Automatic packaging and forming equipment for semiconductor chip

Abstract

The invention relates to the technical field of semiconductor chip manufacturing, in particular to automatic packaging and forming equipment for a semiconductor chip, which can avoid the problems of incomplete curing of sealing glue and local overheating, thereby improving the packaging quality. Comprising a packaging table and a heating mold, a feeding guide rail is arranged on the packaging table, the feeding guide rail is used for assisting chip conveying, a heating opening is formed in the packaging table, the heating mold is arranged at the bottom of the heating opening, and the heating mold is used for heating the glued and packaged chips and accelerating drying of sealing glue; a feeding guide rail is fixedly installed on the packaging table, a plurality of sets of piece containing tools are arranged in the feeding guide rail, a lifting frame is arranged on a table plate of the packaging table, a lifting air cylinder is fixedly installed on the lifting frame, a mold base plate is arranged at the output end of the top end of the lifting air cylinder, a heating mold is fixedly installed on the mold base plate, and a heating wire is arranged in the heating mold.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip manufacturing, and in particular to an automatic packaging and molding device for semiconductor chips. Background Art

[0002] In the production and manufacturing process of semiconductor chips, the packaging process is related to the protection and stability of the chip, and directly affects the performance and service life of the chip. Traditional semiconductor chip packaging is mostly done manually or semi-automatically. This packaging method is inefficient and the packaging quality is difficult to guarantee, which makes it difficult to meet the modern semiconductor industry's demand for high efficiency and high quality.

[0003] With the advancement of science and technology and the development of automation technology, semiconductor chip packaging technology is constantly being updated, and automatic packaging molding equipment has emerged. This type of equipment, through a highly integrated mechanical structure and a precise control system, realizes the automation of the entire process from chip loading, positioning, gluing, packaging to finished product output, greatly improving packaging efficiency and packaging quality.

[0004] However, existing semiconductor chip automatic packaging equipment still has some shortcomings in the heating and curing of the sealant. Some equipment uses an external heating source to heat the packaged chip, which has low heating efficiency and is difficult to ensure heating uniformity, which can easily lead to incomplete curing of the sealant or local overheating, affecting the packaging quality. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a semiconductor chip automatic packaging molding device which can avoid the problems of incomplete curing of the sealing glue and local overheating, thereby improving the packaging quality.

[0006] The automatic semiconductor chip packaging and molding equipment of the present invention comprises a packaging platform and a heating mold, wherein the packaging platform is provided with a feeding guide rail, the feeding guide rail is used to assist in chip transportation, the packaging platform is provided with a heating port, the bottom of the heating port is provided with a heating mold, the heating mold is used to heat the chip packaged with glue to accelerate the drying of the sealing glue;

[0007] A feeding guide is fixedly installed on the packaging table, and a plurality of assembly toolings are arranged in the feeding guide. A hanging frame is provided on the packaging table plate, and a lifting cylinder is fixedly installed on the hanging frame. A mold seat plate is provided at the top output end of the lifting cylinder, and a heating mold is fixedly installed on the mold seat plate, and a heating wire is provided in the heating mold.

[0008] The automatic packaging and molding equipment for semiconductor chips of the present invention is characterized in that a pressure piece bracket is arranged on the packaging table, a pressure piece cylinder is fixedly mounted on the pressure piece bracket, a linkage plate is fixedly mounted on the output end of the bottom end of the pressure piece cylinder, a guide hole is arranged on the linkage plate, a guide bar is arranged on the pressure piece bracket, the guide hole is slidably mounted on the guide bar, and a pressure block is arranged on the linkage plate.

[0009] The automatic packaging and molding equipment for semiconductor chips of the present invention is characterized in that a glue dispensing mechanism is arranged on the packaging table, and the glue dispensing mechanism includes a lateral adjustment component and a longitudinal adjustment component, and the longitudinal adjustment component includes a glue bracket, a first threaded sleeve and a glue gun, and the glue bracket is fixedly mounted on the packaging table, and a first threaded sleeve is slidably arranged on the glue bracket, the lateral adjustment component is mounted on the first threaded sleeve, and the glue gun is mounted on the lateral adjustment component; a first motor is fixedly mounted on the glue bracket, a first screw is fixedly mounted on the output end of the first motor, a first threaded sleeve is threadedly mounted on the first screw, a first slider is fixedly mounted on the bottom end of the first threaded sleeve, and a first slide bar is fixedly mounted on the glue bracket, and the first slide bar slides in sliding coordination with the first slide bar.

[0010] The automatic packaging and molding equipment for semiconductor chips of the present invention, the lateral adjustment component includes an adjustment bracket, a second threaded sleeve and a glue gun plate, the adjustment bracket is fastened with the first threaded sleeve, the adjustment bracket is slidably provided with a second threaded sleeve, the second threaded sleeve is fastened with the glue gun plate, and a glue gun is provided on the glue gun plate; a second motor is fixedly installed on the adjustment bracket, a second screw is fixedly installed on the output end of the second motor, a second threaded sleeve is threadedly mounted on the second screw, a second slider is fixedly installed on the bottom end of the second threaded sleeve, a second slide bar is fixedly installed on the adjustment bracket, the second slide bar is slidably clamped on the second slide bar, and the glue gun plate is fastened with the second threaded sleeve.

[0011] The semiconductor chip automatic packaging and molding equipment of the present invention has a fine-tuning bracket fixedly installed on the glue gun plate, an adjusting bolt is rotatably inserted on the fine-tuning bracket, a glue gun clamping plate is fastened on the glue gun, the adjusting bolt is threadedly inserted on the glue gun clamping plate, and the glue gun is slidably inserted on the glue gun plate.

[0012] In the automatic semiconductor chip packaging and molding equipment of the present invention, two groups of guide pillars are fixedly installed on the glue gun plate, and the two groups of guide pillars are inserted into the glue gun clamping plate and slidably matched with the glue gun clamping plate.

[0013] The automatic packaging and molding equipment for semiconductor chips of the present invention is characterized in that the packaging table is provided with a first pushing cylinder, a second pushing cylinder, a third pushing cylinder and a fourth pushing cylinder, the output of the first pushing cylinder is pushed toward the second pushing cylinder, the output of the second pushing cylinder is pushed toward the third pushing cylinder, the output of the third pushing cylinder is pushed toward the fourth pushing cylinder, and the output of the fourth pushing cylinder is pushed toward the first pushing cylinder, and the output ends of the first pushing cylinder, the second pushing cylinder, the third pushing cylinder and the fourth pushing cylinder are all provided with push plates, and each group of the push plates is slidably arranged in a feeding guide rail, a plurality of assembly tooling are arranged in the feeding guide rail, and movable vacant positions are reserved in the feeding guide rail.

[0014] The semiconductor chip automatic packaging and molding equipment of the present invention has a protective rubber pad disposed at the bottom end of the pressing block.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The equipment directly heats the chip in the glue-coated package through the heating wire built into the heating mold. Compared with an external heating source, it reduces the loss in the heat transfer process and improves the heating efficiency. The design of the heating mold can fit the chip tightly to ensure even heat distribution, effectively avoiding the problem of incomplete curing of the sealant or local overheating, thereby improving the packaging quality. By precisely controlling the temperature and time of the heating mold, it can ensure that the sealant is cured under optimal conditions, thereby improving the strength and stability of the package. The close fit of the heating mold can also reduce bubbles and gaps in the packaging process, further improving the packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below in conjunction with the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the structure of the present invention;

[0019] Figure 2 It is an enlarged schematic diagram of the heating mold installation structure;

[0020] Figure 3 It is an enlarged schematic diagram of the pressing block installation structure;

[0021] Figure 4 It is an enlarged structural diagram of the dispensing mechanism;

[0022] Figure 5 This is a schematic diagram of the installation structure of the push cylinder;

[0023] Markings in the attached drawings: 1. packaging table; 2. feeding guide rail; 3. tooling for placing parts; 4. lifting frame; 5. lifting cylinder; 6. mold base plate; 7. heating mold; 8. pressing bracket; 9. pressing cylinder; 10. linkage plate; 11. guide hole; 12. guide bar; 13. pressing block; 14. glue bracket; 15. first motor; 16. first screw; 17. first threaded sleeve; 18. first slider; 19. first slider strip; 20, glue gun; 21, adjustment bracket; 22, second motor; 23, second screw; 24, second threaded sleeve; 25, second slider; 26, second slider; 27, glue gun plate; 28, fine-tuning bracket; 29, adjustment bolt; 30, glue gun clamp; 31, guide column; 32, first push cylinder; 33, second push cylinder; 34, third push cylinder; 35, fourth push cylinder; 36, push plate. DETAILED DESCRIPTION

[0024] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0025] like Figures 1 to 5 As shown, the automatic semiconductor chip packaging and molding equipment of the present invention comprises a packaging platform 1 and a heating mold 7. The packaging platform 1 is provided with a feeding guide rail 2, which is used to assist in chip transportation. The packaging platform 1 is provided with a heating port, and a heating mold 7 is provided at the bottom of the heating port. The heating mold 7 is used to heat the chip packaged with glue to accelerate the drying of the sealing glue.

[0026] A feeding guide rail 2 is fixedly installed on the packaging table 1, and a number of assembly tooling 3 are arranged in the feeding guide rail 2. A lifting frame 4 is arranged on the table of the packaging table 1, and a lifting cylinder 5 is fixedly installed on the lifting frame 4. A mold base plate 6 is arranged at the top output end of the lifting cylinder 5, and a heating mold 7 is fixedly installed on the mold base plate 6, and a heating wire is arranged in the heating mold 7; the equipment directly heats the chip packaged with glue through the heating wire built into the heating mold 7, compared with an external heating source, it reduces the loss during heat transfer and improves the heating efficiency; the design of the heating mold 7 can fit the chip tightly to ensure uniform heat distribution, effectively avoid the problem of incomplete curing of the sealing glue or local overheating, thereby improving the packaging quality; by precisely controlling the temperature and time of the heating mold 7, it can ensure that the sealing glue is cured under optimal conditions, thereby improving the strength and stability of the package; the close fit of the heating mold 7 can also reduce bubbles and gaps in the packaging process, further improving the packaging quality.

[0027] As a preferred embodiment of the above, a pressing piece bracket 8 is provided on the packaging table 1, a pressing piece cylinder 9 is fixedly installed on the pressing piece bracket 8, a linkage plate 10 is fixedly installed on the output end of the bottom end of the pressing piece cylinder 9, a guide hole 11 is provided on the linkage plate 10, a guide bar 12 is provided on the pressing piece bracket 8, the guide hole 11 is slidably mounted on the guide bar 12, and a pressing block 13 is provided on the linkage plate 10; the pressing piece cylinder 9 applies uniform pressure to the chip after the glue coating and packaging through the linkage plate 10 and the pressing block 13, which helps to ensure uniform distribution of the sealing glue, reduce the generation of bubbles and gaps, and thus improve the accuracy and stability of the packaging; the guide hole 11 is provided on the linkage plate 10, and the guide bar 12 is provided on the pressing piece bracket 8. The guide hole 11 is slidably mounted on the guide bar 12, and the linkage plate 10 is provided with a pressing block 13. The pressing piece cylinder 9 applies uniform pressure to the chip after the glue coating and packaging through the linkage plate 10 and the pressing block 13, which helps to ensure uniform distribution of the sealing glue, reduce the generation of bubbles and gaps, and thus improve the accuracy and stability of the packaging; The cooperation between the hole 11 and the guide bar 12 ensures the smooth movement of the linkage plate 10 driven by the pressure cylinder 9, avoiding the degradation of packaging quality due to shaking or deviation; the stroke and pressure of the pressure cylinder 9 can be accurately adjusted by the control system, so as to achieve fine control of the packaging process; it is helpful to adjust the optimal pressure and time parameters according to different types of chips and sealing materials to ensure the best packaging effect; the rapid response and efficient action of the pressure cylinder 9 help to shorten the packaging cycle and improve production efficiency; at the same time, automated control reduces manual intervention, reduces operating difficulty and labor intensity.

[0028] As a preferred embodiment of the above, a glue dispensing mechanism is provided on the packaging table 1, and the glue dispensing mechanism includes a lateral adjustment component and a longitudinal adjustment component. The longitudinal adjustment component includes a glue bracket 14, a first threaded sleeve 17 and a glue gun 20. The glue bracket 14 is fixedly installed on the packaging table 1, and a first threaded sleeve 17 is slidably provided on the glue bracket 14. The lateral adjustment component is installed on the first threaded sleeve 17, and the glue gun 20 is installed on the lateral adjustment component; a first motor 15 is fixedly installed on the glue bracket 14, a first screw 16 is fixedly installed on the output end of the first motor 15, a first threaded sleeve 17 is threadedly provided on the first screw 16, a first slider 18 is fixedly installed on the bottom end of the first threaded sleeve 17, and a first slide bar 19 is fixedly installed on the glue bracket 14, and the first slider 18 slides with the first slide bar 19; the first screw 16 is driven to rotate by the first motor 15, so that the first threaded sleeve 1 7 moves vertically along the glue-applying bracket 14 under the action of the thread, realizing the precise adjustment of the glue-applying gun 20 in the longitudinal direction, which helps to improve the precision and quality of the packaging; the lateral adjustment component can further realize the precise movement of the glue-applying gun 20 in the horizontal direction, so as to meet the gluing requirements of chips of different sizes and shapes; the design of the gluing mechanism enables the glue-applying gun 20 to move freely in three-dimensional space, which is not only suitable for gluing operations at different positions and angles, but also can be flexibly adjusted according to the specific layout and packaging requirements of the chip; through the design of the motor drive and the threaded sleeve, the automatic control of the gluing process is realized, which reduces manual intervention and errors and improves production efficiency; precise gluing control helps to reduce glue waste and reduce packaging costs; at the same time, the automated gluing process shortens the packaging cycle, improves production efficiency, and helps to meet the modern semiconductor industry's demand for high efficiency and high quality.

[0029] As a preferred embodiment of the above embodiment, the lateral adjustment component includes an adjustment bracket 21, a second threaded sleeve 24 and a glue gun plate 27. The adjustment bracket 21 is fastened to the first threaded sleeve 17, and a second threaded sleeve 24 is slidably arranged on the adjustment bracket 21. The second threaded sleeve 24 is fastened to the glue gun plate 27, and a glue gun 20 is arranged on the glue gun plate 27; a second motor 22 is fixedly installed on the adjustment bracket 21, a second screw 23 is fixedly installed on the output end of the second motor 22, a second threaded sleeve 24 is threadedly arranged on the second screw 23, a second slider 25 is fixedly installed at the bottom end of the second threaded sleeve 24, a second slide bar 26 is fixedly installed on the adjustment bracket 21, and the second slider 25 is slidably mounted on the second slide bar 26, and the glue gun The support plate 27 is tightly connected to the second threaded sleeve 24; the second motor 22 drives the second screw 23 to rotate, so that the second threaded sleeve 24 moves horizontally along the adjustment bracket 21 under the action of the thread; this design realizes the precise adjustment of the glue gun 20 in the lateral direction, ensuring the accuracy of the glue dispensing position; the sliding cooperation between the second slider 25 and the second slider 26 further enhances the smoothness and stability of the movement, and helps to reduce the glue dispensing error caused by shaking or offset; the design of the lateral adjustment component allows the glue gun 20 to move freely in the horizontal direction, so as to adapt to the glue dispensing needs of chips of different sizes and shapes; this flexibility not only improves the versatility of the equipment, but also helps to optimize the glue dispensing path and improve the glue dispensing efficiency and quality.

[0030] As a preferred embodiment of the above embodiment, a fine-tuning bracket 28 is fixedly installed on the glue gun plate 27, an adjusting bolt 29 is rotatably inserted on the fine-tuning bracket 28, a glue gun clamp 30 is fastened on the glue gun 20, the adjusting bolt 29 is threadedly inserted on the glue gun clamp 30, and the glue gun 20 is slidably inserted on the glue gun plate 27; by rotating the adjusting bolt 29, a small adjustment of the glue gun 20 on the glue gun plate 27 can be achieved; it helps to ensure the precise position of the glue gun during the dispensing process, thereby improving the accuracy and consistency of dispensing; since the glue gun 20 can slide on the glue gun plate 27 and be adjusted by the fine-tuning bracket 28 and the adjusting bolt 29, it can adapt to the dispensing requirements of chips of different sizes and shapes; so that the equipment can handle more types of chip packaging tasks; the precise fine-tuning capability helps to reduce errors in the dispensing process, thereby ensuring that the packaged chip has a high-quality sealing effect; it helps to protect the chip from damage by the external environment and improve its stability and service life.

[0031] As a preferred embodiment of the above embodiment, two groups of guide pillars 31 are fixedly installed on the glue gun plate 27, and the two groups of guide pillars 31 are inserted into the glue gun clamp plate 30 and slide with the glue gun clamp plate 30; the sliding cooperation between the guide pillars 31 and the glue gun clamp plate 30 provides a stable support structure for the glue gun 20; it can prevent the glue gun from shaking or offsetting due to uneven force during the gluing process, thereby ensuring the accuracy and consistency of gluing; through the guidance of the guide pillars 31, the glue gun 20 can maintain higher precision when moving; it helps to reduce gluing errors caused by position deviation, thereby improving packaging quality; the sliding cooperation between the guide pillars 31 and the glue gun clamp plate 30 is combined with the fine-tuning bracket 28 and the adjusting bolt 29, providing the glue gun with a full range of fine-tuning capabilities; allowing the operator to more easily adjust the position and angle of the glue gun to adapt to the packaging requirements of chips of different sizes and shapes.

[0032] As a preferred embodiment of the above embodiment, the packaging table 1 is provided with a first pushing cylinder 32, a second pushing cylinder 33, a third pushing cylinder 34 and a fourth pushing cylinder 35, the output of the first pushing cylinder 32 is pushed toward the second pushing cylinder 33, the output of the second pushing cylinder 33 is pushed toward the third pushing cylinder 34, the output of the third pushing cylinder 34 is pushed toward the fourth pushing cylinder 35, and the output of the fourth pushing cylinder 35 is pushed toward the first pushing cylinder 32, and the output ends of the first pushing cylinder 32, the second pushing cylinder 33, the third pushing cylinder 34 and the fourth pushing cylinder 35 are all provided with pushing plates 36, and each group of pushing plates 36 is slidably set in the feeding guide rail 2, a plurality of assembly tooling 3 are arranged in the feeding guide rail 2, and a movable vacant position is reserved in the feeding guide rail 2; through the coordinated work of the four pushing cylinders, It can realize continuous and automatic pushing of the placement tool 3 and the chips therein; greatly improve production efficiency and reduce the need for manual intervention; the arrangement and pushing direction of the pushing cylinders form a circular assembly line, so that the various steps of the chip packaging process can be carried out sequentially without causing production interruption; the active vacant position is an active position reserved for chip transportation, so that the chip can move in the feeding guide; each pushing cylinder is equipped with a pushing plate 36, which slides in the feeding guide 2 and can accurately push the placement tool 3 and the chips therein from one position to another; due to the use of a circular assembly line operation, each placement tool 3 and the chip therein will not stay in a certain position for a long time waiting during the packaging process; this reduces the waiting time in production and improves resource utilization.

[0033] As a preferred embodiment of the above embodiment, a protective rubber pad is provided at the bottom end of the pressing block 13; during the packaging process, the pressing block 13 is responsible for fixing the chip in the heating mold 7 to ensure that the sealing glue can be evenly coated and tightly fitted; the protective rubber pad serves as a buffer layer between the pressing block and the chip, which can effectively prevent the pressing block from directly contacting the chip surface, thereby avoiding chip damage caused by excessive pressure or uneven contact surface; the protective rubber pad can ensure that the pressing block is more uniform when applying pressure, reducing packaging defects caused by uneven pressure distribution, and since the protective rubber pad has certain wear resistance and corrosion resistance, it can reduce friction and wear between the pressing block and the chip, thereby extending the service life of the equipment; at the same time, the protective rubber pad is also easier to clean and replace, thereby reducing the maintenance cost of the equipment.

[0034] The automatic packaging and molding equipment for semiconductor chips of the present invention is in a standby state when it is working. A plurality of groups of empty toolings 3 are arranged on the feeding guide rail 2, waiting for the placement of chips. The chips to be packaged are placed one by one in the tooling 3 through a manual or automatic feeding mechanism to ensure that the position of each chip in the tooling is accurate. The glue gun 20 in the glue dispensing mechanism is adjusted to a suitable glue dispensing position through the synergistic effect of the longitudinal adjustment component and the lateral adjustment component. The glue gun 20 is fine-tuned through the fine-tuning bracket 28 and the adjusting bolt 29 to ensure its accurate position, and is fixed through the sliding cooperation of the glue gun clamp 30 and the guide column 31. The glue gun 20 is started to evenly apply a proper amount of glue on the chip to prepare for subsequent packaging. After the glue dispensing is completed, the glue gun 20 is fixed by the support The lifting cylinder 5 telescopic movement lowers the heating mold 7 to above the chip and contacts the chip; the pressing cylinder 9 starts to push the linkage plate 10 and the pressing block 13 down to above the chip, and applies appropriate pressure to the chip through the protective rubber pad to ensure that the chip fits tightly with the heating mold; the heating wire in the heating mold 7 starts to work, heats the chip and glue, and accelerates the curing process of the glue; the heating temperature and time can be adjusted according to specific needs; after the glue is completely cured, the heating mold 7 and the pressing block 13 gradually cool down and release the pressure, and then the lifting cylinder 5 lifts the heating mold 7; through the coordinated action of the first pushing cylinder 32, the second pushing cylinder 33, the third pushing cylinder 34 and the fourth pushing cylinder 35, the packaged chip is pushed out and transported to the collection area along the feeding guide 2.

[0035] The automatic semiconductor chip packaging and molding equipment of the present invention has common mechanical installation, connection or setting methods, and any method that can achieve its beneficial effects can be implemented.

[0036] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor chip automatic packaging molding equipment, characterized in that: It includes a packaging platform and a heating mold. The packaging platform is provided with a feeding guide rail, the feeding guide rail is used to assist chip transportation, the packaging platform is provided with a heating port, the bottom of the heating port is provided with a heating mold, the heating mold is used to heat the chip packaged with glue to accelerate the drying of the sealing glue; A feeding guide rail is fixedly installed on the packaging table, and a plurality of assembly toolings are arranged in the feeding guide rail. A hanging frame is provided on the tabletop of the packaging table, and a lifting cylinder is fixedly installed on the hanging frame. A mold seat plate is provided at the top output end of the lifting cylinder, and a heating mold is fixedly installed on the mold seat plate, and a heating wire is provided in the heating mold.

2. The automatic semiconductor chip packaging molding equipment according to claim 1, characterized in that: A pressure piece bracket is provided on the packaging table, a pressure piece cylinder is fixedly installed on the pressure piece bracket, a linkage plate is fixedly installed on the output end of the bottom end of the pressure piece cylinder, a guide hole is provided on the linkage plate, a guide bar is provided on the pressure piece bracket, the guide hole is slidably mounted on the guide bar, and a pressure block is provided on the linkage plate.

3. The automatic semiconductor chip packaging equipment according to claim 1, characterized in that: A glue dispensing mechanism is provided on the packaging table, and the glue dispensing mechanism includes a lateral adjustment component and a longitudinal adjustment component. The longitudinal adjustment component includes a glue bracket, a first threaded sleeve and a glue gun. The glue bracket is fixedly installed on the packaging table, and a first threaded sleeve is slidably provided on the glue bracket. The lateral adjustment component is installed on the first threaded sleeve, and the glue gun is installed on the lateral adjustment component; a first motor is fixedly installed on the glue bracket, a first screw is fixedly installed on the output end of the first motor, a first threaded sleeve is threadedly installed on the first screw, a first slider is fixedly installed on the bottom end of the first threaded sleeve, and a first slide bar is fixedly installed on the glue bracket, and the first slide bar slides in sliding coordination with the first slide bar.

4. The automatic semiconductor chip packaging molding equipment according to claim 3, characterized in that: The lateral adjustment assembly includes an adjusting bracket, a second threaded sleeve and a glue gun plate, the adjusting bracket is fastened with the first threaded sleeve, the adjusting bracket is slidably provided with a second threaded sleeve, the second threaded sleeve is fastened with the glue gun plate, and a glue gun is provided on the glue gun plate; a second motor is fixedly installed on the adjusting bracket, a second screw is fixedly installed on the output end of the second motor, a second threaded sleeve is threadedly mounted on the second screw, a second slider is fixedly installed on the bottom end of the second threaded sleeve, a second slide bar is fixedly installed on the adjusting bracket, the second slide bar is slidably mounted on the second slide bar, and the glue gun plate is fastened with the second threaded sleeve.

5. The automatic semiconductor chip packaging equipment as claimed in claim 4, characterized in that: A fine-tuning bracket is fixedly installed on the glue gun plate, an adjusting bolt is rotatably inserted on the fine-tuning bracket, a glue gun clamping plate is fastened on the glue gun, the adjusting bolt is threadedly inserted on the glue gun clamping plate, and the glue gun is slidably inserted on the glue gun plate.

6. The automatic semiconductor chip packaging equipment according to claim 4, characterized in that: Two groups of guide posts are fixedly mounted on the glue gun plate, and both groups of guide posts are inserted into the glue gun clamping plate and slidably matched with the glue gun clamping plate.

7. The automatic semiconductor chip packaging equipment according to claim 1, characterized in that: The packaging table is provided with a first pushing cylinder, a second pushing cylinder, a third pushing cylinder and a fourth pushing cylinder, the output of the first pushing cylinder pushes toward the second pushing cylinder, the output of the second pushing cylinder pushes toward the third pushing cylinder, the output of the third pushing cylinder pushes toward the fourth pushing cylinder, and the output of the fourth pushing cylinder pushes toward the first pushing cylinder, and the output ends of the first pushing cylinder, the second pushing cylinder, the third pushing cylinder and the fourth pushing cylinder are all provided with pushing plates, and each group of the pushing plates is slidably arranged in the feeding guide rail, a plurality of assemblies of tooling are arranged in the feeding guide rail, and movable vacant positions are reserved in the feeding guide rail.

8. The automatic semiconductor chip packaging equipment according to claim 2, characterized in that: A protective rubber pad is arranged at the bottom end of the pressing block.

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