Integrated and packaged automation system for composite sensitive sensor chip

Through the integrated and position layout and interference optimization unit in the composite sensitive sensor chip and package automation system, the resource waste and signal interference problems caused by unreasonable chip layout are solved, and efficient chip integration and signal stability are achieved.

CN119528085AActive Publication Date: 2025-02-28INST OF LASER & OPTOELECTRONICS INTELLIGENT MFG WENZHOU UNIV
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Patent Information

Application Number
CN202411676918.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-22
Publication Date
2025-02-28
Estimated Expiration
2044-11-22

AI Technical Summary

Technical Problem

In the integration process of composite sensitive sensor chips, irrational chip position layout leads to waste of available area of ​​silicon wafers, increasing costs, and generating signal interference and crosstalk during high-frequency signals and high-speed data transmission, reducing signal quality and stability.

Method used

A composite sensitive sensor chip integration and packaging automation system is provided, including a position layout unit, a distance noise unit, an interference optimization unit and an integrated packaging unit. The system optimizes the distance between the power line and the signal line by calculating reasonable chip layout location and signal line layout, and reduces capacitive coupling, thereby avoiding signal interference.

Benefits of technology

Through reasonable chip and signal line layout, maximize the available area of ​​silicon wafers, reduce resource waste and costs, improve production efficiency and cost efficiency, and reduce interference and crosstalk in high-frequency signal transmission, improving signal quality and stability.

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Abstract

The invention relates to the technical field of sensor chip integration, in particular to a composite sensitive sensor chip integration and packaging automation system. The device comprises a position layout unit, a distance noise unit, an interference optimization unit and an integrated packaging unit. According to the chip layout module, the sizes of the silicon wafer, the pressure sensor chip, the flow sensor chip and the temperature sensor chip and the central positions of the pressure sensor chip, the flow sensor chip and the temperature sensor chip are obtained through the visual technology, and the positions of the pressure sensor chip, the flow sensor chip and the temperature sensor chip arranged on the single silicon wafer are calculated according to the sizes of the silicon wafer and the pressure sensor chip, the flow sensor chip and the temperature sensor chip; by calculating the reasonable layout position, the available area of the silicon wafer can be utilized to the maximum extent, the waste condition is reduced, the production efficiency is improved, the cost is reduced, meanwhile, various sensor chips can be more easily integrated into smaller and lighter materials through the reasonable position layout, and therefore the practicability is improved.
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Citation Information

Patent Citations

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