Packaging design method of inclination measurement sensor

Abstract

The invention provides a packaging design method for an inclination measuring sensor, and relates to the technical field of civil engineering, and the method comprises the steps: carrying out the connection and optimization of a first packaging structure obtained based on the characteristic design of the inclination measuring sensor and a target connection mode determined based on the service life and range of the sensor, and obtaining a first design drawing; and packaging the inclinometry sensor by utilizing a target design drawing obtained by carrying out performance simulation on the inclinometry sensor connected with the first packaging structure and finely adjusting the first design drawing. The method comprises the following steps: connecting and optimizing a first packaging structure obtained based on the characteristic design of the inclinometry sensor and a target connection mode determined based on the service life and the measuring range of the sensor to obtain a first design drawing; performing performance simulation on the packaged inclinometry sensor, and performing fine adjustment on the first design drawing according to a performance simulation result to obtain a target design drawing; according to the target design drawing, the inclinometry sensor is packaged, effective packaging of the inclinometry sensor can be achieved, and the inclinometry sensor is prevented from being damaged.

Description

Technical Field

[0001] The invention relates to the technical field of civil engineering, and in particular to a packaging design method for an inclinometer sensor. Background Art

[0002] In recent years, in the field of civil engineering, monitoring soil tilt deformation is crucial to ensure structural safety. Traditional inclinometer methods often have problems such as insufficient accuracy, complex installation, and easy damage to sensors. In addition, inclinometer sensors that are not properly packaged are easily damaged in complex geological environments, resulting in failure of soil tilt monitoring. Therefore, how to effectively package inclinometer sensors to avoid damage has become one of the current research focuses.

[0003] Therefore, the present invention provides a packaging design method for an inclinometer sensor. Summary of the invention

[0004] The present invention provides a packaging design method for an inclinometer sensor, which is used for obtaining a first design drawing by connecting and optimizing a first packaging structure obtained based on the characteristics of the inclinometer sensor and a target connection method determined based on the service life and range of the sensor; performing performance simulation on the packaged inclinometer sensor, and fine-tuning the first design drawing according to the performance simulation result to obtain a target design drawing; and packaging the inclinometer sensor according to the target design drawing, thereby achieving effective packaging of the inclinometer sensor and avoiding damage.

[0005] The present invention provides a packaging design method for an inclinometer sensor, comprising: Step 1: Designing a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure; Step 2: Determine a target connection method based on the service life and range of the sensor, connect the first packaging structure with the inclinometer sensor, and optimize the connection to obtain a first design drawing; Step 3: performing a package connection performance simulation on the inclinometer sensor connected to the first package structure, and fine-tuning the first design drawing according to the performance simulation result to obtain a target design drawing; Step 4: Design the package of the current inclinometer sensor according to the target design drawing.

[0006] Preferably, the packaging structure is designed based on the characteristics of the inclinometer sensor using the setting modeling software to obtain the first packaging structure, including: Determining a first applicable size of the current inclinometer sensor according to a monitoring environment of the inclinometer sensor; Determine the packaging structure material of the current inclinometer sensor and a corresponding packaging structure option list by using the category of the current inclinometer sensor and the monitoring environment; Using the first applicable size obtained as a matching condition, matching a key package structure from a package structure option list; An initial packaging structure model is established based on the acquired key packaging structure by using a set modeling software, and after key structural information is annotated in the initial packaging structure model, it is output as a first packaging structure.

[0007] Preferably, the key structural information refers to the size, connection method and packaging material used in the key packaging structure.

[0008] Preferably, the target connection mode is determined based on the service life and range of the sensor, the first packaging structure is connected to the target inclinometer sensor, and the connection is optimized to obtain a first design drawing, including: Acquire a first connection mode between the current first packaging structure and the inclinometer sensor; If there is only a single first connection mode, the current first connection mode is used as the target connection mode; If there are multiple first connection modes, the most suitable first connection mode is selected as the target connection mode from all the acquired first connection modes by analyzing the service life and the measuring range of the current inclinometer sensor; A sensor model of the current inclinometer sensor is established based on the set modeling software, and connected with the key packaging structure according to the target connection mode to obtain a first connection model; After optimizing the connection in the first connection model, a target design model is obtained; According to the target design model, a two-dimensional first design drawing is generated using set modeling software.

[0009] Preferably, by analyzing the service life and range of the current inclinometer sensor, the most suitable first connection mode is selected as the target connection mode from all the first connection modes obtained, including: The service life and measuring range of the current inclinometer sensor are respectively extended to obtain a reference service life and a reference measuring range; Extract the inclinometer sensor whose service life and measuring range correspond to the benchmark service life and benchmark measuring range from the sensor connection database, and whose benchmark information is consistent with the current inclinometer sensor, and mark it as the reference sensor; Obtain a historical connection usage record of each reference sensor using the first connection mode; Calculate the first usage evaluation coefficient of each first connection mode according to the historical connection usage records; The calculation formula of the first use evaluation coefficient is as follows: ; Wherein, P1 represents the first usage evaluation coefficient of the current first connection mode; It is represented as the historical usage frequency of the i-th reference sensor using the current first connection mode, where i=1,2,3, ,n; n represents the total number of reference sensors; It is expressed as the ratio of the service life of the i-th reference sensor to the current inclinometer sensor; It is expressed as the range ratio of the i-th reference sensor to the current inclinometer sensor; It is represented by the number of historical failures of the i-th reference sensor using the current first connection mode; It is represented by the historical fault repair time of the i-th reference sensor using the current first connection mode; e is represented by a constant, and its value is 2.7; Using a set reliability evaluation index to perform a performance evaluation on each first connection mode to obtain a first reliability coefficient; Performing weighted average calculation on the first usage evaluation coefficient and the first reliability coefficient to obtain a comprehensive evaluation coefficient; The first connection method with the largest comprehensive evaluation coefficient is regarded as the target connection method.

[0010] Preferably, after optimizing the connection in the first connection model, a target design model is obtained, including: Importing the first connection model into a set finite element analysis software, running a preset solver to perform stress analysis at the connection, and obtaining a first stress distribution result; According to the first stress distribution result, if there are high stress areas and stress concentration points, obtain real-time parameter values ​​of stable associated parameters of the current high stress areas and stress concentration points; Comparing the real-time parameter value of the stable correlation parameter with the corresponding expected parameter value to obtain the correlation parameter difference; When the correlation parameter difference of all stable correlation parameters is greater than the corresponding set correlation threshold difference, a key replacement material is selected to replace the original material at the connection to obtain a target design model; When there is a stable associated parameter whose associated parameter difference is not greater than the corresponding set associated threshold difference, the stable associated parameter whose associated parameter difference is greater than the corresponding set associated threshold difference is used as a matching condition, and the first connection process parameter is obtained by matching from the set stable-process parameter mapping table; After optimizing the first connection process parameters in the current first connection mode according to the corresponding optimization scheme, a target design model is obtained.

[0011] Preferably, a package connection performance simulation is performed on the inclinometer sensor connected to the first package structure, and the first design drawing is fine-tuned according to the performance simulation result to obtain a target design drawing, including: Step 11: After setting the operation simulation parameters of the current inclinometer sensor in the modeling software, the target design model is run to implement soil inclination monitoring simulation based on the current inclinometer sensor to obtain first simulation data; Step 12: Using the set connection evaluation index, based on the package connection stress data in the first simulation data, perform stress evaluation on all connections between the first package structure and the current inclinometer sensor to obtain a connection stress evaluation result of the first package structure; Step 13: obtaining a performance evaluation result of the first packaging structure according to an analysis of the connection deformation data in the first simulation data; Step 14: combining and analyzing the connection stress evaluation result and the performance evaluation result of the first packaging structure to obtain a performance simulation result; Step 15: If there are packaging problems such as uneven stress, local deformation, or low-level deformation synchronization in the performance simulation results, matching corresponding adjustment strategies to adjust the current target design model; Step 16: performing soil tilt monitoring simulation based on the current inclinometer sensor again on the adjusted target design model to obtain new first simulation data; Step 17: Repeat steps 12-16 until there is no packaging problem in the obtained performance simulation results, and fine-tune the first design drawing according to the adjusted target design model to obtain the target design drawing.

[0012] Preferably, obtaining a performance evaluation result of the first packaging structure based on an analysis of the connection deformation data in the first simulation data includes: Taking a change monitoring point from a corresponding first package structure region in the target design model and treating it as a first monitoring point; The corresponding package deformation data of all first monitoring points in the connected deformation data are used as dependent variables, and the first monitoring point number is used as an independent variable to construct the first deformation curves at different simulation times; Extracting the curve trend feature from the first deformation curve for analysis to obtain the packaging deformation distribution coefficient of the current first packaging structure at different simulation times; The package deformation distribution coefficient is used as the dependent variable and the simulation time is used as the independent variable to construct the comprehensive deformation distribution curve; Performing trend analysis on the comprehensive deformation distribution curve to obtain a comprehensive deformation distribution coefficient; If the comprehensive deformation distribution coefficient is less than the set deformation distribution threshold, it is determined that the current first packaging structure is concentratedly deformed and output as a performance evaluation result; Otherwise, determining that the current first packaging structure is partially deformed, and outputting it as a performance evaluation result; Taking the parameter data of the sensor change parameters in the connected deformation data as the independent variable and the simulation time as the dependent variable, the corresponding change-parameter curve of each sensor change parameter is constructed in time series; The comprehensive deformation distribution curve and the variation-parameter curve are divided according to the simulation time to obtain a plurality of distribution sub-curves and parameter sub-curves respectively; Calculate the curve area ratio and the curve slope ratio of the distribution sub-curve and the parameter sub-curve belonging to the same simulation time interval, and obtain a first area ratio and a first slope ratio accordingly; Based on the first area ratio and the first slope ratio, a deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter is calculated; The calculation formula of the deformation synchronization evaluation coefficient is as follows: ; In the formula, It is expressed as the deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter; It is expressed as the first area ratio of the corresponding distribution sub-curve and parameter sub-curve in the jth simulation time interval, where j=1, 2, 3, , m; m represents the total number of simulation time intervals; It is expressed as the first area ratio of the distribution sub-curve and the parameter sub-curve in the j-1th simulation time interval; It is expressed as the contribution weight of the curve area ratio to the simultaneous evaluation of the analytical deformation; It is expressed as the contribution weight of the curve slope ratio to the simultaneous assessment of the analyzed deformation; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-th simulation time interval; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-1th simulation time interval; Perform weighted average calculation on the deformation synchronization evaluation coefficients of the packaging structure deformation and all sensor change parameters to obtain a comprehensive deformation synchronization evaluation coefficient; Taking the comprehensive deformation synchronization evaluation coefficient as a matching condition, the deformation synchronization level of the current first packaging structure and the inclinometer sensor is determined and output as a performance evaluation result.

[0013] Compared with the prior art, the present invention has the following beneficial effects: A first design drawing is obtained by connecting and optimizing a first packaging structure obtained based on the characteristics of an inclinometer sensor and a target connection method determined based on the service life and range of the sensor; a performance simulation is performed on the packaged inclinometer sensor, and the first design drawing is fine-tuned according to the performance simulation result to obtain a target design drawing; and the inclinometer sensor is packaged according to the target design drawing, so that the inclinometer sensor can be effectively packaged to avoid damage.

[0014] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0015] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 The present invention is a flowchart of a packaging design method for an inclinometer sensor according to an embodiment of the present invention. DETAILED DESCRIPTION

[0017] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0018] The embodiment of the present invention provides a packaging design method for an inclinometer sensor, such as Figure 1 As shown, including: Step 1: Designing a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure; Step 2: Determine a target connection method based on the service life and range of the sensor, connect the first packaging structure with the inclinometer sensor, and optimize the connection to obtain a first design drawing; Step 3: performing a package connection performance simulation on the inclinometer sensor connected to the first package structure, and fine-tuning the first design drawing according to the performance simulation result to obtain a target design drawing; Step 4: Design the package of the current inclinometer sensor according to the target design drawing.

[0019] In this embodiment, the characteristics of the inclinometer sensor refer to the monitoring environment, type and size of the inclinometer sensor; the inclinometer sensor refers to a sensor used to measure and monitor changes in the inclination angle of a structure or soil; the first packaging structure refers to a three-dimensional model designed based on the set modeling software and marked with key structural information; the range refers to the maximum range that the inclinometer sensor can measure; the target connection method refers to the connection method with the key packaging structure that is most suitable for the current inclinometer sensor; the first design drawing refers to a two-dimensional drawing generated by the set modeling software according to the target design model, which includes connection details, dimension markings and other information between the sensor and the packaging structure; the target design drawing is a drawing obtained by fine-tuning the first design drawing based on the performance simulation results.

[0020] The beneficial effects of the above technical solution are: by connecting and optimizing the first packaging structure obtained based on the characteristics of the inclinometer sensor and the target connection method determined based on the service life and range of the sensor, a first design drawing is obtained; the performance of the packaged inclinometer sensor is simulated, and the first design drawing is fine-tuned according to the performance simulation results to obtain a target design drawing; the inclinometer sensor is packaged according to the target design drawing, so that the inclinometer sensor can be effectively packaged to avoid damage.

[0021] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which uses a set modeling software to design a packaging structure based on the characteristics of the inclinometer sensor to obtain a first packaging structure, including: Determining a first applicable size of the current inclinometer sensor according to a monitoring environment of the inclinometer sensor; Determine the packaging structure material of the current inclinometer sensor and a corresponding packaging structure option list by using the category of the current inclinometer sensor and the monitoring environment; Using the first applicable size obtained as a matching condition, matching a key package structure from a package structure option list; An initial packaging structure model is established based on the acquired key packaging structure by using a set modeling software, and after key structural information is annotated in the initial packaging structure model, it is output as a first packaging structure.

[0022] In this embodiment, the inclinometer sensor refers to a sensor used to measure and monitor changes in the inclination angle of a structure or soil; the monitoring environment refers to the use environment of the inclinometer sensor, such as underground, the bottom of a bridge, and the wall of a tunnel; the first applicable size refers to the best or most suitable size of the inclinometer sensor determined according to the limitations and requirements of the monitoring environment, including the diameter, length, and size of the connecting part of the sensor, etc.; the category of the inclinometer sensor refers to the different types of inclinometer sensors, such as Flex inclinometer sensor and BOFDA distributed optical fiber inclinometer sensor; the packaging structure materials include stainless steel, titanium alloy, polymer material, biodegradable and environmentally friendly material polylactic acid, etc., and the corresponding packaging structure materials may be different depending on the sensor category or the monitoring environment; the packaging structure option list is a list of all packaging structures applicable to the current category of inclinometer sensors.

[0023] In this embodiment, the key packaging structure is matched with the first applicable size of the current inclinometer sensor, and the packaging structure that meets the first applicable size requirement is screened out from the packaging structure option list; the set modeling software is a predetermined software for modeling the packaged inclinometer sensor, such as CATIA software; the initial packaging structure model refers to a preliminary three-dimensional model created in the set modeling software based on the key packaging structure; the structural key information refers to the size, connection method and packaging material used for the key packaging structure.

[0024] The beneficial effect of the above technical solution is that by using the set modeling software to design the packaging structure based on the monitoring environment and category of the inclinometer sensor, it helps to improve the accuracy and efficiency of the design and optimize the performance of the packaging structure.

[0025] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which determines a target connection mode based on the service life and range of the sensor, connects the first packaging structure with the target inclinometer sensor, and optimizes the connection to obtain a first design drawing, including: Acquire a first connection mode between the current first packaging structure and the inclinometer sensor; If there is only a single first connection mode, the current first connection mode is used as the target connection mode; If there are multiple first connection modes, the most suitable first connection mode is selected as the target connection mode from all the acquired first connection modes by analyzing the service life and the measuring range of the current inclinometer sensor; A sensor model of the current inclinometer sensor is established based on the set modeling software, and connected with the key packaging structure according to the target connection mode to obtain a first connection model; After optimizing the connection in the first connection model, a target design model is obtained; According to the target design model, a two-dimensional first design drawing is generated using set modeling software.

[0026] In this embodiment, the first connection method refers to a possible connection method between the inclinometer sensor and the packaging structure, including threaded connection, snap-on connection and the like; the target connection method refers to a connection method that is most suitable for the current inclinometer sensor and the key packaging structure; the sensor model refers to a three-dimensional model of the inclinometer sensor created using set modeling software; the first connection model is obtained by connecting the sensor model with the key packaging structure according to the target connection method, and is used to demonstrate how the inclinometer sensor and the packaging structure are combined together through a specific connection method; the target design model refers to a model obtained after optimizing the connection on the basis of the first connection model; the first design drawing refers to a drawing generated using the set modeling software according to the target design model, which includes information such as connection details and dimension markings of the sensor and the packaging structure.

[0027] The beneficial effects of the above technical solution are: by determining the connection method with the packaging structure based on the service life and range of the sensor, and optimizing the connection, the practicality and reliability of the packaging design can be effectively ensured, and the overall performance of the packaging structure can be improved.

[0028] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which analyzes the service life and range of the current inclinometer sensor, and selects the most suitable first connection mode as a target connection mode from all acquired first connection modes, including: The service life and measuring range of the current inclinometer sensor are respectively extended to obtain a reference service life and a reference measuring range; Extract the inclinometer sensor whose service life and measuring range correspond to the benchmark service life and benchmark measuring range from the sensor connection database, and whose benchmark information is consistent with the current inclinometer sensor, and mark it as the reference sensor; Obtain a historical connection usage record of each reference sensor using the first connection mode; Calculate the first usage evaluation coefficient of each first connection mode according to the historical connection usage records; The calculation formula of the first use evaluation coefficient is as follows: ; Wherein, P1 represents the first usage evaluation coefficient of the current first connection mode; It is represented as the historical usage frequency of the i-th reference sensor using the current first connection mode, where i=1,2,3, ,n; n represents the total number of reference sensors; It is expressed as the ratio of the service life of the i-th reference sensor to the current inclinometer sensor; It is expressed as the range ratio of the i-th reference sensor to the current inclinometer sensor; It is represented by the number of historical failures of the i-th reference sensor using the current first connection mode; It is represented by the historical fault repair time of the i-th reference sensor using the current first connection mode; e is represented by a constant with a value of 2.7; Using a set reliability evaluation index to perform a performance evaluation on each first connection mode to obtain a first reliability coefficient; Performing weighted average calculation on the first usage evaluation coefficient and the first reliability coefficient to obtain a comprehensive evaluation coefficient; The first connection method with the largest comprehensive evaluation coefficient is regarded as the target connection method.

[0029] In this embodiment, the reference service life refers to the service life value range obtained by extending the service life of the current inclinometer sensor, which is expressed as , where a0 represents the service life of the current inclinometer sensor; the reference range refers to the range of values ​​obtained after expanding the range of the current inclinometer sensor, expressed as , where b0 represents the range of the current inclinometer sensor; the sensor connection database refers to a database that stores a variety of inclinometer sensors and their connection information, including the service life, range, connection method, historical usage records, etc. of the sensor; the benchmark information refers to the monitoring environment, sensor size, connection method between the sensor and the packaging structure, and the packaging structure used.

[0030] In this embodiment, the reference sensor refers to a sensor extracted from a sensor connection database, whose service life and range belong to the benchmark service life and benchmark range respectively, and whose benchmark information is consistent with the current inclinometer sensor; the historical connection usage record refers to the historical usage of the sensor using different connection methods, including information such as usage frequency, number of failures, and fault repair time; the first usage evaluation coefficient is used to evaluate the applicability of each first connection method on the current inclinometer sensor; a reliable evaluation index is set to evaluate the reliability of each first connection method, including connection strength, connection density, fatigue resistance, and installation difficulty; the first reliability coefficient is obtained by weighted averaging the index coefficients obtained after evaluating the first connection method using the set reliable evaluation index, and the weight assigned to the set reliable evaluation index is obtained by solving the matrix constructed after pairwise comparison and relative importance scoring using the hierarchical analysis method.

[0031] In this embodiment, the weights assigned to the first usage evaluation coefficient and the first reliability coefficient are obtained by solving a matrix constructed after pairwise comparison and relative importance scoring using the hierarchical analysis method; the target connection method refers to the first connection method with the largest comprehensive evaluation coefficient.

[0032] The beneficial effect of the above technical solution is: by analyzing the service life and range of the current inclinometer sensor and determining the target connection method, it can help ensure the practicality and reliability of the packaging design and help improve the overall performance of the packaging structure.

[0033] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which optimizes the connection in the first connection model to obtain a target design model, including: Importing the first connection model into a set finite element analysis software, running a preset solver to perform stress analysis at the connection, and obtaining a first stress distribution result; According to the first stress distribution result, if there are high stress areas and stress concentration points, obtain real-time parameter values ​​of stable associated parameters of the current high stress areas and stress concentration points; Comparing the real-time parameter value of the stable correlation parameter with the corresponding expected parameter value to obtain the correlation parameter difference; When the correlation parameter difference of all stable correlation parameters is greater than the corresponding set correlation threshold difference, a key replacement material is selected to replace the original material at the connection to obtain a target design model; When there is a stable associated parameter whose associated parameter difference is not greater than the corresponding set associated threshold difference, the stable associated parameter whose associated parameter difference is greater than the corresponding set associated threshold difference is used as a matching condition, and the first connection process parameter is obtained by matching from the set stable-process parameter mapping table; After optimizing the first connection process parameters in the current first connection mode according to the corresponding optimization scheme, a target design model is obtained.

[0034] In this embodiment, the finite element analysis software is a pre-set software for analyzing the stress condition of the connection; the preset solver refers to a component in the finite element analysis software, which is used to solve the response of the model (such as stress, displacement, etc.) according to the input model, material properties and boundary conditions; the first stress distribution result is obtained by running the preset solver through the finite element analysis software, and is used to represent the stress distribution of the connection under specific load conditions; the stability correlation coefficient refers to a coefficient associated with the stability of the connection, such as yield strength and tensile strength; the correlation coefficient difference refers to the difference obtained by subtracting the corresponding expected parameter value from the real-time parameter value of the stability correlation parameter; The stability-process parameter mapping table is used to store the mapping relationship between different stability-related parameters and the corresponding connection process parameters (such as welding temperature, bolt preload, heat treatment conditions, etc.); the first connection process parameters are used to describe the specific conditions in the connection process using the connection method (such as threaded connection, snap connection), such as welding temperature, bolt preload, etc.; the optimization scheme refers to the pre-set specific content for optimizing the first connection process parameters, which is composed of optimization objectives (such as reducing stress concentration and improving connection strength), optimization algorithms (such as gradient descent method, genetic algorithm, simulated annealing method) and optimization models (parametric models established based on finite element analysis software).

[0035] The beneficial effect of the above technical solution is that by optimizing and adjusting the connection points in the first connection model, it can help ensure the practicality and reliability of the packaging design and improve the overall performance of the packaging structure.

[0036] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which performs packaging connection performance simulation on an inclinometer sensor connected to a first packaging structure, and fine-tunes the first design drawing according to the performance simulation result to obtain a target design drawing, including: Step 11: After setting the operation simulation parameters of the current inclinometer sensor in the modeling software, the target design model is run to implement soil inclination monitoring simulation based on the current inclinometer sensor to obtain first simulation data; Step 12: Using the set connection evaluation index, based on the package connection stress data in the first simulation data, perform stress evaluation on all connections between the first package structure and the current inclinometer sensor to obtain a connection stress evaluation result of the first package structure; Step 13: obtaining a performance evaluation result of the first packaging structure according to an analysis of the connection deformation data in the first simulation data; Step 14: combining and analyzing the connection stress evaluation result and the performance evaluation result of the first packaging structure to obtain a performance simulation result; Step 15: If there are packaging problems such as uneven stress, local deformation, or low-level deformation synchronization in the performance simulation results, matching corresponding adjustment strategies to adjust the current target design model; Step 16: performing soil tilt monitoring simulation based on the current inclinometer sensor again on the adjusted target design model to obtain new first simulation data; Step 17: Repeat steps 12-16 until there is no packaging problem in the obtained performance simulation results, and fine-tune the first design drawing according to the adjusted target design model to obtain the target design drawing.

[0037] In this embodiment, the operation simulation parameters include environmental factors such as temperature, humidity, pressure, vibration, and mechanical factors such as load type, size and direction; the soil inclination monitoring simulation is intended to evaluate the performance of the packaged inclinometer sensor in actual applications; the first simulation data refers to various data about the packaged inclinometer sensor and its interaction with the soil output by the modeling software during the soil inclination monitoring simulation, including package connection stress data, connection deformation data, etc.; the set connection evaluation index refers to stress uniformity (determined by calculating the stress standard deviation), maximum stress value and stress concentration factor (refers to the stress value of representative points selected from areas where stress concentration may exist, such as corners and hole edges of the package structure, and then the nominal stress value calculated by the stress values ​​of all representative points is divided by the maximum stress value); the connection stress evaluation result refers to the conclusion drawn by evaluating the stress state of the connection between the first package structure and the current inclinometer sensor using the set connection evaluation index, including whether the stress at the connection is The performance evaluation results refer to the conclusions drawn from the evaluation of the overall performance of the first packaging structure during the simulation, such as whether the deformation of the packaging structure is localized or concentrated. The performance simulation results are used to evaluate the performance of the packaged inclinometer in actual applications, and are composed of the connection stress evaluation results and the performance evaluation results. The adjustment strategy refers to the specific methods and measures for optimizing the target design model extracted from the set simulation adjustment strategy table with the performance simulation results as the matching conditions. The set simulation adjustment strategy table is composed of the packaging problem, the adjustment strategy, and the specific parameters and ranges that need to be adjusted for each adjustment strategy. The target design drawing refers to the final design drawing obtained after optimizing the first design drawing according to the performance simulation results and the adjustment strategy.

[0038] The beneficial effect of the above technical solution is that by testing the packaging connection performance of the target inclinometer sensor connected to the first packaging structure, potential problems can be predicted and adjusted to ensure that the design meets actual usage requirements.

[0039] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which obtains a performance evaluation result of a first packaging structure based on analysis of connection deformation data in the first simulation data, including: Taking a change monitoring point from a corresponding first package structure region in the target design model and treating it as a first monitoring point; The corresponding package deformation data of all first monitoring points in the connected deformation data are used as dependent variables, and the first monitoring point number is used as an independent variable to construct the first deformation curves at different simulation times; Extracting the curve trend feature from the first deformation curve for analysis to obtain the packaging deformation distribution coefficient of the current first packaging structure at different simulation times; The package deformation distribution coefficient is used as the dependent variable and the simulation time is used as the independent variable to construct the comprehensive deformation distribution curve; Performing trend analysis on the comprehensive deformation distribution curve to obtain a comprehensive deformation distribution coefficient; If the comprehensive deformation distribution coefficient is less than the set deformation distribution threshold, it is determined that the current first packaging structure is concentratedly deformed and output as a performance evaluation result; Otherwise, determining that the current first packaging structure is partially deformed, and outputting it as a performance evaluation result; Taking the parameter data of the sensor change parameters in the connected deformation data as the independent variable and the simulation time as the dependent variable, the corresponding change-parameter curve of each sensor change parameter is constructed in time series; The comprehensive deformation distribution curve and the variation-parameter curve are divided according to the simulation time to obtain a plurality of distribution sub-curves and parameter sub-curves respectively; Calculate the curve area ratio and the curve slope ratio of the distribution sub-curve and the parameter sub-curve belonging to the same simulation time interval, and obtain a first area ratio and a first slope ratio accordingly; Based on the first area ratio and the first slope ratio, a deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter is calculated; The calculation formula of the deformation synchronization evaluation coefficient is as follows: ; In the formula, It is expressed as the deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter; It is expressed as the first area ratio of the corresponding distribution sub-curve and parameter sub-curve in the jth simulation time interval, where j=1, 2, 3, , m; m represents the total number of simulation time intervals; It is expressed as the first area ratio of the distribution sub-curve and the parameter sub-curve in the j-1th simulation time interval; It is expressed as the contribution weight of the curve area ratio to the simultaneous evaluation of the analytical deformation; It is expressed as the contribution weight of the curve slope ratio to the simultaneous assessment of the analyzed deformation; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-th simulation time interval; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-1th simulation time interval; Perform weighted average calculation on the deformation synchronization evaluation coefficients of the packaging structure deformation and all sensor change parameters to obtain a comprehensive deformation synchronization evaluation coefficient; Taking the comprehensive deformation synchronization evaluation coefficient as a matching condition, the deformation synchronization level of the current first packaging structure and the inclinometer sensor is determined and output as a performance evaluation result.

[0040] In this embodiment, the first monitoring point refers to a point selected in the corresponding encapsulation structure area in the target design model for monitoring deformation; the encapsulation deformation data refers to the data on the deformation of the encapsulation structure obtained by the first monitoring point during the soil inclination monitoring simulation, generally referring to the deformation amount; the first deformation curve refers to a curve constructed with the number of the first monitoring point as the independent variable and the corresponding encapsulation deformation data as the dependent variable; the encapsulation deformation distribution coefficient is obtained by weighted averaging the curve trend characteristics extracted from the first deformation curve, wherein the curve trend characteristics include the slope of the curve, the sum of the deviations of the extreme points from the average value, the curvature and the acceleration, and the weight assigned to the curve trend characteristics is obtained by solving a matrix constructed by using the hierarchical analysis method to compare the curve trend characteristics pairwise and score the relative importance.

[0041] In this embodiment, the comprehensive deformation distribution curve is a curve constructed with the package deformation distribution coefficient as the dependent variable and the simulation time as the independent variable; the comprehensive deformation distribution coefficient is obtained by weighted averaging the curve trend characteristics extracted from the comprehensive deformation distribution curve, wherein the curve trend characteristics include the curve slope, the sum of the deviations between the extreme points and the average value, the curvature and the acceleration, and the weights assigned to the curve trend characteristics are obtained by solving a matrix constructed by using the hierarchical analysis method to compare the curve trend characteristics pairwise and score their relative importance.

[0042] In this embodiment, the performance evaluation result refers to the concentrated deformation of the first packaging structure, the local deformation of the first packaging structure and the deformation synchronization level; the change-parameter curve is a curve constructed with the parameter data of the sensor change parameter as the independent variable and the simulation time as the dependent variable; the distribution sub-curve refers to the sub-curve obtained by dividing the comprehensive deformation distribution curve; the parameter sub-curve refers to the sub-curve obtained by dividing the change-parameter curve according to the simulation time; the first area ratio refers to the ratio of the area of ​​the distribution sub-curve divided by the area of ​​the parameter sub-curve; the first slope ratio refers to the ratio of the slope of the distribution sub-curve divided by the slope of the parameter sub-curve; the deformation synchronization evaluation coefficient is used to evaluate the degree of synchronization between the deformation of the packaging structure and the sensor change parameter. The comprehensive deformation synchronization evaluation coefficient is obtained by weighted average calculation of the deformation synchronization evaluation coefficients of the packaging structure deformation and all sensor change parameters, and is used to quantify the overall synchronization between the packaging structure and the sensor. The weights assigned to the deformation synchronization evaluation coefficients of different sensor change parameters are obtained by solving the matrix constructed after pairwise comparison and relative importance scoring using the hierarchical analysis method. The deformation synchronization level is a synchronization level obtained by screening from the set synchronization level list with the comprehensive deformation synchronization evaluation coefficient as the matching condition. The synchronization level includes three levels: low, medium and high. The set synchronization level list is composed of different value ranges of the comprehensive deformation synchronization evaluation coefficient and the corresponding synchronization level.

[0043] The beneficial effect of the above technical solution is that by analyzing the connection deformation data in the first simulation data, the performance evaluation result of the first packaging structure is obtained, which can help improve the overall performance of the packaging structure.

[0044] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A packaging design method for an inclinometer sensor, characterized in that: include: Step 1: Designing a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure; Step 2: Determine a target connection method based on the service life and range of the sensor, connect the first packaging structure with the inclinometer sensor, and optimize the connection to obtain a first design drawing; Step 3: performing a package connection performance simulation on the inclinometer sensor connected to the first package structure, and fine-tuning the first design drawing according to the performance simulation result to obtain a target design drawing; Step 4: Design the package of the current inclinometer sensor according to the target design drawing.

2. The packaging design method of an inclinometer sensor according to claim 1, characterized in that: The package structure is designed based on the characteristics of the inclinometer sensor using the setting modeling software to obtain a first package structure, including: Determining a first applicable size of the current inclinometer sensor according to a monitoring environment of the inclinometer sensor; Determine the packaging structure material of the current inclinometer sensor and a corresponding packaging structure option list by using the category of the current inclinometer sensor and the monitoring environment; Using the first applicable size obtained as a matching condition, matching a key package structure from a package structure option list; An initial packaging structure model is established based on the acquired key packaging structure by using a set modeling software, and after key structural information is annotated in the initial packaging structure model, it is output as a first packaging structure.

3. The packaging design method of an inclinometer sensor according to claim 2, characterized in that: Structural key information refers to the size, connection method and packaging materials used in key packaging structures.

4. The packaging design method of an inclinometer sensor according to claim 1, characterized in that: The target connection mode is determined based on the service life and range of the sensor, the first packaging structure is connected to the target inclinometer sensor, and the connection is optimized to obtain a first design drawing, including: Acquire a first connection mode between the current first packaging structure and the inclinometer sensor; If there is only a single first connection mode, the current first connection mode is used as the target connection mode; If there are multiple first connection modes, the most suitable first connection mode is selected as the target connection mode from all the acquired first connection modes by analyzing the service life and the measuring range of the current inclinometer sensor; A sensor model of the current inclinometer sensor is established based on the set modeling software, and connected with the key packaging structure according to the target connection mode to obtain a first connection model; After optimizing the connection in the first connection model, a target design model is obtained; According to the target design model, a two-dimensional first design drawing is generated using set modeling software.

5. The packaging design method of an inclinometer sensor according to claim 4, characterized in that: By analyzing the service life and range of the current inclinometer sensor, the most suitable first connection method is selected as the target connection method from all the first connection methods obtained, including: The service life and measuring range of the current inclinometer sensor are respectively extended to obtain a reference service life and a reference measuring range; Extract the inclinometer sensor whose service life and measuring range correspond to the benchmark service life and benchmark measuring range from the sensor connection database, and whose benchmark information is consistent with the current inclinometer sensor, and mark it as the reference sensor; Obtain a historical connection usage record of each reference sensor using the first connection mode; Calculate the first usage evaluation coefficient of each first connection mode according to the historical connection usage records; The calculation formula of the first use evaluation coefficient is as follows: ; Wherein, P1 represents the first usage evaluation coefficient of the current first connection mode; It is represented as the historical usage frequency of the i-th reference sensor using the current first connection mode, where i=1,2,3, ,n; n represents the total number of reference sensors; It is expressed as the ratio of the service life of the i-th reference sensor to the current inclinometer sensor; It is expressed as the range ratio of the i-th reference sensor to the current inclinometer sensor; It is represented by the number of historical failures of the i-th reference sensor using the current first connection mode; It is represented by the historical fault repair time of the i-th reference sensor using the current first connection mode; e is represented by a constant, and its value is 2.7; Using a set reliability evaluation index to perform a performance evaluation on each first connection mode to obtain a first reliability coefficient; Performing weighted average calculation on the first usage evaluation coefficient and the first reliability coefficient to obtain a comprehensive evaluation coefficient; The first connection method with the largest comprehensive evaluation coefficient is regarded as the target connection method.

6. The packaging design method of an inclinometer sensor according to claim 4, characterized in that: After optimizing the connection in the first connection model, a target design model is obtained, including: Importing the first connection model into a set finite element analysis software, running a preset solver to perform stress analysis at the connection, and obtaining a first stress distribution result; According to the first stress distribution result, if there are high stress areas and stress concentration points, obtain real-time parameter values ​​of stable associated parameters of the current high stress areas and stress concentration points; Comparing the real-time parameter value of the stable correlation parameter with the corresponding expected parameter value to obtain the correlation parameter difference; When the correlation parameter difference of all stable correlation parameters is greater than the corresponding set correlation threshold difference, a key replacement material is selected to replace the original material at the connection to obtain a target design model; When there is a stable associated parameter whose associated parameter difference is not greater than the corresponding set associated threshold difference, the stable associated parameter whose associated parameter difference is greater than the corresponding set associated threshold difference is used as a matching condition, and the first connection process parameter is obtained by matching from the set stable-process parameter mapping table; After optimizing the first connection process parameters in the current first connection mode according to the corresponding optimization scheme, a target design model is obtained.

7. The packaging design method of an inclinometer sensor according to claim 1, characterized in that: The package connection performance of the inclinometer sensor connected to the first package structure is simulated, and the first design drawing is fine-tuned according to the performance simulation result to obtain a target design drawing, including: Step 11: After setting the operation simulation parameters of the current inclinometer sensor in the modeling software, the target design model is run to implement soil inclination monitoring simulation based on the current inclinometer sensor to obtain first simulation data; Step 12: Using the set connection evaluation index, based on the package connection stress data in the first simulation data, perform stress evaluation on all connections between the first package structure and the current inclinometer sensor to obtain a connection stress evaluation result of the first package structure; Step 13: obtaining a performance evaluation result of the first packaging structure according to an analysis of the connection deformation data in the first simulation data; Step 14: combining and analyzing the connection stress evaluation result and the performance evaluation result of the first packaging structure to obtain a performance simulation result; Step 15: If there are packaging problems such as uneven stress, local deformation, or low-level deformation synchronization in the performance simulation results, matching corresponding adjustment strategies to adjust the current target design model; Step 16: performing soil tilt monitoring simulation based on the current inclinometer sensor again on the adjusted target design model to obtain new first simulation data; Step 17: Repeat steps 12-16 until there is no packaging problem in the obtained performance simulation results, and fine-tune the first design drawing according to the adjusted target design model to obtain the target design drawing.

8. The packaging design method of an inclinometer sensor according to claim 7, characterized in that: Acquiring a performance evaluation result of the first packaging structure according to an analysis of the connection deformation data in the first simulation data includes: Taking a change monitoring point from a corresponding first package structure region in the target design model and treating it as a first monitoring point; The corresponding package deformation data of all first monitoring points in the connected deformation data are used as dependent variables, and the first monitoring point number is used as an independent variable to construct the first deformation curves at different simulation times; Extracting the curve trend feature from the first deformation curve for analysis to obtain the packaging deformation distribution coefficient of the current first packaging structure at different simulation times; The package deformation distribution coefficient is used as the dependent variable and the simulation time is used as the independent variable to construct the comprehensive deformation distribution curve; Performing trend analysis on the comprehensive deformation distribution curve to obtain a comprehensive deformation distribution coefficient; If the comprehensive deformation distribution coefficient is less than the set deformation distribution threshold, it is determined that the current first packaging structure is concentratedly deformed and output as a performance evaluation result; Otherwise, determining that the current first packaging structure is partially deformed, and outputting it as a performance evaluation result; Taking the parameter data of the sensor change parameters in the connected deformation data as the independent variable and the simulation time as the dependent variable, the corresponding change-parameter curve of each sensor change parameter is constructed in time series; The comprehensive deformation distribution curve and the variation-parameter curve are divided according to the simulation time to obtain a plurality of distribution sub-curves and parameter sub-curves respectively; Calculate the curve area ratio and the curve slope ratio of the distribution sub-curve and the parameter sub-curve belonging to the same simulation time interval, and obtain a first area ratio and a first slope ratio accordingly; Based on the first area ratio and the first slope ratio, a deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter is calculated; The calculation formula of the deformation synchronization evaluation coefficient is as follows: ; In the formula, It is expressed as the deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter; It is expressed as the first area ratio of the corresponding distribution sub-curve and parameter sub-curve in the jth simulation time interval, where j=1, 2, 3, , m; m represents the total number of simulation time intervals; It is expressed as the first area ratio of the distribution sub-curve and the parameter sub-curve in the j-1th simulation time interval; It is expressed as the contribution weight of the curve area ratio to the simultaneous evaluation of the analyzed deformation; It is expressed as the contribution weight of the curve slope ratio to the simultaneous assessment of the analyzed deformation; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-th simulation time interval; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-1th simulation time interval; Perform weighted average calculation on the deformation synchronization evaluation coefficients of the packaging structure deformation and all sensor change parameters to obtain a comprehensive deformation synchronization evaluation coefficient; Taking the comprehensive deformation synchronization evaluation coefficient as a matching condition, the deformation synchronization level of the current first packaging structure and the inclinometer sensor is determined and output as a performance evaluation result.

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