An automated semiconductor wafer cleaning and drying equipment

Abstract

The present invention belongs to the technical field of wafer processing, and discloses an automated semiconductor wafer cleaning and drying device, including a base. The base adopts a shelling design, and a rotating mechanism is provided on the inner curved surface of the base. Symmetrically and fixedly installed in the middle of the front and rear sides of the upper surface of the base are second telescopic rods. On the inner sides of the telescopic ends of the two second telescopic rods, push plates are symmetrically and fixedly installed. Fixedly installed at the upper part of the inner side surface of the telescopic ends of the two second telescopic rods is a cross-shaped seat, and fixedly installed in the middle of the upper surface of the cross-shaped seat is a mounting plate. By starting the ultrasonic mechanism, the ultrasonic waves generated by the ultrasonic mechanism penetrate the cleaning liquid on the surface of the wafer, causing the wafer surface to vibrate up and down, thereby further detaching the attachments on the wafer surface and improving the cleaning effect of the wafer surface. At the same time, by pushing the sealing block towards the middle of the sliding shell with the push plate, the amount of cleaning liquid flowing into the inner cavity of the nozzle through the sliding shell is reduced, thus solving the problems of poor cleaning effect and serious waste of cleaning materials in the existing wafer cleaning device.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing, and specifically relates to an automated semiconductor wafer cleaning and drying device. Background Art

[0002] An automated semiconductor wafer cleaning and drying device is a highly integrated production device designed specifically for the semiconductor industry. It aims to clean and dry wafers through an automated process. Such a device needs to adopt advanced cleaning technologies and efficient drying mechanisms to ensure the cleanliness and dryness of the wafer surface, meeting the high standards required in the semiconductor manufacturing process.

[0003] However, currently, traditional wafer cleaning and drying methods often rely on manual operation or semi-automated equipment, which are inefficient, have unstable processes, and are difficult to precisely control the cleaning effect. Especially in the high-precision semiconductor manufacturing process. In addition, conventional single cleaning modules and single drying modules cannot effectively remove tiny particles, thin film contaminants, or water spots, easily causing residual impurities or moisture on the wafer surface, increasing the defect rate and affecting the yield. Moreover, the flow rates of cleaning liquids, nitrogen, etc. used in existing wafer cleaning and drying equipment remain constant during operation. However, when cleaning and drying from the center of the wafer to the outside, the area required for cleaning and drying continuously decreases. When controlling the flow rates of cleaning liquids, nitrogen, etc. based on the maximum cleaning area, it will result in waste of materials such as cleaning liquids and nitrogen, increasing production costs. Summary of the Invention

[0004] The purpose of the present invention is to provide an automated semiconductor wafer cleaning and drying device to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: an automated semiconductor wafer cleaning and drying device, including a base, the base is designed with a shell extraction, a rotating mechanism is provided on the inner curved surface of the base, symmetrically fixed on the middle parts of the front and rear sides of the upper surface of the base are second telescopic rods, symmetrically fixed on the inner sides of the telescopic ends of the two second telescopic rods are push plates, fixed on the upper parts of the inner side surfaces of the telescopic ends of the two second telescopic rods is a cross-shaped seat, fixed on the middle of the upper surface of the cross-shaped seat is a mounting plate, threadedly connected to the middle of the mounting plate is a threaded sleeve rod, slidably sleeved on the upper part of the outer curved surface of the threaded sleeve rod is a tooth sliding sleeve, fixed on the upper surface of the mounting plate is a driving member, fixed on the output end of the driving member is a driving gear, the tooth sliding sleeve meshes with the driving gear, a jetting mechanism is provided on the inner curved surface of the threaded sleeve rod, an unfolding mechanism is provided at the bottom of the threaded sleeve rod, symmetrically slidably sleeved on the front and rear sides of the cross-shaped seat are liquid spraying mechanisms, the liquid spraying mechanism includes a sliding shell, the sliding shell is slidably sleeved with the cross-shaped seat, fixed sleeved on the upper part of the sliding shell is an input sleeve, the input sleeve is fixedly sleeved with the output end of an external cleaning liquid input device, slidably sleeved on both sides of the sliding shell are sealing blocks, fixedly sleeved at the bottom of the sliding shell is a nozzle, symmetrically slidably sleeved on the left and right sides of the middle of the cross-shaped seat are ultrasonic mechanisms, the ultrasonic mechanism includes a sliding block, the sliding block is slidably sleeved with the cross-shaped seat, fixedly installed on the bottom surface of the sliding block is an ultrasonic head, an infrared mechanism is provided between each adjacent two nozzles and ultrasonic heads.

[0006] Preferably, the rotating mechanism includes a mounting seat, the mounting seat is fixedly sleeved on the middle of the inner curved surface of the base, fixedly sleeved on the upper part of the inner curved surface of the base is an isolation seat, fixedly installed on the middle of the upper surface of the mounting seat is a first driving member, the output shaft of the first driving member is movably sleeved in the middle of the isolation seat, fixedly installed at the top of the output shaft of the isolation seat is an eccentric disc, fixedly installed on the side of the upper surface of the eccentric disc far from its center is a first telescopic rod, fixedly installed at the top of the first telescopic rod is a suction cup, and the suction cup is made of flexible rubber.

[0007] Preferably, the jet mechanism includes a conical head fixedly sleeved at the bottom of the inner curved surface of the threaded sleeve rod. The conical head is in the shape of a cone, so as to guide the nitrogen flowing out of the bottom of the threaded sleeve rod. A first through-block is fixedly installed at the bottom end of the conical head. A valve body is fixedly sleeved at the bottom of the inner curved surface of the threaded sleeve rod. The valve body is located above the conical head. A bottom hole is formed in the outer side of the bottom surface of the valve body. A middle hole is formed in the middle of the upper surface of the valve body. A plurality of side holes are circumferentially and equidistantly formed in the inner curved surface of the middle hole. A piston is slidably sleeved in the inner curved surface of the middle hole. The contact surface between the middle hole and the piston is a smooth surface. A push rod is fixedly installed at the top end of the piston. A second through-block is fixedly installed at the top end of the push rod. A sleeve is fixedly sleeved on the outer curved surface of the second through-block. The outer curved surface of the sleeve is slidably sleeved with the inner curved surface of the threaded sleeve rod. The sleeve is fixedly connected to the output end of an external nitrogen input device.

[0008] Preferably, the unfolding mechanism includes a rotating sleeve movably sleeved at the bottom of the outer curved surface of the threaded sleeve rod. A plurality of first movable seats are fixedly installed on the outer curved surface of the rotating sleeve at equal intervals in the circumferential direction. A curved rod is movably sleeved in the middle of each of the plurality of first movable seats. The ends of the plurality of curved rods away from the first movable seats are all movably sleeved with second movable seats. The front and rear second movable seats are fixedly installed on the bottom surface of the same-side sliding shell. The left and right second movable seats are fixedly installed on the bottom surface of the same-side sliding block.

[0009] Preferably, the infrared mechanism includes two sleeve shells respectively fixedly installed on the adjacent sides of the sliding shell and the sliding block. A sleeve rod is slidably sleeved in the middle of the two sleeve shells. Elastic members are fixedly installed on the sides of the inner cavities of the sleeve rods away from the sliding blocks. The elastic members are fixedly connected to the same-side sliding blocks. A middle block is fixedly installed in the middle of the bottom surface of the elastic member. An infrared head is fixedly installed at the bottom end of the middle block.

[0010] Preferably, a plurality of guiding grooves are circumferentially and equidistantly formed on the outer curved surface of the threaded sleeve rod. The tooth sliding sleeve is slidably sleeved with the guiding grooves. The upper and lower parts of the driving gear protrude away from the center of the circle. The tooth sliding sleeve meshes with the middle part of the driving gear.

[0011] Preferably, the sealing block is in sliding contact with the same-side push plate. The side surface of the push plate close to the sliding shell is an inclined surface. Both the push plate and the sliding shell are made of magnets.

[0012] The beneficial effects of the present invention are as follows:

[0013] 1. The present invention drives the adsorbed wafer to rotate eccentrically through a rotating mechanism, so that the cleaning liquid sprayed onto the upper surface of the wafer by the liquid spraying mechanism flows from the center of the wafer to the outside of the wafer along the upper surface of the wafer under the action of centrifugal force. The eccentrically rotating wafer compensates for the position that cannot be sprayed in the middle of multiple liquid spraying mechanisms. When the cleaning liquid centrifugally flowing on the upper surface of the wafer is used as a static reference, the eccentrically rotating wafer and the cleaning liquid of the static reference on the upper surface of the wafer are rubbed at different horizontal angles, thereby making it easier to shake and detach the attachments on the surface of the wafer. At the same time, when the cleaning liquid is sprayed onto the surface of the wafer, the ultrasonic mechanism is started. The ultrasonic wave generated by the ultrasonic mechanism passes through the cleaning liquid on the surface of the wafer to cause the surface of the wafer to vibrate up and down, thereby further detaching the attachments on the surface of the wafer, thereby improving the cleaning effect of the surface of the wafer.

[0014] 2. Then the threaded sleeve drives the unfolding mechanism to move upward, and the unfolding mechanism pushes the spray mechanism and the ultrasonic mechanism fixedly connected thereto to move to the side away from the threaded sleeve. At this time, the push plate pushes the sealing block to move toward the middle of the sliding shell, and the amount of cleaning liquid flowing into the inner cavity of the nozzle through the sliding shell is reduced, so that the upper surface of the wafer is in close contact with the bottom of the nozzle, and at the same time, the attachments on the surface of the wafer are pushed from the middle of the wafer to the outside of the wafer, so as to improve the overall cleaning effect of the wafer surface. At the same time, as the annular area formed between the nozzle and the wafer decreases, the cleaning liquid sprayed onto the upper surface of the wafer by the nozzle is reduced, thereby improving the utilization efficiency of the cleaning liquid.

[0015] 3. In the present invention, when the threaded sleeve moves upward, the distance between the cone head and the wafer increases, so that the nitrogen ring sprayed by the jet mechanism gradually increases. While the nitrogen ring gradually increases, the mounting plate moving upward drives the valve body to move upward. At this time, the height of the side hole above the top surface of the piston increases, and the amount of nitrogen flowing out of the cone head through the inner cavity of the threaded sleeve through the middle hole, the push rod, the bottom hole and the first pass block gradually increases with the nitrogen ring, thereby achieving the change of the nozzle position, timely nitrogenizing the cleaning liquid on the wafer surface, and drying the wafer. At the same time, according to the size of the nitrogen ring, the nitrogen output is adjusted to reduce the useless consumption of nitrogen. In addition, when the threaded sleeve drives the spray mechanism and the ultrasonic mechanism to move to the side away from the threaded sleeve through the expansion mechanism, the nozzle and the sleeve drive the infrared head of the infrared mechanism to move to the side away from the threaded sleeve, and the infrared head further heats and dries the wafer surface through which the nitrogen passes, so as to quickly remove the residual moisture on the wafer surface and prevent the formation of water spots. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the structure of the rotating mechanism of the present invention;

[0018] Figure 3 It is a schematic diagram of the structure of the mechanism of the present invention;

[0019] Figure 4 This is a schematic structural diagram of the jet mechanism of the present invention;

[0020] Figure 5 This is a schematic structural diagram of the liquid spraying mechanism of the present invention;

[0021] Figure 6 This is a schematic structural diagram of the infrared mechanism of the present invention.

[0022] In the figure: 1, base; 2, rotating mechanism; 201, mounting seat; 202, isolation seat; 203, first driving member; 204, eccentric disc; 205, first telescopic rod; 206, suction cup; 3, second telescopic rod; 301, push plate; 4, cross seat; 5, mounting plate; 6, threaded sleeve rod; 601, tooth sliding sleeve; 602, driving member; 603, driving gear; 7, jet mechanism; 701, conical head; 702, first through block; 703, valve body; 704, bottom hole; 705, middle hole; 706, side hole; 707, piston; 708, push rod; 709, second through block; 710, sleeve; 8, unfolding mechanism; 801, rotating sleeve; 802, first movable seat; 803, curved rod; 804, second movable seat; 9, liquid spraying mechanism; 901, sliding shell; 902, input sleeve; 903, sealing block; 904, nozzle; 10, ultrasonic mechanism; 1001, sliding block; 1002, ultrasonic head; 11, infrared mechanism; 1101, sleeve housing; 1102, sleeve rod; 1103, elastic member; 1104, middle block; 1105, infrared head. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Such as Figures 1 to 6As shown in the figure, an embodiment of the present invention provides an automated semiconductor wafer cleaning and drying device, which includes a base 1. The base 1 adopts a shelled design, thereby reducing the material consumption during the production of the base 1 and reducing the production cost. A rotating mechanism 2 is provided on the inner curved surface of the base 1. In the middle of the front and rear sides of the upper surface of the base 1, second telescopic rods 3 are symmetrically and fixedly installed. On the inner sides of the telescopic ends of the two second telescopic rods 3, push plates 301 are symmetrically and fixedly installed. On the upper part of the inner side surface of the telescopic ends of the two second telescopic rods 3, a cross-shaped seat 4 is fixedly installed. In the middle of the upper surface of the cross-shaped seat 4, a mounting plate 5 is fixedly installed. A threaded sleeve rod 6 is threadedly connected to the middle of the mounting plate 5. An upper part of the outer curved surface of the threaded sleeve rod 6 is slidably sleeved with a tooth sliding sleeve 601. A plurality of guiding grooves are equidistantly formed in the circumferential direction of the outer curved surface of the threaded sleeve rod 6. The tooth sliding sleeve 601 is slidably sleeved with the guiding grooves. Thus, when the tooth sliding sleeve 601 rotates, while the tooth sliding sleeve 601 drives the threaded sleeve rod 6 to rotate, the threaded sleeve rod 6 can move upward along the inner curved surface of the tooth sliding sleeve 601. A driving member 602 is fixedly installed on the upper surface of the mounting plate 5. An output end of the driving member 602 is fixedly installed with a driving gear 603. The tooth sliding sleeve 601 meshes with the driving gear 603. The upper part and the lower part of the driving gear 603 protrude away from the center of the circle. The middle part of the tooth sliding sleeve 601 meshes with the driving gear 603. Thus, the driving gear 603 limits the movement of the tooth sliding sleeve 601 in the up and down directions, preventing the tooth sliding sleeve 601 from sliding downward along the threaded sleeve rod 6 and disengaging from the driving gear 603;

[0025] Among them, a jetting mechanism 7 is provided on the inner curved surface of the threaded sleeve rod 6. An unfolding mechanism 8 is provided at the bottom of the threaded sleeve rod 6. Symmetrical liquid spraying mechanisms 9 are slidably sleeved on the front and rear sides of the cross-shaped seat 4. The liquid spraying mechanism 9 includes a sliding shell 901. The sliding shell 901 is slidably sleeved with the cross-shaped seat 4. An input sleeve 902 is fixedly sleeved on the upper part of the sliding shell 901. The input sleeve 902 is fixedly sleeved with an output end of an external cleaning liquid input device. Sealing blocks 903 are slidably sleeved on both sides of the sliding shell 901. A nozzle 904 is fixedly sleeved at the bottom of the sliding shell 901. The sealing blocks 903 are in sliding contact with the same-side push plate 301. One side surface of the push plate 301 close to the sliding shell 901 is an inclined surface. Both the push plate 301 and the sliding shell 901 are made of magnets. The linear distance between two adjacent push plates 301 close to the threaded sleeve rod 6 is greater than the linear distance between two adjacent push plates 301 away from the threaded sleeve rod 6. Thus, when the sliding shell 901 moves away from the threaded sleeve rod 6, the push plate 301 pushes the sealing block 903 slidably sleeved with it to slide towards the sliding shell 901, reducing the flow rate of the cleaning liquid flowing through the sliding shell 901. Ultrasonic mechanisms 10 are slidably sleeved on the left and right sides of the middle part of the cross-shaped seat 4. The ultrasonic mechanism 10 includes a sliding block 1001. The sliding block 1001 is slidably sleeved with the cross-shaped seat 4. An ultrasonic head 1002 is fixedly installed on the bottom surface of the sliding block 1001. Infrared mechanisms 11 are provided between two adjacent nozzles 904 and the ultrasonic head 1002.

[0026] As Figure 1 and Figure 2 shown, the rotating mechanism 2 includes a mounting base 201. The mounting base 201 is fixedly sleeved in the middle of the inner curved surface of the base 1. The upper part of the inner curved surface of the base 1 is fixedly sleeved with an isolation base 202. The middle of the upper surface of the mounting base 201 is fixedly installed with a first driving member 203. The output shaft of the first driving member 203 is movably sleeved in the middle of the isolation base 202. The top of the output shaft of the isolation base 202 is fixedly installed with an eccentric disk 204. One side of the upper surface of the eccentric disk 204 far from its center is fixedly installed with a first telescopic rod 205. The top of the first telescopic rod 205 is fixedly installed with a suction cup 206. The suction cup 206 is made of rubber. Thus, when the wafer is placed on the upper surface of the suction cup 206, the wafer squeezes the suction cup 206 to deform, exhausting the air in the inner cavity of the suction cup 206, and the suction cup 206 adsorbs and fixes the wafer.

[0027] As Figure 1 、 Figure 3 and Figure 4 shown, the air jetting mechanism 7 includes a conical head 701. The conical head 701 is fixedly sleeved at the bottom of the inner curved surface of the threaded sleeve rod 6. The shape of the conical head 701 is a cone, so as to guide the nitrogen flowing out of the bottom of the threaded sleeve rod 6. When the threaded sleeve rod 6 moves upward, the nitrogen sprayed on the surface of the wafer moves annularly to the outside of the wafer, so as to realize that the nitrogen ring pushes the cleaning liquid on the surface of the wafer from the middle of the surface of the wafer to the outer edge and dries it, reducing the moisture to be dried on the surface of the wafer, improving the drying efficiency, and avoiding the generation of stains at the same time. The bottom end of the conical head 701 is fixedly installed with a first through block 702. The bottom of the inner curved surface of the threaded sleeve rod 6 is fixedly sleeved with a valve body 703. The valve body 703 is located above the conical head 701. The outer side of the bottom surface of the valve body 703 is provided with a bottom hole 704. The middle of the upper surface of the valve body 703 is provided with a middle hole 705. A plurality of side holes 706 are equidistantly arranged on the inner curved surface of the middle hole 705 in a circumferential manner. A piston 707 is slidably sleeved on the inner curved surface of the middle hole 705. The contact surface between the middle hole 705 and the piston 707 is a smooth surface, so as to improve the sealing performance between the middle hole 705 and the piston 707 and avoid gas leakage. The top of the piston 707 is fixedly installed with a push rod 708. The top of the push rod 708 is fixedly installed with a second through block 709. The outer curved surface of the second through block 709 is fixedly sleeved with a sleeve 710. The outer curved surface of the sleeve 710 is slidably sleeved with the inner curved surface of the threaded sleeve rod 6. The sleeve 710 is fixedly connected with the output end of an external nitrogen input device.

[0028] As Figure 3As shown, the unfolding mechanism 8 includes a rotating sleeve 801. The rotating sleeve 801 is movably sleeved on the bottom of the outer surface of the threaded sleeve rod 6. The contact surface between the rotating sleeve 801 and the threaded sleeve rod 6 is a smooth surface, thereby reducing the frictional resistance between the rotating sleeve 801 and the threaded sleeve rod 6, reducing the horizontal torque generated by the frictional force between the rotating sleeve 801 and the threaded sleeve rod 6, and avoiding the bending of the curved rod 803. A plurality of first movable seats 802 are fixedly installed at equal intervals on the outer surface circumference of the rotating sleeve 801. The middle parts of the plurality of first movable seats 802 are movably sleeved with curved rods 803. One ends of the plurality of curved rods 803 away from the first movable seats 802 are movably sleeved with second movable seats 804. The front and rear two second movable seats 804 are fixedly installed on the bottom surface of the same-side sliding shell 901, and the left and right two second movable seats 804 are fixedly installed on the bottom surface of the same-side sliding block 1001.

[0029] As Figure 1 shown, the infrared mechanism 11 includes two sleeve shells 1101. The two sleeve shells 1101 are respectively fixedly installed on the adjacent sides of the sliding shell 901 and the sliding block 1001. A sleeve rod 1102 is slidably sleeved in the middle of the two sleeve shells 1101. Elastic members 1103 are fixedly installed on the sides of the inner cavities of the sleeve rods 1102 away from the sliding block 1001. The elastic members 1103 are fixedly connected to the same-side sliding block 1001. A middle block 1104 is fixedly installed in the middle of the bottom surface of the elastic member 1103. An infrared head 1105 is fixedly installed at the bottom end of the middle block 1104. The infrared head 1105 is located inside the plurality of spray heads 904, thereby avoiding the direct contact between the infrared light emitted by the infrared head 1105 and the cleaning liquid sprayed by the spray heads 904, resulting in a reduction in the utilization efficiency of the heat generated by the infrared light.

[0030] Working principle:

[0031] When the present invention is in use, the first driving member 203 is started. The output end of the first driving member 203 drives the eccentric disk 204 to rotate. The eccentric disk 204 drives the first telescopic rod 205 to rotate eccentrically. The first telescopic rod 205 drives the suction cup 206 to rotate eccentrically. The suction cup 206 drives the adsorbed wafer to rotate eccentrically. Then, an external cleaning liquid input device is started. At this time, the cleaning liquid is sprayed onto the upper surface of the wafer through the input sleeve 902, the sliding shell 901 and the sealing block 903 in sequence. Under the action of centrifugal force, the cleaning liquid flows along the surface of the wafer from the center of the wafer to the outside of the wafer. The eccentrically rotating wafer compensates for the positions that cannot be sprayed in the middle of the plurality of sealing blocks 903. At this time, when the cleaning liquid flowing centrifugally on the upper surface of the wafer is used as a static reference, the eccentrically rotating wafer can have horizontal frictions at different angles with the cleaning liquid as the static reference on the upper surface of the wafer, so that the attachments on the wafer are more likely to shake off. At the same time, when the cleaning liquid is sprayed onto the surface of the wafer, the ultrasonic head 1002 is started. The ultrasonic waves generated by the ultrasonic head 1002 pass through the cleaning liquid on the surface of the wafer to cause the upper and lower vibrations of the wafer surface, thereby further detaching the attachments on the wafer surface and improving the cleaning effect of the wafer surface;

[0032] In addition, when the present invention is in use, the driving member 602 is started, and the output shaft of the driving member 602 drives the driving gear 603 to rotate. The driving gear 603 drives the tooth sliding sleeve 601 to rotate, and the tooth sliding sleeve 601 drives the threaded sleeve rod 6 to rotate. The threaded sleeve rod 6 moves upward along the cross seat 4 threadedly connected thereto. The threaded sleeve rod 6 drives the rotating sleeve 801 to move downward. The rotating sleeve 801 pushes the liquid spraying mechanism 9 and the ultrasonic mechanism 10 fixedly connected thereto to move away from the threaded sleeve rod 6 through the first movable seat 802, the curved rod 803 and the second movable seat 804. At this time, the push plate 301 pushes the sealing block 903 towards the middle of the sliding shell 901. At this time, the amount of cleaning liquid flowing into the inner cavity of the nozzle 904 through the sliding shell 901 decreases, so that the upper surface of the wafer is in close contact with the bottom end of the nozzle 904. At the same time, the attachments on the wafer surface are pushed from the middle of the wafer to the outside of the wafer, so as to improve the overall cleaning effect of the wafer surface. At the same time, as the annular area formed between the nozzle 904 and the wafer decreases, the amount of cleaning liquid sprayed onto the upper surface of the wafer by the nozzle 904 is reduced, and the utilization efficiency of the cleaning liquid is improved;

[0033] In addition, when the present invention is in use, when the threaded sleeve rod 6 moves upward, the distance between the conical head 701 and the wafer increases, so that the nitrogen gas ring ejected from the conical head 701 through the sleeve 710, the bottom hole 704 and the first through block 702 gradually increases. While the nitrogen gas ring gradually increases, the mounting plate 5 moving upward drives the valve body 703 to move upward. At this time, the height of the side hole 706 above the top surface of the piston 707 increases. The amount of nitrogen gas flowing out of the threaded sleeve rod 6 through the middle hole 705, the push rod 708, the bottom hole 704 and the first through block 702 and ejected from the conical head 701 increases as the nitrogen gas ring gradually increases. Thus, it is possible to realize nitrogen gas blowing on the cleaning liquid on the wafer surface in a timely manner following the change of the position of the nozzle 904 to dry the wafer, and at the same time, adjust the nitrogen gas output according to the size of the nitrogen gas ring to reduce the useless consumption of nitrogen gas;

[0034] In addition, when the present invention is in use, when the threaded sleeve rod 6 drives the liquid spraying mechanism 9 and the ultrasonic mechanism 10 to move away from the threaded sleeve rod 6 through the unfolding mechanism 8, the nozzle 904 and the sleeve rod 1102 drive the sleeve shell 1101 fixedly connected thereto to move away from the threaded sleeve rod 6. The sleeve shell 1101 drives the sleeve rod 1102 to move away from the threaded sleeve rod 6. At this time, the sleeve rod 1102 pulls the elastic members 1103 fixedly connected to both ends thereof to synchronously elongate. The elastic members 1103 keep the sleeve rod 1102 always in the middle position connecting the sleeve shell 1101. The sleeve rod 1102 drives the infrared head 1105 to move away from the threaded sleeve rod 6 through the middle block 1104, and the infrared head 1105 further heats and dries the wafer surface where the nitrogen gas passes.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automated semiconductor wafer cleaning and drying device, comprising a base (1), characterized in that: The base (1) adopts a shell-drawing design, and the inner curved surface of the base (1) is provided with a rotating mechanism (2). Second telescopic rods (3) are symmetrically fixedly installed in the middle of the front and rear sides of the upper surface of the base (1), and push plates (301) are symmetrically fixedly installed on the inner sides of the telescopic ends of the two second telescopic rods (3). A cross seat (4) is fixedly installed on the upper part of the inner side surface of the telescopic ends of the two second telescopic rods (3), and a mounting plate (5) is fixedly installed in the middle of the upper surface of the cross seat (4). The middle part of the mounting plate (5) is threadedly connected with a threaded sleeve rod (6), the upper part of the outer curved surface of the threaded sleeve rod (6) is slidably sleeved with a toothed sleeve (601), the upper surface of the mounting plate (5) is fixedly mounted with a driving member (602), the output end of the driving member (602) is fixedly mounted with a driving gear (603), the toothed sleeve (601) and the driving gear (603) are meshed with each other, the inner curved surface of the threaded sleeve rod (6) is provided with an air injection mechanism (7), and the bottom of the threaded sleeve rod (6) is provided with a toothed sleeve (601). A deployment mechanism (8) is provided, and symmetrical liquid spraying mechanisms (9) are slidably sleeved on the front and rear sides of the cross seat (4), and the liquid spraying mechanism (9) comprises a sliding shell (901), and the sliding shell (901) is slidably sleeved with the cross seat (4), and an input sleeve (902) is fixedly sleeved on the upper part of the sliding shell (901), and the input sleeve (902) is fixedly sleeved with the output end of the external cleaning liquid input device, and sealing blocks (903) are slidably sleeved on both sides of the sliding shell (901). The bottom of the sliding shell (901) is fixedly sleeved with a nozzle (904), and the left and right sides of the middle of the cross seat (4) are slidably sleeved with an ultrasonic mechanism (10). The ultrasonic mechanism (10) comprises a sliding block (1001), and the sliding block (1001) is slidably sleeved with the cross seat (4). The bottom surface of the sliding block (1001) is fixedly installed with an ultrasonic head (1002), and an infrared mechanism (11) is provided between two adjacent nozzles (904) and the ultrasonic head (1002).

2. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The rotating mechanism (2) comprises a mounting seat (201), wherein the mounting seat (201) is fixedly sleeved on the middle part of the inner curved surface of the base (1), an isolation seat (202) is fixedly sleeved on the upper part of the inner curved surface of the base (1), a first driving member (203) is fixedly mounted on the middle part of the upper surface of the mounting seat (201), an output shaft of the first driving member (203) is movably sleeved on the middle part of the isolation seat (202), an eccentric disk (204) is fixedly mounted on the top end of the output shaft of the isolation seat (202), a first telescopic rod (205) is fixedly mounted on the side of the upper surface of the eccentric disk (204) away from the center thereof, a suction cup (206) is fixedly mounted on the top end of the first telescopic rod (205), and the suction cup (206) is made of flexible rubber.

3. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The jet mechanism (7) comprises a cone head (701), the cone head (701) being fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve (6), the cone head (701) being in the shape of a cone, so as to guide the nitrogen flowing out of the bottom of the threaded sleeve (6), a first through block (702) being fixedly mounted on the bottom end of the cone head (701), a valve body (703) being fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve (6), the valve body (703) being located above the cone head (701), a bottom hole (704) being provided on the outer side of the bottom surface of the valve body (703), a middle hole (705) being provided in the middle of the upper surface of the valve body (703), and the The inner curved surface of the central hole (705) is provided with a plurality of side holes (706) at equal intervals on its circumference. The inner curved surface of the central hole (705) is slidably sleeved with a piston (707). The contact surface between the central hole (705) and the piston (707) is a smooth surface. A push rod (708) is fixedly mounted on the top of the piston (707). A second through block (709) is fixedly mounted on the top of the push rod (708). A sleeve (710) is fixedly sleeved on the outer curved surface of the second through block (709). The outer curved surface of the sleeve (710) is slidably sleeved with the inner curved surface of the threaded sleeve rod (6). The sleeve (710) is fixedly connected to the output end of an external nitrogen input device.

4. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The unfolding mechanism (8) comprises a rotating sleeve (801), wherein the rotating sleeve (801) is movably sleeved on the bottom of the outer curved surface of the threaded sleeve rod (6), and a plurality of first movable seats (802) are fixedly installed at equal intervals on the circumference of the outer curved surface of the rotating sleeve (801), and a bent rod (803) is movably sleeved in the middle of the plurality of first movable seats (802), and a second movable seat (804) is movably sleeved at one end of the plurality of bent rods (803) away from the first movable seat (802), and the front and rear second movable seats (804) are fixedly installed on the bottom surface of the sliding shell (901) on the same side, and the left and right second movable seats (804) are fixedly installed on the bottom surface of the sliding block (1001) on the same side.

5. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The infrared mechanism (11) comprises two sleeve shells (1101), the two sleeve shells (1101) are respectively fixedly mounted on one side of the sliding shell (901) adjacent to the sliding block (1001), a sleeve rod (1102) is slidably sleeved in the middle of the two sleeve shells (1101), an elastic member (1103) is fixedly mounted on the side of the inner cavity of the sleeve rod (1102) away from the sliding block (1001), the elastic member (1103) is fixedly connected to the sliding block (1001) on the same side, a middle block (1104) is fixedly mounted in the middle of the bottom surface of the elastic member (1103), and an infrared head (1105) is fixedly mounted at the bottom end of the middle block (1104).

6. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The outer curved surface of the threaded sleeve (6) is provided with a plurality of guide grooves at equal intervals, the toothed sleeve (601) is slidably sleeved with the guide grooves, the upper and lower parts of the driving gear (603) protrude toward a side away from the center of the circle, and the toothed sleeve (601) is meshed with the middle part of the driving gear (603).

7. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The sealing block (903) is in sliding contact with the push plate (301) on the same side. The side surface of the push plate (301) close to the sliding shell (901) is an inclined surface. The push plate (301) and the sliding shell (901) are both made of magnets.

Images