Electrical test data monitoring method and device, electronic equipment and storage medium

Abstract

The invention provides a wafer electrical test data monitoring method and device, electronic equipment and a storage medium. The wafer electrical test data monitoring method comprises the steps of uploading an electrical test data file of a to-be-detected wafer in a target batch at a wafer receiving test site; performing file analysis on the electrical test data file at the wafer test receiving waiting station to determine a plurality of electrical test data of the to-be-detected wafer in the target batch; uploading a preset configuration product rule group and a configuration product parameter list obtained from the database to a wafer test receiving waiting station, performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list, and determining a judgment result of the to-be-detected wafer in the target batch; and determining the next execution action of the to-be-detected wafer in the target batch based on the plurality of judgment results of the to-be-detected wafer in the target batch, thereby improving the precision of wafer WAT data management and control.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an electrical test data monitoring method, device, electronic equipment and storage medium. Background Art

[0002] The role of semiconductor WAT (wafer acceptance test) is mainly reflected in the following aspects: (1) Quality assessment: By testing the electrical parameters of specific test structures on the wafer (usually the test key located on the cutting path), WAT can evaluate the process status of each wafer and ensure that the wafer product meets the established electrical specifications. This serves as the criterion for judging the quality of the wafer product. (2) Process monitoring: WAT data reflects the quality and stability of the semiconductor manufacturing process, helping manufacturers monitor and control key parameters in the production process to ensure process consistency and reliability. By collecting and analyzing WAT data, potential problems and trends in the production line can be discovered, and abnormal conditions that may affect product quality can be warned in advance, so as to adjust the process in time and avoid batch production defects. (3) Cost-effectiveness: By discovering and solving quality problems at the early stage of the wafer level, defective products in the downstream packaging and testing stages can be reduced, thereby reducing overall production costs and improving economic benefits. Therefore, how to monitor the electrical test data of wafers has become a technical issue that cannot be underestimated. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a method, device, electronic device and storage medium for monitoring electrical test data of a wafer, and to obtain accurate judgment results by performing rule judgment on the electrical test data according to a configuration product rule group and a configuration product parameter list, thereby improving the accuracy of the wafer's WAT data control.

[0004] The present application provides a method for monitoring electrical test data of a wafer, the method comprising:

[0005] Uploading the electrical test data file of the wafers to be tested under the target batch at the wafer acceptance test site, and uploading the electrical test data file to the wafer acceptance test waiting site after checking the electrical test data file;

[0006] Parsing the electrical test data file at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested under a target batch;

[0007] Uploading the preset configuration product rule group and configuration product parameter list obtained from the database to the wafer acceptance test waiting site, performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list, and determining the judgment result of the wafer to be tested under the target batch;

[0008] Based on multiple judgment results of the wafers to be inspected under the target batch, the next execution action for the wafers to be inspected under the target batch is determined; wherein the execution action includes controlling the wafers to be inspected under the target batch to enter the next station or be retested.

[0009] In a possible implementation manner, the step of performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list at the wafer acceptance test waiting station to determine the judgment result of the target batch of wafers to be tested includes:

[0010] Determine the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection points;

[0011] Based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list, the judgment results of the wafers to be inspected under the target batch are determined.

[0012] In a possible implementation manner, for any wafer to be inspected, determining the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection point includes:

[0013] Detecting whether the number of electrical test data of the wafer to be detected that passes the test at the corresponding wafer test point is greater than or equal to a first preset number;

[0014] If yes, the inspection result of the wafer to be inspected is failure;

[0015] If not, the inspection result of the wafer to be inspected is passed.

[0016] In a possible implementation manner, the determination of the judgment result of the wafers to be inspected in the target batch based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list includes:

[0017] If the total number of failures of the plurality of wafers to be inspected in the target batch exceeds a second preset number, determining that the judgment result of the wafers to be inspected in the target batch is failure;

[0018] If the total number of failures of any electrical test data at the wafer inspection point exceeds a third preset number, it is determined that the judgment result of the wafer to be inspected in the target batch is a failure;

[0019] If the parameter definition of the electrical test data of the wafer to be tested is inconsistent with the parameter definition in the configuration product parameter list, it is determined that the judgment result of the wafer to be tested under the target batch is failure;

[0020] If the test numbers of the wafer inspection points between any two wafers to be inspected are inconsistent, it is determined that the judgment result of the wafer to be inspected under the target batch is failure;

[0021] If the total number of failures of the electrical test data at any wafer inspection point of the plurality of wafers to be inspected exceeds a fourth preset number, it is determined that the judgment result of the wafers to be inspected in the target batch is failure.

[0022] In a possible implementation manner, the step of determining the next execution action for the wafers to be inspected in the target batch based on the multiple judgment results of the wafers to be inspected in the target batch includes:

[0023] If the plurality of judgment results are all successful, the wafers to be inspected in the target batch are sent to the next station;

[0024] If any of the judgment results is failure, the wafers to be inspected in the target batch are retested.

[0025] In a possible implementation manner, before uploading the preset configuration product rule group and the configuration product parameter list obtained from the database to the wafer acceptance test waiting station, the electrical test data monitoring method further includes:

[0026] Based on user requirements, multiple preset quantities in the configuration product rule group are configured to generate a new configuration product rule group.

[0027] In a possible implementation manner, an electrical test data file of wafers to be tested in a target batch is uploaded at a wafer acceptance test site, and after checking the electrical test data file, before uploading the electrical test data file to a wafer acceptance test waiting site, the electrical test data monitoring method further includes:

[0028] Uploading the electrical test data file to the database, and periodically scanning the database to determine the electrical test data file that has not been judged in the database;

[0029] Parsing the electrical test data file that has not been judged at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested under the target batch;

[0030] Uploading the preset configuration product rule group and configuration product parameter list obtained from the database to the wafer acceptance test waiting site, performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list at the wafer acceptance test waiting site, and determining the judgment result of the wafer to be tested under the target batch;

[0031] Based on multiple judgment results of the wafers to be inspected in the target batch, the next execution action for the wafers to be inspected in the target batch is determined.

[0032] The embodiment of the present application also provides a wafer electrical test data monitoring device, the electrical test data monitoring device comprising:

[0033] An acquisition module is used to upload the electrical test data file of the wafers to be tested under the target batch at the wafer acceptance test site, and upload the electrical test data file to the wafer acceptance test waiting site after checking the electrical test data file;

[0034] A file parsing module, used for parsing the electrical test data file at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested under a target batch;

[0035] A rule judgment module is used to upload a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, perform rule judgment on a plurality of the electrical test data based on the configuration product rule group and the configuration product parameter list, and determine a judgment result of the wafer to be tested under a target batch;

[0036] An execution action determination module is used to determine the next execution action for the wafers to be inspected under the target batch based on multiple judgment results of the wafers to be inspected under the target batch; wherein the execution action includes controlling the wafers to be inspected under the target batch to enter the next station or be retested.

[0037] An embodiment of the present application also provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of the above-mentioned wafer electrical test data monitoring method are performed.

[0038] An embodiment of the present application further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the above-mentioned method for monitoring the electrical test data of a wafer are executed.

[0039] The embodiments of the present application provide a method, device, electronic device and storage medium for monitoring electrical test data of wafers. The method comprises: uploading an electrical test data file of wafers to be tested in a target batch at a wafer acceptance test site, and uploading the electrical test data file to a wafer acceptance test waiting site after checking the electrical test data file; parsing the electrical test data file at the wafer acceptance test waiting site to determine multiple electrical test data of the wafers to be tested in the target batch; uploading a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, performing rule judgment on the multiple electrical test data based on the configuration product rule group and the configuration product parameter list, and determining the judgment result of the wafers to be tested in the target batch; determining the next execution action for the wafers to be tested in the target batch based on the multiple judgment results of the wafers to be tested in the target batch; wherein the execution action comprises controlling the wafers to be tested in the target batch to enter the next site or to be retested. According to the configuration product rule group and the configuration product parameter list, the electrical test data is judged according to the rules to obtain accurate judgment results, thereby improving the accuracy of wafer WAT data management and control.

[0040] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 One of the flow charts of a method for monitoring electrical test data of a wafer provided in an embodiment of the present application;

[0043] Figure 2 A second flowchart of a method for monitoring electrical test data of a wafer provided in an embodiment of the present application;

[0044] Figure 3One of the structural schematic diagrams of a wafer electrical test data monitoring device provided in an embodiment of the present application;

[0045] Figure 4 A second structural diagram of a wafer electrical test data monitoring device provided in an embodiment of the present application;

[0046] Figure 5 A schematic structural diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, each other embodiment obtained by those skilled in the art without making creative work belongs to the scope of protection of the present application.

[0048] First, the application scenarios to which the present application is applicable are introduced. The present application can be applied in the field of semiconductor manufacturing technology.

[0049] Research has found that the role of semiconductor WAT (wafer acceptance test) is mainly reflected in the following aspects: (1) Quality assessment: By testing the electrical parameters of specific test structures on the wafer (usually the test key located on the cutting path), WAT can evaluate the process status of each wafer and ensure that the wafer product meets the established electrical specifications. This serves as a criterion for judging the quality of the wafer product. (2) Process monitoring: WAT data reflects the quality and stability of the semiconductor manufacturing process, helping manufacturers monitor and control key parameters in the production process to ensure process consistency and reliability. By collecting and analyzing WAT data, potential problems and trends in the production line can be discovered, and abnormal conditions that may affect product quality can be warned in advance, so as to adjust the process in time and avoid batch production defects. (3) Cost-effectiveness: By discovering and solving quality problems at the early stage of the wafer level, defective products in the downstream packaging and testing stages can be reduced, thereby reducing overall production costs and improving economic benefits. Therefore, how to monitor the electrical test data of wafers has become a technical issue that cannot be underestimated.

[0050] Based on this, an embodiment of the present application provides a method for monitoring electrical test data of a wafer, which performs rule judgment on the electrical test data according to a configuration product rule group and a configuration product parameter list to obtain accurate judgment results, thereby improving the accuracy of WAT data management and control of the wafer.

[0051] See also Figure 1 , Figure 1 This is one of the flow charts of a method for monitoring the electrical test data of a wafer provided in an embodiment of the present application. Figure 1 As shown in , the electrical test data monitoring method provided by the embodiment of the present application includes:

[0052] S101: uploading electrical test data files of wafers to be tested in a target batch at a wafer acceptance test site, and uploading the electrical test data files to a wafer acceptance test waiting site after checking the electrical test data files.

[0053] In this step, the electrical test data file of the wafers to be tested under the target batch is uploaded at the wafer acceptance test site, and after the electrical test data file is checked, the electrical test data file is uploaded to the wafer acceptance test waiting site.

[0054] Among them, the wafer acceptance test is that the measuring machine will measure the fixed points (Site) on the wafer, and the measurement results are the results of different electrical parameters at different Sites.

[0055] S102: parsing the electrical test data file at the wafer test waiting station to determine a plurality of electrical test data of the wafers to be tested in a target batch.

[0056] In this step, the electrical test data file is parsed at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested in the target batch.

[0057] Here, the device uploads the output data files to the specified file directory, and then monitors the directory through a scheduled task. When a new file is found, it will parse the file into the database.

[0058] Among them, for Offline WAT (users only need to view the results of rule judgment), the device only needs to throw files in the specified directory, and the system will automatically enter its data into the database. The system will have a scheduled task to scan the WAT measurement data that has been stored in the database but not judged, and take out its data for judgment, and then store the judgment results in the database.

[0059] S103: Upload the preset configuration product rule group and configuration product parameter list obtained from the database to the wafer acceptance test waiting station, perform rule judgment on the multiple electrical test data based on the configuration product rule group and the configuration product parameter list, and determine the judgment results of the wafers to be tested under the target batch.

[0060] In this step, the pre-set configuration product rule group and configuration product parameter list obtained from the database are uploaded to the wafer acceptance test waiting station, and rule judgment is performed on multiple electrical test data based on the configuration product rule group and configuration product parameter list to determine the judgment results of the wafers to be tested under the target batch.

[0061] The judgment result is whether the electrical test data of the wafer has passed.

[0062] Here, the definition of wafer test parameters is set in the configuration product parameter list.

[0063] i: Determine the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection points.

[0064] In this step, the inspection result of the wafer to be inspected is determined according to the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection points.

[0065] In a possible implementation manner, for any wafer to be inspected, determining the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection point includes:

[0066] A: Detect whether the number of electrical test data of the wafer to be inspected that passes the inspection at the corresponding wafer inspection point is greater than or equal to a first preset number.

[0067] Here, it is detected whether the number of electrical test data of the wafer to be inspected that passes the inspection at the corresponding wafer inspection point is greater than or equal to a first preset number.

[0068] B: If yes, the inspection result of the wafer to be inspected is failed; if no, the inspection result of the wafer to be inspected is passed.

[0069] Here, if yes, the inspection result of the wafer to be inspected is failed; if no, the inspection result of the wafer to be inspected is passed.

[0070] In a specific embodiment, if multiple wafer inspection points fail in a wafer to be inspected, the inspection result of the wafer to be inspected is a failure. For example, the first preset number is configured as 3, indicating that a wafer needs three wafer inspection points (Site) to fail before the wafer (Wafer) is considered a failure. The R00003 parameter of Wafer 1 is 5Fail at Site 4, 3Pass at Site 1 2; and the R00003 parameter of Wafer 2 is 5Fail at Site 12, 4Pass at Site 2. Then the inspection result is: Wafer 1 Fail Count (2) < 3Pass, Wafer 2 Fail Count (3) > = 3Fail.

[0071] ii: Based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list, the judgment results of the wafers to be inspected under the target batch are determined.

[0072] In this step, the judgment results of the wafers to be inspected under the target batch are determined according to the inspection results of multiple wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configuration product parameter list.

[0073] In a possible implementation manner, the determination of the judgment result of the wafers to be inspected in the target batch based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list includes:

[0074] (1): If the total number of failures of the plurality of wafers to be inspected in the target batch exceeds a second preset number, it is determined that the judgment result of the wafers to be inspected in the target batch is failure.

[0075] Here, if the number of failed wafers in a target batch is greater than a set value, the judgment result of the wafer to be inspected under the target batch is failure.

[0076] (2): If the total number of failures of any electrical test data at the wafer inspection point exceeds a third preset number, it is determined that the judgment result of the wafer to be inspected in the target batch is a failure.

[0077] Here, if the total number of failures of any electrical test data at the wafer inspection point exceeds a third preset number, it is determined that the judgment result of the wafer to be inspected in the target batch is a failure.

[0078] Among them, setting the third preset number to 0.3 means that when more than 30% of the Sites in the target batch fail, the inspection result of the wafers to be inspected under the target batch is failed, such as the R00003 parameter of Wafer 1 fails in Site 2 3, and passes in Site 1 45; the R00006 parameter fails in Site 4 5, and the R00003 parameter of Wafer 2 fails in Site 1, 3, and passes in Site 2, 4, and 5; the R00001 parameter fails in Site 2; R0006 fails in Site 1; and R00009 fails in Site 3. The judgment result is that the parameter R00003 fails in S2 and S3 in Wafer 1; and Wafer 2 fails in S1 and S3. There are two wafers and 10 sites in the lot. Then the Fail Ratio of R00003=4 / 10=40%>30%, and the judgment result of the wafer to be inspected in the target batch is failure.

[0079] (3): If the parameter definition of the electrical test data of the wafer to be inspected is inconsistent with the parameter definition in the configured product parameter list, it is determined that the judgment result of the wafer to be inspected under the target batch is failure.

[0080] Here, if the parameter definition (parameter name, parameter unit, parameter level) of the electrical test data in the electrical test data file is inconsistent with the parameter definition of the configuration product parameter list uploaded by the engineer, the judgment result of the wafer to be tested under the target batch is failure.

[0081] (4): If the test numbers of the wafer inspection points between any two wafers to be inspected are inconsistent, it is determined that the judgment result of the wafer to be inspected under the target batch is failure.

[0082] Here, if the number of test points of wafer inspections between wafers to be inspected is inconsistent, the judgment result of the wafers to be inspected in the target batch is failure, such as: Wafer 1 tested Site 1 2 3 4 5, Wafer 2 tested Site 1 2 3 4. The judgment result is: Wafer 1 tested 5 sites, Wafer 2 tested 4 sites, and the judgment result of the wafers to be inspected in the target batch is failure.

[0083] (5): If the total number of failures of the electrical test data at any wafer inspection point of the plurality of wafers to be inspected exceeds a fourth preset number, it is determined that the judgment result of the wafers to be inspected in the target batch is a failure.

[0084] Here, if the total number of failures of the electrical test data at any wafer inspection point of the multiple wafers to be inspected exceeds the fourth preset number, it is determined that the judgment result of the wafer to be inspected under the target batch is a failure. For example, the fourth preset number is 0.4, data: Wafer 1's R00001 parameter is at Site1 3Fail, R00006 Site 2Fail, R00008 Site2Fail, Wafer 2's R00001 parameter is at Site3Fail, R00003 Site 3Fail, R00008 Site 3Fail, R00009 Site 3Fail. The judgment result is:

[0085] The parameter Fail Count of Site 3 of Wafer 2 is 4, the total number of parameters measured is 9, Fail Ratio is 4 / 9=44.4%>40%, and the judgment result of the wafer to be tested under the target batch is failure.

[0086] In a possible implementation manner, before uploading the preset configuration product rule group and the configuration product parameter list obtained from the database to the wafer acceptance test waiting station, the electrical test data monitoring method further includes:

[0087] Based on user requirements, multiple preset quantities in the configuration product rule group are configured to generate a new configuration product rule group.

[0088] Here, multiple preset quantities and other parameters in the configuration product rule group can be configured according to user needs to generate a new configuration product rule group, and the new configuration product rule group can be used to monitor the electrical test data. For example, for a parameter selected by a Lot, it is considered a Lot Fail only if the same Site of different Wafers fails three times. For example, the R00003 parameter fails in Site1 of Wafer 1 2 3. The judgment result is that if the Fail Count3 of the R00003 parameter Site 1 is greater than or equal to 3, then the Lot Fail.

[0089] S104: Based on multiple judgment results of the wafers to be inspected in the target batch, determine the next execution action for the wafers to be inspected in the target batch; wherein the execution action includes controlling the wafers to be inspected in the target batch to enter the next station or be retested.

[0090] In this step, the next execution action for the wafers to be inspected in the target batch is determined according to multiple judgment results of the wafers to be inspected in the target batch.

[0091] The execution action includes controlling the wafers to be inspected in the target batch to enter the next station or be retested.

[0092] In a possible implementation manner, the step of determining the next execution action for the wafers to be inspected in the target batch based on the multiple judgment results of the wafers to be inspected in the target batch includes:

[0093] a: If the plurality of judgment results are all successful, the wafers to be inspected in the target batch are sent to the next station.

[0094] Here, if multiple judgment results are all successful, the wafers to be inspected under the target batch are sent to the next station.

[0095] b: If any of the above judgment results is failure, the wafers to be inspected under the target batch are retested.

[0096] Here, if any judgment result is failure, the wafers to be inspected under the target batch are retested.

[0097] For further information, see Figure 2 , Figure 2 This is a second flow chart of a method for monitoring the electrical test data of a wafer provided in an embodiment of the present application. Figure 2 As shown:

[0098] S201: Upload the electrical test data file to the database, and perform a periodic scan on the database to determine the electrical test data file that has not been judged in the database.

[0099] In this step, the electrical test data files are uploaded to the database, and the database is scanned periodically to determine the electrical test data files in the database that have not been judged.

[0100] S202: parsing the electrical test data file that has not been judged to determine a plurality of electrical test data of the wafers to be inspected in the target batch.

[0101] In this step, the electrical test data files that have not been judged are parsed to determine a plurality of electrical test data of the wafers to be tested in the target batch.

[0102] S203: Upload the preset configuration product rule group and configuration product parameter list obtained from the database to the wafer acceptance test waiting site, and perform rule judgment on the multiple electrical test data at the wafer acceptance test waiting site based on the configuration product rule group and the configuration product parameter list to determine the judgment results of the wafers to be tested under the target batch.

[0103] In this step, the pre-set configuration product rule group and configuration product parameter list obtained from the database are uploaded to the wafer acceptance test waiting station. At the wafer acceptance test waiting station, rule judgment is performed on multiple electrical test data based on the configuration product rule group and the configuration product parameter list to determine the judgment results of the wafers to be tested under the target batch.

[0104] S204: Based on multiple judgment results of the wafers to be inspected in the target batch, determine the next execution action for the wafers to be inspected in the target batch.

[0105] In this step, the next execution action for the wafers to be inspected in the target batch is determined according to multiple judgment results of the wafers to be inspected in the target batch.

[0106] An embodiment of the present application provides a method for monitoring electrical test data of a wafer, the method comprising: uploading an electrical test data file of wafers to be tested in a target batch at a wafer acceptance test site, and uploading the electrical test data file to a wafer acceptance test waiting site after checking the electrical test data file; performing file parsing on the electrical test data file at the wafer acceptance test waiting site to determine a plurality of electrical test data of the wafers to be tested in the target batch; uploading a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, performing rule judgment on a plurality of the electrical test data based on the configuration product rule group and the configuration product parameter list, and determining a judgment result of the wafers to be tested in the target batch; determining the next execution action for the wafers to be tested in the target batch based on the plurality of judgment results of the wafers to be tested in the target batch; wherein the execution action comprises controlling the wafers to be tested in the target batch to enter the next site or to be retested. According to the configuration product rule group and the configuration product parameter list, the electrical test data is judged according to the rules to obtain accurate judgment results, thereby improving the accuracy of wafer WAT data management and control.

[0107] See also Figure 3 , Figure 4 As shown, Figure 3 One of the structural schematic diagrams of a wafer electrical test data monitoring device provided in an embodiment of the present application; Figure 4 This is a second structural diagram of a wafer electrical test data monitoring device provided in an embodiment of the present application. Figure 3 As shown in , the electrical test data monitoring device 300 includes:

[0108] An acquisition module 310 is used to upload the electrical test data file of the wafers to be tested under the target batch at the wafer acceptance test site, and upload the electrical test data file to the wafer acceptance test waiting site after checking the electrical test data file;

[0109] A file parsing module 320, configured to parse the electrical test data file at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested under a target batch;

[0110] A rule judgment module 330 is used to upload a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, perform rule judgment on a plurality of the electrical test data based on the configuration product rule group and the configuration product parameter list, and determine a judgment result of the wafer to be tested under a target batch;

[0111] The execution action determination module 340 is used to determine the next execution action for the wafers to be inspected under the target batch based on multiple judgment results of the wafers to be inspected under the target batch; wherein the execution action includes controlling the wafers to be inspected under the target batch to enter the next station or be retested.

[0112] Further, when the rule judgment module 330 is used to perform rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list at the wafer acceptance test waiting site to determine the judgment result of the target batch of wafers to be tested, the rule judgment module 330 is specifically used to:

[0113] Determine the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection points;

[0114] Based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list, the judgment results of the wafers to be inspected under the target batch are determined.

[0115] Further, when the rule judgment module 330 is used to determine the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection point for any of the wafers to be inspected, the rule judgment module 330 is specifically used to:

[0116] Detecting whether the number of electrical test data of the wafer to be detected that passes the test at the corresponding wafer test point is greater than or equal to a first preset number;

[0117] If yes, the inspection result of the wafer to be inspected is failure;

[0118] If not, the inspection result of the wafer to be inspected is passed.

[0119] Further, when the rule judgment module 330 is used to determine the judgment result of the target batch of wafers to be detected based on the detection results of the plurality of wafers to be detected, the parameter definition of the electrical test data of the wafers to be detected, and the configured product parameter list, the rule judgment module 330 is specifically used to:

[0120] If the total number of failures of the plurality of wafers to be inspected in the target batch exceeds a second preset number, determining that the judgment result of the wafers to be inspected in the target batch is failure;

[0121] If the total number of failures of any electrical test data at the wafer inspection point exceeds a third preset number, it is determined that the judgment result of the wafer to be inspected in the target batch is a failure;

[0122] If the parameter definition of the electrical test data of the wafer to be tested is inconsistent with the parameter definition in the configuration product parameter list, it is determined that the judgment result of the wafer to be tested under the target batch is failure;

[0123] If the test numbers of the wafer inspection points between any two wafers to be inspected are inconsistent, it is determined that the judgment result of the wafer to be inspected under the target batch is failure;

[0124] If the total number of failures of the electrical test data at any wafer inspection point of the plurality of wafers to be inspected exceeds a fourth preset number, it is determined that the judgment result of the wafers to be inspected in the target batch is failure.

[0125] Further, when the execution action determination module 340 is used to determine the next execution action for the wafers to be inspected under the target batch based on the multiple judgment results of the wafers to be inspected under the target batch, the execution action determination module 340 is specifically used to:

[0126] If the plurality of judgment results are all successful, the wafers to be inspected in the target batch are sent to the next station;

[0127] If any of the judgment results is failure, the wafers to be inspected in the target batch are retested.

[0128] Further, such as Figure 4 As shown, the electrical test data monitoring device 300 further includes a configuration module 350, and the configuration module 350 is used to:

[0129] Based on user requirements, multiple preset quantities in the configuration product rule group are configured to generate a new configuration product rule group.

[0130] Furthermore, the electrical test data monitoring device 300 further includes:

[0131] An acquisition module 310 is used to upload the electrical test data file to the database, and perform a periodic scan on the database to determine the electrical test data file that has not been judged in the database;

[0132] A file parsing module 320, configured to parse the electrical test data file that has not been judged to determine a plurality of electrical test data of the wafers to be tested in the target batch;

[0133] A rule judgment module 330 is used to upload a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, and perform rule judgment on a plurality of the electrical test data based on the configuration product rule group and the configuration product parameter list at the wafer acceptance test waiting site to determine a judgment result of the wafer to be tested under a target batch;

[0134] The execution action determination module 340 is used to determine the next execution action for the wafers to be inspected in the target batch based on multiple judgment results of the wafers to be inspected in the target batch.

[0135] An electrical test data monitoring device for a wafer provided in an embodiment of the present application comprises: an acquisition module, which is used to upload an electrical test data file of a wafer to be tested under a target batch at a wafer acceptance test site, and upload the electrical test data file to a wafer acceptance test waiting site after checking the electrical test data file; a file parsing module, which is used to perform file parsing on the electrical test data file at the wafer acceptance test waiting site to determine a plurality of electrical test data of the wafer to be tested under the target batch; a rule judgment module, which is used to upload a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, and perform rule judgment on a plurality of the electrical test data based on the configuration product rule group and the configuration product parameter list to determine a judgment result of the wafer to be tested under the target batch; an execution action determination module, which is used to determine the next execution action for the wafer to be tested under the target batch based on a plurality of judgment results of the wafer to be tested under the target batch; wherein the execution action comprises controlling the wafer to be tested under the target batch to enter the next site or to be retested. According to the configuration product rule group and the configuration product parameter list, the electrical test data is judged according to the rules to obtain accurate judgment results, thereby improving the accuracy of wafer WAT data management and control.

[0136] See also Figure 5 , Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 5 As shown in , the electronic device 500 includes a processor 510 , a memory 520 and a bus 530 .

[0137] The memory 520 stores machine-readable instructions executable by the processor 510. When the electronic device 500 is running, the processor 510 communicates with the memory 520 via the bus 530. When the machine-readable instructions are executed by the processor 510, the above-mentioned Figure 1 as well as Figure 2 The steps of the method for monitoring the electrical test data of the wafer in the method embodiment shown in the figure, and the specific implementation manner can be referred to the method embodiment, which will not be described in detail here.

[0138] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the computer program can execute the above-mentioned Figure 1 as well as Figure 2 The steps of the method for monitoring the electrical test data of the wafer in the method embodiment shown in the figure, and the specific implementation manner can be referred to the method embodiment, which will not be described in detail here.

[0139] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0140] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0141] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0142] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0143] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or in other words, the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0144] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for monitoring electrical test data of a wafer, characterized in that: The electrical test data monitoring method comprises: Uploading the electrical test data file of the wafers to be tested under the target batch at the wafer acceptance test site, and uploading the electrical test data file to the wafer acceptance test waiting site after checking the electrical test data file; Parsing the electrical test data file at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested under a target batch; Uploading the preset configuration product rule group and configuration product parameter list obtained from the database to the wafer acceptance test waiting site, performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list, and determining the judgment result of the wafer to be tested under the target batch; Based on multiple judgment results of the wafers to be inspected under the target batch, the next execution action for the wafers to be inspected under the target batch is determined; wherein the execution action includes controlling the wafers to be inspected under the target batch to enter the next station or be retested.

2. The electrical test data monitoring method according to claim 1, characterized in that: The step of performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list at the wafer acceptance test waiting station to determine the judgment result of the target batch of wafers to be tested includes: Determine the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection points; Based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list, the judgment results of the wafers to be inspected under the target batch are determined.

3. The electrical test data monitoring method according to claim 2, characterized in that: For any of the wafers to be inspected, determining the inspection result of the wafer to be inspected based on the number of passed inspections of the electrical test data of the wafer to be inspected at the corresponding wafer inspection points includes: Detecting whether the number of electrical test data of the wafer to be detected that passes the test at the corresponding wafer test point is greater than or equal to a first preset number; If yes, the inspection result of the wafer to be inspected is failure; If not, the inspection result of the wafer to be inspected is passed.

4. The electrical test data monitoring method according to claim 2, characterized in that: The determination of the judgment result of the wafers to be inspected in the target batch based on the inspection results of the plurality of wafers to be inspected, the parameter definition of the electrical test data of the wafers to be inspected, and the configured product parameter list includes: If the total number of failures of the plurality of wafers to be inspected in the target batch exceeds a second preset number, determining that the judgment result of the wafers to be inspected in the target batch is failure; If the total number of failures of any electrical test data at the wafer inspection point exceeds a third preset number, it is determined that the judgment result of the wafer to be inspected in the target batch is a failure; If the parameter definition of the electrical test data of the wafer to be tested is inconsistent with the parameter definition in the configuration product parameter list, it is determined that the judgment result of the wafer to be tested under the target batch is failure; If the test numbers of the wafer inspection points between any two wafers to be inspected are inconsistent, it is determined that the judgment result of the wafer to be inspected under the target batch is failure; If the total number of failures of the electrical test data at any wafer inspection point of the plurality of wafers to be inspected exceeds a fourth preset number, it is determined that the judgment result of the wafers to be inspected in the target batch is failure.

5. The electrical test data monitoring method according to claim 1, characterized in that: The step of determining the next execution action for the wafers to be inspected in the target batch based on the multiple judgment results of the wafers to be inspected in the target batch includes: If the plurality of judgment results are all successful, the wafers to be inspected in the target batch are sent to the next station; If any of the judgment results is failure, the wafers to be inspected in the target batch are retested.

6. The electrical test data monitoring method according to claim 1, characterized in that: Before uploading the preset configuration product rule group and the configuration product parameter list obtained from the database to the wafer acceptance test waiting station, the electrical test data monitoring method further includes: Based on user requirements, multiple preset quantities in the configuration product rule group are configured to generate a new configuration product rule group.

7. The electrical test data monitoring method according to claim 1, characterized in that: The electrical test data file of the wafers to be tested under the target batch is uploaded at the wafer acceptance test site, and after checking the electrical test data file, before uploading the electrical test data file to the wafer acceptance test waiting site, the electrical test data monitoring method further includes: Uploading the electrical test data file to the database, and periodically scanning the database to determine the electrical test data file that has not been judged in the database; Performing file analysis on the electrical test data file that has not been judged to determine a plurality of electrical test data of the wafers to be tested in the target batch; Uploading the preset configuration product rule group and configuration product parameter list obtained from the database to the wafer acceptance test waiting site, performing rule judgment on the plurality of electrical test data based on the configuration product rule group and the configuration product parameter list at the wafer acceptance test waiting site, and determining the judgment result of the wafer to be tested under the target batch; Based on multiple judgment results of the wafers to be inspected in the target batch, the next execution action for the wafers to be inspected in the target batch is determined.

8. A wafer electrical test data monitoring device, characterized in that: The electrical test data monitoring device comprises: An acquisition module is used to upload the electrical test data file of the wafers to be tested under the target batch at the wafer acceptance test site, and upload the electrical test data file to the wafer acceptance test waiting site after checking the electrical test data file; A file parsing module, used for parsing the electrical test data file at the wafer acceptance test waiting station to determine a plurality of electrical test data of the wafers to be tested under a target batch; A rule judgment module is used to upload a preset configuration product rule group and a configuration product parameter list obtained from a database to the wafer acceptance test waiting site, perform rule judgment on a plurality of the electrical test data based on the configuration product rule group and the configuration product parameter list, and determine a judgment result of the wafer to be tested under a target batch; An execution action determination module is used to determine the next execution action for the wafers to be inspected under the target batch based on multiple judgment results of the wafers to be inspected under the target batch; wherein the execution action includes controlling the wafers to be inspected under the target batch to enter the next station or be retested.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the electrical test data monitoring method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the electrical test data monitoring method according to any one of claims 1 to 7 are executed.

Images