CPO packaging structure based on glass carrier plate

Abstract

The invention relates to the technical field of photoelectric packaging, and discloses a CPO packaging structure based on a glass carrier plate, the CPO packaging structure comprises the glass carrier plate, an ASIC chip, a silicon optical chip, an electronic chip, a laser element, a positioning socket and an optical fiber array, the ASIC chip, the silicon optical chip and the positioning socket are all installed on the glass carrier plate, and the electronic chip and the laser element are respectively arranged on the silicon optical chip; the ASIC chip and the electronic chip are electrically connected with the rewiring layer of the glass carrier plate, and the laser element is in light conduction with the waveguide layer of the silicon optical chip; the optical fiber array is also provided with a plug structure which is detachably connected with the positioning socket; the optical fiber array is further provided with a protruding end, the protruding end is located on the side, away from the optical fiber body, of the positioning socket, and the lower portion of the protruding end is provided with a first coupling part which is in light conduction with the optical fiber body. A second coupling part is arranged at the upper part of one side, close to the positioning socket, of the silicon optical chip, the second coupling part is in light conduction with the waveguide layer, and the first coupling part and the second coupling part are in light conduction oppositely up and down.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic packaging, and in particular to a CPO packaging structure based on a glass carrier. Background Art

[0002] Optoelectronic co-packaging, referred to as CPO, refers to the co-packaging of switch chips and silicon photonic chips on the same motherboard. As a new optoelectronic integration technology, CPO is widely used in scenarios such as data centers and artificial intelligence, and can achieve high integration, low signal attenuation and high transmission efficiency.

[0003] For example, the Chinese invention patent application with application publication number CN117250702A and application publication date 2023.12.19 discloses an optoelectronic co-packaging module and an optoelectronic co-packaging method, which specifically include an intermediate layer, a photonic integrated chip, an electronic integrated chip and an optical fiber array; the intermediate layer includes an installation groove, a redistribution layer and a redistribution waveguide layer; the photonic integrated chip is installed in the installation groove, and the photonic integrated chip includes at least one first electrical connection part and at least one optical connection part, and the optical connection part is coupled to the redistribution waveguide layer; the optical fiber array is connected to the redistribution waveguide layer by means of coupling packaging to realize optical packaging; the electronic integrated chip includes multiple second electrical connection parts, some of the second electrical connection parts are used to electrically connect to the first electrical connection parts, and another part of the second electrical connection parts are used to electrically connect to the redistribution layer to realize circuit packaging.

[0004] The prior art optoelectronic co-packaging module uses a coupling packaging method to connect the optical fiber array with the redistribution layer of the intermediate layer. However, after the optical fiber array is coupled and packaged, the optical fiber array and the intermediate layer have a high degree of structural dependence, which makes it difficult to meet the requirements of flexible plug-in and replacement of the optical fiber array. Summary of the invention

[0005] The technical problem to be solved by the present invention is that after the optical fiber array is coupled and packaged, the optical fiber array and the intermediate layer have a high degree of structural dependence, making it difficult to meet the requirement of flexible plugging and unplugging and replacing the optical fiber array.

[0006] In order to solve the above technical problems, the present invention provides a technical solution of a CPO packaging structure based on a glass carrier:

[0007] The CPO packaging structure based on the glass carrier includes a glass carrier, an ASIC chip, a silicon photonic chip, an electronic chip, a laser element, a positioning socket and an optical fiber array, wherein the ASIC chip, the silicon photonic chip and the positioning socket are all mounted on the glass carrier, and the electronic chip and the laser element are respectively arranged on the silicon photonic chip;

[0008] The glass carrier is provided with a redistribution layer, the ASIC chip and the electronic chip are electrically connected to the redistribution layer, a waveguide layer is provided inside the silicon photonic chip, and the laser element is optically connected to the waveguide layer; the optical fiber array is also equipped with a plug structure, and the plug structure is detachably connected to the positioning socket;

[0009] The positioning socket is provided with a first guide portion and a first limit portion, and the plug structure is provided with a second guide portion and a second limit portion, the first guide portion and the second guide portion are guided and matched along the length direction of the optical fiber array, and the first limit portion and the second limit portion are limited and matched along the length direction of the optical fiber array;

[0010] The optical fiber array is also provided with a protruding end, which is located on a side of the positioning socket away from the optical fiber body. A first coupling portion is provided at the lower part of the protruding end, and the first coupling portion is optically connected to the optical fiber body; a second coupling portion is provided at the upper part of a side of the silicon photonic chip close to the positioning socket, and the second coupling portion is optically connected to the waveguide layer, and the first coupling portion and the second coupling portion are optically connected relative to each other up and down.

[0011] Furthermore, a first reflection surface is provided inside the protruding end, the first reflection surface is arranged obliquely relative to the length direction of the optical fiber array, and the first reflection surface and the first coupling part are spaced apart; a second reflection surface is also provided inside the silicon photonic chip, the second reflection surface is arranged obliquely relative to the waveguide layer, and the second reflection surface and the second coupling part are spaced apart.

[0012] Furthermore, the ASIC chip, the electronic chip and the positioning socket are respectively arranged on the upper side of the glass carrier, and the redistribution layer is arranged on the bottom side of the glass carrier;

[0013] The glass carrier is provided with glass through holes corresponding to the ASIC chip and the electronic chip respectively, and the silicon photonic chip is provided with silicon through holes corresponding to the electronic chip. The glass through holes and the silicon through holes are filled with conductors, and the conductors are electrically connected between the redistribution layer and the ASIC chip or the electronic chip.

[0014] Furthermore, the positioning socket is a glass structure, the positioning socket is mounted and fixed on the glass carrier, a through slot is provided in the middle of the positioning socket, and the first guide portion and the first limiting portion are respectively arranged on the inner wall of the through slot.

[0015] Furthermore, the through slot includes a first slot section and a second slot section connected along the length direction of the optical fiber array, and the opening width of the first slot section is greater than the opening width of the second slot section;

[0016] The first guide portion is a guide rib arranged on the inner wall of the first slot segment, the first limiting portion is a stop surface arranged between the first slot segment and the second slot segment, and the first limiting portion is arranged perpendicular to the length direction of the optical fiber array.

[0017] Further, the plug structure is wrapped and fixed to the outside of the optical fiber array, the plug structure and the end of the optical fiber array form a convex structure, the second guide portion is a guide groove opened on the outside of the plug structure, and the guide rib is matched with the guide groove in a concave-convex manner;

[0018] The second limiting portion is an abutting surface provided on an end surface of one side of the plug structure, and the abutting surface is arranged perpendicular to the length direction of the optical fiber array.

[0019] Furthermore, the opening width of the first slot section gradually increases in a direction away from the second slot section, and an inclined boss is also provided on the side wall of the first slot section corresponding to the opening width direction;

[0020] The plug structure is further provided with an elastic locking hook on the side wall in the width direction of the optical fiber array. In the plugged state, the elastic locking hook extends into the inner side of the inclined boss along the length direction of the optical fiber array, and the inclined boss is locked with the elastic locking hook.

[0021] Furthermore, a pressing block is installed between the inclined boss and the second groove section, and the pressing block is slidably arranged along the opening width direction of the first groove section. An operating handle is also hinged on the outer side of the plug structure, and the operating handle is connected to the pressing block. The pressing block is used to cooperate with the elastic lock hook when unlocking.

[0022] Furthermore, a third guide portion is provided on the inner wall of the second groove section corresponding to the opening width direction, and a fourth guide portion is provided on the outer side of the optical fiber array corresponding to the width direction, and the third guide portion cooperates with the fourth guide portion in guiding along the length direction of the optical fiber array.

[0023] Furthermore, a groove is provided on the glass carrier, and the silicon photonic chip is matched with the groove in a concave-convex manner. The silicon photonic chip also integrates a PD element and an MPD element. The PD element is arranged corresponding to the receiving waveguide of the waveguide layer, and the MPD element is arranged corresponding to the laser element.

[0024] Compared with the prior art, the CPO packaging structure based on a glass substrate of the present invention has the following beneficial effects: the CPO packaging structure based on a glass substrate adopts a design form of a glass substrate, an ASIC chip, a silicon photonic chip, an electronic chip, a laser element, a positioning socket, an optical fiber array and a plug structure, the ASIC chip, the silicon photonic chip and the positioning socket are all mounted on the glass substrate, the ASIC chip and the electronic chip are electrically connected to the redistribution layer of the glass substrate, and the ASIC chip and the electronic chip send or receive electrical signals through the redistribution layer. The electronic chip and the laser element are respectively arranged on the silicon photonic chip, a waveguide layer is arranged inside the silicon photonic chip, the laser element and the waveguide layer are optically conductive, and optical signals are transmitted between the laser element and the optical fiber array through the waveguide layer, the silicon photonic chip can convert optical signals and electrical signals, and the purpose of high-speed transmission of photoelectric signal data is achieved.

[0025] The optical fiber array is also equipped with a plug structure, which is detachably connected to the positioning socket. The positioning socket is provided with a first guide portion and a first limit portion, and the plug structure is provided with a second guide portion and a second limit portion. Under the guidance and cooperation of the first guide portion and the second guide portion, the plug structure can be accurately installed in the positioning socket along the length direction of the optical fiber array. The first limit portion and the second limit portion cooperate with each other to effectively limit the position of the plug structure relative to the positioning socket along the length direction of the optical fiber array. This not only meets the requirements of flexible plugging and unplugging between the plug structure and the positioning socket, but also ensures the position accuracy of the plug structure and the optical fiber array on the positioning socket.

[0026] In addition, the optical fiber array is also provided with a protruding end, which is located on the side of the positioning socket away from the optical fiber body, and a first coupling part is provided at the lower part of the protruding end, and the first coupling part is optically connected to the optical fiber body; correspondingly, a second coupling part is provided at the upper part of the side of the silicon photonic chip close to the positioning socket, and the second coupling part is optically connected to the waveguide layer. The protruding end of the optical fiber array is located on the side of the positioning socket away from the optical fiber body, that is, the protruding end and the first coupling part are cantilevered on one side of the positioning socket, and the first coupling part and the second coupling part of the silicon photonic chip are opposite to each other up and down and form optical conduction. The optical fiber body, the first coupling part, the second coupling part, the waveguide layer to the PD element form a light receiving path in sequence, and conversely, the laser element, the waveguide layer, the second coupling part, the first coupling part to the optical fiber body form a light emitting path. While ensuring the accuracy and reliability of the entire optical transceiver path, the dependence of the optical fiber array on the carrier structure is reduced, thereby meeting the requirements of flexible plugging and unplugging and replacing the optical fiber array. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a three-dimensional schematic diagram of a CPO packaging structure based on a glass carrier in an embodiment of the present invention;

[0028] Figure 2is a perspective schematic diagram of a positioning socket of a CPO packaging structure based on a glass carrier board in an embodiment of the present invention;

[0029] Figure 3 is a front view schematic diagram of a CPO packaging structure based on a glass carrier in an embodiment of the present invention;

[0030] Figure 4 is a schematic three-dimensional assembly diagram of a positioning socket and a plug structure in an embodiment of the present invention;

[0031] Figure 5 is a plan view schematic diagram of a waveguide layer of a silicon photonic chip in an embodiment of the present invention;

[0032] Figure 6 Schematic diagram of the optical path between the optical fiber body of the optical fiber array and the waveguide layer of the silicon photonic chip in an embodiment of the present invention;

[0033] In the figure: 1-glass carrier, 10-rewiring layer, 2-ASIC chip, 3-silicon photonic chip, 30-waveguide layer, 31-second coupling part, 32-second reflection surface, 4-electronic chip, 40-laser element, 41-PD element, 42-MPD element, 5-positioning socket, 50-through groove, 501-first groove section, 502-second groove section, 51-first guide part, 52-first limiting part, 53-inclined boss, 54-top pressure block, 55-operating handle, 56-third guide part, 6-optical fiber array, 60-protruding end, 61-first coupling part, 62-first reflection surface, 7-plug structure, 71-second guide part, 72-second limiting part, 73-elastic locking hook, 74-fourth guide part. DETAILED DESCRIPTION

[0034] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] like Figures 1 to 6 As shown, a CPO packaging structure based on a glass carrier according to an embodiment of the present invention comprises a glass carrier 1, an ASIC chip 2, a silicon photonic chip 3, an electronic chip 4, a laser element 40, a positioning socket 5 and an optical fiber array 6, wherein the ASIC chip 2, the silicon photonic chip 3 and the positioning socket 5 are all mounted on the glass carrier 1, and the electronic chip 4 and the laser element 40 are respectively arranged on the silicon photonic chip 3; the glass carrier 1 is provided with a redistribution layer 10, and the ASIC chip 2 and the electronic chip 4 are electrically connected to the redistribution layer 10, and a waveguide layer 30 is provided inside the silicon photonic chip 3, and the laser element 40 is optically conductive with the waveguide layer 30; the optical fiber array 6 is also provided with a plug structure 7, and the plug structure 7 is detachably connected to the positioning socket 5.

[0039] The positioning socket 5 is provided with a first guide portion 51 and a first limit portion 52, and the plug structure 7 is provided with a second guide portion 71 and a second limit portion 72. The first guide portion 51 and the second guide portion 71 are guided and matched along the length direction of the optical fiber array 6, and the first limit portion 52 and the second limit portion 72 are limited and matched along the length direction of the optical fiber array 6; the optical fiber array 6 is also provided with a protruding end 60, and the protruding end 60 is located on the side of the positioning socket 5 away from the optical fiber body. The lower part of the protruding end 60 is provided with a first coupling portion 61, and the first coupling portion 61 is optically connected with the optical fiber body; the upper part of the side of the silicon photonic chip 3 close to the positioning socket 5 is provided with a second coupling portion 31, and the second coupling portion 31 is optically connected with the waveguide layer 30, and the first coupling portion 61 and the second coupling portion 31 are optically connected relative to each other up and down.

[0040] The CPO packaging structure based on the glass substrate adopts the design form of glass substrate 1, ASIC chip 2, silicon photonic chip 3, electronic chip 4, laser element 40, positioning socket 5, optical fiber array 6 and plug structure 7. ASIC chip 2, silicon photonic chip 3 and positioning socket 5 are all installed on glass substrate 1. ASIC chip 2 and electronic chip 4 are electrically connected to the redistribution layer 10 of glass substrate 1. ASIC chip 2 and electronic chip 4 send or receive electrical signals through redistribution layer 10. Electronic chip 4 and laser element 40 are respectively arranged on silicon photonic chip 3. Waveguide layer 30 is arranged inside silicon photonic chip 3. Laser element 40 is optically connected with waveguide layer 30. Optical signal transmission is carried out between laser element 40 and optical fiber array 6 through waveguide layer 30. Silicon photonic chip 3 can convert optical signal and electrical signal, so as to achieve the purpose of high-speed transmission of photoelectric signal data.

[0041] The optical fiber array 6 is also equipped with a plug structure 7, which is detachably connected to the positioning socket 5. The positioning socket 5 is provided with a first guide portion 51 and a first limit portion 52, and the plug structure 7 is provided with a second guide portion 71 and a second limit portion 72. Under the guidance and cooperation of the first guide portion 51 and the second guide portion 71, the plug structure 7 can be accurately installed in the positioning socket 5 along the length direction of the optical fiber array 6. The first limit portion 52 and the second limit portion 72 cooperate with each other to effectively limit the position of the plug structure 7 relative to the positioning socket 5 along the length direction of the optical fiber array 5. It not only meets the requirements of flexible plugging and unplugging between the plug structure 7 and the positioning socket 5, but also ensures the position accuracy of the plug structure 7 and the optical fiber array 6 on the positioning socket 5.

[0042] In addition, the optical fiber array 6 is also provided with a protruding end 60, which is located on the side of the positioning socket 5 away from the optical fiber body, and a first coupling portion 61 is provided at the lower part of the protruding end 60, and the first coupling portion 61 is optically connected to the optical fiber body; correspondingly, a second coupling portion 31 is provided at the upper part of the side of the silicon photonic chip 3 close to the positioning socket 5, and the second coupling portion 31 is optically connected to the waveguide layer 30. The protruding end 60 of the optical fiber array 6 is located on the side of the positioning socket 5 away from the optical fiber body, that is, the protruding end 60 and the first coupling portion 61 are cantilevered on one side of the positioning socket 5, and the first coupling portion 61 is opposite to the second coupling portion 31 of the silicon photonic chip 3 up and down and forms optical conduction. The optical fiber body, the first coupling part 61, the second coupling part 31, the waveguide layer 30 to the PD element 41 constitute the light receiving path in sequence. Conversely, the laser element 40, the waveguide layer 30, the second coupling part 31, the first coupling part 61 to the optical fiber body constitute the light emitting path. While ensuring the accuracy and reliability of the entire optical transceiver path, the dependence of the optical fiber array 6 on the carrier structure is reduced, thereby meeting the requirements of flexible plugging and unplugging and replacement of the optical fiber array 6.

[0043] like Figure 6As shown, a first reflection surface 62 is provided inside the protruding end 60, and the first reflection surface 62 is arranged obliquely relative to the length direction of the optical fiber array 6, and the first reflection surface 62 and the first coupling part 61 are spaced apart; a second reflection surface 32 is also provided inside the silicon photonic chip 3, and the second reflection surface 32 is arranged obliquely relative to the waveguide layer 30, and the second reflection surface 32 and the second coupling part 31 are spaced apart. The optical signal emitted from the laser element 40 is transmitted to the second emission surface 32 through the waveguide layer 30, and the optical signal is reflected and changed in direction by the second emission surface 32 to ensure that the optical signal continues to be accurately transmitted upward through the second coupling part 31; then the optical signal from below is aligned with the first coupling part 61 injected into the protruding end 60, and the optical signal is reflected and changed in direction again by the first reflection surface 62 to ensure that the optical signal is accurately transmitted into the optical fiber body. Accordingly, the optical receiving path from the optical fiber body to the PD element 41 is opposite to the transmission direction of the above-mentioned optical emission path.

[0044] In this embodiment, the ASIC chip 2, the electronic chip 4 and the positioning socket 5 are respectively arranged on the upper side of the glass carrier 1, and the redistribution layer 10 is arranged on the bottom side of the glass carrier 1; and the glass carrier 1 is provided with glass through holes corresponding to the ASIC chip 2 and the electronic chip 4, respectively, and the silicon photonic chip 3 is provided with silicon through holes corresponding to the electronic chip 4, and the glass through holes and silicon through holes are filled with conductors (not shown in the figure), and the conductors are electrically connected between the redistribution layer 10 and the ASIC chip 2 or the electronic chip 4. The glass carrier 1 has good insulation and anti-warping properties, and adopts glass through holes and silicon through holes technology to achieve the purpose of vertical conductive connection between the ASIC chip 2, the electronic chip 4 and the redistribution layer 10 on the bottom side of the glass carrier 1.

[0045] As a further preferred solution, the positioning socket 5 is a glass structure, and the positioning socket 5 is mounted and fixed on the glass carrier 1. A through slot 50 is provided in the middle of the positioning socket 5, and a first guide portion 51 and a first limit portion 52 are respectively arranged on the inner wall of the through slot 50. Specifically, the through slot 50 includes a first slot section 501 and a second slot section 502 connected along the length direction of the optical fiber array 6, and the opening width of the first slot section 501 is greater than the opening width of the second slot section 502; the first guide portion 51 is a guide rib arranged on the inner wall of the first slot section 501, and the first limit portion 52 is a stop surface arranged between the first slot section 501 and the second slot section 502, and the first limit portion 52 is arranged perpendicular to the length direction of the optical fiber array 6.

[0046] Correspondingly, the plug structure 7 is wrapped and fixed on the outside of the optical fiber array 6, and the plug structure 7 and the end of the optical fiber array 6 form a convex structure. The second guide portion 71 is a guide groove opened on the outside of the plug structure 7, and the guide ribs and the guide grooves are matched in a concave-convex manner; the second limit portion 72 is an abutment surface set on the end surface of one side of the plug structure 7, and the abutment surface is arranged perpendicular to the length direction of the optical fiber array 6. By using the concave-convex matching between the end of the optical fiber array 6 and the second groove section 502, and the concave-convex matching between the plug structure 7 and the second groove section 502, the plug-in matching degree between the optical fiber array 6 and the positioning socket 5 is improved, and the guide ribs are matched with the guide grooves, and the stop surface of the through groove 50 is matched with the abutment surface of the plug structure 7, thereby ensuring the plug-in assembly accuracy of the optical fiber array 6.

[0047] It should be noted that the opening width of the first slot section 501 gradually increases in the direction away from the second slot section 502, and the side wall of the first slot section 501 corresponding to the opening width direction is also provided with an inclined boss 53; the plug structure 7 is also provided with an elastic locking hook 73 on the side wall in the width direction of the optical fiber array 6. When in the plugged state, the elastic locking hook 73 extends into the inner side of the inclined boss 53 along the length direction of the optical fiber array 6, and the inclined boss 53 and the elastic locking hook 73 are locked and matched. The opening width of the first slot section 501 gradually increases to form a bell mouth, which can guide the plug structure 7 to be smoothly plugged into the first slot section 501. The elastic locking hook 73 of the plug structure 7 enters the inner side of the inclined boss 53, and the inclined boss 53 plays a locking role on the elastic locking hook 73, thereby ensuring the connection reliability between the plug structure 7 and the optical fiber array 6.

[0048] In addition, a pressing block 54 is installed between the inclined boss 53 and the second slot section 502. The pressing block 54 is slidably arranged along the opening width direction of the first slot section 501. An operating handle 55 is hingedly connected to the outer side of the plug structure 7. The operating handle 55 is connected to the pressing block 54. The pressing block 54 is used to press and cooperate with the elastic lock hook 73 when unlocking. The operating handle 55 can drive the pressing block 54 to move toward the inner side of the optical fiber array 6 in the width direction. The pressing block 54 squeezes the elastic lock hook 73 to cause it to be compressed and deformed, thereby ensuring that the elastic lock hook 73 is smoothly disengaged and unlocked relative to the inclined boss 53.

[0049] In this embodiment, the inner wall of the second slot section 502 corresponding to the opening width direction is further provided with a third guide portion 56, and the outer side of the optical fiber array 6 corresponding to the width direction is provided with a fourth guide portion 74, and the third guide portion 56 and the fourth guide portion 74 are guided and matched along the length direction of the optical fiber array 6. On the basis of the first guide portion 51 and the second guide portion 71, the third guide portion 56 of the second slot section 502 and the fourth guide portion 74 of the optical fiber array 6 are combined to further improve the accuracy of the plug-in installation, thereby ensuring the coupling accuracy of the optical signal between the optical fiber array 6 and the waveguide layer 30.

[0050] In addition, a groove is provided on the glass substrate 1, and the silicon photonic chip 3 is matched with the groove in a concave-convex manner. The silicon photonic chip 3 is also integrated with a PD element 41 and an MPD element 42. The PD element 41 is arranged corresponding to the receiving waveguide of the waveguide layer 30, and the MPD element 42 is arranged corresponding to the laser element 40. The silicon photonic chip 3 is accommodated and installed in the groove of the glass substrate 1, which effectively reduces the plate thickness of the packaging structure. The silicon photonic chip 3 is integrated with a PD element 41 and an MPD element 42. The PD element 41 is also called a photodiode, which is used to receive optical signals and convert optical signals into electrical signals. The MPD element 42 is combined with the laser element 40 and is used together to convert electrical signals into optical signals, thereby achieving the purpose of high-speed transmission of optical and electrical signals.

[0051] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A CPO packaging structure based on a glass substrate, characterized in that: It includes a glass carrier, an ASIC chip, a silicon photonic chip, an electronic chip, a laser element, a positioning socket and an optical fiber array, wherein the ASIC chip, the silicon photonic chip and the positioning socket are all mounted on the glass carrier, and the electronic chip and the laser element are respectively arranged on the silicon photonic chip; The glass carrier is provided with a redistribution layer, the ASIC chip and the electronic chip are electrically connected to the redistribution layer, a waveguide layer is provided inside the silicon photonic chip, and the laser element is optically connected to the waveguide layer; the optical fiber array is also equipped with a plug structure, and the plug structure is detachably connected to the positioning socket; The positioning socket is provided with a first guide portion and a first limit portion, and the plug structure is provided with a second guide portion and a second limit portion, the first guide portion and the second guide portion are guided and matched along the length direction of the optical fiber array, and the first limit portion and the second limit portion are limited and matched along the length direction of the optical fiber array; The optical fiber array is also provided with a protruding end, which is located on a side of the positioning socket away from the optical fiber body. A first coupling portion is provided at the lower part of the protruding end, and the first coupling portion is optically connected to the optical fiber body; a second coupling portion is provided at the upper part of a side of the silicon photonic chip close to the positioning socket, and the second coupling portion is optically connected to the waveguide layer, and the first coupling portion and the second coupling portion are optically connected relative to each other up and down.

2. The CPO packaging structure based on a glass substrate according to claim 1 is characterized in that: A first reflection surface is arranged inside the protruding end, the first reflection surface is arranged obliquely relative to the length direction of the optical fiber array, and the first reflection surface and the first coupling part are spaced apart; a second reflection surface is also arranged inside the silicon photonic chip, the second reflection surface is arranged obliquely relative to the waveguide layer, and the second reflection surface and the second coupling part are spaced apart.

3. The CPO packaging structure based on a glass substrate according to claim 2 is characterized in that: The ASIC chip, the electronic chip and the positioning socket are respectively arranged on the upper side of the glass carrier, and the redistribution layer is arranged on the bottom side of the glass carrier; The glass carrier is provided with glass through holes corresponding to the ASIC chip and the electronic chip respectively, and the silicon photonic chip is provided with silicon through holes corresponding to the electronic chip. The glass through holes and the silicon through holes are filled with conductors, and the conductors are electrically connected between the redistribution layer and the ASIC chip or the electronic chip.

4. The CPO packaging structure based on a glass substrate according to claim 1, characterized in that: The positioning socket is a glass structure, and the positioning socket is mounted and fixed on the glass carrier. A through slot is provided in the middle of the positioning socket, and the first guide portion and the first limiting portion are respectively arranged on the inner wall of the through slot.

5. The CPO packaging structure based on a glass substrate according to claim 4 is characterized in that: The through slot comprises a first slot section and a second slot section connected along the length direction of the optical fiber array, and the opening width of the first slot section is greater than the opening width of the second slot section; The first guide portion is a guide rib arranged on the inner wall of the first slot segment, the first limiting portion is a stop surface arranged between the first slot segment and the second slot segment, and the first limiting portion is arranged perpendicular to the length direction of the optical fiber array.

6. The CPO packaging structure based on a glass substrate according to claim 5, characterized in that: The plug structure is wrapped and fixed to the outside of the optical fiber array, the plug structure and the end of the optical fiber array form a convex structure, the second guide portion is a guide groove opened on the outside of the plug structure, and the guide rib is matched with the guide groove in a concave-convex manner; The second limiting portion is an abutting surface provided on an end surface of one side of the plug structure, and the abutting surface is arranged perpendicular to the length direction of the optical fiber array.

7. The CPO packaging structure based on a glass substrate according to claim 6 is characterized in that: The opening width of the first slot section gradually increases in a direction away from the second slot section, and a side wall of the first slot section corresponding to the opening width direction is also provided with an inclined boss; The plug structure is further provided with an elastic locking hook on the side wall in the width direction of the optical fiber array. In the plugged state, the elastic locking hook extends into the inner side of the inclined boss along the length direction of the optical fiber array, and the inclined boss is locked with the elastic locking hook.

8. The CPO packaging structure based on a glass substrate according to claim 7 is characterized in that: A pressing block is also installed between the inclined boss and the second groove section. The pressing block is slidably arranged along the opening width direction of the first groove section. An operating handle is also hinged on the outer side of the plug structure. The operating handle is connected to the pressing block. The pressing block is used to press and cooperate with the elastic lock hook when unlocking.

9. The CPO packaging structure based on a glass substrate according to claim 5, characterized in that: The inner wall of the second groove section corresponding to the opening width direction is further provided with a third guide portion, and the outer side of the optical fiber array corresponding to the width direction is provided with a fourth guide portion, and the third guide portion cooperates with the fourth guide portion in guiding along the length direction of the optical fiber array.

10. The CPO packaging structure based on a glass substrate according to claim 1, characterized in that: A groove is provided on the glass carrier plate, and the silicon photonic chip is matched with the groove in a concave-convex manner. The silicon photonic chip is also integrated with a PD element and an MPD element. The PD element is arranged corresponding to the receiving waveguide of the waveguide layer, and the MPD element is arranged corresponding to the laser element.

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