Automatic inspection equipment for wafer front surface film pasting

Abstract

The invention relates to the related technical field of inspection equipment, in particular to automatic inspection equipment for wafer front surface film pasting, which comprises an automatic inspection equipment rack, a wafer positioning module, a detection lamp source, a detection mechanism and a static electricity removing ion pump, a detection chamber and an electrical assembly box are arranged on the automatic inspection equipment rack, and a mounting seat is fixedly mounted in the detection chamber; a chamber door is hinged to a port of the detection chamber, and the wafer positioning module is mounted on the mounting seat; according to the automatic inspection equipment for wafer front surface film pasting, the automatic inspection equipment is composed of an automatic inspection equipment rack, a wafer positioning module, a detection lamp source, a detection mechanism and a destaticizing ion pump, the detection lamp source is composed of a UV light source and an IR infrared light source, and the UV light source and the IR infrared light source are arranged on the two sides of a detection chamber respectively; therefore, through detection of different light sources, the effect of detecting undesirable phenomena such as wafer scratches, wafer dark cracks, film bubbles, film wrinkles, film burrs and the like at different angles is improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to inspection equipment, and in particular to an automatic inspection equipment for wafer front-side film pasting. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer; Before the wafer is ground and thinned on the back side, it is necessary to apply a front protective film to ensure that the front side of the wafer is free of contamination, scratches, pressure damage, etc. during the back side grinding and thinning. The application effect of the front protective film is particularly important. After the front film is applied, 100% inspection is required. Personnel cannot conduct 100% accurate inspection, which easily leads to the probability of missed inspection. The existing Chinese patent document with the announcement number CN212722576U discloses a fully automatic wafer crack inspection machine, which includes a workbench, a laser scanner and a scanning receiver are fixedly provided on the upper side of the workbench, the laser scanner is located above the scanning receiver, and two support plates for placing wafers are provided on the workbench, and the height of the side surface of the support plate is between the height of the laser scanner and the height of the scanning receiver; However, the above scheme cannot use different light sources for detection, and it is not easy to find problems such as bubbles, wrinkles, burrs, wafer scratches, and wafer dark cracks after film pasting. Therefore, the present invention proposes an automatic inspection device for wafer front film pasting to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide an automatic inspection device for wafer front-side film bonding to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: an automatic inspection device for wafer front film bonding, comprising: An automatic inspection equipment rack, wherein a detection chamber and an electrical component box are arranged on the automatic inspection equipment rack, a mounting seat is fixedly installed in the detection chamber, and a chamber door is hingedly installed at the port of the detection chamber; A wafer positioning module, wherein the wafer positioning module is mounted on a mounting seat; A detection light source, wherein the detection light source is installed on the top wall of the detection chamber; A detection mechanism, wherein the detection mechanism is installed on the top wall of the detection chamber and is located directly above the wafer positioning module; A destaticizing ion pump, wherein the destaticizing ion pump is installed on the bottom surface of the detection chamber, and an outlet port of the destaticizing ion pump is located directly below the wafer positioning module; A three-color indicator light of the equipment is installed on the left side of the front face of the automatic inspection equipment rack, and a control panel is arranged on the right side of the front face of the automatic inspection equipment rack, and the power units on the automatic inspection equipment rack are all connected with the electrical signals of the control panel, and the detection light source is composed of a combination of a UV light source and an IR infrared light source, and the UV light source and the IR infrared light source are respectively located on both sides of the detection room.

[0005] Preferably, the wafer positioning module is composed of a lower cylinder body, an upper cylinder body, an upper adsorption seat, a lower adsorption seat and a piston combination, the lower cylinder body and the upper cylinder body are both circular tube structures, and the upper and lower ports of the lower cylinder body are respectively integrally formed with a first-level connecting ear plate and a second-level connecting ear plate, the upper and lower ends of the upper cylinder body are respectively integrally formed with a third-level connecting ear plate and a fourth-level connecting ear plate, the first-level connecting ear plate and the fourth-level connecting ear plate are connected by a first-level connecting piece, the upper adsorption seat is connected to the third-level connecting ear plate by a second-level connecting piece, and the lower adsorption seat is connected to the second-level connecting ear plate by a third-level connecting piece, the piston is movably arranged in the inner cavity of the lower cylinder body and the upper cylinder body, a rotating shaft is integrally formed on the side wall of the lower cylinder body, the rotating shaft is rotatably mounted on the mounting seat, and the rotating shaft is driven by a first-level servo motor inside the detection chamber.

[0006] Preferably, both the upper adsorption seat and the lower adsorption seat are provided with air holes, and the outer ports of the air holes are provided with adsorption grooves, the side wall of the lower cylinder body is provided with a movable groove, the piston is a steel piston, and a movable seat is integrally formed on the side wall of the piston, the movable seat is movably arranged in the movable groove, and the movable seat is driven up and down by the driving structure on the lower cylinder body.

[0007] Preferably, a primary annular sealing groove and a secondary annular sealing groove are respectively provided on the upper and lower end side walls of the piston, and a primary rubber sealing ring and a secondary rubber sealing ring are respectively embedded in the primary annular sealing groove and the secondary annular sealing groove. When the piston is actually installed, the primary rubber sealing ring and the secondary rubber sealing ring are both under pressure.

[0008] Preferably, when the movable seat moves to the lower side end of the movable groove, the primary rubber sealing ring is higher than the lower end surface of the upper cylinder body, and when the movable seat moves to the upper side end of the movable groove, the secondary rubber sealing ring is lower than the lower side end of the movable groove.

[0009] Preferably, the movable grooves are provided with three equal circumferences, the movable seat is provided with a screw hole, the side wall of the lower cylinder body is integrally formed with a lower screw seat, the side wall of the upper cylinder body is integrally formed with an upper screw seat and a rotating shaft seat, the lower screw seat, the upper screw seat, and the rotating shaft seat are evenly provided with three circumferences, the lower screw seat, the upper screw seat, and the movable groove are correspondingly arranged, and a transmission screw is rotatably installed between the lower screw seat and the upper screw seat, the transmission screw is matched with the screw hole on the movable seat, and a first-level leather is fixedly installed on the upper side end of the transmission screw Pulley, a rotating shaft is rotatably installed on the rotating shaft seat, a secondary pulley is fixedly installed on the rotating shaft, the primary pulley and the secondary pulley are relatively aligned, and the primary pulley and the secondary pulley are connected by a transmission belt, the primary pulley and the secondary pulley are toothed pulleys, and a driven gear is fixedly installed on the lower side end of one of the transmission screws, a secondary servo motor is fixedly installed on the side wall of the lower cylinder body through a motor seat, a transmission gear is fixedly installed on the output shaft of the secondary servo motor, and the driven gear is meshed with the transmission gear.

[0010] Preferably, the pores are evenly arranged in a plurality of groups, and when the piston moves up and down, the volume change of the cavities on the upper and lower sides of the piston is greater than ten times the total volume of the pores and the adsorption grooves.

[0011] Preferably, the lower end surface of the lower cylinder body and the upper end surface of the upper cylinder body are both provided with three-stage annular sealing grooves, and three-stage rubber sealing rings are embedded in the three-stage annular sealing grooves. The inner end surfaces of the upper adsorption seat and the lower adsorption seat are integrally formed with sealing protrusions, and the sealing protrusions are annular protrusion structures with semicircular cross-sections, and multiple sealing protrusions are arranged at equal intervals. When the upper adsorption seat and the lower adsorption seat are actually installed, the sealing protrusions are embedded in the rubber body of the three-stage rubber sealing ring.

[0012] Preferably, a four-level annular sealing groove is opened at the edge of the port of the adsorption groove, a four-level rubber sealing ring is embedded in the four-level annular sealing groove, the end face of the four-level rubber sealing ring is higher than the end face of the adsorption seat, and a varistor is arranged at the bottom of the four-level annular sealing groove, and the varistor is connected to the electrical signal of the control module on the device through a primary wire.

[0013] Preferably, air pressure detection sensors are provided in the inner cavities of the upper adsorption seat and the lower adsorption seat, and the air pressure detection sensors are electrically connected to the control module on the device through a secondary wire. When the piston is located on the lower side, the upper cavity of the piston is in a negative pressure state, and the lower cavity of the piston is in a normal pressure state. When the piston is located on the upper side, the upper cavity of the piston is in a normal pressure state, and the lower cavity of the piston is in a negative pressure state. Pipe connection ports are provided on the side walls of the inner cavities of the upper adsorption seat and the lower adsorption seat, and stop valves are provided on the pipe connection ports.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting up an automatic inspection equipment for wafer front film bonding composed of an automatic inspection equipment frame, a wafer positioning module, a detection light source, a detection mechanism and a destaticized ion pump, and setting the detection light source to be composed of a UV light source and an IR infrared light source, and setting the UV light source and the IR infrared light source on both sides of the inspection room respectively, so as to improve the detection effect of wafer scratches at different angles, wafer dark cracks, film bubbles, film wrinkles, film burrs and other undesirable phenomena through different light source detection; 2. By configuring the wafer positioning module to consist of a lower cylinder, an upper cylinder, an upper adsorption seat, a lower adsorption seat and a piston combination, a group of manipulators can be used to synchronously complete the wafer loading and unloading process. Compared with the traditional process of unloading first and then loading, it can effectively improve the wafer detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a front view of the present invention; Figure 3 This is a schematic diagram of the structure of the wafer positioning module of the present invention; Figure 4 for Figure 3 A schematic diagram of the structure enlargement in the middle; Figure 5 It is a cross-sectional view of a wafer positioning module of the present invention; Figure 6 for Figure 5 A magnified schematic diagram of the structure at B in the middle; Figure 7 for Figure 5 A magnified schematic diagram of the structure at C in the middle; Figure 8 It is a schematic diagram of the transmission screw structure of the present invention; Fig. 9 It is a schematic diagram of the structure of the lower cylinder body and the upper cylinder body of the present invention; Fig.10 for Fig. 9 A magnified schematic diagram of the structure at D in the middle; Fig.11 This is a schematic diagram of the structure of the upper adsorption seat of the present invention; Fig.12 It is a schematic diagram of the piston structure of the present invention.

[0016] In the figure: automatic inspection equipment frame 1, wafer positioning module 2, detection light source 3, detection mechanism 4, destaticization ion pump 5, detection room 6, electrical component box 7, mounting seat 8, three-color indicator light 9, control panel 10, lower cylinder body 11, upper cylinder body 12, upper adsorption seat 13, lower adsorption seat 14, piston 15, rotating shaft 16, first-level connecting ear plate 17, second-level connecting ear plate 18, third-level connecting ear plate 19, fourth-level connecting ear plate 20, movable groove 21, lower screw seat 22, upper screw seat 23, A rotating shaft seat 24, a transmission screw 25, a primary pulley 26, a rotating shaft 27, a secondary pulley 28, a transmission belt 29, a driven gear 30, a motor seat 31, a secondary servo motor 32, a movable seat 33, a primary rubber sealing ring 34, a secondary rubber sealing ring 35, a tertiary rubber sealing ring 36, a sealing protrusion 37, an air hole 38, an adsorption groove 39, a quaternary rubber sealing ring 40, a varistor 41, a primary wire 42, an air pressure detection sensor 43, a secondary wire 44, a pipeline connection port 45, and a chamber door 50. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-12 The present invention provides the following three preferred embodiments: Embodiment 1: An automatic inspection device for wafer front-side film lamination, comprising an automatic inspection device frame 1, a wafer positioning module 2, a detection light source 3, a detection mechanism 4, and a destaticizing ion pump 5. The automatic inspection device frame 1 is provided with a detection chamber 6 and an electrical component box 7, a mounting seat 8 is fixedly installed in the detection chamber 6, and a chamber door 50 is hingedly installed at the port of the detection chamber 6, the wafer positioning module 2 is installed on the mounting seat 8, the detection light source 3 is installed on the top wall of the detection chamber 6, the detection mechanism 4 is installed on the top wall of the detection chamber 6, and the detection mechanism 4 is located directly above the wafer positioning module 2, the destaticizing ion pump 5 is installed on the bottom surface of the detection chamber 6, and the outlet port of the destaticizing ion pump 5 is located directly below the wafer positioning module 2, the front end face of the automatic inspection device frame 1 is provided with a three-color indicator light 9, and the automatic A control panel 10 is arranged on the right side of the front end face of the inspection equipment frame 1, and the power units on the automatic inspection equipment frame 1 are all connected to the control panel 10 by electrical signals, the detection light source 3 is composed of a UV light source and an IR infrared light source, and the UV light source and the IR infrared light source are respectively located on both sides of the inspection chamber 6, and an automatic inspection equipment for wafer front side film pasting is arranged which is composed of an automatic inspection equipment frame 1, a wafer positioning module 2, a detection light source 3, a detection mechanism 4 and a destaticizing ion pump 5, and the detection light source 3 is arranged to be composed of a UV light source and an IR infrared light source, and the UV light source and the IR infrared light source are respectively arranged on both sides of the inspection chamber 6, so as to improve the detection effect of detecting wafer scratches at different angles, wafer dark cracks, film bubbles, film wrinkles, film burrs and other adverse phenomena through detection with different light sources.

[0019] Embodiment 2, on the basis of embodiment 1, the wafer positioning module 2 is composed of a lower cylinder 11, an upper cylinder 12, an upper adsorption seat 13, a lower adsorption seat 14 and a piston 15, the lower cylinder 11 and the upper cylinder 12 are both round tube structures, and the upper and lower ports of the lower cylinder 11 are respectively integrally formed with a first-level connecting ear plate 17 and a second-level connecting ear plate 18, and the upper and lower ends of the upper cylinder 12 are respectively integrally formed with a third-level connecting ear plate 19 and a fourth-level connecting ear plate 20, the first-level connecting ear plate 17, the fourth-level connecting ear plate 20, and the first-level connecting ear plate 17 and the fourth-level connecting ear plate 18 are respectively integrally formed. The connecting ear plates 20 are connected by a primary connecting piece, the upper adsorption seat 13 is connected to the tertiary connecting ear plate 19 by a secondary connecting piece, and the lower adsorption seat 14 is connected to the secondary connecting ear plate 18 by a tertiary connecting piece. The piston 15 is movably arranged in the inner cavity of the lower cylinder body 11 and the upper cylinder body 12. A rotating shaft 16 is integrally formed on the side wall of the lower cylinder body 11. The rotating shaft 16 is rotatably mounted on the mounting seat 8, and the rotating shaft 16 is driven by a primary servo motor inside the detection chamber 6.

[0020] Both the upper adsorption seat 13 and the lower adsorption seat 14 are provided with air holes 38, and an adsorption groove 39 is provided at the outer port of the air hole 38, a movable groove 21 is provided on the side wall of the lower cylinder body 11, the piston 15 is a steel piston, and a movable seat 33 is integrally formed on the side wall of the piston 15, the movable seat 33 is movably arranged in the movable groove 21, and the movable seat 33 is driven up and down by the driving structure on the lower cylinder body 11, and the wafer positioning module 2 is configured to be composed of the lower cylinder body 11, the upper cylinder body 12, the upper adsorption seat 13, the lower adsorption seat 14 and the piston 15, so that the loading and unloading processes of the wafers are synchronously completed by a group of manipulators, which can effectively improve the inspection efficiency of the wafers compared with the traditional process of unloading and then loading.

[0021] Embodiment 3, on the basis of embodiment 2, a primary annular sealing groove and a secondary annular sealing groove are respectively opened on the upper and lower end side walls of the piston 15, and a primary rubber sealing ring 34 and a secondary rubber sealing ring 35 are respectively embedded in the primary annular sealing groove and the secondary annular sealing groove. When the piston 15 is actually installed, the primary rubber sealing ring 34 and the secondary rubber sealing ring 35 are both in a pressurized state, thereby improving the contact sealing between the piston 15 and the lower cylinder body 11 and the upper cylinder body 12.

[0022] When the movable seat 33 moves to the lower side end of the movable groove 21 , the primary rubber sealing ring 34 is higher than the lower end surface of the upper cylinder body 12 ; when the movable seat 33 moves to the upper side end of the movable groove 21 , the secondary rubber sealing ring 35 is lower than the lower side end of the movable groove 21 .

[0023] There are three equal circumferences of the movable groove 21, a screw hole is opened on the movable seat 33, a lower screw seat 22 is integrally formed on the side wall of the lower cylinder body 11, and an upper screw seat 23 and a rotating shaft seat 24 are integrally formed on the side wall of the upper cylinder body 12. The lower screw seat 22, the upper screw seat 23, and the rotating shaft seat 24 are equally arranged in three circles, and the lower screw seat 22, the upper screw seat 23, and the movable groove 21 are correspondingly arranged, and a transmission screw 25 is rotatably installed between the lower screw seat 22 and the upper screw seat 23. The transmission screw 25 is matched with the screw hole on the movable seat 33, and a primary pulley 26 is fixedly installed on the upper side end of the transmission screw 25, and a rotating shaft 2 is rotatably installed on the rotating shaft seat 24. 7. A secondary pulley 28 is fixedly mounted on the rotating shaft 27. The primary pulley 26 and the secondary pulley 28 are relatively aligned and connected to each other through a transmission belt 29. The primary pulley 26 and the secondary pulley 28 are toothed pulleys, and a driven gear 30 is fixedly mounted on the lower side end of one of the transmission screws 25. A secondary servo motor 32 is fixedly mounted on the side wall of the lower cylinder body 11 through a motor seat 31. A transmission gear is fixedly mounted on the output shaft of the secondary servo motor 32. The driven gear 30 is meshed with the transmission gear to ensure that the piston 15 is stably stressed in all directions, thereby ensuring the stability of the up and down movement of the piston 15.

[0024] There are multiple groups of air holes 38 evenly arranged. When the piston 15 moves up and down, the volume change of the cavity located on the upper and lower sides of the piston 15 is greater than ten times the total volume of the air holes 38 and the adsorption groove 39, ensuring that sufficient adsorption force can be provided to the wafer.

[0025] The lower end surface of the lower cylinder body 11 and the upper end surface of the upper cylinder body 12 are both provided with three-stage annular sealing grooves, in which three-stage rubber sealing rings 36 are embedded. The inner end surfaces of the upper adsorption seat 13 and the lower adsorption seat 14 are both integrally formed with sealing protrusions 37. The sealing protrusions 37 are annular protrusion structures with a semicircular cross-section, and multiple sealing protrusions 37 are arranged at equal intervals. When the upper adsorption seat 13 and the lower adsorption seat 14 are actually installed, the sealing protrusions 37 are embedded in the rubber body of the three-stage rubber sealing ring 36.

[0026] A four-level annular sealing groove is provided at the edge of the port of the adsorption groove 39, in which a four-level rubber sealing ring 40 is embedded. The end face of the four-level rubber sealing ring 40 is higher than the end face of the adsorption seat, and a varistor 41 is provided at the bottom of the four-level annular sealing groove. The varistor 41 is electrically connected to the control module on the device through a primary wire 42. The four-level rubber sealing ring 40 can improve the sealing at the wafer contact position, and the setting of the varistor 41 can ensure that each four-level rubber sealing ring 40 can be stably stressed, thereby further ensuring the sealing.

[0027] An air pressure detection sensor 43 is provided in the inner cavity of the upper adsorption seat 13 and the lower adsorption seat 14. The air pressure detection sensor 43 is electrically connected to the control module on the device through a secondary wire 44. When the piston 15 is located on the lower side, the upper cavity of the piston 15 is in a negative pressure state, and the lower cavity of the piston 15 is in a normal pressure state. When the piston 15 is located on the upper side, the upper cavity of the piston 15 is in a normal pressure state, and the lower cavity of the piston 15 is in a negative pressure state. Pipe connection ports 45 are provided on the side walls of the inner cavities of the upper adsorption seat 13 and the lower adsorption seat 14, and stop valves are provided on the pipe connection ports 45, which are convenient for real-time monitoring of the air pressure values ​​in the lower cylinder body 11 and the upper cylinder body 12, thereby ensuring that the wafer is stably adsorbed and positioned.

[0028] In actual use, the staff first opens the chamber door 50, and then uses the loading robot to take the wafer to be inspected and the unloading robot to enter the inspection chamber 6 synchronously, and places the wafer to be inspected taken by the loading robot on the upper adsorption seat 13, and simultaneously lets the unloading robot clamp the wafer that has been inspected on the lower adsorption seat 14, and then drives the piston 15 downward to form a positioning adsorption for the wafer to be inspected, and simultaneously lets the wafer that has been inspected be put down, and then the loading robot and the unloading robot synchronously withdraw from the inspection chamber 6, and then close the chamber door 50 for inspection.

[0029] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. An automatic inspection device for wafer front film lamination, characterized in that: include: An automatic inspection equipment frame (1), wherein the automatic inspection equipment frame (1) is provided with an inspection chamber (6) and an electrical component box (7), a mounting seat (8) is fixedly installed in the inspection chamber (6), and a chamber door (50) is hingedly installed at the end of the inspection chamber (6); A wafer positioning module (2), wherein the wafer positioning module (2) is mounted on a mounting seat (8); A detection light source (3), wherein the detection light source (3) is mounted on the top wall of the detection chamber (6); A detection mechanism (4), the detection mechanism (4) being mounted on a top wall of the detection chamber (6), and the detection mechanism (4) being located directly above the wafer positioning module (2); A destaticizing ion pump (5), wherein the destaticizing ion pump (5) is installed on the bottom surface of the detection chamber (6), and an outlet port of the destaticizing ion pump (5) is located directly below the wafer positioning module (2); A three-color indicator light (9) is installed on the left side of the front face of the automatic inspection equipment frame (1), and a control panel (10) is arranged on the right side of the front face of the automatic inspection equipment frame (1), and the power consumption units on the automatic inspection equipment frame (1) are all connected to the control panel (10) by electrical signals, and the detection light source (3) is composed of a UV light source and an IR infrared light source, and the UV light source and the IR infrared light source are respectively located on both sides of the detection chamber (6).

2. The automatic inspection equipment for wafer front side film lamination according to claim 1, characterized in that: The wafer positioning module (2) is composed of a lower cylinder body (11), an upper cylinder body (12), an upper adsorption seat (13), a lower adsorption seat (14) and a piston (15). The lower cylinder body (11) and the upper cylinder body (12) are both circular tube structures, and the upper and lower ports of the lower cylinder body (11) are respectively integrally formed with a first-level connecting ear plate (17) and a second-level connecting ear plate (18), and the upper and lower ends of the upper cylinder body (12) are respectively integrally formed with a third-level connecting ear plate (19) and a fourth-level connecting ear plate (20). ) are connected via a primary connecting piece, the upper adsorption seat (13) is connected to a tertiary connecting ear plate (19) via a secondary connecting piece, the lower adsorption seat (14) is connected to a secondary connecting ear plate (18) via a tertiary connecting piece, the piston (15) is movably arranged in the inner cavity of the lower cylinder body (11) and the upper cylinder body (12), a rotating shaft (16) is integrally formed on the side wall of the lower cylinder body (11), the rotating shaft (16) is rotatably mounted on the mounting seat (8), and the rotating shaft (16) is driven by a primary servo motor inside the detection chamber (6).

3. The automatic inspection equipment for wafer front side film lamination according to claim 2, characterized in that: The upper adsorption seat (13) and the lower adsorption seat (14) are both provided with air holes (38), and an adsorption groove (39) is provided at the outer end of the air hole (38). The side wall of the lower cylinder body (11) is provided with a movable groove (21). The piston (15) is a steel piston, and a movable seat (33) is integrally formed on the side wall of the piston (15). The movable seat (33) is movably arranged in the movable groove (21), and the movable seat (33) is driven up and down by a driving structure on the lower cylinder body (11).

4. The automatic inspection equipment for wafer front side film lamination according to claim 1, characterized in that: A primary annular sealing groove and a secondary annular sealing groove are respectively formed on the upper and lower end side walls of the piston (15), and a primary rubber sealing ring (34) and a secondary rubber sealing ring (35) are respectively embedded in the primary annular sealing groove and the secondary annular sealing groove. When the piston (15) is actually installed, the primary rubber sealing ring (34) and the secondary rubber sealing ring (35) are both in a compressed state.

5. The automatic inspection equipment for wafer front side film lamination according to claim 4, characterized in that: When the movable seat (33) moves to the lower side end of the movable groove (21), the primary rubber sealing ring (34) is higher than the lower end surface of the upper cylinder body (12); when the movable seat (33) moves to the upper side end of the movable groove (21), the secondary rubber sealing ring (35) is lower than the lower side end of the movable groove (21).

6. The automatic inspection equipment for wafer front side film bonding according to claim 5, characterized in that: The movable groove (21) is provided with three equal circumferences, the movable seat (33) is provided with a screw hole, the side wall of the lower cylinder body (11) is integrally formed with a lower screw seat (22), the side wall of the upper cylinder body (12) is integrally formed with an upper screw seat (23) and a rotating shaft seat (24), the lower screw seat (22), the upper screw seat (23), and the rotating shaft seat (24) are provided with three equal circumferences, the lower screw seat (22), the upper screw seat (23), and the movable groove (21) are correspondingly arranged, and a transmission screw (25) is rotatably installed between the lower screw seat (22) and the upper screw seat (23), the transmission screw (25) is matched with the screw hole on the movable seat (33), and a primary pulley is fixedly installed on the upper side end of the transmission screw (25). (26), a rotating shaft (27) is rotatably mounted on the rotating shaft seat (24), a secondary belt pulley (28) is fixedly mounted on the rotating shaft (27), the primary belt pulley (26) and the secondary belt pulley (28) are arranged in a relatively aligned manner, and the primary belt pulley (26) and the secondary belt pulley (28) are connected to each other through a transmission belt (29), the primary belt pulley (26) and the secondary belt pulley (28) are toothed belt pulleys, and a driven gear (30) is fixedly mounted on the lower side end of one of the transmission screws (25), a secondary servo motor (32) is fixedly mounted on the side wall of the lower cylinder body (11) through a motor seat (31), a transmission gear is fixedly mounted on the output shaft of the secondary servo motor (32), and the driven gear (30) is meshed with the transmission gear.

7. The automatic inspection equipment for wafer front side film bonding according to claim 6, characterized in that: The air holes (38) are evenly arranged in a plurality of groups, and when the piston (15) moves up and down, the volume change of the cavities located on the upper and lower sides of the piston (15) is greater than ten times the total volume of the air holes (38) and the adsorption grooves (39).

8. The automatic inspection equipment for wafer front side film lamination according to claim 7, characterized in that: The lower end surface of the lower cylinder body (11) and the upper end surface of the upper cylinder body (12) are both provided with a three-stage annular sealing groove, and a three-stage rubber sealing ring (36) is embedded in each of the three-stage annular sealing grooves. The inner end surfaces of the upper adsorption seat (13) and the lower adsorption seat (14) are both integrally formed with a sealing protrusion (37), and the sealing protrusion (37) is an annular protrusion structure with a semicircular cross-section, and a plurality of sealing protrusions (37) are arranged at equal intervals. When the upper adsorption seat (13) and the lower adsorption seat (14) are actually installed, the sealing protrusion (37) is embedded in the rubber body of the three-stage rubber sealing ring (36).

9. The automatic inspection equipment for wafer front side film lamination according to claim 8, characterized in that: A four-stage annular sealing groove is provided at the edge of the port of the adsorption groove (39), a four-stage rubber sealing ring (40) is embedded in the four-stage annular sealing groove, the end surface of the four-stage rubber sealing ring (40) is higher than the end surface of the adsorption seat, and a varistor (41) is provided at the bottom of the four-stage annular sealing groove, and the varistor (41) is electrically connected to the control module on the device through a primary wire (42).

10. The automatic inspection equipment for wafer front side film lamination according to claim 9, characterized in that: An air pressure detection sensor (43) is provided in the inner cavity of the upper adsorption seat (13) and the lower adsorption seat (14). The air pressure detection sensor (43) is electrically connected to a control module on the device via a secondary wire (44). When the piston (15) is located at the lower side, the upper cavity of the piston (15) is in a negative pressure state, and the lower cavity of the piston (15) is in a normal pressure state. When the piston (15) is located at the upper side, the upper cavity of the piston (15) is in a normal pressure state, and the lower cavity of the piston (15) is in a negative pressure state. The inner cavity side walls of the upper adsorption seat (13) and the lower adsorption seat (14) are provided with a pipeline connection port (45), and a stop valve is provided on the pipeline connection port (45).

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