High-temperature-resistant EB curing pressure-sensitive adhesive composition and preparation method thereof

Abstract

The invention relates to the technical field of radiation curing materials, in particular to a high-temperature-resistant electron beam (EB) curing pressure-sensitive adhesive and a manufacturing method thereof. The pressure-sensitive adhesive composition is prepared from the following components in parts by mass: 30 to 70 parts of urethane acrylate, 20 to 45 parts of monofunctional (methyl) acrylate or acrylamide monomer, 2 to 5 parts of polyfunctional (methyl) acrylate monomer, 5 to 20 parts of tackifying resin and 0.5 to 5 parts of polyfunctional mercaptan. By introducing the thiol compound, the prepared pressure-sensitive adhesive has excellent high temperature resistance, and can resist 150-180 DEG C for a long time and 200 DEG C (gt; 0.5 h); and mercaptan does not chemically react with urethane acrylate, monomers and the like in the system under non-irradiation, so that the storage stability is good.

Description

Technical Field

[0001] The invention relates to the technical field of radiation curing materials, and in particular to a high temperature resistant EB curing pressure sensitive adhesive and a manufacturing method thereof. Background Art

[0002] Pressure-sensitive adhesive is a special type of adhesive, commonly known as self-adhesive adhesive. Its special stickiness allows it to adhere to various substrate surfaces under slight pressure. Pressure-sensitive adhesive is easy and quick to use. When peeled off, it will not leave residual adhesive on the surface of the adherend substrate and will not damage the adherend surface. It is widely used in various fields such as industry, medical treatment, transportation, and daily life.

[0003] Radiation curing technology mainly includes ultraviolet light (UV) curing and electron beam (EB) curing, which has the advantages of no solvent, no VOCs emission, high production efficiency, energy saving and environmental protection. Pressure-sensitive adhesive is one of its applications, which is mainly composed of oligomers, reactive diluents, photoinitiators, tackifying resins and other additives. The application fields of this technology are constantly increasing, which has promoted higher performance requirements for radiation-cured pressure-sensitive adhesives. For example, some special industries require pressure-sensitive adhesives to maintain good adhesion properties under high temperature conditions, which puts higher requirements on the high temperature resistance of radiation-cured pressure-sensitive adhesives. Although there are some high temperature resistant pressure-sensitive adhesives in the prior art, on the one hand, the high temperature resistance is not satisfactory, and on the other hand, there are problems with storage stability.

[0004] Therefore, it is necessary to develop a pressure-sensitive adhesive composition with better comprehensive performance. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a high temperature resistant EB curing pressure sensitive adhesive and a preparation method thereof.

[0006] The high temperature resistant EB curing pressure sensitive adhesive of the present invention is mainly achieved by adding a multifunctional thiol compound to the pressure sensitive adhesive system to increase the curing degree and crosslinking degree of the EB curing pressure sensitive adhesive, and no epoxy compound and photobase generator are needed to be added in this scheme, and the high temperature resistance is excellent, and the storage stability is excellent. The specific scheme is as follows:

[0007] The first aspect of the present invention is to provide a high temperature resistant EB curing pressure sensitive adhesive composition, comprising the following raw materials in parts by weight:

[0008]

[0009] In some preferred embodiments, the high temperature resistant EB curing pressure sensitive adhesive composition comprises the following raw materials in parts by weight:

[0010]

[0011]

[0012] Furthermore, the polyurethane acrylate is a polyurethane acrylate containing 1 to 3 photosensitive group functionalities. The photosensitive group is a (meth)acrylate group;

[0013] Preferably, the polyurethane acrylate is a polyurethane acrylate containing two photosensitive groups; the polyurethane acrylate may be a mixture of one or more types.

[0014] In some preferred embodiments, the polyurethane acrylate is selected from one or more of CN8881NS, CN 9782, CN 8887NS, CN 8888NS, CN 8895NS, CN 9021 produced by Sartomer and 61329, 61362, 61363, 61365, 61369, DR-U249, DR-U299, DR-U384 produced by Changxing Materials Company.

[0015] Further, the polyfunctional thiol is a thiol compound having 2 or more -SH groups; preferably 1,6-hexanedithiol, bis(3-mercaptopropionic acid)ethylene glycol, trimethylolpropane tris(3-mercaptopropionate), tetrakis(3-mercaptopropionic acid)pentaerythritol ester; more preferably bis(3-mercaptopropionic acid)ethylene glycol, trimethylolpropane tris(3-mercaptopropionate).

[0016] Furthermore, the monofunctional (meth)acrylate monomer is a monomer containing only one (meth)acrylate group. Furthermore, the monofunctional (meth)acrylate monomer is a mixture of a soft monomer with a lower homopolymer glass transition temperature and a hard monomer with a higher homopolymer glass transition temperature.

[0017] In some embodiments, the monofunctional (meth)acrylate monomer is a mixture of a soft monomer and a hard monomer.

[0018] Further, the soft monomer is selected from one or a combination of n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, deca-(meth)acrylate, lauryl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofuran (meth)acrylate, benzyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, and ethoxyethoxyethyl acrylate;

[0019] Furthermore, the hard monomer is selected from one or a combination of isobornyl (meth)acrylate, cyclotrimethylolpropane formal (meth)acrylate, acrylamide, and N,N-dimethylacrylamide.

[0020] Furthermore, the multifunctional (meth)acrylate monomer is a monomer containing two or more (meth)acrylate groups.

[0021] In some embodiments of the present invention, the multifunctional (meth)acrylate monomer is selected from 1,6-hexanediol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate or a combination thereof;

[0022] Furthermore, the tackifying resin is terpene resin, rosin resin, petroleum resin or other synthetic resins.

[0023] In some preferred embodiments, the tackifying resin is rosin resin or modified rosin resin.

[0024] Furthermore, the preparation method of the pressure-sensitive adhesive is as follows: 30 to 70 parts of polyurethane acrylate, 20 to 45 parts of monofunctional (meth)acrylate monomer, 2 to 5 parts of multifunctional (meth)acrylate monomer, 5 to 20 parts of tackifying resin, and 0.5 to 5 parts of multifunctional thiol compound are mixed and stirred and dispersed evenly to obtain the high temperature resistant EB curing pressure-sensitive adhesive.

[0025] The second aspect of the present invention is to provide a high temperature resistant pressure sensitive adhesive film prepared from the high temperature resistant EB curing pressure sensitive adhesive composition. The high temperature resistant EB curing pressure sensitive adhesive film can withstand 150-180°C for a long time and 200°C for a short time (>0.5h).

[0026] The third aspect of the present invention provides a method for preparing a high temperature resistant pressure sensitive adhesive film, the preparation method comprising the steps of:

[0027] S1. The pressure-sensitive adhesive composition is coated on the corona-treated substrate film to obtain a wet film;

[0028] S2. The wet film obtained in S1 is then subjected to EB curing to obtain a high temperature resistant pressure sensitive adhesive film.

[0029] Further, the wet film thickness in step S1 is preferably 20 to 200 μm, more preferably 30 to 90 μm;

[0030] Further, the EB curing conditions in step S2 are preferably 80-200 kV, 30-200 kGy, more preferably 100-150 kV, 50-150 kGy;

[0031] Furthermore, the substrate film is selected from films with good high temperature resistance, preferably PET film, PI film, more preferably PI film;

[0032] Furthermore, the coating tool is a wire rod or a pressure roller.

[0033] Another aspect of the present application provides applications of the high temperature resistant EB curing pressure sensitive adhesive composition in the fields of electronic components, automobiles, aerospace, etc.

[0034] Beneficial effects:

[0035] (1) The pressure-sensitive adhesive prepared by the present invention can further promote the curing degree and cross-linking degree of the pressure-sensitive adhesive under EB irradiation by adding a multifunctional thiol compound, thereby greatly improving the high temperature resistance of the EB-cured pressure-sensitive adhesive. The prepared pressure-sensitive adhesive can withstand 150-180°C for a long time and 200°C for a short time (>0.5h);

[0036] (2) The thiol compound in the pressure-sensitive adhesive composition system prepared by the present invention is difficult to react chemically with other components in the system when stored in the dark, and has excellent storage stability. The viscosity change before and after storage at 50°C for 180 days is very small, indicating that the glue of the present invention has good storage stability. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Performance testing method:

[0039] (1) 180° peel force test

[0040] Test equipment: Tensile tester or similar instrument, whose fixture can peel off pressure-sensitive materials at 180°, peeling speed 300mm / min, accuracy ±2%, test plate made of stainless steel with smooth surface. A standard pressure roller (2kg);

[0041] Test sample: Take a test strip from the prepared pressure-sensitive adhesive, with a width of 25 mm; at least 200 mm long along the instrument direction, with a clean and straight cut. At least 3 strips of each material should be taken for testing;

[0042] Test conditions: temperature 23℃±2℃, 50%RH±5%RH;

[0043] Test steps: Place the pressure-sensitive adhesive test strip with the adhesive side facing down, and apply the strip to the clean test board with slight finger pressure. Use a pressure roller to press back and forth twice at a speed of about 500mm / second to make the adhesive surface closely contact the test board. After the test strip is applied, leave it for 20 minutes before testing again. Adjust the peeling angle to 180°, set the speed to 300mm / min, and start the test;

[0044] Test results: The peel force is expressed in N / 25mm, and the average value is taken for each test strip.

[0045] (2) High temperature adhesion test

[0046] Test equipment: high temperature adhesion test box;

[0047] Test sample: Take a test strip from the prepared pressure-sensitive adhesive, with a width of 25 mm; at least 200 mm long along the instrument direction, with a clean and straight cut. At least 3 strips of each material should be taken for testing;

[0048] Test steps: Place the pressure-sensitive adhesive test strip with the adhesive side facing down, and apply the strip to the clean test board with slight finger pressure. The adhesive area is 25mm×25mm. Use a pressure roller to press back and forth twice at a speed of about 500mm / second to make the adhesive surface closely contact with the test board. After the test strip is attached, place it at room temperature for 20 minutes, then put it in a high-temperature adhesive test box, and hang a hook weight of 1kg under the strip. The test temperature is 150℃.

[0049] Test results: High temperature adhesion is the hanging time before the pressure-sensitive adhesive falls off, unit: h.

[0050] (3) High temperature resistance test

[0051] Test equipment: oven;

[0052] Test sample: Take a test strip from the prepared pressure-sensitive adhesive, with a width of 25 mm; at least 200 mm long along the instrument direction, with a clean and straight cut. At least 3 strips of each material should be taken for testing;

[0053] Test steps: Place the pressure-sensitive adhesive test strip with the adhesive side facing down, and apply the strip to the clean test board with slight finger pressure. Use a pressure roller to press back and forth twice at a speed of about 500 mm / second to make the adhesive surface closely contact the test board. After the test strip is attached, let it stand for 20 minutes and then put it in the oven. The test temperature is 150-200℃. After baking for a while, take out the test sample, tear off the adhesive strip after cooling, and observe whether there is any residual adhesive or ghost image left on the test steel plate;

[0054] Test results: Record the placement time at different test temperatures and whether residual glue or ghost images are left.

[0055] (3) Storage stability test

[0056] Testing instrument: lamina viscometer;

[0057] Test sample: uncured pressure-sensitive adhesive;

[0058] Test method: Take the uncured pressure-sensitive adhesive before and after storage and test it on the lamina viscometer. The test temperature is 25℃. Select the appropriate test range. Test each sample 3 times and take the average value of the results.

[0059] Test results: record the viscosity change of the glue before and after storage, unit: cps@25℃.

[0060] The present invention is described in detail below; the raw materials and the amounts of raw materials used in each embodiment are shown in Table 1.

[0061] Table 1 Distribution ratio of each group in the embodiments and comparative examples

[0062]

[0063] Example 1

[0064] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0065] 30 parts of difunctional polyurethane acrylate (61363), 25 parts of isobornyl acrylate (IBOA), 20 parts of 2-ethylhexyl acrylate (2-EHA), 5 parts of 1,6-hexanediol diacrylate (HDDA), 20 parts of modified rosin resin, and 2 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0066] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0067] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0068] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0069] Example 2

[0070] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0071] 50 parts of difunctional polyurethane acrylate (61363), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 5 parts of 1,6-hexanediol diacrylate (HDDA), 10 parts of modified rosin resin, and 2 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0072] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0073] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0074] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0075] Example 3

[0076] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0077] 70 parts of difunctional polyurethane acrylate (61363), 10 parts of isobornyl acrylate (IBOA), 10 parts of 2-ethylhexyl acrylate (2-EHA), 5 parts of 1,6-hexanediol diacrylate (HDDA), 5 parts of modified rosin resin, and 2 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0078] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0079] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0080] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0081] Example 4

[0082] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0083] 50 parts of difunctional polyurethane acrylate (CN 8887NS), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 5 parts of 1,6-hexanediol diacrylate (HDDA), 10 parts of modified rosin resin, and 2 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was prepared.

[0084] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0085] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0086] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0087] Example 5

[0088] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0089] 50 parts of difunctional polyurethane acrylate (61363), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 5 parts of 1,6-hexanediol diacrylate (HDDA), 10 parts of modified rosin resin, and 0.5 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0090] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0091] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0092] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0093] Example 6

[0094] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0095] 50 parts of difunctional polyurethane acrylate (61363), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 5 parts of 1,6-hexanediol diacrylate (HDDA), 10 parts of modified rosin resin, and 5 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0096] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0097] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0098] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0099] Example 7

[0100] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0101] 50 parts of difunctional polyurethane acrylate (61363), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 2 parts of 1,6-hexanediol diacrylate (HDDA), 10 parts of modified rosin resin, and 2 parts of trimethylolpropane tris(3-mercaptopropionate) were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0102] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0103] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0104] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0105] Comparative Example 1

[0106] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0107] 50 parts of difunctional polyurethane acrylate (61363), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 2 parts of 1,6-hexanediol diacrylate (HDDA), and 10 parts of modified rosin resin were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was obtained.

[0108] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0109] S1: First, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm, and a transparent PET release film is covered on the surface to isolate the air;

[0110] S2: The PI film containing the liquid coating is then placed in a crawler-type EB curing device for radiation curing (EB irradiation energy 1000mJ / cm 2 ), thereby obtaining a high temperature resistant EB curing pressure sensitive adhesive.

[0111] Comparative Example 2

[0112] A high temperature resistant EB curing pressure sensitive adhesive, the preparation method of which comprises the following steps:

[0113] 50 parts of difunctional polyurethane acrylate (CN 8887NS), 20 parts of isobornyl acrylate (IBOA), 15 parts of 2-ethylhexyl acrylate (2-EHA), 2 parts of 1,6-hexanediol diacrylate (HDDA), and 10 parts of modified rosin resin were mixed, and stirred and dispersed at a speed of 2000 rpm for 30 minutes using a disperser; the high temperature resistant EB curing pressure-sensitive adhesive composition was prepared.

[0114] A method for preparing a high temperature resistant EB curing pressure sensitive adhesive comprises the following steps:

[0115] S1: firstly, a high temperature resistant EB curing pressure sensitive adhesive composition is coated on the PI film using a wire rod to form a liquid coating with a thickness of 60 μm;

[0116] S2: The PI film containing the liquid coating is then placed in a track-type EB curing device for radiation curing (EB curing conditions are voltage 150 kV, dose 60 kGy), thereby obtaining a high temperature resistant EB cured pressure sensitive adhesive.

[0117] Performance test results:

[0118] The pressure-sensitive adhesive tapes obtained in Examples 1 to 7 of the present invention and Comparative Examples 1 to 2 were tested for 180° peel strength, high temperature holding force, high temperature resistance, and storage stability. The test results are shown in Table 2.

[0119] Table 2 Performance test of embodiments and comparative examples

[0120]

[0121] Note: ○ means there is no residual glue or ghost on the steel plate. ● represents leaving a ghost image on the steel plate, and ● represents leaving residual glue on the steel plate.

[0122] From the test results in Table 2, it can be seen that the peel strength of the pressure-sensitive adhesives prepared in Examples 1 to 7 of the present invention is 3.6 to 10.4 N / 25 mm, and has good adhesive properties; the high temperature holding force at 140°C can reach more than 100 hours. Among them, Examples 2 to 4, 6, and 8 show the best high temperature resistance, and no residual adhesive and ghosting appear at 150°C for 6 hours, 180°C for 2 hours, and 200°C for 0.5 hours.

[0123] The high temperature holding force of Comparative Examples 1 and 2 was less than 100h, and all high temperature resistant tests showed residual glue, which was caused by insufficient curing and crosslinking due to the lack of polyfunctional thiol compounds added to the system. The viscosity of the glue in the embodiment changed little before and after storage at 50°C for 180 days, indicating that the glue of the present invention has good storage stability.

[0124] The invention provides a radiation-curable pressure-sensitive adhesive composition. The prepared pressure-sensitive adhesive has excellent high temperature resistance and can withstand 150-180°C for a long time and 200°C for a short time (>0.5h). The composition system does not undergo chemical reaction under non-irradiation and has good storage stability.

[0125] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the claims.

Claims

1. A high temperature resistant EB curing pressure sensitive adhesive composition, characterized in that: The invention comprises the following raw materials in parts by weight:

2. The high temperature resistant EB curing pressure sensitive adhesive composition according to claim 1, characterized in that: The polyurethane acrylate is a polyurethane acrylate containing two photosensitive groups; And / or, the polyfunctional thiol is a thiol compound having 2 or more -SH groups.

3. The high temperature resistant EB curing pressure sensitive adhesive composition according to claim 2, characterized in that: The multifunctional thiol is selected from 1,6-hexanedithiol, bis(3-mercaptopropionic acid)ethylene glycol, trimethylolpropane tris(3-mercaptopropionate), and pentaerythritol tetrakis(3-mercaptopropionic acid).

4. The high temperature resistant EB curing pressure sensitive adhesive composition according to claim 1, characterized in that: The monofunctional (meth)acrylate monomer is a mixture of a soft monomer and a hard monomer; The soft monomer is selected from one or a combination of n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, deca-(meth)acrylate, lauryl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofuran (meth)acrylate, benzyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, and ethoxyethoxyethyl acrylate; The hard monomer is selected from one or a combination of isobornyl (meth)acrylate, cyclotrimethylolpropane methylal (meth)acrylate, acrylamide, and N,N-dimethylacrylamide.

5. The high temperature resistant EB curing pressure sensitive adhesive composition according to claim 1, characterized in that: The multifunctional (meth)acrylate monomer is selected from one or a combination of 1,6-hexanediol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

6. The high temperature resistant EB curing pressure sensitive adhesive composition according to claim 1, characterized in that: The tackifying resin includes but is not limited to terpene resin, rosin resin, and petroleum resin.

7. A high temperature resistant pressure-sensitive adhesive film prepared from the high temperature resistant EB curing pressure-sensitive adhesive composition according to any one of claims 1 to 6.

8. The method for preparing a high temperature resistant pressure sensitive adhesive film according to claim 7, characterized in that: Includes steps: S1. The pressure-sensitive adhesive composition is coated on the corona-treated substrate film to obtain a wet film; S2. The wet film obtained in S1 is then subjected to EB curing to obtain a high temperature resistant pressure sensitive adhesive film.

9. The method for preparing a high temperature resistant pressure sensitive adhesive film according to claim 8, characterized in that: The curing conditions in step S2 are voltage 80-200 kV and dosage 30-200 kGy.

10. Application of the high temperature resistant EB curing pressure sensitive adhesive composition according to any one of claims 1 to 6 in the fields of electronic components, automobiles, and aerospace.

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