Wafer baking device

Abstract

The wafer baking device comprises a first shell, a heating mechanism, a flow guide disc and a flow distribution plate, and the heating mechanism, the flow guide disc and the flow distribution plate are sequentially arranged on the first shell in the height direction of the first shell. The wafer baking device comprises a heating space located between the heating mechanism and the flow guide disc, a flow dividing space located between the flow guide disc and the flow dividing plate, and a liquid-gas separation pipeline communicated with the flow dividing space. The ventilation opening is communicated with the heating space and the flow dividing space. The gaseous solvent can be discharged in time, liquid-gas separation and collection are carried out, and the post-treatment cost of factory affairs is reduced.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a wafer baking device. Background Art

[0002] In the wafer baking process, since the wafer surface is coated with a film, the film melts and turns into a gaseous solvent during the high-temperature baking process, and a large amount of gaseous solvent is filled in the wafer baking box and needs to be discharged in time. If the gaseous solvent cannot be discharged in time and evenly, the gaseous solvent will condense and liquefy during the upward flow, and then drip down to the wafer surface, contaminating the wafer and affecting the product yield; in the existing technology, a large amount of gaseous solvent is discharged to the factory side, which will also bring great costs to the factory side for post-processing. Summary of the invention

[0003] One of the purposes of the present invention is to provide a wafer baking device to solve the technical problem of how to deal with the exhaust of gaseous solvents in the prior art.

[0004] To achieve one of the above-mentioned purposes of the invention, one embodiment of the present invention provides a wafer baking device, comprising a first shell, a heating mechanism, a guide plate and a diverter plate sequentially arranged on the first shell along its height direction, the guide plate having a ventilation hole penetrating along the height direction, the wafer baking device comprising a heating space located between the heating mechanism and the guide plate, a diverter space located between the guide plate and the diverter plate, and a liquid-gas separation pipeline connected to the diverter space, and the ventilation hole connects the heating space and the diverter space.

[0005] As a further improvement of an embodiment of the present invention, the outer periphery of the diverter plate abuts against the inner wall surface of the first shell, and the middle of the diverter plate is higher than the outer periphery.

[0006] As a further improvement of an embodiment of the present invention, the center of the diverter plate forms an angle with the plane where the outer periphery is located, and the angle ranges from 15° to 20°.

[0007] As a further improvement of an embodiment of the present invention, the diverter plate includes four inclined plates, each of which is triangular or fan-shaped.

[0008] As a further improvement of an embodiment of the present invention, the diverter plate is made of metal, and the thickness of the diverter plate is between 3-5 mm.

[0009] As a further improvement of one embodiment of the present invention, the wafer baking device includes a first air duct uniformizing plate located between the guide plate and the diverter plate along its height direction, and / or a second air duct uniformizing plate located between the heating mechanism and the guide plate.

[0010] As a further improvement of one embodiment of the present invention, the liquid-gas diversion pipeline includes a first air inlet, the guide plate includes an avoidance gap arranged on its outer periphery, and the first air inlet is connected to the avoidance gap and thus connected to the diversion space.

[0011] As a further improvement of an embodiment of the present invention, the first air inlet is arranged in the avoidance gap, the shape of the first air inlet is adapted to the shape of the avoidance gap, and the first air inlet does not exceed the surface of the guide plate upward.

[0012] As a further improvement of an embodiment of the present invention, the guide plate includes a plurality of avoidance gaps arranged at intervals, and the liquid-gas diversion pipeline includes a plurality of the first air inlets arranged in a one-to-one correspondence with the avoidance gaps.

[0013] As a further improvement of one embodiment of the present invention, the first shell includes a bottom wall arranged opposite to the top wall, the liquid-gas diversion pipeline includes a first guide pipe arranged between the bottom wall and the guide plate, the first guide pipe includes the first air inlet, and the first guide pipe is opposite to the avoidance gap.

[0014] As a further improvement of an embodiment of the present invention, a first air outlet is provided at one end of the first air guide pipe away from the first air inlet, and the first air outlet includes an inclined air guide channel.

[0015] As a further improvement of one embodiment of the present invention, the liquid-gas diversion pipeline includes a collection tank located at the bottom thereof, an intermediate pipeline connecting the collection tank and the first air inlet, and an exhaust pipeline connecting the intermediate pipeline.

[0016] Compared with the prior art, the present invention provides a wafer baking device, including a guide plate, a diverter plate and a liquid-gas separation pipeline. The guide plate is used to guide the gaseous solvent to flow into the diverter space in an orderly manner. The diverter plate is used to further guide the flow of the gaseous solvent in the diverter space to enter the liquid-gas separation pipeline, thereby preventing the gaseous solvent from dripping onto the wafer surface and performing liquid-gas separation in a timely manner, thereby reducing the processing cost of subsequent factory affairs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 1 is a perspective view of a wafer baking device according to an embodiment of the present invention.

[0018] Figure 2 FIG. 4 is a cross-sectional view of a wafer baking device according to an embodiment of the present invention.

[0019] Figure 3 Schematic diagram of the internal structure of a wafer baking device according to one embodiment of the present invention.

[0020] Figure 4It is a partial structural exploded view of a wafer baking device in one embodiment of the present invention.

[0021] Figure 5 It is a front view of a guide plate in one embodiment of the present invention.

[0022] Figure 6 Schematic diagram of a diverter plate in one embodiment of the present invention.

[0023] Figure 7 Schematic diagram of a diverter plate in another embodiment of the present invention.

[0024] Figure 8 Schematic diagram of a wafer baking device in another embodiment of the present invention.

[0025] Fig. 9 Schematic diagram of a wafer baking device in another embodiment of the present invention.

[0026] Fig.10 It is a schematic diagram showing the internal structure of a wafer baking device in another embodiment of the present invention.

[0027] Fig.11 It is a partial structural exploded view of a wafer baking device in another embodiment of the present invention.

[0028] Fig.12 It is a top view of a solar-type wind duct uniform disk in another embodiment of the present invention.

[0029] Fig.13 It is a top view of a matrix-type air duct uniform disk in another embodiment of the present invention. DETAILED DESCRIPTION

[0030] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0031] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0032] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.

[0033] See also Figure 1 , is a structural schematic diagram of a wafer baking device 100 provided in one embodiment of the present invention, including a plurality of stacked heating chambers. In a preferred embodiment, it can also be set as a single heating chamber. The present invention will be described in detail below taking a single heating chamber as an example.

[0034] In a preferred embodiment, the wafer baking device 100 includes a first shell 10 and a heating mechanism 20 disposed on the first shell 10. The wafer is placed on the heating mechanism 20 and is heated and baked by the heating mechanism 20. The colloid coated on the surface of the wafer evaporates into the air due to heat to form a gas solvent. The gas solvent flows in the first shell 10 and needs to be discharged in time.

[0035] The first housing 10 can be optionally configured as a rectangular structure or a circular structure.

[0036] Combination Figure 2 As shown, the first shell 10 includes a top wall 11 and a bottom wall 12 relative to each other, a side wall 13 located between the top wall 11 and the bottom wall 12 and connecting the top wall 11 and the bottom wall 12, and an opening is formed on one side of the first shell 10 for installing a door body 14, and the door body 14 is used to open or close the internal receiving space of the first shell 10.

[0037] In a preferred embodiment, the wafer baking device 100 includes a guide plate 30 and a diverter plate 40 sequentially arranged along the height direction thereof, and the guide plate 30 and the diverter plate 40 are located between the heating mechanism 20 and the top wall 11. The guide plate 30 has a vent 301 penetrating along the height direction, and the wafer baking device 100 includes a heating space 101 located between the heating mechanism 20 and the guide plate 30 and a diverter space 102 located between the guide plate 30 and the diverter plate 40, and the vent 301 connects the heating space and the diverter space. The gaseous solvent on the surface of the wafer flows from the heating space 101 to the diverter space 102 through the vent 301, and will not accumulate around the wafer.

[0038] Continue to combine Figure 3-4As shown, the outer periphery of the guide plate 30 abuts against the inner wall surface of the first shell 10. It can be understood that when the first shell 10 is set to a rectangular structure, the guide plate 30 is matched to be set to a rectangular shape, and when the first shell 10 is set to a circular structure, the guide plate 30 is matched to be set to a circular shape. The key point is that the outer periphery contour of the guide plate 30 is the same as the inner wall contour of the first shell 10, so as to achieve mutual abutment. In this way, if the gas solvent condenses and liquefies in the diversion space 102, it will also drip on the surface of the guide plate 30, and will not drip on the surface of the wafer.

[0039] Combination Figure 5 As shown, the surface of the guide plate 30 is preferably a smooth surface, which is conducive to the sliding of the liquid solvent on the surface.

[0040] The vent 301 of the guide plate 30 is arranged at the center thereof, and the guide plate 50 includes a guide slope 31 between the vent 301 and its outer periphery, and the vent 301 of the guide plate is higher than its outer periphery. The guide plate 30 is in a shape with a high center and a low outer periphery, so that the liquid solvent can slide toward the outer periphery of the guide plate 30.

[0041] The guide plate 30 can also be considered as a centrally symmetrical structure obtained by rotating an arc line, and the guide slope 31 has an inclined plane.

[0042] The guide slope 31 has an arc-shaped longitudinal section, and the center of the arc-shaped longitudinal section is located above the guide plate 30. The arc-shaped longitudinal section is a downward concave arc. If the center of the arc-shaped longitudinal section is located below the guide plate 30, the arc-shaped longitudinal section is an upward convex arc, which is not convenient for the liquid solvent to slide down. The center angle of the arc-shaped longitudinal section of the guide slope 31 is 20-30 degrees.

[0043] In a preferred embodiment, the outer periphery of the diverter plate 40 abuts against the inner wall surface of the first shell 10, and the outer periphery of the diverter plate 40 abuts against the inner wall surface of the first shell 10. Figure 6 As shown, it can be understood that when the first shell 10 is set to a rectangular structure, the diverter plate 40 is matched to be set to a rectangular structure, and when the first shell 10 is set to a circular structure, the diverter plate 40 is matched to be set to a circular structure. The key point is that the outer peripheral contour of the diverter plate 40 is the same as the inner wall contour of the first shell 10 to achieve mutual abutment.

[0044] The middle of the diverter plate 40 is high and the outer periphery is low, so that the gaseous solvent is diverted to the outside and the liquid solvent is guided to flow down along the wall of the diverter plate 40. Specifically, the gaseous solvent entering the diverter space 102 from the vent 301 will flow to the lower wall of the diverter plate 40. Since the diverter plate 40 does not have a vent and has a high middle and low outer periphery, the gaseous solvent flowing at the outer periphery of the diverter plate 40 is relatively dense.

[0045] The diverter plate 40 is made of metal and can store heat to prevent the gaseous solvent from liquefying when it is cooled. It can be understood that the temperature inside the first shell 10 is relatively high, and the gaseous solvent also has a relatively high temperature. The metal diverter plate 40 can quickly absorb a large amount of heat and form a heat storage plate to keep the gaseous solvent warm and prevent it from liquefying in the diverter space 102.

[0046] The thickness of the diverter plate 40 is between 3-5 mm. Ideally, the thicker the diverter plate 40 is, the better the heat storage and insulation effect is. However, the thicker the diverter plate 40 is, the heavier the diverter plate 40 will be. Considering the load-bearing capacity of the first shell 10 and the overall weight of the wafer baking device 100, the diverter plate preferably has a thickness of 3-5 mm while having heat storage performance.

[0047] The center of the diverter plate 40 forms an angle with the plane where the outer periphery is located, and the angle ranges from 15° to 20°. It has a certain diverter function and does not occupy too much space in the height direction.

[0048] In another embodiment, the diverter plate 40 may be a smooth inclined arc surface, for example, a structure similar to the guide plate 30, except that the center is not open.

[0049] In a specific embodiment, refer to Figure 6 The splitter plate 40 includes four inclined plates 41, each of which is triangular or fan-shaped. When the splitter plate 40 has a rectangular outer periphery, the inclined plates 41 are triangular, and when the splitter plate 40 has a circular outer periphery, the inclined plates 41 are fan-shaped.

[0050] In yet another embodiment, referring to Figure 7 The diverter plate 40 may also be configured as two symmetrical inclined plates according to actual needs.

[0051] In a preferred embodiment, the wafer baking device 100 includes a liquid-gas separation pipeline 50 connected to the diversion space 102, so that liquid-gas separation is performed in time to reduce the processing cost of subsequent factory affairs.

[0052] The liquid-gas diversion pipeline 50 includes a first air inlet 501 , and the guide plate 30 includes an avoidance gap 302 arranged on its outer periphery. The first air inlet 501 is connected to the avoidance gap 302 and thus connected to the diversion space 102 .

[0053] Combination Figure 2-3As shown, it can be understood that, under the premise that the first shell 10 is a regular rectangular structure or a circular structure, since the outer peripheries of the guide plate 30 and the diverter plate 40 are both in contact with the inner wall surface of the first shell 10, it can be obtained that the outer periphery of the guide plate 30 and the outer periphery of the diverter plate 40 should be parallel and aligned in the height direction. It can be seen that the avoidance gap 302 should be directly opposite to the outer periphery of the diverter plate 40. Since the outer periphery of the diverter plate 40 is relatively low, the gaseous solvent flowing around the diverter space 102 is relatively dense, and the first air inlet 501 is connected to the avoidance gap 302, so that the relatively dense gaseous solvent can be discharged first.

[0054] In a preferred embodiment, the first air inlet 501 is disposed at the avoidance gap 302 , the shape of the first air inlet 501 is adapted to the shape of the avoidance gap 302 , and the first air inlet 501 does not extend beyond the surface of the guide plate 30 upwards.

[0055] The first air inlet 501 is directly arranged in the avoidance gap 302 to connect with the diversion space 102. The avoidance gap 302 can be set to be circular or rectangular, and the first air inlet 501 is also set to be circular or rectangular accordingly, so that the two are more closely connected and seamless.

[0056] The surface of the guide plate 30 can prevent the liquid solvent from dripping onto the surface of the wafer. Because the liquid solvent falls on the surface of the guide plate 30, and since the guide plate 30 also has a low outer periphery, the outer periphery of the guide plate 30 will accumulate liquid solvent. Placing the first air inlet 501 lower than or flush with the surface of the guide plate 30 will also help to discharge the liquid solvent on the surface of the guide plate 30 in a timely manner.

[0057] In a preferred embodiment, the guide plate 30 includes a plurality of avoidance gaps 302 arranged at intervals, and the liquid-gas diversion pipeline 50 includes a plurality of the first air inlets 501 arranged in a one-to-one correspondence with the avoidance gaps 302 .

[0058] Specifically, combined Figure 3-4 When the first shell 10 is rectangular, the guide plate 30 is also rectangular, and avoidance gaps 302 are set at the four corners of the guide plate 30. The liquid-gas diversion pipeline 50 includes four first air inlets 501, which are arranged one by one corresponding to the avoidance gaps 302; when the first shell 10 is circular, the guide plate 30 is also circular, and four or more avoidance gaps 302 can also be evenly set on the outer periphery of the guide plate 30.

[0059] In a preferred embodiment, the liquid-gas diversion pipeline 50 includes a first guide pipe 51 disposed between the bottom wall 12 and the guide plate 30 , the first guide pipe 51 includes the first air inlet 501 , and the first guide pipe 51 is directly opposite to the avoidance gap 302 .

[0060] Specifically, the first air guide tube 51 can be disposed at a corner of the first housing 10, and one end of the first air guide tube 51 is formed so that the first air inlet 501 is just connected to the avoidance gap 302 of the air guide plate 30. The first air guide tube 51 can be a square tube or a round tube, and the specific selection is based on the shape of the avoidance gap 302. The other end of the first air guide tube 51 away from the first air inlet 501 is connected to the bottom wall 12.

[0061] When the first shell 10 is rectangular, the first guide tube 51 is also a square tube, and the guide plate 30 is also a rectangular structure. The first guide tube 51 is fixed to the four corners of the first shell 10 to save space.

[0062] The side surface of the first flow guide pipe 51 is provided with a first air outlet 502, which is further connected to the intermediate pipeline 52 described below to discharge the gaseous solvent out of the first shell 10. The side wall 13 of the first shell is correspondingly provided with a through groove 130 for the intermediate pipeline 52 to pass through.

[0063] The liquid-gas split pipeline 50 includes a collecting tank 53 at the bottom thereof, an intermediate pipeline 52 connecting the collecting tank 53 and the first air inlet 501 , and an exhaust pipeline 54 connecting the intermediate pipeline 52 .

[0064] The intermediate pipeline 52 is connected to the first guide pipe 51 and the collecting tank 53. The intermediate pipeline 52 is connected to the first gas outlet 502 and then to the first gas inlet 501. The end of the intermediate pipeline 52 is connected to the collecting tank 53. The collecting tank 53 is located at the bottom of the liquid-gas separation pipeline 50. The gaseous solvent gradually condenses and liquefies in the intermediate pipeline 52, and then flows downward due to gravity and gathers in the collecting tank 53.

[0065] The intermediate pipeline 52 is made of metal material with good thermal conductivity. In actual scenarios, the temperature difference between the gaseous solvent in the first shell 10 and the outside reaches more than 100°. The gaseous solvent enters the intermediate pipeline 52 and rapidly cools down and liquefies, and finally flows into the collection tank 53.

[0066] The gaseous solvent in the first shell 10 is naturally discharged due to thermal expansion, and is further assisted by the exhaust pipe 54, which helps to discharge the gaseous solvent more timely and efficiently.

[0067] Since the liquid and gas processing system of the plant service end is located at the bottom of the plant in the actual scenario, the collection tank 53 and the exhaust pipeline 54 are both arranged at the bottom of the first shell 10. In the actual application scenario, the bottom wall of the first shell 10 is fixed to the external fixing frame, and the collection tank 53 is suspended in the air, which is convenient for installation and disassembly.

[0068] The intermediate pipeline 52 includes a horizontal section pipeline 520 connected to the first flow guiding pipe 51 , and a vertical section pipeline 521 connected to the horizontal section pipeline 520 .

[0069] The first air outlet 502 includes an inclined arc-shaped guide channel, which is connected to the horizontal section pipe 520 to help the liquid solvent slide smoothly when the first air outlet 502 turns to the horizontal section pipe 520, thereby preventing the liquid solvent from accumulating in the corner.

[0070] An arc-shaped inclined guide channel is also provided between the horizontal section pipe 520 and the vertical section pipe 521 to help the liquid solvent slide smoothly when the horizontal section pipe 520 turns to the vertical section pipe 521, thereby preventing the liquid solvent from accumulating in the corner.

[0071] In one embodiment, when the wafer baking device 100 is a single heating chamber, Figure 8 In the bottommost heating chamber shown, the end of the vertical section pipe 521 is directly connected to the collection tank 53. The first flow guide pipe 51 is located inside the first shell 10, and the intermediate pipeline 52 is located outside the first shell 10. In order to extend the condensation time of the gaseous solvent, the horizontal section pipe 520 and / or the vertical section pipe 521 can also be extended.

[0072] When the wafer baking apparatus 100 comprises a plurality of heating chambers, Figure 8 As shown, it is only necessary to stack the single heating chambers and connect several vertical pipe sections 521 to each other and to connect to a collection tank 53 .

[0073] In another embodiment, when the wafer baking device 100 is a single heating chamber, Figure 3 In the bottommost heating cavity shown, the first guide pipe 51 passes downward and is connected to an extended pipe 523 . The extended pipe 523 passes through the bottom of the first shell 10 , and a collection tank 53 is arranged at the bottom of the extended pipe 523 .

[0074] In another embodiment, when the wafer baking device 100 includes a plurality of heating chambers stacked together, Figure 2-3 As shown, the two types of single heating chambers mentioned above can be stacked to form the vertical pipes 521 of the heating chambers located at the top are connected to each other and further connected to the extended pipes 523 of the heating chambers located at the bottom, thereby connecting to the collection tank 53 located at the bottom.

[0075] When the wafer baking device 100 includes a plurality of heating chambers stacked together, Figure 2 , 8As shown, the first flow guide pipe 51 located in the bottom heating chamber is connected to the upstream intermediate pipeline 52 on one hand, and is connected to the downstream collection tank 53 on the other hand. Therefore, an exhaust pipeline 54 is set in the bottom vertical section pipeline 521 or the extended pipeline 523 to prevent the gaseous solvent from flowing back from the first gas outlet 502 to the upstream horizontal section pipeline 520. Even if there is a small amount of reverse reflux, the existence of the upstream vertical section pipeline 521 will not affect the liquid-gas separation and collection.

[0076] The coordinated design of the guide plate 30 , the diverter plate 40 and the liquid-gas diverter pipeline 50 is to further prevent the gaseous solvent from liquefying and dripping and to collect the liquid solvent, thereby reducing the cost at the plant side.

[0077] In a preferred embodiment, in order to further improve the temperature uniformity of the first housing 10, the wafer baking device 100 includes a first air duct uniform plate 60 located between the guide plate 30 and the diverter plate 40 along its height direction. Figure 9-11 As shown, since the first air inlet 501 of the liquid-gas separation pipeline 50 is directly connected to the diversion space 102, in order to prevent the gas in the diversion space 102 from being directly sucked in to cause airflow turbulence and lead to uneven temperature inside the first shell 10, the first air duct uniformity plate 60 is arranged in the diversion space 102 to ensure the temperature uniformity of the diversion space 102.

[0078] In other embodiments, in order to ensure better temperature uniformity around the wafer, a second air duct uniform plate may be provided in the heating space 101, that is, between the heating mechanism 20 and the guide plate 30. The first air duct uniform plate 60 may have the same structure as the second air duct uniform plate.

[0079] As shown in Figures 12-13, the first air duct uniform plate 60 includes a matrix uniform plate 61 and a sun-type uniform plate 62. The second air duct uniform plate may also include a matrix uniform plate 61 and a sun-type uniform plate 62.

[0080] The outer periphery of the matrix-type uniform disk 61 abuts against the inner wall surface of the first shell, and the diameters of the air duct holes of the matrix-type uniform disk 61 are equal and in an array shape.

[0081] The outer periphery of the sun-type uniform disk 62 abuts against the inner wall surface of the first shell, and the sun-type uniform disk 62 has a reference position O located at the center. In the direction of diverging outward from the reference position O, the diameter of the air duct hole of the sun-type uniform disk 62 has a tendency to increase. The air duct holes of the sun-type uniform disk 62 are arranged in a straight line diverging outward from the reference position O.

[0082] In the solar-type uniform disk 62, the diameters of the air duct holes in the same circular ring are equal, and the diameters of the air duct holes in different circular rings from the inside to the outside increase successively and then remain equal. The number of air duct holes in different circular rings from the inside to the outside is the same, and the arrangement density of the air duct holes decreases from the inside to the outside.

[0083] The beneficial effects of the present invention are as follows: a diverter plate 40 is provided to divert the gaseous solvent outward and guide the liquid solvent to flow down along the wall of the diverter plate 40; the diverter plate 40 is made of metal material and acts as a heat storage plate to keep the gaseous solvent warm and prevent it from liquefying; a guide plate 30 is provided, and an avoidance gap 302 is provided on its outer peripheral edge, and the avoidance gap 302 is connected to the liquid-gas separation pipeline 50 to discharge the gaseous solvent on the periphery of the diverter space 102 in time; the first air outlet 501 is directly connected to the avoidance gap 302 and does not exceed the surface of the guide plate 30, which is conducive to the discharge of the liquid solvent through the first air outlet 501.

[0084] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.

[0085] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0086] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer baking device, comprising a first shell, a heating mechanism, a guide plate and a diverter plate arranged in sequence on the first shell along the height direction thereof, the guide plate having a vent running through the first shell along the height direction, the wafer baking device comprising a heating space between the heating mechanism and the guide plate, a diverter space between the guide plate and the diverter plate, and a liquid-gas separation pipeline connected to the diverter space, the vent connecting the heating space and the diverter space.

2. The wafer baking device according to claim 1, characterized in that: The outer periphery of the diverter plate abuts against the inner wall surface of the shell, and the middle of the diverter plate is high and the outer periphery is low.

3. The wafer baking device according to claim 1, characterized in that: The center of the diverter plate forms an angle with the plane where the outer periphery is located, and the angle ranges from 15° to 20°.

4. The wafer baking device according to claim 1, characterized in that: The diverter plate includes four inclined plates, each of which is triangular or fan-shaped.

5. The wafer baking device according to claim 1, characterized in that: The diverter plate is made of metal, and the thickness of the diverter plate is between 3-5 mm.

6. The wafer baking device according to claim 1, characterized in that: The wafer baking device comprises a first air duct uniformizing plate located between the guide plate and the diverter plate along its height direction, and / or a second air duct uniformizing plate located between the heating mechanism and the guide plate.

7. The wafer baking device according to claim 1, characterized in that: The liquid-gas diversion pipeline includes a first air inlet, the guide plate includes an avoidance gap arranged on its outer periphery, and the first air inlet is connected to the avoidance gap and thus connected to the diversion space.

8. The wafer baking device according to claim 7, characterized in that: The first air inlet is arranged at the avoidance gap, the shape of the first air inlet is adapted to the shape of the avoidance gap, and the first air inlet does not exceed the surface of the guide plate upwards.

9. The wafer baking device according to claim 7, characterized in that: The guide plate includes a plurality of avoidance gaps arranged at intervals, and the liquid-gas flow separation pipeline includes a plurality of the first air inlets arranged in one-to-one correspondence with the avoidance gaps.

10. The wafer baking device according to claim 7, characterized in that: The first shell includes a bottom wall arranged opposite to the top wall, the liquid-gas diversion pipeline includes a first guide pipe arranged between the bottom wall and the guide plate, the first guide pipe includes the first air inlet, and the first guide pipe is directly opposite to the avoidance gap.

11. The wafer baking device according to claim 10, characterized in that: A first air outlet is provided at one end of the first air guide pipe away from the first air inlet, and the first air outlet includes an inclined air guide channel.

12. The wafer baking device according to claim 7, characterized in that: The liquid-gas flow separation pipeline comprises a collection tank located at the bottom thereof, an intermediate pipeline connecting the collection tank and the first air inlet, and an exhaust pipeline connecting the intermediate pipeline.

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