Semiconductor wafer trimming device and method

Abstract

The invention relates to the field of chip manufacturing technology, and provides a semiconductor wafer trimming device and method. A wafer placed on a pre-calibration workbench is calibrated by a calibration arm assembly to adjust the wafer to the center of the pre-calibration workbench, and after calibration, the calibration arm assembly is controlled to clamp the edge of the wafer and move it to the center of a trimming work disk along the Y-axis direction, thereby solving the problem of inconvenient calibration after placement due to the use of a hollow working suction cup in a wafer trimming device. The calibration arm also well protects products with size deviations to avoid damage during the calibration process, and the calibration structure is simple. After calibration, the wafer only needs to be transferred to the trimming work disk along the Y-axis direction, and the position deviation in the X-direction does not need to be considered, thereby achieving a calibration accuracy of hundreds of microns, and the entire calibration process is highly efficient. At the same time, by clamping and transporting the edge of the wafer, the traditional vacuum adsorption method is changed, and the pollution caused by dust in the vacuum air path is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a semiconductor wafer trimming device and method. Background Art

[0002] Wafer trimming machine is a device that grinds and trims the edge of the wafer to a certain width and depth according to the process requirements. When the device is trimming, the wafer is placed on the workbench, the workbench drives the wafer to rotate in a circle, and the tool falls on the edge of the wafer. When the wafer rotates one circle, the edge trimming is completed.

[0003] Currently, wafer trimming machines generally use a handling arm with an adsorption function to place the wafer on the workbench of the trimming machine for direct calibration. However, due to continuous production operations, water and debris are likely to remain on the workbench. At this time, calibration on the workbench may easily cause chip damage. In addition, the calibration structure and process are relatively complicated when calibration is performed directly on the workbench, and the efficiency is low. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor wafer trimming device and method to solve the problems of easy chip damage and low calibration efficiency during calibration of existing wafer trimming equipment.

[0005] In a first aspect, the present invention provides a semiconductor wafer trimming device, comprising a loading unit, a loading and unloading mechanism, a calibration mechanism, a trimming work disk and a trimming cutting mechanism, wherein the trimming work disk is mounted on an X-axis motion unit, and the calibration mechanism comprises: a pre-calibration workbench, a calibration arm assembly and a control unit, wherein the calibration arm assembly is arranged above the pre-calibration workbench, and the control unit is electrically connected to the pre-calibration workbench and the calibration arm assembly; the control unit is used to control the calibration arm assembly to calibrate the wafer placed on the pre-calibration workbench to adjust the wafer to the pre-calibration workbench. The center of the table, and after calibration, controls the calibration arm assembly to clamp the edge of the wafer and move it along the Y-axis direction to the center of the trimming work disk, waiting for subsequent trimming operations; the control unit is used to control the X-axis motion unit of the trimming work disk to work, so as to drive the trimming work disk to move along the X-axis direction so as to realize switching between the trimming station and the loading station. When the trimming work disk is located at the loading station and is in an unloaded state, the calibration arm assembly moves the wafer along the Y-axis direction to the center of the trimming work disk; the trimming work disk loads the wafer and moves to the trimming station to perform trimming operations.

[0006] Optionally, the calibration arm assembly includes: a support plate, a Y-axis motion unit, a Z-axis motion unit and a calibration mechanism; the Y-axis motion unit is installed on the support plate, the Z-axis motion unit is installed on the Y-axis motion unit, and the Y-axis motion unit drives the Z-axis motion unit to move along the Y-axis direction; the calibration mechanism is fixed to the lower end of the Z-axis motion unit, and the Z-axis motion unit drives the calibration mechanism to move along the Z-axis direction; the calibration mechanism includes three groups of symmetrically arranged adjustment components, and the wafer placed on the pre-calibration workbench is adjusted to the center of the pre-calibration workbench through the three groups of adjustment components.

[0007] Optionally, three groups of adjustment components are evenly distributed on the calibration arm base, and the angle between two adjacent groups of adjustment components is 120 degrees; the calibration arm base is installed on the lower end of the Z-axis motion unit through a hanging plate located above the adjustment components.

[0008] Optionally, each group of the adjustment components includes: a driving component, a guide mechanism, a tension spring and a limit clamping mechanism; the limit clamping mechanism is connected to the driving component through the tension spring, and slides along the guide mechanism under the driving action of the driving component. During calibration and adjustment, the limit clamping mechanism contacts the circumferential edge of the wafer and moves along the guide mechanism to adjust the position of the wafer. The tension spring is used for buffering when the limit clamping mechanism clamps the wafer.

[0009] Optionally, the limit clamping mechanism includes: a buffer adapter block, a calibration limit column and a wedge block; the buffer adapter block is installed on the slider of the guide mechanism, the tension spring is arranged between the mounting seat of the driving component and the buffer adapter block, the wedge block and the calibration limit column are both fixed at the lower end of the buffer adapter block, the calibration limit column is used to calibrate and adjust the wafer, and the wedge block is used to clamp and transport the edge of the wafer after calibration and adjustment.

[0010] Optionally, three positioning support structures are provided on the pre-calibration workbench, and the three positioning support structures are arranged in a circular array near the edge of the pre-calibration workbench. The top of the positioning support structure is a slope structure with a high middle and a low edge, and the slope structure is used to support the wafer to facilitate calibration and adjustment.

[0011] Optionally, a first positioning component is provided on the calibration arm, and a second positioning component corresponding to the first positioning component is provided on the pre-calibration workbench, the first positioning component is provided at the bottom of the support plate, and the second positioning component is provided on the upper surface of the pre-calibration workbench, and the first positioning component and the second positioning component are paired and sensed to achieve rapid positioning of the wafer on the pre-calibration workbench.

[0012] Optionally, the semiconductor wafer trimming device further includes: a front cleaning component, a back cleaning component, a first conveying component and a second conveying component; the back cleaning component is arranged on one side of the pre-calibration workbench, and the front cleaning component is arranged on the side of the back cleaning component close to the loading unit, the first conveying component is used to transfer the trimmed wafer from the trimming work disk to the front cleaning component, the second conveying component is used to transfer the wafer from the front cleaning component to the back cleaning component for back cleaning, the loading and unloading mechanism is used to transfer the wafer from the back cleaning component to the wafer box located on the loading unit, and the transmission path of the wafer in the semiconductor wafer trimming device is annular.

[0013] Optionally, the first transport assembly can realize movement in the X-axis direction, movement in the Z-axis direction, and rotation in the Z-axis direction; the second transport assembly can realize movement in the Y-axis direction, movement in the Z-axis direction, and rotation in the Z-axis direction.

[0014] In a second aspect, the present invention further provides a semiconductor wafer trimming method, based on the semiconductor wafer trimming device described in the first aspect, the semiconductor wafer trimming method comprises:

[0015] S100, controlling the loading and unloading mechanism to move the wafer to the pre-calibration workbench;

[0016] S200, controlling the calibration arm assembly to calibrate the wafer placed on the pre-calibration workbench to adjust the wafer to the center of the pre-calibration workbench;

[0017] S300, controlling the X-axis motion unit of the trimming work disk to work, so as to drive the trimming work disk to move along the X-axis direction to the loading station;

[0018] S400, controlling the calibration arm assembly to move the wafer onto the trimming work disk along the Y-axis direction;

[0019] S500, controlling the X-axis motion unit of the trimming work disk to work, so as to drive the trimming work disk to move to the trimming station along the X-axis direction;

[0020] S600, controlling the trimming and cutting mechanism to perform a trimming operation on the wafer on the trimming work disk.

[0021] Optionally, the pre-calibration workbench is provided with three positioning support structures, the three positioning support structures are arranged in a circular array at positions close to the edge of the pre-calibration workbench, the top of the positioning support structure is an inclined structure with a high middle and a low edge, and in S200, the control calibration arm assembly calibrates the wafer placed on the pre-calibration workbench to adjust the wafer to the center of the pre-calibration workbench, including:

[0022] The calibration arm assembly is controlled to limit the edge of the wafer placed on the pre-calibration workbench so that the wafer moves on the inclined surface to be adjusted to the center of the pre-calibration workbench.

[0023] The present invention has at least the following technical effects:

[0024] The semiconductor wafer trimming device and method provided by the present invention solve the problem of inconvenient calibration after placement due to the use of a hollow working suction cup in the wafer trimming equipment by arranging a pre-calibration workbench and a calibration arm assembly. The calibration arm also well protects products with size deviations to avoid damage during the calibration process. The calibration structure is simple. After calibration, it only needs to be transferred to the trimming work plate along the Y-axis direction without considering the position deviation in the X-direction. The calibration accuracy of hundreds of microns is achieved, and the efficiency of the entire calibration process is high. At the same time, by clamping and transporting the edge of the wafer, the traditional vacuum adsorption method is changed, and the pollution caused by dust in the vacuum air path is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the overall structure of a semiconductor wafer trimming device provided by an embodiment of the present invention;

[0027] Figure 2 A simplified top view schematic diagram of a semiconductor wafer trimming device provided by an embodiment of the present invention;

[0028] Figure 3 A schematic structural diagram of a calibration arm assembly of a semiconductor wafer trimming device provided by an embodiment of the present invention;

[0029] Figure 4 A schematic structural diagram of a calibration mechanism of a calibration arm assembly of a semiconductor wafer trimming device provided by an embodiment of the present invention;

[0030] Figure 5 A schematic diagram of the overall structure of a pre-calibration workbench of a semiconductor wafer trimming device provided by an embodiment of the present invention;

[0031] Figure 6 The embodiment of the present invention provides Figure 5 Front view in;

[0032] Figure 7 A flow chart of a semiconductor wafer trimming method provided by an embodiment of the present invention.

[0033] Icons: 100-pre-calibration workbench; 110-positioning support structure; 111-inclined structure; 120-second positioning component; 200-calibration arm assembly; 210-support plate; 220-Y-axis motion unit; 230-Z-axis motion unit; 240-Z-axis adapter plate; 250-calibration mechanism; 251-calibration arm base; 252-hanging plate; 253-driving component; 253a-driving mounting seat; 254-tension spring; 255-limit Clamping mechanism; 255a-buffer adapter block; 255b-wedge block; 255c-calibration limit column; 256-joint; 257-support column; 258-guide mechanism; 259-leveling nut; 300-trimming work disk; 400-X-axis motion unit; 500-first conveying assembly; 600-front cleaning assembly; 700-second conveying assembly; 800-back cleaning assembly; 900-loading and unloading mechanism; 1000-trimming and cutting mechanism. DETAILED DESCRIPTION

[0034] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Those skilled in the art will understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art in the field to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0036] Those skilled in the art will appreciate that, unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0037] The technical solution of the present invention and how the technical solution of the present invention solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0038] Combination Figures 1 to 5 As shown, an embodiment of the present invention provides a semiconductor wafer trimming device, including a loading unit (not shown in the figure), a loading and unloading mechanism 900, a calibration mechanism 250, a trimming work disk 300 and a trimming cutting mechanism 1000. The trimming work disk 300 is installed on the X-axis motion unit 400, and is driven by the X-axis motion unit to move along the X-axis direction. The calibration mechanism 250 includes: a pre-calibration workbench 100, a calibration arm assembly 200 and a control unit (not shown in the figure). The calibration arm assembly 200 is arranged above the pre-calibration workbench 100, and is used to calibrate and transfer the wafer on the pre-calibration workbench 100; the control unit is electrically connected to the pre-calibration workbench 100 and the calibration arm assembly 200. It should be noted that the control unit in this embodiment can be a control module of the semiconductor wafer trimming device itself, or it can be an additional control module. The control module is, for example, a PLC (programmable logic control) module, which can be applicable to the control system of industrial equipment.

[0039] Specifically, the control unit is used to control the calibration arm assembly 200 to calibrate the wafer placed on the pre-calibration workbench 100 so as to adjust the wafer to the center of the pre-calibration workbench 100, and after calibration, control the calibration arm assembly 200 to move the wafer along the Y-axis direction to the center of the trimming work disk 300 for subsequent trimming operations.

[0040] Furthermore, the control unit is used to control the operation of the X-axis motion unit 400 to drive the trimming work disk to move along the X-axis direction so as to switch between the trimming station and the loading station, wherein the X-axis motion unit 400 includes an X-axis drive component 253 and an X-axis guide mechanism, and the X-axis drive component 253 is controlled to operate, thereby driving the trimming work disk to slide along the X-axis guide mechanism. When the trimming work disk is located at the loading station and is in an unloaded state, the calibration arm assembly 200 moves the wafer along the Y-axis direction to the center of the trimming work disk 300; the trimming work disk loads the wafer and moves to the trimming station to perform the trimming operation. It should be noted that when the trimming work disk is located at the loading station, it can be considered that there is no deviation between the center of the trimming work disk and the center of the pre-calibration workbench 100 in the X-axis direction. In addition, the calibration arm assembly 200 is configured to have no movement along the X-axis direction, which can further reduce the position deviation caused by the X-axis movement alignment. The calibration arm assembly 200 only needs to move along the Y-axis direction to achieve the transfer of the wafer from the pre-calibration workbench 100 to the cutting worktable.

[0041] The semiconductor wafer trimming device provided by the embodiment of the present invention solves the problem of inconvenient calibration after placement due to the use of a hollow working suction cup in the wafer trimming equipment by setting a pre-calibration workbench 100 and a calibration arm assembly 200. This calibration arm also protects products with dimensional deviations well to avoid damage during the calibration process. In addition, the calibration structure is simple. After calibration, it only needs to be transferred to the trimming work disk 300 along the Y-axis direction. There is no need to consider the position deviation in the X-direction, so the calibration accuracy of hundreds of microns is achieved, and the entire calibration process is highly efficient. At the same time, by clamping and transporting the edge of the wafer, the traditional vacuum adsorption method is changed, and the pollution caused by dust in the vacuum air path is reduced.

[0042] In some embodiments, Figures 1 to 4 As shown, the calibration arm assembly 200 includes: a support plate 210 , a Y-axis motion unit 220 , a Z-axis motion unit 230 and a calibration mechanism 250 .

[0043] Specifically, the Y-axis motion unit 220 is installed on the support plate 210, and the support plate 210 is a connecting structure between the entire calibration mechanism 250 and the wafer trimming device platform. The Z-axis motion unit 230 is installed on the Y-axis motion unit 220, and the Y-axis motion unit 220 drives the Z-axis motion unit 230 to move along the Y-axis direction. The calibration mechanism 250 is fixed to the lower end of the Z-axis motion unit 230 through the Z-axis adapter plate 240, and the Z-axis motion unit 230 drives the calibration mechanism 250 to move along the Z-axis direction. The calibration mechanism 250 includes three groups of symmetrically arranged adjustment components, and the maximum stroke and minimum stroke of the three groups of adjustment components along their respective adjustment directions are the same. The three groups of adjustment components work simultaneously to adjust the wafer placed on the pre-calibration workbench 100 to the center of the pre-calibration workbench 100.

[0044] In some embodiments, Figure 3 and Figure 4 As shown, three groups of adjustment components are evenly distributed on the calibration arm base 251. The calibration arm base 251 is the supporting structure of the calibration mechanism 250. The center of the calibration arm base 251 is the intersection of the three groups of adjustment components. The angles between two adjacent groups of adjustment components are 120 degrees, so as to achieve uniform arrangement of the adjustment components, which is conducive to quickly adjusting the position of the wafer; the calibration arm base 251 is installed at the lower end of the Z-axis motion unit 230 through the hanging plate 252 located above the adjustment components, so as to facilitate the movement of the calibration arm assembly 200 along the Z-axis direction. A support column 257 is arranged between the hanging plate 252 and the calibration arm base 251, and the support column 257 is used to connect the hanging plate 252 and the calibration arm base 251. A leveling nut 259 is arranged between the support column 257 and the hanging plate 252, which is used to adjust the posture of the entire calibration arm base 251 and the parts installed on the calibration arm base 251, so as to avoid affecting the wafer calibration accuracy due to its own level problem.

[0045] In some embodiments, Figure 4 As shown, each set of adjustment components includes: a driving component 253, a guide mechanism 258, a tension spring 254 and a limit clamping mechanism 255.

[0046] Specifically, the limit clamping mechanism 255 is connected to the driving component 253, and slides along the guide mechanism 258 under the driving action of the driving component 253. During calibration and adjustment, the limit clamping mechanism 255 contacts the circumferential edge of the wafer and moves along the guide mechanism 258 to adjust the position of the wafer. The telescopic shaft of the driving component 253 is fixedly connected to the driving mounting seat 253a, and the lower end of the driving mounting seat 253a is installed on the guide mechanism 258, thereby driving the limit clamping mechanism 255 to move along the guide mechanism 258.

[0047] Optionally, the driving component 253 can be a screw motor or a linear motor, which drives the linear motion of the telescopic shaft to drive the limit clamping mechanism 255 to move along the guide mechanism 258. The guide mechanism 258 includes a slide rail and a slider that cooperates with the slide rail. The limit clamping mechanism 255 is connected to the slider and is driven by the screw motor to move along the slide rail. In addition, the calibration mechanism is protected by a sheet metal cover, and a joint 256 is provided on the sheet metal cover. The joint 256 is connected to an external air pump, and the dust falling into the cavity formed inside the sheet metal cover is absorbed by negative pressure through the joint 256, thereby maintaining the cleanliness of the inside of the calibration mechanism to a certain extent.

[0048] In some embodiments, continue to refer to Figure 4The limit clamping mechanism 255 includes: a buffer adapter block 255a, a calibration limit column 255c and a wedge block 255b. The slider of the guide mechanism 258 includes two parts, including an upper slider and a lower slider, and the wedge block 255b and the drive mounting seat 253a are respectively connected to the lower slider, so as to achieve a rigid connection between the two; the buffer adapter block 255a is installed on the upper slider of the guide mechanism 258, and the upper slider is connected to the drive mounting seat 253a through a tension spring 254, and the calibration limit column 255c is fixed to the lower end of the buffer adapter block 255a, so as to achieve a flexible connection between the calibration limit column 255c and the drive mounting seat 253a (the two are connected through the tension spring 254), so as to indirectly achieve the buffering of the buffer calibration limit column 255c through the tension spring 254, so as to avoid the risk of wafer fragmentation caused by the driving component 253 continuing to drive the calibration limit column 255c to move inward after the wafer is adjusted in place.

[0049] The calibration limit pins 255c are used to calibrate and adjust the wafer. Before the wafer is calibrated, the wafer is placed on the pre-calibration workbench 100. The calibration limit pins 255c are located outside the edge of the wafer. The corresponding calibration limit pins 255c are driven inward by the driving component 253 to drive the wafer to move toward the center of the pre-calibration workbench 100. The wedge blocks 255b move inward synchronously with the calibration limit pins 255c, and clamp and transport the edge of the wafer after the calibration and adjustment of the calibration limit pins 255c are completed. The wafer is held up by the inclined surfaces of the three wedge blocks 255b, and a large clamping force is not required to position and support the wafer. Compared with the transport mechanism of the suction cup, the secondary displacement after calibration can be avoided, which is conducive to improving the calibration accuracy.

[0050] It should be noted that before the calibration mechanism 250 calibrates the wafer, the center of the calibration mechanism 250 (the center of the calibration arm base 251) is aligned with the center of the pre-calibration workbench 100, so as to serve as a reference base for wafer calibration. Optionally, a first positioning component (not shown in the figure) is provided on the calibration mechanism 250, and the first positioning component is arranged at the bottom of the support plate 210. A second positioning component 120 corresponding to the first positioning component is provided on the pre-calibration workbench 100, and the second positioning component 120 is arranged on the upper surface of the pre-calibration workbench 100. The first positioning component and the second positioning component 120 are paired and sensed to realize the rapid positioning of the wafer on the pre-calibration workbench 100, that is, when the first positioning component and the second positioning component 120 are paired and sensed, it can be considered that the center positions of the two coincide and align.

[0051] In some embodiments, Figure 5 and Figure 6As shown, three positioning support structures 110 are arranged on the pre-calibration workbench 100. The three positioning support structures 110 are located near the edge of the pre-calibration workbench 100 and are arranged in a circular array. The top of the positioning support structure 110 is a slope structure 111 which is high in the middle and low at the edge. The slope structure 111 is used to support the wafer for calibration and adjustment. Moreover, when the wafer position is adjusted by the calibration limit column 255c, the contact area of ​​the wafer on the slope structure 111 is small, so that the resistance when the wafer moves is relatively small, which is conducive to rapid calibration of the wafer. The calibration process of the wafer is the process of aligning the center of the wafer with the center of the pre-calibration workbench 100.

[0052] In some embodiments, Figure 2 As shown, the semiconductor wafer trimming device further includes: a front cleaning assembly 600 , a back cleaning assembly 800 , a first transport assembly 500 and a second transport assembly 700 .

[0053] Specifically, the back cleaning assembly 800 is arranged on one side of the pre-calibration workbench 100, the front cleaning assembly 600 is arranged on one side of the back cleaning assembly 800 close to the loading unit, the first transport assembly 500 is used to transfer the trimmed wafer from the trimming work plate 300 to the front cleaning assembly 600, the second transport assembly 700 is used to transfer the wafer from the front cleaning assembly 600 to the back cleaning assembly 800 for back cleaning, the loading and unloading mechanism 900 is used to transfer the wafer from the back cleaning assembly 800 to the wafer box located on the loading unit, and the wafer box is located on the loading unit on the left side. Figure 2 The arrows in the figure indicate the entire transmission path of the wafer in the trimming device. The transmission path of the wafer in the semiconductor wafer trimming device is annular, which can make the structure of the entire semiconductor wafer trimming device more compact and is conducive to improving the overall transmission efficiency of the wafer trimming.

[0054] Optionally, the first transport assembly 500 can realize movement in the X-axis direction, movement in the Z-axis direction, and rotation in the Z-axis direction.

[0055] Optionally, the second transport assembly 700 can realize movement in the Y-axis direction, movement in the Z-axis direction, and rotation in the Z-axis direction.

[0056] The transport assembly in this embodiment has a Z-axis movement function, which can reduce the number of robotic arms in the entire device and make the structure of the entire device more compact.

[0057] Based on the same inventive concept, the embodiment of the present invention also provides a trimming method for a semiconductor wafer trimming device, based on a semiconductor wafer trimming device, including a loading unit, a loading and unloading mechanism 900, a calibration mechanism 250, a trimming work disk 300 and a trimming cutting mechanism 1000, the calibration mechanism 250 includes: a pre-calibration workbench 100, a calibration arm assembly 200 and a control unit, the control unit is electrically connected to the pre-calibration workbench 100 and the calibration arm assembly 200, the specific structure of the semiconductor wafer trimming device can refer to the content of the aforementioned embodiment, and will not be repeated here. Figure 7 As shown, the trimming method based on the semiconductor wafer trimming device includes the following steps:

[0058] S100 , controlling the loading and unloading mechanism 900 to transport the wafer to the pre-alignment workbench 100 .

[0059] S200 , controlling the calibration arm assembly 200 to calibrate the wafer placed on the pre-calibration workbench 100 , so as to adjust the wafer to the center of the pre-calibration workbench 100 .

[0060] S300, controlling the X-axis motion unit 400 of the trimming work disk to operate so as to drive the trimming work disk to move along the X-axis direction to the loading station.

[0061] S400 , controlling the calibration arm assembly 200 to move the wafer onto the trimming work disk 300 along the Y-axis direction.

[0062] S500, controlling the X-axis motion unit 400 of the trimming work disk to operate so as to drive the trimming work disk 300 to move to the trimming station along the X-axis direction.

[0063] S600 , controlling the trimming and cutting mechanism 1000 to perform a trimming operation on the wafer on the trimming work disk 300 .

[0064] Optionally, three positioning support structures 110 are provided on the pre-calibration workbench 100, and the three positioning support structures 110 are arranged in a circular array near the edge of the pre-calibration workbench 100, and the top of the positioning support structure 110 is an inclined structure 111 with a high middle and a low edge. In S200, the calibration arm assembly 200 is controlled to calibrate the wafer placed on the pre-calibration workbench 100 to adjust the wafer to the center of the pre-calibration workbench 100, specifically including:

[0065] The edge of the wafer placed on the pre-alignment workbench 100 is limited and moved by controlling the alignment arm assembly 200 , so that the wafer moves on the surface of the inclined surface structure 111 to be adjusted to the center of the pre-alignment workbench 100 .

[0066] The semiconductor wafer trimming method provided by the embodiment of the present invention solves the problem of inconvenient calibration after placement due to the use of a hollow working suction cup in the wafer trimming equipment by setting a pre-calibration workbench and a calibration arm assembly. This calibration arm also protects products with dimensional deviations well to avoid damage during the calibration process. In addition, the calibration structure is simple. After calibration, it only needs to be transferred to the trimming work disk along the Y-axis direction without considering the position deviation in the X-direction. The calibration accuracy of hundreds of microns is achieved, and the entire calibration process is highly efficient. At the same time, by clamping and transporting the edge of the wafer, the traditional vacuum adsorption method is changed, and the pollution caused by dust in the vacuum air path is reduced.

[0067] Those skilled in the art will appreciate that the various operations, methods, steps, measures, and schemes discussed in the present invention may be alternated, modified, combined, or deleted. Further, other steps, measures, and schemes in the various operations, methods, and schemes discussed in the present invention may also be alternated, modified, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and schemes in the prior art that are similar to those disclosed in the present invention may also be alternated, modified, rearranged, decomposed, combined, or deleted.

[0068] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0069] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0070] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific conditions.

[0071] In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. It should be understood that although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily performed in sequence in the order indicated by the arrows. Unless clearly stated herein, there is no strict order restriction on the execution of these steps, and they may be performed in other orders. Moreover, at least a portion of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily performed at the same time, but may be performed at different times, and their execution order is not necessarily performed in sequence, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor wafer trimming device, comprising a loading unit, a loading and unloading mechanism, a calibration mechanism, a trimming work disk and a trimming cutting mechanism, wherein the trimming work disk is mounted on an X-axis motion unit, and is characterized in that: The calibration mechanism comprises: a pre-calibration workbench, a calibration arm assembly and a control unit, wherein the calibration arm assembly is arranged above the pre-calibration workbench, and the control unit is electrically connected to the pre-calibration workbench and the calibration arm assembly; The control unit is used to control the calibration arm assembly to calibrate the wafer placed on the pre-calibration workbench to adjust the wafer to the center of the pre-calibration workbench, and after calibration, control the calibration arm assembly to clamp the edge of the wafer and move it along the Y-axis direction to the center of the trimming work disk to wait for subsequent trimming operations; The control unit is used to control the operation of the X-axis motion unit to drive the trimming work disk to move along the X-axis direction to achieve switching between the trimming station and the loading station. When the trimming work disk is located at the loading station and is in an unloaded state, the calibration arm assembly moves the wafer along the Y-axis direction to the center of the trimming work disk; the trimming work disk loads the wafer and moves to the trimming station to perform trimming operations.

2. The semiconductor wafer trimming device according to claim 1, characterized in that: The calibration arm assembly comprises: a support plate, a Y-axis motion unit, a Z-axis motion unit and a calibration mechanism; The Y-axis motion unit is mounted on the support plate, and the Z-axis motion unit is mounted on the Y-axis motion unit, and the Y-axis motion unit drives the Z-axis motion unit to move along the Y-axis direction; the calibration mechanism is fixed to the lower end of the Z-axis motion unit, and the Z-axis motion unit drives the calibration mechanism to move along the Z-axis direction; The calibration mechanism comprises three groups of symmetrically arranged adjustment components, and the wafer placed on the pre-calibration workbench is adjusted to the center of the pre-calibration workbench through the three groups of adjustment components.

3. The semiconductor wafer trimming device according to claim 2, characterized in that: The three groups of adjustment components are evenly distributed on the calibration arm base, and the angles between two adjacent groups of adjustment components are 120 degrees; the calibration arm base is installed on the lower end of the Z-axis motion unit through a hanging plate located above the adjustment components.

4. The semiconductor wafer trimming device according to claim 3, characterized in that: Each set of the adjustment components includes: a driving component, a guide mechanism, a tension spring and a limit clamping mechanism; The limit clamping mechanism is connected to the driving component through the tension spring, and slides along the guide mechanism under the driving action of the driving component. During calibration and adjustment, the limit clamping mechanism contacts the circumferential edge of the wafer and moves along the guide mechanism to adjust the position of the wafer. The tension spring is used for buffering when the limit clamping mechanism clamps the wafer.

5. The semiconductor wafer trimming device according to claim 4, characterized in that: The limit clamping mechanism comprises: a buffer transfer block, a calibration limit column and a wedge block; The buffer adapter block is installed on the slider of the guide mechanism, the tension spring is arranged between the mounting seat of the driving component and the buffer adapter block, the wedge block and the calibration limit column are both fixed at the lower end of the buffer adapter block, the calibration limit column is used to calibrate and adjust the wafer, and the wedge block is used to clamp and carry the edge of the wafer after calibration and adjustment.

6. The semiconductor wafer trimming device according to claim 2, characterized in that: Three positioning support structures are arranged on the pre-calibration workbench, and the three positioning support structures are arranged in a circular array near the edge of the pre-calibration workbench. The top of the positioning support structure is a slope structure with a high middle and a low edge. The slope structure is used to support the wafer to facilitate calibration and adjustment.

7. The semiconductor wafer trimming device according to claim 6, characterized in that: A first positioning component is provided on the calibration arm, and a second positioning component corresponding to the first positioning component is provided on the pre-calibration workbench. The first positioning component is provided at the bottom of the support plate, and the second positioning component is provided on the upper surface of the pre-calibration workbench. The first positioning component and the second positioning component are paired and sensed to realize rapid positioning of the wafer on the pre-calibration workbench.

8. The semiconductor wafer trimming device according to claim 1, characterized in that: Also includes: A front cleaning component, a back cleaning component, a first transport component, and a second transport component; The back side cleaning component is arranged on one side of the pre-calibration workbench, and the front side cleaning component is arranged on the side of the back side cleaning component close to the loading unit. The first transport component is used to transfer the trimmed wafer from the trimming work disk to the front side cleaning component, and the second transport component is used to transfer the wafer from the front side cleaning component to the back side cleaning component for back side cleaning. The loading and unloading mechanism is used to transfer the wafer from the back side cleaning component to the wafer box located on the loading unit, and the transmission path of the wafer in the semiconductor wafer trimming device is annular.

9. The semiconductor wafer trimming device according to claim 8, characterized in that: The first transport assembly can realize movement in the X-axis direction, movement in the Z-axis direction, and rotation in the Z-axis direction; The second transport assembly can realize movement in the Y-axis direction, movement in the Z-axis direction, and rotation in the Z-axis direction.

10. A semiconductor wafer trimming method, based on the semiconductor wafer trimming device according to any one of claims 1 to 9, characterized in that: The semiconductor wafer trimming method comprises: S100, controlling the loading and unloading mechanism to move the wafer to the pre-calibration workbench; S200, controlling the calibration arm assembly to calibrate the wafer placed on the pre-calibration workbench to adjust the wafer to the center of the pre-calibration workbench; S300, controlling the X-axis motion unit of the trimming work disk to work, so as to drive the trimming work disk to move to the loading station along the X-axis direction; S400, controlling the calibration arm assembly to move the wafer onto the trimming work disk along the Y-axis direction; S500, controlling the X-axis motion unit of the trimming work disk to work, so as to drive the trimming work disk to move to the trimming station along the X-axis direction; S600, controlling the trimming and cutting mechanism to perform a trimming operation on the wafer on the trimming work disk.

11. The semiconductor wafer trimming method according to claim 10, characterized in that: The pre-calibration workbench is provided with three positioning support structures, which are arranged in a circular array near the edge of the pre-calibration workbench, and the top of the positioning support structure is a slope structure with a high middle and a low edge. In S200, the control calibration arm assembly calibrates the wafer placed on the pre-calibration workbench to adjust the wafer to the center of the pre-calibration workbench, including: The calibration arm assembly is controlled to limit the edge of the wafer placed on the pre-calibration workbench so that the wafer moves on the inclined surface to be adjusted to the center of the pre-calibration workbench.

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