A packaging design method for an inclinometer sensor

Abstract

The present invention provides a packaging design method for an inclinometer sensor, which relates to the field of civil engineering technology. The method includes connecting and optimizing a first packaging structure designed based on the characteristics of the inclinometer sensor with a target connection method determined based on the service life and range of the sensor to obtain a first design drawing; and packaging the inclinometer sensor by using a target design drawing obtained after performing performance simulation on the inclinometer sensor connected to the first packaging structure and fine-tuning the first design drawing. By connecting and optimizing a first packaging structure designed based on the characteristics of the inclinometer sensor with a target connection method determined based on the service life and range of the sensor, a first design drawing is obtained; performing performance simulation on the packaged inclinometer sensor, and fine-tuning the first design drawing according to the performance simulation results to obtain a target design drawing; and packaging the inclinometer sensor according to the target design drawing, which can achieve effective packaging of the inclinometer sensor and avoid damage.

Description

Technical Field

[0001] The present invention relates to the technical field of civil engineering, and particularly relates to a packaging design method for an inclinometer sensor. Background Art

[0002] In recent years, in the field of civil engineering, the monitoring of soil inclination deformation is crucial for ensuring structural safety. Traditional inclinometry methods often have problems such as insufficient accuracy, complex installation, and easy damage to sensors. Moreover, inclinometer sensors without reasonable packaging are vulnerable to damage in complex geological environments, resulting in the failure of soil inclination monitoring. Therefore, how to effectively package inclinometer sensors and avoid damage has become one of the current research focuses.

[0003] Therefore, the present invention provides a packaging design method for an inclinometer sensor. Summary of the Invention

[0004] The present invention provides a packaging design method for an inclinometer sensor, which is used to connect and optimize a first packaging structure designed based on the characteristics of the inclinometer sensor with a target connection method determined based on the service life and range of the sensor to obtain a first design drawing; perform performance simulation on the packaged inclinometer sensor, and fine-tune the first design drawing according to the performance simulation results to obtain a target design drawing; package the inclinometer sensor according to the target design drawing, which can effectively package the inclinometer sensor and avoid damage.

[0005] The present invention provides a packaging design method for an inclinometer sensor, including:

[0006] Step 1: Design a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure;

[0007] Step 2: Determine a target connection method based on the service life and range of the sensor, connect the first packaging structure with the inclinometer sensor, and optimize the connection part to obtain a first design drawing;

[0008] Step 3: Perform packaging connection performance simulation on the inclinometer sensor connected to the first packaging structure, and fine-tune the first design drawing according to the performance simulation results to obtain a target design drawing;

[0009] Step 4: Package and design the current inclinometer sensor according to the target design drawing.

[0010] Preferably, designing a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure includes:

[0011] Determine the first applicable size of the current inclinometer sensor according to the monitoring environment of the inclinometer sensor;

[0012] Determine the encapsulation structure material of the current inclinometer sensor and the corresponding list of encapsulation structure options based on the category of the current inclinometer sensor and the monitoring environment;

[0013] Match the key encapsulation structure from the list of encapsulation structure options with the obtained first applicable size as the matching condition;

[0014] Use the set modeling software to establish an initial encapsulation structure model based on the obtained key encapsulation structure, and after marking the key structure information in the initial encapsulation structure model, output it as the first encapsulation structure.

[0015] Preferably, the key structure information refers to the size, connection method, and encapsulation material used in the key encapsulation structure.

[0016] Preferably, determine the target connection method based on the service life and range of the sensor, connect the first encapsulation structure with the target inclinometer sensor, and optimize the connection to obtain the first design drawing, including:

[0017] Obtain the first connection method between the current first encapsulation structure and the inclinometer sensor;

[0018] If there is only a single first connection method, use the current first connection method as the target connection method;

[0019] If there are multiple first connection methods, screen out the most suitable first connection method from all the obtained first connection methods as the target connection method by analyzing the service life and range of the current inclinometer sensor;

[0020] Based on the set modeling software, establish a sensor model of the current inclinometer sensor and connect it with the key encapsulation structure according to the target connection method to obtain the first connection model;

[0021] After optimizing the connection in the first connection model, obtain the target design model;

[0022] Generate a two-dimensional first design drawing using the set modeling software according to the target design model.

[0023] Preferably, screening out the most suitable first connection method from all the obtained first connection methods as the target connection method by analyzing the service life and range of the current inclinometer sensor includes:

[0024] Respectively expand the service life and range of the current inclinometer sensor to obtain the reference service life and the reference range;

[0025] Extract the inclinometer sensors from the sensing connection database whose service life and range belong to the reference service life and the reference range respectively, and whose reference information is the same as that of the current inclinometer sensor, and mark them as reference sensors;

[0026] Obtain the historical connection usage records of each reference sensor using the first connection method;

[0027] Calculate the first usage evaluation coefficient for each first connection method based on the historical connection usage records;

[0028] Among them, the calculation formula for the first usage evaluation coefficient is as follows:

[0029] ; In the formula, P1 represents the first usage evaluation coefficient of the current first connection method; represents the historical usage frequency of the i-th reference sensor using the current first connection method, where i = 1, 2, 3, , n; n represents the total number of reference sensors; represents the service life ratio of the i-th reference sensor to the current inclinometer sensor; represents the range ratio of the i-th reference sensor to the current inclinometer sensor; represents the historical failure times of the i-th reference sensor using the current first connection method; represents the historical failure repair duration of the i-th reference sensor using the current first connection method; e represents a constant with a value of 2.7;

[0030] Use the set reliability evaluation index to evaluate the performance of each first connection method to obtain the first reliability coefficient;

[0031] Perform a weighted average calculation on the first usage evaluation coefficient and the first reliability coefficient to obtain a comprehensive evaluation coefficient;

[0032] Regard the first connection method with the largest comprehensive evaluation coefficient as the target connection method.

[0033] Preferably, after optimizing the connection part in the first connection model, a target design model is obtained, including:

[0034] Import the first connection model into the set finite element analysis software, run the preset solver to perform stress analysis on the connection part, and obtain the first stress distribution result;

[0035] According to the first stress distribution result, if there are high stress areas and stress concentration points, obtain the real-time parameter values of the stable correlation parameters of the current high stress areas and stress concentration points;

[0036] Compare the real-time parameter values of the stable correlation parameters with the corresponding expected parameter values to obtain the correlation parameter difference;

[0037] When the difference between the associated parameter differences of all stable associated parameters is greater than the corresponding set associated threshold difference, select the key replacement material to replace the original material at the connection, and obtain the target design model;

[0038] When there is a difference between stable associated parameters that is not greater than the corresponding set associated threshold difference, use the stable associated parameters with a difference between associated parameter differences greater than the corresponding set associated threshold difference as the matching condition, and match the first connection process parameter from the set stable-process parameter mapping table;

[0039] After optimizing the first connection process parameter within the current first connection method according to the corresponding optimization plan, obtain the target design model.

[0040] Preferably, perform a simulation of the packaging connection performance of the inclinometer sensor connected to the first packaging structure, and based on the performance simulation results, fine-tune the first design drawing to obtain the target design drawing, including:

[0041] Step 11: After setting the operation simulation parameters of the current inclinometer sensor in the set modeling software, run the target design model to implement the simulation of soil inclination monitoring based on the current inclinometer sensor, and obtain the first simulation data;

[0042] Step 12: Use the set connection evaluation index to perform stress evaluation on all connections between the first packaging structure and the current inclinometer sensor based on the packaging connection stress data in the first simulation data, and obtain the connection stress evaluation result of the first packaging structure;

[0043] Step 13: Obtain the performance evaluation result of the first packaging structure based on the analysis of the connection deformation data in the first simulation data;

[0044] Step 14: Combine and analyze the connection stress evaluation result and the performance evaluation result of the first packaging structure to obtain the performance simulation result;

[0045] Step 15: If there are packaging problems such as uneven stress, local deformation, or low-level deformation synchronization in the performance simulation result, match the corresponding adjustment strategy to adjust the current target design model;

[0046] Step 16: Perform the simulation of soil inclination monitoring based on the current inclinometer sensor on the adjusted target design model again to obtain new first simulation data;

[0047] Step 17: Repeat steps 12-16 until there are no packaging problems in the obtained performance simulation result, and based on the adjusted target design model, fine-tune the first design drawing to obtain the target design drawing.

[0048] Preferably, according to the analysis of the connection deformation data in the first simulation data, obtain the performance evaluation result of the first packaging structure, including:

[0049] Take change monitoring points from the corresponding first packaging structure area in the target design model and regard them as the first monitoring points;

[0050] Taking the corresponding packaging deformation data of all the first monitoring points in the connection deformation data as the dependent variable and the first monitoring point number as the independent variable, construct the first deformation curves at different simulation times;

[0051] Extract the curve trend characteristics from the first deformation curves for analysis to obtain the packaging deformation distribution coefficient of the current first packaging structure at different simulation times;

[0052] Taking the packaging deformation distribution coefficient as the dependent variable and the simulation time as the independent variable, construct a comprehensive deformation distribution curve;

[0053] Conduct trend analysis on the comprehensive deformation distribution curve to obtain the comprehensive deformation distribution coefficient;

[0054] If the comprehensive deformation distribution coefficient is less than the set deformation distribution threshold, it is determined that the current first packaging structure has concentrated deformation and is output as the performance evaluation result;

[0055] Otherwise, it is determined that the current first packaging structure has local deformation and is output as the performance evaluation result;

[0056] Taking the parameter data of the sensor change parameters in the connection deformation data as the independent variable and the simulation time as the dependent variable, construct the corresponding change-parameter curves of each sensor change parameter in chronological order;

[0057] Divide the comprehensive deformation distribution curve and the change-parameter curve according to the simulation time to obtain several distribution sub-curves and parameter sub-curves respectively;

[0058] Calculate the curve area ratio and curve slope ratio of the distribution sub-curve and the parameter sub-curve belonging to the same simulation time interval, and correspondingly obtain the first area ratio and the first slope ratio;

[0059] Based on the first area ratio and the first slope ratio, calculate the deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter;

[0060] Among them, the calculation formula of the deformation synchronization evaluation coefficient is as follows:

[0061] ; In the formula, represents the deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter; Denoted as the first area ratio of the corresponding distribution sub-curve and parameter sub-curve for the j-th simulation time interval, where j = 1, 2, 3, , m; m represents the total number of simulation time intervals; Denoted as the first area ratio of the distribution sub-curve and parameter sub-curve for the (j - 1)-th simulation time interval; Denoted as the contribution weight of the curve area ratio to the analysis of deformation synchronization evaluation; Denoted as the contribution weight of the curve slope ratio to the analysis of deformation synchronization evaluation; Denoted as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve for the j-th simulation time interval; Denoted as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve for the (j - 1)-th simulation time interval;

[0062] Perform a weighted average calculation on the deformation synchronization evaluation coefficient of the package structure deformation and the deformation parameters of all sensors to obtain a comprehensive deformation synchronization evaluation coefficient;

[0063] Taking the comprehensive deformation synchronization evaluation coefficient as the matching condition, determine the deformation synchronization level of the current first package structure and the inclinometer sensor, and output it as the performance evaluation result.

[0064] Compared with the prior art, the beneficial effects of the present application are as follows:

[0065] By connecting and optimizing the first package structure designed based on the characteristics of the inclinometer sensor with the target connection method determined based on the service life and range of the sensor, a first design drawing is obtained; perform performance simulation on the packaged inclinometer sensor, and fine-tune the first design drawing according to the performance simulation results to obtain a target design drawing; package the inclinometer sensor according to the target design drawing, which can achieve effective packaging of the inclinometer sensor and avoid damage.

[0066] Other features and advantages of the present invention will be described in the following specification, and, in part, will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained by the structures specifically pointed out in the written specification and the drawings.

[0067] The technical solutions of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0068] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0069] Figure 1This is a flowchart of a packaging design method for an inclinometer sensor in an embodiment of the present invention. Specific embodiments

[0070] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not used to limit the present invention.

[0071] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, as Figure 1 shown, including:

[0072] Step 1: Design a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure;

[0073] Step 2: Determine the target connection method based on the service life and range of the sensor, connect the first packaging structure to the inclinometer sensor, and optimize the connection part to obtain a first design drawing;

[0074] Step 3: Simulate the packaging connection performance of the inclinometer sensor connected to the first packaging structure, and fine-tune the first design drawing according to the performance simulation results to obtain a target design drawing;

[0075] Step 4: Perform a packaging design on the current inclinometer sensor according to the target design drawing.

[0076] In this embodiment, the characteristics of the inclinometer sensor refer to the monitoring environment, category, and size of the inclinometer sensor; the inclinometer sensor refers to a sensor used to measure and monitor the change in the inclination angle of a structure or soil; the first packaging structure refers to a three-dimensional model marked with key structure information designed based on the set modeling software; the range refers to the maximum range that the inclinometer sensor can measure; the target connection method refers to the connection method that is most suitable for the current inclinometer sensor and the key packaging structure; the first design drawing refers to a two-dimensional drawing generated using the set modeling software according to the target design model, including connection details, dimension markings, etc. of the sensor and the packaging structure; the target design drawing is a drawing obtained by fine-tuning the first design drawing according to the performance simulation results.

[0077] The beneficial effects of the above technical solution are as follows: By connecting the first packaging structure designed based on the characteristics of the inclinometer sensor with the target connection method determined based on the service life and range of the sensor and optimizing it, a first design drawing is obtained; the performance of the packaged inclinometer sensor is simulated, and the first design drawing is fine-tuned according to the performance simulation results to obtain a target design drawing; packaging the inclinometer sensor according to the target design drawing can achieve effective packaging of the inclinometer sensor and avoid damage.

[0078] An embodiment of the present invention provides a packaging design method for an inclinometer sensor. Using a set modeling software, a packaging structure is designed based on the characteristics of the inclinometer sensor to obtain a first packaging structure, including:

[0079] According to the monitoring environment of the inclinometer sensor, determine the first applicable size of the current inclinometer sensor;

[0080] Using the category and monitoring environment of the current inclinometer sensor, determine the packaging structure material of the current inclinometer sensor and the corresponding list of packaging structure options;

[0081] Taking the obtained first applicable size as a matching condition, match the key packaging structure from the list of packaging structure options;

[0082] Using the set modeling software, establish an initial packaging structure model based on the obtained key packaging structure, and after marking the key structure information in the initial packaging structure model, output it as the first packaging structure.

[0083] In this embodiment, the inclinometer sensor refers to a sensor used to measure and monitor the change in the inclination angle of a structure or soil; the monitoring environment refers to the usage environment of the inclinometer sensor, such as underground, under a bridge, or on a tunnel wall; the first applicable size refers to the optimal or most suitable size of the inclinometer sensor determined according to the limitations and requirements of the monitoring environment, including the diameter, length of the sensor, and the size of the connection part, etc.; the category of the inclinometer sensor refers to different types of inclinometer sensors, such as Flex inclinometer sensors, BOFDA distributed fiber optic inclinometer sensors; the packaging structure materials include types such as stainless steel, titanium alloy, polymer materials, and the biodegradable environmental protection material polylactic acid. If the sensor category is different or the monitoring environment is different, the corresponding packaging structure materials may be different; the list of packaging structure options is a list composed of all packaging structures applicable to the current category of inclinometer sensor.

[0084] In this embodiment, the key packaging structure is a packaging structure that meets the requirements of the first applicable size selected from the list of packaging structure options with the first applicable size of the current inclinometer sensor as the matching condition; the set modeling software is pre-determined software for modeling and packaging inclinometer sensors, such as CATIA software; the initial packaging structure model refers to a preliminary three-dimensional model created in the set modeling software according to the key packaging structure; the key structure information refers to the size, connection method, and packaging material used in the key packaging structure.

[0085] The beneficial effects of the above technical solution are: By using the set modeling software to design the packaging structure based on the monitoring environment and category of the inclinometer sensor, it helps to improve the accuracy and efficiency of the design and optimize the performance of the packaging structure.

[0086] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which determines a target connection method based on the service life and range of the sensor, connects the first packaging structure to the target inclinometer sensor, and optimizes the connection part to obtain a first design drawing, including:

[0087] Obtain the first connection method between the current first packaging structure and the inclinometer sensor;

[0088] If there is only a single first connection method, then use the current first connection method as the target connection method;

[0089] If there are multiple first connection methods, then through analyzing the service life and range of the current inclinometer sensor, screen out the most suitable first connection method from all the obtained first connection methods as the target connection method;

[0090] Based on a set modeling software, establish a sensor model of the current inclinometer sensor, and connect it to the key packaging structure according to the target connection method to obtain a first connection model;

[0091] After optimizing the connection part in the first connection model, obtain a target design model;

[0092] According to the target design model, use the set modeling software to generate a two-dimensional first design drawing.

[0093] In this embodiment, the first connection method refers to the possible connection methods between the inclinometer sensor and the packaging structure, including threaded connection, snap connection and other methods; the target connection method refers to the connection method that is most suitable for the current inclinometer sensor and the key packaging structure; the sensor model refers to the three-dimensional model of the inclinometer sensor created using the set modeling software; the first connection model is obtained by connecting the sensor model to the key packaging structure according to the target connection method, and is used to show how the inclinometer sensor and the packaging structure are combined through a specific connection method; the target design model refers to the model obtained by optimizing the connection part on the basis of the first connection model; the first design drawing refers to the drawing generated using the set modeling software according to the target design model, and includes connection details, dimension markings and other information of the sensor and the packaging structure.

[0094] The beneficial effects of the above technical solution are: by determining the connection method with the packaging structure based on the service life and range of the sensor, and optimizing the connection part, the practicability and reliability of the packaging design can be effectively ensured, and it helps to improve the overall performance of the packaging structure.

[0095] An embodiment of the present invention provides a packaging design method for an inclinometer sensor, which screens out the most suitable first connection method from all the obtained first connection methods as the target connection method by analyzing the service life and range of the current inclinometer sensor, including:

[0096] Separate the service life and range of the current inclinometer sensor to be expanded to obtain the reference service life and reference range;

[0097] Extract from the sensing connection database the inclinometer sensors whose service life and range belong to the reference service life and reference range respectively, and whose reference information is consistent with that of the current inclinometer sensor, and label them as reference sensors;

[0098] Obtain the historical connection usage records of each reference sensor using the first connection method;

[0099] Calculate the first usage evaluation coefficient for each first connection method according to the historical connection usage records;

[0100] Among them, the calculation formula of the first usage evaluation coefficient is as follows:

[0101] ; In the formula, P1 represents the first usage evaluation coefficient of the current first connection method; represents the historical usage frequency of the i-th reference sensor using the current first connection method, where i = 1, 2, 3, , n; n represents the total number of reference sensors; represents the service life ratio of the i-th reference sensor to the current inclinometer sensor; represents the range ratio of the i-th reference sensor to the current inclinometer sensor; represents the historical failure times of the i-th reference sensor using the current first connection method; represents the historical failure repair duration of the i-th reference sensor using the current first connection method; e represents a constant with a value of 2.7;

[0102] Use the set reliability evaluation index to evaluate the performance of each first connection method to obtain the first reliability coefficient;

[0103] Perform a weighted average calculation on the first usage evaluation coefficient and the first reliability coefficient to obtain a comprehensive evaluation coefficient;

[0104] Regard the first connection method with the largest comprehensive evaluation coefficient as the target connection method.

[0105] In this embodiment, the reference service life refers to the service life value range obtained after expanding the service life of the current inclinometer sensor, expressed as , where a0 represents the service life of the current inclinometer sensor; the reference range refers to the range value range obtained after expanding the range of the current inclinometer sensor, expressed as , where b0 represents the range of the current inclinometer sensor; the sensing connection database refers to a database that stores various inclinometer sensors and their connection information, including the service life, range, connection method, historical usage records, etc. of the sensors; the reference information refers to the monitoring environment, sensor size, connection method between the sensor and the packaging structure, and the adopted packaging structure.

[0106] In this embodiment, the reference sensor refers to a sensor extracted from the sensing connection database, whose service life and range respectively belong to the reference service life and reference range, and the reference information is consistent with that of the current inclinometer sensor; the historical connection usage record refers to the historical usage of the sensor with different connection methods, including information such as usage frequency, number of failures, and failure repair duration; the first usage evaluation coefficient is used to evaluate the applicability of each first connection method on the current inclinometer sensor; the set reliable evaluation index is used to evaluate the reliability of each first connection method, including connection strength, connection density, fatigue resistance, and installation difficulty; the first reliable coefficient is obtained by weighted averaging the index coefficients obtained by evaluating the first connection method using the set reliable evaluation index, and the weights assigned to the set reliable evaluation index are obtained by solving the matrix constructed through pairwise comparison and relative importance scoring using the analytic hierarchy process.

[0107] In this embodiment, the weights assigned to the first usage evaluation coefficient and the first reliable coefficient are obtained by solving the matrix constructed through pairwise comparison and relative importance scoring using the analytic hierarchy process; the target connection method refers to the first connection method with the largest comprehensive evaluation coefficient.

[0108] The beneficial effects of the above technical solution are: By analyzing the service life and range of the current inclinometer sensor to determine the target connection method, it helps to ensure the practicability and reliability of the packaging design, and helps to improve the overall performance of the packaging structure.

[0109] An embodiment of the present invention provides a packaging design method for an inclinometer sensor. After optimizing the connection part in the first connection model, a target design model is obtained, including:

[0110] Import the first connection model into the set finite element analysis software, run the preset solver to perform stress analysis on the connection part, and obtain the first stress distribution result;

[0111] According to the first stress distribution result, if there are high stress areas and stress concentration points, obtain the real-time parameter values of the stable correlation parameters of the current high stress areas and stress concentration points;

[0112] Compare the real-time parameter values of the stable correlation parameters with the corresponding expected parameter values to obtain the correlation parameter difference;

[0113] When the difference between the correlation parameters of all stable correlation parameters is greater than the corresponding set correlation threshold difference, select the key replacement material to replace the original material at the joint to obtain the target design model;

[0114] When there is a stable correlation parameter whose correlation parameter difference is not greater than the corresponding set correlation threshold difference, use the stable correlation parameter with a correlation parameter difference greater than the corresponding set correlation threshold difference as the matching condition, and match the first connection process parameter from the set stable-process parameter mapping table;

[0115] After optimizing the first connection process parameter in the current first connection method according to the corresponding optimization scheme, obtain the target design model.

[0116] In this embodiment, the set finite element analysis software is a software preset for analyzing the stress condition at the joint; the preset solver refers to a component in the set finite element analysis software, which is used to solve the response of the model (such as stress, displacement, etc.) according to the input model, material properties, and boundary conditions, etc.; the first stress distribution result is obtained by running the preset solver through the finite element analysis software, and is used to represent the stress distribution condition of the joint under specific load conditions; the stable correlation coefficient refers to the coefficient related to connection stability, such as yield strength, tensile strength; the correlation coefficient difference refers to the difference obtained by subtracting the corresponding expected parameter value from the real-time parameter value of the stable correlation parameter; the set stable-process parameter mapping table is used to store the mapping relationship between different stable correlation parameters and the corresponding connection process parameters (such as welding temperature, bolt pre-tightening force, heat treatment conditions, etc.); the first connection process parameter is used to describe the specific conditions during the connection process using a connection method (such as threaded connection, snap connection), such as welding temperature, bolt pre-tightening force, etc.; the optimization scheme refers to the specific content preset for optimizing the first connection process parameter, which is composed of an optimization goal (such as reducing stress concentration, improving connection strength), an optimization algorithm (such as gradient descent method, genetic algorithm, simulated annealing method), and an optimization model (a parameterized model established based on the finite element analysis software), etc.

[0117] The beneficial effect of the above technical solution is that by optimizing and adjusting the joint in the first connection model, it can help ensure the practicability and reliability of the package design, and improve the overall performance of the package structure.

[0118] An embodiment of the present invention provides a package design method for an inclinometer sensor, which simulates the package connection performance of the inclinometer sensor connected to the first package structure, and fine-tunes the first design drawing according to the performance simulation result to obtain the target design drawing, including:

[0119] Step 11: After setting the operation simulation parameters of the current inclinometer in the set modeling software, run the target design model to implement the soil tilt monitoring simulation based on the current inclinometer, and obtain the first simulation data;

[0120] Step 12: Use the set connection evaluation index to perform stress evaluation on all connections between the first encapsulation structure and the current inclinometer based on the encapsulated connection stress data in the first simulation data, and obtain the connection stress evaluation result of the first encapsulation structure;

[0121] Step 13: Obtain the performance evaluation result of the first encapsulation structure according to the analysis of the connection deformation data in the first simulation data;

[0122] Step 14: Combine and analyze the connection stress evaluation result and the performance evaluation result of the first encapsulation structure to obtain the performance simulation result;

[0123] Step 15: If there are encapsulation problems such as uneven stress, local deformation, or low-level deformation synchronization in the performance simulation result, match the corresponding adjustment strategy to adjust the current target design model;

[0124] Step 16: Perform the soil tilt monitoring simulation based on the current inclinometer on the adjusted target design model again to obtain new first simulation data;

[0125] Step 17: Repeat steps 12 - 16 until there are no encapsulation problems in the obtained performance simulation result, and fine-tune the first design drawing according to the adjusted target design model to obtain the target design drawing.

[0126] In this embodiment, the running simulation parameters include environmental factors such as temperature, humidity, pressure, vibration, etc., and mechanical factors such as load type, magnitude, and direction, etc.; the soil inclination monitoring simulation aims to evaluate the performance of the inclinometer sensor after encapsulation in actual applications; the first simulation data refers to various data output by the modeling software during the soil inclination monitoring simulation regarding the inclinometer sensor after encapsulation and its interaction with the soil, including encapsulation connection stress data, connection deformation data, etc.; setting the connection evaluation indexes refers to stress uniformity (determined by calculating the stress standard deviation), the maximum stress value, and the stress concentration coefficient (which refers to the stress value of representative points selected from areas where stress concentration may occur, such as the corners, hole edges, etc. of the encapsulation structure, and then obtained by dividing the nominal stress value calculated using the stress values of all representative points by the maximum stress value); the connection stress evaluation result refers to the conclusion obtained by evaluating the stress state at the connection between the first encapsulation structure and the current inclinometer sensor using the set connection evaluation indexes, including whether the stress at the connection part is uniform (when the stress standard deviation is less than the set standard deviation, it is determined that the stress is uniform, otherwise, it is determined that the stress is non-uniform) and whether there are stress concentration points (when the stress concentration coefficient is greater than the set concentration threshold, it is determined that there are stress concentration points, where the set concentration threshold is determined in advance) in two types; the performance evaluation result refers to the conclusion obtained by evaluating the overall performance of the first encapsulation structure during the simulation, such as whether the deformation of the encapsulation structure is local or concentrated; the performance simulation result is used to evaluate the performance of the inclinometer sensor after encapsulation in actual applications and is composed of the connection stress evaluation result and the performance evaluation result; the adjustment strategy refers to the specific methods and measures for optimizing the target design model extracted from the set simulation adjustment strategy table with the performance simulation result as the matching condition, and the set simulation adjustment strategy table is composed of encapsulation problems, adjustment strategies, and the specific parameters and ranges that need to be adjusted for each adjustment strategy; the target design drawing refers to the final design drawing obtained by optimizing the first design drawing according to the performance simulation result and the adjustment strategy.

[0127] The beneficial effects of the above technical solution are: By performing the encapsulation connection performance on the target inclinometer sensor connecting the first encapsulation structure, potential problems can be predicted and adjusted to ensure that the design meets the actual use requirements.

[0128] An embodiment of the present invention provides a method for encapsulating and designing an inclinometer sensor. According to the analysis of the connection deformation data in the first simulation data, the performance evaluation result of the first encapsulation structure is obtained, including:

[0129] Take the change monitoring points from the corresponding first encapsulation structure area in the target design model and regard them as the first monitoring points;

[0130] Taking the corresponding encapsulated deformation data connecting all the first monitoring points in the deformation data as the dependent variable and the first monitoring point number as the independent variable, construct the first deformation curves at different simulation times;

[0131] Extract the curve trend characteristics from the first deformation curves for analysis to obtain the encapsulation deformation distribution coefficients of the current first encapsulation structure at different simulation times;

[0132] Taking the encapsulation deformation distribution coefficient as the dependent variable and the simulation time as the independent variable, construct a comprehensive deformation distribution curve;

[0133] Conduct trend analysis on the comprehensive deformation distribution curve to obtain the comprehensive deformation distribution coefficient;

[0134] If the comprehensive deformation distribution coefficient is less than the set deformation distribution threshold, it is determined that the current first encapsulation structure has concentrated deformation and output as the performance evaluation result;

[0135] Otherwise, it is determined that the current first encapsulation structure has local deformation and output as the performance evaluation result;

[0136] Taking the parameter data of the sensor change parameters in the connection deformation data as the independent variable and the simulation time as the dependent variable, construct the corresponding change-parameter curves of each sensor change parameter in chronological order;

[0137] Divide the comprehensive deformation distribution curve and the change-parameter curves according to the simulation time to obtain several distribution sub-curves and parameter sub-curves respectively;

[0138] Calculate the curve area ratio and curve slope ratio of the distribution sub-curve and the parameter sub-curve belonging to the same simulation time interval, and correspondingly obtain the first area ratio and the first slope ratio;

[0139] Based on the first area ratio and the first slope ratio, calculate the deformation synchronization evaluation coefficient of the encapsulation structure deformation and the current sensor change parameter;

[0140] Among them, the calculation formula of the deformation synchronization evaluation coefficient is as follows:

[0141] ; In the formula, represents the deformation synchronization evaluation coefficient of the encapsulation structure deformation and the current sensor change parameter; represents the first area ratio of the corresponding distribution sub-curve and parameter sub-curve in the jth simulation time interval, where j = 1, 2, 3, , m; m represents the total number of simulation time intervals; represents the first area ratio of the distribution sub-curve and parameter sub-curve in the (j - 1)th simulation time interval; represents the contribution weight of the curve area ratio to the analysis of the deformation synchronization evaluation; It represents the contribution weight of the curve slope ratio analysis to the deformation synchronization evaluation; It represents the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-th simulation time interval; It represents the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the (j - 1)-th simulation time interval;

[0142] The weighted average calculation is performed on the deformation synchronization evaluation coefficient of the package structure deformation and the deformation parameters of all sensors to obtain the comprehensive deformation synchronization evaluation coefficient;

[0143] Taking the comprehensive deformation synchronization evaluation coefficient as the matching condition, the deformation synchronization level between the current first package structure and the inclinometer sensor is determined and output as the performance evaluation result.

[0144] In this embodiment, the first monitoring point refers to the point selected in the corresponding package structure area in the target design model for monitoring the deformation condition; the package deformation data refers to the data about the package structure deformation obtained by the first monitoring point during the simulation process of soil tilt monitoring, generally referring to the deformation amount; the first deformation curve refers to the curve constructed with the number of the first monitoring point as the independent variable and the corresponding package deformation data as the dependent variable; the package deformation distribution coefficient is obtained by weighted averaging the curve trend characteristics extracted from the first deformation curve, where the curve trend characteristics include the curve slope, the sum of the deviations of the extreme points from the average value, the curvature, and the acceleration, and the weights assigned to the curve trend characteristics are obtained by solving the matrix constructed by pairwise comparison and relative importance scoring of the curve trend characteristics using the analytic hierarchy process.

[0145] In this embodiment, the comprehensive deformation distribution curve is a curve constructed with the package deformation distribution coefficient as the dependent variable and the simulation time as the independent variable; the comprehensive deformation distribution coefficient is obtained by weighted averaging the curve trend characteristics extracted from the comprehensive deformation distribution curve, where the curve trend characteristics include the curve slope, the sum of the deviations of the extreme points from the average value, the curvature, and the acceleration, and the weights assigned to the curve trend characteristics are obtained by solving the matrix constructed by pairwise comparison and relative importance scoring of the curve trend characteristics using the analytic hierarchy process.

[0146] In this embodiment, the performance evaluation result refers to the centralized deformation of the first encapsulation structure, the local deformation of the first encapsulation structure, and the deformation synchronization level; the variation-parameter curve is a curve constructed with the parameter data of the sensor variation parameter as the independent variable and the simulation time as the dependent variable; the distribution sub-curve refers to the sub-curve obtained by dividing the comprehensive deformation distribution curve; the parameter sub-curve refers to the sub-curve obtained by dividing the variation-parameter curve according to the simulation time; the first area ratio refers to the ratio of the area of the distribution sub-curve to the area of the parameter sub-curve; the first slope ratio refers to the ratio of the slope of the distribution sub-curve to the slope of the parameter sub-curve; the deformation synchronization evaluation coefficient is used to evaluate the synchronization degree between the deformation of the encapsulation structure and the sensor variation parameter; the comprehensive deformation synchronization evaluation coefficient is obtained by weighted average calculation of the deformation synchronization evaluation coefficients of the deformation of the encapsulation structure and all sensor variation parameters, and is used to quantify the overall synchronization between the encapsulation structure and the sensor. The weights assigned to the deformation synchronization evaluation coefficients of different sensor variation parameters are obtained by solving the matrix constructed through pairwise comparison and relative importance scoring using the analytic hierarchy process; the deformation synchronization level is the synchronization level selected from the set synchronization level list with the comprehensive deformation synchronization evaluation coefficient as the matching condition. The synchronization levels include three levels: low level, medium level, and high level. The set synchronization level list is composed of different value ranges of the comprehensive deformation synchronization evaluation coefficient and the corresponding synchronization levels.

[0147] The beneficial effect of the above technical solution is that by analyzing the connection deformation data in the first simulation data to obtain the performance evaluation result of the first encapsulation structure, it can help improve the overall performance of the encapsulation structure.

[0148] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A packaging design method for an inclinometer sensor, characterized in that: include: Step 1: Designing a packaging structure based on the characteristics of the inclinometer sensor using a set modeling software to obtain a first packaging structure; Step 2: Determine a target connection method based on the service life and range of the sensor, connect the first packaging structure with the inclinometer sensor, and optimize the connection to obtain a first design drawing; Step 3: performing a package connection performance simulation on the inclinometer sensor connected to the first package structure, and fine-tuning the first design drawing according to the performance simulation result to obtain a target design drawing; Step 4: Design a package for the current inclinometer sensor according to the target design drawing; The method includes: performing a package connection performance simulation on the inclinometer sensor connected to the first package structure, and fine-tuning the first design drawing according to the performance simulation result to obtain a target design drawing, including: Step 11: After setting the operation simulation parameters of the current inclinometer sensor in the modeling software, the target design model is run to implement soil inclination monitoring simulation based on the current inclinometer sensor to obtain first simulation data; Step 12: Using the set connection evaluation index, based on the package connection stress data in the first simulation data, perform stress evaluation on all connections between the first package structure and the current inclinometer sensor to obtain a connection stress evaluation result of the first package structure; Step 13: obtaining a performance evaluation result of the first packaging structure according to an analysis of the connection deformation data in the first simulation data; Step 14: combining and analyzing the connection stress evaluation result and the performance evaluation result of the first packaging structure to obtain a performance simulation result; Step 15: If there are packaging problems such as uneven stress, local deformation, or low-level deformation synchronization in the performance simulation results, matching corresponding adjustment strategies to adjust the current target design model; Step 16: performing soil tilt monitoring simulation based on the current inclinometer sensor again on the adjusted target design model to obtain new first simulation data; Step 17: Repeat steps 12-16 until there is no packaging problem in the obtained performance simulation results, and fine-tune the first design drawing according to the adjusted target design model to obtain the target design drawing.

2. The packaging design method of an inclinometer sensor according to claim 1, characterized in that: The package structure is designed based on the characteristics of the inclinometer sensor using the setting modeling software to obtain a first package structure, including: Determining a first applicable size of the current inclinometer sensor according to a monitoring environment of the inclinometer sensor; Determine the packaging structure material of the current inclinometer sensor and a corresponding packaging structure option list by using the category of the current inclinometer sensor and the monitoring environment; Using the first applicable size obtained as a matching condition, matching a key package structure from a package structure option list; An initial packaging structure model is established based on the acquired key packaging structure by using a set modeling software, and after key structural information is annotated in the initial packaging structure model, it is output as a first packaging structure.

3. The packaging design method of an inclinometer sensor according to claim 2, characterized in that: Structural key information refers to the size, connection method and packaging materials used in key packaging structures.

4. The packaging design method of an inclinometer sensor according to claim 1, characterized in that: The target connection mode is determined based on the service life and range of the sensor, the first packaging structure is connected to the target inclinometer sensor, and the connection is optimized to obtain a first design drawing, including: Acquire a first connection mode between the current first packaging structure and the inclinometer sensor; If there is only a single first connection mode, the current first connection mode is used as the target connection mode; If there are multiple first connection modes, the most suitable first connection mode is selected as the target connection mode from all the acquired first connection modes by analyzing the service life and the measuring range of the current inclinometer sensor; A sensor model of the current inclinometer sensor is established based on the set modeling software, and connected with the key packaging structure according to the target connection mode to obtain a first connection model; After optimizing the connection in the first connection model, a target design model is obtained; According to the target design model, a first two-dimensional design drawing is generated using set modeling software.

5. The packaging design method of an inclinometer sensor according to claim 4, characterized in that: By analyzing the service life and measuring range of the current inclinometer sensor, the most suitable first connection mode is selected as the target connection mode from all the first connection modes obtained, including: The service life and measuring range of the current inclinometer sensor are respectively extended to obtain a reference service life and a reference measuring range; Extract the inclinometer sensor whose service life and measuring range correspond to the benchmark service life and benchmark measuring range from the sensor connection database, and whose benchmark information is consistent with the current inclinometer sensor, and mark it as the reference sensor; Obtain a historical connection usage record of each reference sensor using the first connection mode; Calculating a first usage evaluation coefficient for each first connection mode according to historical connection usage records; The calculation formula of the first use evaluation coefficient is as follows: ; Wherein, P1 represents the first usage evaluation coefficient of the current first connection mode; It is represented as the historical usage frequency of the i-th reference sensor using the current first connection mode, where i=1,2,3, ,n; n represents the total number of reference sensors; It is expressed as the ratio of the service life of the i-th reference sensor to the current inclinometer sensor; It is expressed as the range ratio of the i-th reference sensor to the current inclinometer sensor; It is represented by the number of historical failures of the i-th reference sensor using the current first connection mode; It is represented by the historical fault repair time of the i-th reference sensor using the current first connection mode; e is represented by a constant, and its value is 2.7; Using a set reliability evaluation index to perform a performance evaluation on each first connection mode to obtain a first reliability coefficient; Performing weighted average calculation on the first usage evaluation coefficient and the first reliability coefficient to obtain a comprehensive evaluation coefficient; The first connection method with the largest comprehensive evaluation coefficient is regarded as the target connection method.

6. The packaging design method of an inclinometer sensor according to claim 4, characterized in that: After optimizing the connection in the first connection model, a target design model is obtained, including: Importing the first connection model into a set finite element analysis software, running a preset solver to perform stress analysis at the connection, and obtaining a first stress distribution result; According to the first stress distribution result, if there are high stress areas and stress concentration points, obtain real-time parameter values ​​of stable associated parameters of the current high stress areas and stress concentration points; Comparing the real-time parameter value of the stable correlation parameter with the corresponding expected parameter value to obtain the correlation parameter difference; When the correlation parameter difference of all stable correlation parameters is greater than the corresponding set correlation threshold difference, a key replacement material is selected to replace the original material at the connection to obtain a target design model; When there is a stable associated parameter whose associated parameter difference is not greater than the corresponding set associated threshold difference, the stable associated parameter whose associated parameter difference is greater than the corresponding set associated threshold difference is used as a matching condition, and the first connection process parameter is obtained by matching from the set stable-process parameter mapping table; After optimizing the first connection process parameters in the current first connection mode according to the corresponding optimization scheme, a target design model is obtained.

7. The packaging design method of an inclinometer sensor according to claim 1, characterized in that: Acquiring a performance evaluation result of the first packaging structure according to an analysis of the connection deformation data in the first simulation data includes: Taking a change monitoring point from a corresponding first package structure region in the target design model and treating it as a first monitoring point; The corresponding package deformation data of all first monitoring points in the connected deformation data are used as dependent variables, and the first monitoring point number is used as an independent variable to construct the first deformation curves at different simulation times; Extracting the curve trend feature from the first deformation curve for analysis to obtain the packaging deformation distribution coefficient of the current first packaging structure at different simulation times; The package deformation distribution coefficient is used as the dependent variable and the simulation time is used as the independent variable to construct the comprehensive deformation distribution curve; Performing trend analysis on the comprehensive deformation distribution curve to obtain a comprehensive deformation distribution coefficient; If the comprehensive deformation distribution coefficient is less than the set deformation distribution threshold, it is determined that the current first packaging structure is concentratedly deformed and output as a performance evaluation result; Otherwise, determining that the current first packaging structure is partially deformed, and outputting it as a performance evaluation result; Taking the parameter data of the sensor change parameters in the connected deformation data as the independent variable and the simulation time as the dependent variable, the corresponding change-parameter curve of each sensor change parameter is constructed in time series; The comprehensive deformation distribution curve and the variation-parameter curve are divided according to the simulation time to obtain a plurality of distribution sub-curves and parameter sub-curves respectively; Calculate the curve area ratio and the curve slope ratio of the distribution sub-curve and the parameter sub-curve belonging to the same simulation time interval, and obtain a first area ratio and a first slope ratio accordingly; Based on the first area ratio and the first slope ratio, a deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter is calculated; The calculation formula of the deformation synchronization evaluation coefficient is as follows: ; In the formula, It is expressed as the deformation synchronization evaluation coefficient of the packaging structure deformation and the current sensor change parameter; It is expressed as the first area ratio of the corresponding distribution sub-curve and parameter sub-curve in the jth simulation time interval, where j=1, 2, 3, , m; m represents the total number of simulation time intervals; It is expressed as the first area ratio of the distribution sub-curve and the parameter sub-curve in the j-1th simulation time interval; It is expressed as the contribution weight of the curve area ratio to the simultaneous evaluation of the analyzed deformation; It is expressed as the contribution weight of the curve slope ratio to the simultaneous assessment of the analyzed deformation; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-th simulation time interval; It is expressed as the first slope ratio of the corresponding distribution sub-curve and parameter sub-curve in the j-1th simulation time interval; Perform weighted average calculation on the deformation synchronization evaluation coefficients of the packaging structure deformation and all sensor change parameters to obtain a comprehensive deformation synchronization evaluation coefficient; Taking the comprehensive deformation synchronization evaluation coefficient as a matching condition, the deformation synchronization level of the current first packaging structure and the inclinometer sensor is determined and output as a performance evaluation result.

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