Overcurrent protection device for computer mainboard

Abstract

The invention belongs to the technical field of computer mainboard over-current protection, and particularly relates to a computer mainboard over-current protection device which comprises a protection shell, a heat dissipation mechanism and a dust removal assembly, the heat dissipation mechanism and the dust removal assembly are both located in the protection shell and matched with each other, and a mainboard is installed in the protection shell. The heat dissipation mechanism comprises an air cooling assembly and a water cooling assembly, the effect of circulating heat absorption is achieved through backflow of liquid, a power piece controls a combination column to rotate, a liquid discharging plate descends, the liquid flows into a water cooling pipe, and when condensate touches a flow blocking plate and a flow guiding plate to slide outwards, a distance is generated between the condensate and the flow blocking plate, the condensate flows out. When the pressure of the water flow on the flow guide plate is smaller than the elastic force of the reset spring, the flow guide plate can reset, the liquid does not circulate, condensate flows into the water cooling box to enable the water level to rise, the liquid in the water cooling box can flow back into the assembly in the same mode, a backflow closed loop is formed in the same way, and heat in the protective shell is absorbed while the liquid circulates.

Description

Technical Field

[0001] The invention belongs to the technical field of over-current protection for computer mainboards, in particular to an over-current protection device for computer mainboards. Background Art

[0002] Computer motherboard overpowering usually refers to the motherboard failing to start normally or experiencing abnormal phenomena after power is turned on. This situation may be caused by a variety of reasons, including hardware failure, power supply problems, electrostatic interference, etc. The poor quality of the computer power supply itself or internal circuit damage may cause the output voltage to increase abnormally. For example, if the voltage stabilization circuit inside the power supply fails, the voltage of 12V, 5V, etc. that should be output stably may become too high, causing the motherboard to overpower. Damage to certain electronic components on the motherboard (such as capacitors, resistors, etc.) may cause a short circuit in the circuit, thereby changing the current path and size, causing partial or entire motherboard overpowering. For example, capacitor leakage or short circuit may increase the voltage of a normal circuit.

[0003] In the prior art, overcurrent protection devices are basically for current and voltage. When the voltage is unstable or the current changes, it may cause overcurrent on the motherboard. However, this may also be caused by abnormal changes in the temperature of the motherboard. When a large amount of dust accumulates on the surface of the motherboard, the heat cannot be dissipated, causing a short circuit.

[0004] To this end: the present invention provides a computer mainboard overcurrent protection device. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a computer motherboard overcurrent protection device described in the present invention includes a protective shell, a heat dissipation mechanism and a dust removal component, the heat dissipation mechanism and the dust removal component are both located inside the protective shell and cooperate with each other, a motherboard is installed inside the protective shell, and the heat dissipation mechanism includes an air cooling component and a water cooling component; The protective case is used to protect the motherboard from external impact. The dust removal component is used to remove dust on the surface of the protective case to prevent dust from falling on the motherboard, causing dust accumulation and local overtemperature. The heat dissipation mechanism is used to control the temperature inside the protective case to prevent the motherboard from overheating due to some objective factors and causing a short circuit. When controlling the temperature of the motherboard, if the external temperature is also very high, it is difficult to lower the internal temperature by simply increasing the air flow rate. At this time, a water cooling component is required to cool it down. Through the cooperation of the heat dissipation mechanism and the dust removal mechanism, the accumulation of dust can be avoided, and the temperature of the motherboard can be controlled.

[0007] Preferably, the air cooling component includes a spiral plate, the outer wall of the protective shell is provided with a main viewport, the spiral plate is installed on the outer wall of the main viewport, a power part and a combination part are installed inside the protective shell, a combination column is arranged inside the combination part, one end of the combination column is fixedly connected to the output shaft of the power part, one end of the combination column is fixedly connected to a track plate, a slide rail is provided on the outer wall of the track plate, the dust removal component includes a scraper, the outer wall of the scraper is slidably connected to the inner wall of the spiral plate, a connecting column is installed on the top of the scraper, the outer wall of the connecting column is slidably connected to the inner wall of the slide rail, the scraper It is replaceable, one end of the combined column is a smooth column, and the other end of the combined column is threaded. When dust falls on the heat dissipation port, it is likely to cause gas blockage. At this time, the power part controls the rotation of the track plate through the combined column, and the scraper part will move along the track on the spiral plate. At the same time, the scraper part will gradually move toward the center of the board along the slide rail until the scraper part reaches the end of the track on the spiral plate. All the dust falling on the heat dissipation port on the spiral plate will be removed. When this scraper part cannot be used, only one scraper part needs to be replaced. Through the dust removal component, the dust on the heat dissipation port can be removed.

[0008] Preferably, the water cooling assembly includes a drain plate, the outer wall of the threaded end of the assembly column is threadedly connected to the drain plate, the drain plate is slidably connected to the inner wall of the assembly, the outer wall of the assembly is provided with a plurality of water cooling pipes, a water cooling box is installed inside the protective shell, the other ends of the plurality of water cooling pipes are connected to the water cooling box, and an intercommunication plate is installed inside the water cooling pipes; The interconnecting plate divides the interior of the water-cooling tube into two layers, the upper layer of the water-cooling tube is the output layer, the lower layer of the water-cooling tube is the return layer, and the output layer and the return layer are both fixedly installed with a baffle plate at one end away from the return layer. The outer walls of both sides of the interconnecting plate are symmetrically provided with card grooves, the inner walls of the card grooves are clamped with card blocks, the inner walls of the card blocks are slidably connected with a lead-out column, the other end of the lead-out column is fixedly connected with a fixed plate, and the outer wall of the baffle is slidably connected with a sliding column; A guide plate is fixedly connected between the outer walls of the fixed plate, and the outer wall of the guide plate is fixedly connected to one end of the sliding column. The outer wall of the guide plate is slidably connected to the outer wall of the baffle plate. A return spring is fixedly connected between the fixed plate and the outer wall of the block. While the air cooling component cools down the mainboard, the power part controls the rotation of the combined column. The interior of the assembly is filled with condensate. The lower end of the combined column is threaded, and the drain plate is threadedly connected to the combined column. When the combined column rotates, the drain plate will drop, and the liquid will flow into the water-cooling pipe under pressure. The water-cooling pipe is divided into an upper and lower layer by the interconnecting plate, and the upper and lower layers of the water-cooling pipe are both unidirectional, so the condensate will flow around through one of the layers. When the condensate flows to the edge of the water-cooling pipe, it will touch the baffle plate, but because the guide plate is subjected to the impact force of the liquid , it will be controlled to slide outward. At this time, the guide column moves outward from the inside of the block, and a certain distance will be generated between the guide plate and the baffle plate. The condensate will flow out through the gap between the two. When the water flow gradually becomes smaller, the pressure of the water flow on the guide plate is less than the elastic force of the return spring, and the guide plate will be pulled back into the card slot of the baffle plate. At this time, the liquid no longer circulates, because the outermost end of the water-cooling pipe leads to the water-cooling box, so the condensate inside the assembly will eventually flow back into the water-cooling box. At the same time, the liquid in the water-cooling box increases, the water level line will also rise, and the other layer of the water-cooling pipe is lower than the water level line of the water-cooling box. Therefore, the liquid in the water-cooling box will also flow back to the assembly in the same way, forming a reflux closed loop in this way. While the liquid is circulating, it also absorbs the heat inside the protective shell. Through the reflux of the liquid, the effect of circulating heat absorption is achieved.

[0009] Preferably, a ventilation layer is provided inside the protective shell, a dustproof plate is installed at the bottom of the ventilation layer, a ventilation plate is installed at the top of the ventilation layer, a rotating cylinder is installed inside the ventilation layer, an output shaft of the rotating cylinder is fixedly connected to an air suction fan, a plurality of air guide holes are provided inside the protective shell, the air guide holes are used to connect the ventilation layer with the space where the main board is installed, a dustproof cover is installed on the outer wall of the air guide hole, a plurality of main transmission wheels are fixedly connected to the output shaft of the power part, a fixed column is rotatably connected to the inner wall of the protective shell, a slave transmission wheel is fixedly connected to the outer wall of the fixed column, a transmission belt is transmission-connected between the outer wall of each group of the main transmission wheels and the outer wall of the slave transmission wheel, and an exhaust fan is fixedly installed on the outer wall of the fixed column. Air fan. While the dust removal component is cleaning the protective shell, the air cooling component is also running. The bottom of the protective shell and the position below the mainboard is the ventilation layer. The top and bottom of the ventilation layer are the ventilation plate and the dust plate respectively. When the rotary cylinder starts to control the suction fan to rotate, the outside air will be sucked into the ventilation layer through the dust plate, and then part of the gas will enter the inside of the protective shell through the ventilation plate, and the remaining gas will enter the inside of the protective shell through the air guide hole. At the same time, the power part drives the slave drive wheel through the main drive wheel, thereby controlling the rotation of the exhaust fan. At this time, the bottom, top and side of the mainboard are all dissipating heat. The air cooling component accelerates the air in all directions of the mainboard, which achieves a more efficient cooling effect.

[0010] The beneficial effects of the present invention are as follows: 1. The computer motherboard overcurrent protection device described in the present invention achieves a circulating heat absorption effect through the reflux of liquid. The power part controls the combination column to rotate, the drain plate descends, and the liquid flows into the water cooling pipe. When the condensed liquid touches the baffle plate, the guide plate slides outward, and a distance is generated between the baffle plate and the condensed liquid flows out through the gap. When the pressure of the water flow on the guide plate is less than the elastic force of the return spring, the guide plate will be pulled back into the slot of the baffle plate. At this time, the liquid will no longer circulate, and the condensed liquid inside the assembly will flow back into the water cooling box. The water level in the water cooling box rises, and the liquid in the water cooling box will flow back to the assembly in the same way, forming a reflux closed loop in this way. While the liquid circulates, the heat inside the protective shell is also absorbed.

[0011] 2. The computer motherboard overcurrent protection device described in the present invention accelerates the air on the motherboard in all directions through the air cooling component, thereby achieving a more efficient cooling effect. The bottom of the protective shell and the position below the motherboard is the ventilation layer, and the top and bottom of the ventilation layer are the ventilation plate and the dustproof plate respectively. When the rotary cylinder starts to control the suction fan to rotate, the outside air will be sucked into the ventilation layer through the dustproof plate, and then a part of the gas will enter the interior of the protective shell through the ventilation plate, and the remaining gas will enter the interior of the protective shell through the air guide hole. At the same time, the power part drives the slave transmission wheel through the main transmission wheel, thereby controlling the rotation of the exhaust fan. At this time, the bottom, top and side of the motherboard are all dissipating heat.

[0012] 3. The computer motherboard overcurrent protection device described in the present invention has the effect of removing dust from the heat dissipation port through the dust removal component. When dust falls on the heat dissipation port, it is likely to cause gas blockage. At this time, the power part controls the rotation of the track plate through the combination column, and the scraper part will move along the track on the spiral plate. At the same time, the scraper part will gradually move toward the center of the board surface along the slide rail until the scraper part reaches the end of the track on the spiral plate. The dust falling on the heat dissipation port on the spiral plate will be completely removed. When this scraper part cannot be used, it only needs to be replaced with a scraper part. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Figure 1 It is an overall diagram of the present invention; Figure 2 It is a schematic diagram of the spiral plate structure of the present invention; Figure 3 It is a schematic diagram of the water cooling box structure of the present invention; Figure 4 It is a schematic diagram of the cross-sectional structure of the assembly of the present invention; Figure 5 It is a schematic diagram of the internal detailed structure of the water cooling tube of the present invention; Figure 6 is a schematic diagram of the structure of the air cooling assembly of the present invention; Figure 7 It is a schematic diagram of the internal structure of the protective shell of the present invention; Figure 8 It is a schematic diagram of the structure of the dustproof plate of the present invention; Fig. 9 It is a schematic diagram of the cross-sectional structure of the protective shell of the present invention; Fig.10 The present invention Figure 2 Enlarged structural diagram at A in the middle.

[0015] In the figure: 1, protective shell; 3, spiral plate; 4, power part; 5, ventilation layer; 10, heat dissipation mechanism; 100, air cooling component; 101, assembly; 102, assembly column; 103, track plate; 104, slide rail; 105, air intake fan; 106, air guide hole; 107, main transmission wheel; 108, fixed column; 109, slave transmission wheel; 110, transmission belt; 111, exhaust fan; 200, water cooling component; 2 01. Drain plate; 202. Water cooling pipe; 203. Water cooling box; 204. Interconnecting plate; 205. Baffle plate; 206. Slot; 207. Block; 208. Lead-out column; 209. Fixed plate; 210. Sliding column; 211. Guide plate; 212. Return spring; 300. Dust removal assembly; 301. Scraping piece; 302. Connecting column; 303. Dustproof plate; 304. Ventilation plate; 305. Rotating cylinder. DETAILED DESCRIPTION

[0016] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0017] like Figures 1 to 10 As shown, a computer motherboard overcurrent protection device according to an embodiment of the present invention comprises a protective shell 1, a heat dissipation mechanism 10 and a dust removal assembly 300. The heat dissipation mechanism 10 and the dust removal assembly 300 are both located inside the protective shell 1 and cooperate with each other. A motherboard is installed inside the protective shell 1. The heat dissipation mechanism 10 comprises an air cooling assembly 100 and a water cooling assembly 200. During operation, the protective shell 1 is used to prevent the mainboard from being hit by external forces. The dust removal component 300 is used to remove dust on the surface of the protective shell 1 to prevent dust from falling on the mainboard, causing dust accumulation and local overtemperature. The heat dissipation mechanism 10 is used to control the temperature inside the protective shell 1 to prevent the mainboard from being overheated due to some objective factors and causing a short circuit. When controlling the temperature of the mainboard, if the external temperature is also very high, it is difficult to reduce the internal temperature by simply increasing the air flow rate. At this time, the water cooling component 200 is required to cool it down. Through the cooperation of the heat dissipation mechanism 10 and the dust removal mechanism, the dust accumulation can be avoided and the temperature of the mainboard can be controlled.

[0018] like Figures 2 to 7As shown, the air cooling component 100 includes a spiral plate 3, the outer wall of the protective shell 1 is provided with a main viewport, the spiral plate 3 is installed on the outer wall of the main viewport, the power member 4 and the assembly 101 are installed inside the protective shell 1, the assembly 101 is provided with a combination column 102 inside, one end of the combination column 102 is fixedly connected to the output shaft of the power member 4, one end of the combination column 102 is fixedly connected to a track plate 103, the outer wall of the track plate 103 is provided with a slide rail 104, the dust removal component 300 includes a scraper 301, the outer wall of the scraper 301 is slidably connected to the inner wall of the spiral plate 3, the top of the scraper 301 is provided with a connecting column 302, the outer wall of the connecting column 302 is slidably connected to the inner wall of the slide rail 104, and the scraper 301 is replaceable; When working, one end of the combined column 102 is a smooth column, and the other end of the combined column 102 is threaded. When dust falls on the heat dissipation port, it is likely to cause gas blockage. At this time, the power part 4 controls the rotation of the track plate 103 through the combined column 102, and the scraper 301 will move along the track on the spiral plate 3. At the same time, the scraper 301 will also gradually move toward the center of the board along the slide rail 104 until the scraper 301 rotates to the end of the track on the spiral plate 3. All the dust falling on the heat dissipation port of the spiral plate 3 will be removed. When this scraper 301 cannot be used, only one scraper 301 needs to be replaced. Through the dust removal component 300, the dust on the heat dissipation port is removed.

[0019] like Figures 4 to 7 As shown, the water cooling assembly 200 includes a drain plate 201, the outer wall of the threaded end of the assembly column 102 is threadedly connected to the drain plate 201, the drain plate 201 is slidably connected to the inner wall of the assembly 101, a plurality of water cooling pipes 202 are arranged on the outer wall of the assembly 101, a water cooling box 203 is installed inside the protective shell 1, the other ends of the plurality of water cooling pipes 202 are all connected to the water cooling box 203, and an interconnecting plate 204 is installed inside the water cooling pipe 202; The interconnecting plate 204 divides the interior of the water-cooling tube 202 into two layers, the upper layer of the water-cooling tube 202 is the output layer, and the lower layer of the water-cooling tube 202 is the return layer. The output layer and the return layer are both fixedly installed with a baffle plate 205 at one end away from the other. The outer walls of both sides of the interconnecting plate 204 are symmetrically provided with a card slot 206, and the inner wall of the card slot 206 is clamped with a card block 207. The inner wall of the card block 207 is slidably connected with a lead-out column 208, and the other end of the lead-out column 208 is fixedly connected with a fixed plate 209. The outer wall of the baffle plate 205 is slidably connected with a sliding column 210; A guide plate 211 is fixedly connected between the outer walls of the fixed plate 209, the outer wall of the guide plate 211 is fixedly connected to one end of the sliding column 210, the outer wall of the guide plate 211 is slidably connected to the outer wall of the spoiler 205, and a return spring 212 is fixedly connected between the fixed plate 209 and the outer wall of the block 207; During operation, while the air cooling assembly 100 cools down the mainboard, the power part 4 controls the combined column 102 to rotate, the interior of the combined column 101 is filled with condensate, the lower end of the combined column 102 is threaded, and the drain plate 201 is threadedly connected to the combined column 102. When the combined column 102 rotates, the drain plate 201 will drop, and the liquid will flow into the water cooling pipe 202 under pressure, wherein the water cooling pipe 202 is divided into an upper and lower layer by the interconnecting plate 204, and the upper and lower layers of the water cooling pipe 202 are both unidirectional, so the condensate will flow around through one of the layers, and when the condensate flows to the edge of the water cooling pipe 202, it will touch the baffle plate 205, but because the guide plate 211 is subjected to the impact force of the liquid, it will be controlled to slide outward, and at this time the outlet column 208 moves outward from the inside of the block 207, and the guide plate 211 and the baffle plate 205 will have a certain distance between them, and the condensate will flow out through the gap between them. When the water flow gradually becomes smaller, the pressure of the water flow on the guide plate 211 is less than the elastic force of the return spring 212, and the guide plate 211 will be pulled back into the slot 206 of the baffle 205. At this time, the liquid no longer circulates, because the outermost end of the water-cooling tube 202 leads to the water-cooling box 203, so the condensate inside the assembly 101 will eventually flow back into the water-cooling box 203. At the same time, the liquid in the water-cooling box 203 increases, and the water level line will also rise. The other layer of the water-cooling tube 202 is lower than the water level line of the water-cooling box 203. Therefore, the liquid in the water-cooling box 203 will also flow back to the assembly 101 in the same way, and a reflux closed loop is formed in this way. While the liquid circulates, the heat inside the protective shell 1 is also absorbed. Through the reflux of the liquid, the effect of circulating heat absorption is achieved.

[0020] like Figures 4 to 7 As shown, a ventilation layer 5 is provided inside the protective shell 1, a dustproof plate 303 is installed at the bottom of the ventilation layer 5, a ventilation plate 304 is installed at the top of the ventilation layer 5, a rotating cylinder 305 is installed inside the ventilation layer 5, and an output shaft of the rotating cylinder 305 is fixedly connected to an air suction fan 105, a plurality of air guide holes 106 are provided inside the protective shell 1, and the air guide holes 106 are used to connect the ventilation layer 5 with the space where the main board is installed, and a dustproof cover is installed on the outer wall of the air guide hole 106, a plurality of main transmission wheels 107 are fixedly connected to the output shaft of the power part 4, a fixed column 108 is rotatably connected to the inner wall of the protective shell 1, and a slave transmission wheel 109 is fixedly connected to the outer wall of the fixed column 108, a transmission belt 110 is transmission-connected between the outer wall of each group of main transmission wheels 107 and the outer wall of the slave transmission wheel 109, and an exhaust fan 111 is fixedly installed on the outer wall of the fixed column 108; During operation, while the dust removal component 300 is cleaning the protective shell 1, the air cooling component 100 is also running. The bottom of the protective shell 1 and the position below the mainboard is the ventilation layer 5. The top and bottom of the ventilation layer 5 are the ventilation plate 304 and the dustproof plate 303 respectively. When the rotating cylinder 305 starts to control the suction fan 105 to rotate, the outside air will be sucked into the ventilation layer 5 through the dustproof plate 303, and then a part of the gas will enter the interior of the protective shell 1 through the ventilation plate 304, and the remaining gas will enter the interior of the protective shell 1 through the air guide hole 106. At the same time, the power part 4 drives the slave transmission wheel 109 through the main transmission wheel 107, thereby controlling the rotation of the exhaust fan 111. At this time, the bottom, top and side of the mainboard are all dissipating heat. The air cooling component 100 accelerates the air in all directions of the mainboard, which achieves a more efficient cooling effect.

[0021] Working principle: The protective shell 1 is used to prevent the mainboard from being hit by external forces. The dust removal component 300 is used to remove dust on the surface of the protective shell 1 to prevent dust from falling on the mainboard, causing dust accumulation and local overtemperature. The heat dissipation mechanism 10 is used to control the temperature inside the protective shell 1 to prevent the mainboard from being overheated due to some objective factors and causing a short circuit. When controlling the temperature of the mainboard, if the external temperature is also very high, it is difficult to reduce the internal temperature by simply increasing the air flow rate. At this time, the water cooling component 200 is required to cool it down. When dust falls on the heat dissipation port, it is likely to cause gas blockage. At this time, the power part 4 controls the rotation of the track plate 103 through the combination column 102, and the dust scraper 301 will follow the spiral plate 3 The dust scraper 301 moves along the track, and at the same time, the dust scraper 301 will gradually move toward the center of the board surface along the slide rail 104 until the dust scraper 301 reaches the end of the track on the spiral plate 3. The dust falling on the heat dissipation outlet of the spiral plate 3 will be completely removed. When this dust scraper 301 cannot be used, only one dust scraper 301 needs to be replaced. While the dust removal component 300 is cleaning the protective shell 1, the air cooling component 100 is also running. The bottom of the protective shell 1 and the position below the main board are the ventilation layer 5. The top and bottom of the ventilation layer 5 are the ventilation plate 304 and the dustproof plate 303 respectively. When the rotating cylinder 305 starts to control the suction fan 105 to rotate, the outside air will be sucked into the ventilation layer 5 through the dustproof plate 303, and then a Part of the gas will enter the interior of the protective shell 1 through the ventilation plate 304, and the remaining gas will enter the interior of the protective shell 1 through the air guide hole 106. At the same time, the power part 4 drives the slave transmission wheel 109 through the main transmission wheel 107, thereby controlling the exhaust fan 111 to rotate. At this time, the bottom, top and side of the mainboard are all dissipating heat. While the air cooling component 100 cools the mainboard, the power part 4 controls the combination column 102 to rotate. The interior of the combination 101 is filled with condensate. The lower end of the combination column 102 is threaded. The drain plate 201 is threadedly connected to the combination column 102. When the combination column 102 rotates, the drain plate 201 will drop, and the liquid will flow into the water cooling pipe 202 under pressure. Among them, the water cooling pipe 202 is divided into two layers, an upper layer and a lower layer, by the interconnecting plate 204, and the upper and lower layers of the water-cooling tube 202 are both unidirectionally conductive, so the condensate will flow around through one of the layers, and when the condensate flows to the edge of the water-cooling tube 202, it will touch the baffle plate 205, but because the baffle plate 211 is impacted by the liquid, it will be controlled to slide outward, and at this time, the guide column 208 moves outward from the inside of the block 207, and a certain distance will be generated between the baffle plate 211 and the baffle plate 205, and the condensate will flow out through the gap between the two. When the water flow gradually becomes smaller, the pressure of the water flow on the baffle plate 211 is less than the elastic force of the return spring 212, and the baffle plate 211 will be pulled back into the card slot 206 of the baffle plate 205, and the liquid will no longer flow.Because the outermost end of the water cooling tube 202 leads to the water cooling box 203, the condensed liquid inside the final assembly 101 will flow back into the water cooling box 203. At the same time, the liquid in the water cooling box 203 increases, and the water level rises. The other layer of the water cooling tube 202 is lower than the water level of the water cooling box 203. Therefore, the liquid in the water cooling box 203 will flow back to the assembly 101 in the same way, and a reflux closed loop is formed in this way. While the liquid is circulating, the heat inside the protective shell 1 is also absorbed. Through the reflux of the liquid, the effect of circulating heat absorption is achieved.

[0022] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A computer motherboard overcurrent protection device, characterized in that: It comprises a protective shell (1), a heat dissipation mechanism (10) and a dust removal component (300), wherein the heat dissipation mechanism (10) and the dust removal component (300) are both located inside the protective shell (1) and cooperate with each other; A mainboard is installed inside the protective shell (1); The heat dissipation mechanism (10) comprises an air cooling component (100) and a water cooling component (200).

2. A computer motherboard overcurrent protection device according to claim 1, characterized in that: The air cooling component (100) comprises a spiral plate (3), the outer wall of the protective shell (1) is provided with a main viewport, the spiral plate (3) is mounted on the outer wall of the main viewport, a power component (4) and an assembly component (101) are mounted inside the protective shell (1), a combination column (102) is arranged inside the assembly component (101), one end of the combination column (102) is fixedly connected to the output shaft of the power component (4), one end of the combination column (102) is fixedly connected to a track plate (103), and the outer wall of the track plate (103) is provided with a slide rail (104).

3. A computer motherboard overcurrent protection device according to claim 1, characterized in that: The dust removal assembly (300) comprises a scraper (301), the outer wall of the scraper (301) being slidably connected to the inner wall of the spiral plate (3), a connecting column (302) being installed on the top of the scraper (301), the outer wall of the connecting column (302) being slidably connected to the inner wall of the slide rail (104), and the scraper (301) is replaceable; One end of the combined column (102) is a smooth column, and the other end of the combined column (102) is threaded.

4. A computer motherboard overcurrent protection device according to claim 3, characterized in that: The water cooling component (200) comprises a liquid drain plate (201), the outer wall of the threaded end of the assembly column (102) is threadedly connected to the liquid drain plate (201), the liquid drain plate (201) is slidably connected to the inner wall of the assembly (101), and the outer wall of the assembly (101) is provided with a plurality of water cooling pipes (202); A water cooling box (203) is installed inside the protective shell (1); the other ends of the plurality of water cooling tubes (202) are all connected to the water cooling box (203); and an interconnecting plate (204) is installed inside the water cooling tubes (202).

5. A computer motherboard overcurrent protection device according to claim 4, characterized in that: The interconnecting plate (204) divides the interior of the water-cooling tube (202) into two layers, the upper layer of the water-cooling tube (202) being the output layer, the lower layer of the water-cooling tube (202) being the return layer, the output layer and the return layer being fixedly mounted with a baffle plate (205) at one end thereof away from the return layer, both sides of the outer wall of the interconnecting plate (204) being symmetrically provided with a card slot (206), the inner wall of the card slot (206) being clamped with a card block (207), the inner wall of the card block (207) being slidably connected with a lead-out column (208), the other end of the lead-out column (208) being fixedly connected with a fixed plate (209), and the outer wall of the baffle plate (205) being slidably connected with a sliding column (210).

6. A computer motherboard overcurrent protection device according to claim 5, characterized in that: A guide plate (211) is fixedly connected between the outer walls of the fixed plate (209), the outer wall of the guide plate (211) is fixedly connected to one end of the sliding column (210), the outer wall of the guide plate (211) is slidably connected to the outer wall of the spoiler (205), and a return spring (212) is fixedly connected between the fixed plate (209) and the outer wall of the clamping block (207).

7. A computer motherboard overcurrent protection device according to claim 1, characterized in that: A ventilation layer (5) is provided inside the protective shell (1), a dustproof plate (303) is installed at the bottom of the ventilation layer (5), a ventilation plate (304) is installed at the top of the ventilation layer (5), a rotating cylinder (305) is installed inside the ventilation layer (5), and an output shaft of the rotating cylinder (305) is fixedly connected to an air suction fan (105).

8. The computer motherboard overcurrent protection device according to claim 1, characterized in that: A plurality of air guide holes (106) are provided inside the protective shell (1), the air guide holes (106) being used to connect the ventilation layer (5) with the space containing the mainboard, and dust covers are installed on the outer walls of the air guide holes (106).

9. A computer motherboard overcurrent protection device according to claim 2, characterized in that: The output shaft of the power member (4) is fixedly connected to a plurality of main transmission wheels (107), the inner wall of the protective shell (1) is rotatably connected to a fixing column (108), the outer wall of the fixing column (108) is fixedly connected to a slave transmission wheel (109), and a transmission belt (110) is transmission-connected between the outer wall of each group of the main transmission wheels (107) and the outer wall of the slave transmission wheel (109).

10. A computer motherboard overcurrent protection device according to claim 9, characterized in that: An exhaust fan (111) is fixedly mounted on the outer wall of the fixed column (108).

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