Cover glass bonding method, bonding system, vacuum assembly system device and control method of bonding system

Abstract

The invention provides a cover glass bonding method, a bonding system, a vacuum assembly system device and a control method of the bonding system. The cover glass bonding method includes aligning each wafer of a silicon-based organic light emitting diode (OLEDoS) wafer set and disposing the OLEDoS wafer set on an upper stage VAS module of a vacuum assembly system (VAS) apparatus without using a carrier glass; arranging the cover glass drawn by epoxy resin on a lower workbench VAS module of the VAS device; a set of OLEDoS wafers is combined with an epoxy resin drawn cover glass, where the working position of each wafer in the set of OLEDoS wafers is individually controlled in an upper table VAS module of a VAS apparatus.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0100895, filed on August 2, 2023, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments relate to a carrier-free bonding method for an organic light emitting diode on silicon (OLEDoS) wafer and a cover glass, a vacuum assembly system (VAS) device for the OLEDoS wafer and the cover glass, a bonding system using the VAS device, and a control method of the VAS device, and more particularly, to an OLEDoS wafer bonded to a cover glass without using a carrier glass. Embodiments relate to a method for bonding a carrier-free OLEDoS wafer and a cover glass capable of minimizing and preventing misalignment and poor epoxy drawing and / or capable of reducing the amount of filling, a VAS device used in the method, a bonding system using the VAS device, and a control method of the VAS device. Background Art

[0004] The OLEDoS display is a display manufactured by implementing an organic light emitting diode (OLED) as a light emitting portion after forming pixels and a driver on a silicon wafer substrate.

[0005] During the process of manufacturing the OLEDoS display, after performing the OLED organic film deposition process and the thin film encapsulation process, the cover glass may be bonded to a circular wafer having a diameter of about 300 mm. Therefore, a VAS device is required to bond the OLEDoS display and the cover glass.

[0006] Methods of attaching (or bonding) a cover glass to a circular wafer having a diameter of about 300 mm include: Figure 1A As shown in , a circular wafer 11 is arranged on a quadrilateral carrier glass 13 (ie, carrier glass on wafer), and then a cover glass 15 (ie, carrier glass on wafer) is applied. Figure 1B As shown in , the circular cover glass 15 ′ and the wafer 11 have the same size (eg, a diameter of about 300 mm), and the circular cover glass 15 ′ and the wafer 11 are bonded one-to-one without using a carrier glass.

[0007] Recently, such as Figure 1CAs shown in FIG. 1 , in order to improve productivity, a method has been considered in which a cover glass 15 is attached to OLEDoS wafers 11A, 11B, 11C, and 11D (for example, four wafers 11A, 11B, 11C, and 11D) located on a quadrilateral carrier glass 13, and the OLEDoS wafers 11A, 11B, 11C, and 11D are arranged to replace Figure 1A A wafer set 11 ′ of circular wafers 11 on a quadrilateral carrier glass 13 .

[0008] However, the method of combining the cover glass 15 and the four OLEDoS wafers 11A, 11B, 11C, and 11D arranged on the quadrilateral carrier glass 13 using the carrier glass 13 may cause mechanical stacking. Therefore, the carrier glass 13 may be cracked or damaged due to the mechanical stacking.

[0009] For example, when pressing pressure is accumulated in the VAS device, the carrier glass 13 is very likely to exceed the yield point and break.

[0010] Furthermore, in the case where the four wafers 11A, 11B, 11C, and 11D are arranged as a wafer set 11' on a carrier glass 13, necessary tolerances may occur, so that the position of epoxy drawing may be distorted when the cover glass 15 is combined in a VAS device. The distorted position of epoxy drawing may lead to a high probability of causing a unit defect due to the inability to align with high precision. In the worst case, since the wafer set 11' should all be scrapped, there is also a problem of high processing cost.

[0011] Since the wafers are randomly warped in the case of processing four wafers instead of a single wafer, there is a problem in that the possibility of bonding defects such as in the epoxy drawing process increases.

[0012] For example, because the carrier glass 13 is heavy, the carrier glass 13 may be placed only on the lower stage in the VAS device. For example, in the case where the epoxy drawing process may be performed on the wafer set 11', there may be many epoxy drawing defects or filling defects due to the use of the wafer set 11'. Therefore, the wafer set 11' may be scrapped. Summary of the invention

[0013] The embodiments solve these problems and provide high productivity compared to investment cost without using carrier glass and without discarding wafers due to bad epoxy drawing, etc., and reduce facility investment cost compared to production capacity. The embodiments provide a carrier-free bonding method for multiple OLEDoS wafers and cover glasses, a VAS device for the carrier-free bonding method, a bonding system using the VAS device, and a control method of the VAS device, which can improve layout efficiency and thus reduce investment cost.

[0014] However, the embodiments of the present disclosure are not limited to those set forth herein. The above and other embodiments will become more apparent to those of ordinary skill in the art to which the present disclosure pertains by referring to the detailed description of the present disclosure given below.

[0015] In an embodiment, a cover glass bonding method may include: aligning each wafer in a silicon-based organic light emitting diode (OLEDoS) wafer set and placing the OLEDoS wafer set on an upper worktable VAS module of a vacuum assembly system (VAS) device without using a carrier glass; placing an epoxy-drawn cover glass on a lower worktable VAS module of the VAS device; and bonding the OLEDoS wafer set with the epoxy-drawn cover glass, wherein the working position of each wafer in the OLEDoS wafer set can be individually controlled in the upper worktable VAS module of the VAS device.

[0016] The OLEDoS wafer set may include a first wafer, a second wafer, a third wafer, and a fourth wafer, each of the first wafer, the second wafer, the third wafer, and the fourth wafer having a circular shape having a diameter of approximately 300 mm, the epoxy-drawn cover glass having a quadrilateral shape having a size of approximately 650 mm×750 mm, the first wafer having a first recess and the second wafer having a second recess are arranged side by side in a first row on an upper portion of the OLEDoS wafer set, and the third wafer having a third recess and the fourth wafer having a fourth recess are arranged side by side in a second row on a lower portion of the OLEDoS wafer set, and the third recess and the fourth recess are arranged on a straight line relative to the first recess and the second recess to combine the OLEDoS wafer set with the epoxy-drawn cover glass.

[0017] The epoxy drawn cover glass may include a first visual alignment mark, a second visual alignment mark, a third visual alignment mark, and a fourth visual alignment mark corresponding to the first notch of the first wafer, the second notch of the second wafer, the third notch of the third wafer, and the fourth notch of the fourth wafer.

[0018] In an embodiment, the cover glass bonding system may include: a front-end module, the front-end module takes out the wafer from the wafer box; an index stage module module), the index stage module forms a notch-aligned wafer set by aligning the notches of the first wafer, the second wafer, the third wafer and the fourth wafer transferred from the front-end module; a first conveying module, the first conveying module takes out the notch-aligned wafer set formed in the index stage module, reverses the notch-aligned wafer set at one time, and transports the notch-aligned wafer set and places the notch-aligned wafer set on an upper stage vacuum assembly system (VAS) module of a vacuum assembly system (VAS) device; a second conveying module, the second conveying module transports the cover glass drawn with epoxy resin in the cover glass preparation station and arranges the epoxy-drawn cover glass to a lower stage VAS module of the VAS device; and a VAS device, the VAS device combines the epoxy-drawn cover glass and the notch-aligned wafer set under a vacuum atmosphere, the notch-aligned wafer set is conveyed by the first conveying module in a first direction in a reversed state and arranged on the upper stage VAS module, and the epoxy-drawn cover glass is conveyed by the second conveying module in a direction opposite to the first direction and arranged on the lower stage VAS module.

[0019] Each of the first, second, third, and fourth wafers may have a circular shape having a diameter of approximately 300 mm, the cover glass may have a quadrilateral shape having a size of approximately 650 mm×750 mm, and the notch-aligned wafer sets and the cover glass may be bonded to each other.

[0020] The cover glass bonding system may further include: a vision module, which aligns the first wafer, the second wafer, the third wafer and the fourth wafer using the first notch of the first wafer, the second notch of the second wafer, the third notch of the third wafer and the fourth notch of the fourth wafer respectively; and a control module, which controls the front-end module, the indexing stage module, the first conveying module, the VAS device and the second conveying module by electrically communicating with the vision module.

[0021] The front-end module may include: an extraction robot, which takes out the wafer from the wafer box; and a first wafer notch alignment device and a second wafer notch alignment device, which communicate with the control module, and the first wafer notch alignment device and the second wafer notch alignment device are arranged at the end of the robotic arm of the extraction robot, and the first wafer notch alignment device and the second wafer notch alignment device optimize the processing time balance of the indexing stage module.

[0022] The index stage module may have a shape and size corresponding to that of the cover glass, and the index stage module may include: an index stage, the index stage supporting the first compartment, the second compartment, the third compartment, and the fourth compartment, in which the first wafer, the second wafer, the third wafer, and the fourth wafer are sequentially filled for notch alignment, the index stage notifying the index of the empty first compartment, the second compartment, the third compartment, and the fourth compartment so that the control module operates and controls the extraction robot, the first wafer notch alignment device and the second wafer notch alignment device, and the robotic arm; a stage driving unit, in which the first wafer, the second wafer, the third wafer, and the fourth wafer aligned by the first wafer notch alignment device and the second wafer notch alignment device are sequentially aligned and arranged by the robotic arm. The first type method, the second type method, the third type method and the fourth type method are used to drive the index table; and an index notification unit, the index notification unit notifies the index of the empty first compartment, the second compartment, the third compartment and the fourth compartment, so that the control module operates and controls the extraction robot, the first wafer notch alignment device and the second wafer notch alignment device and the robotic arm, and the first compartment, the second compartment, the third compartment and the fourth compartment may include: seat pins, which are arranged at the central area of ​​each of the first compartment, the second compartment, the third compartment and the fourth compartment to place the first wafer, the second wafer, the third wafer and the fourth wafer; and index alignment marks, which correspond to the first notch of the first wafer, the second notch of the second wafer, the third notch of the third wafer and the fourth notch of the fourth wafer.

[0023] The first conveying module may include: a manipulator, which upwardly absorbs and fixes the wafer set with notches aligned; and a rotatable robot, which rotates the manipulator downward to reverse the wafer set with notches aligned, and the manipulator may include: a first finger, which absorbs and supports the first wafer and the second wafer; and a second finger, which is spaced a distance from the first finger and absorbs and supports the third wafer and the fourth wafer.

[0024] The control module can communicate with the upper worktable VAS module to confirm that the upper worktable wafer table of the upper worktable VAS module is in an empty state before transferring the inverted wafer set from the first conveying module, and the robot can move the inverted wafer set forward relative to the upper worktable wafer table, and can align the first wafer, the second wafer, the third wafer and the fourth wafer of the notch-aligned wafer set relative to each of the upper worktable wafer table, and can lower the vacuum suction cup to adsorb each wafer in the notch-aligned wafer set, the robot can move upward and backward from the notch-aligned wafer set, and when the robot moves upward and backward from the notch-aligned wafer set, the vacuum suction cup can be raised to control the first wafer, the second wafer, the third wafer and the fourth wafer of the notch-aligned wafer set to be arranged on the upper worktable wafer table, and the vacuum suction cup can move up and down between the first finger and the second finger of the robot.

[0025] In an embodiment, a vacuum assembly system (VAS) device for a system for combining multiple silicon-based organic light-emitting diode (OLEDoS) wafers and cover glasses may include: an upper workbench VAS module, which is arranged on the upper side of the VAS device; and a lower workbench VAS module, which is arranged on the lower side of the VAS device, wherein the upper workbench VAS module may include: a first upper workbench wafer table, a second upper workbench wafer table, a third upper workbench wafer table and a fourth upper workbench wafer table, and the first wafer, the second wafer, the third wafer and the fourth wafer of the set of four wafers are respectively arranged with notches aligned. The wafer table is disposed on the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table; a UVW alignment table, the UVW alignment table includes the first UVW alignment table, the second UVW alignment table, the third UVW alignment table and the fourth UVW alignment table connected to the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table and independently performing 3-axis UVW alignment on each of the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table; a vacuum suction cup unit, the vacuum suction cup unit includes Placing the first wafer, the second wafer, the third wafer and the fourth wafer on the first vacuum chuck, the second vacuum chuck, the third vacuum chuck and the fourth vacuum chuck on the first upper workbench wafer table, the second upper workbench wafer table, the third upper workbench wafer table and the fourth upper workbench wafer table; a vacuum chuck driving unit, the vacuum chuck driving unit comprising a first vacuum chuck driving unit, a second vacuum chuck driving unit, a third vacuum chuck driving unit and a fourth vacuum chuck driving unit for raising and lowering the vacuum chuck unit; and a first high-resolution vision unit, a second high-resolution vision unit, a third high-resolution vision unit, a fourth high-resolution vision unit The first high-resolution vision unit, the second high-resolution vision unit, the third high-resolution vision unit, the fourth high-resolution vision unit, the fifth high-resolution vision unit, the sixth high-resolution vision unit, the seventh high-resolution vision unit and the eighth high-resolution vision unit are provided in pairs for each of the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table and communicate with the control module so that the UVW alignment table is adjusted in the 3-axis UVW direction.

[0026] The first upper table wafer table, the second upper table wafer table, the third upper table wafer table and the fourth upper table wafer table can be arranged in the upper chamber, the UVW alignment table can be arranged outside the upper chamber, the vacuum suction cup driving unit can be arranged outside the UVW alignment table, the first high-resolution vision unit, the second high-resolution vision unit, the third high-resolution vision unit, the fourth high-resolution vision unit, the fifth high-resolution vision unit, the sixth high-resolution vision unit, the seventh high-resolution vision unit and the eighth high-resolution vision unit can correspond to the first upper table wafer table, the second upper table wafer table, the third upper table wafer table and the fourth upper table wafer table, respectively, and can be arranged under the first upper table wafer table, the second upper table wafer table, the third upper table wafer table and the fourth upper table wafer table.

[0027] The UVW alignment table may include: a first base substrate, a second base substrate, a third base substrate and a fourth base substrate, which are connected through a connecting hole of an upper chamber; and a first UVW driver, a second UVW driver, a third UVW driver and a fourth UVW driver, which correspond to the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table, and drive the first base substrate, the second base substrate, the third base substrate and the fourth base substrate on three axes to compensate for the displacement of the working positions of the first base substrate, the second base substrate, the third base substrate and the fourth base substrate.

[0028] The vacuum suction cup unit of the upper workbench VAS module may include: a vacuum suction cup pad, which is connected to each of the upper workbench wafer stages; a vacuum suction cup tube, which provides vacuum negative pressure to the vacuum suction cup pad; and a vacuum suction cup tube ring shell, which prevents leakage between the bottom of the vacuum suction cup tube and the vacuum suction cup pad, and the vacuum suction cup tube can be at least partially connected to the vacuum suction cup driving unit to raise and lower the vacuum suction cup pad to be exposed to the outside of the upper chamber.

[0029] The VAS device for the combined system may further include: a bellows, which is arranged in the upper chamber to provide vacuum negative pressure to the first upper table wafer table, the second upper table wafer table, the third upper table wafer table and the fourth upper table wafer table, thereby independently driving the first upper table wafer table, the second upper table wafer table, the third upper table wafer table and the fourth upper table wafer table and the UVW alignment table; and an adapter, which connects the lower part of the UVW alignment table and the upper part of the upper chamber, and wherein the bellows and the adapter may overlap with the first upper table wafer table, the second upper table wafer table, the third upper table wafer table and the fourth upper table wafer table and the UVW alignment table, respectively.

[0030] The VAS device for the bonding system may further include a second conveying module, the second conveying module including: a first conveying hand, the first conveying hand conveying the cover glass to the lower workbench VAS module; and a second conveying hand, the second conveying hand conveying the set of four wafers bonded to each other and the cover glass, wherein the first conveying hand and the second conveying hand may be arranged opposite to each other and connected to the conveying channel.

[0031] In an embodiment, a control method for a system for combining multiple carrier-free silicon-based organic light-emitting diode (OLEDoS) wafers and cover glasses may include: controlling an extraction robot to take out wafers from a wafer box loaded in a front-end module of the combination system through a control module; controlling an indexing stage module to align the wafers taken out by the extraction robot using notches of the wafers; sequentially arranging a first wafer, a second wafer, a third wafer, and a fourth wafer among the wafers to form a wafer set with notches aligned when determining that a first compartment, a second compartment, a third compartment, and a fourth compartment of the indexing stage are empty through indexing stage communication with the indexing stage module; communicating with a first conveying module to take out the notch-aligned wafer set, and aligning the notches at one time. The invention relates to a method for inverting a wafer set with notches aligned and controlling the transfer and placement of the wafer set with notches aligned to an upper stage VAS module of a vacuum assembly system (VAS) device; communicating with a second transfer module and controlling the transfer and placement of a cover glass drawn with epoxy resin at a cover glass preparation station to a lower stage VAS module of the VAS device; and controlling the upper stage VAS module and the lower stage VAS module of the VAS device to combine the wafer set with notches aligned and arranged in an inverted state in a first direction in the upper stage VAS module by the first transfer module with the cover glass drawn with epoxy resin and arranged in a second direction opposite to the first direction in the lower stage VAS module by the second transfer module under a vacuum atmosphere.

[0032] The control method of the combined system may further include: communicating with a vision module for aligning the first wafer, the second wafer, the third wafer and the fourth wafer using the first notch of the first wafer, the second notch of the second wafer, the third notch of the third wafer and the fourth notch of the fourth wafer, respectively; and controlling the working positions of the front-end module, the index stage module, the first conveying module, the VAS device and the second conveying module by communicating with the vision module.

[0033] The control method of the combined system may further include: communicating with the upper workbench VAS module and confirming that the upper workbench wafer table of the upper workbench VAS module is empty before transferring the inverted notch-aligned wafer set from the first conveying module; moving the inverted notch-aligned wafer set forward relative to the upper workbench wafer table by a robot; aligning the first wafer, the second wafer, the third wafer and the fourth wafer of the notch-aligned wafer set relative to each of the upper workbench wafer tables; sucking each wafer in the notch-aligned wafer set by lowering the vacuum suction cup in the upper workbench VAS module; and placing the first wafer, the second wafer, the third wafer and the fourth wafer of the notch-aligned wafer set on the upper workbench wafer table by moving the robot upward and backward from the notch-aligned wafer set so that the vacuum suction cup of the upper workbench wafer table can move upward.

[0034] The control method of the combined system may further include: arranging the wafers notched and aligned by the first wafer notch alignment device and the second wafer notch alignment device one by one into the first compartment, the second compartment, the third compartment and the fourth compartment of the index table of the index table module; arranging the wafers loaded into the index table on seat pins, which are arranged in the central area of ​​each of the first compartment, the second compartment, the third compartment and the fourth compartment and are driven independently; sequentially filling the first compartment, the second compartment, the third compartment and the fourth compartment with the first wafer, the second wafer and the third compartment; and In the case of the first wafer, the third wafer and the fourth wafer, the indexing table is driven according to the first angle driving type, the second angle driving type, the third angle driving type and the fourth angle driving type in which the notches of the first wafer, the second wafer, the third wafer and the fourth wafer are aligned; and the first wafer, the second wafer, the third wafer and the fourth wafer are used to align the notches of the first angle driving type, the second angle driving type, the third angle driving type and the fourth angle driving type to form a set of wafers filled in the first compartment, the second compartment, the third compartment and the fourth compartment in sequence. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1A Schematic diagram illustrating a method of one-to-one wafer and cover glass bonding using carrier glass in manufacturing a conventional OLEDoS display.

[0036] Figure 1Bis a schematic diagram illustrating a method of performing one-to-one wafer and cover glass bonding without using a carrier glass in manufacturing a conventional OLEDoS display.

[0037] Figure 1C is a schematic diagram of a method of bonding a wafer and a cover glass using a carrier glass in the case of manufacturing an OLEDoS display.

[0038] Figure 2 is a schematic diagram illustrating a method of bonding a carrier-less OLEDoS wafer set and a cover glass according to an embodiment.

[0039] Figure 3 FIG. 1 is an overall schematic diagram of a system for bonding a carrier-free OLEDoS wafer and a cover glass according to an embodiment.

[0040] Figure 4 Yes Description Figure 3 Schematic diagram of the configuration and operation of the front-end module and indexing station.

[0041] Figure 5 Yes Description Figure 3 A schematic diagram of the configuration and operation of the first transmission module.

[0042] Figure 6 It is detailed description Figure 3 Schematic diagram of the loading operation of the first conveyor module.

[0043] Fig. 7A , Figure 7B , Figure 7C , Fig.7D , Fig. 7E and Figure 7F They are Figure 3 Schematic perspective view of the upper workbench VAS module, schematic perspective view from below, schematic front view, Figure 7C Schematic front longitudinal section of Figure 7C A schematic rear longitudinal sectional view and a schematic diagram for explaining the operation of the vacuum chuck.

[0044] Figure 8 is a flow chart showing a method for bonding a carrier-free OLEDoS wafer set and a cover glass according to an embodiment. DETAILED DESCRIPTION

[0045] In the following description, for the purpose of illustration, many specific details are set forth to provide a comprehensive understanding of various embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable words as non-limiting examples of the apparatus or method disclosed herein. However, it is apparent that various embodiments may be practiced without these specific details or by one or more equivalent arrangements. Here, various embodiments need not be exclusive and need not limit the present disclosure. For example, the specific shape, configuration and characteristics of an embodiment may be used in another embodiment or implemented in another embodiment.

[0046] Unless otherwise specified, the illustrated embodiments will be understood to provide features of the present invention. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments, etc. (hereinafter referred to as "elements" respectively or collectively) may be combined, separated, interchanged and / or rearranged in other ways without departing from the scope of the present invention.

[0047] The use of cross hatching and / or shading in the accompanying drawings is generally provided to make the boundaries between adjacent elements clear. Therefore, unless specified, the presence or absence of cross hatching or shading does not express or indicate any preference or requirement for a specific material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the accompanying drawings, the size and relative size of the elements can be magnified for clarity and / or descriptive purposes. When the embodiments can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two continuously described processes can be performed substantially simultaneously or in an order opposite to the described sequence. In addition, similar reference numerals represent similar elements.

[0048] When an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, the element or layer may be directly on, directly connected to or coupled to, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there is no intervening element or layer. For this purpose, the term "connection" may refer to a physical connection, an electrical connection and / or a fluid connection with or without an intervening element. In addition, the axis of the first direction DR1, the axis of the second direction DR2, and the axis of the third direction DR3 are not limited to the three axes of a rectangular coordinate system, such as the X-axis, the Y-axis, and the Z-axis, and may be interpreted in a broader sense. For example, the axis of the first direction DR1, the axis of the second direction DR2, and the axis of the third direction DR3 may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of A and B" may be understood to refer to only A, only B, or any combination of A and B. Furthermore, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0049] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below can be referred to as the second element without departing from the teachings of the present disclosure.

[0050] For descriptive purposes, spatially relative terms such as "below," "beneath," "lower," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein and thereby describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, in operation, and / or in manufacture other than the orientation depicted in the accompanying drawings. For example, if the device is flipped over in the accompanying drawings, an element described as being "below" or "below" other elements or features will subsequently be oriented as being "above" the other elements or features. Thus, the term "below" is capable of encompassing both above and below orientations. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0051] Hereinafter, a method for attaching a carrier-less OLEDoS wafer and a cover glass, a vacuum assembly system (VAS) apparatus used for the method, a bonding system using the VAS apparatus, and a bonding method according to an embodiment will be described in detail with reference to the accompanying drawings.

[0052] Hereinafter, the same reference numerals are used for technical elements performing the same functions, and repeated detailed descriptions are omitted to avoid redundant descriptions.

[0053] For example, the embodiments described below are shown by way of example to effectively illustrate preferred embodiments and should not be construed as limiting the scope of the present invention.

[0054] Figure 2 is a schematic diagram illustrating a method of bonding a carrier-free organic light emitting diode on silicon (OLEDoS) wafer set and a cover glass according to an embodiment.

[0055] The method of bonding a carrier-free OLEDoS wafer set and a cover glass according to an embodiment may include four circular wafers 11A, 11B, 11C, and 11D having a diameter of about 300 mm without using a carrier glass. In a state where a wafer set (hereinafter also referred to as a wafer) 11' is arranged at a higher position, a quadrilateral cover glass 15 having a typical size of about 650 mm×750 mm may be arranged at a lower position to perform a bonding process.

[0056] For example, a set 11' (11A, 11B, 11C, and 11D) of four circular wafers having a diameter of about 300 mm may be simultaneously inverted and transferred to a vacuum assembly system (VAS) device (e.g., an upper stage VAS module), and a quadrilateral cover glass 15 having a conventional size of 650 mm x 750 mm may be transferred to the VAS device (e.g., a lower stage VAS module). In the case of bonding the four circular wafers 11A, 11B, 11C, and 11D having a diameter of about 300 mm to the cover glass 15, since the four circular wafers 11A, 11B, 11C, and 11D having a diameter of about 300 mm are each aligned by using at least two visual alignment marks, alignment may be performed to have high accuracy.

[0057] The quadrilateral cover glass 15 can be Figure 1A The quadrilateral cover glass 15 is the same as (or similar to) the typical production line shown in FIG. The quadrilateral cover glass 15 may further have four visual alignment marks 15a corresponding to the recesses of the four wafers and two visual alignment dummy marks 15b located in the center area thereof.

[0058] According to the method of combining a carrier-free OLEDoS wafer set 11' and a cover glass 15 according to an embodiment, four circular wafers 11A, 11B, 11C, and 11D of the OLEDoS wafer set 11' can be formed without using a carrier glass. In a case where the circular wafers 11A, 11B, 11C, and 11D can be respectively aligned and arranged on an upper stage VAS module of a vacuum assembly system (VAS) device, the circular wafers 11A, 11B, 11C, and 11D can be combined with the cover glass 15 arranged on the lower stage VAS module of the VAS device, and an epoxy resin drawing process and a filling process can be performed on the cover glass 15 arranged on the lower stage VAS module. Therefore, the epoxy resin drawing process and the filling process can be performed before the circular wafers 11A, 11B, 11C, and 11D are combined with the cover glass 15. As a result, typical equipment can be used without the need to develop separate equipment. Therefore, in Figure 1A and Figure 1B In preparation for the conventional bonding method of one-to-one OLEDoS wafers and cover glass, although the processing time of the standard process of a typical VAS device is the same, four OLEDoS wafers 11' and cover glass 15 can be bonded at once. Therefore, since the four OLEDoS wafers 11' are bonded to the cover glass 15 at the same time, it is possible to ensure four times the productivity by reducing the processing time.

[0059] refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 , according to the embodiment, the carrier-free sheet is used to realize the reference Figure 3 , Figure 4 , Figure 5 and Figure 6 According to a method of bonding a carrier-free OLEDoS wafer set 11 ′ and a cover glass 15 according to an embodiment, a detailed description will be given of a bonding system 1 for the OLEDoS wafer set 11 ′ and the cover glass 15 .

[0060] Figure 3 FIG. 1 is an overall schematic diagram of a bonding system 1 for a carrier-free OLEDoS wafer 11 ′ and a cover glass 15 according to an embodiment.

[0061] like Figure 3As shown in , the bonding system 1 for the carrier-less OLEDoS wafer 11' and the cover glass 15 according to the embodiment may have a front-end module 110 that inputs the wafer 11' from the wafer box 111 in units of sheets (or one by one), an index stage module 130 in which the set 11' of four wafers input from the front-end module 110 may be respectively aligned by notches, and a first transfer module 150 that takes out the set 11' of four wafers from the index stage module 130, turns the set 11' of four wafers, and places the set 11' of four wafers on the upper stage VAS module 170A of the VAS device 170. After the epoxy drawing process is performed on the cover glass 15 in the cover glass preparation stage 200, the epoxy-drawn cover glass supplied through the channel 210 may be transferred to the VAS device 170. The bonding system 1 may further include a second transfer module 190 that inputs the epoxy-drawn cover glass to the lower stage VAS module 170B.

[0062] The first conveyor module 150 may input the wafer set 11' to the VAS device 170 in a first direction, and the second conveyor module 190 may supply the epoxy-drawn cover glass to the VAS device 170 in a second direction opposite to the first direction. The wafer set 11' and the epoxy-drawn cover glass may be combined with each other in the VAS device 170, and the second conveyor module 190 may discharge the combined wafer set 11' and the epoxy-drawn cover glass in the first direction after the wafer set 11' and the epoxy-drawn cover glass are combined.

[0063] The VAS apparatus 170 may include a set 11' of four wafers arranged on the upper stage VAS module 170A and transferred in a first direction by the first transfer module 150, and an epoxy-drawn cover glass transferred in a second direction by the second transfer module 190. The quadrilateral cover glass arranged on the lower stage VAS module 170B may be bonded to the set 11' of four wafers arranged on the upper stage VAS module 170A in the VAS apparatus 170 under a vacuum atmosphere.

[0064] According to an embodiment, a bonding system 1 for a carrier-free OLEDoS wafer set 11' and a cover glass 15 may include a front-end module 110, an index stage module 130, a first conveying module 150, a vacuum assembly system (VAS) device 170, and a second conveying module 190. The bonding system 1 may further include a vision module for micro-aligning the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D of the wafer set 11' by using the first recess to the fourth recess of the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D, respectively, and a control module, which electrically communicates with the vision module and controls the front-end module 110, the index stage module 130, the first conveying module 150, the VAS device 170, and the second conveying module 190 to align each of the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D of the wafer set 11'. Therefore, the bonding process may be performed in an aligned state.

[0065]

Table 1

[0066] Comparative table of advantages and disadvantages of Examples and Comparative Examples

[0067]

[0068] As shown in Table 1, in the bonding system 1 for the carrier-free OLEDoS wafer 11' and the cover glass 15 according to the embodiment, since the carrier glass is not used, the carrier glass itself is unlikely to be destroyed or damaged by the VAS device 170, and bonding failure between the wafer 11' on the carrier glass and the cover glass 15 can be prevented, and productivity can be improved compared to the case where a single circular wafer 11 and a quadrilateral cover glass 15 are bonded one-to-one. Since the epoxy resin drawing process is not performed on the wafer 11 but on the cover glass 15, various problems such as poor epoxy resin drawing can be reduced or prevented, which can be suitable for mass production, and maintenance costs can be reduced. Reference Figure 4 Together with Figure 3 , it will be described in detail how the wafers 11A, 11B, 11C, and 11D input as a unit of the front end module 110 are notched and aligned in the index stage module 130 to form a set 11 ′ of four wafers.

[0069] Figure 4 It is shown Figure 3 Schematic diagram of the configuration and operation of the front-end module 110 and the indexing module 130.

[0070] Again Figure 3As shown in , in the bonding system 1 for the OLEDoS wafer set 11' and the cover glass 15 according to the embodiment, the front-end module 110 may use a typical front-end module. In order to optimize the balance of the feasible production time of the index stage module 130, for example, to optimize the balance of the processing time, the robot arm 115 may be controlled to interlock with the first wafer notch alignment device 117a and the second wafer notch alignment device 117b, which are on the side (for example, the opposite side) of the extraction robot 113 that extracts the wafer from the wafer box 111 based on the input direction of the index stage module 130 of the extraction robot 113.

[0071] The wafer set 11' may include four wafers, the four wafers include a first wafer 11A, a second wafer 11B, a third wafer 11C, and a fourth wafer 11D, each of the four wafers may have a circular shape having a diameter of about 300 mm, and the cover glass 15 may have a quadrilateral shape having a size of about 650 mm×750 mm. The first wafer 11A and the second wafer 11B having a first notch and a second notch may be arranged side by side on the top (or upper part) of the wafer set 11' in a first row. The third wafer 11C and the fourth wafer 11D having a third notch and a fourth notch may be arranged side by side at the bottom (or lower part) of the wafer set 11' in a second row.

[0072] The third recess and the fourth recess may be arranged on a straight line relative to the first recess and the second recess, so that the four wafers of the wafer set 11 ′ may be accurately aligned with each other.

[0073] The index stage module 130 may be made into a size and shape corresponding to that of the cover glass 15, and may have an index stage 131 having four compartments (or a first compartment, a second compartment, a third compartment, and a fourth compartment), and the four wafers 11A, 11B, 11C, and 11D are respectively inserted (or arranged) in the four compartments in a counterclockwise direction. The index stage module 130 may include a stage driving section 133 that rotates the index stage 131 so that the visual alignment marks 15a and / or 15b of the first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D of the index stage 131 may be aligned to the recesses of the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D.

[0074] In the case where the robot arm 115 of the front-end module 110 linearly reciprocates in the wafer input direction, the notches of the four wafers 11A, 11B, 11C, and 11D arranged on the robot arm 115 can be aligned to the visual alignment marks 15a and / or 15b of the first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D of the index stage 131 by rotating a certain angle (e.g., about -14 degrees, about 14 degrees, about 139 degrees, and about -139 degrees). Considering the wafer input direction of the robot arm 115 and the size of the index stage 131 and the size of each of the OLEDoS wafers 11', the index stage 131 can swing or rotate the first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D arranged side by side by about -14 degrees, about 14 degrees, about 139 degrees, and about -139 degrees relative to the standby state. The index table 131 may include a table driving part 133 for swing-driving the index table 131 so that the compartments 131A, 131B, 131C, and 131D may be arranged.

[0075] The indexing table 131 can send information about empty compartments among the first compartment 131A, the second compartment 131B, the third compartment 131C and the fourth compartment 131D (or the index of the empty first compartment 131A, the second compartment 131B, the third compartment 131C and the fourth compartment 131D) to the front-end module 110, and the front-end module 110 can be aligned according to the angles of the first compartment 131A, the second compartment 131B, the third compartment 131C and the fourth compartment 131D and the wafer can be inserted.

[0076] The robot arm 115 of the front-end module 110 may sequentially transfer the wafer 11' including the notches aligned one by one to the index stage module 130 by the first wafer notch alignment device 117a and the second wafer notch alignment device 117b. In the index stage 131, the wafer 11' may be aligned and input to the empty first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D.

[0077] The wafer 11' loaded into the index stage 131 may be seated on a seat pin installed in a central area of ​​each of the first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D. The index stage 131 may be adsorbed and fixed by an independently controlled adsorption device so that the index stage 131 may not move when the stage driving part 133 swings.

[0078] When the first compartment 131A, the second compartment 131B, the third compartment 131C and the fourth compartment 131D are all filled with a set 11' of four wafers aligned by the table driving part 133 of the index table 131 by using notches and alignment marks, the index table 131 can be in a take-out state in which the wafers of the set 11' of four wafers are arranged side by side in the input direction of the wafers in the same manner as in the standby state.

[0079] refer to Figure 5 and Figure 6 , the first transfer module 150 may take out and flip (or reverse) the set 11' of four wafers transferred as a unit from the index stage module 130, and may input the reversed set 11' of four wafers into the VAS apparatus 170. The configuration and operation of inputting the set 11' of four wafers into the upper stage VAS module 170A of the VAS apparatus 170 will be described in detail.

[0080] Figure 5 It is shown Figure 3 A schematic diagram of the configuration and operation of the first transmission module 150, and Figure 6 It is shown in detail Figure 3 FIG. 1 is a schematic diagram of a loading operation of the first conveying module 150 .

[0081] like Figure 5 As shown in FIG. 1 , in the bonding system 1 for the carrier-free OLEDoS wafer 11 ′ and the cover glass 15 according to the embodiment, the first transfer module 150 may include a rotatable robot 151 and a manipulator 153 attached to the rotatable robot 151. The rotatable robot 151 may be rotatable, and may suck the wafer set 11 ′ upward and flip (or reverse) the wafer set 11 ′ downward.

[0082] The first transfer module 150 may adsorb the wafer set 11' aligned in the index stage module 130 onto the robot 153 and may move the robot 153 attached to the rotatable robot 151. The first transfer module 150 may be turned down (or reversed) to keep the wafer set 11' in a reversed state.

[0083] like Figure 6 As shown in FIG, an upper stage VAS module 170A of the VAS device 170 may include four upper stage wafer tables 171a, 171b, 171c and 171d and vacuum chucks 175a, 175b, 175c and 175d respectively connected to the upper stage wafer tables 171a, 171b, 171c and 171d.

[0084] In the VAS apparatus 170 , the upper stage wafer stages 171 a , 171 b , 171 c , and 171 d may remain empty before the set 11 ′ of inverted wafers is loaded from the first transfer module 150 .

[0085] The robot 153 reversed (or inverted) downward in the first transfer module 150 may move forward to align the wafers 11A, 11B, 11C, and 11D to the upper stage wafer tables 171a, 171b, 171c, and 171d of the VAS device 170. With each of the wafers 11A, 11B, 11C, and 11D of the wafer set 11' aligned on the upper stage wafer tables 171a, 171b, 171c, and 171d, the vacuum chucks 175a, 175b, 175c, and 175d may respectively absorb each of the wafers 11A, 11B, 11C, and 11D of the wafer set 11' by descending.

[0086] In a state in which the vacuum chucks 175 a , 175 b , 175 c , and 175 d descend and respectively adsorb each wafer in the wafer set 11 ′, the robot hand 153 may move upward and backward.

[0087] like Figure 5 As shown in, the robot 153 can have a pair of first fingers 153a and a second finger 153b, which are arranged at a certain distance from the central area of ​​two wafers arranged parallel to the input direction of the wafers, and the vacuum suction cups 175a, 175b, 175c and 175d attached to each of the upper workbench wafer tables 171a, 171b, 171c and 171d can move freely up and down between the first finger 153a and the second finger 153b at a certain distance.

[0088] When the robot 153 moves upward and backward relative to the wafer set 11', the vacuum chucks 175a, 175b, 175c and 175d respectively attached to the upper stage wafer tables 171a, 171b, 171c and 171d can move upward. Therefore, the wafer set 11' can be arranged on the upper stage wafer tables 171a, 171b, 171c and 171d.

[0089] refer to Fig. 7A , Figure 7B , Figure 7C , Fig.7D , Fig. 7E and Figure 7F , in which the OLEDoS wafer 11 ′ and the cover glass 15 are arranged in the bonding system 1 according to the embodiment, a configuration and an operating method of a VAS device for bonding four aligned OLEDoS wafers 11 ′ to the cover glass 15 as a set are described in detail.

[0090] 7A to 7F They are shown respectively Figure 3 A schematic diagram of a VAS device in FIG. 1 is a schematic top view, a schematic bottom view, a schematic front view, Figure 7C Schematic front longitudinal section of Figure 7C A schematic rear longitudinal sectional view and a schematic diagram for explaining the operation of the vacuum chuck.

[0091] like Fig. 7A and Figure 7B As shown in FIG. 1 , an upper stage VAS module 170A of a VAS device 170 of a system 1 for bonding a carrier-less OLEDoS wafer 11′ and a cover glass 15 according to an embodiment may include an upper stage wafer stage 171, a UVW alignment stage 173, a vacuum chuck driving unit 177, and a vision unit 179. The upper stage wafer stage 171 may include a first upper stage wafer stage 171a, a second upper stage wafer stage 171b, a third upper stage wafer stage 171c, and a fourth upper stage wafer stage 171d on which four wafers 11A, 11B, 11C, and 11D of a wafer set 11′ are respectively arranged. The UVW alignment stage 173 may include a first UVW alignment stage 173a, a second UVW alignment stage 173b, a third UVW alignment stage 173c, and a fourth UVW alignment stage 173d connected to the first upper stage wafer stage 171a, the second upper stage wafer stage 171b, the third upper stage wafer stage 171c, and the fourth upper stage wafer stage 171d, respectively, and independently aligning the first upper stage wafer stage 171a, the second upper stage wafer stage 171b, the third upper stage wafer stage 171c, and the fourth upper stage wafer stage 171d in the 3-axis UVW direction. The vacuum chuck driving unit 177 may include a first vacuum chuck driving unit 177a, a second vacuum chuck driving unit 177b, a third vacuum chuck driving unit 177c, and a fourth vacuum chuck driving unit 177d that move the vacuum chucks 175a, 175b, 175c, and 175d up and down. The vision unit 179 may include a first to an eighth high-resolution vision unit 179a to 179h for fine-tuning the UVW alignment stage 173 in the 3-axis UVW direction, and each of the first to eighth high-resolution vision units 179a to 179h may be mounted in pairs on the first upper stage wafer table 171a, the second upper stage wafer table 171b, the third upper stage wafer table 171c and the fourth upper stage wafer table 171d.

[0092] The upper stage wafer table 171 may have a circular shape having a size of about 305 mm corresponding to the size of the four wafers 11A, 11B, 11C, and 11D of the wafer set 11' having a diameter of about 300 mm, or the upper stage wafer table 171 may have four quadrilateral shapes. Figure 7C At least two vacuum chuck pads 175-1 in the upper stage wafer table 171 and spaced apart from each other may be arranged to seat each of the wafer sets 11'.

[0093] The UVW alignment stage 173 may include a base substrate 173 - 1 and a UVW driver 173 - 2 that corrects the base substrate 173 - 1 in the X-axis, the Y-axis, and the θ-axis, respectively. Fig. 7E The UVW alignment stage 173 can be highly accurate and responsive.

[0094] The base substrate 173 - 1 may be connected to the upper chamber 172 and may be supported while the base substrate 173 - 1 is pressed by a lower stage VAS module 170B which will be briefly described later.

[0095] The UVW driver 173 - 2 may use an X-axis linear servo motor and a Y-axis linear servo motor, and may use a θ-axis direct drive motor.

[0096] like Fig.7D As shown in FIG. 1 , the upper workbench vacuum chuck unit 175 (in Figure 7F ) may include a vacuum suction cup pad 175-1, a vacuum suction cup tube 175-3, and a vacuum suction cup tube ring housing 175-5. The vacuum suction cup pads 175-1 may be symmetrically spaced apart from each other, may be connected to each other, and may be arranged on the upper workbench wafer table 171. The vacuum suction cup tube 175-3 may be connected to a vacuum pump and controlled to apply a vacuum negative pressure to the vacuum suction cup pad 175-1. The vacuum suction cup tube ring housing 175-5 may provide an airtight connection between the vacuum suction cup tube 175-3 and the vacuum suction cup pad 175-1.

[0097] A vacuum cup tube ring housing 175 - 5 may be installed to prevent or block air leakage from the vacuum cup tube 175 - 3 when the vacuum cup pad 175 - 1 moves up and down.

[0098] The upper stage vacuum chuck unit 175 may be disposed on the top (or upper portion) of the upper chamber 172. The upper stage vacuum chuck unit 175 may raise and lower the upper stage wafer table 171 to be exposed outside the upper chamber 172 by a vacuum chuck driving unit 177.

[0099] Each of the upper stage vacuum chuck units 175 may be driven so that each wafer in the wafer set 11 ′ may be transferred and sucked by each of the upper stage wafer tables 171 .

[0100] The upper chamber 172 may further include a bellows 174 and an adapter 176, wherein the bellows 174 includes four independent first bellows 174a, second bellows 174b, third bellows 174c and fourth bellows 174d, and the adapter 176 includes a first adapter 176a, a second adapter 176b, a third adapter 176c and a fourth adapter 176d. The bellows 174 and the adapter 176 may be installed between the first upper table wafer table 171a, the second upper table wafer table 171b, the third upper table wafer table 171c and the fourth upper table wafer table 171d accommodated in the upper chamber 172 and the first UVW alignment table 173a, the second UVW alignment table 173b, the third UVW alignment table 173c and the fourth UVW alignment table 173d arranged in the atmosphere outside the upper chamber 172, so that the first UVW alignment table 173a, the second UVW alignment table 173b, the third UVW alignment table 173c and the fourth UVW alignment table 173d may be operated smoothly and independently.

[0101] The first adapter 176a, the second adapter 176b, the third adapter 176c, and the fourth adapter 176d can each be connected to the lower portion of the first UVW alignment stage 173a, the second UVW alignment stage 173b, the third UVW alignment stage 173c, and the fourth UVW alignment stage 173d, and each can be connected through the through hole 172-1 formed in the upper chamber 172 (at Fig.7D ) are connected to the first wind box 174a, the second wind box 174b, the third wind box 174c and the fourth wind box 174d under vacuum state.

[0102] The first upper stage wafer table 171a, the second upper stage wafer table 171b, the third upper stage wafer table 171c, and the fourth upper stage wafer table 171d may be vacuum sealed by the first wind box 174a, the second wind box 174b, the third wind box 174c, and the fourth wind box 174d. The first UVW alignment table 173a, the second UVW alignment table 173b, the third UVW alignment table 173c, and the fourth UVW alignment table 173d may have mobility without destroying the vacuum tightness.

[0103] The first upper stage wafer table 171a, the second upper stage wafer table 171b, the third upper stage wafer table 171c and the fourth upper stage wafer table 171d may be connected to the vacuum pump from the upper chamber 172 through the first wind box 174a, the second wind box 174b, the third wind box 174c and the fourth wind box 174d.

[0104] Visual Unit 179 (in Figure 7B The vision unit 179 may include a first high-resolution vision unit 179a to an eighth high-resolution vision unit 179h that accurately adjust each UVW alignment stage 173 in the 3-axis UVW direction.

[0105] The vacuum chucks 175a, 175b, 175c, and 175d attached to each of the above-mentioned four upper table wafer tables 171a, 171b, 171c, and 171d may include a vacuum chuck tube 175-3 and a vacuum chuck tube ring housing 175-5. The vacuum chuck tube 175-3 may operate vacuum suction. The vacuum chuck tube ring housing 175-5 may airtightly accommodate the vacuum chuck tube 175-3. The vacuum chuck driving unit 177 may raise and lower the vacuum chucks 175a, 175b, 175c, and 175d, and may be located above the UVW alignment table 173.

[0106] The second transmission module 190 (in Figure 3 ) may include a transfer robot 191 having dual arms and two transfer hands 193 and 195 respectively attached to the dual arms.

[0107] The first transfer hand 193 may be configured to transfer the cover glass 15 to the lower stage VAS module 170B, and the second transfer hand 195 may be configured to simultaneously transfer the wafer set 11 ′ and the cover glass 15 bonded to each other.

[0108] Accordingly, one of the transfer hands 193 and 195 may be used to transfer only the cover glass 15 , and the other may be used to take out the wafer set 11 ′ and the cover glass 15 bonded to each other from the VAS apparatus 170 .

[0109] The second conveying hand 195 may be discharged through a conveying channel through which glass having a size of approximately 650 mm×750 mm is returned.

[0110] Turning functions can be performed through this channel, and depending on the transport configuration, the channel can have a two-level structure.

[0111] refer to Figure 8 , a bonding method between the carrier-free OLEDoS wafer set 11 ′ and the cover glass 15 according to an embodiment will be described.

[0112] like Figure 8As shown in, in the control method of the bonding system 1 for the carrierless OLEDoS wafer 11' and the cover glass 15, the control module can be loaded into the front-end module 110 of the bonding system 1, the extraction robot 113 can be controlled to take out the carrierless OLEDoS wafer set 11' from the wafer box 111 in units of sheets (or one by one) (S110), and the index stage module 130 can be controlled to align the carrierless OLEDoS wafer set 11' taken out from the wafer box 111 using the notches of the carrierless OLEDoS wafer set 11' (S120). In the case where the first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D of the index stage 131 are determined to be empty by communicating with the index stage 131 of the index stage module 130, the notch-aligned wafer set 11' may be provided by sequentially arranging the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D among the carrier-free OLEDoS wafer set 11' taken out in units of sheets (or one by one) from the front-end module 110 (S130). The notch-aligned wafer set 11' may be taken out from the index stage module 130, the notch-aligned wafer set 11' may be reversed as a whole at one time, and the notch-aligned wafer set 11' may be transferred to the upper stage VAS module 170A of the VAS device 170 (S140). The second transfer module 190 may communicate with the cover glass preparation stage 200 to transfer the epoxy-drawn cover glass to the lower stage VAS module 170B of the VAS device 170 (S150). The control module may communicate with the vision module for finely aligning the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D using each of the first to fourth notches, and may control the front-end module 110, the index stage module 130, the first transfer module 150, the VAS device 170, and the second transfer module 190 to align the working positions of the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D of the notch-aligned wafer set 11', respectively, by communicating with the vision module (S160). By controlling the upper stage VAS module and the lower stage VAS module of the VAS device 170, the notch-aligned wafer set 11' conveyed in a first direction by the first conveying module 150 in an inverted state and arranged on the upper stage VAS module 170A can be joined or attached to the epoxy-resin-painted cover glass conveyed in a second direction opposite to the first direction by the second conveying module 190 and arranged on the lower stage VAS module 170B under a vacuum atmosphere (S170).

[0113] It may be determined whether the upper stage wafer table 171 of the upper stage VAS module 170A is in an empty state before the inverted wafer set 11' is transferred from the first transfer module 150 by communicating with the upper stage VAS module 170A. After confirming that the upper stage wafer table 171 is in an empty state, the robot 153 may move the inverted wafer set 11' forward relative to the upper stage wafer table 171, and may align each of the upper stage wafer tables 171 to the first wafer 11A, the second wafer 11B, the third wafer 11C, and the fourth wafer 11D of the inverted wafer set 11'. In addition, the vacuum chuck unit 175 may descend in the upper stage VAS module 170A to approach the inverted wafer set 11', and may adsorb each wafer.

[0114] The robot 153 can move upward and backward from the inverted wafer set 11', and when the robot 153 moves upward and backward from the inverted wafer set 11', the vacuum suction cup unit 175 of the upper workbench wafer table 171 can move upward to arrange the inverted wafer set 11' including the first wafer 11A, the second wafer 11B, the third wafer 11C and the fourth wafer 11D on the upper workbench wafer table 171.

[0115] The control module may control the robot 153 to sequentially transfer the wafers notched by the first wafer notch alignment device 117a and the second wafer notch alignment device 117b to the empty first compartment 131A, the second compartment 131B, the third compartment 131C, and the fourth compartment 131D of the index stage 131 of the index stage module 130 one by one. The wafers placed in the index stage 131 may be arranged on the seat pins 135 installed in the central area of ​​each of the first compartment 131A to the fourth compartment 131D and driven independently. When the first compartment 131A, the second compartment 131B, the third compartment 131C and the fourth compartment 131D are sequentially filled with the first wafer 11A, the second wafer 11B, the third wafer 11C and the fourth wafer 11D, the index table 131 can be rotated according to a driving type from a first angle to a fourth angle in which notch alignment of each of the first wafer 11A, the second wafer 11B, the third wafer 11C and the fourth wafer 11D can be performed.

[0116] Through the first angle drive type rotation drive method to the fourth angle drive type rotation drive method, the index table 131 can form a wafer set 11' in which the first compartment 131A, the second compartment 131B, the third compartment 131C and the fourth compartment 131D are filled with the above-mentioned first wafer 11A, the second wafer 11B, the third wafer 11C and the fourth wafer 11D in a notch alignment state.

[0117] According to another aspect of the present invention, the upper stage VAS module 170A may also have four cover glasses 15 corresponding to the size of the wafer.

[0118] Therefore, there is a problem in that the bonding system 1 becomes more complicated because the upper stage VAS module 170A should also include four UVW alignment stages 173 and four vision modules to enable epoxy drawing.

[0119] At the end of the detailed description, those skilled in the art will recognize that many variations and modifications may be made to the embodiments without departing substantially from the principles, spirit and scope of the present disclosure. Therefore, the disclosed embodiments are used only in a general and descriptive sense, and the disclosed embodiments are not used for limiting purposes.

Claims

1. A cover glass bonding method, the method comprising: aligning each wafer in a silicon-based organic light-emitting diode wafer set and placing the silicon-based organic light-emitting diode wafer set on an upper stage vacuum component system module of a vacuum component system device without using a carrier glass; placing an epoxy-drawn cover glass on a lower stage vacuum assembly system module of the vacuum assembly system apparatus; and The silicon-based organic light-emitting diode wafer set is bonded to the epoxy-drawn cover glass, Wherein, the working position of each wafer in the silicon-based organic light-emitting diode wafer set is individually controlled in the upper workbench vacuum component system module of the vacuum component system device.

2. The cover glass bonding method according to claim 1, wherein: The silicon-based organic light-emitting diode wafer set includes a first wafer, a second wafer, a third wafer and a fourth wafer, Each of the first wafer, the second wafer, the third wafer, and the fourth wafer has a circular shape having a diameter of 300 mm, The epoxy-drawn cover glass has a quadrilateral shape having a size of 650 mm×750 mm. The first wafer having a first notch and the second wafer having a second notch are arranged side by side in a first row on an upper portion of the silicon-based organic light-emitting diode wafer set, The third wafer having the third notch and the fourth wafer having the fourth notch are arranged side by side in a second row on a lower portion of the silicon-based organic light-emitting diode wafer set, and The third recess and the fourth recess are arranged on a straight line with respect to the first recess and the second recess to combine the silicon-based organic light emitting diode wafer set with the epoxy-drawn cover glass.

3. The cover glass bonding method according to claim 2, wherein: The epoxy drawn cover glass includes a first visual alignment mark, a second visual alignment mark, a third visual alignment mark, and a fourth visual alignment mark corresponding to the first recess of the first wafer, the second recess of the second wafer, the third recess of the third wafer, and the fourth recess of the fourth wafer.

4. A cover glass bonding system, comprising: A front-end module, wherein the front-end module takes out the wafer from the wafer box; an index stage module that forms a notch-aligned wafer set by notch-aligning the first wafer, the second wafer, the third wafer, and the fourth wafer transferred from the front-end module; a first conveying module, the first conveying module taking out the notch-aligned wafer set formed in the index stage module, inverting the notch-aligned wafer set at one time, and transporting the notch-aligned wafer set and placing the notch-aligned wafer set on an upper stage vacuum component system module of a vacuum component system device; a second conveying module that carries the cover glass drawn with epoxy resin in the cover glass preparation station and arranges the cover glass to a lower stage vacuum component system module of the vacuum component system apparatus; and The vacuum component system device combines the cover glass drawn with epoxy resin and the wafer set with the notches aligned under a vacuum atmosphere, the wafer set with the notches aligned is transferred in a first direction by the first transfer module in a reversed state and arranged on the upper workbench vacuum component system module, and the cover glass drawn with epoxy resin is transferred in a direction opposite to the first direction by the second transfer module and arranged on the lower workbench vacuum component system module.

5. The cover glass bonding system according to claim 4, wherein: Each of the first wafer, the second wafer, the third wafer, and the fourth wafer has a circular shape having a diameter of 300 mm, The cover glass has a quadrilateral shape having a size of 650 mm×750 mm, and The notch-aligned wafer set and the cover glass are bonded to each other.

6. The cover glass bonding system according to claim 4, comprising: a vision module, wherein the vision module aligns the first wafer, the second wafer, the third wafer, and the fourth wafer using the first notch of the first wafer, the second notch of the second wafer, the third notch of the third wafer, and the fourth notch of the fourth wafer, respectively; as well as A control module controls the front end module, the indexing station module, the first transport module, the vacuum assembly system device, and the second transport module by electrically communicating with the vision module.

7. The cover glass bonding system according to claim 6, wherein: The front-end module comprises: an extraction robot, the extraction robot taking out the wafer from the wafer box; and a first wafer notch alignment device and a second wafer notch alignment device, the first wafer notch alignment device and the second wafer notch alignment device communicating with the control module, the first wafer notch alignment device and the second wafer notch alignment device being arranged at an end of a mechanical arm of the extraction robot, and The first wafer notch alignment device and the second wafer notch alignment device optimize the balance of the processing time of the index stage module.

8. The cover glass bonding system according to claim 7, wherein: The index stage module has a shape and size corresponding to the shape and size of the cover glass, and The index station module includes: an indexing stage that supports a first compartment, a second compartment, a third compartment, and a fourth compartment, in which the first wafer, the second wafer, the third wafer, and the fourth wafer are sequentially filled for notch alignment, and the indexing stage notifies indexes of the empty first compartment, the second compartment, the third compartment, and the fourth compartment so that the control module operates and controls the extraction robot, the first wafer notch alignment device, the second wafer notch alignment device, and the robot arm; and a stage driving unit that drives the index stage in a first type method, a second type method, a third type method, and a fourth type method for sequentially aligning and arranging the first wafer, the second wafer, the third wafer, and the fourth wafer aligned by the first wafer notch alignment device and the second wafer notch alignment device through the robot arm, and The first compartment, the second compartment, the third compartment and the fourth compartment include: a seating pin disposed at a central area of ​​each of the first compartment, the second compartment, the third compartment, and the fourth compartment to seat the first wafer, the second wafer, the third wafer, and the fourth wafer; and An index alignment mark corresponds to the first notch of the first wafer, the second notch of the second wafer, the third notch of the third wafer, and the fourth notch of the fourth wafer.

9. The cover glass bonding system according to claim 4, wherein: The first transmission module comprises: a robot arm that sucks and fixes the wafer set with the notches aligned upward; and a rotatable robot that rotates the robot arm downward to invert the notch-aligned wafer set, and The manipulator comprises: a first finger, the first finger sucking and supporting the first wafer and the second wafer; and The second finger is spaced apart from the first finger by a distance and absorbs and supports the third wafer and the fourth wafer.

10. The cover glass bonding system according to claim 6, wherein: The control module communicates with the upper stage vacuum assembly system module to confirm that the upper stage wafer table of the upper stage vacuum assembly system module is in an empty state before transferring the inverted wafer set from the first transfer module, and The robot moves the inverted wafer set forward relative to the upper stage wafer table, aligning the first wafer, the second wafer, the third wafer, and the fourth wafer of the notch-aligned wafer set with respect to each of the upper stage wafer tables, and The vacuum chuck is lowered to absorb each wafer in the wafer set with the notch aligned therewith, The robot moves upward and backward from the wafer set aligned with the notch, and When the robot moves upward and backward from the notch-aligned wafer set, the vacuum chuck is raised to control the first wafer, the second wafer, the third wafer and the fourth wafer of the notch-aligned wafer set to be arranged on the upper stage wafer table, and The vacuum suction cup moves up and down between the first finger and the second finger of the robot.

11. A vacuum assembly system device for a bonding system, the bonding system being used for a plurality of silicon-based organic light-emitting diode wafers and cover glasses, the vacuum assembly system device comprising: An upper workbench vacuum component system module, wherein the upper workbench vacuum component system module is arranged on the upper side of the vacuum component system device; as well as A lower workbench vacuum component system module, wherein the lower workbench vacuum component system module is arranged at the lower side of the vacuum component system device, Wherein, the upper workbench vacuum component system module includes: A first upper stage wafer table, a second upper stage wafer table, a third upper stage wafer table and a fourth upper stage wafer table, wherein the first wafer, the second wafer, the third wafer and the fourth wafer of the set of four wafers are respectively notched and aligned and arranged on the first upper stage wafer table, the second upper stage wafer table, the third upper stage wafer table and the fourth upper stage wafer table; A UVW alignment stage, the UVW alignment stage comprising a first UVW alignment stage, a second UVW alignment stage, a third UVW alignment stage, and a fourth UVW alignment stage connected to the first upper stage wafer stage, the second upper stage wafer stage, the third upper stage wafer stage, and the fourth upper stage wafer stage and independently performing 3-axis UVW alignment on each of the first upper stage wafer stage, the second upper stage wafer stage, the third upper stage wafer stage, and the fourth upper stage wafer stage; a vacuum chuck unit, the vacuum chuck unit comprising a first vacuum chuck, a second vacuum chuck, a third vacuum chuck and a fourth vacuum chuck for placing the first wafer, the second wafer, the third wafer and the fourth wafer on the first upper workbench wafer table, the second upper workbench wafer table, the third upper workbench wafer table and the fourth upper workbench wafer table, respectively; a vacuum suction cup driving unit, the vacuum suction cup driving unit including a first vacuum suction cup driving unit, a second vacuum suction cup driving unit, a third vacuum suction cup driving unit, and a fourth vacuum suction cup driving unit for ascending and descending the vacuum suction cup unit; and A first high-resolution vision unit, a second high-resolution vision unit, a third high-resolution vision unit, a fourth high-resolution vision unit, a fifth high-resolution vision unit, a sixth high-resolution vision unit, a seventh high-resolution vision unit and an eighth high-resolution vision unit, wherein the first high-resolution vision unit, the second high-resolution vision unit, the third high-resolution vision unit, the fourth high-resolution vision unit, the fifth high-resolution vision unit, the sixth high-resolution vision unit, the seventh high-resolution vision unit and the eighth high-resolution vision unit are provided in pairs for each of the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table, and communicate with a control module so that the UVW alignment table is adjusted in the 3-axis UVW direction.

12. The vacuum assembly system for a bonding system according to claim 11, wherein: The first upper stage wafer table, the second upper stage wafer table, the third upper stage wafer table and the fourth upper stage wafer table are arranged in an upper chamber, The UVW alignment stage is arranged outside the upper chamber, The vacuum chuck driving unit is arranged outside the UVW alignment table, The first high-resolution vision unit, the second high-resolution vision unit, the third high-resolution vision unit, the fourth high-resolution vision unit, the fifth high-resolution vision unit, the sixth high-resolution vision unit, the seventh high-resolution vision unit and the eighth high-resolution vision unit correspond to the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table, respectively, and are arranged under the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table.

13. The vacuum assembly system for a bonding system according to claim 12, wherein: The UVW alignment station comprises: a first base substrate, a second base substrate, a third base substrate, and a fourth base substrate, wherein the first base substrate, the second base substrate, the third base substrate, and the fourth base substrate are connected through a communication hole of the upper chamber; and a first UVW driver, a second UVW driver, a third UVW driver and a fourth UVW driver, wherein the first UVW driver, the second UVW driver, the third UVW driver and the fourth UVW driver correspond to the first upper worktable wafer table, the second upper worktable wafer table, the third upper worktable wafer table and the fourth upper worktable wafer table, and the first UVW driver, the second UVW driver, the third UVW driver and the fourth UVW driver drive the first base substrate, the second base substrate, the third base substrate and the fourth base substrate on three axes to compensate for the displacement of the working positions of the first base substrate, the second base substrate, the third base substrate and the fourth base substrate.

14. The vacuum assembly system for a bonding system according to claim 12, wherein: The vacuum suction cup unit of the upper workbench vacuum assembly system module includes: a vacuum chuck pad connected to each of the first upper stage wafer table, the second upper stage wafer table, the third upper stage wafer table, and the fourth upper stage wafer table; a vacuum suction cup tube, the vacuum suction cup tube providing vacuum negative pressure to the vacuum suction cup pad; and a vacuum cup tube ring housing, the vacuum cup tube ring housing preventing leakage between the bottom of the vacuum cup tube and the vacuum cup pad, and The vacuum cup pipe is at least partially connected to the vacuum cup driving unit to allow the vacuum cup pad to rise and fall to be exposed to the outside of the upper chamber.

15. The vacuum assembly system for bonding system according to claim 14, further comprising: a bellows arranged in the upper chamber to provide vacuum negative pressure to the first upper stage wafer table, the second upper stage wafer table, the third upper stage wafer table and the fourth upper stage wafer table, so as to independently drive the first upper stage wafer table, the second upper stage wafer table, the third upper stage wafer table and the fourth upper stage wafer table and the UVW alignment table; as well as an adapter connecting a lower portion of the UVW alignment stage and an upper portion of the upper chamber, and Wherein, the bellows and the adapter overlap with the first upper stage wafer table, the second upper stage wafer table, the third upper stage wafer table, the fourth upper stage wafer table and the UVW alignment table, respectively.

16. The vacuum assembly system for bonding system according to claim 14, further comprising: A second transmission module, wherein the second transmission module comprises: a first transfer hand, which transfers the cover glass to the lower stage vacuum component system module; and a second transfer hand, the second transfer hand transferring the set of the four wafers bonded to each other and the cover glass, Wherein, the first conveying hand and the second conveying hand are arranged opposite to each other and connected to a conveying channel.

17. A method for controlling a system for bonding a plurality of carrier-free silicon-based organic light-emitting diode wafers and cover glass, the method comprising: The control module controls the extraction robot to take out the wafer from the wafer box loaded in the front-end module of the combination system; controlling the index stage module to align the wafer taken out by the extraction robot using the notches of the wafer; In a case where it is determined through index communication with the index module that the first compartment, the second compartment, the third compartment, and the fourth compartment of the index station are empty, sequentially arranging the first wafer, the second wafer, the third wafer, and the fourth wafer among the wafers to form a wafer set with notches aligned; communicating with the first transfer module to take out the notch-aligned wafer set, inverting the notch-aligned wafer set at one time, and controlling the transfer and placement of the notch-aligned wafer set to the upper stage vacuum component system module of the vacuum component system device; communicating with a second transfer module and controlling the transfer and placement of the cover glass painted with epoxy resin in the cover glass preparation station to a lower station vacuum component system module of the vacuum component system apparatus; and The upper stage vacuum component system module and the lower stage vacuum component system module of the vacuum component system device are controlled to combine the notch-aligned wafer set arranged in the upper stage vacuum component system module in a reverse state in a first direction by the first conveying module and the epoxy-drawn cover glass arranged in the lower stage vacuum component system module in a second direction opposite to the first direction by the second conveying module under a vacuum atmosphere.

18. The control method of the combination system according to claim 17, further comprising: communicating with a vision module for aligning the first wafer, the second wafer, the third wafer, and the fourth wafer using a first notch of the first wafer, a second notch of the second wafer, a third notch of the third wafer, and a fourth notch of the fourth wafer, respectively; as well as The working positions of the front end module, the indexing station module, the first transport module, the vacuum component system device and the second transport module are controlled by communicating with the vision module.

19. The control method of the combination system according to claim 18, further comprising: communicating with the upper stage vacuum assembly system module and confirming that an upper stage wafer stage of the upper stage vacuum assembly system module is empty prior to transferring the inverted notch-aligned wafer set from the first transfer module; moving the inverted notch-aligned wafer set forward relative to the upper stage wafer table by a robot; aligning the first wafer, the second wafer, the third wafer, and the fourth wafer of the notch-aligned wafer set relative to each of the upper stage wafer tables; Suctioning each wafer in the notch-aligned wafer set by lowering a vacuum chuck in the upper stage vacuum assembly system module; as well as The first wafer, the second wafer, the third wafer and the fourth wafer of the notch-aligned wafer set are placed on the upper stage wafer table by moving the robot upward and backward from the notch-aligned wafer set so that the vacuum chuck of the upper stage wafer table moves upward.

20. The control method of the combination system according to claim 19, further comprising: arranging the wafers notch-aligned by the first wafer notch alignment device and the second wafer notch alignment device one by one to the first compartment, the second compartment, the third compartment, and the fourth compartment of the index stage of the index stage module; placing the wafer loaded into the index stage on seating pins which are arranged in a central area of ​​each of the first compartment, the second compartment, the third compartment, and the fourth compartment and are independently driven; driving the index stage according to a first angle drive type, a second angle drive type, a third angle drive type, and a fourth angle drive type for aligning the notches of the first wafer, the second wafer, the third wafer, and the fourth wafer, when the first compartment, the second compartment, the third compartment, and the fourth compartment are sequentially filled with the first wafer, the second wafer, the third wafer, and the fourth wafer; as well as The first wafer, the second wafer, the third wafer and the fourth wafer are aligned with the notches of the first angle drive type, the second angle drive type, the third angle drive type and the fourth angle drive type to form a set of wafers filled in the first compartment, the second compartment, the third compartment and the fourth compartment in sequence.

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