Detection data analysis method, device and equipment of wafer, medium and product

Abstract

The invention discloses a wafer detection data analysis method, device and equipment, a medium and a product, and is applied to the technical field of chip manufacturing. According to the method, a detection data picture comprising a plurality of crystal grains is displayed, so that a related user can conveniently divide a plurality of corresponding target areas in the detection data picture according to requirements; and performing data analysis on the detection data picture based on each target area. Therefore, according to the technical scheme, the detection data generated by actual production can be flexibly classified by freely dividing the areas, so that the requirement of accurate data analysis is met. By means of free selection of a user, region division can be closer to facts, detection data of different distribution modes can be visually checked and analyzed, grain distribution can be rapidly tracked and analyzed, convenience is brought to data analysis of uneven distribution or special distribution modes, and the grain distribution rule in a detection data picture is effectively judged.

Description

Technical Field

[0001] The present application belongs to the field of chip manufacturing technology, and in particular, relates to a method, device, equipment, medium and product for analyzing wafer inspection data. Background Art

[0002] In the process of semiconductor design, wafer manufacturing, packaging and testing, a large amount of test data will be generated. Visualizing, standardizing and analyzing the obtained test data can not only timely discover problems in the semiconductor process, but also quickly find ways to improve the yield by analyzing one or more types of data. When analyzing the test data of wafers, the data needs to be divided into multiple zones. By reasonably and effectively dividing the zones for data analysis, the sources of defects in the process and the main distribution of grains can be preliminarily determined.

[0003] At present, the traditional area division method is to divide the inspection data image according to a preset scheme, for example, dividing the circular inspection data image into a preset number of sectors of equal area. However, this fixed area division method works better when the grain positions are evenly distributed. In the actual production process, the distribution of grains in the inspection data generated by the wafer is diverse, making it difficult to effectively determine the grain distribution pattern within the inspection data image. Summary of the invention

[0004] The embodiments of the present application provide a method, device, equipment, medium and product for analyzing wafer inspection data, which can effectively determine the grain distribution pattern within the inspection data image under various circumstances.

[0005] On the one hand, the embodiment of the present application provides a method for analyzing wafer inspection data, and on the other hand, includes:

[0006] Displaying a detection data picture of a wafer; the detection data picture includes a plurality of crystal grains;

[0007] Receiving a region division instruction for the detection data picture;

[0008] In response to the region division instruction, dividing the detection data image into a corresponding plurality of target regions;

[0009] Determining the area information corresponding to each of the target areas;

[0010] Based on the information of each region, data analysis is performed on the detection data image.

[0011] On the other hand, the region division instruction includes a selection instruction for a plurality of discrete points in the detection data image;

[0012] In response to the region division instruction, dividing the detection data picture into a plurality of corresponding target regions includes:

[0013] In response to each of the discrete points selected by the selection instruction, determining a corresponding discrete point set;

[0014] The discrete points in the same discrete point set are connected to form the target area.

[0015] On the other hand, the region division instruction includes a region shape setting instruction, a region position setting instruction, and a region size setting instruction;

[0016] In response to the region division instruction, dividing the detection data picture into a plurality of corresponding target regions includes:

[0017] In response to the area shape setting instruction, selecting a target shape from a plurality of preset shapes;

[0018] In response to the area position setting instruction, setting the target shape at a target position;

[0019] In response to the region size setting instruction, the target shape is resized.

[0020] On the other hand, after displaying the inspection data picture of the wafer and before receiving the region division instruction for the inspection data picture, the method further includes:

[0021] A region setting interface for the detection data image is displayed; the region setting interface includes a preset shape selection interface and a region size input box.

[0022] On the other hand, before receiving the region division instruction for the detection data picture, the method further includes:

[0023] Display a selection interface for selecting whether to freely set the area;

[0024] In case of receiving an instruction to freely set an area, triggering the step of receiving an area division instruction for the detection data picture;

[0025] When an instruction is received that the area does not need to be freely set, the detection data image is divided into areas using a preset solution.

[0026] In another aspect, the grain includes defects; the region information includes any one or any combination of the following: the number of defects in different size intervals, the total number of defects;

[0027] After determining the area information corresponding to each of the target areas, the method further includes:

[0028] The area information is displayed based on a preset chart; in the preset chart, defects of different size intervals in the same target area are displayed separately.

[0029] On the other hand, an embodiment of the present application provides a wafer detection data analysis device, including:

[0030] A display module, used to display a detection data picture of a wafer; the detection data picture includes a plurality of crystal grains;

[0031] A receiving module, used for receiving a region division instruction for the detection data image;

[0032] A division module, configured to divide the detection data image into a plurality of corresponding target areas in response to the area division instruction;

[0033] A determination module, used to determine the area information corresponding to each of the target areas;

[0034] The analysis module is used to perform data analysis on the detection data image based on the area information.

[0035] In another aspect, an embodiment of the present application provides a wafer inspection data analysis device, comprising: a processor and a memory storing computer program instructions;

[0036] When the processor executes the computer program instructions, the wafer inspection data analysis method as described above is implemented.

[0037] On the other hand, an embodiment of the present application provides a computer-readable storage medium, on which computer program instructions are stored. When the computer program instructions are executed by a processor, the wafer inspection data analysis method as described above is implemented.

[0038] On the other hand, an embodiment of the present application provides a computer program product. When instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the wafer inspection data analysis method as described above.

[0039] A method for analyzing wafer inspection data provided by an embodiment of the present application will display an inspection data image including multiple grains, so that relevant users can determine a regional division scheme based on the distribution of the grains. Then, in response to the regional division instruction of the inspection data image, multiple corresponding target areas are divided in the inspection data image; and data analysis is performed on the inspection data image based on each target area. It can be seen that in the present technical solution, by freely dividing the area, it is possible to flexibly classify the inspection data generated by actual production, thereby meeting the needs of accurate data analysis. Through the free choice of the user, the regional division can be made closer to the actual situation, which is convenient for intuitively viewing and analyzing the inspection data of different distribution patterns, and quickly tracking and analyzing the distribution of grains, thereby facilitating the data analysis of uneven distribution or special distribution patterns, and effectively judging the distribution law of grains within the inspection data image. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 A schematic diagram of a process flow of a wafer inspection data analysis method provided by an embodiment of the present application is shown;

[0042] Figure 2 An interactive interface diagram provided by an embodiment of the present application is shown;

[0043] Figure 3 A stacked bar chart provided in an embodiment of the present application is shown;

[0044] Figure 4 A schematic diagram of the structure of a wafer inspection data analysis device provided in an embodiment of the present application is shown;

[0045] Figure 5 A schematic diagram of the hardware structure of a wafer inspection data analysis device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0046] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "include..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0048] When analyzing semiconductor inspection or inspection data images, traditional Zone division technology, whether it is divided by equal radius or equal area, can only set the number of rings and the number of equal blocks in each ring according to the specified parameters, and then set the Zone partition and subsequent data analysis. For images with uniform distribution of grain positions, the analysis effect is ideal. However, in actual applications, the distribution of grains in the inspection data images generated by mass-produced wafers is diverse. In the case of uneven distribution of grains, it is difficult for traditional solutions to effectively determine the grain distribution law.

[0049] In order to solve the problems of the traditional solution, the embodiments of the present application provide a method, device, equipment, medium and product for analyzing the detection data of a wafer. The detection data of the embodiments of the present application can be the detection data obtained by performing defect detection on the surface of the wafer, and can also include the data generated by chip testing. The detection data analysis method of the wafer provided in the embodiments of the present application is first introduced below. Figure 1 FIG. 1 is a flow chart of a method for analyzing wafer inspection data provided by an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:

[0050] S101: Displaying inspection data images of wafers.

[0051] The inspection data images are single images or stacked images of the wafer. Figure 2 An interactive interface diagram provided by an embodiment of the present application is shown; Figure 2 As shown, the obtained detection data image is displayed, and the detection data image includes multiple grains, and the distribution of the grains in the image is not uniform. The area in the upper box is a target area, and the division process of the area is described below.

[0052] S102: Receive a region division instruction for a detection data image.

[0053] After obtaining the distribution of the inspection data image, the user can determine the regional division scheme of the inspection data image according to the needs. At this time, the screen can still only display the inspection data image of the wafer. The user can use the mouse to draw the corresponding area on the inspection data image to complete the regional division. Figure 2 In addition, the screen may also display a region setting interface for the detection data image; the region setting interface may include a preset shape selection interface and a region size input box, and the desired target shape may be selected in the preset shape selection interface through input devices such as a mouse and a keyboard, and the size of the target shape may be adjusted in the region size input box, and the target shape may be dragged by the mouse to adjust its position.

[0054] S103: In response to the region division instruction, divide the detection data image into a plurality of corresponding target regions.

[0055] After the user inputs the area division instruction, the corresponding operation is performed based on the type of area division instruction. For example, after receiving the same set of discrete points selected by the user, these discrete points are connected in sequence to obtain a corresponding target area. Or after the user selects a target graphic and sets the size and position, a target area is also obtained. In practical applications, any of the above area division schemes can be adopted, or multiple schemes can be combined to achieve area division, and finally multiple target areas are obtained. For example, in practical applications, modes such as point selection or reverse selection of grains can also be adopted.

[0056] S104: Determine the area information corresponding to each target area.

[0057] After obtaining multiple target areas, it is necessary to determine the area information corresponding to each target area for subsequent data analysis. The specific content of these area information is not limited. Generally, if the grain includes defects, the area information may include the number of defects in different size intervals, the total number of defects, etc. For example, for a target area, the defects therein may be counted to obtain the total number of defects, and the defects in different size intervals may also be counted to obtain the specific number of each type of defect.

[0058] S105: Based on the information of each region, data analysis is performed on the detection data image.

[0059] After the user divides the area according to the needs, multiple target areas are generated, and then the data in the target area is analyzed to summarize the normal distribution pattern or numerical trend of defects, determine the possibility of recurrence and the impact on the manufacturing process, and analyze which step in the production process causes these defects. In addition, in this application, all bad grains and good grains use the same coordinate system or the same point as the position reference, so that the position information of the grains can be accurately determined in subsequent steps.

[0060] This solution can analyze chip test data or wafer acceptance test data. Chip test data refers to the data of wafer testing before the chip is packaged. Wafer acceptance test data refers to the electrical parameters of specific test structures measured by wafer acceptance test after wafer product tape-out and before quality inspection.

[0061] The method of free area division proposed in the embodiment of the present application makes up for the shortcomings of the fixed area division scheme. This method is closer to the actual situation, facilitates the intuitive viewing and analysis of detection data of different distribution patterns, and quickly tracks and analyzes grain distribution, thereby facilitating data analysis of uneven distribution or special distribution patterns, and provides assistance for adjusting and optimizing the process technology to ensure compliance with specifications and performance standards, thereby further promoting the stability and controllability of the entire production process.

[0062] For ease of understanding, a specific area division method is provided below, but this example does not limit other solutions of the present application:

[0063] Step 1: Display the detection data image (single image).

[0064] Step 2: Switch the mouse to the selection state and select some defects (such as Figure 2 The area selected by the upper middle box is the selected defect).

[0065] Step 3: Press Enter to display a pop-up window to set the target zone name (e.g. Zone1) and display the number of selected grains.

[0066] Step 4: Repeat steps 2 and 3 until all target areas are set.

[0067] A method for analyzing wafer inspection data provided by an embodiment of the present application will display an inspection data image including multiple grains, so that relevant users can determine a regional division scheme based on the distribution of the grains. Then, in response to the regional division instruction of the inspection data image, multiple corresponding target areas are divided in the inspection data image; and data analysis is performed on the inspection data image based on each target area. It can be seen that in the present technical solution, by freely dividing the area, it is possible to flexibly classify the inspection data generated by actual production, thereby meeting the needs of accurate data analysis. Through the free choice of the user, the regional division can be made closer to the actual situation, which is convenient for intuitively viewing and analyzing the inspection data of different distribution patterns, and quickly tracking and analyzing the distribution of grains, thereby facilitating the data analysis of uneven distribution or special distribution patterns, and effectively judging the distribution law of grains within the inspection data image.

[0068] This application does not limit the specific form of the region division instruction, and the corresponding solution can be selected according to actual needs. For example, the region division instruction includes a selection instruction for multiple discrete points in the detection data image. In response to the region division instruction, the corresponding multiple target areas are divided in the detection data image, including: in response to each discrete point selected by the selection instruction, determining the corresponding discrete point set; connecting each discrete point in the same discrete point set to form a target area.

[0069] For example, to divide a target area, the user can click on the detection data image with the mouse according to the needs, and after obtaining a complete set of discrete points, connect these discrete points to obtain the corresponding target area.

[0070] This embodiment forms a target area by setting multiple discrete points and connecting them, so as to quickly and efficiently depict a target area of ​​a desired shape and size. Especially for target areas that need to be divided into some special shapes, this method can greatly improve efficiency.

[0071] In addition, the region division instruction may also include a region shape setting instruction, a region position setting instruction, and a region size setting instruction, etc. In response to the region division instruction, a plurality of corresponding target regions are divided in the detection data image, including:

[0072] In response to the region shape setting instruction, selecting a target shape from a plurality of preset shapes;

[0073] In response to the region position setting instruction, setting the target shape at the target position;

[0074] In response to the region size setting instruction, the target shape is resized.

[0075] The preset shapes include some common shapes such as circle, rectangle and triangle. When setting the specific position of the target shape, you can enter the specific coordinates through the keyboard or drag the target shape with the mouse. Similarly, when adjusting the size of the target shape, you can enter the specific size value through the keyboard or drag the target shape with the mouse to adjust the size.

[0076] This embodiment selects a target shape from pre-prepared preset shapes through a region shape setting instruction, and then sets the size and position of the target shape through corresponding instructions. For some simple shapes, this method is more efficient to implement.

[0077] When the preset shape scheme of the real-time stream is adopted, after displaying the inspection data image of the wafer and before receiving the region division instruction for the inspection data image, the region setting interface for the inspection data image can be displayed; the region setting interface includes a preset shape selection interface and a region size input box. The user can select the desired target shape in the preset shape selection interface, and then enter the corresponding value in the region size input box.

[0078] When dividing an area by a preset shape, the embodiment of the present application displays a corresponding interface to facilitate the user to quickly find the desired target shape and set its size, thereby improving convenience.

[0079] In actual applications, there may be situations where it is not necessary to divide the areas by yourself. This embodiment provides a solution. Before receiving an instruction to divide the areas for the detection data image, a selection interface for selecting whether to set the areas freely is displayed; when an instruction to freely set the areas is received, the step of receiving the instruction to divide the areas for the detection data image is triggered; and when an instruction to not freely set the areas is received, a preset solution is used to divide the detection data image into areas.

[0080] The solution proposed in the embodiment of the present application can directly use a preset solution to divide the detection data image when the user does not need to freely divide the area, thereby improving efficiency.

[0081] The above embodiment mentioned that the grain may include defects; the regional information may include any one or any combination of the following: the number of defects in different size intervals, the total number of defects. After determining the regional information corresponding to each target area, the regional information is displayed based on a preset chart. In the preset chart, defects in different size intervals in the same target area can also be displayed separately to facilitate a more intuitive display of the data.

[0082] Figure 3 A stacked bar chart provided in an embodiment of the present application is shown; Figure 3As shown in the figure, the preset chart is specifically a stacked bar chart. A stacked bar chart is generated for the number of defects. Through the stacked bar chart, the distribution ratio of each type of defect in each target area can be intuitively seen. Each bar in each stacked bar chart corresponds to a target area. The top of the bar shows the number of all defects in the target area. The different colors in the bar represent the number of defects of different types (i.e., different size intervals) in the target area. As shown in the figure, the two areas Zone1 and Zone2, in the Bar corresponding to Zone1, the specific number of each type of defect is marked in the figure, corresponding to the size of the area occupied by each type of defect in the Bar. The detailed information of defects in each target area can also be displayed in a table. Here is a specific implementation method for explanation. The blue part in Zone1 represents a defect size greater than 0 and less than 52.1935um, with a number of 2272; the sky blue represents a defect size greater than 52.1935um and less than 104.387um, with a number of 300; the pink represents a defect size greater than 104.387um and less than 156.581um, with a number of 1215, and so on. As shown in Table 1.

[0083] Table 1 Zone 1 defect distribution table

[0084]

[0085]

[0086] After dividing into multiple target areas, the embodiment of the present application displays the area information inside each target area separately based on a preset chart, and displays defects of different size intervals in the same target area differently, so that the user can intuitively view the specific situation of each target area and facilitate the analysis of the detection data image.

[0087] In order to solve the above technical problems, the present application also provides a wafer detection data analysis device. Figure 4 FIG. 1 is a schematic diagram showing the structure of a wafer detection data analysis device provided in an embodiment of the present application. Figure 4 As shown, the device includes the following modules:

[0088] Display module 401, used to display the inspection data picture of the wafer; the inspection data picture includes multiple grains;

[0089] A receiving module 402 is used to receive a region division instruction for a detection data picture;

[0090] A division module 403 is used to divide the detection data image into corresponding multiple target areas in response to the area division instruction;

[0091] A determination module 404 is used to determine the area information corresponding to each target area;

[0092] The analysis module 405 is used to perform data analysis on the detection data image based on the information of each region.

[0093] In some embodiments, the region division instruction includes a selection instruction for a plurality of discrete points in the detection data image;

[0094] The division module 403 is specifically used for:

[0095] In response to each discrete point selected by the selection instruction, determining a corresponding discrete point set;

[0096] Connect the discrete points in the same discrete point set to form a target area.

[0097] In some embodiments, the region division instruction includes a region shape setting instruction, a region position setting instruction, and a region size setting instruction;

[0098] The division module 403 is specifically used to: select a target shape from a plurality of preset shapes in response to a region shape setting instruction;

[0099] In response to the region position setting instruction, setting the target shape at the target position;

[0100] In response to the region size setting instruction, the target shape is resized.

[0101] In some embodiments, the display module 401 is also used to: display an area setting interface for the inspection data image after displaying the inspection data image of the wafer and before receiving an area division instruction for the inspection data image; the area setting interface includes a preset shape selection interface and an area size input box.

[0102] In some embodiments, the display module 401 is further used to: before receiving the region division instruction for the detection data picture, display a selection interface for selecting whether to freely set the region;

[0103] In case of receiving an instruction to freely set an area, triggering a receiving module;

[0104] When an instruction is received that the area does not need to be freely set, the division module is triggered to divide the detection data image into areas using a preset solution.

[0105] In some embodiments, the grain includes defects; the region information includes any one or any combination of the following: the number of defects in different size intervals, the total number of defects;

[0106] The display module 401 is further used to: after determining the area information corresponding to each target area, display the area information based on a preset chart; in the preset chart, defects of different size intervals in the same target area are displayed separately.

[0107] The device provided in the embodiment of the present application is the same as the method in the above embodiment, so both have the same embodiments and beneficial effects, which will not be repeated here.

[0108] Figure 5 FIG. 1 is a schematic diagram showing the hardware structure of a wafer detection data analysis device provided in an embodiment of the present application. Figure 5 As shown, the wafer inspection data analysis device may include a processor 501 and a memory 502 storing computer program instructions.

[0109] Specifically, the processor 501 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0110] The memory 502 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 502 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive or a combination of two or more of these. In appropriate cases, the memory 502 may include a removable or non-removable (or fixed) medium. In appropriate cases, the memory 502 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 502 is a non-volatile solid-state memory.

[0111] The memory 502 may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk storage medium device, an optical storage medium device, a flash memory device, an electrical, optical or other physical / tangible memory storage device. Therefore, generally, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to one aspect of the present disclosure.

[0112] The processor 501 implements any one of the wafer inspection data analysis methods in the above embodiments by reading and executing computer program instructions stored in the memory 502 .

[0113] In one example, the wafer inspection data analysis device may further include a communication interface 503 and a bus 504. The processor 501, the memory 502, and the communication interface 503 are connected via the bus 504 and communicate with each other.

[0114] The communication interface 503 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0115] Bus 504 includes hardware, software or both, and the components of the detection data analysis equipment of the wafer are coupled to each other. For example, but not limitation, the bus may include Accelerate Graphical Port (AGP) or other graphics bus, Enhanced Industry Standard Architecture (EISA) bus, Front Side Bus (FSB), Hyper Transport (HT) interconnection, Industry Standard Architecture (ISA) bus, InfiniBand interconnection, Low Pin Count (LPC) bus, memory bus, Micro Channel Architecture (MCA) bus, Peripheral Component Interconnect (PCI) bus, PCI-Express (PCI-X) bus, Serial Advanced Technology Attachment (SATA) bus, Video Electronics Standards Association Local Bus (VLB) bus or other suitable bus or two or more of these combinations. In appropriate cases, bus 504 may include one or more buses. Although embodiments of the present application describe and illustrate a particular bus, the present application contemplates any suitable bus or interconnect.

[0116] In addition, in combination with the wafer inspection data analysis method in the above embodiment, the embodiment of the present application can provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when the computer program instructions are executed by the processor, any one of the wafer inspection data analysis methods in the above embodiment is implemented.

[0117] An embodiment of the present application also provides a computer program product, including a computer program, which, when processed and executed, implements any one of the wafer inspection data analysis methods in the above embodiments.

[0118] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0119] The functional blocks shown in the block diagram above can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an ASIC, appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (Erasable ROM, EROM), floppy disks, compact disc read-only memory (Compact Disc Read-Only Memory, CD-ROM), optical discs, hard disks, optical fiber media, radio frequency (Radio Frequency, RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0120] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0121] The above describes various aspects of the present disclosure with reference to the flowchart and / or block diagram of the detection data analysis method, device, equipment, medium and product of a wafer according to an embodiment of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit. It can also be understood that each box in the block diagram and / or flowchart and the combination of boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0122] The above contents are only specific implementation methods of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A method for analyzing wafer inspection data, characterized in that: include: Display the inspection data image of the wafer; The detection data image includes a plurality of grains; Receiving a region division instruction for the detection data picture; In response to the region division instruction, dividing the detection data image into a corresponding plurality of target regions; Determining the area information corresponding to each of the target areas; Based on the information of each region, data analysis is performed on the detection data image.

2. The wafer inspection data analysis method according to claim 1, characterized in that: The region division instruction includes a selection instruction for a plurality of discrete points in the detection data picture; In response to the region division instruction, dividing the detection data picture into a plurality of corresponding target regions includes: In response to each of the discrete points selected by the selection instruction, determining a corresponding discrete point set; The discrete points in the same discrete point set are connected to form the target area.

3. The wafer detection data analysis method according to claim 1, characterized in that: The region division instruction includes a region shape setting instruction, a region position setting instruction and a region size setting instruction; In response to the region division instruction, dividing the detection data picture into a plurality of corresponding target regions includes: In response to the area shape setting instruction, selecting a target shape from a plurality of preset shapes; In response to the area position setting instruction, setting the target shape at a target position; In response to the region size setting instruction, the target shape is resized.

4. The wafer detection data analysis method according to claim 3, characterized in that: After displaying the inspection data picture of the wafer and before receiving the region division instruction for the inspection data picture, the method further includes: A region setting interface for the detection data image is displayed; the region setting interface includes a preset shape selection interface and a region size input box.

5. The wafer inspection data analysis method according to any one of claims 1 to 4, characterized in that: Before receiving the region division instruction for the detection data picture, the method further includes: Display a selection interface for selecting whether to freely set the area; In case of receiving an instruction to freely set an area, triggering the step of receiving an area division instruction for the detection data picture; When an instruction is received that the area does not need to be freely set, the detection data image is divided into areas using a preset solution.

6. The wafer inspection data analysis method according to claim 1, characterized in that: The grain includes defects; the region information includes any one or any combination of the following: the number of defects in different size intervals, the total number of defects; After determining the area information corresponding to each of the target areas, the method further includes: Based on a preset chart, display the regional information; In the preset chart, defects of different size ranges in the same target area are displayed separately.

7. A wafer inspection data analysis device, characterized in that: include: A display module, used to display the inspection data images of the wafer; The detection data image includes a plurality of grains; A receiving module, used for receiving a region division instruction for the detection data image; A division module, configured to divide the detection data image into a plurality of corresponding target areas in response to the area division instruction; A determination module, used to determine the area information corresponding to each of the target areas; The analysis module is used to perform data analysis on the detection data image based on the area information.

8. A wafer inspection data analysis device, characterized in that: include: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the wafer inspection data analysis method as described in any one of claims 1 to 6 is implemented.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the wafer inspection data analysis method according to any one of claims 1 to 6 is implemented.

10. A computer program product, characterized in that When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the wafer inspection data analysis method as described in any one of claims 1 to 6.

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