Method for repairing SiP interconnection fault through configurable circuit
CN119473734APending Publication Date: 2025-02-1858TH RES INST OF CETC
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Patent Information
- Application Number
- CN202411493037.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-02-18
AI Technical Summary
Technical Problem
The existing SiP internal interconnection line cannot be configured and the problem of interconnection failure cannot be fixed.
Method used
In the design stage of internal bare chip interconnection of SiP, configurable circuits for inter-pin interconnection are added, multi-path interconnection between pins is achieved through path selection and multiple selection switches, and re-select the fault-free path in the event of a failure. Repair.
Benefits of technology
The configurability of the SiP interconnection line is realized, which can efficiently repair interconnection failures, improve the reusability and yield of SiP, and reduce maintenance costs.
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Abstract
The invention discloses a method for repairing SiP interconnection faults through a configurable circuit, and belongs to the field of integrated circuit packaging. In an interconnection design stage between bare chips in the SiP, a configurable circuit used for interconnection between pins is added, and more selection paths are provided for interconnection between the pins; and when an interconnection fault occurs in the SiP, reselecting a fault-free path through the configurable circuit to complete interconnection fault repair. According to the invention, a new SiP interconnection circuit structure is designed, a configurable circuit is added, a plurality of interconnection line path selections can be provided for interconnected pins, and the method has the advantage that the interconnection lines are configurable; by designing a new SiP interconnection circuit structure, a configurable circuit is added, interconnection faults such as short circuit between an interconnection line and a power supply or the ground, open circuit of a single interconnection line and adhesion between the interconnection lines can be repaired, the fault SiP does not need to be disassembled and replaced, and the method has the advantages of high efficiency, low cost, self-repairing and the like.
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