Wafer film pasting equipment and wafer film pasting method

Abstract

The invention provides wafer film pasting equipment and a wafer film pasting method.The wafer film pasting equipment comprises a wafer bearing table, a feeding mechanism and a film pasting device, the wafer bearing table is used for horizontally bearing a wafer, the feeding mechanism is used for conveying a pasting film to the position above the surface, to be subjected to film pasting, of the wafer, and the film pasting device comprises a lifting mechanism and an organic capsule located above the pasting film; the organic capsule is driven by the lifting mechanism to descend to drive the laminating film to be in contact with the to-be-laminated surface of the wafer, and in the descending process, the organic capsule deforms and gradually increases the pressing acting surface capable of acting on the laminating film under the gravity action of the fluid substance in the organic capsule until the laminating film is completely laminated on the whole to-be-laminated surface of the wafer; and the laminating of the laminating film is completed. And compared with a roller rolling mode, the situation that the wafer is damaged due to overlarge pressure is avoided, and the situation that the laminating film cannot be completely laminated to the wafer due to insufficient pressure or forward stress and tangential stress in the advancing direction of the roller in the film laminating process is also avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of integrated circuits, and in particular to a wafer lamination device and a wafer lamination method. Background Art

[0002] Wafer thinning and dicing are essential steps in the semiconductor manufacturing process. Thinning is typically performed on the side of the wafer without the circuitry, or on the side with the circuitry. Before thinning or dicing, a film is applied to the other side of the wafer to protect the circuitry.

[0003] In related film lamination technologies, taking the common roller rolling method as an example, when a roller is used to roll the lamination film onto the wafer, due to the concave and convex structure on the wafer surface, the roller may apply too much or too little pressure during rolling. This makes it difficult for the lamination film to completely adhere to the surface of the wafer, which makes it easy for bubbles to form between the lamination film and the wafer, resulting in poor lamination tightness. In addition, during the lamination process, there are normal stress and tangential stress along the direction of the roller's movement. Uneven stress will cause the warpage of the wafer to increase. Especially for thin wafers after thinning, the lamination action of the roller rolling method is likely to cause damage or even rupture of the wafer due to excessive pressure. Summary of the Invention

[0004] In view of the above deficiencies in the related technologies, the purpose of the present disclosure is to provide a wafer film attaching device and a wafer film attaching method to solve the various deficiencies in the related technologies.

[0005] A first aspect of the present disclosure provides a wafer attaching device, comprising:

[0006] The wafer carrying platform is provided with a vacuum adsorption structure for horizontally carrying the wafer; wherein, after the wafer is placed on the wafer carrying platform, the surface of the wafer to be film-mounted faces upward;

[0007] A feeding mechanism, used for delivering the laminating film to above the wafer carrying platform and the wafer carried thereon; and

[0008] The film laminating device includes a lifting mechanism and an organic capsule connected to the lifting mechanism and located above the laminating film, wherein the organic capsule contains a fluid substance; wherein the organic capsule is driven by the lifting mechanism to move downward, driving the laminating film to contact the surface of the wafer to be laminating, and during the descending process, the organic capsule is deformed under the gravity of the fluid substance inside it and gradually increases the pressing surface that can act on the laminating film until the laminating film is completely laminating to the entire surface of the wafer to be laminating, thereby completing the laminating of the laminating film.

[0009] In some examples of the first aspect, a vacuum adsorption structure is provided on the wafer supporting platform, and the vacuum adsorption structure includes adsorption holes provided on the wafer supporting platform and a vacuum generator connected to the adsorption holes.

[0010] In certain examples of the first aspect, the feeding mechanism includes: a feeding roller, a first conveying roller, and a second conveying roller, the bonding film is wound on the feeding roller, the first conveying roller and the second conveying roller are respectively arranged on opposite sides of the wafer supporting platform, and the feeding roller is driven to rotate to unwind and feed the bonding film, and the bonding film is conveyed to the top of the wafer carried by the wafer supporting platform via the first conveying roller and the second conveying roller.

[0011] In some examples of the first aspect, the feeding mechanism includes: a tension adjustment roller disposed between the feeding roller and the adjacent first conveying roller.

[0012] In certain examples of the first aspect, the feeding mechanism includes: a first transition component and a second transition component, the first transition component is located between the first conveying roller and the wafer supporting platform, and the second transition component is located between the second conveying roller and the wafer supporting platform.

[0013] In some examples of the first aspect, the feeding mechanism further includes a cutting unit for cutting the laminating film.

[0014] In some examples of the first aspect, the organic capsule is connected to the lifting mechanism via a hanging rope or a support rod.

[0015] In some examples of the first aspect, the film-attaching device further includes a pressing plate, the organic capsule is connected below the pressing plate, and the pressing plate is related to a size of the wafer.

[0016] In certain examples of the first aspect, there is one organic capsule in the film-sticking device, the center of gravity of the organic capsule and the center of the wafer are on the same vertical axis, and the pressing surface formed by the deformation of the organic capsule under the action of gravity of the fluid material inside the organic capsule can completely cover the wafer.

[0017] In some examples of the first aspect, the organic capsule is made of an elastic material, and the elastic material includes one or more combinations of latex, rubber, plastic, polyvinyl chloride, polyamide, and polyethylene.

[0018] A second aspect of the present disclosure provides a wafer attaching method, comprising the following steps:

[0019] The wafer is horizontally supported by a wafer supporting platform; wherein, after the wafer is placed on the wafer supporting platform, the surface of the wafer to be film-mounted faces upward;

[0020] Using a feeding mechanism to convey the bonding film onto the top of the wafer; and

[0021] The organic capsule placed above the bonding film is lowered so that the organic capsule drives the bonding film to contact the surface of the wafer to be bonded. During the descending process, the organic capsule is deformed under the gravity of the fluid substance inside it and the pressing surface that can act on the bonding film is gradually increased until the bonding film is completely bonded to the entire surface of the wafer to be bonded, thereby completing the bonding of the bonding film.

[0022] In some examples of the second aspect, after the lamination of the lamination film is completed, the lamination film is cut along the edge of the wafer.

[0023] The disclosed embodiments provide a wafer laminating device and a wafer laminating method, wherein the wafer laminating device includes a wafer supporting platform, a feeding mechanism, and a laminating device, wherein the wafer supporting platform is used to horizontally support the wafer, the feeding mechanism is used to transfer the laminating film to the top of the wafer surface to be laminating, and the laminating device includes a lifting mechanism and an organic capsule located above the laminating film, the organic capsule is driven by the lifting mechanism to move downward, driving the laminating film to contact the wafer surface to be laminating, and during the descent process, the organic capsule is deformed under the gravity of the fluid material inside it and gradually increases the pressing surface that can act on the laminating film, until the laminating film is completely laminating to the entire surface to be laminating of the wafer, completing the laminating of the laminating film. Compared with the roller rolling method, there will be no excessive pressure causing damage to the wafer, and there will be no insufficient pressure and the presence of normal stress and tangential stress along the direction of roller travel during the laminating process, which will cause the laminating film to be unable to completely laminating to the entire surface to be laminating of the wafer. The wafer lamination equipment and wafer lamination method disclosed in the present invention have high cost advantages and high industrial utilization value. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Shown is a schematic structural diagram of a wafer mounting device in one embodiment of the present disclosure.

[0025] Figure 2 Shown is a schematic structural diagram of another embodiment of the wafer bonding equipment disclosed herein.

[0026] Figure 3 Shown is a schematic flow chart of a wafer attaching method according to one embodiment of the present disclosure.

[0027] Figure 4 and Figure 5 Shown as per Figure 1 The diagram shows the status of the wafer mounting equipment implementing the wafer mounting process. DETAILED DESCRIPTION

[0028] The following describes the embodiments of the present disclosure through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present disclosure from the information disclosed in this disclosure. The present disclosure can also be implemented or applied through different specific embodiments. The details of the present disclosure can also be modified or changed according to different viewpoints and application modules without departing from the spirit of the present disclosure. It should be noted that the embodiments and features in the embodiments of the present disclosure can be combined with each other unless there is a conflict.

[0029] The following is a detailed description of the embodiments of the present disclosure with reference to the accompanying drawings so that those skilled in the art can easily implement the present disclosure. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.

[0030] Throughout the present disclosure, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present disclosure. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or a group of embodiments or examples. Furthermore, those skilled in the art may combine and integrate different embodiments or examples, and features of different embodiments or examples, as described in the present disclosure, without conflicting requirements.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the context of this disclosure, "a group" means two or more, unless otherwise specifically defined.

[0032] In order to clearly describe the present disclosure, components not related to the description are omitted, and the same or similar components throughout the specification are denoted by the same reference numerals.

[0033] Throughout this specification, when a device is said to be "connected" to another device, this includes not only "direct connection" but also "indirect connection" with other elements interposed therebetween. Furthermore, when a device is said to "include" a certain component, unless otherwise stated, this does not exclude the inclusion of other components but rather implies that the device may include other components.

[0034] Although the terms first, second, etc. are used in this document to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are represented. Furthermore, as used in this document, the singular forms "one," "an," and "the" are intended to also include the plural forms, unless there is a contrary indication in the context. It should be further understood that the terms "comprise" and "include" indicate the presence of the described features, steps, operations, elements, modules, projects, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or a group of other features, steps, operations, elements, modules, projects, types, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C." Exceptions to this definition only occur when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0035] The technical terms used herein are intended only to refer to specific embodiments and are not intended to limit the present disclosure. The singular form used herein also includes the plural form unless the statement explicitly indicates otherwise. The term "comprising" as used in this specification is intended to specify specific features, regions, integers, steps, operations, elements, and / or components and does not exclude the presence or addition of other features, regions, integers, steps, operations, elements, and / or components.

[0036] Although not defined differently, all terms used herein, including technical and scientific terms, have the same meanings as those generally understood by those skilled in the art to which this disclosure belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with relevant technical literature and the current message. Unless otherwise defined, they should not be overly interpreted as ideal or highly formalized meanings.

[0037] In the relevant technologies involving wafer lamination, a roller rolling method is often used. When a roller is used to roll the laminating film onto the wafer, due to the concave and convex structure on the wafer surface, the roller will produce uneven pressure when rolling. In this way, it is difficult to make the laminating film completely adhere to the surface of the wafer, which makes it easy for bubbles to form between the laminating film and the wafer, resulting in poor lamination tightness. During the laminating process, there are normal stress and tangential stress along the direction of the roller's movement. The uneven stress will cause the warping of the wafer to increase. In addition, when the pressure is too high, the wafer will be damaged or even broken.

[0038] In view of this, the embodiments of the present disclosure provide a wafer lamination device and a wafer lamination method to solve the various deficiencies in the aforementioned related technologies.

[0039] A first aspect of the present disclosure provides a wafer film bonding device for bonding a bonding film to a surface of a wafer.

[0040] See also Figure 1 , which is a schematic structural diagram of the wafer laminating equipment disclosed in one embodiment.

[0041] like Figure 1 As shown, the wafer laminating equipment in this embodiment may include: a wafer carrying platform 11 , a feeding mechanism 13 , and a laminating device 15 .

[0042] The wafer carrying platform 11 is used to horizontally carry the wafer 10 .

[0043] When the wafer 10 is placed on the wafer carrier 11, the surface of the wafer to be film-attached faces upward. In practical applications, the side of the wafer 10 with the circuit structure arranged thereon can be referred to as the front side, and the side opposite the front side can be referred to as the back side. When the wafer is to be placed on the wafer carrier 11, the back side of the wafer 10 is placed directly opposite the wafer carrier 11 so that the front side of the wafer 10 faces upward. In some embodiments, the wafer carrier 11 is designed to be horizontal, and therefore, the wafer 10 carried by the wafer carrier 11 is placed horizontally.

[0044] In some embodiments, the wafer carrier 11 is a truncated cone structure. For example, wafer carriers of corresponding sizes can be provided for wafers of different sizes, so that the size of the wafer carrier 11 is consistent with the size of the wafer 10 to be carried. For example, the size of the wafer carrier 11 is relatively large, so that the wafer carrier 11 is suitable for carrying wafers 10 of different sizes.

[0045] In some embodiments, the wafer carrier 11 may be provided with a vacuum adsorption structure, wherein the vacuum adsorption structure includes adsorption holes provided on the wafer carrier 11 and a vacuum generator connected to the adsorption holes.

[0046] For example, a plurality of adsorption holes are evenly distributed on the wafer carrier 11 , and all the adsorption holes can be connected to a vacuum generator.

[0047] Exemplarily, a plurality of adsorption holes are evenly distributed on the wafer carrier 11, and these adsorption holes form a plurality of adsorption areas according to their distribution positions, and each adsorption area is connected to a corresponding vacuum generator. For example, according to the size of the wafer to be carried, a plurality of adsorption areas are formed radially outward from the center of the wafer carrier 11, and each of the adsorption areas is connected to a corresponding vacuum generator. The wafer carrier 11 forms a first adsorption area, a second adsorption area, and a third adsorption area in sequence radially outward from its center, wherein the first adsorption area is circular, and the adsorption holes in the first adsorption area are connected to one or more corresponding vacuum generators, the second adsorption area is an annular area located outside the first adsorption area, and the adsorption holes in the second adsorption area are connected to one or more corresponding vacuum generators, the third adsorption area is an annular area located outside the second adsorption area, and the adsorption holes in the third adsorption area are connected to one or more corresponding vacuum generators. When a wafer of the first size that is compatible with the first adsorption area is to be carried, the vacuum generator corresponding to the first adsorption area generates vacuum suction through the vacuum in the first adsorption area. The adsorption holes adsorb the first-size wafer so that it is tightly combined with the wafer carrier. When the second-size wafer adapted to the second adsorption area is to be carried, the vacuum generators corresponding to the first adsorption area and the second adsorption area generate vacuum suction force to adsorb the second-size wafer through the adsorption holes in the first adsorption area and the adsorption holes in the second adsorption area, so that it is tightly combined with the wafer carrier. When the third-size wafer adapted to the third adsorption area is to be carried, the vacuum generators corresponding to the first adsorption area, the second adsorption area and the Sian adsorption area generate vacuum suction force to adsorb the third-size wafer through the adsorption holes in the first adsorption area, the adsorption holes in the second adsorption area and the adsorption holes in the third adsorption area, so that it is tightly combined with the wafer carrier.

[0048] The feeding mechanism 13 is used to deliver the laminating film 20 to the wafer carrying platform 11 and the wafer 10 carried thereon.

[0049] In some embodiments, the feeding mechanism 13 may include: a feeding roller 131, a first conveying roller 133, and a second conveying roller 135, wherein the bonding film 20 is wound on the feeding roller 131, and the first conveying roller 133 and the second conveying roller 135 are respectively arranged on opposite sides of the wafer supporting platform 11, and the feeding roller 131 is driven to rotate to unwind and feed the bonding film 20, and the bonding film 20 is conveyed to the top of the wafer 10 carried by the wafer supporting platform 11 via the first conveying roller 133 and the second conveying roller 135.

[0050] In certain embodiments, the feeding mechanism 13 may further include a tension-adjusting roller (not shown in the drawings), which may be disposed between the feeding roller 131 and the adjacent first conveying roller 133. For example, one tension-adjusting roller is disposed between the feeding roller 131 and the first conveying roller 133. For example, multiple tension-adjusting rollers are disposed between the feeding roller 131 and the first conveying roller 133, and the multiple tension-adjusting rollers are disposed in an interlaced manner. For example, two tension-adjusting rollers are disposed between the feeding roller 131 and the first conveying roller 133, the first tension-adjusting roller being disposed on the first side of the laminating film, and the second tension-adjusting roller being disposed on the second side of the laminating film.

[0051] In certain embodiments, the feeding mechanism 13 may further include a first transition assembly 132 and a second transition assembly 134. The first transition assembly 132 is located between the first conveying roller 133 and the wafer carrier 11 and adjacent to the wafer carrier 11, and the second transition assembly 134 is located between the second conveying roller 135 and the wafer carrier 11 and adjacent to the wafer carrier 11. For example, the height of the first transition assembly 132 is slightly higher than the wafer 10 carried by the wafer carrier 11, that is, the height of the first transition assembly 132 is slightly higher than the height of the wafer 10 after being placed on the wafer carrier 11. Similarly, the height of the second transition assembly 134 is slightly higher than the height of the wafer 10 carried by the wafer carrier 11, and the heights of the first transition assembly 132 and the second transition assembly 134 are consistent. In actual applications, the heights of the first transition assembly 132 and the second transition assembly 134 can be adjusted according to the thickness of the wafer carried by the wafer carrier 11.

[0052] The film-sticking device 15 includes a lifting mechanism 151 and an organic capsule 153 connected to the lifting mechanism 151 .

[0053] The organic capsule 153 is filled with a fluid substance and is located above the wafer carrier 11 and the laminating film 20. The organic capsule 153 is connected to the lifting mechanism 151 and can move up and down when driven by the lifting mechanism to move closer to or away from the wafer carrier 11 and the laminating film 20. In actual applications, the fluid substance may include, but is not limited to, a liquid substance or a colloidal substance.

[0054] In actual application, the organic capsule 153 is driven by the lifting mechanism 151 to move downward, driving the bonding film 20 to contact the surface of the wafer 10 to be bonded, and in the process of descending, the organic capsule 153 is deformed under the gravity of the fluid material inside it and gradually increases the pressing surface that can act on the bonding film 20 until the bonding film 20 is completely bonded to the entire surface of the wafer 10 to be bonded, completing the bonding of the bonding film.

[0055] In certain embodiments, as Figure 1 As shown, the organic capsule 153 can be connected to the lifting mechanism 151 through a hanging rope or a support rod. Moreover, the number of the organic capsule 153 is one, and this organic capsule 153 is located directly above the wafer carrier 11. In a natural state, the center of gravity of this organic capsule 153 is on the same vertical axis as the center of the wafer 10. When the organic capsule 153 encounters a blocking surface, the organic capsule will be deformed under the gravity of the fluid material inside it and adhere to the blocking surface to form a pressing surface. In this embodiment, the material and size of the organic capsule are reasonably set so that the pressing surface formed by the deformation of the organic capsule under the gravity of the fluid material inside it can completely cover the wafer underneath.

[0056] In some embodiments, see Figure 2 , which is a schematic diagram of the structure of the wafer film mounting device disclosed in another embodiment. Figure 2 As shown, the film laminating device includes a lifting mechanism 151, an organic capsule 153 connected to the lifting mechanism 151, and a pressing plate 152. The organic capsule 153 is positioned below the pressing plate 152, and the pressing plate 152 is sized relative to the wafer 10. For example, the pressing plate 152 may be a conical structure, with its horizontal projection corresponding to the size of the wafer 10. When the organic capsule 153 and the pressing plate 152 are driven downward by the lifting mechanism 151, they move the laminating film 20 into contact with the surface of the wafer 10 to be laminarized. During this descent, the organic capsule 153 deforms under the gravity of the fluid within it, gradually increasing the pressing surface available for application to the laminating film 20. Furthermore, during this process, the upper portion of the organic capsule 153 is also pressed by the pressing plate 152, thereby increasing the force exerted on the pressing surface of the laminating film 20.

[0057] In some embodiments, the organic capsule 153 is made of an elastic material with the characteristics of being easily deformable and strong. The elastic material includes but is not limited to latex, rubber, plastic, polyvinyl chloride (PVC), polyamide (PA), polyethylene (PE) or any combination thereof.

[0058] In some embodiments, the feeding mechanism may further include a cutting unit, which can be used to cut the laminating film. For example, after the laminating film is applied, the cutting unit can be used to cut the laminating film along the edge of the wafer.

[0059] As can be seen from the above, the embodiment of the present disclosure provides a wafer laminating device, including a wafer supporting platform, a feeding mechanism, and a laminating device, wherein the wafer supporting platform is used to horizontally support the wafer, the feeding mechanism is used to transfer the laminating film to the top of the surface of the wafer to be laminating, and the laminating device includes a lifting mechanism and an organic capsule located above the laminating film, the organic capsule is driven by the lifting mechanism to move downward, driving the laminating film to contact the surface of the wafer to be laminating, and during the descent process, the organic capsule is deformed under the gravity of the fluid material inside it and gradually increases the pressing surface that can act on the laminating film, until the laminating film is completely laminating to the entire surface of the wafer to be laminating, completing the laminating of the laminating film. Compared with the roller rolling method, there will be no excessive pressure causing damage to the wafer, nor will there be insufficient pressure and the presence of normal stress and tangential stress along the direction of roller travel during the laminating process, which makes the laminating film unable to completely laminarize to the entire surface of the wafer to be laminating. The wafer lamination equipment and wafer lamination method disclosed in the present invention have high cost advantages and high industrial utilization value.

[0060] A second aspect of the present disclosure provides a wafer lamination method, which utilizes the aforementioned wafer lamination equipment to apply a lamination film to the surface of a wafer.

[0061] See also Figure 3 , which is a schematic flow chart of the wafer bonding method disclosed in one embodiment.

[0062] like Figure 3 As shown, the wafer attaching method includes the following steps:

[0063] Step S101 , using a wafer supporting platform to horizontally support a wafer; wherein, after the wafer is placed on the wafer supporting platform, the surface of the wafer to be film-mounted faces upward.

[0064] In step S103 , the bonding film is delivered to the top of the wafer by using a feeding mechanism.

[0065] In step S105, the organic capsule placed on the bonding film is lowered so that the organic capsule drives the bonding film to contact the surface of the wafer to be bonded. During the descending process, the organic capsule is deformed under the gravity of the fluid material inside it and gradually increases the pressing surface that can act on the bonding film until the bonding film is completely bonded to the entire surface of the wafer to be bonded, thereby completing the bonding of the bonding film.

[0066] In some embodiments, the wafer laminating method further includes: after the laminating film is applied, cutting the laminating film along the edge of the wafer.

[0067] The embodiment of the present disclosure provides a wafer lamination method, in which an organic capsule is arranged above the wafer and the lamination film. When lamination is performed, the organic capsule is lowered, and the organic capsule is deformed under the gravity of the fluid substance inside it and the pressing surface that can act on the lamination film is gradually increased, so that the lamination film can be completely lamination to the entire surface of the wafer to be lamination, thereby completing the lamination of the lamination film. Compared with the roller rolling method, there will be no excessive pressure causing damage to the wafer, and there will be no insufficient pressure and the presence of normal stress and tangential stress along the direction of roller travel during the lamination process, which will prevent the lamination film from being completely lamination to the entire surface of the wafer to be lamination. The wafer lamination equipment and wafer lamination method disclosed in the present disclosure have high cost advantages and high industrial utilization value.

[0068] The following targets Figure 1 The wafer mounting device in the embodiment of the present invention is used to describe the process of wafer mounting in detail:

[0069] First, the wafer 10 is horizontally supported by the wafer carrier 11, the bonding film 20 is transferred to the top of the wafer 10 by the feeding mechanism 13, and the connected organic capsule 153 is placed on the top of the bonding film 20 by the lifting mechanism 151. After the wafer 10 is placed on the wafer carrier 11, the surface of the wafer 10 to be bonded faces upward. The organic capsule 153 is filled with fluid and is located directly above the wafer 10. In a natural state, the center of gravity of the organic capsule 153 is on the same vertical axis as the center of the wafer 10. For details, please refer to Figure 1 .

[0070] Next, the organic capsule 153 placed above the laminating film 20 is lowered by the lifting mechanism 151, so that when the organic capsule 153 moves downward onto the laminating film 20, it will press the laminating film 20 to adhere to the central area of ​​the surface to be laminating the wafer 10, and in the process of descending, as the organic capsule 153 gradually moves downward, the fluid material in the organic capsule 153 will gradually spread from the central area of ​​the wafer 10 to the surrounding areas. The organic capsule 153 will deform under the gravity of the fluid material inside it and gradually increase the pressing surface that can act on the laminating film 20, forcing the contact area between the laminating film 20 and the wafer to gradually increase until the laminating film 20 is completely adhered to the entire surface to be laminating the wafer 10, completing the laminating of the laminating film. For details, please refer to Figure 4 and Figure 5 .

[0071] Finally, after the laminating film is applied, the organic capsule 153 can be raised by the lifting mechanism 151 until it returns to its original position, so that the organic capsule 153 is completely separated from the laminating film 20 .

[0072] The above embodiments are merely illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this disclosure. Therefore, any equivalent modifications or alterations made by a person skilled in the art without departing from the spirit and technical concepts disclosed herein shall be encompassed by the scope of protection of this disclosure.

Claims

1. A wafer film attaching device, characterized in that: include: The wafer carrying platform is provided with a vacuum adsorption structure for horizontally carrying the wafer; wherein, after the wafer is placed on the wafer carrying platform, the surface of the wafer to be film-mounted faces upward; A feeding mechanism, used for conveying the bonding film to above the wafer carrying platform and the wafer carried thereon; and The film laminating device comprises a lifting mechanism and an organic capsule connected to the lifting mechanism and located above the laminating film, wherein the organic capsule contains a fluid substance; The organic capsule is driven by the lifting mechanism to move downward, driving the bonding film to contact the surface of the wafer to be bonded with the bonding film, and in the process of descending, the organic capsule is deformed under the gravity of the fluid substance inside it and gradually increases the pressing surface that can act on the bonding film until the bonding film is completely bonded to the entire surface of the wafer to be bonded with the bonding film, thereby completing the bonding of the bonding film.

2. The wafer film attaching equipment according to claim 1, characterized in that: The vacuum adsorption structure comprises an adsorption hole arranged on the wafer carrying platform and a vacuum generator connected to the adsorption hole.

3. The wafer film attaching equipment according to claim 1, characterized in that: The feeding mechanism includes: a feeding roller, a first conveying roller, and a second conveying roller. The bonding film is wound on the feeding roller. The first conveying roller and the second conveying roller are respectively arranged on opposite sides of the wafer supporting platform. The feeding roller is driven to rotate to unwind and feed the bonding film. The bonding film is conveyed to the top of the wafer carried by the wafer supporting platform via the first conveying roller and the second conveying roller.

4. The wafer film attaching equipment according to claim 3, characterized in that: The feeding mechanism includes: a first transition component and a second transition component, the first transition component is located between the first conveying roller and the wafer carrying platform, and the second transition component is located between the second conveying roller and the wafer carrying platform.

5. The wafer film attaching equipment according to claim 1, characterized in that: The organic capsule is connected to the lifting mechanism through a hanging rope or a supporting rod.

6. The wafer film attaching equipment according to claim 1, characterized in that: The film sticking device also includes a pressing plate, the organic capsule is connected below the pressing plate, and the pressing plate is related to the size of the wafer.

7. The wafer film attaching equipment according to claim 1, characterized in that: The center of gravity of the organic capsule and the center of the wafer are located on the same vertical axis, and the pressing surface formed by the deformation of the organic capsule under the gravity of the fluid substance inside the organic capsule can completely cover the wafer.

8. The wafer film attaching equipment according to claim 1, characterized in that: The organic capsule is made of elastic material, and the elastic material includes one or more combinations of latex, rubber, plastic, polyvinyl chloride, polyamide, and polyethylene.

9. A wafer film attaching method, characterized in that: The steps include: The wafer is horizontally carried by a wafer carrying platform; wherein, after the wafer is placed on the wafer carrying platform, the surface of the wafer to be film-mounted faces upward; Using a feeding mechanism to transfer the bonding film to above the wafer; and The organic capsule placed above the bonding film is lowered so that the organic capsule drives the bonding film to contact the surface of the wafer to be bonded, and during the descending process, the organic capsule is deformed under the gravity of the fluid substance inside it and gradually increases the pressing surface that can act on the bonding film until the bonding film is completely bonded to the entire surface of the wafer to be bonded, thereby completing the bonding of the bonding film.

10. The wafer attaching method according to claim 9, characterized in that: Also includes: After the laminating film is applied, the laminating film is cut along the edge of the wafer.

Images