axis of the mounting head 28. The transformation from the substrate coordinate system to the mechanical coordinate system is performed by the NC data conversion unit 62.

[0130] If the worktable 24 rotates around the rotation axis Rm, the substrate 1 and the substrate coordinate system also rotate. If the worktable 24 moves up and down in the Z-axis direction, the substrate 1 and the substrate coordinate system also move up and down. Therefore, the installation position Pp (xp, yp, zp) is transformed into the installation position Pm (xm, ym, zm) in the mechanical coordinate system through the data of the rotation angle and the amount of up and down movement of the worktable 24, the position of the rotation axis of the worktable 24, and the position of the rotation axis of the worktable 24 and the origin of the substrate coordinate system. In addition, the position of the mechanical coordinate system can also be transformed into the position of the substrate coordinate system according to the control amount of the worktable 24. The transformation from the mechanical coordinate system to the substrate coordinate system is performed by the substrate data transformation unit 63.

[0131] [Effect]

[0132] As described above, according to the present embodiment, the substrate data including the rotation angle for making the surface of the substrate 1 at the mounting position horizontal can be calculated based on the difference between the coordinates of the mounting position in the measurement data of the three-dimensional shape of the surface of the substrate 1 supported on the worktable 24 and the mounting position in the design data. Thus, the worktable 24 can be controlled based on the substrate data so that the surface of the three-dimensional substrate at the mounting position becomes horizontal, and thus the component 2 can be mounted by the mounting head 28 at the mounting position in the horizontal state.

[0133] Determination of the mounting position and calculation of the rotation angle required for setting it horizontally can be achieved by comparing the design data with the measurement data, so that automatic teaching can be achieved for a plurality of mounting positions set on the substrate 1. That is, there is no need for an operator to manually input the mounting position and the normal vector one by one using a reference substrate, or to adjust the error by confirming with a camera, as in the prior art, and the teaching process in the three-dimensional substrate can be easily implemented.

[0134] [Other embodiments]

[0135] The above describes the embodiments of the present application, but the present invention is not limited by the contents of these embodiments. The above embodiments and modifications can be appropriately combined within the scope that does not cause conflicts in the processing contents. In addition, the aforementioned structural elements include structural elements that are substantially the same as the structural elements that can be easily thought of by those skilled in the art, and structural elements of so-called equal scope. Moreover, the aforementioned structural elements can be appropriately combined. Moreover, various omissions, substitutions or changes of structural elements can be performed within the scope that does not depart from the gist of the aforementioned embodiments.

[0136] For example, in the embodiment, the circuit pattern is used to compare the design data and the measurement data on the surface of the substrate 1, but a plurality of positioning marks may be provided on the surface of the substrate 1 and the positioning marks may be used for comparison. In addition, before the step S2 is implemented, a determination process may be included, that is, the measurement data is displayed on a display device, for example, and the error is determined to be less than a specified value for the three-dimensional data of the pre-stored reference substrate.

[0137] In addition, all or part of the processing described as automatically performed in the various processes described in the above embodiments can also be performed manually, or all or part of the processing described as manually performed can also be performed automatically by a known method. In addition, the processing sequence, specific names, and information including various data and parameters shown in the above documents and drawings can be changed arbitrarily except for special descriptions. For example, the various information shown in each figure is not limited to the information shown in the figure.

[0138] In addition, the structural elements of each device shown in the figure are structural elements of functional concepts and do not necessarily have to be constructed as shown in the physical figure. That is, the specific way of distributing and merging each device is not limited to the way shown in the figure, and all or part of it can be functionally or physically dispersed and merged in any unit according to various loads, usage conditions, etc. For example, the above-mentioned management device 16 can be composed of multiple computers divided into several functions, and several functions of the computer can also be functions of a cloud server that performs various functions in a cloud computing manner.

[0139] Description of the label

[0140] 1…substrate, 1A…base material, 1B…film, 1C…electrode, 2…component, 3…tray, 4…support component, 4A…base part, 4B…protection part, 4C…pin part, 4D…hole, 5…clamping mechanism, 5A…support part, 5B…movable part, 10…production system, 11…3D measuring device, 12…installation device, 13…preheating device, 14…laser irradiation device, 15…inspection device, 16…management device, 17…production line, 18…base component, 19…conveyor device, 19A…conveyor belt, 19B…guide component, 20 ...sensor, 21...chamber, 22...base component, 23...conveyor, 23A...conveyor belt, 23B...guide component, 24...workbench, 24A...positioning component, 25...workbench moving device, 26...component supply device, 27...sucking nozzle, 27A...axis, 28...mounting head, 29...substrate camera, 30...height sensor, 31...mounting head moving device, 31X...X-axis moving device, 31Y...Y-axis moving device, 32...sucking nozzle moving device, 33...chamber, 34...opening and closing cover, 35...window, 36...display device, 37 ...input device, 38...dispenser, 39...base component, 40...conveyor, 40A...conveyor belt, 40B...guide component, 41...heater, 42...chamber, 43...base component, 44...conveyor, 44A...conveyor belt, 44B...guide component, 45...workbench, 46...workbench moving device, 47...laser head, 48...chamber, 49...opening and closing cover, 50...window, 51...processor, 52...main memory, 53...storage, 54...interface, 55...measurement data acquisition unit, 56...data comparison unit, 57...substrate number According to the calculation unit, 59...display control unit, 60...mounting head control unit, 61...workbench control unit, 62...NC data conversion unit, 63...substrate data conversion unit, 64...NC data storage unit, 65...substrate data storage unit, 66...workbench data storage unit, 80...information medium, 101...reading device, 102...reading device, 103...reading device, 104...reading device, Pp...mounting position (substrate coordinates), Pp0...mounting position, Pm...mounting position (mechanical coordinates), Pr...substrate coordinate reference point, Rm...rotation axis.

Claims

1. A mounting device, comprising: A workbench, which supports the three-dimensional substrate; A mounting head for mounting components on the three-dimensional substrate; a measurement data acquisition unit that acquires measurement data of a three-dimensional shape of a surface of the three-dimensional substrate; a data comparison unit that compares the design data of the surface of the three-dimensional substrate with the measurement data and extracts a mounting position in the measurement data that corresponds to a prescribed mounting position in the design data; a substrate data calculation unit that calculates substrate data including a rotation angle for making the surface of the three-dimensional substrate at the mounting position horizontal based on a difference between the coordinates of the design data and the measurement data at the mounting position; a workbench control unit that controls the workbench based on the substrate data so that the surface of the three-dimensional substrate at the mounting position is set to be horizontal; as well as The mounting head control unit controls the mounting head so that the component is mounted at the mounting position in a state where the surface of the three-dimensional substrate at the mounting position is horizontal.

2. The mounting device according to claim 1, wherein: The three-dimensional substrate includes: a base material having a curved surface; and a film including an electric circuit bonded to the surface of the base material. The data comparison unit compares the pattern of the electric circuit with the measurement data.

3. The mounting device according to claim 1, wherein: The substrate data calculation unit calculates a rotation angle for making the surface of the three-dimensional substrate horizontal based on a difference between a deflection angle of the design data and a deflection angle of the measurement data of the mounting position converted into three-dimensional polar coordinates.

4. A manufacturing system for an electronic device, comprising: A tray, which supports the three-dimensional substrate; a three-dimensional measuring device that measures a three-dimensional shape of a surface of the three-dimensional substrate fixed to the tray and outputs measurement data; and The mounting device described in any one of claims 1 to 3 applies cream solder to the three-dimensional substrate conveyed from the three-dimensional measuring device in a state fixed to the tray, and mounts the component to the mounting position.

5. An installation method comprising the following steps: Acquiring measurement data of a three-dimensional shape of a surface of a three-dimensional substrate supported on a worktable; Comparing the design data of the surface of the three-dimensional substrate with the measurement data, and extracting the mounting position in the measurement data corresponding to the prescribed mounting position in the design data; calculating substrate data including a rotation angle for making the surface of the three-dimensional substrate at the mounting position horizontal based on a difference between the coordinates of the design data and the measurement data at the mounting position; Controlling the workbench based on the substrate data so that the surface of the three-dimensional substrate at the installation position is set to be horizontal; as well as In a state where the surface of the three-dimensional substrate at the mounting position is horizontal, a component is mounted to the mounting position by a mounting head.

6. A method for manufacturing an electronic device, comprising the following steps: applying solder paste to the three-dimensional substrate; and The component is mounted on the three-dimensional substrate by the mounting method described in claim 5 .

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