Automatic riveting and detecting device for electronic detonator chip leg wire

By designing an automatic riveting and detection device for electronic detonators, the problem of inefficiency caused by excessive manual participation in the prior art is solved, and the process of electronic detonators is automated and efficient.

CN119468821APending Publication Date: 2025-02-18NEW ERA CIVIL EXPLOSIVE (LIAONING) CO LTD
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Patent Information

Application Number
CN202411840608.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-02-18

AI Technical Summary

Technical Problem

In the production process of existing electronic detonators, the combing, riveting and detection of electronic detonators pins require a lot of manual participation, resulting in low production efficiency, cumbersome process and low automation.

Method used

Design a device for automatic riveting and detection of electronic detonator chip pins, transporting the detonator assembly mold through the conveying system, and combing the electronic detonator pins using a combing mechanism, and automatically riveting the chip, and finally pre-adopting through the electronic chip module. The inspection machine conducts the inspection.

Benefits of technology

The integration and continuous process of electronic detonator processing has been achieved, manual participation has been reduced, production efficiency has been improved, and the degree of automation has been improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

An automatic riveting and detecting device for electronic detonator chip leg wires comprises an operation table, a conveying system is installed at the front end of the operation table, a detonator assembling mold is installed on the conveying system, a carding mechanism and a riveting mechanism are installed on the top of the operation table in parallel, and an operation screen is installed beside the carding mechanism and the riveting mechanism. A chip mounting mechanism is installed on the back of the operation table and arranged behind the carding mechanism, an electronic chip module pre-inspection machine is installed on the conveying system, detonator assembling molds are conveyed through the conveying system, electronic detonator leg wires arranged on the detonator assembling molds are carded through the carding mechanism in the conveying process, and the electronic detonator leg wires are arranged on the detonator assembling molds. After electronic detonator leg wires are carded, split chips are riveted and installed through the riveting mechanism and finally conveyed to the electronic chip module pre-inspection machine through the conveying system to be detected, the electronic detonator machining process is integrated, the whole process is continuous in machining, manual participation is reduced, and the production efficiency is improved.
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Description

Technical Field

[0001] This invention relates to the field of electronic detonator testing technology, and in particular to a device for automatic riveting and testing of electronic detonator chip leads. Background Technology

[0002] In the existing technology, the production process of electronic detonators requires sorting out the lead wires. After sorting out the lead wires, the next step is for workers to prepare the electronic chip. Then, the lead wires are riveted to the prepared electronic chip. At the same time, the riveted electronic detonators need to undergo continuity testing. The testing process for each group of electronic detonators cannot be handled centrally. The overall process in the existing technology is cumbersome, requires too much human intervention, and results in time-consuming and labor-intensive operations. The overall automation level of the process is low, leading to low production efficiency.

[0003] Therefore, in view of the shortcomings of the existing technology, it is necessary to provide a device for automatic riveting and detection of electronic detonator chip leads to solve the shortcomings of the existing technology. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and provide an automatic riveting and inspection device for electronic detonator chip leads. A detonator assembly mold is transported via a conveying system. During transport, a combing mechanism combs the electronic detonator leads on the assembly mold. After combing, the chip leads are riveted and installed by a riveting mechanism. Finally, the device is transported to an electronic chip module pre-inspection machine for inspection. The electronic detonator processing is integrated and continuous, reducing manual intervention and improving production efficiency.

[0005] The above-mentioned objectives of the present invention are achieved by the following technical means.

[0006] An automatic riveting and inspection device for electronic detonator chip leads is provided, including an operating table, a conveying system installed at the front end of the operating table, a detonator assembly mold installed on the conveying system, a combing mechanism and a riveting mechanism installed side by side on the top of the operating table, an operating screen installed next to the combing mechanism and the riveting mechanism, a movable track installed between the combing mechanism and the riveting mechanism, a chip mounting mechanism installed on the back of the operating table, the chip mounting mechanism is located behind the combing mechanism, and an electronic chip module pre-inspection machine is installed on the conveying system;

[0007] The conveying system includes a multiple chain conveyor, on which a combing positioning plate and a riveting positioning plate are installed in sequence. The combing positioning plate corresponds to the position of the combing mechanism. A combing positioning cylinder is installed next to the combing positioning plate. The riveting positioning plate corresponds to the riveting mechanism. Lifting cylinders are installed at the bottom of the riveting positioning plate and the combing positioning plate.

[0008] The chip mounting mechanism includes a rotating platform on which a chip mold is mounted, and a chip slitting blade is mounted above the chip mold.

[0009] Specifically, the riveting mechanism includes a riveting frame, a miniature riveting cylinder mounted on the top of the riveting frame, a riveting knife connected to the miniature riveting cylinder, and a movable track mounted on the back of the riveting knife.

[0010] Specifically, the combing mechanism includes a support frame, with combing chucks mounted side by side on the top of the support frame. The combing chucks are installed in correspondence with the combing positioning plate. A chip vacuum suction cup is provided on the back of the support frame. The chip vacuum cup is installed on the movable track and is installed in correspondence with the chip mold.

[0011] Specifically, the electronic chip module pre-inspection machine includes a pre-inspection positioning cylinder, a continuity detection probe, and a twisting cylinder. The pre-inspection positioning cylinder is installed at the bottom of the multi-chain conveyor. The continuity detection probe is set on one side of the multi-chain conveyor via a support frame and is driven by a probe pressing cylinder. The twisting cylinder is installed on the other side of the multi-chain conveyor, corresponding to the support frame. A mold pushing cylinder is installed on the twisting cylinder, and a twisting clamp is installed on the mold pushing cylinder.

[0012] Specifically, the movable track runs between the combing mechanism and the riveting mechanism, and the chip vacuum chuck installed on the movable track moves to the riveting position of the riveting knife through the movable track.

[0013] Furthermore, a transverse cylinder is installed on the outside of the riveting positioning plate, and the transverse cylinder is installed correspondingly to the riveting knife.

[0014] Specifically, the rotating platform rotates at four angles, with each angle rotating in 90° increments.

[0015] Specifically, the multiple chain conveyor is equipped with a power box for power supply.

[0016] Specifically, a mold blocking cylinder is installed at the end of the multi-chain conveyor near the electronic chip module pre-inspection machine.

[0017] This invention uses a conveying system to transport the detonator assembly mold. During the transport process, a sorting mechanism sorts the electronic detonator leads on the detonator assembly mold. After sorting, the electronic detonator leads are riveted and installed by a riveting mechanism after being cut. Finally, the mold is transported to an electronic chip module pre-inspection machine for testing. The electronic detonator processing is integrated and the entire process is continuous, reducing manual intervention and improving production efficiency. Attached Figure Description

[0018] The invention will be further described with reference to the accompanying drawings, but the contents of the drawings do not constitute any limitation on the invention.

[0019] Figure 1 This is a perspective view of a device for automatic riveting and detection of electronic detonator chip leads according to the present invention.

[0020] Figure 2 This is a front view of a device for automatic riveting and detection of electronic detonator chip leads according to the present invention.

[0021] Figure 3 This is a left view of a device for automatic riveting and detection of electronic detonator chip leads according to the present invention.

[0022] Figure 4 This is a top view of a device for automatic riveting and detection of electronic detonator chip leads according to the present invention.

[0023] Figure 5 This invention relates to a device for automatic riveting and inspection of electronic detonator chip leads. Figure 1 A magnified view of a portion of point A in the middle.

[0024] Figure 6 This invention relates to a device for automatic riveting and inspection of electronic detonator chip leads. Figure 1 A magnified view of a section at point B in the middle.

[0025] Figure 7 This invention relates to a device for automatic riveting and inspection of electronic detonator chip leads. Figure 1 A magnified view of a section at point C.

[0026] from Figures 1 to 7 Including:

[0027] 1. Control panel;

[0028] 2. Conveying system;

[0029] 3. Detonator assembly mold;

[0030] 4. Analyze the organizational structure;

[0031] 5. Riveting mechanism;

[0032] 6. Control panel;

[0033] 7. Activity track;

[0034] 8. Chip mounting mechanism;

[0035] 9. Electronic chip module pre-inspection machine;

[0036] 10. Multiple chain conveyor;

[0037] 11. Arrange the positioning plates;

[0038] 12. Rivet the positioning plate;

[0039] 13. Clean and position the cylinder;

[0040] 14. Lifting cylinder;

[0041] 15. Rotating platform;

[0042] 16. Chip molds;

[0043] 17. Chip slitting blade;

[0044] 18. Riveting bracket;

[0045] 19. Miniature riveting cylinder;

[0046] 20. Riveting knife;

[0047] 21. Support frame;

[0048] 22. Comb the chuck;

[0049] 23. Chip vacuum chuck;

[0050] 24. Pre-inspection positioning cylinder;

[0051] 25. Continuity detection probe;

[0052] 26. Twisting cylinder;

[0053] 27. Support frame;

[0054] 28. Probe pressing cylinder;

[0055] 29. The mold is pushed into the cylinder;

[0056] 30. Twist clamp;

[0057] 31. Horizontal cylinder;

[0058] 32. Power box;

[0059] 33. Mold blocking cylinder. Detailed Implementation

[0060] The present invention will be further described in conjunction with the following embodiments.

[0061] Example 1:

[0062] like Figure 1-7As shown, an automatic riveting and inspection device for electronic detonator chip leads includes an operating table 1, a conveying system 2 installed at the front end of the operating table 1, a detonator assembly mold 3 installed on the conveying system 2, a combing mechanism 4 and a riveting mechanism 5 installed side by side on the top of the operating table 1, an operating screen 6 installed next to the combing mechanism 4 and the riveting mechanism 5, a movable track 7 installed between the combing mechanism 4 and the riveting mechanism 5, a chip mounting mechanism 8 installed on the back of the operating table 1, the chip mounting mechanism 8 is located behind the combing mechanism 4, and an electronic chip module pre-inspection machine 9 is installed on the conveying system 2.

[0063] During use, the detonator assembly mold 3 is installed on the conveying system 2. The conveying system 2 transports the detonator assembly mold 3 to change its position. First, the conveying system 2 transports the detonator assembly mold 3 to the combing mechanism 4. The combing mechanism 4 combs and stretches the electronic detonator leads on the detonator assembly mold 3. After the stretching process is completed, the detonator assembly mold 3 is transported again through the conveying system 2 and sent to the riveting mechanism 5. The riveting mechanism 5 rivets the electronic chips on the electronic detonators on the detonator assembly mold 3. The processing of the electronic chips is completed manually by the chip installation mechanism 8. The electronic chips processed by the chip installation mechanism 8 can be riveted and assembled with the electronic detonators on the detonator assembly mold 3 through the riveting mechanism 5. After assembly, the detonator assembly mold 3 is conveyed through the conveying system 2 to the electronic chip module pre-inspection machine 9 for inspection. The electronic chip module pre-inspection machine 9 performs continuity and module quality inspection on the riveted products with electronic detonators. If there are any unqualified products, the system will stop and alarm to replace them.

[0064] The conveying system 2 includes a multi-chain conveyor 10, which is powered by a power box 32. A mold blocking cylinder 33 is installed at the end of the multi-chain conveyor 10 near the electronic chip module pre-inspection machine 9. A combing positioning plate 11 and a riveting positioning plate 12 are installed on the multi-chain conveyor 10 in sequence. The combing positioning plate 11 corresponds to the combing mechanism 4. A combing positioning cylinder 13 is installed next to the combing positioning plate 11. The riveting positioning plate 12 corresponds to the riveting mechanism 5. A lifting cylinder 14 is provided at the bottom of the riveting positioning plate 12 and the combing positioning plate 11. A transverse cylinder 31 is installed on the outside of the riveting positioning plate 12. The transverse cylinder 31 is installed correspondingly to the riveting knife 20.

[0065] During the operation of the conveying system 2, the multi-chain conveyor 10 is powered by the installed power box 32. When the detonator assembly mold 3 is placed on the multi-chain conveyor 10, it first passes through the combing positioning cylinder 13. At this time, the detonator assembly mold 3 corresponds to the top of the combing positioning plate 11. The lifting cylinder 14 installed at the bottom of the combing positioning plate 11 lifts the combing positioning plate 11 and cooperates with the combing mechanism 4 to comb the electronic detonator leads in the detonator assembly mold 3. After combing, the lifting cylinder 14 descends, and the multi-chain conveyor 10 continues to convey the detonator assembly mold 3. When the detonator assembly mold 3 is conveyed to the riveting positioning plate 12, the lifting cylinder 14 installed at the bottom of the riveting positioning plate 12 and the horizontal cylinder 31 operate simultaneously to push the detonator assembly mold 3 to the corresponding position of the riveting mechanism 5 for riveting and resetting of the electronic chip. Finally, the detonator assembly mold 3 is conveyed by the multi-chain conveyor 10 to the electronic chip module pre-inspection machine 9 for inspection.

[0066] The chip mounting mechanism 8 includes a rotating platform 15, which rotates at four angles, each angle being 90° increments. A chip mold 16 is mounted on the rotating platform 15, and a chip slitting blade 17 is mounted above the chip mold 16. The chip mounting mechanism 8 requires manual operation. The chip is manually mounted on the chip mold 16, and the chip slitting blade 17 cuts off the connecting parts of the electronic chip, forming an independent electronic chip. The rotating platform 15 rotates 90°, and the sliced ​​electronic chip is picked up by the chip vacuum chuck 23. The chip module spacing is adjusted by the chip vacuum chuck 23, and the chip is placed at the chip riveting position via the movable track 7.

[0067] The riveting mechanism 5 includes a riveting frame 18, a miniature riveting cylinder 19 mounted on the top of the riveting frame 18, a riveting knife 20 connected to the miniature riveting cylinder 19, and a movable track 7 mounted on the back of the riveting knife 20. The movable track 7 passes through the combing mechanism 4 and the riveting mechanism 5. The chip vacuum suction cup 23 mounted on the movable track 7 moves to the riveting position of the riveting knife 20 via the movable track 7. In the riveting mechanism 5, the riveting knife 20, driven by the miniature riveting cylinder 19, rivets the electronic detonator leads to the electronic chip module together. At the same time, during the riveting process, the position of the electronic chip is attracted by the chip vacuum suction cup 23 and adjusted by the position of the movable track 7 to correspond with the electronic detonator leads, which facilitates the riveting by the riveting knife 20 and improves the riveting efficiency.

[0068] The combing mechanism 4 includes a support frame 21. Combing chucks 22 are mounted side by side on the top of the support frame 21. The combing chucks 22 are installed in correspondence with the combing positioning plate 11. The combing chucks 22 clamp the lead wires and move horizontally backward to complete the combing of the shape and position of the electronic detonator lead wires. A chip vacuum suction cup 23 is provided on the back of the support frame 21. The chip vacuum cup is installed on the movable track 7. The chip vacuum suction cup 23 is installed in correspondence with the chip mold 16.

[0069] The electronic chip module pre-inspection machine 9 includes a pre-inspection positioning cylinder 24, a continuity detection probe 25, and a twisting cylinder 26. The pre-inspection positioning cylinder 24 is installed at the bottom of the multi-chain conveyor 10. The continuity detection probe 25 is set on one side of the multi-chain conveyor 10 through a support frame 27. The continuity detection probe 25 is driven by a probe pressing cylinder 28. The twisting cylinder 26 is installed on the other side of the multi-chain conveyor 10, corresponding to the support frame 27. A mold pushing cylinder 29 is installed on the twisting cylinder 26, and a twisting clamp 30 is installed on the mold pushing cylinder 29.

[0070] When the detonator assembly mold 3 is inspected and positioned, the bottom-mounted lifting cylinder 14 is activated, completing the secondary positioning of the detonator assembly mold 3. When the twisting cylinder 26 is in the middle position, the twisting cylinder 26 drives the twisting clamp 30 to clamp it. The twisting cylinder 26 moves back 5mm, and the corresponding twisting clamp 30 rotates counterclockwise 15 degrees. When the probe pressing cylinder 28 presses down, the continuity detection probe 25 contacts the electronic detonator, and the system performs a continuity test once, recording the test result.

[0071] When the twisting cylinder 26 extends 10mm, the corresponding twisting clamp 30 rotates 15 degrees clockwise. When the probe pressing cylinder 28 presses down, the continuity detection probe 25 contacts the electronic detonator. The system performs a continuity test once and records the test result.

[0072] Twisting cylinder 26 returns to the middle position, twisting clamp 30 opens, lifting cylinder 14 at the bottom of detonator assembly mold 3 descends, and according to the two test results, both are qualified, mold blocking cylinder 33 descends, and the mold flows to the next process. If one test is unqualified, the operation screen 6 displays the position of the unqualified chip and the system alarms. After the qualified chip is replaced manually, the mold flows to the next process.

[0073] During the production process, the detonator assembly mold 3 is conveyed by the conveying system 2. During this conveying process, the electronic detonator leads on the mold 3 are combed by the combing mechanism 4. After combing, the cut chips are riveted and installed by the riveting mechanism 5. Finally, the chips are conveyed by the conveying system 2 to the electronic chip module pre-inspection machine 9 for testing. The electronic detonator processing is integrated and continuous, reducing manual intervention and improving production efficiency.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A device for automatic riveting and detection of electronic detonator chip pins, characterized in that: It comprises an operating table, a conveying system is installed at the front end of the operating table, a detonator assembly mold is installed on the conveying system, a combing mechanism and a riveting mechanism are installed in parallel on the top of the operating table, an operating screen is installed next to the combing mechanism and the riveting mechanism, a movable track is installed between the combing mechanism and the riveting mechanism, a chip installation mechanism is installed at the back of the operating table, the chip installation mechanism is arranged behind the combing mechanism, and an electronic chip module pre-inspection machine is installed on the conveying system; The conveying system includes a multiple chain conveyor, on which a combing positioning plate and a riveting positioning plate are sequentially installed, the combing positioning plate corresponds to the position of the combing mechanism, a combing positioning cylinder is installed next to the combing positioning plate, the riveting positioning plate corresponds to the riveting mechanism, and a lifting cylinder is arranged at the bottom of the riveting positioning plate and the combing positioning plate; The chip mounting mechanism comprises a rotating platform, a chip mold is mounted on the rotating platform, and a chip cutting knife is mounted above the chip mold; The riveting mechanism comprises a riveting frame, a micro riveting cylinder is installed on the top of the riveting frame, the micro riveting cylinder is connected to a riveting knife, and the movable track is installed on the back of the riveting knife.

2. The device for automatic riveting and detection of electronic detonator chip pins according to claim 1 is characterized in that: The combing mechanism includes a support frame, combing chucks are installed in parallel on the top of the support frame, the combing chucks are installed corresponding to the combing positioning plate, a chip vacuum suction cup is arranged on the back of the support frame, the chip vacuum cup is installed on the movable track, and the chip vacuum suction cup is installed corresponding to the chip mold.

3. The device for automatic riveting and detection of electronic detonator chip pins according to claim 2 is characterized in that: The electronic chip module pre-inspection machine includes a pre-inspection positioning cylinder, a continuity detection probe and a wire twisting cylinder. The pre-inspection positioning cylinder is installed at the bottom of the multiple chain conveyor. The continuity detection probe is arranged on one side of the multiple chain conveyor through a supporting frame. The continuity detection probe is driven by a probe pressing cylinder. The wire twisting cylinder is installed on the other side of the multiple chain conveyor corresponding to the supporting frame. A mold pushing cylinder is installed on the wire twisting cylinder, and a wire twisting clamp is installed on the mold pushing cylinder.

4. The device for automatic riveting and detection of electronic detonator chip pins according to claim 3 is characterized in that: The movable track runs through the combing mechanism and the riveting mechanism, and the chip vacuum suction cup installed on the movable track moves to the riveting position of the riveting knife through the movable track.

5. The device for automatic riveting and detection of electronic detonator chip pins according to claim 4 is characterized in that: A transverse cylinder is installed outside the riveting positioning plate, and the transverse cylinder is installed corresponding to the riveting knife.

6. The device for automatic riveting and testing of electronic detonator chip pins according to claim 5, characterized in that: The rotating platform is at four angles, and each group of angles rotates at 90°.

7. The device for automatic riveting and testing of electronic detonator chip pins according to claim 6, characterized in that: The multiple chain conveyor is provided with a power box for energy supply.

8. The device for automatic riveting and testing of electronic detonator chip pins according to claim 7 is characterized in that: A mold blocking cylinder is installed at one end of the multiple chain conveyor close to the electronic chip module pre-inspection machine.