The invention relates to the technical field of photoelectric packaging, and discloses a CPO packaging
structure based on a glass carrier plate, the CPO packaging structure comprises the glass carrier plate, an ASIC
chip, a
silicon optical
chip, an
electronic chip, a
laser element, a positioning socket and an
optical fiber array, the ASIC
chip, the
silicon optical chip and the positioning socket are all installed on the glass carrier plate, and the
electronic chip and the
laser element are respectively arranged on the
silicon optical chip; the ASIC chip and the
electronic chip are electrically connected with the rewiring layer of the glass carrier plate, and the
laser element is in light conduction with the
waveguide layer of the silicon optical chip; the
optical fiber array is also provided with a plug structure which is detachably connected with the positioning socket; the
optical fiber array is further provided with a protruding end, the protruding end is located on the side, away from the optical
fiber body, of the positioning socket, and the lower portion of the protruding end is provided with a first
coupling part which is in light conduction with the optical
fiber body. A second
coupling part is arranged at the upper part of one side, close to the positioning socket, of the silicon optical chip, the second
coupling part is in light conduction with the
waveguide layer, and the first coupling part and the second coupling part are in light conduction oppositely up and down.