Wafer cassette handling robot, wafer cassette handling method

Abstract

The present invention provides a wafer cassette handling robot. The wafer cassette handling robot includes: a base, inside which a drawer plate is provided, and the drawer plate is slidably connected to the base; a first moving component, slidably connected to the drawer plate; a second moving component, pivotally connected to the first moving component; a manipulator, pivotally connected to the second moving component, and the manipulator is used for handling wafer cassettes; and a loading rack, connected to the base, and a positioning sleeve frame is provided on the loading rack for placing wafer cassettes. Wherein, when the drawer plate is inside the base, the moving direction of the second moving component, the extending direction of the manipulator and the extending direction of the drawer plate are parallel; when the drawer plate is pulled out of the base, the moving direction of the second moving component is perpendicular to the extending direction of the drawer plate, and the extending direction of the manipulator is parallel to the extending direction of the drawer plate. The present invention can improve the handling efficiency of wafer cassettes and ensure the safety and integrity of wafer transfer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a wafer cassette handling robot and a wafer cassette handling method. Background Art

[0002] In the semiconductor field, wafers need to be placed in a wafer cassette, and the wafer cassette is transported by a handling robot in units of the wafer cassette. When the existing wafer cassette handling robot is in use, the position of the manipulator thereon is fixed and cannot be moved. When the carrying platform is lengthened to increase the transportation workload, the manipulator cannot handle the wafer cassette at a relatively far position, resulting in low handling efficiency. Summary of the Invention

[0003] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a wafer cassette handling robot and a wafer cassette handling method, which are used to solve the problem of low wafer cassette handling efficiency in the prior art.

[0004] To achieve the above object and other related objects, the present invention provides a wafer cassette handling robot, including:

[0005] A base, inside which a drawer plate is provided, and the drawer plate is slidably connected to the base;

[0006] A first moving component, slidably connected to the drawer plate;

[0007] A second moving component, pivotally connected to the first moving component;

[0008] A manipulator, pivotally connected to the second moving component, and the manipulator is used to handle the wafer cassette; and

[0009] A loading rack, connected to the base, and a positioning sleeve frame is provided on the loading rack, and the positioning sleeve frame is used to place the wafer cassette;

[0010] Wherein, when the drawer plate is inside the base, the moving direction of the second moving component, the extending direction of the manipulator, and the extending direction of the drawer plate are parallel;

[0011] When the drawer plate is pulled out of the base, the moving direction of the second moving component is perpendicular to the extending direction of the drawer plate, and the extending direction of the manipulator is parallel to the extending direction of the drawer plate.

[0012] In an embodiment of the present invention, the manipulator includes a connecting arm, a moving arm, and a clamping arm;

[0013] The connecting arm is connected to the second moving component, the moving arm is pivotally connected to the connecting arm, and the clamping arm is pivotally connected to the moving arm.

[0014] In an embodiment of the present invention, the clamping arm includes:

[0015] A fixing plate, on which an arc-shaped groove is formed;

[0016] A first connecting rod, which is slidably connected in the first arc-shaped groove, and a first clamping plate is connected to the first connecting rod; and

[0017] A second connecting rod, which is slidably connected in the second arc-shaped groove, and a second clamping plate is connected to the second connecting rod. The first clamping plate and the second clamping plate are opposite to each other to clamp the wafer cassette.

[0018] In an embodiment of the present invention, on one side close to the first clamping plate, the distance between the first arc-shaped groove and the second arc-shaped groove is denoted as a first distance, and on the side far from the first clamping plate, the distance between the first arc-shaped groove and the second arc-shaped groove is denoted as a second distance. The first distance is greater than the second distance;

[0019] The centers of the circles corresponding to the first arc-shaped groove and the second arc-shaped groove are located on the side far from the first clamping plate.

[0020] In an embodiment of the present invention, the clamping arm further includes:

[0021] A first parallel plate, one end of which is pivotally connected to the first connecting rod, and the other end of which is fixedly connected to the first clamping plate;

[0022] A second parallel plate, one end of which is pivotally connected to the second connecting rod, and the other end of which is fixedly connected to the second clamping plate;

[0023] A first cross rod, which is connected between the head end of the first parallel plate and the tail end of the second parallel plate;

[0024] A second cross rod, which is connected between the tail end of the first parallel plate and the head end of the second parallel plate. The centers of the first cross rod and the second cross rod are rotationally connected.

[0025] In an embodiment of the present invention, the clamping arm further includes:

[0026] A moving block, which is connected to the first connecting rod and the second connecting rod;

[0027] A power source, which drives the moving block to move;

[0028] A gear, racks are respectively arranged on the opposite sides of the first connecting rod and the second connecting rod. The rack on the first connecting rod meshes with one gear, and the rack on the second connecting rod meshes with the other gear.

[0029] In one embodiment of the present invention, a groove is provided on the draw-out plate, and a rack is arranged in the groove. The first moving assembly includes a mounting block, a driving motor, and a gear. The gear is connected to the bottom of the mounting block and meshes with the rack, and the driving motor drives the gear to rotate.

[0030] In one embodiment of the present invention, a vertical plate is connected to the base, and the loading rack is connected to both sides of the vertical plate.

[0031] In one embodiment of the present invention, when the draw-out plate is located inside the base, the connecting arm, the moving arm, and the clamping arm are on the same straight line.

[0032] The present invention also provides a method for handling a wafer cassette, which is applied to the wafer cassette handling robot as described in any one of the above, and includes:

[0033] Pull out the draw-out plate to the outside of the base, rotate the second moving assembly so that the moving direction of the second moving assembly is perpendicular to the extending direction of the draw-out plate;

[0034] Rotate the manipulator so that the extending direction of the manipulator is parallel to the extending direction of the draw-out plate;

[0035] Move through the first moving assembly and the second moving assembly, the manipulator grabs a target wafer cassette, and places the target wafer cassette on the positioning sleeve of the loading rack;

[0036] When the manipulator transports a plurality of target wafer cassettes to the positioning sleeve of the loading rack, or when the positioning sleeve of the loading rack is already filled with target wafer cassettes, rotate the manipulator so that the extending direction of the manipulator is perpendicular to the extending direction of the draw-out plate;

[0037] Rotate the second moving assembly so that the moving direction of the second moving assembly is parallel to the extending direction of the draw-out plate, and pull out the draw-out plate to the inside of the base.

[0038] As described above, the present invention provides a wafer cassette handling robot and a method for handling a wafer cassette, which can improve the handling efficiency of the wafer cassette and ensure the safety and integrity of wafer transfer. Description of the Drawings

[0039] Figure 1 Schematic diagram of the wafer cassette handling robot provided by an embodiment of the present invention without handling a wafer cassette.

[0040] Figure 2 Schematic diagram of the wafer cassette handling robot provided by an embodiment of the present invention handling a wafer cassette.

[0041] Figure 3 Schematic diagrams of a manipulator, a second moving component, and a drawer plate inside a wafer cassette handling robot provided by an embodiment of the present invention.

[0042] Figure 4 Schematic diagrams of a manipulator, a second moving component, and a drawer plate outside a wafer cassette handling robot provided by an embodiment of the present invention.

[0043] Figure 5 Schematic diagram of a manipulator and a second moving component provided by an embodiment of the present invention.

[0044] Figure 6 Schematic diagram of a connecting arm of a manipulator and a second moving component provided by an embodiment of the present invention.

[0045] Figure 7 Another schematic diagram of a connecting arm of a manipulator and a second moving component provided by an embodiment of the present invention.

[0046] Figure 8 Schematic diagram of the structure of a clamping arm of a manipulator provided by an embodiment of the present invention.

[0047] Figure 9 Schematic diagram of the steps of a wafer cassette handling method provided by an embodiment of the present invention.

[0048] 10. Base; 110. Drawer plate; 111. Groove; 112. Rack; 120. Vertical plate;

[0049] 20. First moving component; 210. Mounting block; 220. Gear; 30. Second moving component;

[0050] 40. Manipulator; 410. Connecting arm; 420. Moving arm; 430. Clamping arm; 431. Fixed plate; 4311. Arc-shaped groove; 432. First connecting rod; 433. Second connecting rod; 434. First clamping plate; 435. Second clamping plate; 436. First parallel plate; 4361. First cross bar; 4362. Chute; 437. Second parallel plate; 4371. Second cross bar; 438. Moving block; 439. Power source;

[0051] 50. Loading rack; 510. Positioning sleeve frame; 60. Wafer cassette. Detailed implementation manners

[0052] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0053] It should be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the layout type of its components may also be more complex.

[0054] In the following description, a large number of details are explored to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0055] Please refer to Figures 1 to 9 , the present invention provides a wafer cassette handling robot and a wafer cassette handling method, which can be applied to the field of wafer handling in semiconductors. For example, between the processes of multiple wafers, the wafer cassette handling robot is used to handle the wafer cassette 60 to ensure the safety and integrity of wafer transfer. The following is a detailed description through specific embodiments.

[0056] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , in an embodiment of the present invention, the present invention provides a wafer cassette handling robot, which may include a base 10, a first moving component 20, a second moving component 30, a manipulator 40, and a loading rack 50. Among them, the base 10 serves as the installation main body of the wafer cassette handling robot. Specifically, the first moving component 20, the second moving component 30, and the manipulator 40 can be installed in the base 10, and the loading rack 50 can be installed on the top of the base 10.

[0057] Specifically, as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a drawer plate 110 can be arranged inside the base 10, and the drawer plate 110 is slidably connected to the base 10. The first moving component 20 is slidably connected to the drawer plate 110, that is, the first moving component 20 can move on the drawer plate 110. The second moving component 30 is pivotally connected to the first moving component 20, that is, the second moving component 30 and the first moving component 20 are rotationally connected, and the second moving component 30 can rotate relative to the first moving component 20.

[0058] Specifically, as Figure 3 , Figure 4 shown, the manipulator 40 is pivotally connected to the second moving component 30, that is, the manipulator 40 and the second moving component 30 are rotationally connected, and the manipulator 40 can rotate relative to the second moving component 30. The second moving component 30 can drive the manipulator 40 to move, and the manipulator 40 can be used to carry the wafer cassette 60.

[0059] Specifically, as Figure 1 , Figure 2 shown, the loading rack 50 is connected to the base 10, and a positioning sleeve frame 510 can be arranged on the loading rack 50, and the wafer cassette 60 is carried to the positioning sleeve frame 510 by the manipulator 40.

[0060] Specifically, as Figure 3 , Figure 4 shown, when the drawer plate 110 is inside the base 10, the moving direction of the second moving component 30, the extending direction of the manipulator 40 and the extending direction of the drawer plate 110 are parallel. When the drawer plate 110 is outside the base 10, the moving direction of the second moving component 30 is perpendicular to the extending direction of the drawer plate 110, and the extending direction of the manipulator 40 is parallel to the extending direction of the drawer plate 110.

[0061] As Figure 3 , Figure 4 shown, when the wafer cassette handling robot does not need to handle the wafer cassette 60, the first moving component 20, the second moving component 30 and the manipulator 40 can be stored in the base 10 to reduce the space. When the wafer cassette handling robot needs to handle the wafer cassette 60, the first moving component 20, the second moving component 30 and the manipulator 40 can be pulled out of the base 10, so as to perform the handling operation of the wafer cassette 60.

[0062] Please refer to Figure 1 , Figure 2 , in an embodiment of the present invention, a vertical plate 120 is connected to the base 10, and the loading rack 50 is connected to both sides of the vertical plate 120. The second moving component 30 is an electric telescopic rod.

[0063] Please refer to Figure 5, in an embodiment of the present invention, at least two manipulators 40 may be provided on the second moving component 30, which can improve the handling efficiency of the wafer cassette 60.

[0064] Specifically, as Figure 5 shown, the manipulator 40 may include a connecting arm 410, a moving arm 420, and a clamping arm 430. The connecting arm 410 is connected to the second moving component 30, the moving arm 420 is pivotally connected to the connecting arm 410, and the clamping arm 430 is pivotally connected to the moving arm 420.

[0065] For example, within one manipulator 40, the number of moving arms 420 may be at least two. For example, the first end of the first moving arm 420 may be rotatably connected to the connecting arm 410, the second end of the first moving arm 420 may be rotatably connected to the first end of the second moving arm 420, and the second end of the second moving arm 420 may be connected to the clamping arm 430.

[0066] As Figure 5 shown, driving motors (not shown in the figure) may be provided at the bottoms of both ends of the moving arm 420. The driving motors can be used to drive the moving arm 420 to rotate, so as to realize the moving arm 420 driving the clamping arm 430 to move within a plane. The vertical upward movement of the clamping arm 430 is driven by the second moving component 30.

[0067] As Figure 1 , Figure 2 , Figure 3 and Figure 5 shown, when the draw plate 110 is located inside the base 10, the connecting arm 410, the moving arm 420, and the clamping arm 430 are on the same straight line.

[0068] Please refer to Figure 8 , in an embodiment of the present invention, the clamping arm 430 may include a fixing plate 431, a first connecting rod 432, a second connecting rod 433, a first clamping plate 434, and a second clamping plate 435.

[0069] Specifically, an arc-shaped groove 4311 is formed in the fixing plate 431. The first connecting rod 432 is slidably connected in the first arc-shaped groove 4311, and a first clamping plate 434 is connected to the first connecting rod 432. The second connecting rod 433 is slidably connected in the second arc-shaped groove 4311, and a second clamping plate 435 is connected to the second connecting rod 433. The first clamping plate 434 and the second clamping plate 435 are opposite to each other to clamp the wafer cassette 60. During the movement of the first connecting rod 432 and the second connecting rod 433, they will move along the arc-shaped groove 4311, so that when the first connecting rod 432 and the second connecting rod 433 move, they will approach or move away from each other, thereby changing the distance between the first clamping plate 434 and the second clamping plate 435. The distance between the first clamping plate 434 and the second clamping plate 435 can be increased or decreased, and wafer cassettes 60 of different sizes can be clamped and transported.

[0070] In addition, as Figure 8 shown, it is also possible that arc-shaped grooves 4311 are respectively formed on the first connecting rod 432 and the second connecting rod 433, and two limiting posts are correspondingly arranged on the fixing plate 431, and the limiting posts are inserted into the arc-shaped grooves 4311. During the movement of the first connecting rod 432 and the second connecting rod 433, they will be restricted by the limiting posts, so that when the first connecting rod 432 and the second connecting rod 433 move, they will approach or move away from each other, thereby changing the distance between the first clamping plate 434 and the second clamping plate 435.

[0071] Please refer to Figure 8 , in an embodiment of the present invention, on one side close to the first clamping plate 434, the distance between the first arc-shaped groove 4311 and the second arc-shaped groove 4311 is denoted as the first distance. On the side far from the first clamping plate 434, the distance between the first arc-shaped groove 4311 and the second arc-shaped groove 4311 is denoted as the second distance. The first distance is greater than the second distance. The centers of the circles corresponding to the first arc-shaped groove 4311 and the centers of the circles corresponding to the second arc-shaped groove 4311 are located on the side far from the first clamping plate 434.

[0072] Please refer to Figure 8 , in an embodiment of the present invention, during the movement of the first connecting rod 432 and the second connecting rod 433, they will move along the arc-shaped groove 4311, so that when the first connecting rod 432 and the second connecting rod 433 move, they will approach or move away from each other, thereby changing the distance between the first clamping plate 434 and the second clamping plate 435. The distance between the first clamping plate 434 and the second clamping plate 435 can be increased or decreased, and wafer cassettes 60 of different sizes can be clamped and transported.

[0073] However, since the first clamping plate 434 and the second clamping plate 435 move directly under the action of the first connecting rod 432 and the second connecting rod 433, the first clamping plate 434 and the second clamping plate 435 do not always remain parallel to each other. Since the wafer cassette 60 is in the shape of a cuboid, it is possible that the forces exerted by the first clamping plate 434 and the second clamping plate 435 on the wafer cassette 60 are uneven, resulting in damage to the wafers inside the wafer cassette 60. Therefore, it is necessary to keep the first clamping plate 434 and the second clamping plate 435 always parallel to each other.

[0074] Please refer to Figure 8 , in an embodiment of the present invention, the clamping arm 430 may further include a first parallel plate 436, a second parallel plate 437, a first cross bar 4361, and a second cross bar 4371.

[0075] One end of the first parallel plate 436 is pivotally connected to the first connecting rod 432, and the other end of the first parallel plate 436 is fixedly connected to the first clamping plate 434.

[0076] Specifically, one end of the second parallel plate 437 is pivotally connected to the second connecting rod 433, and the other end of the second parallel plate 437 is fixedly connected to the second clamping plate 435.

[0077] Specifically, one end of the first cross bar 4361 is slidably connected to the first parallel plate 436, and the other end of the first cross bar 4361 is rotatably connected to one end of the second parallel plate 437 close to the second connecting rod 433. For example, as Figure 8 shown, a chute 4362 may be formed on the first parallel plate 436, one end of the first cross bar 4361 may be slidably connected to the chute 4362 of the first parallel plate 436, and the other end of the first cross bar 4361 may be rotatably connected to one end of the second parallel plate 437 close to the second connecting rod 433.

[0078] Specifically, one end of the second cross bar 4371 is slidably connected to the second parallel plate 437, and the other end of the second cross bar 4371 is rotatably connected to one end of the first parallel plate 436 close to the first connecting rod 432, and the centers of the first cross bar 4361 and the second cross bar 4371 are rotatably connected. For example, as Figure 8 shown, a chute 4362 may be formed on the second parallel plate 437, one end of the second cross bar 4371 may be slidably connected to the chute 4362 of the second parallel plate 437, and the other end of the second cross bar 4371 may be rotatably connected to one end of the first parallel plate 436 close to the first connecting rod 432.

[0079] As described above, under the action of the first cross bar 4361 and the second cross bar 4371, and under the action of the first connecting rod 432 and the second connecting rod 433, the first parallel plate 436 and the second parallel plate 437 form two sides of a parallelogram, and the first cross bar 4361 and the second cross bar 4371 form two diagonals of another parallelogram. Thus, the first parallel plate 436 and the second parallel plate 437 can always be in a parallel state, so that the wafer cassette 60 can be more adaptively clamped and transported.

[0080] Please refer to Figure 8 , in an embodiment of the present invention, the clamping arm 430 may further include a moving block 438, a power source 439 and a gear 220. Specifically, the moving block 438 is connected to the first connecting rod 432 and the second connecting rod 433.

[0081] The power source 439 is connected to the moving block 438, and the output end of the power source 439 drives the moving block 438 to move. Rack teeth 112 are respectively provided on the sides of the first connecting rod 432 and the second connecting rod 433 that are close to each other. The rack teeth 112 on the first connecting rod 432 mesh with one gear 220, and the rack teeth 112 on the second connecting rod 433 mesh with another gear 220.

[0082] Specifically, the power source 439 drives the moving block 438 to move. The movement of the moving block 438 can drive the first connecting rod 432 and the second connecting rod 433 to move. Since the rack teeth 112 on the first connecting rod 432 mesh with one gear 220, and the rack teeth 112 on the second connecting rod 433 mesh with another gear 220, the first connecting rod 432 and the second connecting rod 433 can move smoothly.

[0083] Please refer to Figure 3 , Figure 4 , in an embodiment of the present invention, a groove 111 is formed on the draw plate 110, and rack teeth 112 are provided in the groove 111. The first moving assembly 20 includes a mounting block 210, a driving motor (not shown in the figure) and a gear 220. The gear 220 is connected to the bottom of the mounting block 210 and meshes with the rack teeth 112. The driving motor drives the gear 220 to rotate, so as to realize the movement of the mounting block 210 on the draw plate 110. During the movement of the mounting block 210, the second moving assembly 30 on the mounting block 210 also moves. Under the action of the second moving assembly 30, the second moving assembly 30 can further drive the manipulator 40 to move. After the manipulator 40 clamps the wafer cassette 60, it can clamp and transport the wafer cassette 60 under the action of the first moving assembly 20 and the second moving assembly 30.

[0084] Please refer to Figure 9, in an embodiment of the present invention, a method for handling a wafer cassette is proposed, which applies the above-mentioned wafer cassette handling robot and may include the following steps.

[0085] Step S10: Pull out the drawer plate to the outside of the base, and rotate the second moving component so that the moving direction of the second moving component is perpendicular to the extending direction of the drawer plate.

[0086] Step S20: Rotate the manipulator so that the extending direction of the manipulator is parallel to the extending direction of the drawer plate.

[0087] Step S30: Move through the first moving component and the second moving component, the manipulator grabs the target wafer cassette, and places the target wafer cassette on the positioning sleeve of the loading rack.

[0088] Step S40: When the manipulator transports multiple target wafer cassettes to the positioning sleeve of the loading rack, or when the positioning sleeve of the loading rack is already filled with target wafer cassettes, rotate the manipulator so that the extending direction of the manipulator is perpendicular to the extending direction of the drawer plate.

[0089] Step S50: Rotate the second moving component so that the moving direction of the second moving component is parallel to the extending direction of the drawer plate, and pull the drawer plate into the inside of the base.

[0090] It can be seen that through the above-mentioned wafer cassette handling method, when the wafer cassette handling robot does not need to handle the wafer cassette 60, the first moving component 20, the second moving component 30 and the manipulator 40 can be stored in the base 10 to achieve the purpose of reducing space. When the wafer cassette handling robot needs to handle the wafer cassette 60, the first moving component 20, the second moving component 30 and the manipulator 40 can be pulled out of the base 10, so as to carry out the handling operation of the wafer cassette 60.

[0091] In summary, a wafer cassette handling robot and a wafer cassette handling method disclosed by the present invention can improve the handling efficiency of the wafer cassette and ensure the safety and integrity of wafer transfer. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0092] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A wafer box handling robot, characterized in that: include: A base, wherein a drawer plate is arranged inside the base, and the drawer plate is slidably connected inside the base; A first moving component, slidably connected to the drawer plate; A second moving assembly, pivotally connected to the first moving assembly; A robot arm, pivotally connected to the second moving assembly, the robot arm being used for carrying a wafer box; as well as A loading rack connected to the base, wherein a positioning frame is provided on the loading rack, and the positioning frame is used to place a wafer box; Wherein, when the pull-out plate is located inside the base, the moving direction of the second moving assembly, the extending direction of the manipulator and the extending direction of the pull-out plate are parallel; When the pull-out plate is located outside the base, the moving direction of the second moving assembly is perpendicular to the extending direction of the pull-out plate, and the extending direction of the manipulator is parallel to the extending direction of the pull-out plate; The manipulator comprises a connecting arm, a moving arm and a clamping arm, wherein the connecting arm is connected to the second moving assembly, the moving arm is pivotally connected to the connecting arm, and the clamping arm is pivotally connected to the moving arm; The clamping arm comprises a first clamping plate, a second clamping plate, a first parallel plate, a second parallel plate, a first cross bar and a second cross bar, the first clamping plate is opposite to the second clamping plate to clamp the wafer box; the first parallel plate and the second parallel plate are respectively connected to the first clamping plate and the second clamping plate, the first parallel plate and the second parallel plate are rotatably connected by the first cross bar and the second cross bar, and the first parallel plate and the second parallel plate are parallel; The clamping arm further comprises: A fixing plate, wherein the fixing plate is provided with an arc-shaped groove; A first connecting rod, slidably connected in the first arc-shaped groove, the first connecting rod being connected to the first clamping plate; and A second connecting rod is slidably connected in the second arc groove, and the second connecting rod is connected to the second clamping plate; Wherein, on a side close to the first clamping plate, the distance between the first arc groove and the second arc groove is recorded as a first distance, and on a side far from the first clamping plate, the distance between the first arc groove and the second arc groove is recorded as a second distance, and the first distance is greater than the second distance; The center of a circle corresponding to the first arc-shaped groove and the center of a circle corresponding to the second arc-shaped groove are located on a side away from the first clamping plate; Wherein, under the action of the first cross rod, the second cross rod, the first connecting rod and the second connecting rod, the first parallel plate and the second parallel plate form two sides of a parallelogram, and the first cross rod and the second cross rod form two diagonals of the parallelogram, so as to realize that the first parallel plate and the second parallel plate are always in a parallel state.

2. The wafer box handling robot according to claim 1, characterized in that: One end of the first parallel plate is pivotally connected to the first connecting rod, and the other end of the first parallel plate is fixedly connected to the first clamping plate; One end of the second parallel plate is pivotally connected to the second connecting rod, and the other end of the second parallel plate is fixedly connected to the second clamping plate; One end of the first cross bar is slidably connected to the first parallel plate, and the other end of the first cross bar is rotatably connected to an end of the second parallel plate close to the second connecting bar; One end of the second cross bar is slidably connected to the second parallel plate, the other end of the second cross bar is rotationally connected to one end of the first parallel plate close to the first connecting rod, and the center of the first cross bar is rotationally connected to the center of the second cross bar.

3. The wafer box handling robot according to claim 1, characterized in that: The clamping arm further comprises: A moving block connected to the first connecting rod and the second connecting rod; A power source, an output end of which is connected to the moving block to drive the moving block to move; Gear, a rack is provided on one side of the first connecting rod and the second connecting rod close to each other, the rack on the first connecting rod is meshed with one of the gears, and the rack on the second connecting rod is meshed with the other of the gears.

4. The wafer box handling robot according to claim 1, characterized in that: The pull-out plate is provided with a groove, in which a rack is arranged. The first moving assembly includes a mounting block, a driving motor and a gear. The gear is connected to the bottom of the mounting block and meshes with the rack. The driving motor drives the gear to rotate.

5. The wafer box transport robot according to claim 1, characterized in that: A vertical plate is connected to the base, and the loading frame is connected to two sides of the vertical plate.

6. The wafer box transport robot according to claim 1, characterized in that: When the pull-out plate is located inside the base, the connecting arm, the moving arm and the clamping arm are located on the same straight line.

7. A wafer box handling method, using the wafer box handling robot according to any one of claims 1 to 6, characterized in that: include: Pull the pull-out plate to the outside of the base, and rotate the second movable assembly so that the moving direction of the second movable assembly is perpendicular to the extending direction of the pull-out plate; Rotate the manipulator so that the extension direction of the manipulator is parallel to the extension direction of the pull-out plate; The robot grabs the target wafer box by moving the first moving component and the second moving component, and places the target wafer box on the positioning frame of the loading rack; When the robot carries a plurality of target wafer boxes to the positioning frame of the loading rack, or when the positioning frame of the loading rack is full of target wafer boxes, the robot is rotated so that the extension direction of the robot is perpendicular to the extension direction of the pull-out plate; The second moving assembly is rotated so that the moving direction of the second moving assembly is parallel to the extending direction of the pull-out plate, and the pull-out plate is pulled into the interior of the base.

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