Assembly including semiconductor element and temperature sensor unit for detecting temperature of semiconductor element, and switching device

Abstract

The invention relates to an assembly (10) comprising a semiconductor element (310) and a temperature sensor unit (100, 200) for detecting a temperature of the semiconductor element (310), the semiconductor element (310) having a recess (312), the temperature sensor unit (100, 200) having a housing element (110, 210) and a temperature sensor element (120, 220), the housing element (110, 210) having a first housing section (111, 211) and a second housing section (112, 212), wherein the second housing section (112, 212) protrudes from the first housing section (111, 211), the temperature sensor element (120, 220) is arranged at least partially in the second housing section (111, 211), and the second housing section (112, 212) is arranged in the recess (312) of the semiconductor element (310); the invention further relates to a switching device (300) having at least one such component (10) and at least one further semiconductor element (310).

Description

Technical Field

[0001] The invention relates to a component having a semiconductor element and a temperature sensor unit for detecting the temperature of the semiconductor element, and a switching device having at least one such component. Background Art

[0002] The (half-bridge switching) assembly can be used, for example, in a rectifier, for example as an inverse rectifier or an inverter for converting between a DC voltage and an AC voltage or vice versa. For example, such a switching device can be used in a rectifier or converter in a (motor) vehicle in order to convert the voltage between a DC electrical system and an electric machine operable with a multiphase AC voltage.

[0003] Such a rectifier has one half-bridge per phase, each half-bridge having a high-side switch and a low-side switch. Individual, discrete semiconductor elements can be used as high-side or low-side switches, for example individual transistors, such as FETs, MOSFETs, IGBTs, etc. Furthermore, a large number of such half-bridges, each having a first semiconductor element and a second semiconductor element, can be connected in parallel per phase, wherein the first semiconductor elements of these parallel half-bridges form the high-side switches, and wherein the second semiconductor elements of these parallel half-bridges form the low-side switches.

[0004] Temperature sensors can be used to detect the temperature within a half-bridge, for example for overtemperature protection or power reduction. However, the placement of such temperature sensors often proves to be difficult, for example due to mechanical or spatial constraints within the power module or due to electrical isolation distances. Summary of the invention

[0005] Against this background, an assembly having a semiconductor element and a temperature sensor unit for detecting the temperature of the semiconductor element and a switching device having at least one such assembly are proposed, having the features of the independent patent claims. Advantageous developments are the subject matter of the dependent claims and the following description.

[0006] The invention adopts the measure of combining a specially designed temperature sensor unit with a (general) semiconductor element with a recess (especially a through hole) to form a component, wherein on the one hand, the temperature sensor element is arranged in the recess and is therefore as close to the barrier layer as possible and is not affected by the environment, and on the other hand, the component itself is mechanically very simple and reliable. The semiconductor element with the recess can be, for example, a semiconductor element according to the TO standard (transistor guide, English: "transistor outline"), such as TO-3P, TO-264, TO-247, etc. The semiconductor element is in particular a discrete semiconductor switch or transistor, such as MOSFET, IGBT, etc.

[0007] The temperature sensor unit has a housing element and a temperature sensor element, wherein the housing element has a first housing section and a second housing section, wherein the second housing section protrudes or projects from the first housing section. The temperature sensor element is at least partially arranged in the second housing section. The second housing section fits into the recess, in particular it fits precisely, i.e. the second housing section and the recess are complementary, so as to keep the thermal resistance between the semiconductor element and the temperature sensor unit as small as possible. For example, the second housing section can have a cylindrical shape to complement the through-hole.

[0008] In an embodiment of the present invention, the first housing section forms a base body of the temperature sensor unit, and the second housing section forms a projection rising or protruding from the base body.

[0009] The temperature sensor element serves to measure the temperature and may be, for example, a thermistor, in particular a thermistor having a negative temperature coefficient (NTC).

[0010] The invention further relates to a switching device having at least one component and at least one further semiconductor element, wherein the semiconductor element of the at least one component and the at least one further semiconductor element are connected in parallel or wherein the semiconductor element of the at least one component and the at least one further semiconductor element form a half bridge.

[0011] At least one further semiconductor element may also be part of the assembly according to the invention, but this is not mandatory. If a plurality of further semiconductor elements are part of a switching device, one or more or all of the plurality of further semiconductor elements may be part of the assembly according to the invention, but this is not mandatory.

[0012] Such a switching device consisting of a plurality of semiconductor elements connected in parallel can be used as a switch to switch a current that exceeds the current conductivity of a single semiconductor element. Such a switching device can also have two sets of semiconductor elements connected in parallel, which form a half bridge in an embodiment of the present invention. For example, one set can be used as a high-side switch and the other set can be used as a low-side switch.

[0013] Developments and advantages of the assembly according to the invention and of the switching device according to the invention follow in a corresponding manner from the present description.

[0014] The temperature sensor unit is advantageously a modular component, which can be flexibly arranged on the semiconductor element in order to detect the temperature of the respective semiconductor element. Here, the temperature sensor unit is fastened or fixed to the respective semiconductor element or fastened or fixed relative to the respective semiconductor element in such a way that the second housing section is located in the recess of the semiconductor element. As described above, the first housing section can, for example, form a matrix. For example, the first housing section can be designed to fasten or fix the temperature sensor unit on the semiconductor element. The second housing section is used to accommodate the actual measurement sensor system. The shape and size of the second housing section are particularly adapted to the shape and size of the recess. The housing element can, for example, be made of plastic and can, for example, be produced by a plastic injection molding method.

[0015] Advantageously, it is possible to flexibly select, for example, depending on the temperature distribution, the maximum temperature and / or the minimum temperature of the switching device, on which specific semiconductor element or on which specific semiconductor element of the switching device the corresponding temperature sensor unit is arranged.

[0016] Therefore, the present invention provides the possibility of conveniently arranging the temperature sensor directly or in close proximity to the corresponding semiconductor element in a structurally simple and space-saving manner, so that the sensor can, for example, reliably and accurately detect the temperature of the semiconductor element for overheat protection or power reduction. The temperature sensor element can advantageously be placed as close as possible to the semiconductor element or as close as required. The shape and size of the temperature sensor unit, in particular the housing element, can be adapted to the conditions and spatial conditions or mechanical or spatial limitations within the corresponding power module with the switching device. The recess can, for example, completely penetrate the semiconductor element and can be conventionally provided for mechanical fastening, for example by screws, bolts, etc. The recess already exists in the semiconductor element and is now used to place the temperature sensor. In this way, the temperature sensor can be very close to the barrier layer of the semiconductor element, so that any deviation of the measured temperature from the actual barrier layer temperature can be easily compensated, for example using software. In addition, the temperature sensor element can be electrically insulated by being arranged in the housing element, in particular electrically insulated from the high voltage potential of the electrical switching device.

[0017] Conventionally, temperature sensors are usually arranged on the housing of the corresponding power module, but this may involve complex and difficult fastening of the sensor. In addition, such an arrangement may make it more difficult to ensure the connection of the sensor and to protect the sensor from mechanical or environmental hazards. In contrast, the temperature sensor unit of the present invention can be arranged on the semiconductor element in a simple manner, thereby providing protection against mechanical or environmental influences. In addition, the temperature sensor unit enables the connection of the temperature sensor element to be easily fixed.

[0018] According to one embodiment, the temperature sensor unit also has at least two electrical circuit elements. Each electrical circuit element has a first circuit section and a second circuit section. The respective first circuit section is arranged inside the first housing section and is electrically connected to the temperature sensor element. The respective second circuit section protrudes from the first housing section. Therefore, these circuit elements are particularly provided for the electrical connection of the temperature sensor element. Two such circuit elements can be conveniently provided.

[0019] The first line section for the electrical contacting of the sensor element can thus be arranged in a structurally simple and space-saving manner inside the housing element, thereby enabling in particular protection against external influences and electrical insulation. By arranging the temperature sensor and the first line section connected thereto inside the housing element, they can be electrically insulated, in particular from the high voltage potential of the semiconductor element.

[0020] The second line section may protrude from the first housing section, for example in the form of a pin or a pin.The second line section may in particular be provided for connecting the temperature sensor element to a power supply and / or a computing unit for evaluating the detected sensor value.

[0021] For example, the electrical connection means or the electrical connection of the temperature sensor element can be guided from the second housing section into the first housing section in order to be electrically connected there to the first line section. For example, to produce the temperature sensor unit, the temperature sensor element can first be connected to the line element, and then the housing element can be formed around the unit of temperature sensor element and line element, for example by an injection molding method. Alternatively, the housing element can first be produced, for example by an injection molding method, and then the temperature sensor element and the line element can be introduced into the housing element and, if necessary, can be cast there.

[0022] According to one embodiment, the semiconductor element also has at least two electrical connections. Then, the second line section is oriented parallel to or at least substantially parallel to the connection of the semiconductor element. The connection of the semiconductor element can, for example, have a drain, a source and a gate connection (or a collector / base / emitter) and further, for example, a Kelvin connection (also referred to as a Kelvin source connection or an auxiliary source connection). The individual connections of the semiconductor element can each be specifically designed as a pin or a pin. The second line section and the connection of the semiconductor element can in particular be arranged adjacent to each other or in close proximity to each other. In this way, the connection of the second line section to other elements and therefore the connection of the temperature sensor element to, for example, a power supply and / or a computing unit can be realized in a simple manner. It is particularly advantageous that the second line section can correspond to the connection of the semiconductor element or be electrically connected to other elements of the switching device together with the connection of the semiconductor element.

[0023] According to one embodiment, the second line sections of the temperature sensor unit are all electrically connected to a control circuit board or a printed circuit board of the switching device, for example, by welding or sintering. The single or multiple connection parts of the semiconductor element are also advantageously connected to the control circuit board, in particular also by welding or sintering. In particular, the control circuit board is provided for controlling the semiconductor elements, for example, transmitting control signals to the respective semiconductor elements. For this purpose, the control circuit board can be connected to a calculation or control unit. In particular, the temperature sensor element can be connected to the calculation unit via the second line section and the control circuit board in order to transmit the detected sensor value to the calculation unit. The second line section can advantageously be electrically connected to the control circuit board together with the connection part of the semiconductor element, thereby significantly simplifying the contacting of the temperature sensor element. The length of the second line section can be advantageously adapted according to the position of the control circuit board, so that the connection with the control circuit board can be established in a simple manner.

[0024] According to one embodiment, the main extension plane of the control circuit board is oriented perpendicularly or at least substantially perpendicularly to the main extension plane of the respective semiconductor element. One or more connecting parts of the respective semiconductor element of the switching device are connected to the control circuit board. Since the connecting parts are particularly oriented parallel to the main extension plane of the respective semiconductor element, the connecting parts are also advantageously oriented perpendicularly or at least substantially perpendicularly to the control circuit board. Correspondingly, the second line section of the temperature sensor unit is also advantageously oriented perpendicularly or at least substantially perpendicularly to the control circuit board.

[0025] It is particularly advantageous if the respective connections of the semiconductor element and the second line section can be designed as pins or pins and contacted with the control circuit board by means of through-hole assembly or plug-in assembly (English: "through-hole technology", THT, or "pin-in-hole technology", PIH). For this purpose, the corresponding pins penetrate the control circuit board, for example, through corresponding connection openings, in particular in the form of holes or holes, and are connected to the control circuit board in a material-fitting manner, in particular by soldering or sintering connections. In this way, a particularly simple contacting of the temperature sensor element can be achieved. It is therefore particularly advantageous if the temperature sensor unit is used as an integrated temperature sensor for through-hole assembly (THT) or for semiconductor elements connected to a circuit board or printed circuit board using THT.

[0026] According to one embodiment, the line elements are each designed as a strip or a strip, in particular as a copper strip. The length of these individual strips can be adapted to the specific situation, for example depending on the size and shape of the first housing section, the distance between the first housing section and the control circuit board, etc.

[0027] According to one embodiment, the temperature sensor unit further comprises at least one mechanical connection element, which is designed to be mechanically connected to a carrier for the semiconductor element, in particular to a cooling body on which the semiconductor element is mounted, such as a cooling body of a switch device. For example, each mechanical connection element can be designed as a projection, a pin, a bolt, a latching hook, etc., which can be inserted into a corresponding recess or opening in the carrier.

[0028] According to one embodiment, at least one mechanical connection element adjoins the first housing section at a predetermined angle. For example, the connection elements can each be designed as a protrusion, a pin, a latching hook or a bolt adjoining the first housing section at a right angle.

[0029] According to one embodiment, the main extension direction of the at least one mechanical connecting element is oriented parallel or at least substantially parallel to the main extension direction of the second housing section. In particular, the at least one mechanical connecting element and the second housing section are arranged on the same side of the first housing section, advantageously on the side facing the respective semiconductor component. It is particularly advantageous that the second housing section can thus be inserted into the recess of the respective semiconductor component and at the same time the at least one mechanical connecting element can be inserted into the respective opening in the carrier on which the respective semiconductor component is arranged.

[0030] According to one embodiment, the switch device also has a cooling body, wherein each semiconductor element is arranged on one or more side surfaces of the cooling body. Each semiconductor element is in thermal contact with the cooling body. The cooling body is advantageously arranged to dissipate waste heat from each semiconductor element. For example, the cooling body can be fluid-cooled and, for example, have an inlet and an outlet for a corresponding cooling fluid. The cooling fluid can, for example, include oil, water, air, etc. The individual semiconductor elements are advantageously arranged relative to the cooling body so that the respective main extension planes of the individual semiconductor elements are arranged parallel to or at least substantially parallel to the respective side surfaces of the cooling body. The control circuit board is advantageously arranged perpendicular to or at least substantially perpendicular to the side surfaces of the cooling body.

[0031] For example, all semiconductor elements may be arranged together on a single side surface of the cooling body. Furthermore, for example, a first number of semiconductor elements (e.g. all semiconductor elements used as high-side switches) may be arranged on a first side surface of the cooling body, and a second number of semiconductor elements (e.g. all semiconductor elements used as low-side switches) may be arranged on a second side surface of the cooling body. The first side surface and the second side surface may, for example, be side surfaces of the cooling body that are opposite to each other or face away from each other or are opposite to each other.

[0032] In particular, each semiconductor element is electrically insulated from the cooling body by an electrical semiconductor element insulating layer. The semiconductor element insulating layers respectively and particularly represent a thermal interface material (English: "thermal interface material", TIM) between the corresponding semiconductor element and the cooling body and can each have a thermal resistance as low as possible or a thermal conductivity as high as possible. In this way, the thermal resistance between each semiconductor device and the cooling body can be reduced, so that heat can be effectively dissipated from the semiconductor device to the cooling body. For example, the semiconductor element insulating layers can be made of metallized ceramics and / or ceramic materials, such as aluminum oxide (Al2O3), aluminum nitride (AlN) or silicon nitride (Si3N4).

[0033] According to one embodiment, at least one mechanical connection element of the temperature sensor unit is designed to be mechanically connected to a cooling body of the switchgear. For this purpose, the cooling body has, for example, a corresponding opening into which the corresponding connection element can be inserted. Since the corresponding semiconductor element is arranged in particular directly or in the immediate vicinity of the cooling body, it is particularly advisable to fasten the temperature sensor unit to the cooling body in this way.

[0034] According to one embodiment, the temperature sensor units are respectively arranged on two semiconductor elements of the switch device, wherein the two semiconductor elements are arranged at opposite ends of the corresponding side surface of the cooling body. In particular, the two semiconductor elements can be arranged at opposite ends of the corresponding side surface relative to the flow direction of the cooling fluid through the cooling body. For example, the fluid inlet for the cooling fluid can be located near the first end of the corresponding side surface, and the fluid outlet for the cooling fluid can be located near the opposite second end. The semiconductor element arranged at the first end of the side surface close to the fluid inlet is in particular the semiconductor element with the lowest temperature and the best cooling among the semiconductor elements arranged on the side surface. Correspondingly, the semiconductor element arranged at the second end of the side surface close to the fluid outlet is in particular the semiconductor element with the highest temperature and the worst cooling among the semiconductor elements arranged on the side surface. With the help of the temperature sensor units arranged on the two semiconductor elements, the highest and lowest temperatures of the semiconductor elements arranged on the side surface can be detected. The temperatures of the remaining semiconductor elements arranged on the side surface can be advantageously estimated or interpolated based on the detected maximum and minimum temperatures. If a plurality of semiconductor elements are respectively arranged on a plurality of side surfaces of the cooling body, the temperature sensor units may be respectively arranged on two semiconductor elements arranged at opposite ends of the corresponding side surfaces.

[0035] According to one embodiment, the switch device has at least one clamping element, which is designed to press one or more semiconductor elements against the cooling body. For example, a separate clamping element can be provided for each semiconductor element, or, for example, a common clamping element can also be provided for a plurality of semiconductor elements. If the semiconductor elements are arranged, for example, on two different side surfaces of the cooling body, a first clamping element can be provided, for example, for the first side surface of the cooling body, in order to press the semiconductor elements arranged there against the first side surface, and a second clamping element can be provided, for example, for the second side surface, in order to press the semiconductor elements arranged there against the second side surface. With the aid of these clamping elements, the individual semiconductor elements can be connected to the cooling body in a force-fitting manner, in particular in a manner that can be easily released again. Thus, advantageously, a corresponding recess in the individual semiconductor elements (which recess can usually be provided for fixing by screws or bolts) is not required for fastening the semiconductor elements to the cooling body, and the recess can be used to accommodate the second housing section and thus the temperature sensor element.

[0036] In particular, half-bridge switching devices are suitable for use in (motor) vehicles in order to convert voltages between a DC electrical system and an electric machine operable with a multi-phase AC voltage in a powerful manner. The switching device can, for example, be part of a rectifier or inverter for controlling a plurality of phases of an electric machine, wherein, for example, a half-bridge is provided in each case for controlling one phase in each case.

[0037] The invention is particularly suitable for half-bridge switching devices, as described in the applicant's unpublished patent applications DE 10 2023 121 301.6 and DE 10 2023 121 303.2. In these half-bridge switching devices, a large number of semiconductor elements are arranged on a cooling body, and a printed circuit board or a control circuit board can be arranged perpendicular to the cooling body. The proposed temperature sensor unit can be arranged particularly advantageously on one or more of these semiconductor elements.

[0038] Further advantages and improvements of the invention are apparent from the description and the accompanying drawings.

[0039] The invention is schematically illustrated in the drawings using exemplary embodiments and is described below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG. 1 schematically shows views a) to e) of an embodiment of a temperature sensor unit for use in an assembly according to the invention.

[0041] FIG. 2 schematically shows views a) and b) of a further embodiment of a temperature sensor unit for use in an assembly according to the invention.

[0042] Figure 3An exemplary embodiment of a switching device according to the invention is schematically shown, which has two components according to an embodiment of the invention. DETAILED DESCRIPTION

[0043] In FIG. 1 , a temperature sensor unit 100 for use in an assembly according to the invention is schematically shown in a number of views. Figure 1a and 1d The temperature sensor unit 100 is shown in a three-dimensional diagram. Figure 1b Shown in front view and Figure 1c The following view shows. Figure 1e The front view shows Figure 1b A similar temperature sensor unit 100 , but in a transparent view so that the components within the temperature sensor unit 100 are also shown.

[0044] The temperature sensor unit 100 is used to detect the temperature of a semiconductor component, such as a metal oxide semiconductor field effect transistor (MOSFET) or a bipolar transistor with an insulated gate electrode (IGBT). The semiconductor component has a surface and a recess extending from the surface and extending into the semiconductor component (see Figure 3 ).

[0045] The temperature sensor unit 100 has a housing element 110, which has a first housing section 111 and a second housing section 112, wherein the main extension plane of the first housing section 111 is oriented at a predetermined angle to the main extension direction of the second housing section 112. In the example shown in FIG. 1 , the main extension plane of the first housing section 111 extends parallel to the xy plane, and the main extension direction of the second housing section 112 extends parallel to the z direction. The main extension plane of the first housing section 111 and the main extension direction of the second housing section 112 are therefore oriented at right angles to each other. For example, the second housing section 112 is cylindrical.

[0046] The temperature sensor unit 100 further comprises a temperature sensor element 120, for example a thermistor with a negative temperature coefficient (NTC). The temperature sensor element 120 is arranged at least partially in the second housing section 112. For example, a measuring sensor system of the temperature sensor element 120 is arranged inside the second housing section 112. An electrical connection 121 of the temperature sensor element 120 protrudes from the second housing section 112 into the first housing section 111, for example.

[0047] The second housing section 112 is designed to be inserted into a recess of the semiconductor element. In this way, the temperature sensor element 120 can be introduced directly into the semiconductor element in order to detect the temperature within the semiconductor element.

[0048] The temperature sensor unit 100 further comprises circuit elements 130, each having a first circuit section 131 and a second circuit section 132, wherein the respective first circuit section 131 is arranged inside the first housing section 111 and is respectively electrically connected to the temperature sensor element 120, and wherein the respective second circuit section 132 protrudes from the first housing section 111. For example, the electrical connection device 121 of the temperature sensor element 120, which protrudes from the second housing section 112 into the first housing section 111, is electrically connected to the first circuit section 131, for example by a solder connection. The second circuit section 132 protrudes from the first housing section 111, for example as a connection in the form of a pin or a pin. In particular, the second circuit section 132 extends parallel to the main extension plane of the first housing section 111 and therefore also parallel to the xy plane. For example, the circuit elements 130 can each be designed as a copper strip or a copper strip.

[0049] Housing element 110 is made of plastic, for example, and is produced, for example, by a plastic injection molding method. By arranging temperature sensor element 120 and first line section 131 within housing element 110 , they can be electrically insulated, in particular from the high voltage potential of the semiconductor element.

[0050] The temperature sensor unit 100 also has two mechanical connection elements 140, which are designed to be mechanically connected to a carrier for the semiconductor element, for example to a cooling body. For example, these mechanical connection elements 140 are each designed as a projection, a pin, a latching hook or a bolt. The two mechanical connection elements 140 are each adjacent to the first housing section 111 at a predetermined angle, in particular at a right angle. The main extension direction of each mechanical connection element 140 is oriented parallel to the main extension direction of the second housing section 112 and therefore extends in the z direction.

[0051] An embodiment of a temperature sensor unit 200 which can be used within the scope of the present invention is also schematically shown in FIG. Figure 2a In stereogram and Figure 2b Compared with the temperature sensor unit 100 of FIG1 , the same or structurally identical elements of the temperature sensor unit 200 shown in FIG2 are denoted by reference numerals with a value of “100” added thereto.

[0052] Compared to the temperature sensor unit 100 of FIG. 1 , the temperature sensor unit 200 of FIG. 2 has an opening 213 in the first housing section 211. Through the opening 213, the temperature sensor element 220 can be easily inserted into the second housing section 212 and can be removed or replaced if necessary. In addition, the connection device 221 of the temperature sensor element 220 can be connected to the first line section 231 through the opening 213. The opening 213 is used to accommodate the temperature sensor element.

[0053] Figure 3 An embodiment of a switchgear according to the invention is shown in a schematic side view and is referenced 300, wherein the switchgear 300 has a plurality of temperature sensor units 100 as part of an assembly 10 according to an embodiment of the invention shown in Fig. 1. Each of the two assemblies 10 has a semiconductor element 310 and a temperature sensor unit 100 for detecting the temperature of the semiconductor element 310.

[0054] The switching device 300 is provided, for example, for use in a (motor) vehicle in order to convert a voltage between a DC electrical system and an electrical machine operable with a multi-phase AC voltage.

[0055] The switch device 300 has a large number of semiconductor elements 310, two of which are part of the component 10 (i.e. connected to the temperature sensor unit) and the other three are not. Each individual semiconductor element 310 is designed as a MOSFET, for example, and each has a surface 311 and a recess 312 extending from the surface 311 and extending into the semiconductor element 310. In addition, the semiconductor elements 310 each have a plurality of connections 313, in particular a drain, a source, a gate and a Kelvin connection, respectively.

[0056] The switch device 300 further includes a cooling body 320, wherein each semiconductor element 310 is arranged on one or more side surfaces of the cooling body 320. Figure 3 In the schematic side view of FIG. 3 , the first side surface 321 of the cooling body 320 can be seen, on which five semiconductor elements 310 are arranged. For example, the five semiconductor devices 310 are also arranged on the second side surface opposite to the first side surface 321 in a corresponding manner. Figure 3 For example, the semiconductor elements 310 facing each other on both side surfaces each form a half bridge.

[0057] In this case, the switching device 300 therefore has five half-bridges, wherein the five half-bridges are connected in parallel, for example. For example, the semiconductor elements 310 arranged on the first side surface 321 can be used together as a low-side switch, and the semiconductor elements 310 arranged on the second side surface can be used together as a high-side switch. For example, the switching device 300 is therefore designed as a phase half-bridge for controlling one phase of a motor. In a multiphase inverter of a (motor) vehicle, a plurality of such switching devices 300 can be provided, for example three switching devices 300 for a three-phase motor. Alternatively, the half-bridges can also be operated individually, so that five phases or three phases and two other currents can also be switched using the switching device 300 shown as having five half-bridges.

[0058] Each semiconductor element 310 is in thermal contact with the cooling body 320 and is thermally insulated from the cooling body 320 by a semiconductor element insulating layer 314. The semiconductor element insulating layers 314 represent thermal interface materials (English: "thermal interface material", TIM) between the corresponding semiconductor element 310 and the cooling body 320, and each has a thermal resistance as low as possible or a thermal conductivity as high as possible. For example, the semiconductor element insulating layers are made of metallized ceramics and / or ceramic materials, such as aluminum oxide (Al2O3), aluminum nitride (AlN) or silicon nitride (Si3N4).

[0059] Therefore, the thermal resistance between each semiconductor element 310 and the cooling body 320 can be reduced, so that heat can be effectively dissipated from the semiconductor element 310 to the cooling body 320. The cooling body 320 can be, for example, fluid-cooled and have an inlet or inlet 323 for supplying a cooling fluid and an outlet or outflow port 324 for discharging the cooling fluid. The cooling fluid can include, for example, oil, water, air, etc.

[0060] Each semiconductor element 310 is arranged relative to the cooling body 320 such that a respective surface 311 of each semiconductor element 310 is arranged parallel or at least substantially parallel to a respective side surface 321 of the cooling body 320 .

[0061] The half-bridge switching device 300 further has a control circuit board 330 and a printed circuit board 340. The main extension plane of the control circuit board 330 is oriented perpendicularly to the respective surface 311 of the individual semiconductor elements 310 and thus perpendicularly to the side surface 321 of the cooling body 320. In addition, the main extension plane of the control circuit board 330 is oriented parallel to the main extension plane of the printed circuit board 340. The control circuit board 330 can be provided for sending and receiving logic signals, in particular for driving the individual semiconductor elements 310. The printed circuit board 340 can be designed, for example, as a multilayer board, wherein the individual layers of the printed circuit board 340 can be provided as busbars for energizing the semiconductor elements 310.

[0062] The individual connections 313 of the semiconductor element 310, in particular the corresponding gate and Kelvin connections, are electrically connected to the control circuit board 330, in particular by through-hole or plug-in assembly (English: "through-hole technology", THT). The remaining connections 313 of the semiconductor element 310, in particular the corresponding drain and source connections, are electrically connected to the printed circuit board 340, in particular also by means of through-hole assembly (THT).

[0063] As shown in FIG1 , the temperature sensor units 100 are respectively arranged on a plurality of semiconductor elements 310. The respective second housing sections 112 of the respective temperature sensor units 100 are inserted into the recesses 312 of the respective semiconductor elements 310. In addition, the respective mechanical connection elements 140 of the respective temperature sensor units 100 are mechanically connected to the cooling body 320. For this purpose, the connection elements 140 are each inserted into the respective recesses 322 in the cooling body 320.

[0064] like Figure 3 As shown, for example, the temperature sensor units 100 are respectively arranged on two semiconductor elements 310 arranged on the first side surface 321. For example, these semiconductor elements 310 are arranged at opposite ends of the side surface 321, especially relative to the flow direction of the cooling fluid. Figure 3 The right semiconductor element 310 in FIG. 3 is arranged near the fluid inlet 323 and is therefore, for example, the best cooled semiconductor element with the lowest temperature among the five semiconductor elements 310 arranged on the first side surface 321. Accordingly, Figure 3 The left semiconductor element 310 in the figure is arranged near the fluid outlet 324, and is therefore the worst cooled and highest temperature semiconductor element among the five semiconductor elements 310 arranged on the side surface 321. With the help of the temperature sensor units 100 arranged on these two semiconductor elements 310, the highest temperature and the lowest temperature of the five semiconductor elements 310 arranged on the side surface 321 can be detected. The temperatures of the remaining three semiconductor elements 310 arranged on the side surface 321 can be estimated based on the recorded maximum and minimum temperatures. Accordingly, for example, two temperature sensor units 100 can also be arranged on semiconductor elements arranged on opposite side surfaces of the cooling body 320.

[0065] The temperature sensor units 100 are respectively arranged relative to the respective semiconductor elements 310 so that the main extension planes of the respective first housing sections 111 are oriented parallel to the respective surfaces 311 of the respective semiconductor elements 310. In addition, the respective second line sections 132 of the temperature sensor units 100 are each oriented parallel to the connection portions 313 of the respective semiconductor elements 310. The second line sections 132 of the temperature sensor units 310 are each electrically connected to the control circuit board 330 using a through-hole mounting THT. For example, the second line sections 132 are each electrically insulated compared to the printed circuit board 340.

[0066] The invention thus provides the possibility of arranging a temperature sensor directly or in the immediate vicinity of a semiconductor element of a half-bridge switching device in a structurally simple and space-saving manner, such that the sensor can reliably and accurately detect the temperature of the semiconductor element. In this way, the respective temperature sensor can be brought very close to the barrier of the semiconductor element, such that any deviations of the measured temperature from the actual barrier temperature can be easily compensated, for example using software. Particularly advantageously, the temperature sensor unit serves as an integrated temperature sensor for through-hole mounting (THT) or for semiconductor elements connected to a circuit board or printed circuit board using a THT.

[0067] List of reference numerals:

[0068] 10 Components

[0069] 100 Temperature sensor unit

[0070] 110 Shell element

[0071] 111 First shell section

[0072] 112 Second shell section

[0073] 120 Temperature sensor element

[0074] 121 Connection of temperature sensor element

[0075] 130 Circuit components

[0076] 131 First Line Section

[0077] 132 Second Line Section

[0078] 140 Mechanical connection elements

[0079] 200 Temperature sensor unit

[0080] 210 Shell element

[0081] 211 First shell section

[0082] 212 Second shell section

[0083] 213 Opening

[0084] 220 Temperature sensor element

[0085] 221 Connection of temperature sensor element

[0086] 230 Circuit Components

[0087] 231 First Line Section

[0088] 232 Second Line Section

[0089] 240 Mechanical connection elements

[0090] 300 Half-bridge switch device

[0091] 310 Semiconductor components

[0092] 311 Surface

[0093] 312 recess

[0094] 313 Connection

[0095] 314 Semiconductor component insulation layer

[0096] 320 Cooling body

[0097] 321 Side surface of cooling body

[0098] 322 Recess for accommodating a mechanical connection element

[0099] 323 Cooling fluid inlet

[0100] 324 Cooling fluid outlet

[0101] 330 Control circuit board

[0102] 340 Printed Circuit Board

Claims

1. A component (10) comprising a semiconductor element (310) and a temperature sensor unit (100, 200) for detecting the temperature of the semiconductor element (310), in, The semiconductor element (310) has a recess (312). The temperature sensor unit (100, 200) comprises a housing element (110, 210) and a temperature sensor element (120, 220). The housing element (110, 210) comprises a first housing section (111, 211) and a second housing section (112, 212), wherein the second housing section (112, 212) protrudes from the first housing section (111, 211), wherein the temperature sensor element (120, 220) is at least partially arranged in the second housing section (111, 211), The second housing section (112, 212) is arranged in a recess (312) of the semiconductor component (310).

2. The assembly (10) according to claim 1, wherein The temperature sensor unit (100, 200) has at least two electrical circuit elements (130, 230), each of the at least two electrical circuit elements (130, 230) having a first circuit section (131, 231) and a second circuit section (132, 232), wherein the corresponding first circuit section (131, 231) is arranged inside a first housing section (111, 211) and is electrically connected to a temperature sensor element (120, 220), and wherein the corresponding second circuit section (132, 232) protrudes from the first housing section (111, 211).

3. The assembly (10) according to claim 2, wherein: The semiconductor element (310) has at least two connections (313), wherein the second line section (132, 232) of the temperature sensor unit (100, 200) is oriented parallel or at least substantially parallel to the connections (313) of the semiconductor element (310).

4. Assembly (10) according to claim 2 or 3, wherein: The at least two electrical conductor elements (130, 230) are each designed as a strip or a ribbon, in particular as a copper strip.

5. Assembly (10) according to any one of the preceding claims, wherein The temperature sensor unit (100, 200) has at least one mechanical connection element (140, 240) which is designed to be mechanically connected to a carrier for a semiconductor element (310), in particular to a cooling body (320) on which the semiconductor element (310) is mounted.

6. The assembly (10) according to claim 5, wherein: At least one mechanical connection element (140, 240) is adjacent to the first shell section (111, 211) at a predetermined angle and / or the main extension direction of at least one mechanical connection element (140, 240) is oriented parallel to or at least substantially parallel to the main extension direction of the second shell section (112, 212).

7. A switching device (300) comprising at least one assembly (10) according to any one of claims 1 to 6 and at least one further semiconductor element (310), wherein the semiconductor element (310) of at least one assembly is connected in parallel with at least one other semiconductor element (310), or The semiconductor element (310) of at least one component forms a half bridge with at least one other semiconductor element (310).

8. The switch device (300) according to claim 7, further comprising a cooling body (320) as a carrier, wherein: The semiconductor element (310) of the assembly is arranged on a cooling body (320) with further semiconductor elements (310).

9. The switch device (300) according to claim 8 when referring to claim 5, wherein: At least one mechanical connection element (140, 240) of the assembly is mechanically connected to the cooling body (320).

10. The switch device (300) according to claim 8 or 9 comprises at least two components (10) according to any one of claims 1 to 6, the components (10) being arranged at opposite ends of corresponding side surfaces (321) of the cooling body (320), in particular at opposite ends relative to the flow direction of the cooling fluid through the cooling body (320).

11. The switchgear (300) according to any one of claims 8 to 10, further comprising at least one clamping element, which is designed to press one or more of the semiconductor elements (310) against the cooling body (320).

12. The switch device (300) according to any one of claims 7 to 11, further comprising a control circuit board (330), wherein: The main extension plane of the control circuit board (330) is oriented perpendicularly or at least substantially perpendicularly to the main extension plane of the respective semiconductor element (310), wherein each individual or multiple connection portions (313) of the respective semiconductor element (310) are connected to the control circuit board (330).

13. The switch device (300) according to claim 12, wherein: The second line section (132, 232) of the temperature sensor unit (100) is electrically connected to a control circuit board (330) of the half-bridge switch device (300).

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