Heat dissipation module and heat dissipation system

Abstract

The application relates to the technical field of heat control in a space environment, in particular to a heat dissipation module and a heat dissipation system. The heat dissipation module comprises a body and a flow channel adapter pipe. The body comprises a transparent packaging layer and a first reflection layer. A micro flow channel is formed in the body. The first reflection layer covers the inner surface of the micro flow channel. The heat dissipation module also has a contact surface which is used for contacting a heat generating device. The micro flow channel is arranged close to the contact surface. The end of the micro flow channel is connected with the flow channel adapter pipe. The application aims to solve at least one technical problem in the prior art and provides a heat dissipation module and a heat dissipation system.

Description

Technical Field

[0001] This application relates to the field of thermal control technology in space environments, and more specifically, to a heat dissipation module and a heat dissipation system. Background Technology

[0002] Due to the high vacuum environment of outer space, spacecraft can only dissipate the heat generated inside them and the heat absorbed from outside space through radiation.

[0003] The amount of radiative heat dissipation of a spacecraft is positively correlated with the effective radiative heat dissipation area, while the amount of radiative heat dissipation per unit area is closely related to the thermal radiation properties of the thermal control coating on the radiative heat dissipation surface.

[0004] Therefore, to improve the heat dissipation capacity of spacecraft, it is necessary to increase both the effective utilization area of ​​the spacecraft's heat dissipation surface by the thermal control system and the radiative heat dissipation efficiency of the spacecraft's heat dissipation surface. For the first requirement, traditional aerospace thermal control systems typically employ methods such as pre-embedded heat pipes or fluid loops within structural plates, installation of heat pipes or fluid loops on the surface of structural plates, and the addition of heat-expanding plates to the mounting surfaces of high-power-density equipment to achieve localized heat transfer or diffusion. For the second requirement, traditional aerospace thermal control systems typically use low-absorptivity, high-emissivity thermal control coatings applied to the spacecraft's heat dissipation surface to reduce the amount of space heat absorbed and increase the radiative dissipation of waste heat. The thermal control system under the above design can be divided into two independent subsystems. In the design of spacecraft of different types, functions, application scenarios, and space conditions, the heat conduction subsystem, which plays a role in heat conduction or heat amplification, and the heat radiation subsystem, which plays a role in radiative heat dissipation, need to be designed separately and heat exchange coupling between the subsystems needs to be achieved. This type of thermal control system has low adaptability to general-purpose spacecraft platforms and makes it difficult to shorten the development cycle. Summary of the Invention

[0005] The purpose of this application is to provide a heat dissipation module and heat dissipation system to address at least one of the technical problems involved in the background art.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] One aspect of this application provides a heat dissipation module, including a body and a flow channel adapter. The body includes a transparent encapsulation layer and a first reflective layer. Microchannels are formed within the body. The first reflective layer covers the inner surface of the microchannels. The heat dissipation module also has a contact surface for contacting a heat-generating device. The microchannels are disposed close to the contact surface, and the ends of the microchannels are connected to the flow channel adapter.

[0008] Optionally, the body further includes a second reflective layer, the transparent encapsulation layer is stacked with the second reflective layer, and the second reflective layer is attached to the surface of the transparent encapsulation layer, with the contact surface formed on the side of the second reflective layer opposite to the transparent encapsulation layer.

[0009] The beneficial effect of this technical solution is that the second reflective layer is a bright metal surface, which has a strong reflective effect on solar radiation, thus reducing the absorption of solar radiation by the heat dissipation module provided in this application.

[0010] Optionally, in the cross-section of the microchannel, a portion of the microchannel is formed in the transparent encapsulation layer, and another portion of the microchannel is formed in the second reflective layer.

[0011] The beneficial effect of this technical solution is that it allows heat to be quickly transferred to the fluid working medium in the microchannel after passing through the second reflective layer without having to pass through the transparent encapsulation layer, thereby improving the efficiency of heat transfer and thus improving the heat dissipation capacity of the heat dissipation module.

[0012] Optionally, the first reflective layer and the second reflective layer are integrally formed.

[0013] The beneficial effects of this technical solution are as follows: on the one hand, it avoids the gap that may exist between the first reflective layer and the second reflective layer, so that heat can be transferred quickly in the same uniform material, thereby improving the heat dissipation capacity; on the other hand, it improves the production efficiency of the heat dissipation module provided in this application, making it easier for mass production.

[0014] Optionally, both the microchannels and the contact surfaces are formed in the transparent encapsulation layer.

[0015] The beneficial effect of this technical solution is that when the heat dissipation surface of the heat-generating equipment is a bright metal surface, there is no need to set a second reflective layer, thereby reducing costs.

[0016] Optionally, at least two non-intersecting microchannels are formed within the body.

[0017] The beneficial effect of this technical solution is that the flow direction of the working fluid in two different microchannels can be different, which facilitates the formation of a flow channel for the circulating flow of the working fluid in the microchannel, or even in a heat dissipation system with multiple heat dissipation modules.

[0018] Optionally, the contact surface is a plane, and the microchannels are parallel to each other, with each microchannel being parallel to the contact surface.

[0019] The beneficial effects of this technical solution are as follows: the contact surface is a plane, which is applicable to the surface of most heat-generating equipment; the microchannels are parallel to each other and all microchannels are parallel to the contact surface, which facilitates the standardization, mass production and mass assembly of the heat dissipation module.

[0020] Optionally, the contact surface is used for detachable connection with the heat-generating equipment.

[0021] The beneficial effects of this technical solution are as follows: it enables the heat dissipation module and the heat dissipation system using the heat dissipation module to have independent heat dissipation channels and can be decoupled from the heat-generating equipment, thereby reducing the complexity of the heat dissipation system of the heat-generating equipment (especially spacecraft) and improving the reliability and stability of the spacecraft heat dissipation system.

[0022] Another aspect of this application provides a heat dissipation system, including a micro piezoelectric pump and a heat dissipation module provided in this application, wherein the micro piezoelectric pump is connected to the heat dissipation module and is used to drive a fluid working medium to flow within the microchannel.

[0023] Optionally, the heat dissipation system provided in this application includes at least two heat dissipation modules, forming two non-intersecting microchannels within the body. One of the microchannels is a first microchannel, and the other is a second microchannel. The flow channel adapter connected to the first microchannel is a first flow channel adapter, and the flow channel adapter connected to the second microchannel is a second flow channel adapter.

[0024] Each of the first microchannels is sequentially connected via corresponding first channel adapters to enable the working fluid to circulate between the first microchannels. Each of the second microchannels is sequentially connected via corresponding second channel adapters to enable the working fluid to circulate between the second microchannels. A micro piezoelectric pump is installed on both the first and second channel adapters; or...

[0025] Each of the first microchannels is connected in sequence through a corresponding first channel adapter, and each of the second microchannels is connected in sequence through a corresponding second channel adapter. The first channel adapter and the second channel adapter are connected by a micro piezoelectric pump to form a circulation of the working fluid between each of the first microchannels and each of the second microchannels.

[0026] The technical solution provided in this application can achieve at least one of the following beneficial effects:

[0027] The heat dissipation module and system provided in this application have a transparent encapsulation layer that is transparent to visible light and has strong absorption of infrared light, thus exhibiting a high infrared emissivity. The first reflective layer has good solar radiation reflection characteristics and a low solar absorptivity, which gives the heat dissipation module a strong radiative heat dissipation capability. Flow channel adapters are installed at both ends of the microchannel, facilitating the connection of multiple heat dissipation modules into a single unit based on the structural form of the heat-generating equipment. This integrates the heat conduction and heat radiation subsystems and forms a targeted heat dissipation system, making the heat dissipation module applicable to various structural forms of heat-generating equipment (especially spacecraft structures requiring heat dissipation). It has high adaptability, and the development cycle for heat dissipation systems for different structural forms of heat-generating equipment is relatively shortened. Furthermore, the heat dissipation module provided in this application has a simple structure, making it easy to adapt to the application requirements of mass production as a standardized design.

[0028] The additional technical features and advantages of this application will become more apparent from the following description or from practical application. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the specific embodiments of this application, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 A front view structural diagram of one embodiment of the standard unit of the integrated module provided in this application;

[0031] Figure 2 A left-side view of one embodiment of the heat dissipation module provided in this application.

[0032] Figure 3 A front view structural schematic diagram of another implementation of the standard unit of the integrated module provided in the embodiments of this application;

[0033] Figure 4 A left-side structural schematic diagram of one embodiment of the heat dissipation module provided in this application, applied to a heat-generating device;

[0034] Figure 5(a) is a schematic diagram of the solar radiation reflection characteristics of the heat dissipation module provided in the embodiment of this application;

[0035] Figure 5(b) is a schematic diagram of the infrared radiation emission characteristics of the heat dissipation module provided in the embodiment of this application;

[0036] Figure 6This is a front view schematic diagram of one embodiment of the heat dissipation system provided in this application.

[0037] Figure 7 A front view schematic diagram of another embodiment of the heat dissipation system provided in this application;

[0038] Figure 8 This is a schematic diagram of one embodiment of the heat dissipation system provided in this application, applied to a heat-generating device.

[0039] In Figure 5(a), the dashed arrows represent the reflection of solar radiation, and in Figure 5(b), the dashed arrows represent the emission of infrared radiation.

[0040] Figure label:

[0041] 01. Microchannel; 02. Second reflective layer;

[0042] 03. Flow channel adapter; 04. Transparent encapsulation layer;

[0043] 05. First reflective layer; 06. Contact surface;

[0044] 07. Miniature piezoelectric pump; 08. Heat dissipation module;

[0045] 100. Heat-generating equipment. Detailed Implementation

[0046] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] like Figures 1 to 8 As shown, one aspect of this application provides a heat dissipation module 08, including a body and a flow channel adapter 03. The body includes a transparent encapsulation layer 04 and a first reflective layer 05. A microchannel 01 is formed in the body. The first reflective layer 05 covers the inner surface of the microchannel 01. The heat dissipation module 08 also has a contact surface 06 for contacting a heat-generating device 100. The microchannel 01 is disposed close to the contact surface 06, and the end of the microchannel 01 is connected to the flow channel adapter 03.

[0050] In this embodiment, the transparent encapsulation layer 04 is preferably made of transparent materials such as quartz glass or plastic, and the first reflective layer 05 is preferably made of metals with good reflective properties such as aluminum.

[0051] The heat dissipation module 08 provided in this application, when in use, makes face-to-face contact with the heat-generating device 100 (such as a spacecraft structure that needs heat dissipation) through the contact surface 06, and is connected to adjacent heat dissipation modules 08, other heat dissipation devices, or devices that drive the flow of fluid working medium through the flow channel adapter 03, so that the microchannel 01 can receive the fluid working medium and send the fluid working medium out of the microchannel 01. The fluid working medium in the microchannel 01 absorbs the heat transferred from the heat-generating device 100 and carries away the heat.

[0052] In the heat dissipation module 08 provided in this application, the transparent encapsulation layer 04 is transparent to visible light and has strong absorption of infrared light, thus possessing a high infrared emissivity. The first reflective layer 05 has good solar radiation reflection characteristics and a low solar absorptivity. Flow channel adapters 03 are installed at both ends of the microchannel 01, facilitating the connection of multiple heat dissipation modules 08 into a single unit according to the structural form of the heat-generating equipment 100 via the flow channel adapters 03. This integrates the heat conduction and heat radiation subsystems and forms a targeted heat dissipation system, making the heat dissipation module 08 applicable to various structural forms of heat-generating equipment 100 (especially spacecraft structures requiring heat dissipation). It has high adaptability, and the development cycle for heat dissipation systems for different structural forms of heat-generating equipment 100 is relatively shortened. Furthermore, the heat dissipation module 08 provided in this application has a simple structure, making it easy to adapt to the application requirements of mass production as a standardized design.

[0053] Optionally, the body further includes a second reflective layer 02, the transparent encapsulation layer 04 is stacked with the second reflective layer 02, and the second reflective layer 02 is attached to the surface of the transparent encapsulation layer 04. The contact surface 06 is formed on the side of the second reflective layer 02 facing away from the transparent encapsulation layer 04. In this embodiment, the second reflective layer 02 can be made of a metal with good reflective properties, such as aluminum. Preferably, the material of the second reflective layer 02 is the same as that of the first reflective layer 05. The second reflective layer 02 has a bright metal surface and strong reflective properties for solar radiation, thus reducing the absorption of solar radiation by the heat dissipation module 08 provided in this application. It is understood that the transparent encapsulation layer 04 is fixedly connected to the second reflective layer 02. In this embodiment, the surface of the transparent encapsulation layer 04 used to connect to the second reflective layer 02 coincides with the surface of the second reflective layer 02 used to connect to the transparent encapsulation layer 04. Of course, when the thickness of the second reflective layer 02 is large enough, in some specific cases, in addition to the side of the second reflective layer 02 facing away from the transparent encapsulation layer 04, the contact surface 06 can also be formed on other sides of the second reflective layer 02.

[0054] like Figure 2 As shown, optionally, in the cross-section of the microchannel 01, a portion of the microchannel 01 is formed in the transparent encapsulation layer 04, and another portion of the microchannel 01 is formed in the second reflective layer 02. This allows heat to be quickly transferred to the fluid working medium in the microchannel 01 after passing through the second reflective layer 02 without passing through the transparent encapsulation layer 04, improving the efficiency of heat transfer and thus improving the heat dissipation capacity of the heat dissipation module 08.

[0055] Optionally, the first reflective layer 05 and the second reflective layer 02 are integrally formed. This avoids any gaps that may exist between the first reflective layer 05 and the second reflective layer 02, allowing heat to be transferred quickly in the same uniform material, thus improving heat dissipation capacity. On the other hand, it improves the production efficiency of the heat dissipation module 08 provided in this application, facilitating mass production.

[0056] like Figure 3 and Figure 4 As shown, optionally, both the microchannel 01 and the contact surface 06 are formed on the transparent encapsulation layer 04. Thus, when the heat dissipation surface of the heat-generating device 100 is a bright metal surface, there is no need to provide a second reflective layer 02, thereby reducing costs.

[0057] Optionally, at least two non-intersecting microchannels 01 are formed within the main body. In this embodiment, two to four microchannels 01 can be formed within the main body, for example, two, three, or four microchannels 01. Preferably, two microchannels 01 are formed within the main body. This allows the flow direction of the working fluid in the two different microchannels 01 to be different (or, of course, the same), facilitating the formation of a flow channel for circulating the working fluid within the microchannels 01, or even in a heat dissipation system with multiple heat dissipation modules 08. Of course, in this embodiment, only one microchannel 01 may be formed within the transparent encapsulation layer 04.

[0058] Optionally, the contact surface 06 is planar, and the microchannels 01 are parallel to each other and all microchannels 01 are parallel to the contact surface 06. A planar contact surface 06 is suitable for most surfaces of the heat-generating equipment 100. Parallel microchannels 01 facilitate the standardization, mass production, and mass assembly of the heat dissipation module 08. Of course, the microchannels 01 do not have to intersect or be parallel; the microchannels 01 can also pass through the contact surface 06, but preferably they do not intersect with the contact surface 06. The specific shape of the contact surface 06 can be designed according to the shape of the heat dissipation surface on the heat-generating equipment 100. For example, if the heat dissipation surface is planar, the contact surface 06 can be designed as planar; if the heat dissipation surface is curved, the contact surface 06 can also be designed as a curved surface to facilitate contact with the heat dissipation surface; if the heat dissipation surface is wavy, the contact surface 06 can also be designed as a wavy surface to facilitate contact with the heat dissipation surface, and so on.

[0059] Optionally, the contact surface 06 is used for detachable connection with the heat-generating device 100. The detachable connection is preferably adhesive, for example, but not limited to, using silicone rubber. This allows the heat dissipation module 08 and the heat dissipation system employing the heat dissipation module 08 to have independent heat dissipation channels and to be decoupled from the heat-generating device 100, reducing the complexity of the heat dissipation system of the heat-generating device 100 (especially for spacecraft structures requiring heat dissipation) and improving the reliability and stability of the spacecraft heat dissipation system.

[0060] like Figures 6 to 8 As shown, another aspect of this application provides a heat dissipation system, including a micro piezoelectric pump 07 and a heat dissipation module 08 provided in the embodiments of this application. The micro piezoelectric pump 07 is connected to the heat dissipation module 08, and the micro piezoelectric pump 07 is used to drive the fluid working medium to flow in the microchannel 01.

[0061] The heat dissipation system provided in this application utilizes the heat dissipation module 08 provided in this application. The transparent encapsulation layer 04 is transparent to visible light and has strong absorption of infrared light, thus possessing a high infrared emissivity. The first reflective layer 05 has good solar radiation reflection characteristics and a low solar absorptivity, which gives the heat dissipation module 08 provided in this application a strong radiative heat dissipation capability. Flow channel adapters 03 are installed at both ends of the microchannel 01, facilitating the connection of multiple heat dissipation modules 08 into a single unit according to the structural form of the heat-generating equipment 100 via the flow channel adapters 03. This achieves the integration of heat conduction and heat radiation subsystems and the targeted formation of a corresponding heat dissipation system, making the heat dissipation module 08 applicable to various structural forms of heat-generating equipment 100 (especially spacecraft structures requiring heat dissipation). It has high adaptability, and the development cycle for heat dissipation systems for heat-generating equipment 100 with different structural forms is relatively shortened. Furthermore, the heat dissipation module 08 provided in this application has a simple structure, making it easy to adapt to the application requirements of mass production as a standardized design.

[0062] Optionally, the heat dissipation system provided in this application embodiment includes at least two heat dissipation modules 08, and two non-intersecting microchannels 01 are formed in the body. One of the microchannels 01 is a first microchannel 01, and the other microchannel 01 is a second microchannel 01. The flow channel adapter 03 connected to the first microchannel 01 is a first flow channel adapter 03, and the flow channel adapter 03 connected to the second microchannel 01 is a second flow channel adapter 03.

[0063] like Figure 6 As shown, in one embodiment of this application, each of the first microchannels 01 is sequentially connected through corresponding first channel adapters 03 to enable the working fluid to form a circulation between each of the first microchannels 01. Each of the second microchannels 01 is sequentially connected through corresponding second channel adapters 03 to enable the working fluid to form a circulation between each of the second microchannels 01. A micro piezoelectric pump 07 is installed on both the first and second channel adapters 03. That is, in the heat dissipation system provided by this application embodiment, under the action of the micro piezoelectric pump 07 installed on the first channel adapter 03, the working fluid flows sequentially through the first microchannels 01 of each heat dissipation module 08 to form a closed circulation. And under the action of the micro piezoelectric pump 07 installed on the second channel adapter 03, the working fluid flows sequentially through the second microchannels 01 of each heat dissipation module 08 to form a closed circulation.

[0064] Figure 7As shown, in another embodiment of this application, each of the first microchannels 01 is sequentially connected through each of the corresponding first channel adapters 03, and each of the second microchannels 01 is sequentially connected through each of the corresponding second channel adapters 03. The first channel adapters 03 and the second channel adapters 03 are connected by a micro piezoelectric pump 07 to form a circulating flow of the working fluid between each of the first microchannels 01 and each of the second microchannels 01. That is, in the heat dissipation system provided in this application embodiment, under the action of the micro piezoelectric pump 07, the working fluid flows sequentially through each of the first microchannels 01 and enters and flows sequentially through each of the second microchannels 01, thereby forming a circulating flow of the working fluid.

[0065] In the heat dissipation system provided in this application embodiment, the number of miniature piezoelectric pumps 07 can be specifically selected as needed. For example, the number of miniature piezoelectric pumps 07 can be 1 to 10, specifically 2, 4, 6, or 8. In this application embodiment, the number of miniature piezoelectric pumps 07 is preferably 2 or 8. Similarly, in the heat dissipation system provided in this application embodiment, the number of heat dissipation modules 08 can also be specifically selected as needed. For example, the number of heat dissipation modules 08 can be 2 to 20, specifically 4, 8, 12, or 16. In this application embodiment, the number of heat dissipation modules 08 is preferably 4 or 16. Each heat dissipation module 08 can be arranged according to the specific structure of the heat generation device 100. Preferably, each heat dissipation module 08 is arranged in an array. Figure 1 and Figure 3 As shown, this is a standard unit of an integrated module formed by connecting two heat dissipation modules 08. In this embodiment, the flow channel adapter 03 can be designed as an elastic tube, which facilitates the heat dissipation system to change its arrangement according to different heat-generating devices 100, further enhancing its applicability. When the heat dissipation pressure of one or more heat dissipation modules 08 in a local area of ​​the array composed of heat dissipation modules 08 is low, heat can be transferred to several adjacent heat dissipation modules 08 through the heat dissipation module 08 corresponding to the heat source location or through the fluid working medium in the microchannel 01, so as to dissipate heat radiation in a timely manner. When the heat dissipation pressure in a local area of ​​the array composed of heat dissipation modules 08 is high, heat can be transferred to several adjacent heat dissipation modules 08 or all heat dissipation modules 08 in the entire array through the flow of the fluid working medium in the microchannel 01, so as to dissipate heat in a parallel manner of heat conduction and heat radiation.

[0066] Of course, in the heat dissipation system provided in this application embodiment, only one heat dissipation module 08 may be provided. The first microchannel 01 and the second microchannel 01 of the heat dissipation module 08 are connected through the channel adapter pipe 03, and a micro piezoelectric pump 07 is installed to form a circulation.

[0067] When the heat dissipation module 08 provided in the embodiments of this application is provided with only one microchannel 01, if the heat dissipation system includes at least two heat dissipation modules 08, each microchannel 01 is connected through a flow channel adapter 03 and a micro piezoelectric pump 07 is installed, thereby forming a circulating flow; if the heat dissipation system includes only one heat dissipation module 08, the two ends of the microchannel 01 are connected through a flow channel adapter 03 and a micro piezoelectric pump 07 is installed, thereby forming a circulating flow.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation system, characterized in that, The device includes a micro piezoelectric pump and a heat dissipation module. The micro piezoelectric pump is connected to the heat dissipation module. The heat dissipation module includes a body and a flow channel adapter. The body includes a transparent encapsulation layer and a first reflective layer. A microchannel is formed in the body. The first reflective layer covers the inner surface of the microchannel. The heat dissipation module also has a contact surface for contacting a heat-generating device. The microchannel is located close to the contact surface. The end of the microchannel is connected to the flow channel adapter. The micro piezoelectric pump is used to drive a fluid working medium to flow in the microchannel. The body also includes a second reflective layer, the transparent encapsulation layer is stacked with the second reflective layer, and the second reflective layer is attached to the surface of the transparent encapsulation layer, and the contact surface is formed on the side of the second reflective layer away from the transparent encapsulation layer; The heat dissipation system includes at least two heat dissipation modules, forming two non-intersecting microchannels within the main body. One of the microchannels is a first microchannel, and the other is a second microchannel. The flow channel adapter connected to the first microchannel is a first flow channel adapter, and the flow channel adapter connected to the second microchannel is a second flow channel adapter. Each of the first microchannels is sequentially connected via corresponding first channel adapters to enable the working fluid to circulate between the first microchannels. Each of the second microchannels is sequentially connected via corresponding second channel adapters to enable the working fluid to circulate between the second microchannels. A micro piezoelectric pump is installed on both the first and second channel adapters; or... Each of the first microchannels is connected in sequence through a corresponding first channel adapter, and each of the second microchannels is connected in sequence through a corresponding second channel adapter. The first channel adapter and the second channel adapter are connected by a micro piezoelectric pump to form a circulation of the working fluid between each of the first microchannels and each of the second microchannels.

2. The heat dissipation system according to claim 1, characterized in that, In the cross-section of the microchannel, a portion of the microchannel is formed in the transparent encapsulation layer, and another portion of the microchannel is formed in the second reflective layer.

3. The heat dissipation system according to claim 2, characterized in that, The first reflective layer and the second reflective layer are integrally formed.

4. The heat dissipation system according to claim 1, characterized in that, Both the microchannels and the contact surfaces are formed in the transparent encapsulation layer.

5. The heat dissipation system according to any one of claims 1 to 4, characterized in that, The contact surface is a plane, and the microchannels are parallel to each other and each microchannel is parallel to the contact surface.

6. The heat dissipation system according to any one of claims 1 to 4, characterized in that, The contact surface is used for detachable connection with heat-generating equipment.

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