Position detection device, semiconductor device, and method for detecting substrate offset

Abstract

A position detection apparatus includes a detection area, a plurality of detectors disposed in the detection area, and a controller configured to control the plurality of detectors when a manipulator and a substrate are placed in the detection area. The plurality of detectors are configured to respectively emit a detection signal with a width to the surface of the substrate, each detection signal covers the edge of the substrate in the width direction, and the detectors output the length of the detection signal shielded by the substrate in the width direction; the controller is configured to be in signal connection with the multiple detectors, the current length, shielded by the substrate, of each detection signal in the width direction is obtained through the multiple detectors, and the offset, deviating from the standard position, of the substrate on the mechanical arm is obtained according to the current length and the standard length. The offset of the substrate on the manipulator is obtained through the length, shielded by the surface of the substrate, of each detection signal in the width direction, and the method is suitable for warping the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a position detection device, semiconductor equipment and a method for detecting the offset of a substrate on a robot. Background Art

[0002] In the semiconductor manufacturing process, the robot plays an extremely important role. The robot is responsible for taking the substrate from one station and transferring it to the next station for a series of process steps such as gluing and developing. Before performing the above operations, the substrate and the robot will be aligned to ensure that the center of the substrate is aligned with the center of the next station.

[0003] At present, the substrate and the robot can be aligned by detecting the offset of the substrate on the robot. Generally, a distance sensor is installed on the robot, and the offset of the substrate on the robot is determined by measuring the distance between the distance sensor and the edge of the substrate, and then the robot is adjusted according to the offset. However, this method is not applicable to warped substrates, because the distance sensor on the robot cannot accurately detect the edge of the warped substrate, and thus cannot accurately determine the center of the substrate, resulting in the robot being unable to accurately find the center position of the substrate, which leads to deviations in the alignment of the substrate with the next station. Summary of the invention

[0004] The purpose of the present invention is to solve the problem of how to obtain the offset of a substrate on a robot in the prior art and to be applicable to a warped substrate.

[0005] In order to solve the above problems, the present application proposes a position detection device for detecting the displacement of a substrate from a standard position on a robot, comprising:

[0006] Detection area;

[0007] A plurality of detectors are arranged in the detection area. When the manipulator and the substrate are placed in the detection area, the plurality of detectors are located on at least one side of the surface of the substrate on the manipulator. The plurality of detectors are arranged to: respectively transmit a detection signal having a width to the surface of the substrate, each detection signal covers the edge of the substrate in the direction of the width, and the detector outputs the detection signal by the length blocked by the substrate in the direction of the width;

[0008] A controller is configured to be connected to a plurality of detector signals, obtain the current length of each detection signal blocked by the substrate in the width direction through the plurality of detectors, and obtain the offset of the substrate from the standard position on the manipulator according to the current length and the standard length;

[0009] The standard length refers to the length of the detection signals output by multiple detectors blocked by the substrate in the width direction when the substrate is located at the standard position on the robot. When the substrate is located at the standard position, the center of the substrate is aligned with the center of the robot.

[0010] The current length refers to the length of the detection signals output by the plurality of detectors blocked by the substrate in the width direction when the substrate at the current position on the robot is detected.

[0011] The present application proposes a semiconductor device, comprising:

[0012] Main frame;

[0013] A robot arm is arranged in the main frame and is used for transferring the substrate;

[0014] The above-mentioned position detection device is used to detect the deviation of the substrate from the standard position on the robot.

[0015] The present application proposes a method for detecting the offset of a substrate on a robot, comprising the following steps:

[0016] Placing the robot arm and the substrate thereon in a detection area;

[0017] Transmitting a plurality of detection signals having a width to the surface of the substrate, each detection signal covering an edge of the substrate in a direction of the width, and obtaining a length of each detection signal blocked by the substrate in the direction of the width;

[0018] Obtain the current length of each detection signal blocked by the substrate in the width direction, and obtain the offset of the substrate from the standard position on the robot according to the current length and the standard length;

[0019] The standard length refers to the length of a plurality of detection signals blocked by the substrate in the width direction when the substrate is located at the standard position on the manipulator. When the substrate is located at the standard position, the center of the substrate is aligned with the center of the manipulator.

[0020] The current length refers to the length of the detection signals output by the plurality of detection signals blocked by the substrate in the width direction when the substrate at the current position on the robot is detected.

[0021] The position detection device provided by the present invention includes a detection area, multiple detectors and a controller. The multiple detectors are arranged in the detection area to respectively transmit a detection signal with a width to the surface of the substrate in the detection area. Each detection signal covers the edge of the substrate in the width direction. The detector outputs the length of the detection signal blocked by the substrate in the width direction. The controller is connected to the multiple detector signals, and the current length of each detection signal blocked by the substrate in the width direction is obtained through the multiple detectors. According to the current length and the standard length, the offset of the substrate from the standard position on the robot is obtained. For a warped substrate, this method of obtaining the offset is also applicable. The length of the multiple detection signals emitted by the multiple detectors blocked by the warped substrate in the width direction is the accurate current length. According to the current length and the standard length, the offset of the warped substrate from the standard position on the robot can be accurately obtained.

[0022] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects become obvious from the description in the specification of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of a robot and a substrate in Example 1 of the present application when they are placed in a detection area of ​​a position detection device;

[0024] Figure 2 This is a schematic diagram of a substrate placed in the detection area of ​​Example 1 of the present application when it is located at a standard position on the robot;

[0025] Figure 3 This is a schematic diagram of a substrate placed in the detection area of ​​Example 1 of the present application when it deviates from the standard position on the robot;

[0026] Figure 4 This is a comparison diagram of the substrate in Example 1 of the present application when it is located at a standard position on the robot and when it deviates from the standard position;

[0027] Figure 5 This is a schematic diagram of the analysis process of decomposing the deviation of the substrate on the robot according to Example 1 of the present application;

[0028] Figure 6 It is a partial schematic diagram of the substrate of Example 1 of the present application when it is first offset by dx; and

[0029] Figure 7 This is a schematic diagram of the structure of the semiconductor device of Example 2 of the present application. DETAILED DESCRIPTION

[0030] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0031] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0032] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0036] Embodiment 1:

[0037] Figure 1 This is a schematic diagram of a robot and a substrate in Example 1 of the present application when they are placed in a detection area of ​​a position detection device; Figure 2 This is a schematic diagram of a substrate placed in the detection area of ​​Example 1 of the present application when it is located at a standard position on the robot; Figure 3 This is a schematic diagram of a substrate placed in the detection area of ​​Example 1 of the present application when it deviates from the standard position on the robot. Figure 2 and Figure 3 The dashed box in the middle represents the detection area.

[0038] Combination Figures 1 to 3 , the position detection device 300 is used to detect the deviation of the substrate 20 from the standard position on the manipulator 110. The position detection device 300 includes a detection area, a plurality of detectors and a controller. The plurality of detectors are arranged in the detection area. When the manipulator 110 and the substrate 20 are placed in the detection area, the plurality of detectors are located on at least one side of the surface of the substrate 20 on the manipulator 110, and the plurality of detectors are configured to respectively transmit a detection signal having a width to the surface of the substrate 20, each detection signal covers the edge of the substrate 20 in the direction of the width, and the detector outputs the length of the detection signal blocked by the substrate 20 in the direction of the width. The controller is configured to be connected to the plurality of detector signals, and obtain the current length y of each detection signal blocked by the substrate 20 in the direction of the width through the plurality of detectors. 11 ,y 21 ,y 31 , and according to the current length y 11 ,y 21 ,y 31 The deviation of the substrate 20 from the standard position on the robot 110 is obtained by comparing the standard lengths y1, y2, and y3.

[0039] Among them, reference Figure 2 The standard lengths y1, y2, and y3 refer to the lengths of the detection signals output by multiple detectors that are blocked by the substrate 20 in the width direction when the substrate 20 located at the standard position on the robot 110 is detected. When the substrate 20 is located at the standard position, the center O' of the substrate 20 is aligned with the center M of the robot 110.

[0040] refer to Figure 3 , current length y 11 ,y 21 ,y 31It refers to the length of the detection signals output by multiple detectors blocked by the substrate 20 in the width direction when the substrate 20 located at the current position on the robot 110 is detected. Figure 3 In the figure, when the substrate 20 is located at the current position, the center of the substrate 20 is shifted from O' to O.

[0041] In this embodiment, the standard position of the substrate 20 on the robot 110 refers to the position of the substrate 20 when there is no deviation on the robot 110, and the center O' of the substrate 20 at this position is aligned with the center M of the robot 110. The deviation referred to in this application refers to the deviation of the substrate 20 in the horizontal direction on the robot 110. It should be noted that the calculation of the deviation amount of the substrate 20 from the standard position on the robot 110 will be described in detail later.

[0042] In some embodiments, the width of the detection signal emitted by each detector to the surface of the substrate 20 is parallel to a horizontal straight line passing through the center M of the robot 110. Figure 2 , the y-axis is a horizontal straight line passing through the center M, and the direction of the width of the detection signal is parallel to the y-axis direction.

[0043] In some embodiments, the width of the detection signal emitted by each detector to the surface of the substrate 20 is parallel to the symmetry axis W of the robot 110 . When the substrate 20 is in the standard position, the center O′ of the substrate 20 is located on the symmetry axis W of the robot 110 .

[0044] In some embodiments, reference Figure 1 , the multiple detectors include a first detector 310, a second detector 320 and a third detector 330 which are arranged in sequence and at intervals. The structures of the three detectors 310, 320 and 330 are the same. The structure of the detector is described below by taking the first detector 310 as an example. The first detector 310 includes a transmitter 3011 and a receiver 3021. The transmitter 3011 and the receiver 3021 are arranged opposite to each other, and the area between the transmitter 3011 and the receiver 3021 is the detection area. When the manipulator 110 and the substrate 20 are placed in the detection area, the transmitter 3011 and the receiver 3021 are located on both sides of the surface of the substrate 20. The transmitter 3011 transmits a detection signal with a width to the surface of the substrate 20. The receiver 3021 receives the detection signal transmitted by the transmitter 3011 and sends the detection signal to the controller. The length of the detection signal blocked by the substrate 20 in the width direction.

[0045] exist Figure 1 In FIG. 1 , the vertical solid lines between the transmitters 3011 , 3012 , 3013 and the receivers 3021 , 3022 , 3023 of the three detectors 310 , 320 , 330 respectively represent the detection signals. Figure 2 and Figure 3Each detector has a fixed detection length Y, which is greater than the standard lengths y1, y2, y3 and the current length y of each detector whose detection signal is blocked by the substrate 20 in the width direction. 11 ,y 21 ,y 31 It should be noted that the detection length Y of the detector is equivalent to the width of the detection signal emitted by the detector.

[0046] In some embodiments, the Figures 1 to 3 The first detector 310 and the third detector 330 are symmetrically arranged about the second detector 320, and the directions of the widths of the detection signals of the three detectors 310, 320, and 330 are parallel to the symmetry axis W of the robot 110, wherein the detection signal emitted by the second detector 320 to the surface of the substrate 20 overlaps with the projection of the symmetry axis W of the robot 110 on the substrate 20. The detector is a line scan sensor, such as a laser line scan sensor or an ultrasonic line scan sensor.

[0047] Furthermore, if Figure 1 The position detection device 300 further includes an upper mounting frame 303 and a lower mounting frame 304 which are arranged opposite to each other. The transmitters 3011, 3012, 3013 of the three detectors 310, 320, 330 are respectively arranged in a straight line and installed at intervals on the upper mounting frame 303, and the receivers 3021, 3022, 3023 of the three detectors 310, 320, 330 are respectively arranged in a straight line and installed at intervals on the lower mounting frame 304.

[0048] Under the above conditions, the controller calculates the current length y of the substrate 20 blocked by the surface in the width direction according to the three detection signals. 11 ,y 21 , y3 and the standard lengths y1, y2, y3, determine the offset direction of the substrate 20, and obtain the offset amount of the substrate 20 from the standard position on the robot 110 according to the offset direction of the substrate 20 and the following calculation formula:

[0049]

[0050] Among them, refer to Figures 2 to 4 , dx is the offset of the substrate 20 in the x-axis direction;

[0051] dy is the offset of the substrate 20 in the y-axis direction, the y-axis is parallel to the symmetry axis of the robot 110, and the y-axis is perpendicular to the x-axis;

[0052] y1, y2, and y3 are respectively the lengths of the detection signals output by the first detector 310, the second detector 320, and the third detector 330 blocked by the substrate 20 in the width direction when the substrate 20 is located at the standard position on the robot 110;

[0053] y 11 ,y 21 ,y 31 are respectively the lengths of the detection signals output by the first detector 310 , the second detector 320 , and the third detector 330 blocked by the substrate 20 in the width direction when the substrate 20 is located at the current position on the robot 110 ;

[0054] R is the radius of the substrate 20; it should be noted that when the substrate 20 is not warped and is a normal substrate, R is the radius of the substrate 20 itself, and when the substrate is a warped substrate, R is the radius of the contour line of the warped substrate, and the warped substrate is warped upward or downward;

[0055] L1 is the horizontal distance between the detection signal of the first detector and the axis of symmetry of the manipulator 110 , L2 is the horizontal distance between the detection signal of the second detector and the axis of symmetry of the manipulator 110 , and L3 is the horizontal distance between the detection signal of the third detector and the axis of symmetry of the manipulator 110 .

[0056] In the above calculation formula, y1, y2, y3, y 11 ,y 21 ,y 31 , R, and L are all known parameters, and only dx and dy are unknown parameters. The controller calculates dx and dy according to the above calculation formula. At the same time, the controller obtains accurate dx and dy according to the following judgment rules, that is, the offset of the substrate 20 from the standard position on the robot 110 is obtained:

[0057] When 31 >y 11 , and y 21 When y2 is less than y2, it is determined that the substrate 20 is shifted toward the third detector, or is shifted toward the third detector and away from the detection area. Figure 4 As an example, in Figure 4 The dashed box in the middle represents the detection area. Figure 4 The dotted circle in the figure is shifted toward the third detector and away from the detection area. Figure 4 The center is offset to the upper right relative to the standard position;

[0058] When 31 >y 11 , and y 21 ≥y2, it is determined that the substrate 20 is offset toward the third detector and is close to the detection area (refer to Figure 2 , that is, the substrate 20 is offset to the lower right relative to the standard position);

[0059] When 31 <y 11 , and y 21When y2 is less than y2, it is determined that the substrate 20 is shifted toward the first detector, or is shifted toward the first detector and away from the detection area (refer to Figure 2 , that is, the substrate 20 is offset toward the upper left relative to the standard position);

[0060] When 31 <y 11 , and y 21 ≥y2, it is determined that the substrate 20 is offset toward the first detector and is close to the detection area (refer to Figure 2 , that is, the substrate 20 is offset toward the lower left relative to the standard position);

[0061] When 31 =y 11 , and y 21 <y2, it is determined that the substrate 20 is away from the detection area (refer to Figure 2 , that is, the substrate 20 is offset upward relative to the standard position);

[0062] When 31 =y 11 , and y 21 >y2, it is determined that the substrate 20 is close to the detection area (refer to Figure 2 , that is, the substrate 20 is offset toward the bottom relative to the standard position).

[0063] Combine the following Figure 5 and Figure 6 , with the formula As an example, the derivation process of the calculation formula in this embodiment and the principle of obtaining the offsets dx and dy of the substrate 20 on the robot 110 are described:

[0064] Figure 5 The analysis process of decomposing the offset of the substrate on the robot is shown. Specifically, Figure 5 In the figure, it is assumed that the substrate 20 is first offset by dx along the x-axis direction and then offset by dy along the y-axis direction. The solid circle represents the substrate at the standard position on the robot 110, which is denoted as 20a. At this time, the center of the substrate 20a at the standard position is denoted as O' and is aligned with the center M of the robot 110. The dotted circle represents the substrate offset by dx relative to the substrate 20a at the standard position, which is denoted as 20b. At this time, the center of the substrate 20b offset by dx is denoted as O'. x The dotted circle represents the substrate that is offset by dx and then by dy relative to the substrate 20a at the standard position, that is, the substrate at the current position on the robot 110, which is denoted as 20c. At this time, the center of the substrate 20c that is offset by both dx and dy is denoted as O. The length of the detection signal output by the first detector 310 blocked by the substrate 20a in the width direction is y1, and the length of the detection signal output by the first detector 310 blocked by the substrate 20b in the width direction is y11x The length of the detection signal output by the first detector 310 blocked by the substrate 20c in the width direction is y 11 Assume that the edge point of the substrate 20a covered by the detection signal of the first detector 310 is recorded as A', and the edge point of the substrate 20b covered by the detection signal of the first detector 310 is recorded as A x , then the edge point A' and the edge point A x The distance d1 between them is y1-y 11x .

[0065] like Figure 6 As shown, given the horizontal distance L1 between the detection signal of the first detector 310 and the symmetry axis (ie, the y-axis) of the robot 110, it can be known that the vertical distance H between the center O' of the substrate 20a and the edge point A' of the substrate 20a is And know the center O of substrate 20b x The edge point A of the substrate 20b x The vertical distance H X for Therefore, it can be concluded that

[0066] Assuming that the substrate 20 is offset dy along the y-axis direction, we can refer to Figure 5 , then y1-y 11 =d1+dy, substitute The calculation formula can be derived:

[0067] Similarly, it can be deduced that and

[0068] The controller automatically calculates the offsets dx and dy according to any two of the above three calculation formulas, and obtains the offset of the substrate 20c from the standard position on the robot 110 according to the offset direction of the substrate 20c. The above derivation process is also applicable to the calculation formula for the offset of the warped substrate.

[0069] In some embodiments, the edge of the substrate 20 is provided with a notch (not shown) for positioning. In the present application, in order to prevent the notch of the substrate 20 from affecting the detection result of the above-mentioned offset, the notch of the substrate 20 can be made to avoid the detection area during the process of placing the substrate 20 in the detection area. In other embodiments, when the notch of the substrate 20 is in the detection area, at most one detector among the multiple detectors configured in the detection area will detect the notch of the substrate 20. In this case, the other at least two detectors can be used to detect the offset of the substrate 20 from the standard position on the robot 110.

[0070] In some embodiments, the multiple detectors include two detectors, and two calculation formulas are derived to determine the offset direction of the substrate according to the length of the detection signals output by the two detectors respectively blocked by the substrate 20 in the width direction, for example, the substrate 20 is offset to the right or to the left relative to the standard position. It should be noted that in this embodiment, when the substrate 20 is placed in the detection area, the gap of the substrate 20 should be avoided as much as possible from the detection area.

[0071] It should be noted that the basic idea of ​​the present invention is to calculate the offsets dx and dy according to the length of the detection signal output by the detector that is blocked by the substrate 20 in the width direction, and to obtain the final offset of the substrate 20 from the standard position on the robot 110 by determining the offset direction of the substrate 20. This basic idea is applicable to two detectors or three detectors and a greater number of detectors.

[0072] In addition, for the analysis process of decomposing the displacement of the substrate 20 on the robot 110, it can also be assumed that the substrate 20 is first displaced by dy along the y-axis direction and then displaced by dx along the x-axis direction, to obtain the same calculation formula as above.

[0073] also, Figure 1 This is only an example and is not intended to limit the arrangement of multiple detectors in this application. For example, in some embodiments, the transmitters and receivers of multiple detectors are arranged relative to each other, and the transmitters are arranged below the receivers to respectively transmit detection signals vertically upward and receive them through the corresponding receivers. For example, in other embodiments, when the manipulator 110 and the substrate 20 are placed in the detection area, the transmitters and receivers of the multiple detectors are located on the same side of the surface of the substrate 20. The multiple transmitters of this embodiment respectively transmit a detection signal with a width to the surface of the substrate 20. Each detection signal covers the edge of the substrate 20 in the direction of the width and is reflected on the substrate 20. The receiver receives the detection signal reflected back from the substrate 20, so that the length of the detection signal blocked by the substrate 20 in the direction of the width can be obtained.

[0074] Secondly, the first detector 310 and the third detector 330 can also be set asymmetrically with respect to the second detector 320, and the calculation formulas of the offsets dx and dy can be adaptively changed. As long as the horizontal distance between the detection signal of each detector and the axis of symmetry of the manipulator 110 is known, the horizontal distance can be substituted into the corresponding formula to calculate dx and dy.

[0075] The number of detectors arranged can be appropriately increased, preferably at least two.

[0076] The arrangement of multiple detectors is not limited to the linear distribution mentioned above, and multiple detectors can also be arranged along the edge of the substrate 20, etc., and the calculation formulas of the offsets dx and dy are adaptively changed according to the actual design needs. It should be pointed out that the present application mainly proposes a new way to accurately obtain the offset of the substrate 20 from the standard position on the manipulator 110, and the calculation formulas for calculating the offsets dx and dy can be adaptively changed according to the actual design needs, and the present application does not limit it.

[0077] Embodiment 2:

[0078] Figure 7 1 shows a schematic diagram of the structure of a semiconductor device. This embodiment 2 proposes a semiconductor device 10, including a main frame 101, a robot 110 and the position detection device 300 in embodiment 1. The robot 110 is arranged in the main frame 101 and is used to transfer the substrate 20. In this example, a process chamber 130 or a loading port 120 is also arranged in the main frame 101, and the robot 110 can transfer the substrate 20 between the loading port 120 and the process chamber 130.

[0079] In some embodiments, the position detection device 300 is disposed on the main frame 101 , for example, on the main frame corresponding to the loading port 120 , the process chamber 130 , or the robot 110 .

[0080] In some embodiments, the position detection device 300 may also be integrated on the manipulator 110. Figure 2 The robot 110 includes a robot arm 111, a wrist 112 and a robot finger 113. The robot finger 113 is used to carry the substrate 20. The robot arm 111 drives the robot finger 113 to operate together through the wrist 112. The position detection device 300 can be integrated on the robot arm 111, the wrist 112 or the robot finger 113, as long as the position detection device 300 can detect the substrate 20.

[0081] refer to Figure 7, taking the position detection device 300 being arranged on the main frame corresponding to the robot 110 as an example, after the robot 110 takes out the substrate 20 from the loading port 120 and transfers the substrate 20 to the next station, that is, before the process chamber 130, the robot 110 first places the substrate 20 in the detection area of ​​the position detection device 300. At this time, multiple detectors of the position detection device 300, such as the first detector 310, the second detector 320, and the third detector 330, respectively transmit a detection signal with a width to the surface of the substrate 20 and output the length of each detection signal blocked by the substrate 20 in the width direction. The controller obtains the current length of each detection signal blocked by the substrate 20 in the width direction through multiple detectors, and obtains the offset of the substrate 20 from the standard position on the robot 110 based on the current length and the standard length. Then, when the robot 110 places the substrate 20 at the next workstation, the controller adjusts the position of the center of the robot 110 relative to the center of the next workstation according to the offset to compensate for the offset of the substrate 20 from the standard position on the robot 110, so that the center of the substrate 20 falls at the center position of the next workstation.

[0082] In some embodiments, after obtaining the offset of the substrate 20 from the standard position on the robot 110, the position of the robot 110 can be adjusted to align the center of the robot 110 with the center of the substrate 20, and then the substrate 200 is transferred to the next station. For example, when the position detection device 300 is set on the robot 110, in the process of the robot 110 obtaining the substrate 20 from the loading port 120, the offset of the substrate 20 from the standard position on the robot 110 is detected by the position detection device 300, and then the position of the robot 110 is adjusted according to the offset, so that the center of the robot 110 is aligned with the center of the substrate 20.

[0083] Embodiment 3:

[0084] This embodiment 3 proposes a method for detecting the offset of a substrate on a robot. Using the position detection device 300 of embodiment 1, the method for detecting the offset of a substrate 20 on a robot 110 includes the following steps:

[0085] Placing the robot 110 and the substrate 20 thereon in a detection area;

[0086] Transmitting a plurality of detection signals having a width to the surface of the substrate 20, each detection signal covering the edge of the substrate 20 in the direction of the width, and obtaining the length of each detection signal blocked by the substrate 20 in the direction of the width;

[0087] Obtain the current length of each detection signal blocked by the substrate 20 in the width direction, and obtain the offset of the substrate 20 from the standard position on the robot according to the current length and the standard length;

[0088] The standard length refers to the length of the multiple detection signals blocked by the substrate 20 in the width direction when the substrate 20 located at the standard position on the robot 110 is detected. When the substrate 20 is located at the standard position, the center of the substrate 20 is aligned with the center of the robot 110. The current length refers to the length of the detection signals output by the multiple detection signals blocked by the substrate 20 in the width direction when the substrate 20 located at the current position on the robot 110 is detected.

[0089] This embodiment 3 can use the detection means in embodiment 1 to obtain the offset of the substrate 20 from the standard position on the robot 110. The calculation of the offset is based on embodiment 1.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A position detection device for detecting the displacement of a substrate from a standard position on a robot, characterized in that: include: Detection area; A plurality of detectors are arranged in the detection area. When the manipulator and the substrate are placed in the detection area, the plurality of detectors are located on at least one side of the surface of the substrate on the manipulator. The plurality of detectors are arranged to: respectively emit a detection signal having a width to the surface of the substrate, each of the detection signals covers the edge of the substrate in the direction of the width, and the detector outputs the length of the detection signal blocked by the substrate in the direction of the width; A controller, configured to be connected to a plurality of detector signals, obtain a current length of each detection signal blocked by the substrate in the direction of the width through the plurality of detectors, and obtain an offset of the substrate from a standard position on the robot according to the current length and a standard length; The standard length refers to the length of the detection signals output by the multiple detectors blocked by the substrate in the direction of the width when the substrate is located at the standard position of the manipulator. When the substrate is located at the standard position, the center of the substrate is aligned with the center of the manipulator. The current length refers to a length of detection signals output by the plurality of detectors blocked by the substrate in the direction of the width when detecting the substrate at the current position on the robot.

2. The position detection device according to claim 1, characterized in that: The direction of the width of the detection signal emitted by each detector to the substrate surface is parallel to a horizontal straight line passing through the center of the robot.

3. The position detection device according to claim 2, characterized in that: The direction of the width of the detection signal emitted by each detector to the substrate surface is parallel to the symmetry axis of the robot.

4. The position detection device according to claim 3, characterized in that: The multiple detectors include a first detector, a second detector and a third detector which are sequentially arranged at intervals, and when the manipulator and the substrate are placed in the detection area, the detection signal emitted by the second detector to the surface of the substrate overlaps with the projection of the symmetry axis of the manipulator on the substrate; The controller determines the offset direction of the substrate according to the current length and the standard length, and obtains the offset amount of the substrate from the standard position on the manipulator according to the offset direction of the substrate and the following calculation formula: Wherein, dx is the offset of the substrate in the x-axis direction; dy is the displacement of the substrate in the y-axis direction, the y-axis is parallel to the symmetry axis of the manipulator, and the y-axis is perpendicular to the x-axis; y1, y2, and y3 are respectively the lengths of the detection signals output by the first detector, the second detector, and the third detector blocked by the substrate in the direction of the width when the substrate is located at the standard position on the robot; y 11 ,y 21 ,y 31 are respectively the lengths of detection signals output by the first detector, the second detector and the third detector blocked by the substrate in the direction of the width when the substrate is located at the current position on the robot; R is the radius of the substrate; L1 is the horizontal distance between the detection signal of the first detector and the axis of symmetry of the manipulator, L2 is the horizontal distance between the detection signal of the second detector and the axis of symmetry of the manipulator, and L3 is the horizontal distance between the detection signal of the third detector and the axis of symmetry of the manipulator; When 31 >y 11 , and y 21 When y2 is less than y2, it is determined that the substrate is offset toward the third detector, or is offset toward the third detector and away from the detection area. When 31 >y 11 , and y 21 ≥y2, it is judged that the substrate is offset toward the third detector and is close to the detection area; When 31 <y 11 , and y 21 <y2, it is determined that the substrate is offset toward the first detector, or is offset toward the first detector and away from the detection area; When 31 <y 11 , and y 21 ≥y2, it is judged that the substrate is offset toward the first detector and is close to the detection area; When 31 =y 11 , and y 21 <y2, it is judged that the substrate is away from the detection area; When 31 =y 11 , and y 21 >y2, it is determined that the substrate is close to the detection area.

5. The position detection device according to claim 1, characterized in that: Each detector includes a transmitter and a receiver. When the robot and the substrate are placed in the detection area, the transmitter transmits a detection signal to the surface of the substrate, the receiver receives the detection signal transmitted by the transmitter, and sends the length of the detection signal blocked by the substrate surface in the direction of the width to the controller.

6. The position detection device according to claim 5, characterized in that: When the robot and the substrate are placed in the detection area, the transmitter and the receiver of each detector are respectively located on two sides of the substrate surface.

7. The position detection device according to claim 5, characterized in that: When the robot and substrate are placed in the inspection area, the transmitter and receiver of each detector are located on the same side of the substrate surface.

8. The position detection device according to claim 1, characterized in that: The multiple detectors are line scan sensors.

9. A semiconductor device, characterized in that: include: Main frame; A robot arm, arranged in the main frame, for transferring the substrate; as well as The position detection device according to any one of claims 1 to 8 is used to detect the displacement of the substrate from the standard position on the robot.

10. The semiconductor device according to claim 9, wherein: The position detection device is arranged on the main frame or the manipulator.

11. A method for detecting the displacement of a substrate on a robot, characterized in that: The following steps are involved: Placing the robot arm and the substrate thereon in a detection area; Transmitting a plurality of detection signals having a width to the surface of the substrate, each of the detection signals covering an edge of the substrate in a direction of the width, and obtaining a length of each detection signal blocked by the substrate in the direction of the width; Acquire a current length of each detection signal blocked by the substrate in the direction of the width, and obtain an offset of the substrate from a standard position on the robot according to the current length and a standard length; The standard length refers to the length of a plurality of detection signals blocked by the substrate in the direction of the width when the substrate is located at the standard position of the manipulator, and when the substrate is located at the standard position, the center of the substrate is aligned with the center of the manipulator; The current length refers to the length of a detection signal output by a plurality of detection signals blocked by the substrate in the direction of the width when detecting the substrate at the current position on the robot.

12. The method according to claim 11, characterized in that The direction of the width of each detection signal is parallel to a horizontal straight line passing through the center of the robot.

13. The method according to claim 12, characterized in that The width of each detection signal is in a direction parallel to the symmetry axis of the manipulator.

14. The method according to claim 13, characterized in that The multiple detection signals include a first detection signal, a second detection signal, and a third detection signal that are sequentially spaced and distributed, and when the robot and the substrate thereon are placed in a detection area, the second detection signal overlaps with a projection of a symmetry axis of the robot on the substrate; The offset direction of the substrate is determined according to the current length and the standard length, and the offset amount of the substrate from the standard position on the manipulator is obtained according to the offset direction of the substrate and the following calculation formula: Wherein, dx is the offset of the substrate in the x-axis direction; dy is the displacement of the substrate in the y-axis direction, the y-axis is parallel to the symmetry axis of the manipulator, and the y-axis is perpendicular to the x-axis; y1, y2, and y3 are respectively the lengths of the first detection signal, the second detection signal, and the third detection signal blocked by the substrate in the direction of the width when the substrate is located at a standard position on the robot; y 11 ,y 21 ,y 31 are respectively the lengths of the first detection signal, the second detection signal and the third detection signal blocked by the substrate in the direction of the width when the substrate is located at the current position on the robot; R is the radius of the substrate; L1 is the horizontal distance between the first detection signal and the axis of symmetry of the manipulator, L2 is the horizontal distance between the second detection signal and the axis of symmetry of the manipulator, and L3 is the horizontal distance between the third detection signal and the axis of symmetry of the manipulator; When 31 >y 11 , and y 21 <y2, it is determined that the substrate is shifted in the direction of the third detection signal, or is shifted in the direction of the third detection signal and away from the detection area; When 31 >y 11 , and y 21 ≥y2, it is judged that the substrate is shifted in the direction of the third detection signal and is close to the detection area; When 31 <y 11 , and y 21 <y2, it is determined that the substrate is shifted in the direction of the first detection signal, or is shifted in the direction of the first detection signal and away from the detection area; When 31 <y 11 , and y 21 ≥y2, it is judged that the substrate is offset in the direction of the first detection signal and is close to the detection area; When 31 =y 11 , and y 21 <y2, it is judged that the substrate is away from the detection area; When 31 =y 11 , and y 21 >y2, it is determined that the substrate is close to the detection area.

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