Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate, and the first conductive pad includes a first upper surface and a first side surface. The second substrate and the first substrate are oppositely arranged. The second conductive pad is disposed on the second substrate, and the second conductive pad includes a second upper surface. The through hole penetrates through the first substrate, and in a top view, the through hole comprises an extension area. The conductive material is partially disposed in the extension region and is in contact with the first upper surface and the second upper surface.

Description

Technical Field

[0001] The present disclosure relates to electronic devices, and in particular to electrical connection structures of electronic devices. Background Art

[0002] Electronic devices such as tablet computers, laptops, smart phones, monitors and televisions have become indispensable necessities in modern society. With the application of electronic devices and the habits or needs of users, the requirements for the structure and quality of electronic devices are getting higher and higher, which in turn makes electronic devices face different problems.

[0003] For example, in response to requirements for higher resolution or display quality, the size of the electrical connection structure in the electronic device needs to be miniaturized accordingly, which affects the reliability or conduction capability of the electrical connection structure.

[0004] As mentioned above, existing electronic devices still fail to meet the requirements in all aspects, and further improving the performance of the electrical connection structure of electronic devices is still one of the research topics that the industry is currently committed to. Summary of the invention

[0005] According to some embodiments of the present disclosure, an electronic device is provided, comprising at least one electrical connection structure. The at least one electrical connection structure comprises a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through-hole and a conductive material. The first conductive pad is disposed on the first substrate, and the first conductive pad comprises a first upper surface and a first side surface. The second substrate is disposed opposite to the first substrate. The second conductive pad is disposed on the second substrate, and the second conductive pad comprises a second upper surface. The through-hole passes through the first substrate, and in a top view, the through-hole comprises an extension area. The conductive material is partially disposed in the extension area and contacts the first upper surface and the second upper surface.

[0006] In order to make the features and advantages of the present disclosure more obvious and understandable, some embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 Showing a schematic diagram of a top view structure of an electronic device according to some embodiments of the present disclosure;

[0008] Figure 2 According to some embodiments of the present disclosure, Figure 1 A schematic cross-sectional structure diagram of the electronic device along the section line AA';

[0009] Figure 3 A schematic cross-sectional structure diagram showing an electrical connection structure of an electronic device according to some embodiments of the present disclosure;

[0010] Figure 4A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present disclosure;

[0011] FIG. 5A to FIG. 5D A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present disclosure;

[0012] Figure 6 A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present disclosure;

[0013] FIG. 7A to FIG. 7D A schematic diagram showing a top view of some components of an electrical connection structure of an electronic device according to some embodiments of the present disclosure;

[0014] Figure 8 A schematic diagram of a cross-sectional structure of an electronic device according to some embodiments of the present disclosure is shown.

[0015]

Explanation of symbols

[0016] 10, 20: Electronic devices

[0017] 10E, 10E-1, 10E-2: Electrical connection structure

[0018] 100: first substrate

[0019] 102: Middle layer

[0020] 102s: side surface

[0021] 104: Covering layer

[0022] 110: first conductive pad

[0023] 110b: Lower surface

[0024] 110i: Inner edge

[0025] 110s: side surface

[0026] 110t: Upper surface

[0027] 110u: outer edge

[0028] 151: First pad

[0029] 152: Second pad

[0030] 191: First Test Pad

[0031] 192: Second test pad

[0032] 200: Second substrate

[0033] 202: Insulation layer

[0034] 210: second conductive pad

[0035] 210t: Upper surface

[0036] 300: The third substrate

[0037] 302: Drive components

[0038] 310: third conductive pad

[0039] 400, 400B, 400G, 400R: Electronic components

[0040] 401a, 401b: electrodes

[0041] 402: Main body

[0042] A-A', B-B': Transect

[0043] CA:Connection Area

[0044] CD: Conductive material

[0045] CDs: Side surface

[0046] EA:Extended Area

[0047] Eu: Outer edge

[0048] P1, P2, P3, P4: endpoints

[0049] PX1, PX2: Pixels

[0050] TH1, TH2: Perforation

[0051] THs: side surface DETAILED DESCRIPTION

[0052] The following is a detailed description of the electronic device of the embodiment of the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific components and arrangements described below are only for simple and clear description of some embodiments of the present disclosure. Of course, these are only used as examples and are not limitations of the present disclosure. In addition, similar and / or corresponding numbers may be used in different embodiments to indicate similar and / or corresponding components to clearly describe the present disclosure. However, the use of these similar and / or corresponding numbers is only for the purpose of simply and clearly describing some embodiments of the present disclosure, and does not represent any correlation between the different embodiments and / or structures discussed.

[0053] It should be understood that relative terms, such as "lower" or "bottom" or "upper" or "top", may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described on the "lower" side will become the component on the "upper" side. The embodiments of the present disclosure may be used in conjunction with the attached drawings. Figure 1 It is also understood that the drawings of the present disclosure are also considered as part of the disclosure. It should be understood that the drawings of the present disclosure are not drawn to scale, and in fact, the size of the components may be arbitrarily enlarged or reduced to clearly show the features of the present disclosure.

[0054] Furthermore, when a first material layer is mentioned as being located on or above a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

[0055] In addition, it should be understood that the ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify components, do not imply or represent any previous ordinal numbers of the component (or components), nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The same words may not be used in the claims and the specification. For example, the first component in the specification may be the second component in the claims.

[0056] In some embodiments of the present disclosure, terms such as "connection", "interconnection", etc., related to bonding and connection, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein another structure is disposed between the two structures. Such terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "coupled" include any direct and indirect electrical connection means.

[0057] In the text, the terms "about", "substantially", and "approximately" usually mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The term "range between a first value and a second value" means that the range includes the first value, the second value, and other values ​​therebetween. Furthermore, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0058] According to the embodiments of the present disclosure, a scanning electron microscope (SEM), an optical microscope (OM), an α-step, an ellipsometer, or other suitable methods may be used to measure the width, thickness, height or area of ​​each component, and the spacing or distance between components. Specifically, according to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image of a component to be measured, and the width, thickness, height or area of ​​each component, and the spacing or distance between components may be measured.

[0059] It should be understood that the following embodiments can replace, reorganize, and combine the features of several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. The features of each embodiment can be combined and used in any combination as long as they do not violate the spirit of the invention or conflict with each other.

[0060] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0061] According to the embodiments of the present disclosure, an electronic device including an electrical connection structure can be provided, wherein the electrical connection structure includes a through hole having an extended area, and the conductive material disposed in the through hole having the extended area can have an improved electrical conductivity, thereby improving the reliability of the electrical connection structure, thereby improving the performance of the electronic device, and enabling the electronic device to have good electrical quality or display quality. In addition, according to the embodiments of the present disclosure, the design of the electrical connection structure can dispose electronic components (e.g., driving components, etc.) on the back side of the substrate, thereby reducing the peripheral usage of the electronic device, thereby achieving technical requirements such as borderless, narrow border, or seamless splicing.

[0062] According to an embodiment of the present disclosure, the electronic device may include a display device, a splicing device, a touch electronic device, a sensing device, an antenna device, a packaging device, a curved electronic device or a non-rectangular electronic device, but is not limited thereto. The electronic device may, for example, include a liquid crystal, a light emitting diode, fluorescence, phosphorescence, other suitable display media, or a combination of the foregoing, but is not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The electronic device may include an electronic component, which may be a passive component or an active component, such as a capacitor, a resistor, an inductor, a diode, a driving component, a transistor, etc. The diode may include a light-emitting diode (LED) or a photodiode. The light-emitting diode may, for example, include an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device may, for example, be a display splicing device, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna or a varactor diode antenna device but is not limited thereto. The packaging device may be used for wafer-level packaging (WLP) technology or panel-level packaging (WLP) technology, such as chip first or chip later packaging (RDLfirst). It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. In addition, the electronic device may be a bendable or flexible electronic device. In addition, the appearance of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support a display device or a splicing device.

[0063] Please refer to Figure 1 as well as Figure 2 , Figure 1 A schematic diagram showing a top view of the structure of an electronic device 10 according to some embodiments of the present disclosure is shown. Figure 2 According to some embodiments of the present disclosure, Figure 1 Schematic diagram of the cross-sectional structure of the electronic device 10 along the section line A-A' in FIG. It should be understood that, for the sake of clarity, some components of the electronic device 10 may be omitted in the drawings, and only some components are schematically shown. According to some embodiments, additional features may be added to the electronic device 10 described below. According to other embodiments, some features of the electronic device 10 described below may be replaced or omitted.

[0064] The electronic device 10 includes at least one electrical connection structure 10E. The following description will be based on the electronic device 10 being a display device and the electrical connection structure 10E being applied to the display device, but the present disclosure is not limited thereto. It should be understood that the electrical connection structure 10E can also be applied to other suitable electronic devices to provide an electrical connection function.

[0065] like Figure 1 as well as Figure 2 As shown, according to some embodiments, the electronic device 10 may include a first substrate 100, a second substrate 200, an electronic component 400 and an electrical connection structure 10E. The second substrate 200 may be arranged opposite to the first substrate 100. The electronic component 400 may be arranged on the first substrate 100, and the electronic component 400 may be electrically connected to another electronic component (not shown, for example, a driving component, etc.) on the second substrate 200 through the electrical connection structure 10E. According to some embodiments, the electronic component 400 may include a light-emitting diode, and the electronic device 10 is, for example, a light-emitting diode display device. In this way, the electronic component 400 may be driven by another electronic component (not shown, for example, a driving component, etc.) arranged on the back side of the first substrate, thereby reducing the peripheral usage rate of the electronic device 10, thereby achieving the technical requirements of borderless, narrow border or seamless splicing, and having good display quality.

[0066] According to some embodiments, the first substrate 100 may be used as an active array substrate, for example, it may include a base (not shown) and a circuit component layer (not shown) disposed on the base. The base of the first substrate 100 may include a rigid substrate, a flexible substrate, or a combination thereof. According to some embodiments, the material of the base of the first substrate 100 may include glass, quartz, sapphire, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), polydimethylsiloxane (PDMS), other suitable base materials, or a combination thereof, but not limited thereto. Furthermore, the circuit component layer may include, for example, a stack of at least one or more circuit components (e.g., thin film transistors), a buffer layer, and a plurality of insulating layers, but not limited thereto. According to some embodiments, the circuit component layer is, for example, an active array layer composed of a plurality of thin film transistors, but not limited thereto.

[0067] Please continue to refer to Figure 1 as well as Figure 2 According to some embodiments, one or more electronic components 400 may constitute a pixel, and a plurality of pixels (e.g., pixel PX1, pixel PX2) may be disposed on the first substrate 100. As mentioned above, the electronic component 400 may be a light emitting diode. In other words, according to some embodiments, each pixel may include a plurality of light emitting diodes (for convenience of description, Figure 1 The electronic components 400R, 400G and 400B are marked in FIG. 1 , and the number of light emitting diodes is not limited. For example, Figure 1 The two pixels PX1 and PX2 shown in the figure can be arranged in an array in the X-axis and Y-axis directions in the figure (the X-axis is perpendicular to the Y-axis and the Z-axis, and the Y-axis is perpendicular to the X-axis and the Z-axis, but not limited to this). It should be understood that Figure 1 The number of pixels and the pattern of arrangement shown are only examples. The actual number of pixels can be tens, tens of thousands, or millions or more, but is not limited thereto.

[0068] According to some embodiments, the plurality of light emitting diodes may include red light emitting diodes, green light emitting diodes, blue light emitting diodes, white light emitting diodes, yellow light emitting diodes or light emitting diodes of other colors, which may be adjusted according to design requirements. According to some embodiments, the aforementioned electronic components 400R, 400G and 400B may be used as sub-pixels, and a combination of a plurality of pixels PX1 and PX2 may be used to generate an image pattern. According to some embodiments, the number of the plurality of light emitting diodes in the pixels PX1 and PX2 may be three or more than three, and the color of the light emitting diode may include red light, blue light, green light, white light, yellow light or other suitable colors of light, but is not limited thereto.

[0069] According to some embodiments, the electronic component 400 may include an electrode 401a, an electrode 401b, and a main body 402. The main body 402 may include, for example, a first-type semiconductor layer (e.g., an N-type doped semiconductor layer), a second-type semiconductor layer (e.g., a P-type doped semiconductor layer), and a light-emitting layer located between the first-type semiconductor layer and the second-type semiconductor layer, that is, the main body 402 may be a PN light-emitting diode, but is not limited thereto. Furthermore, although the electronic component 400 in the accompanying drawings is a flip chip LED, the present disclosure is not limited thereto. In other embodiments, the electronic component 400 may also include a vertical LED, a front-mounted LED, or other suitable types of LED packages.

[0070] According to some embodiments, the electronic component 400 may be electrically connected to the circuit component layer of the first substrate 100. Specifically, a plurality of first pads 151 and a plurality of second pads 152 may be provided on the first substrate 100 or the circuit component layer. One of the plurality of light-emitting diodes is provided corresponding to the first pad 151 and the adjacent second pad 152. For example, the electrode 401a of the electronic component 400R may be electrically connected to the first pad 151, and the electrode 401b may be electrically connected to the second pad 152, but is not limited thereto. In this way, the first pad 151 and the second pad 152 may be respectively used as pads connected to the positive or negative electrode of the electronic component 400. For example, the electronic component 400 may be electrically connected to the first pad 151 and the second pad 152 by wire bonding. In addition, according to some other embodiments, the electronic component 400 can also be electrically connected to the circuit components (for example, thin film transistors) or the circuit layer in the circuit component layer through conductive lines by means of a transfer layer including conductive lines and an insulating layer, so that the electrode 401a and / or the electrode 402b are respectively electrically connected to the circuit components (for example, thin film transistors) or the circuit layer in the circuit component layer through conductive lines, but is not limited thereto.

[0071] According to some embodiments, the electronic device 10 may selectively include a first test pad 191 and a plurality of second test pads 192. The first test pad 191 and the plurality of second test pads 192 may be respectively disposed adjacent to one side of a pixel (e.g., pixel PX1), but not limited thereto. The first test pad 191 and the plurality of second test pads 192 may be electrically connected to the circuit component layer of the first substrate 100, but not limited thereto. The first test pad 191 may be connected in series to a plurality of first pads 151. The plurality of second test pads 192 may be respectively electrically connected to a plurality of second pads 152. According to some embodiments, the first test pad 191 and the plurality of second test pads 192 may be used as test electrodes for detecting the electrical quality of a plurality of electronic components 400 in the pixels PX1 and PX2.

[0072] The materials of the first test pad 191, the second test pad 192, the first pad 151, and the second pad 152 may include a conductive material. According to some embodiments, the materials of the first test pad 191, the second test pad 192, the first pad 151, and the second pad 152 may include a metal conductive material, such as molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), gold (Au), alloys of the aforementioned materials, other suitable conductive materials, or combinations thereof, but are not limited thereto. According to some embodiments, the materials of the first test pad 191, the second test pad 192, the first pad 151 and the second pad 152 may include a transparent conductive material. The transparent conductive material may include, for example, a transparent conductive oxide (TCO), such as indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), other suitable transparent conductive materials, or a combination thereof, but not limited thereto.

[0073] like Figure 2 As shown, according to some embodiments, the electronic device 10 may further include a covering layer 104 disposed on the first substrate 100. Further, according to some embodiments, the covering layer 104 may be disposed on the electronic component layer of the first substrate 100, the covering layer 104 may cover the first test pad 191 and the second test pad 192, and may at least partially cover the electronic component 400. According to some embodiments, the covering layer 104 may cover a plurality of electronic components 400 and an electrical connection structure 10E. According to some embodiments, the covering layer 104 may cover the first test pad 191, the second test pad 192, a plurality of electronic components 400 and an electrical connection structure 10E, but not limited thereto. The covering layer 104 may play at least one of the functions of electrical insulation, protection of the above-mentioned related components covered, and surface flatness. The covering layer 104 may be formed by coating, jetting, dispensing, printing or other appropriate methods, but not limited thereto. According to some embodiments, the cover layer 104 may include an inorganic material, an organic material, or a combination thereof, but is not limited thereto. According to some embodiments, the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, other suitable materials, or a combination thereof, but is not limited thereto. According to some embodiments, the organic material may include, for example, perfluoroalkoxy alkane (PFA), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), polyethylene, silicone, acrylic, urethane or epoxy, other suitable materials, or a combination thereof, but is not limited thereto.

[0074] According to some embodiments, the second substrate 200 is disposed below the first substrate 100, and is located on two opposite surfaces of the first substrate 100 with the plurality of electronic components 400. The second substrate 200 can be used as a circuit substrate. According to some embodiments, the second substrate 200 can include a printed circuit board (PCB), a redistribution layer (RDL), or a combination thereof, but is not limited thereto. According to other embodiments, the second substrate 200 can include a chip on film (COF), but is not limited thereto.

[0075] Specifically, according to some embodiments, the second substrate 200 may include a base and a plurality of insulating layers and interconnect layers (eg, a patterned conductive layer) disposed on the base. Figure 2 As shown, according to some embodiments, the electronic device 10 may further include an insulating layer 202 and a second conducting pad 210, and the insulating layer 202 and the second conducting pad 210 may also be a part of the insulating layer and the interconnect layer of the second substrate 200. The insulating layer 202 and the second conducting pad 210 may be disposed between the second substrate 200 and the first substrate 100. According to other embodiments, the second substrate 200 may be an interposer.

[0076] The base of the second substrate 100 may include a rigid substrate, a flexible substrate, or a combination thereof. According to some embodiments, the material of the base of the second substrate 100 may include glass, quartz, sapphire, polyimide (PI), polycarbonate (PC), polyethyleneterephthalate (PET), polypropylene (PP), polydimethylsiloxane (PDMS), other suitable base materials, or a combination thereof, but is not limited thereto.

[0077] According to some embodiments, the insulating layer 202 may include a polymer insulating material, such as an ABF build-up film (Ajinomoto Build-up Film, ABF), polyphenylene bis(phenylene sulfide), or poly(phenylene sulfide). Polybenzoxazole (PBO), polyimide (PI), photosensitive polyimide (PSPI), benzocyclobutene (BCB), film (PrePreg), photosensitive dielectric material (photoimageabledielectric, PID), resin coated cooper foil (RCC), flame resistant glass fiber (FR4), glass fiber resin composite material, other suitable insulating materials or combinations of the foregoing, but not limited thereto.

[0078] According to some embodiments, the electronic device 10 may further include an intermediate layer 102, and the intermediate layer 102 may be disposed between the first substrate 100 and the second substrate 200. In detail, a portion of the intermediate layer 102 may be disposed between the insulating layer 202 and the first substrate 100, and a portion of the intermediate layer 102 may be disposed between the second substrate 200 and the first substrate 100. According to some embodiments, the intermediate layer 102 may be an adhesive layer, and the first substrate 100 and the second substrate 200 may be combined, for example, it may be disposed on the second substrate 200 and then combined with the first substrate 100, or it may be disposed on the first substrate 100 and then combined with the second substrate 200. According to some embodiments, the material of the intermediate layer 102 may include an inorganic material, an organic material, or a combination thereof, but is not limited thereto. According to some embodiments, the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, other suitable materials, or a combination thereof, but is not limited thereto. According to some embodiments, the organic material may include, for example, perfluoroalkoxy alkane (PFA), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), polyethylene, other suitable materials, or a combination thereof, but not limited thereto. In addition, according to some embodiments, the intermediate layer 102 may include an adhesive material having a viscous property, such as optical clear adhesive (OCA), optical clear resin (OCR), pressure sensitive adhesive (PSA), acrylic adhesive, acrylic resin, other suitable materials, or a combination thereof, but not limited thereto. Furthermore, the intermediate layer 102 may have a single-layer or multi-layer structure.

[0079] In addition, the electronic device 10 includes at least one electrical connection structure 10E, and the electrical connection structure 10E can be disposed between the electronic components 400, for example, between two adjacent pixels PX1 and PX2, but is not limited thereto. In other words, according to some embodiments, the electrical connection structure 10E can be disposed in the active area and / or the peripheral area of ​​the electronic device 10. The electrical connection structure 10E can be applied to any suitable electronic device to provide an electrical connection function. The detailed structure of the electrical connection structure 10E will be described below.

[0080] Please refer to Figure 3 as well as Figure 4 , Figure 3 A schematic cross-sectional structure diagram of an electrical connection structure 10E of an electronic device according to some embodiments of the present disclosure is shown. Figure 4The schematic diagram of the top view of some components of the electrical connection structure 10E of the electronic device according to some embodiments of the present disclosure is shown. Specifically, Figure 3 For along Figure 4 The cross-sectional structure diagram of the electrical connection structure 10E obtained by the section line BB'. Figure 4 Only the first conducting pad 110, the through hole TH1 and the conducting material CD of the electrical connection structure 10E are shown to facilitate the description of the positional relationship between them. Figure 4 The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0081] In addition, it should be understood that the components or components that are the same or similar to those described above will be represented by the same or similar numbers, and their materials and functions are the same or similar to those described above, so this part will not be repeated in the following text.

[0082] First, if Figure 3 As shown, the electrical connection structure 10E may include a first substrate 100 , a first conducting pad 110 , a second substrate 200 , a second conducting pad 210 , a through hole TH1 , and a conductive material CD.

[0083] The first conductive pad 110 may be disposed on the first substrate 100, and the first conductive pad 100 includes an upper surface 110t, a side surface 110s, and a lower surface 110b. According to some embodiments, the first conductive pad 110 may be disposed, for example, on the topmost insulating layer of the circuit component layer (not shown) of the first substrate 100, for example, the lower surface 110b of the first conductive pad 110 may contact the topmost insulating layer of the circuit component layer, but is not limited thereto. Figure 4 As shown, according to some embodiments, in a top view, the first conducting pad 110 may have an arc-shaped or concave profile, but is not limited thereto.

[0084] The first conductive pad 110 may include a conductive material. According to some embodiments, the material of the first conductive pad 110 may include a metal conductive material, such as molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), gold (Au), alloys of the foregoing materials, other suitable conductive materials, or combinations thereof, but not limited thereto. According to some embodiments, the material of the first conductive pad 110 may include a transparent conductive material, and the transparent conductive material may include, for example, a transparent conductive oxide (TCO), but not limited thereto.

[0085] The second conducting pad 210 may be disposed on the second substrate 200, the second conducting pad 210 includes an upper surface 210t, and the second conducting pad 210 may be disposed on the second substrate 200. According to some embodiments, the second conducting pad 210 may be a part of the interconnect layer of the second substrate 200, but is not limited thereto. According to some embodiments, the second conducting pad 210 may be further electrically connected to an electronic component (not shown, for example, a driving component) disposed on the second substrate 200.

[0086] Furthermore, the material of the second conducting pad 210 may be the same as or similar to that of the first conducting pad 110 , and will not be repeated here.

[0087] According to some embodiments, the electrical connection structure 10E may further include an intermediate layer 102, which may be disposed between the first substrate 100 and the second substrate 200 and partially cover the second conducting pad 210. The intermediate layer 102 may have a single-layer or multi-layer structure.

[0088] The through hole TH1 may pass through the first substrate 100. According to some embodiments, the through hole TH1 may pass through the first substrate 100 and the intermediate layer 102 and expose a portion of the upper surface 210t of the second conducting pad 210. Figure 4As shown, in the top view, the through hole TH1 includes an extension area EA, and the conductive material CD may be partially disposed in the extension area EA and contact the upper surface 110t of the first conductive pad 110 and the upper surface 210t of the second conductive pad 210. The first conductive pad 110 may be electrically connected to the second conductive pad 210 through the through hole TH1. Specifically, the conductive material CD may pass through the through hole TH1 so that the first conductive pad 110 and the second conductive pad 210 are electrically connected. According to some embodiments, the conductive material CD may contact the upper surface 110t, the side surface 110s of the first conductive pad 110, and the upper surface 210t of the second conductive pad 210. According to some embodiments, the conductive material CD may contact the upper surface 110t, the side surface 110s of the first conductive pad 110, the first substrate 100, the intermediate layer 102, and the upper surface 210t of the second conductive pad 210.

[0089] like Figure 3 As shown, according to some embodiments, the side surface THs of the through hole TH1 may be substantially perpendicular to the upper surface 210t of the second conducting pad 210. According to other embodiments, the side surface THs of the through hole TH1 may not be perpendicular to the upper surface 210t of the second conducting pad 210, that is, the side surface THs of the through hole TH1 may be inclined, for example, it may be inclined inward (the top width of the through hole TH1 is smaller than the bottom width), or it may be inclined outward (the top width of the through hole TH1 is larger than the bottom width). The side surface THs of the through hole TH1 may have an irregular sidewall or a combination thereof, but is not limited thereto.

[0090] Furthermore, the conductive material CD may be filled partially into the through hole TH1 or completely fill the through hole TH1. For example, during the process of the conductive material CD filling the through hole TH1, a gap may exist between the side surface CDs of the conductive material CD in the through hole TH1 and the side surface THs of the through hole TH1. According to some embodiments, the side surface CDs of the conductive material CD may partially not contact the side surface THs of the through hole TH1 and / or the side surface 102s of the intermediate layer 102.

[0091] According to some embodiments, a portion of the first substrate 100 and the intermediate layer 102 may be removed by one or more photolithography processes and / or etching processes to form the through hole TH1. According to some embodiments, the photolithography process may include photoresist coating (e.g., spin coating), soft baking, hard baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning and drying, etc., but is not limited thereto. The etching process may include a dry etching process or a wet etching process, but is not limited thereto.

[0092] Furthermore, the conductive material CD may include a conductive material. According to some embodiments, the material of the conductive material CD may include silver paste, copper paste, conductive solder, other suitable conductive materials or a combination thereof, but is not limited thereto. According to some embodiments, the conductive material CD may be disposed in the through hole TH1 by solder paste printing, micro inkjet printing (MJP) process, chemical vapor deposition (CVD) process, physical vapor deposition (physical vapor deposition) process, electroplating process, electroless plating process, other suitable methods or a combination thereof.

[0093] It is worth noting that, in the process of setting the conductive material CD in the through hole TH1, the air bubbles generated can be released through the gap between the side surface CDs of the conductive material CD and the side surface THs of the through hole TH1. In this way, the risk of bubbles generated in the conductive material CD can be reduced, thereby reducing the problem of poor contact or electrical abnormality between the conductive material CD and the first conductive pad 110 or the second conductive pad 210.

[0094] As mentioned above, in the top view, the through hole TH1 includes an extension area EA, and the conductive material CD may be partially disposed in the extension area EA. In detail, in the top view, the first conductive pad 110 may include a connection area CA, and the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u may define the connection area CA. In other words, in the top view, the area surrounded by the endpoints P1 and P2 of the inner edge 110i and the endpoints P3 and P4 of the outer edge 110u of the first conductive pad 110 is defined as the connection area CA. According to an embodiment of the present disclosure, in the top view, the portion of the through hole TH1 that overlaps with the aforementioned connection area CA (which may also be regarded as a portion located in the connection area CA) and the portion that extends beyond the connection area CA may be defined as the extension area EA. Furthermore, the aforementioned portion that extends beyond the connection area CA may be a portion that extends beyond the connection area CA in a direction away from the first conductive pad 110.

[0095] like Figure 4As shown, according to some embodiments, the extension area EA of the through hole TH1 at least partially overlaps with the connection area CA. For example, in the normal direction of the first substrate 100 (for example, the Z direction in the figure), the extension area EA at least partially overlaps with the connection area CA. And, according to some embodiments, the extension area EA exceeds the connection area CA. For example, the extension area EA extends beyond the connection area CA in a direction away from the first conductive pad 110. In this example, the area of ​​the connection area CA is 0. That is, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u form a connection line segment. The portion where the through hole TH1 overlaps with the connection area CA (connection line segment) and the portion extending beyond the connection area CA can be defined as the extension area EA.

[0096] It is worth noting that, through the above configuration, the through hole TH1 provides an additional extension area EA for the conductive material CD to be disposed. When the conductive material CD is disposed in the extension area EA of the through hole TH1, the contact area between the conductive material CD and the upper surface 210t of the second conductive pad 210 can be increased, and the contact resistance between the first conductive pad 110 and the second conductive pad 210 can be reduced, thereby improving the reliability of the electrical connection structure, thereby enhancing the performance of the electronic device, and making the electronic device have good electrical quality or display quality. Furthermore, the through hole TH1 provides an additional extension area EA, which can also allow the device to have a larger allowable error value during the process of filling the conductive material CD, thereby improving the process yield.

[0097] In addition, according to some embodiments, the area of ​​the extended region EA of the through hole TH1 may be greater than or equal to one tenth of the area of ​​the connection area CA (that is, the area of ​​the extended region EA ≥ 1 / 10x the area of ​​the connection area CA), or the area of ​​the extended region EA of the through hole TH1 may be greater than or equal to one ninth, one eighth, one seventh, one sixth, one fifth, one quarter, one third or one half of the area of ​​the connection area CA, but not limited thereto. Alternatively, according to other embodiments, the area of ​​the extended region EA of the through hole TH1 may be greater than or equal to 1 times, 1.1 times, 1.2 times, 1.3 times, 1.4 times, 1.5 times, 1.6 times, 1.7 times, 1.8 times, 1.9 times or 2 times the area of ​​the connection area CA, but not limited thereto.

[0098] In particular, when the area of ​​the extension region EA of the through hole TH1 and the area of ​​the connection region CA meet the aforementioned relationship, the contact resistance between the conductive pads can be further reduced, the conductive capacity of the electrical connection structure can be improved, and the reliability of the electrical connection between the first substrate 100 and the second substrate 200 can be improved. In addition, the equipment can have a larger allowable error value during the process of filling the conductive material CD, thereby improving the process yield.

[0099] According to some embodiments, in a top view, the area of ​​the extended region EA of the perforation TH1 may be greater than or equal to 5% of the total area of ​​the perforation TH1 (i.e., the area of ​​the extended region EA ≥ the total area of ​​the perforation TH1 x 5%), or, the area of ​​the extended region EA of the perforation TH1 may be greater than or equal to 10%, 15%, 20%, 25%, 30%, 35% or 40% of the total area of ​​the perforation TH1, but is not limited thereto.

[0100] In particular, when the area of ​​the extended region EA of the through hole TH1 and the total area of ​​the through hole TH1 meet the aforementioned relationship, the contact resistance between the conductive pads can be further reduced, the conductive capacity of the electrical connection structure can be improved, and the reliability of the electrical connection between the first substrate 100 and the second substrate 200 can be improved. In addition, the equipment can have a larger allowable error value during the process of filling the conductive material CD, thereby improving the process yield.

[0101] Furthermore, according to some embodiments, the outer edge Eu of the extension area EA of the through hole TH1 has an arc or curved profile. According to some embodiments, in the top view, the through hole TH1 may be circular, elliptical, rectangular, symmetrical, irregular or other suitable shapes, but is not limited thereto. According to some embodiments, the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu is discontinuous with the outer edge 110u. According to some embodiments, the outer edge Eu of the extension area EA of the through hole TH1 may protrude from the connection between the end point P3 and the end point P4 of the outer edge 110u of the first conductive pad 110. According to some embodiments, the curvature of the outer edge Eu of the extension area EA of the through hole TH1 is different from the curvature of the outer edge 110u of the first conductive pad 110. According to some embodiments, the curvature of the outer edge Eu of the extension area EA of the through hole TH1 is different from the curvature of the inner edge 110i of the first conductive pad 110.

[0102] Next, please refer to FIG. 5A to FIG. 5D , FIG. 5A to FIG. 5D A schematic diagram of a top view of some components of the electrical connection structure of an electronic device according to some other embodiments of the present disclosure is shown. FIG. 5A to FIG. 5D Only the first conducting pad 110 and the through hole TH1 of the electrical connection structure are shown to clearly illustrate the positional relationship between the two. FIG. 5A to FIG. 5D The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0103] like FIG. 5A to FIG. 5DAs shown, according to some embodiments, the extension area EA of the through hole TH1 at least partially overlaps with the connection area CA, and the extension area EA exceeds the connection area CA. For example, in the normal direction of the first substrate 100 (for example, the Z direction in the figure), the extension area EA at least partially overlaps with the connection area CA, and the extension area EA extends beyond the connection area CA in a direction away from the first conductive pad 110. Furthermore, in these examples, the area of ​​the connection area CA is 0. That is, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u form a connection line segment. The portion where the through hole TH1 overlaps with the connection area CA (connection line segment) and the portion that extends beyond the connection area CA can be defined as the extension area EA.

[0104] like Figure 5A As shown, according to some embodiments, in the top view, the through hole TH1 may be elliptical, the first conductive pad 110 may have an arc-shaped or concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu and the outer edge 110u are discontinuous. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located between the endpoint P1 and the endpoint P3 and / or between the endpoint P2 and the endpoint P4. Furthermore, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u may be located on the same straight line, that is, collinear.

[0105] like Figure 5B As shown, according to some embodiments, in the top view, the through hole TH1 may be rectangular, the first conductive pad 110 may have a concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 may be aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu is continuous with the outer edge 110u. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located at the positions of the end points P3 and P4. Furthermore, the end points P1 and P2 of the inner edge 110i of the first conductive pad 110 and the end points P3 and P4 of the outer edge 110u may be located on the same straight line, that is, collinear.

[0106] like Figure 5CAs shown, according to some embodiments, in the top view, the through hole TH1 may be elliptical, the first conductive pad 110 may have an arc-shaped or concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu and the outer edge 110u are discontinuous. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located between the endpoint P1 and the endpoint P3 and / or between the endpoint P2 and the endpoint P4. Furthermore, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u may be located on the same straight line, that is, collinear.

[0107] like Figure 5D As shown, according to some embodiments, in the top view, the through hole TH1 may be circular, the first conductive pad 110 may have an arc-shaped or concave profile, the width of the first conductive pad 110 may be gradual, and the outer edge Eu of the extension area EA of the through hole TH1 may be aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu is continuous with the outer edge 110u. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located at the positions of the end points P3 and P4. Furthermore, the end points P1 and P2 of the inner edge 110i of the first conductive pad 110 and the end points P3 and P4 of the outer edge 110u are not located on the same straight line, that is, they are non-collinear.

[0108] Next, please refer to Figure 6 , Figure 6 A schematic diagram of a top view of some components of the electrical connection structure of an electronic device according to some other embodiments of the present disclosure is shown. Figure 6 Only the first conducting pad 110, the through hole TH1 and the conducting material CD of the electrical connection structure are shown to facilitate the description of the positional relationship between them. Figure 6 The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0109] like Figure 6As shown, according to some embodiments, the extension area EA of the through hole TH1 at least partially overlaps with the connection area CA, and the extension area EA is located in the connection area CA. For example, in the normal direction of the first substrate 100 (for example, the Z direction in the figure), the extension area EA overlaps with the connection area CA. Furthermore, in this example, the area of ​​the connection area CA is greater than 0. That is, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u surround the connection area CA. The portion where the through hole TH1 overlaps with the connection area CA can be defined as the extension area EA. In this embodiment, the area of ​​the extension area EA is smaller than the area of ​​the connection area CA.

[0110] like Figure 6 As shown, according to some embodiments, in the top view, the through hole TH1 may be elliptical, the first conductive pad 110 may have an arc-shaped or concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu and the outer edge 110u are discontinuous. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located between the endpoint P1 and the endpoint P3 and / or between the endpoint P2 and the endpoint P4. Furthermore, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u are not located on the same straight line, that is, they are non-collinear.

[0111] Next, please refer to FIG. 7A to FIG. 7D , FIG. 7A to FIG. 7D A schematic diagram of a top view of some components of the electrical connection structure of an electronic device according to some other embodiments of the present disclosure is shown. FIG. 7A to FIG. 7D Only the first conducting pad 110 and the through hole TH1 ( Fig. 7A The conductive material CD is also shown to facilitate the description of the positional relationship between them. FIG. 7A to FIG. 7D The top view shown corresponds substantially to Figure 3 The horizontal position of the lower surface 110b of the first conductive pad 110 in FIG.

[0112] like FIG. 7A to FIG. 7DAs shown, according to some embodiments, the extension area EA of the through hole TH1 at least partially overlaps with the connection area CA, and the extension area EA exceeds the connection area CA. For example, in the normal direction of the first substrate 100 (for example, the Z direction in the figure), the extension area EA at least partially overlaps with the connection area CA, and the extension area EA extends beyond the connection area CA in a direction away from the first conductive pad 110. Furthermore, in these examples, the area of ​​the connection area CA is greater than 0. That is, the end points P1 and P2 of the inner edge 110i of the first conductive pad 110 and the end points P3 and P4 of the outer edge 110u surround the connection area CA. The portion where the through hole TH1 overlaps with the connection area CA and the portion that extends beyond the connection area CA can be defined as the extension area EA. In these examples, the area of ​​the extension area EA is greater than the area of ​​the connection area CA.

[0113] like Fig. 7A As shown, according to some embodiments, in the top view, the through hole TH1 may be circular, the first conductive pad 110 may have an arc-shaped or concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu and the outer edge 110u are discontinuous. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located between the endpoint P1 and the endpoint P3 and / or between the endpoint P2 and the endpoint P4. Furthermore, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u are not located on the same straight line, that is, they are non-collinear.

[0114] like Figure 7B As shown, according to some embodiments, in the top view, the through hole TH1 may be circular, the first conductive pad 110 may have an arc-shaped or concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu and the outer edge 110u are discontinuous. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located between the endpoint P1 and the endpoint P3 and / or between the endpoint P2 and the endpoint P4. Furthermore, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u are not located on the same straight line, that is, they are non-collinear.

[0115] like Figure 7CAs shown, according to some embodiments, in the top view, the through hole TH1 may be rectangular, the first conductive pad 110 may have a concave profile, and the outer edge Eu of the extension area EA of the through hole TH1 may be aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu is continuous with the outer edge 110u. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located at the positions of the end points P3 and P4. Furthermore, the end points P1 and P2 of the inner edge 110i of the first conductive pad 110 and the end points P3 and P4 of the outer edge 110u are not located on the same straight line, that is, they are non-collinear.

[0116] like Fig.7D As shown, according to some embodiments, in the top view, the through hole TH1 may be elliptical, the first conductive pad 110 may have an arc-shaped or concave asymmetric profile, and the outer edge Eu of the extension area EA of the through hole TH1 is not aligned with the outer edge 110u of the first conductive pad 110, that is, in the top view, the outer edge Eu and the outer edge 110u are discontinuous. In detail, the intersection of the outer edge Eu of the extension area EA and the first conductive pad 110 may be located between the endpoint P1 and the endpoint P3 and / or between the endpoint P2 and the endpoint P4. Furthermore, the endpoints P1 and P2 of the inner edge 110i of the first conductive pad 110 and the endpoints P3 and P4 of the outer edge 110u are not located on the same straight line, that is, they are non-collinear.

[0117] Please refer to Figure 8 , Figure 8 A schematic cross-sectional structure diagram of an electronic device 20 is shown according to other embodiments of the present disclosure. It should be understood that for the sake of clarity, some components of the electronic device 20 may be omitted in the drawings, and only some components are schematically shown. According to some embodiments, additional features may be added to the electronic device 20 described below. According to other embodiments, some features of the electronic device 20 described below may be replaced or omitted.

[0118] like Figure 8 As shown, according to some embodiments, the electronic device 20 includes an electrical connection structure 10E-1 and an electrical connection structure 10E-2. Specifically, the electrical connection structure 10E-1 and the electrical connection structure 10E-2 Figure 2 The electrical connection structure 10E in the illustrated embodiment is substantially the same as Figure 2 Compared to the electronic device 10 shown in FIG. 1 , the electronic device 20 further includes an electrical connection structure 10E-2, which can be electrically connected to the electrical connection structure 10E-1. According to some embodiments, in the normal direction of the first substrate 100 (e.g., the Z direction in the drawings), the electrical connection structure 10E-2 at least partially overlaps the electrical connection structure 10E-1.

[0119] In detail, according to some embodiments, the electrical connection structure 10E-2 may include a third substrate 300, a third conductive pad 310, and a through hole TH2, the third conductive pad 310 may be disposed between the third substrate 300 and the second conductive pad 210, the through hole TH2 may pass through the second substrate 200, and the third conductive pad 310 may be electrically connected to the second conductive pad 210 through the through hole TH2. In detail, a conductive material is also disposed in the through hole TH2, and the third conductive pad 310 may be electrically connected to the second conductive pad 210 through the conductive material disposed in the through hole TH2.

[0120] The materials of the third substrate 300 and the third conducting pad 310 may be the same as or similar to the materials of the second substrate 200 and the second conducting pad 210 , and will not be repeated here.

[0121] Furthermore, the electronic device 20 may include an electronic component 400 and a driving component 302, the electronic component 400 may be disposed on the first substrate 100, the driving component 302 may be disposed on the third substrate 300, and the driving component 302 may be electrically connected to the electronic component 400 by means of the electrical connection structure 10E-1 and the electrical connection structure 10E-2. As mentioned above, according to some embodiments, the electronic component 400 may include a light emitting diode, but is not limited thereto. Furthermore, according to some embodiments, the driving component 302 may include an integrated circuit chip (IC), a microchip, or other suitable electronic driving components that can provide electronic signals or logic signals, but is not limited thereto. According to some embodiments, the driving component 302 may be disposed on the third substrate 300 in the form of a chip on film (COF) or a chip on glass (COG), but is not limited thereto.

[0122] The conductive material CD of the electronic device 20 can be electrically connected to the second conductive pad 210 and the third conductive pad 310 through the through hole TH1 and the through hole TH2, and then electrically connected to the driving component 302 on the third substrate 300. Through the above configuration, the driving signal of the driving component 302 can provide the driving signal to the first conductive pad 110 and the plurality of electronic components 400 through the conductive path formed by the conductive material CD, the second conductive pad 210 and the third conductive pad 310. When the electronic device 20 is applied to the field of display equipment, the driving signal of the driving component 302 can be transmitted from one side of the first substrate 100 to the plurality of electronic components 400 on the opposite side through the electrical connection structure 10E-1 and the electrical connection structure 10E-2. Therefore, the driving component 302 can be disposed on the back side of the first substrate 100, thereby reducing the peripheral usage of the electronic device 20, thereby achieving the technical requirements of borderless, narrow border or seamless splicing, and having good display quality.

[0123] In addition, according to some other embodiments, the aforementioned electrical connection structure can also be applied to a splicing device to provide electrical connection between different parts of the splicing device. Furthermore, the electrical connection structure can be used to provide conduction between any suitable number of substrates, and the number of the electrical connection structure and the substrates is not limited to those shown in the drawings of this case.

[0124] In summary, according to an embodiment of the present disclosure, an electronic device includes an electrical connection structure, and the electrical connection structure includes a through-hole having an extended area. The conductive material disposed in the through-hole having the extended area may have an enhanced electrical conductivity, thereby improving the reliability of the electrical connection structure, thereby enhancing the performance of the electronic device, and enabling the electronic device to have good electrical quality or display quality. Furthermore, the through-hole provides an additional extended area, which may also allow the device to have a larger allowable error value during the process of filling the conductive material, thereby improving the process yield. In addition, according to an embodiment of the present disclosure, the design of the electrical connection structure may allow electronic components (e.g., drive components) to be disposed on the back side of the substrate, thereby reducing the peripheral usage of the electronic device, thereby achieving technical requirements such as borderless, narrow border, or seamless splicing.

[0125] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. The features between the embodiments of the present disclosure can be mixed and matched as needed as long as they do not violate the spirit of the invention or conflict with each other. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present disclosure, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. The scope of protection of the present disclosure shall be subject to the scope of the appended claims. Any embodiment or claim of the present disclosure does not need to achieve all the purposes, advantages and features disclosed in this disclosure.

Claims

1. An electronic device, characterized in that: include: At least one electrical connection structure, wherein the at least one electrical connection structure comprises: a first substrate; A first conducting pad is disposed on the first substrate, wherein the first conducting pad includes a first upper surface and a first side surface; a second substrate, disposed opposite to the first substrate; a second conducting pad disposed on the second substrate, wherein the second conducting pad includes a second upper surface; a through hole passing through the first substrate, wherein in a top view, the through hole includes an extended area; and A conductive material is partially disposed in the extension region and contacts the first upper surface and the second upper surface.

2. The electronic device according to claim 1, wherein: In the top view, the first conducting pad includes a connection area, and the endpoints of the inner edge and the outer edge of the first conducting pad define the connection area.

3. The electronic device according to claim 2, wherein: The extension region at least partially overlaps with the connection region.

4. The electronic device as claimed in claim 3, characterized in that: The extended area exceeds the connecting area.

5. The electronic device as claimed in claim 2, characterized in that: The area of ​​the extended region is greater than or equal to one tenth of the area of ​​the connecting region.

6. The electronic device as claimed in claim 1, wherein: In the top view, the area of ​​the extended region is greater than or equal to 5% of the total area of ​​the through hole.

7. The electronic device as claimed in claim 1, characterized in that: The at least one electrical connection structure further includes an intermediate layer, which is disposed between the first substrate and the second substrate and partially covers the second conducting pad, wherein the through hole passes through the first substrate and the intermediate layer and exposes a portion of the second upper surface.

8. The electronic device as claimed in claim 1, wherein: The conductive material contacts the first upper surface, the first side surface and the second upper surface.

9. The electronic device as claimed in claim 1, wherein: It further includes another electrical connection structure, wherein the another electrical connection structure is electrically connected to the at least one electrical connection structure.

10. The electronic device as claimed in claim 2, characterized in that: The outer edge of the extension area protrudes from the connection of the end points of the outer edge of the first conducting pad.

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