Loading device for cleaning semiconductor silicon wafer

Abstract

The invention belongs to the technical field of semiconductor silicon wafer cleaning equipment, and particularly relates to a semiconductor silicon wafer cleaning loading device which comprises a box body, a cleaning tank is arranged in the box body, rotating mechanisms are symmetrically and fixedly connected to the positions, located in the cleaning tank, of the inner wall of the box body, and clamping mechanisms are assembled on the rotating mechanisms in an array mode. The rotating mechanism drives the clamping mechanisms to rotate by a certain angle, one clamping part is separated from the semiconductor silicon wafer, and each clamping mechanism is provided with a flushing mechanism used for flushing the part clamped by the semiconductor silicon wafer in good time. In the process, the clamping part is separated from the semiconductor silicon wafer, so that the flushing mechanism flushes the part, which is clamped by the clamping part previously, of the semiconductor silicon wafer, and therefore, the semiconductor silicon wafer can be cleaned in all directions, and cleaning dead angles are prevented.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor silicon wafer cleaning equipment, and in particular relates to a loading device for cleaning semiconductor silicon wafers. Background Art

[0002] Semiconductor silicon wafers are the most widely used and important semiconductor basic materials in the world and are the basic substrate materials for manufacturing chips. Semiconductor silicon wafers need to be cleaned many times during the production process, and the cleanliness level will affect the performance of the chip.

[0003] After searching, the Chinese patent with the announcement number CN115938999B provides a loading device for cleaning semiconductor silicon wafers, which places the silicon wafer on the side support block, the rotating support shaft and the limiting disk, and guides the liquid to spray along the side of the silicon wafer through the cooperation of the liquid guide channel and the liquid guide column to change the flow direction of the liquid on the silicon wafer surface, so that particulate debris will not be at the bottom of the silicon wafer. However, the position where the silicon wafer is placed on the limiting disk has a dead angle for cleaning, which is difficult to clean, and the liquid guide channel is located on the inner wall of the side support block, which cannot support the silicon wafer, and the silicon wafer clamping is unstable, and it may shake during the cleaning process. Summary of the invention

[0004] The object of the present invention is to provide a loading device for cleaning semiconductor silicon wafers to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0006] A loading device for cleaning semiconductor silicon wafers comprises a box body, a cleaning tank is arranged in the box body, a rotating mechanism is symmetrically fixedly connected to the inner wall of the box body at a position in the cleaning tank, a clamping mechanism for clamping semiconductor silicon wafers is arrayed on the rotating mechanism, the rotating mechanism drives the semiconductor silicon wafer on the clamping mechanism to rotate and clean in the cleaning tank, the rotating mechanism drives the clamping mechanism to rotate a certain angle, one of the clamping parts is separated from the semiconductor silicon wafer, and each of the clamping mechanisms is equipped with a flushing mechanism for timely flushing the part clamped by the semiconductor silicon wafer.

[0007] Furthermore, the rotating mechanism includes a fixed plate symmetrically fixedly connected to the position of the box body in the cleaning tank, each of the fixed plates is fixedly connected to an arc block at a position away from the axis, each of the fixed plates is fixedly connected to a fixed rod at a position close to the arc block, the fixed rod is fixedly connected to a first blocking plate at one end away from the fixed plate, each of the fixed plates is rotatably connected with a rotating shaft passing through the center, the rotating shaft is fixedly connected to a rotating plate at one end away from the fixed plate, a sliding groove is opened circumferentially on the rotating plate, a plurality of groups of card slots are opened in an array on one side of the rotating plate away from the fixed plate, a motor is fixedly connected to the outer wall of the box body, and the output end of the motor is fixedly connected to the end of the rotating shaft extending outside the box body.

[0008] The cam is connected to the rotation of the drive mechanism, and the cam is connected to the control frame by the spring, and the cam is connected to the control frame by the spring, and the cam is connected to the control frame by the spring.

[0009] Furthermore, the fixing part includes a fixing plate fixedly connected to the pushing rod, the fixing plate is located on a side of the fixing block close to the fixing disk, a moving rod is slidably connected through the fixing plate, an end of the moving rod away from the fixing disk is fixedly connected to a clamping plate, a position of the clamping plate corresponding to the clamping slot is fixedly connected to a clamping block, a spring is sleeved on the pushing rod, one end of the spring is fixedly connected to the fixing plate, the other end of the spring is fixedly connected to the fixing block, and a second blocking plate is fixedly connected to a side of the moving rod close to the fixed rod.

[0010] Furthermore, the flushing mechanism includes a connecting block slidably connected to the through slot, a mounting groove is provided at a position of the support frame near the through slot, a vibrating block is slidably connected in the mounting groove, one end of the connecting block is fixedly connected to the vibrating block, the other end of the connecting block is fixedly connected to one of the clamping claws, the vibrating block is arranged in a wave shape, two rotating blocks are hingedly connected to the position of the support frame near the vibrating block, each of the rotating blocks is equipped with a nozzle facing the middle position of the two clamping claws, a connecting rod is fixedly connected to the side of the rotating block close to the vibrating block, and a rotating ball is rotatably connected to the end of the connecting rod away from the rotating block, and the rotating ball abuts against the vibrating block.

[0011] Furthermore, the length of the vibration block is smaller than the length of the mounting groove, and the vibration block continuously abuts against the rotating ball when moving with the connecting rod.

[0012] Furthermore, the push rod passes through the fixed block and extends to one side of the fixed disk, and the push rod abuts against the arc block in due course.

[0013] Furthermore, when the push rod abuts against the arc block, the engaging block is disengaged from the engaging groove, and the push rod causes the first blocking plate to abut against the second blocking plate through the transmission structure.

[0014] Furthermore, when the push rod abuts against the arc block, the rotating disk rotates at a certain angle to make the engaging block engage with the adjacent engaging groove.

[0015] Furthermore, two ends of the arc block are arranged in inclined surfaces.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention drives the clamping mechanism to rotate a certain angle through the rotating mechanism, so as to facilitate the clamping of the semiconductor silicon wafer. In the process, the clamping part is separated from the semiconductor silicon wafer, so that the flushing mechanism flushes the part of the semiconductor silicon wafer previously clamped by the clamping part, thereby the semiconductor silicon wafer can be cleaned in all directions to prevent the occurrence of cleaning dead corners.

[0018] The present invention is provided with a clamping part and a rotating mechanism. When the clamping part rotates a certain angle, the clamping part is separated from the semiconductor silicon wafer to avoid friction between the clamping part and the semiconductor silicon wafer during the rotation process, thereby avoiding wear on the surface of the semiconductor silicon wafer to ensure the qualified rate of the semiconductor silicon wafer.

[0019] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the connection between the rotating mechanism and the clamping mechanism of the present invention;

[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of the connection between the rotating mechanism and the fixing part of the present invention;

[0024] Figure 4 yes Figure 3 A schematic diagram of the enlarged structure at B in the middle;

[0025] Figure 5 It is a schematic diagram of the three-dimensional structure of the connection between the clamping part and the flushing mechanism of the present invention;

[0026] Figure 6 It is a schematic diagram of the cross-sectional structure of the connection between the clamping part and the flushing mechanism of the present invention;

[0027] Figure 7 It is a partial structural schematic diagram of the flushing mechanism of the present invention;

[0028] Figure 8 yes Figure 7 Schematic diagram of the enlarged structure at point B in the middle.

[0029] In the figure: 1, box body; 2, cleaning tank; 3, fixed plate; 4, arc block; 5, fixed rod; 6, first blocking plate; 7, rotating shaft; 8, rotating plate; 9, sliding groove; 10, clamping groove; 11, motor; 12, clamping part; 13, sliding rod; 14, fixed block; 15, supporting frame; 16, sliding groove; 17, pushing groove; 18, pushing rod; 19, connecting rod; 20, sliding block; 21, opening and closing rod; 22, clamping claw; 23, through groove; 24, fixing part; 25, fixing plate; 26, moving rod; 27, clamping plate; 28, clamping block; 29, spring; 30, second blocking plate; 31, connecting block; 32, mounting groove; 33, vibration block; 34, rotating block; 35, nozzle; 36, linkage rod; 37, rotating ball. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0031] See also Figures 1 to 8The present invention provides a loading device for cleaning semiconductor silicon wafers, comprising a box body 1, a cleaning tank 2 is arranged in the box body 1, a rotating mechanism is symmetrically fixedly connected to the inner wall of the box body 1 in the cleaning tank 2, a clamping mechanism for clamping semiconductor silicon wafers is arrayed on the rotating mechanism, the rotating mechanism drives the semiconductor silicon wafer on the clamping mechanism to rotate and clean in the cleaning tank 2, the rotating mechanism drives the clamping mechanism to rotate a certain angle, one of the clamping parts 12 is separated from the semiconductor silicon wafer, and each clamping mechanism is equipped with a flushing mechanism for flushing the part clamped by the semiconductor silicon wafer in time.

[0032] The rotating mechanism and the clamping mechanism are provided, and the clamping mechanism is used to clamp the semiconductor silicon wafer. When one of the clamping parts 12 rotates to a certain position of the rotating mechanism, the clamping part 12 stops rotating driven by the rotating mechanism, and the clamping part 12 rotates a certain angle relative to the rotating mechanism to facilitate the clamping of the semiconductor silicon wafer. In this process, the clamping part 12 is separated from the semiconductor silicon wafer, so that the flushing mechanism flushes the part of the semiconductor silicon wafer previously clamped by the clamping part 12. The clamping part 12 of the clamping mechanism undergoes the above process at least once, so that the semiconductor silicon wafer can be cleaned in all directions to prevent the occurrence of cleaning dead corners. At the same time, when the clamping part 12 rotates a certain angle relative to the rotating mechanism, the clamping part 12 is separated from the semiconductor silicon wafer first to avoid mutual friction between the clamping part 12 and the semiconductor silicon wafer during the rotation process, thereby avoiding wear on the surface of the semiconductor silicon wafer to ensure the qualified rate of the semiconductor silicon wafer.

[0033] See also Figures 1 to 4 The rotating mechanism includes a fixed disk 3 symmetrically fixedly connected to the position of the box body 1 in the cleaning tank 2, each fixed disk 3 is fixedly connected to an arc block 4 at a position away from the axis, each fixed disk 3 is fixedly connected to a fixed rod 5 at a position close to the arc block 4, and the fixed rod 5 is fixedly connected to a first blocking plate 6 at one end away from the fixed disk 3. A rotating shaft 7 is rotatably connected to the center of each fixed disk 3, and a rotating disk 8 is fixedly connected to the end of the rotating shaft 7 away from the fixed disk 3. A sliding groove 9 is opened circumferentially on the rotating disk 8, and a plurality of groups of card slots 10 are opened in an array on one side of the rotating disk 8 away from the fixed disk 3. A motor 11 is fixedly connected to the outer wall of the box body 1, and the output end of the motor 11 is fixedly connected to one end of the rotating shaft 7 extending outside the box body 1.

[0034] When the semiconductor silicon wafer is clamped, the motor 11 is started, and the output end of the motor 11 drives the rotating shaft 7 to rotate, thereby driving the rotating disk 8 to rotate, and then driving one of the clamping parts 12 to rotate. The clamping part 12 first contacts the arc block 4, so that the clamping part 12 is disengaged from the slot 10, and at the same time, the clamping part 12 abuts against the first blocking plate 6, so that the clamping part 12 and the rotating disk 8 rotate relative to each other. When rotating by a certain angle, when the clamping part 12 rotates to an adjacent slot 10, the clamping part 12 is engaged with the slot 10, and the clamping part 12 is driven to rotate by the rotating disk 8. The above process is performed in sequence, so that all the clamping parts 12 undergo the above process at least once, thereby performing an all-round cleaning of the semiconductor silicon wafer to avoid cleaning dead corners.

[0035] See also Figure 2 , Figure 5 , Figure 6 and Figure 8 The clamping mechanism includes at least three clamping parts 12 slidably connected to the rotating disk 8, and the clamping parts 12 are timely engaged with the card slots 10 through the arc block 4. Each clamping part 12 includes a slide rod 13 slidably connected to the sliding slot 9, and the end of the slide rod 13 away from the rotating disk 8 is fixedly connected to a fixed block 14, and a support frame 15 is fixedly connected between the two fixed blocks 14. The support frame 15 is provided with a plurality of slide slots 16, and the support frame 15 is provided with a push slot 17, and a push rod 18 is slidably connected in the push slot 17, and the push rod 18 is hinged with a connecting rod 19 at a position close to the slide slot 16, and a sliding block 20 is hinged at the other end of the connecting rod 19. An opening and closing rod 21 is symmetrically hinged on the sliding block 20, and a clamping claw 22 is hinged at the other end of each opening and closing rod 21. The clamping claw 22 is located in the slide slot 16 and is slidably connected to the support frame 15. A through groove 23 is provided on the side of the support frame 15 away from the push rod 18, and the through groove 23 is connected to the slide slot 16. A fixing portion 24 that is timely engaged with the card slot 10 is fixedly connected to the side of the push rod 18 close to the rotating disk 8.

[0036] See also Figure 3 and Figure 4 The fixing portion 24 includes a fixing plate 25 fixedly connected to the pushing rod 18, the fixing plate 25 is located on the side of the fixing block 14 close to the fixing disk 3, a moving rod 26 is slidably connected through the fixing plate 25, an end of the moving rod 26 away from the fixing disk 3 is fixedly connected to a clamping plate 27, a position of the clamping plate 27 corresponding to the clamping slot 10 is fixedly connected to a clamping block 28, a spring 29 is sleeved on the pushing rod 18, one end of the spring 29 is fixedly connected to the fixing plate 25, the other end of the spring 29 is fixedly connected to the fixing block 14, and a second blocking plate 30 is fixedly connected to the side of the moving rod 26 close to the fixing rod 5.

[0037] The rotating disk 8 rotates, driving the clamping block 28 to rotate, thereby driving the clamping plate 27 to rotate, and then driving the moving rod 26 to rotate. The moving rod 26 drives the fixed plate 25 to rotate, thereby driving the pushing rod 18 to rotate, and then driving the fixed block 14 to rotate. The fixed block 14 drives the support frame 15 to rotate. When the pushing rod 18 rotates and abuts against the arc block 4, the pushing rod 18 moves along the surface of the arc block 4, so that the pushing rod 18 moves, driving the connecting rod 19 to move, thereby driving the sliding block 20 to move, and then driving one of the two opening and closing rods 21 away from each other, so that the two clamping claws 22 are away from each other, so that the clamping claws 22 loosen the semiconductor silicon wafer to avoid friction between the clamping part 12 and the semiconductor silicon wafer, thereby avoiding wear on the surface of the semiconductor silicon wafer to ensure the qualified rate of the semiconductor silicon wafer. The pushing rod 18 moves, driving the fixed plate 25 to move, Thereby, the moving rod 26 is driven to move, and then the clamping plate 27 is driven to move. The clamping plate 27 drives the clamping block 28 to move, and the clamping block 28 moves out of the slot 10. At the same time, the moving rod 26 drives the second blocking plate 30 to move and abuts against the first blocking plate 6. When the rotating disk 8 continues to rotate, the sliding rod 13 will slide in the sliding groove 9, so that the fixing part 24 and the clamping part 12 rotate relative to the rotating disk 8. When it rotates to a certain angle, the clamping block 28 rotates to an adjacent slot 10. Under the action of the spring 29, the opposite action to the above process occurs. The clamping block 28 is clamped with the slot 10, and the rotating disk 8 drives the clamping block 28 to continue to rotate until the next fixing part 24 and the clamping part 12 rotate to the arc block 4 to perform the same action as the above process, thereby the semiconductor silicon wafer can be cleaned in all directions to avoid the occurrence of cleaning dead corners.

[0038] See also Figures 5 to 8 The flushing mechanism includes a connecting block 31 slidably connected to the through groove 23, a mounting groove 32 is opened at a position of the support frame 15 near the through groove 23, a vibration block 33 is slidably connected in the mounting groove 32, one end of the connecting block 31 is fixedly connected to the vibration block 33, and the other end of the connecting block 31 is fixedly connected to one of the clamping jaws 22, the vibration block 33 is arranged in a wave shape, and two rotating blocks 34 are hingedly connected to the position of the support frame 15 near the vibration block 33, each rotating block 34 is equipped with a nozzle 35 facing the middle position of the two clamping jaws 22, a connecting rod 36 is fixedly connected to the side of the rotating block 34 near the vibration block 33, and a rotating ball 37 is rotatably connected to the end of the connecting rod 36 away from the rotating block 34, and the rotating ball 37 abuts against the vibration block 33.

[0039] When the clamping jaw 22 moves, it drives the connecting block 31 to move, thereby driving the vibration block 33 to move, and then driving the rotating ball 37 abutting against the vibration block 33 to move along the surface of the vibration block 33, thereby generating a cyclic lifting and lowering motion. The rotating ball 37 drives the connecting rod 36 to move, thereby driving the rotating block 34 to move, and then driving the nozzle 35 to move, thereby expanding the range of the nozzle 35 to spray the cleaning liquid. The nozzle 35 sprays the cleaning liquid to rinse the part of the semiconductor silicon wafer that was previously clamped, thereby being able to perform all-round cleaning of the semiconductor silicon wafer to avoid cleaning dead corners.

[0040] See also Figure 7 The length of the vibration block 33 is smaller than the length of the mounting groove 32. The vibration block 33 continuously contacts the rotating ball 37 when moving with the connecting rod. There is enough space for the vibration block 33 to move and drive the two rotating balls 37 to move simultaneously.

[0041] See also Figure 4 The push rod 18 passes through the fixed block 14 and extends to one side of the fixed disk 3. The push rod 18 abuts against the arc block 4 in a timely manner. When the push rod 18 moves to the arc block 4, the arc block 4 can move the push rod 18.

[0042] When the push rod 18 abuts against the arc block 4, the clamping block 28 disengages from the clamping slot 10, and the push rod 18 abuts the first blocking plate 6 and the second blocking plate 30 through the transmission structure, so that the first blocking plate 6 blocks the movement of the second blocking plate 30, thereby causing the fixing part 24 and the clamping part 12 to rotate relative to the rotating disk 8.

[0043] When the push rod 18 abuts against the arc block 4, the rotating disk 8 rotates a certain angle to make the clamping block 28 clamped with the adjacent clamping groove 10, so that the clamping part 12 exposes the part that clamped the semiconductor silicon wafer before, so as to facilitate cleaning of the part.

[0044] See also Figure 4 The two ends of the arc block 4 are arranged with inclined surfaces, so that the push rod 18 can move along the surface of the arc block 4.

[0045] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A loading device for cleaning semiconductor silicon wafers, comprising a housing (1), wherein a cleaning tank (2) is provided in the housing (1), characterized in that: The inner wall of the box body (1) is symmetrically fixedly connected to a rotating mechanism at a position inside the cleaning tank (2); a clamping mechanism is arrayed on the rotating mechanism; the rotating mechanism drives the semiconductor silicon wafer on the clamping mechanism to rotate and clean in the cleaning tank (2); the rotating mechanism drives the clamping mechanism to rotate a certain angle, and one of the clamping parts (12) is separated from the semiconductor silicon wafer; and each of the clamping mechanisms is equipped with a flushing mechanism.

2. A semiconductor silicon wafer cleaning loading device according to claim 1, characterized in that: The rotating mechanism comprises a fixed disk (3) symmetrically fixedly connected to a position of the housing (1) located in the cleaning tank (2); each of the fixed disks (3) is fixedly connected to an arc block (4) at a position away from the axis; each of the fixed disks (3) is fixedly connected to a fixed rod (5) at a position close to the arc block (4); one end of the fixed rod (5) away from the fixed disk (3) is fixedly connected to a first blocking plate (6); a rotating shaft (7) passes through the center of each fixed disk (3) and is rotatably connected; one end of the rotating shaft (7) away from the fixed disk (3) is fixedly connected to a rotating disk (8); a sliding groove (9) is circumferentially provided on the rotating disk (8); a plurality of groups of card slots (10) are arranged in an array on a side of the rotating disk (8) away from the fixed disk (3); a motor (11) is fixedly connected to the outer wall of the housing (1); an output end of the motor (11) is fixedly connected to one end of the rotating shaft (7) extending outside the housing (1).

3. A semiconductor silicon wafer cleaning loading device according to claim 2, characterized in that: The clamping mechanism comprises at least three clamping parts (12) slidably connected to the rotating disk (8), the clamping parts (12) being timely engaged with the clamping groove (10) through the arc block (4), each of the clamping parts (12) comprising a sliding rod (13) slidably connected to the sliding groove (9), one end of the sliding rod (13) away from the rotating disk (8) being fixedly connected to a fixed block (14), a support frame (15) being fixedly connected between the two fixed blocks (14), a plurality of sliding grooves (16) being provided on the support frame (15), a pushing groove (17) being provided on the support frame (15), a pushing rod (18) being slidably connected in the pushing groove (17), and the pushing rod (18) being slidably connected in the pushing groove (17), 8) A connecting rod (19) is hinged at a position close to the slide groove (16), and a sliding block (20) is hinged at the other end of the connecting rod (19). An opening and closing rod (21) is symmetrically hinged on the sliding block (20). The other end of each opening and closing rod (21) is hinged with a clamping claw (22), and the clamping claw (22) is located in the slide groove (16) and is slidably connected to the support frame (15). A through groove (23) is provided on the side of the support frame (15) away from the push rod (18), and the through groove (23) is connected to the slide groove (16). A fixing part (24) that is timely engaged with the clamping groove (10) is fixedly connected to the side of the push rod (18) close to the rotating disk (8).

4. A semiconductor silicon wafer cleaning loading device according to claim 3, characterized in that: The fixing portion (24) comprises a fixing plate (25) fixedly connected to the pushing rod (18), the fixing plate (25) being located on a side of the fixing block (14) close to the fixing disk (3), a moving rod (26) being slidably connected therethrough, an end of the moving rod (26) away from the fixing disk (3) being fixedly connected to a clamping plate (27), a position of the clamping plate (27) corresponding to the clamping slot (10) being fixedly connected to a clamping block (28), a spring (29) being sleeved on the pushing rod (18), one end of the spring (29) being fixedly connected to the fixing plate (25), the other end of the spring (29) being fixedly connected to the fixing block (14), and a second blocking plate (30) being fixedly connected to a side of the moving rod (26) close to the fixing rod (5).

5. A semiconductor silicon wafer cleaning loading device according to claim 4, characterized in that: The flushing mechanism comprises a connecting block (31) slidably connected to the through groove (23); a mounting groove (32) is provided on the support frame (15) near the through groove (23); a vibration block (33) is slidably connected to the mounting groove (32); one end of the connecting block (31) is fixedly connected to the vibration block (33); the other end of the connecting block (31) is fixedly connected to one of the clamping claws (22); the vibration block (33) is arranged in a wave shape; two rotating blocks (34) are hingedly connected to the support frame (15) near the vibration block (33); each rotating block (34) is equipped with a nozzle (35) facing the middle position of the two clamping claws (22); a linking rod (36) is fixedly connected to one side of the rotating block (34) near the vibration block (33); a rotating ball (37) is rotatably connected to the end of the connecting rod (36) away from the rotating block (34); the rotating ball (37) is in contact with the vibration block (33).

6. A semiconductor silicon wafer cleaning loading device according to claim 5, characterized in that: The length of the vibration block (33) is smaller than the length of the mounting groove (32), and the vibration block (33) continuously contacts the rotating ball (37) when moving with the connecting rod.

7. A semiconductor silicon wafer cleaning loading device according to claim 4, characterized in that: The push rod (18) passes through the fixed block (14) and extends to one side of the fixed disk (3), and the push rod (18) abuts against the arc block (4) at the right time.

8. A semiconductor silicon wafer cleaning loading device according to claim 4, characterized in that: When the push rod (18) abuts against the arc block (4), the clamping block (28) is disengaged from the clamping groove (10), and the push rod (18) causes the first blocking plate (6) and the second blocking plate (30) to abut against each other through the transmission structure.

9. A semiconductor silicon wafer cleaning loading device according to claim 3, characterized in that: During the process of the push rod (18) abutting against the arc block (4), the rotating disk (8) rotates at a certain angle to allow the engaging block (28) to engage with the adjacent engaging groove (10).

10. The semiconductor silicon wafer cleaning loading device according to claim 2, characterized in that: The two ends of the arc-shaped block (4) are arranged in the form of inclined surfaces.

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