Bolt, semiconductor device and bolt manufacturing method

By designing bolts for seals with shape memory function, the problem of poor film thickness uniformity caused by vacuum bolts in semiconductor equipment is solved, and better sealing effect and film quality are achieved.

CN119467511APending Publication Date: 2025-02-18PIOTECH (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202411659704.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-19
Publication Date
2025-02-18

AI Technical Summary

Technical Problem

In semiconductor process equipment, the hollow structure of vacuum bolts and the hexagonal grooves cause chemical gas to produce vortex at the threads, which cannot be completely purged, resulting in poor uniformity of film thickness on the wafer.

Method used

A bolt including a bolt body, an elastic member and a seal is designed. The seal has a shape memory function and expands when the temperature rises to closely match the bolt grooves to prevent gas from entering; and restores to the initial state when the temperature falls, making it convenient for disassembly.

Benefits of technology

Effectively prevent gas from entering the bolt gap during the coating process, reduce airflow disturbance affecting the film quality, and prevent particle pollution caused by the deposit of film in the gap, and improve film thickness uniformity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a bolt, semiconductor equipment and a manufacturing method of the bolt, the bolt comprises a bolt body, an elastic piece and a sealing piece, one end of the elastic piece is inserted into the bolt body, and the other end of the elastic piece is matched with the sealing piece; the sealing piece has a first state in clearance fit with the groove of the bolt body and a second state in close fit with the groove of the bolt body. In the invention, the sealing element has two states. In the first state, the sealing piece is in clearance fit with the groove of the bolt body, namely, a gap is formed between the sealing piece and the inner wall of the groove, and in the state, the bolt can be mounted or dismounted only by clamping a dismounting tool in the gap. In the second state, the groove of the bolt body is in close fit, that is, no gap exists between the sealing piece and the inner wall of the groove, the sealing effect is achieved, at the moment, it can be prevented that in the coating technological process, gas enters a bolt gap, airflow disturbance is caused, the film quality is influenced, and particle pollution caused by film deposition in the gap can be prevented.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a bolt, a semiconductor equipment and a method for manufacturing the bolt. Background Art

[0002] In existing semiconductor process equipment, such as atomic layer deposition equipment, vacuum bolts are often used to fix the main components such as the shower plate in the vacuum chamber, so as to facilitate the rapid discharge of air from the threaded holes and bottom holes during vacuum pumping. In addition, in order to facilitate disassembly and assembly, cylindrical bolt heads with hexagonal grooves are generally used, and hexagonal wrenches are used to disassemble and assemble the screws. This disassembly method requires a hexagonal groove to be reserved at the end of the vacuum bolt to facilitate cooperation with the hexagonal wrench.

[0003] However, semiconductor process equipment usually has a large air intake. The vacuum bolts used in key locations, especially the shower plate, have a hollow structure and a relatively large hexagonal groove. The chemical gas entering the chamber will generate eddy currents in the grooves or hollow pores of the bolts during the process. Especially under the process requirements of extremely short cycle time, the chemical gas cannot be completely purged. Therefore, the area of ​​the vacuum bolts near the shower plate above the wafer will bring about process non-uniformity, resulting in the film on the wafer being thicker at the bolt position than at other positions, showing poor thickness uniformity. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a bolt, a semiconductor device and a method for manufacturing the bolt, which solves the technical problem of poor film thickness uniformity caused by the hollow structure and hexagonal groove of the bolts in traditional semiconductor devices.

[0005] In order to solve the above problems, according to one aspect of the present application, an embodiment of the present invention provides a bolt, which includes a bolt body, an elastic member and a sealing member, one end of the elastic member is inserted into the bolt body, and the other end of the elastic member cooperates with the sealing member located at the groove of the bolt body; and the sealing member has a first state in which it is gap-fitted with the groove of the bolt body and a second state in which it is tightly fit with the groove of the bolt body.

[0006] In some embodiments, the seal is made of shape memory alloy, which can expand after the temperature rises to fit tightly with the groove of the bolt body, and can also return to an initial state after the temperature drops to fit loosely with the groove of the bolt body.

[0007] In some embodiments, the expansion coefficient of the shape memory alloy is greater than the expansion coefficient of the bolt body.

[0008] In some embodiments, the bolt body includes a hollow section and a solid section that are connected, and an inner wall of the hollow section has a first thread that cooperates with the elastic member.

[0009] In some embodiments, the elastic member is a spring, and one end of the spring cooperates with the first thread.

[0010] In some embodiments, the seal has a second thread therein, and the other end of the spring cooperates with the second thread.

[0011] In some embodiments, when the spring is in a released state, the sum of the length of the spring and the length of the seal is the same as the length of the hollow section.

[0012] In some embodiments, the bolt body has a guide shaft inside, and the spring can be sleeved on the guide shaft.

[0013] In some embodiments, a diameter of the groove at a portion away from the solid section is smaller than a diameter of the groove at a portion close to the solid section; wherein the seal is disposed at the portion away from the solid section.

[0014] According to another aspect of the present application, an embodiment of the present invention provides a semiconductor device, which includes a shower plate and the above-mentioned bolts, and the shower plate is fixed in a cavity of the semiconductor device by the bolts.

[0015] According to another aspect of the present application, an embodiment of the present invention provides a method for manufacturing a bolt, which is used to manufacture the above-mentioned bolt, and the manufacturing method includes:

[0016] S1, assemble the bolt body, the elastic member and the sealing member together;

[0017] S2, inserting a temporary mandrel into the bolt body through the tail of the bolt body, and when the bottom of the temporary mandrel presses against the seal, processing the head of the bolt body so that the surface of the seal is flush with the surface of the bolt body when the elastic member is in a natural state;

[0018] S3, remove the temporary mandrel and complete the production of the bolt.

[0019] In some embodiments, the step of assembling the bolt body, the elastic member and the sealing member together in S1 includes:

[0020] S11, processing the bolt body and the seal, and reserving solder at the bottom of the groove of the bolt body;

[0021] S12, assembling the elastic member and the sealing member together and installing them into the bolt groove of the bolt body;

[0022] S13, welding the tail of the elastic member to the bottom of the bolt groove through the reserved solder.

[0023] Compared with the prior art, the bolt of the present invention has at least the following beneficial effects:

[0024] The bolt provided by the present invention comprises a bolt body, an elastic member and a sealing member, one end of the elastic member is inserted into the bolt body, and the other end of the elastic member cooperates with the sealing member located at the groove of the bolt body; and the sealing member has a first state of gap cooperation with the groove of the bolt body and a second state of tight cooperation with the groove of the bolt body.

[0025] In the present invention, the seal has two states. In the first state, the seal has a clearance fit with the groove of the bolt body, that is, there is a gap between the seal and the inner wall of the groove. In this state, the bolt can be installed or disassembled, and only the disassembly tool needs to be stuck in the gap. In the second state, the groove of the bolt body is tightly matched, that is, there is no gap between the seal and the inner wall of the groove, and a sealing effect is achieved. At this time, it can prevent gas from entering the bolt gap during the coating process, causing airflow disturbances that affect the quality of the film, and can prevent particle contamination caused by the deposition of film in the gap.

[0026] The semiconductor device provided by the present invention is designed based on the above-mentioned bolts, and its beneficial effects refer to the beneficial effects of the above-mentioned bolts, which will not be described in detail here.

[0027] The manufacturing method of the bolt provided by the present invention is designed based on the above-mentioned bolt, and its beneficial effects refer to the beneficial effects of the above-mentioned bolt. In addition, when processing the head of the bolt body, the manufacturing method uses a temporary core rod to support the seal and process the head of the bolt body, so that the surface of the seal is flush with the surface of the bolt body when the elastic part is in a natural state.

[0028] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0030] Figure 1 is a cross-sectional view of a bolt in a first state provided by an embodiment of the present invention;

[0031] Figure 2 is a cross-sectional view of a bolt in a second state provided by an embodiment of the present invention;

[0032] Figure 3 is a schematic diagram of bolt assembly provided by an embodiment of the present invention;

[0033] Figure 4 It is a schematic diagram of a bolt provided by an embodiment of the present invention being fixed to a spray plate during use and being removed from the spray plate;

[0034] Figure 5 It is a structural schematic diagram of a bolt body in a bolt provided by an embodiment of the present invention;

[0035] Figure 6 is a top view of a bolt in a first state provided by an embodiment of the present invention;

[0036] Figure 7 is a top view of a bolt in a second state provided by an embodiment of the present invention;

[0037] Figure 8 is a front view of a bolt provided by an embodiment of the present invention;

[0038] Fig. 9 yes Figure 8 Cross-sectional view along AA direction;

[0039] Fig.10 It is a schematic diagram of the structure of the cooperation between a sealing member and an elastic member in a bolt provided by an embodiment of the present invention;

[0040] Fig.11 This is a front view of the cooperation between a sealing member and an elastic member in a bolt provided by an embodiment of the present invention;

[0041] Fig.12 is a structural schematic diagram of a sealing member in a bolt provided by an embodiment of the present invention;

[0042] Fig.13 is a cross-sectional view of a bolt manufacturing process provided by an embodiment of the present invention;

[0043] Fig.14 It is a flow chart of a method for manufacturing a bolt provided in an embodiment of the present invention.

[0044] Reference numerals:

[0045] 1. Bolt body; 11. Hollow section; 12. Solid section; 13. Guide shaft; 14. Groove; 2. Elastic member; 3. Sealing member; 4. Temporary core rod; 41. Rod-shaped body; 42. Block; 5. Disassembly tool. DETAILED DESCRIPTION

[0046] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0047] In the description of the present invention, it should be clarified that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, but are not necessarily used to describe a specific order or sequence; the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the referred device or element must have a specific direction or position, and therefore cannot be understood as a limitation on the present invention.

[0048] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Thickness uniformity is a film property that cannot be ignored in the film preparation process. Uneven thickness will lead to a decrease in the film yield. In semiconductor process equipment, key components such as the spray plate are generally installed through vacuum bolts. However, due to the hollow structure of the spray plate and the presence of the hexagonal groove, eddy currents will be generated when the air intake is large, which will make the film thicker near the vacuum bolts.

[0050] To address this problem, the bolt provided by the present invention adopts a sealing bolt design. After the bolt and the components in the vacuum chamber, such as the spray plate, are assembled, the seal can automatically return to the same height as the head of the bolt body, avoiding the formation of a bolt groove. Of course, the present invention also takes into account that if there is no groove, it will affect the disassembly of the bolt. Therefore, a shape memory alloy is used as a seal. After the cavity is heated up, the seal with shape memory function will expand and seal the groove to prevent gas from entering the gap of the bolt during the coating process, causing airflow disturbance to affect the quality of the film, and can prevent particle contamination caused by the deposited film in the gap. When the temperature drops, the seal returns to its initial state, and the groove leaks out, which can facilitate disassembly and installation.

[0051] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0052] Example 1

[0053] This embodiment provides a bolt, such as Figure 1-Figure 12 As shown, the bolt includes a bolt body 1, an elastic member 2 and a sealing member 3, one end of the elastic member 2 is inserted into the bolt body 1, and the other end of the elastic member 2 cooperates with the sealing member 3 located at the groove 14 of the bolt body 1; and the sealing member 3 has a first state of clearance cooperation with the groove 14 of the bolt body 1 and a second state of tight cooperation with the groove 14 of the bolt body 1.

[0054] One end of the bolt body 1 has a groove 14, and the seal 3 is arranged in the groove 14. In the space formed by the seal 3 and the bottom of the groove of the bolt body 1, there is an elastic part 2. During assembly, firstly, one end of the elastic part 2 is matched with the seal 3 to ensure that the seal 3 and the elastic part 2 are centered and not tilted; then use a tool, for example, when the shape of the seal 3 is hexagonal, use an Allen wrench to insert the seal 3 with the elastic part 2 installed into the bolt body 1, compress the elastic part 2, rotate the Allen wrench to tighten it to achieve installation, and loosen it to achieve disassembly. Among them, the tool refers to a tool for assembling the elastic part 2 and the bolt body 1. The tool needs to have a magnetic head so that the magnetic head and the magnetic seal 2 are attracted and fixed to each other, and the seal 3 with the elastic part 2 installed can be inserted into the bolt body 1 by rotation.

[0055] Importantly, in this embodiment, the seal 3 has two states. In the first state, the seal 3 has a clearance fit with the groove 14 of the bolt body 1, that is, there is a gap between the seal 3 and the inner wall of the groove 14. In this state, the assembled bolt can be installed with the spray plate in the vacuum chamber, and can be removed from the spray plate. In the second state, the groove 14 of the bolt body 1 is tightly fitted, that is, there is no gap between the seal 3 and the inner wall of the groove 14, and a sealing effect is achieved. At this time, it can prevent gas from entering the bolt gap during the coating process, causing airflow disturbances that affect the quality of the film, and can prevent particle contamination caused by the deposition of film in the gap.

[0056] In addition, in this embodiment, the seal 3 is a sealing sheet, which can be a hexagonal shape or other special shapes with anti-theft function, but it is necessary to ensure that the shape of the groove 14 of the bolt body 1 corresponds to it, and the size of the groove 14 should be slightly larger than the size of the sealing sheet in the first state.

[0057] In addition, the bolt body 1 is made of corrosion-resistant metal materials such as Hastelloy or 316L. Hastelloy is a nickel-based corrosion-resistant alloy, which is mainly divided into two categories: nickel-chromium alloy and nickel-chromium-molybdenum alloy, and has good corrosion resistance and thermal stability. 316L belongs to American standard austenitic stainless steel. 316L stainless steel is a molybdenum-containing stainless steel. Due to the molybdenum content in the steel, the overall performance of this steel is better than that of 310 and 304 stainless steel. 316L stainless steel also has good resistance to chloride corrosion. Therefore, the bolt body 1 made of corrosion-resistant metal materials such as Hastelloy or 316L has good performance.

[0058] In a specific embodiment, the seal 3 is made of a shape memory alloy, which can expand after the temperature rises to fit tightly with the groove 14 of the bolt body 1. Figure 2 and Figure 7 It can also return to its initial state after the temperature drops to fit the groove 14 of the bolt body 1, as shown in FIG. Figure 1 and Figure 6 shown.

[0059] In addition, in one of the embodiments, the seal 3 is made of metal with a high thermal expansion coefficient, which is much larger than the thermal expansion coefficient of the bolt material. It can maintain a small volume at low temperature (25°C) and expand in volume at the process temperature (above 300°C) to seal with the bolt head. That is to say, at above 300°C, the outer hexagonal surface of the metal sealing sheet can expand to squeeze the inner hexagonal surface of the bolt together without any gaps.

[0060] In this embodiment, when the bolt is used in a semiconductor device, such as an atomic layer deposition device, since the atomic layer deposition device needs to be heated during the process of preparing a thin film, it can cause the shape memory alloy to deform and expand, and then closely match with the groove 14 of the bolt body 1. When the bolt needs to be installed or removed, it must be when the atomic layer deposition device is not working. At this time, the temperature is reduced, and the seal 3 made of the shape memory alloy will automatically return to the original state before the deformation and expansion, that is, it is gap-matched with the groove 14 of the bolt body 1. This embodiment makes full use of the function of the shape memory alloy to achieve the blocking of the groove 14 after the cavity is heated up, to prevent the gas from entering the gap of the bolt during the coating process, causing air flow disturbance to affect the quality of the film, and to prevent particle contamination caused by the deposition of the film in the gap; at the same time, it also achieves that when the temperature is reduced, the seal 3 returns to the initial state, and the groove 14 leaks out, which can be easily disassembled and installed. In addition, when disassembling, after the spring is compressed by force, a groove for matching the disassembly tool 5 will also appear on the head of the bolt body 1.

[0061] In a specific embodiment, Figure 2-Figure 4 As shown, the bolt body 1 includes a connected hollow section 11 and a solid section 12, and the inner wall of the hollow section 11 has a first thread that cooperates with the elastic member 2; the elastic member 2 and the hollow section 11 can be matched through the first thread.

[0062] The elastic member 2 is a spring, one end of which cooperates with the first thread. In order to achieve cooperation with the elastic member 2, the hollow section 11 does not penetrate the entire axial direction of the internal hollow structure of the bolt body 1 in order to avoid the hollow section 11 being too long and destroying the structure of the entire bolt body 1, thereby affecting the stability of the bolt. In addition, a first thread is provided on the inner wall of the hollow section 11. When assembling, the spring is screwed into the first thread, which can achieve stable assembly of the spring and prevent the spring from tilting.

[0063] The seal 3 has a second thread inside, and the other end of the spring cooperates with the second thread. The seal 3 is a sheet structure, which can be a hexagonal shape, or other special shapes with anti-theft functions, which are not specifically limited here. The seal 3 has an opening at one end facing the elastic member 2, and a second thread is provided on the inner wall of the opening. The other end of the spring is screwed into the opening and cooperates with the second thread. Of course, the other end of the spring can also be directly welded to the end of the seal 3 facing the elastic member 2.

[0064] In a specific embodiment, when the spring is in a released state, the sum of the length of the spring and the length of the seal 3 is the same as the length of the hollow section 11. In the process of assembling or disassembling the bolt, the assembly tool squeezes the spring through the seal 3 to achieve tightening installation or disassembly. During installation, the tool compresses the spring through the seal 3, and the groove 14 will leak out. When the external force of the tool disappears, the spring will return the seal 3 to its initial position under the action of the restoring force. In order to avoid the seal being unable to be flush with the notch of the groove 14 in the initial position, thereby causing the end face of the bolt body 1 to have a convexity or concave, this embodiment stipulates that when the spring is in a released state, the sum of the length of the spring and the length of the seal 3 is the same as the length of the hollow section 11. That is to say, when the external force of the tool disappears, the spring is released under the action of the restoring force, and it just allows the seal to be flush with the notch of the groove 14. In this way, after the seal 3 expands due to heat, it can just block the groove 14 and will not form a convexity or concave on the end face of the bolt body 1.

[0065] In a specific embodiment, Fig. 9 As shown, the bolt body 1 has a guide shaft 13 inside, and the spring can be sleeved on the guide shaft 13. The guide shaft 13 is set in the hollow section 11 of the bolt body 1. When installing the seal 3, the spring and the seal 3 are first assembled together, and the spring is matched with the second thread in the seal 3. Then the spring is sleeved on the guide shaft 13 and installed by the installation tool. The guide shaft 13 is mainly used to support and guide the installation of the spring, ensure that the spring moves on the correct path, reduce friction and wear, and avoid spring tilting.

[0066] In a specific embodiment, the diameter of the groove 14 away from the solid section 12 is smaller than the diameter of the portion close to the solid section 12; wherein the seal 3 is arranged at the portion away from the solid section 12. For better explanation, it is assumed that the groove 14 includes a first groove and a second groove connected, and the first groove, the second groove, the hollow section 11 and the solid section 12 are connected in sequence to form the bolt body 1. Of course, the first groove, the second groove, the hollow section 11 and the solid section 12 are integrally formed and are not separated. In this embodiment, the second groove is a groove close to the hollow section 11, and the first groove is a groove away from the hollow section. This embodiment is limited to the first groove and the second groove, and the diameter of the first groove is smaller and the diameter of the second groove is slightly larger. The significance of such limitation is that when the bolt is installed or removed, the tool presses the seal 3 to the second groove, and the second groove needs to be rotated. When the seal 3 is hexagonal or other irregular shapes, the rotation requires a larger space. Therefore, in order to avoid the seal 3 being unable to rotate, the second groove needs to have a larger diameter. After the bolt is installed, the seal 3 cooperates with the first groove. If the diameter of the first groove is too large, the seal 3 may not be able to completely seal the first groove after thermal expansion. This may cause gas to enter the bolt body 1 through the first groove, causing airflow disturbance and affecting the quality of the film.

[0067] The bolt provided in this embodiment, after the bolt and the components in the vacuum chamber such as the spray plate are assembled, the sealing sheet will automatically return to the same height as the bolt head, avoiding the formation of a groove on the bolt head; and after the cavity is heated up, the sealing sheet with shape memory function will expand, further sealing the gap between the sealing sheet and the bolt, such as Figure 2 and Figure 7 As shown, it prevents gas from entering the bolt gap during the coating process, causing air flow disturbance that affects the film quality, and can prevent particle contamination caused by the deposited film in the gap; in addition, the bolt assembly method is simple, and the built-in first thread and second thread are designed to assemble the spring with the inner wall of the hollow section and the sealing plate to prevent parts from falling; when removing the bolt, the removal wrench is pressed downward along the sealing plate, the spring is compressed, and the wrench can be embedded in the wrench slot, and the bolt can be removed by rotating.

[0068] Example 2

[0069] This embodiment provides a semiconductor device, which includes a shower plate and the bolts described in Embodiment 1, wherein the shower plate is fixed in a cavity of the semiconductor device by the bolts.

[0070] The bolts provided in Example 1 can be used in semiconductor equipment to fix parts such as shower plates, and can also be used in other vacuum environments. When used in semiconductor equipment, the bolts have cylindrical heads, and the size of the cylindrical heads matches the shower plates.

[0071] Example 3

[0072] This embodiment provides a method for manufacturing a bolt, which is used to manufacture the bolt described in Embodiment 1. Fig.14 As shown, the manufacturing method comprises:

[0073] S1, assembling the bolt body 1, the elastic member 2 and the sealing member 3 together;

[0074] S2, inserting the temporary mandrel 4 into the bolt body 1 through the tail of the bolt body 1, and after the bottom of the temporary mandrel 4 presses against the seal 3, processing the head of the bolt body 1 so that the surface of the seal 3 is flush with the surface of the bolt body 1 when the elastic member 2 is in a natural state;

[0075] S3, remove the temporary mandrel 4, and complete the production of the bolt.

[0076] Among them, Fig.13 As shown, the temporary core rod 4 includes a rod-shaped body 41 and a clamping block 42. When making a bolt, firstly assemble the bolt body 1, the elastic member 2 and the sealing member 3 together, and then insert the rod-shaped body 41 into the bolt from the tail of the bolt body 1. When the clamping block 42 is clamped at the tail of the bolt body 1, it proves that the rod-shaped body 41 is in place, and it just rests on the sealing member 3. At this time, it is equivalent to completing the fixing of the sealing member 3, and the head of the bolt body 1 can be milled or other processing.

[0077] In the process of manufacturing the bolt in this embodiment, when processing the head of the bolt body 1, the temporary core rod 4 is used to support the sealing member 3 and process the head of the bolt body 1 so that the surface of the sealing member 3 is flush with the surface of the bolt body 1 when the elastic member 2 is in a natural state.

[0078] In a specific embodiment, the bolt body 1, the elastic member 2 and the sealing member 3 are assembled together in S1, including:

[0079] S11, processing the bolt body 1 and the seal 3, and reserving solder at the bottom of the groove of the bolt body 1;

[0080] S12, assembling the elastic member 2 and the sealing member 3 together and installing them into the bolt groove of the bolt body 1;

[0081] S13, welding the tail of the elastic member 2 to the bottom of the bolt groove through the reserved solder.

[0082] More specifically, in S11, the bolt body 1 and the seal 3 are machined, and solder is reserved at the bottom of the groove of the bolt body 1. In S12, when the elastic member 2 and the seal 3 are assembled, the assembly can be achieved by matching the second thread of the elastic member 2 with the seal 3, or one end of the elastic member 2 can be welded to the seal 3. In S13, the other end of the elastic member 2 is first welded to the bottom of the bolt groove by brazing or other means, and then the elastic member 2 is matched with the first thread in the hollow section.

[0083] The manufacturing method provided in this embodiment can be used to conveniently and quickly produce the required bolts, and the produced bolts can be used in semiconductor equipment to solve the technical problem of poor film thickness uniformity caused by the hollow structure and hexagonal grooves of the bolts in traditional semiconductor equipment.

[0084] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope disclosed by the present invention, and these modifications or substitutions should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A bolt, characterized in that: The bolt includes a bolt body, an elastic member and a sealing member, one end of the elastic member is inserted into the bolt body, and the other end of the elastic member cooperates with the sealing member located at the groove of the bolt body; and the sealing member has a first state of gap cooperation with the groove of the bolt body and a second state of tight cooperation with the groove of the bolt body.

2. The bolt according to claim 1, characterized in that The sealing member is made of a shape memory alloy, which can expand after the temperature rises to closely match with the groove of the bolt body, and can also return to an initial state after the temperature drops to loosely match with the groove of the bolt body.

3. The bolt according to claim 2, characterized in that: The expansion coefficient of the shape memory alloy is greater than the expansion coefficient of the bolt body.

4. The bolt according to claim 1, characterized in that The bolt body comprises a connected hollow section and a solid section, and the inner wall of the hollow section has a first thread matched with the elastic member.

5. The bolt according to claim 4, characterized in that The elastic member is a spring, and one end of the spring is matched with the first thread.

6. The bolt according to claim 5, characterized in that The sealing element has a second thread therein, and the other end of the spring is matched with the second thread.

7. The bolt according to claim 5, characterized in that When the spring is in a released state, the sum of the length of the spring and the length of the seal is the same as the length of the hollow section.

8. The bolt according to claim 5, characterized in that The bolt body has a guide shaft inside, and the spring can be sleeved on the guide shaft.

9. The bolt according to claim 5, characterized in that The diameter of the groove away from the solid section is smaller than the diameter of the groove near the solid section; wherein the sealing member is arranged at the section away from the solid section.

10. A semiconductor device, characterized in that: The semiconductor device comprises a shower plate and the bolts according to any one of claims 1 to 9, and the shower plate is fixed in a cavity of the semiconductor device by the bolts.

11. A method for manufacturing a bolt, used for manufacturing the bolt according to any one of claims 1 to 9, characterized in that: The production method comprises: S1, assemble the bolt body, the elastic member and the sealing member together; S2, inserting a temporary mandrel into the bolt body through the tail of the bolt body, and when the bottom of the temporary mandrel presses against the seal, processing the head of the bolt body so that the surface of the seal is flush with the surface of the bolt body when the elastic member is in a natural state; S3, remove the temporary mandrel and complete the production of the bolt.

12. The method for manufacturing a bolt according to claim 11, characterized in that: In S1, the bolt body, the elastic member and the sealing member are assembled together, including: S11, processing the bolt body and the seal, and reserving solder at the bottom of the groove of the bolt body; S12, assembling the elastic member and the sealing member together and installing them into the bolt groove of the bolt body; S13, welding the tail of the elastic member to the bottom of the bolt groove through the reserved solder.