Mask module, substrate carrier, substrate processing system, and method of processing substrate

Abstract

A mask module configured to be coupled to a substrate carrier is described. The mask module includes: a main body; a mask coupled to the body, the mask having one or more first openings; the movable gate plate is provided with one or more second openings; and an actuator coupled to the movable shutter plate. The actuator is configured to move the one or more second openings to align at least one of the one or more second openings over at least one of the one or more first openings.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the generation of test structures or test elements (e.g., test element groups) in a substrate processing system, in particular an in-line substrate processing system. In addition, embodiments of the present disclosure relate to systems and methods for evaporating OLED layer stacks. Embodiments of the present disclosure relate in particular to a mask module, a substrate carrier, a substrate processing system, a method for processing a substrate (e.g., in an in-line substrate processing system), and a method for manufacturing a layer stack for a display on a large-area substrate. Background Art

[0002] An organic light emitting diode (OLED) is a special type of light emitting diode in which the emissive layer comprises a thin film of certain organic compounds. OLEDs are used to make television screens, computer monitors, mobile phones, other handheld devices, etc. for displaying information. OLEDs can also be used for general space lighting. Since OLED materials emit light directly, OLED displays can have a greater range of colors and brightness than conventional LCD displays. OLED displays use much less energy than conventional LCD displays.

[0003] Furthermore, the fact that OLEDs can be manufactured on flexible substrates allows for further applications. An OLED display may include, for example, a layer of organic material between two electrodes, such as electrodes made of a metallic material. Typically, the OLED is placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED in the glass panels. Alternatively, the OLED may be encapsulated using thin film technology, such as with a barrier film.

[0004] For the manufacture of OLED devices but also for the manufacture of other devices, multiple material layers are deposited on a substrate. The multiple material layers can be deposited by corresponding multiple deposition sources (e.g., evaporation sources). The deposition sources can deposit different materials so that the deposition sources have individual source conditions, for example for optimized substrate processing. It is beneficial to monitor the individual source conditions. For example, it is beneficial to monitor the layer thickness or layer uniformity of the individual sources. In particular, operating condition monitoring can be provided during manufacturing under production conditions.

[0005] In view of the above, it would be beneficial to provide apparatus and methods that allow for individual monitoring of process conditions of different layers deposited on a substrate. Summary of the invention

[0006] In view of the above, a mask module, a substrate carrier, a substrate processing system and a method for processing a substrate, in particular in an inline deposition system, are provided. Further aspects, embodiments, features and details may be derived from the dependent claims, the drawings and the description.

[0007] According to an embodiment, a mask module configured to be coupled to a substrate carrier is provided. The mask module includes: a body; a mask, the mask being coupled to the body, the mask having one or more first openings; a movable shutter, the movable shutter having one or more second openings; and an actuator, the actuator being coupled to the movable shutter. According to some embodiments that may be combined with other embodiments described herein, the actuator is configured to move at least a portion of the mask module relative to the carrier. The actuator is configured to move the one or more second openings to align at least one of the one or more second openings above at least one of the one or more first openings.

[0008] According to an embodiment, a mask module configured to be coupled to a substrate carrier for carrying a substrate is provided. The mask module includes: a body; a movable shutter, the movable shutter including one or more second openings; one or more spacers, the one or more spacers are arranged on one side of the movable shutter and configured to be disposed between the movable shutter and the substrate; and an actuator, the actuator is coupled to the movable shutter and configured to move the one or more second openings to align at least one of the one or more second openings over a test element on the substrate.

[0009] According to an embodiment, a substrate carrier is provided. The substrate carrier comprises: a carrier body; an electrostatic chuck; a substrate receiving surface, the substrate receiving surface being provided in particular by the carrier body and / or the electrostatic chuck; and a mask module. The mask module comprises: a body; a mask coupled to the body, the mask having one or more first openings to be positioned above the substrate receiving surface; and a movable shutter having one or more second openings, wherein the mask is disposed between the movable shutter and the substrate receiving surface. The mask module further comprises an actuator coupled to the movable shutter and configured to move the one or more second openings relative to the one or more first openings.

[0010] According to an embodiment, a mask module configured to be coupled to a substrate carrier for carrying a substrate is provided. The mask module includes: a body; a movable shutter, the movable shutter including one or more second openings; one or more spacers, the one or more spacers are arranged on one side of the movable shutter and configured to be disposed between the movable shutter and the substrate; and an actuator, the actuator is coupled to the movable shutter and configured to move the one or more second openings to align at least one of the one or more second openings over a test element on the substrate.

[0011] According to an embodiment, a substrate processing system is provided. The substrate processing system comprises: one or more vacuum chambers; a plurality of deposition sources disposed in the one or more vacuum chambers; a substrate transport track configured to move one of the plurality of substrates and then pass through the plurality of deposition sources to deposit different material layers on the substrate; and one or more substrate carriers according to any of the embodiments described herein.

[0012] According to an embodiment, a method for processing a substrate is provided. The method includes: depositing a first material layer on the substrate, the first material being deposited in a device region and a first test region among a plurality of test regions, wherein the first material is deposited in the first test region through one or more first openings in a mask and through one or more second openings in a movable gate; moving one or more second openings relative to the one or more first openings; and depositing a second material layer on the substrate, the second material being deposited in the device region and a second test region among the plurality of test regions, wherein the second material is deposited in the second test region through one or more first openings in the mask and through one or more second openings in the movable gate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to be able to understand in detail the manner in which the above-mentioned features of the present disclosure are achieved, a more particular description of the present disclosure briefly summarized above may be made by reference to embodiments. The accompanying drawings relate to the embodiments and are described below:

[0014] Figure 1 shows a schematic diagram of a portion of a substrate carrier and a mask module according to an embodiment of the present disclosure;

[0015] Figure 2 shows a schematic diagram of a substrate carrier having one or more mask modules according to an embodiment of the present disclosure;

[0016] Figure 3A shows a schematic diagram of a portion of a substrate carrier and a mask module according to an embodiment of the present disclosure;

[0017] Figure 3B shows a schematic diagram of a portion of a substrate carrier and a mask module according to an embodiment of the present disclosure;

[0018] Figure 4A A schematic diagram showing a gate, a mask, and an overlapping arrangement of the gate and the mask;

[0019] Figure 4B A schematic diagram showing a gate, a mask, and an overlapping arrangement of the gate and the mask;

[0020] Figure 5AA schematic diagram showing a shutter and a mask according to an embodiment of the present disclosure is shown;

[0021] Figure 5B A schematic diagram showing a shutter having spacers to form a mask module according to an embodiment of the present disclosure;

[0022] Figure 6 A schematic diagram of a substrate processing system according to an embodiment of the present disclosure is shown; and

[0023] Figure 7 A flow chart depicting a method of processing a substrate according to embodiments described herein is shown. DETAILED DESCRIPTION

[0024] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals denote the same parts. Generally, only the differences with respect to a single embodiment are described. Each example is provided by way of explanation, but this is not meant to limit the present disclosure. Further, features illustrated or described as part of one embodiment may be used on other embodiments or used in conjunction with other embodiments to produce yet another embodiment. This specification is intended to include such modifications and changes.

[0025] The process of manufacturing an OLED display may include thermal evaporation of organic materials in a high vacuum and deposition of the organic materials on a substrate. In particular, multiple materials may be deposited to generate multiple material layers on a substrate. Measurement of the properties of individual material layers (e.g., layer thickness measurements of individual layers) is beneficial. Therefore, the process conditions used to deposit the individual layers may be monitored.

[0026] Embodiments of the present disclosure relate to a mask module, a substrate carrier, a substrate processing system and a method for processing a substrate. In particular, the substrate can be processed in an inline deposition system for generating a plurality of layers on a substrate, wherein, for example, the plurality of substrates are subsequently processed (in particular coated with a layer stack).

[0027] Embodiments of the present disclosure allow for masking portions of a substrate, particularly portions of a substrate on which no device is fabricated. The masking can be provided at different substrate locations to, for example, have only one material at a specific substrate location. This allows for process control over the deposition of a specific material.

[0028] The mask module and the substrate carrier carrying at least one mask module according to the embodiments of the present disclosure may be used in a vertical substrate processing system and a horizontal substrate processing system.

[0029] Figure 1A carrier 20 is shown. The substrate 10 is supported by the carrier 20. In addition, a mask module 100 according to an embodiment of the present disclosure is provided. The mask module 100 includes a body 110, a mask 120, and a shutter 130. In addition, an actuator 140 or a driving unit may be provided. The actuator 140 is configured to move the shutter 130 as indicated by an arrow 135.

[0030] The mask 120 and the shutter 130 are disposed at side regions of the substrate 10 , particularly at regions on the substrate where no devices are to be manufactured during production.

[0031] The mask 120 includes a plurality of first openings 122. The first openings 122 provide a structure for a test element. A plurality of test elements may be used to form a test element group, i.e., a group of test elements distributed above the substrate. The distribution of the test elements above the substrate allows the uniformity of material deposition to be measured or monitored. According to some embodiments that may be combined with other embodiments described herein, one or more first openings in the mask may define a plurality of test elements or test element groups. In particular, the test elements distributed above the substrate (e.g., along a line on the substrate) may define a test element group.

[0032] The mask is coupled to the body 110 of the mask module 100. One or more first openings 122 in the mask provide locations where different materials can be deposited for testing, measuring and / or monitoring. The shutter 130 includes one or more second openings 132. In order to deposit material on the substrate at a particular test element, the second openings 132 are aligned with the first openings 122. Figure 1 In the example shown in , the deposition source will be arranged above the paper plane, that is, above the substrate 10. The substrate, mask 120, gate 130 and evaporation source will be arranged in order starting from the paper plane. Therefore, according to some embodiments that can be combined with other embodiments described herein, the mask 120 can be arranged between the substrate 10 and the gate 130. It should be understood that for a vertical substrate orientation, for example, during vertical substrate processing, the elements will be adjacent to each other. The alignment of the second opening 132 with the first opening 122 allows material to be deposited on the substrate through the two openings.

[0033] According to some embodiments that can be combined with other embodiments described herein, the mask comprises a mask bar or a mask strip. The mask can have a first dimension of 40 mm or less and a second dimension of 500 mm or more. According to some embodiments that can be combined with other embodiments described herein, the mask has a first dimension and a second dimension, the second dimension being at least 6 times greater than the first dimension. In particular, Figure 1 As shown, the mask module or the mask and shutter are arranged along one side of the substrate 10 and may extend along the length of one side of the substrate. The mask module is arranged outside the substrate area, which is used to manufacture devices on the substrate.

[0034] like Figure 1 As shown, the plurality of first openings 122 may be equally spaced apart at a first distance. The plurality of first openings may be arranged in a line or more arranged to form a line. In addition, the plurality of second openings 132 may be spaced apart at a second distance 134, which is different from the first distance. Figure 1 Six second openings spaced apart by a second distance 134 are exemplarily shown. A plurality of second openings allow for simultaneous deposition of material on the substrate, in particular at different locations. The different locations may be arranged along one side of the substrate. The different substrate locations may be used to monitor or measure, for example, the uniformity of material deposition along a first substrate dimension (such as in a vertical direction).

[0035] By moving the shutter 130 with one or more second openings 132 as indicated by arrow 135, the one or more second openings can be aligned with a different first opening (test element) or a different plurality of first openings forming a test element group. The material deposited at the previous test element or the previous test element group is covered by the shutter. During production, the material deposition can be individualized on the substrate.

[0036] According to some embodiments, which can be combined with other embodiments described herein, the actuator 140 or the drive unit can be moved (e.g., Figure 1 In some embodiments, the gate 130 may be movable in parallel to a substrate receiving surface of a substrate carrier on which the substrate 10 is supported. According to some embodiments that may be combined with other embodiments described herein, the gate 130 has a length such that the length of the gate is sufficient to cover the mask (i.e., the mask rod) to reduce or avoid material deposition on the mask. According to some embodiments that may be combined with other embodiments described herein, the gate has a length greater than the length of the mask. According to some embodiments that may be combined with other embodiments described herein, the gate has a width greater than the width of the mask.

[0037] Figure 2A carrier 20 is shown. The carrier 20 is shown in a side view, wherein a vertical carrier orientation is described as an optional implementation. The carrier 20 supports a substrate 10. A first mask module 100 is shown on one side of the carrier (e.g., the left-hand side of the carrier). The first mask module may include an actuator 140 or a drive unit. According to some embodiments that may be combined with other embodiments described herein, a second mask module 100 or other mask modules may be arranged at a second side of the carrier. For example, the second side may be a side opposite to the first side. According to some embodiments that may be combined with other embodiments described herein, the substrate carrier 20 may include one or more mask modules according to an embodiment of the present disclosure. According to some embodiments that may be combined with other embodiments described herein, the mask has a first size, which is 20% or less, in particular 10% or less, of the size of the substrate receiving surface in the same direction. For example, during deposition, the mask 120 may only cover a total of 10% or less of the substrate, in particular an edge area of ​​the substrate that may be used for testing and / or monitoring purposes.

[0038] According to some embodiments, which may be combined with other embodiments described herein, the substrate carrier may further include one or more magnetic elements, which are configured to suspend and / or drive the carrier, for example using a magnetic levitation system, wherein the one or more magnetic elements are selected from the group consisting of magnetic materials, permanent magnets, electromagnets or combinations thereof.

[0039] According to some embodiments, a mask module configured to be coupled to a substrate carrier is provided. The mask module includes: a body; a mask, the mask being coupled to the body, the mask including one or more first openings; a movable gate, the movable gate including one or more second openings; and an actuator, the actuator being coupled to the movable gate and configured to move the one or more second openings of the gate to align at least one of the one or more second openings above at least one of the one or more first openings. In particular, the movable gate is arranged above the mask. According to some embodiments that may be combined with other embodiments described herein, the movable gate is arranged adjacent to the mask and optionally spaced apart from the substrate by a gap (see Figure 3A and Figure 3B For example, the gate may be arranged above the mask at a small distance (e.g., 1 cm or less or 1 mm or less) and / or may be arranged above the substrate at a small distance (e.g., 1 cm or less or 1 mm or less).

[0040] According to an embodiment, a substrate carrier is provided. The substrate carrier comprises a carrier body, an electrostatic chuck and a mask module. The carrier body may provide a substrate receiving surface, at which the electrostatic chuck of the substrate carrier may be used to carry a substrate 10. The mask module comprises: a body; a mask coupled to the body, the mask comprising one or more first openings to be positioned above the substrate receiving surface; a movable shutter, the movable shutter comprising one or more second openings, wherein the mask is disposed between the movable shutter and the substrate receiving surface; and an actuator coupled to the movable shutter and configured to move the one or more second openings relative to the one or more first openings, in particular configured to move the shutter relative to the mask.

[0041] like Figure 2 As shown in , a shutter of a mask module can be moved in the y direction in order to select a test element or a group of test elements during the processing of a layer stack.

[0042] According to some embodiments, which may be combined with other embodiments described herein, the mask module is detachable from and attachable to a substrate carrier. Making the mask module detachable and attachable to a substrate carrier allows transforming a "normal substrate carrier" into a "smart carrier". A "smart carrier" as referred to herein allows flexible exposure of test elements or groups of test elements on a substrate, for example by moving a shutter relative to a mask. Switching between test elements or groups of test elements may be provided during the manufacture of a layer stack, in particular in a substrate processing system. Switching between test elements or groups of test elements may be provided without removing the substrate carrier from a vacuum chamber or multiple vacuum chambers of the substrate processing system.

[0043] A "smart carrier" may be provided for an in-line substrate processing system. For example, by optimizing or improving source conditions and monitoring, thickness processing can be achieved, especially under large-scale production. For example, the monitoring may indicate the direction of the material plume and / or the nozzle direction of the deposition source. A mask module (e.g., a detachable mask module) may be provided, which provides a mask and a gate for a test element or a group of test elements. For example, one or two mask modules may be arranged on different sides of a substrate carrier, such as at the left and / or right side of the substrate carrier. In particular, the mask module may be arranged at the substrate carrier in a zone or area on the substrate where device manufacturing is not performed.

[0044] Figure 3A and Figure 3BA carrier 20 and a mask module coupled to the carrier 20 are shown. The carrier includes a carrier body 310 and an electrostatic chuck 320. For example, the electrostatic chuck includes one or more electrodes 322. The one or more electrodes 322 may be biased to generate an attractive force on the substrate 10. According to some embodiments that may be combined with other embodiments described herein, the one or more electrodes may be embedded in the dielectric material of the carrier body. The mask module includes a mask 120 having one or more first openings 122 and a shutter 130 having one or more second openings 132. In addition, the mask module includes a body and an actuator 140. The mask 120 may be attached to the body of the mask module. According to some embodiments that may be combined with other embodiments described herein, the mask 120 may be attracted toward the carrier by the electrostatic chuck, in particular by an electrostatic force provided by the electrostatic chuck. For example, the mask 120 may be attracted toward the substrate 10 so as to contact the substrate through the one or more first openings 122 during material deposition. Additionally or alternatively, the body of the mask module may be attached to the carrier by the electrostatic chuck. According to some embodiments, which can be combined with other embodiments described herein, a body of the mask module includes a material configured to be attracted by an electrostatic force of an electrostatic chuck.

[0045] like Figure 3A As shown, the second opening 132 may be larger than the first opening. However, this may result in material being deposited on the mask 120. According to some embodiments that may be combined with other embodiments described herein, and as Figure 3B As shown, one or more of the second openings 132, in particular each of the second openings 132, may be smaller than one or more of the first openings 122, in particular each of the first openings 122. Material deposition on the mask 120 may be reduced or avoided. Thus, no material is deposited between the mask 120 and the shutter 130 (e.g., in the gap between the mask 120 and the shutter 130). Particle generation, in particular when the shutter 130 is moved to align the second openings with different first openings, may be reduced or avoided.

[0046] According to some embodiments, which can be combined with other embodiments described herein, the mask comprises a metal sheet, in particular a thin and / or flexible metal sheet.The metal material may be configured to be attracted by the electrostatic chuck.

[0047] As indicated by arrow 330, at least mask 120 and shutter 130 may be moved relative to substrate carrier 20. According to some embodiments, which may be combined with other embodiments described herein, at least a portion of the mask module may be moved relative to the substrate carrier. In particular, at least a portion of the mask module may be moved relative to the substrate carrier for loading or unloading of the substrate. According to some embodiments, a portion of the mask module may be moved by actuator 140. Additionally or alternatively, the mask module may include other drive units configured to move the mask module or a portion of the mask module relative to the carrier. While the shutter of the mask module may be moved in the y direction during the processing of the layer stack for selecting a test element or a test element group, a portion of the mask module (e.g., mask and shutter (and optionally the body of the mask module)) may be moved at least in the x direction and in particular also in the z direction for loading and unloading of the substrate.

[0048] According to some embodiments, which can be combined with other embodiments described herein, movement parallel to the plane of the substrate receiving surface allows unloading or loading of a substrate (e.g., a glass plate). Specifically, the mask and the shutter can be moved to a loading position, in which the substrate receiving surface is not covered by the mask module, so that the substrate 10 can be loaded onto or unloaded from the substrate receiving surface. The mask and the shutter can be moved to a deposition position, in which the mask and the shutter are at least partially arranged above the substrate 10, and the substrate is loaded and carried on the substrate receiving surface (see Figure 3A and Figure 3B ). Deposition of material(s) on the substrate through the mask and the gate openings may be performed in a deposition position.

[0049] According to some embodiments, which can be combined with other embodiments described herein, movement perpendicular to the substrate receiving surface and / or diagonal movement allows separation of the mask 120 from the substrate 10. Damage to the substrate can be avoided. According to some embodiments, which can be combined with other embodiments described herein, at least the mask and the shutter can be moved relative to the substrate receiving surface in one or more of the following directions: (i) a first movement direction perpendicular to the substrate receiving surface and a second direction parallel to the substrate receiving surface; (ii) a combined movement direction, which is a combination of the first movement direction and the second movement direction (see Figure 3A and Figure 3B slanted arrow in the figure).

[0050] The mask and the shutter may be moved by the actuator 140 or a different drive unit. The actuator or drive unit may be integrated in the mask module or may be separate. For example, the mask module may be coupled to a first edge region of a carrier or carrier body and may be movable between a first position (in which the mask is not arranged above the substrate receiving surface) and a second position (in which the mask is arranged above the edge region of the substrate receiving surface) (e.g., Figure 3A and Figure 3B The mask module may be coupled to the first edge region of the carrier body such that the mask may be positioned over the substrate receiving surface or the first edge region of the substrate, respectively.

[0051] Figure 4B On the left hand side, a gate 130 having an opening (ie, the second opening 132) is shown. Figure 1 As shown by way of example in FIG. 1 , other openings may be provided. In the center, a mask 120 having a plurality of openings 522 is shown. Figure 4B The right hand side of FIG. 1 shows a mask and a shutter on top of the mask. The shutter can be moved as indicated by arrow 135. Thus, the second opening 132 can be aligned with one of the first openings 522. Furthermore, after the shutter is moved, the second opening 132 can be aligned with the other of the first openings 522. A test element or a group of test elements can be selected by moving the shutter.

[0052] According to some embodiments that can be combined with other embodiments described herein, the one or more first openings in the mask may be a plurality of first openings arranged in a line. The plurality of first openings may be equally spaced apart at a first distance, and in particular, the one or more second openings may be a plurality of second openings equally spaced apart at a second distance, the second distance being N times the first distance, wherein N is an integer > 1. Figure 4B As shown, the second opening 132 may be larger than each of the first openings 522. However, as will be discussed below with respect to Figure 5A Explained in more detail, the second opening 132 may be smaller than the first opening. This is beneficial to avoid or reduce material deposition on the mask 120 in order to reduce particle generation, especially when the shutter 130 moves.

[0053] like Figure 4BAs shown on the right hand side of , the actuator is configured to move the movable gate to position at least one of the one or more second openings 132 to be aligned over at least one of the one or more first openings. Thus, the actuator can move the movable gate to different monitoring positions, the different monitoring positions including at least a first monitoring position and a second monitoring position, wherein in the first monitoring position, the one or more second openings are aligned over a first subset or a first sub-region of the one or more first openings, and in the second monitoring position, the one or more second openings are aligned over a second subset or a second sub-region of the one or more first openings that is different from the first subset or the first sub-region.

[0054] Specifically, the one or more first openings may include a plurality of first openings, and in a first monitoring position, the one or more second openings are positioned to be aligned over a first subset of the plurality of first openings, and in a second monitoring position, the one or more second openings are positioned to be aligned over a second subset of the plurality of first openings, the second subset being different from the first subset.

[0055] For example, the one or more second openings may include N second openings, and the plurality of first openings may include M subsets of the N first openings, N and M are positive integers, the actuator is configured to move the movable gate to M monitoring positions, and in each of the M monitoring positions, the N second openings are aligned over the N first openings of the corresponding subset of the first openings. For example, N is 2, 3 or greater, and / or M is 5, 10 or greater.

[0056] Figure 4A The shutter 130 is shown with a second opening 132 on the left hand side and a mask 120 with a first opening 422 in the center. The first opening may be a slit opening. Figure 4A On the right hand side in FIG. 1 , the shutter 130 is shown on top of the mask 120. According to some embodiments, the one or more first openings may be one or more slit openings forming a line. According to some embodiments, the one or more second openings are smaller than each of the one or more slit openings. Figure 4AIn one embodiment, the one or more second openings are positioned to align over a first sub-region of the one or more slit openings, and in a second monitoring position (not shown), the one or more second openings are positioned to align over a second sub-region of the one or more slit openings that is different from the first sub-region. For example, the one or more first openings include N slit openings, and the one or more second openings include N second openings, and in each of the different monitoring positions, each of the N second openings is aligned over a sub-region of a corresponding one of the N slit openings. For example, each of the N slit openings may include M sub-regions defining M monitoring positions, and in each of the M monitoring positions, each of the N second openings of the gate may be aligned over a corresponding one of the M sub-regions of a corresponding one of the N slit openings. In some embodiments, N may be 2, 3 or greater, and M may be 5 or greater or 10 or greater.

[0057] As described above, the one or more slit openings have a slit length dimension in the length direction and a slit width dimension that is smaller than the slit length dimension in the width direction, respectively, and the one or more second openings of the movable shutter may have a dimension that is smaller than the slit width dimension in the length direction and the width direction. If the one or more second openings of the movable shutter are smaller than the one or more first openings of the mask, material deposition on the mask may be reduced or avoided.

[0058] Figure 5A A schematic side view of a mask module 100 disposed over a portion of a substrate 10 is shown. The mask module includes a mask 120 and a shutter 130. The mask 120 includes a plurality of first openings 122. The shutter includes a plurality of second openings 132. A gap 325 may be provided between the substrate and the shutter 130. The second openings 132 may be positioned to align with corresponding first openings to allow deposition of test material on the substrate 10.

[0059] According to some embodiments, which can be combined with other embodiments described herein, one or more of the second openings 132, in particular each of the second openings 132, can be smaller than one or more of the first openings 122, in particular each of the first openings 122. As shown in the deposition profile 510, the material is deposited on the substrate. The deposition of material on the mask 120 can be reduced or avoided. Therefore, no material is deposited between the mask 120 and the shutter 130 (for example, in the gap between the mask 120 and the shutter 130). Particle generation, in particular when the shutter 130 moves to align the second openings with different first openings, can be reduced or avoided.

[0060] Figure 5B 1 and 2 show other embodiments of the mask module 500. The mask module 500 includes a shutter 130. The shutter 130 may be provided along a direction of Figure 2The gate is moved in the y direction described. One or more second openings 132 of the gate can be positioned above the test element or test element group on the substrate 10. The distribution of the test elements above the substrate allows the uniformity of material deposition to be measured or monitored. According to some embodiments that can be combined with other embodiments described herein, one or more second openings in the gate 130 of the mask module 500 can define a plurality of test elements or test element groups. In particular, the test elements distributed above the substrate (e.g., along a line on the substrate) can define a test element group.

[0061] A gap 525 is provided between the gate 130 and the substrate 10. As exemplarily shown in the deposition profile 510, the gap avoids or reduces scratching of the gate 130 over the material deposited at the test element. Thus, particle generation, particularly when the gate 130 is moved, can be reduced or avoided. The gap 525 can be provided by one or more spacers 520. The one or more spacers 520 can be formed integrally with the gate 130 or can be coupled to the gate. Figure 5B The spacers shown in FIG. are drawn with dashed lines. The dashed lines indicate that the spacers are not Figure 5B The spacer is arranged in a plane in which no second opening 132 is arranged in the shutter. Therefore, the spacer will not generate particles when the shutter moves and in particular causes the spacer to move over the substrate 10.

[0062] According to one embodiment, a mask module configured to be coupled to a substrate carrier for carrying a substrate is provided. The mask module includes a main body and a movable gate, the movable gate including one or more second openings. The mask module further includes: one or more spacers, the one or more spacers are arranged on one side of the movable gate and are configured to be arranged between the movable gate and the substrate; and an actuator, the actuator is coupled to the movable gate and is configured to move the one or more second openings to align at least one of the one or more second openings above a test element on the substrate. For example, the one or more spacers may be coupled to the movable gate or formed integrally with the movable gate.

[0063] According to some embodiments that may be combined with other embodiments described herein, the one or more second openings of the gate include two, three or more second openings distributed on the substrate receiving surface along the first direction. In particular, wherein the first direction is a vertical direction. In particular, the one or more second openings of the gate include: an upper opening arranged above an upper edge region of the substrate receiving surface; a lower opening arranged above a lower edge region of the substrate receiving surface; and optionally, one or more other openings arranged between the upper opening and the lower opening above an area of ​​the substrate receiving surface between the upper edge region and the lower edge region. If two, three or more second openings are arranged away from each other in the first direction (e.g., in the vertical direction), the thickness uniformity of the deposited material along the first direction can be checked and / or monitored.

[0064] In view of the above, a plurality of test elements or test element group patterns may be provided by holes or slit holes.The mask (eg thin mask bar) may be fixed to the mask module by welding or may be assembled onto the module.

[0065] According to some embodiments that can be combined with other embodiments described herein, a plurality of second openings can be provided in the gate. A plurality of second openings can provide a test element group. The holes (i.e., second openings) can form an array defining uniformity measurement points and positions, for example 3 points, such as top, middle, and bottom.

[0066] Figure 6 A substrate processing system 600 is shown. Figure 6 The substrate processing system 600 shown in FIG. 6 includes a plurality of vacuum chambers. The one or more vacuum chambers may include a vacuum processing chamber 602 and a vacuum transfer chamber 604 . Figure 6 Three vacuum processing chambers and two vacuum transfer chambers are shown as examples. The vacuum processing chamber 602 is included in the substrate processing device. The glass processing module 630 can be arranged at one end of the substrate processing system 600. The glass processing module can load and / or unload the substrate into the vacuum processing chamber, such as on a corresponding substrate carrier. In addition, a rotation module 620 (e.g., a vacuum rotation module) can be arranged at the second end of the substrate processing system, and the second end is far away from the mask processing module.

[0067] like Figure 6 The illustrated substrate processing system is an in-line substrate processing system. The substrates processed in the substrate processing system 600 are loaded into the glass processing module, such as on a substrate carrier, and the substrates are unloaded from the substrate carrier at the glass processing module. The substrates can be transported in one direction (e.g., in one direction) on the first substrate transport track 632. Figure 1The substrate can be transported on the second substrate transport track 632 (for example, from left to right in the glass processing module). The substrate can be rotated in the rotation module and transferred to the second substrate transport track 632. The substrate can be transported on the second substrate transport track (for example, from right to left) for unloading at the glass processing module. Therefore, after unloading the processed substrate, the empty carrier is set at the same position where a new substrate is loaded onto the empty carrier. Therefore, the transportation of empty carriers, for example on the carrier return path, can be avoided or reduced. In addition, the exposure of the carrier to atmospheric conditions can be avoided or reduced to a minimum. In addition, the rotation module allows "folding" the substrate processing system. As shown in FIG. Figure 6 As shown in an exemplary embodiment, the substrate processing system may include: a forward transport path on a first substrate transport track, the forward transport path being used to deposit a first set of material layers, such as an organic layer, on the substrate; and a backward transport path on a second substrate transport track, the backward transport path being used to deposit a second set of material layers above the first set of material layers. The substrate is rotated between the forward transport path and the backward transport path by a rotation module 620. By "folding" the substrate processing system, the length of the substrate processing system can be reduced.

[0068] The inline substrate handling system may be a display manufacturing system (particularly an OLED display manufacturing system, and more particularly an OLED display manufacturing system for large area substrates) or part of a display manufacturing system. The transport of the substrate carrier (i.e., the movement of the substrate carrier through the inline substrate handling system) may be performed, for example, in a vertical orientation state of the substrate carrier. For example, the substrate carrier may be configured to maintain a substrate (such as a glass plate) in a vertical orientation state or a substantially vertical orientation state. The substrate may be a substrate carrier as described herein. In particular, the substrate carrier may be a "normal substrate carrier" or a "smart carrier" provided with a mask module as described herein.

[0069] In the examples described above, the substrate processing system is described as a vertical substrate processing system, wherein the substrate is processed in a vertical orientation. However, the mask module, substrate carrier and substrate processing system may also be configured as a mask module, substrate carrier and substrate processing system wherein the substrate is processed in a horizontal orientation.

[0070] According to some embodiments that may be combined with other embodiments described herein, the substrate carrier may be configured to hold or carry a substrate or a substrate and a mask in a substantially vertical orientation. As used throughout the present disclosure, "vertical" or "substantially vertical" is understood to allow deviations from the vertical direction or orientation of ±20° or less, such as ±10° or less, particularly when it comes to substrate orientation. Such deviations may be provided, for example, because a substrate support having a certain deviation from the vertical orientation may result in a more stable substrate position. In addition, when the substrate is tilted forward, fewer particles reach the substrate surface. However, during deposition of materials (such as organic or metallic materials) on a substrate in a high vacuum, for example, the substrate orientation is considered to be substantially vertical, which is considered to be different from a horizontal substrate orientation, which may be considered to be horizontal ±20° or less.

[0071] like Figure 6 As shown, a substrate transport track 632 may be provided. According to some embodiments, the substrate transport track may be configured for contactless transport of a substrate carrier. The contactless transport may be a magnetic levitation system. In particular, a magnetic levitation system may be provided so that at least a portion of the weight of the substrate carrier is carried by the magnetic levitation system. The carrier may then be guided substantially contactlessly along the substrate transport track through the in-line substrate processing system. In particular, the transport may include a carrier holding structure and a carrier drive structure. The carrier holding structure may be configured for contactless holding of the carrier. The carrier drive structure may be configured for contactless translation of the carrier. The carrier holding structure may include a magnetic levitation system for contactless holding of the substrate carrier. In addition, the carrier drive structure may include a magnetic drive system for contactless drive of the carrier.

[0072] The substrate processing system may include a forward transport path. The forward transport path includes a substrate transport track. For example, the forward transport path may be Figure 6 6, wherein the substrate is transported from left to right through the substrate processing system 600. The deposition source 610 may be disposed in the vacuum processing system. According to some embodiments that may be combined with other embodiments described herein, the deposition source 610 may be an organic deposition source. Additionally, the deposition source may be a metal deposition source, for example, for depositing a cathode of a device to be manufactured on the substrate.

[0073] The deposition source is disposed in a vacuum processing chamber of the substrate processing device. According to some embodiments that can be combined with other embodiments described herein, one or more deposition sources in the substrate processing system 600 can be evaporation sources and can be line sources extending substantially vertically. For example, when the substrate moves past the deposition source 610 providing the line source, an organic material or a metal-containing material can be deposited on the substrate.

[0074] According to some embodiments, which can be combined with other embodiments described herein, the forward transport path can be separated from the backward transport path by one or more protective covers 614. The protective cover 614 separates the forward transport path from the backward transport path to allow, for example, deposition of different materials in a vacuum processing chamber of the substrate processing system 600.

[0075] like Figure 6 As shown, a plurality of substrate carriers are provided in the substrate processing system 600. For example, during mass production, the "normal substrate carrier" 640 may be replaced by a "smart carrier" 650. Figure 6 A "normal substrate carrier" in white and a "smart carrier" in black are shown. Due to the compatible design of the carrier and / or the attachability of the mask module on the carrier, the benefits of the "smart carrier" according to embodiments of the present disclosure can be provided for mass production, i.e. during normal operation.

[0076] Back to Figure 3A and Figure 3B , at least a portion of the mask module has been described as being movable for loading or unloading a substrate, such as a glass sheet. Loading and unloading can be provided in a horizontal substrate orientation (e.g., with the substrate facing upward). Thus, in particular by moving the mask and the shutter away from the substrate receiving surface, the glass (or substrate) can also be replaced on a "smart carrier" under vacuum. In addition, the "smart carrier" can be stored in a mask stocker, or the mask module can be attached or detached in the mask stocker.

[0077] According to some embodiments, which can be combined with other embodiments described herein, the mask module may also be attachable or detachable for cleaning, in particular for cleaning the shutter and / or the mask.

[0078] like Figure 6 As shown, the "smart carrier" can move through the substrate processing system. When the substrate carrier moves the substrate through the first deposition source 610, the gate can be in a first monitoring position. The gate movement signal can be provided at, before or after a specific deposition source (e.g., a specific processing chamber). For example, the gate movement signal can be provided by a remote control or a mechanical signal. Therefore, the gate can be moved from the first monitoring position to a second monitoring position different from the first monitoring position. In the first monitoring position, the gate exposes a first test element or a first test element group, i.e., one or more first openings in the mask. In the second monitoring position, the gate exposes a second test element or a second test element group, i.e., one or more different first openings in the mask. Therefore, material deposition from the first deposition source can be separated from material deposition from another deposition source. For example, in order to measure and / or monitor material properties or material layer properties, conventional measurement techniques can be used to measure material properties or material layer properties, such as layer thickness and / or thickness uniformity of the layer over the entire substrate surface.

[0079] According to some embodiments, which can be combined with other embodiments described herein, the substrate carrier can be an electrostatic chuck (E-chuck), which provides an electrostatic force to hold the substrate and optionally the mask at the substrate carrier, and in particular at the substrate receiving surface. For example, the substrate carrier comprises an electrode arrangement configured to provide an attractive force acting on the substrate.

[0080] The embodiments described herein may be used to deposit materials (such as organic materials or metallic materials) on large area substrates, for example for use in OLED display manufacturing. Specifically, the substrate for which the structures and methods according to the embodiments described herein are provided may be a large area substrate. For example, a large area substrate may be a substrate having a thickness of about 0.67 m 2 The surface area of ​​GEN 4.5 is about 1.4m 2 The surface area of ​​GEN 5 is about 4.29m 2 The surface area of ​​GEN 7.5 is about 5.7m 2 (2.2m x 2.5m) corresponding to the GEN 8.5 or even with about 8.7m 2 (2.85 m x 3.05 m) surface area corresponding to GEN 10. Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can be similarly realized. Half-sized GEN generations can also be provided in OLED display manufacturing.

[0081] According to some embodiments that can be combined with other embodiments described herein, the substrate thickness can be from 0.1 mm to 1.8 mm. The substrate thickness can be about 0.9 mm or less, such as 0.5 mm. The term "substrate" as used herein may particularly include substantially non-flexible substrates, such as glass plates or other substrates. However, the present disclosure is not limited thereto, and the term "substrate" may also include flexible substrates, such as coils or foils. The term "substantially non-flexible" should be understood to be distinguished from "flexible". Specifically, a substantially non-flexible substrate may have a certain degree of flexibility, such as a glass plate having a thickness of 0.9 mm or less (such as 0.5 mm or less), wherein the substantially non-flexible substrate is less flexible than the flexible substrate.

[0082] Embodiments of the present disclosure provide carriers and / or mask modules for carriers for layer thickness measurement and / or layer uniformity measurement, etc. (especially on different material layers deposited by more than one deposition source, especially multiple deposition sources). A conveying carrier, i.e., a substrate carrier, is provided for layer thickness measurement in an evaporation device. A carrier according to an embodiment of the present disclosure, which can be combined with other embodiments described herein, may include a substrate chuck unit, in particular an electrostatic chuck. In some embodiments, the carrier can be operated in a horizontal and vertical system. Due to the detachable concept of the mask module and / or the ability to move at least a portion of the mask module, glass can be loaded or unloaded from a glass loading / unloading module. An inspection process for a separate material layer or a separate material can be provided without removing the glass from the vacuum chamber. By having a wireless control system, the condition of the carrier can be checked in real time.

[0083] Figure 7 A flow chart illustrating one or more methods of processing a substrate is shown. In operation 702, a first material layer is deposited on a substrate. The first material is deposited in a device region and a first test region of a plurality of test regions. The first material is deposited in the first test region through one or more first openings in a mask and through one or more second openings in a movable shutter. In operation 704, one or more second openings are moved relative to the one or more first openings. For example, the movable shutter may be moved by an actuator. In particular, as Figure 1 and Figure 2 As shown, the movable gate can be moved in the y direction. In operation 706, a second material layer is deposited on the substrate. The second material is deposited in the device area and the second test area of ​​the plurality of test areas. The second material is deposited in the second test area through one or more first openings in the mask and through one or more second openings in the movable gate. In particular, the one or more first openings for depositing the second material are openings different from the one or more first openings for depositing the first material.

[0084] According to some embodiments that can be combined with other embodiments described herein, the movable gate can be moved to different monitoring positions or test areas by an actuator, and the different monitoring positions or test areas include at least one first monitoring position or first test area and a second monitoring position or second test area. In the first monitoring position, the one or more second openings are aligned above a first subset or first sub-area of ​​the one or more first openings, and in the second monitoring position, the one or more second openings are aligned above a second subset or second sub-area of ​​the one or more first openings that is different from the first subset or first sub-area. Different materials are deposited in separate test areas among the multiple test areas, i.e., different monitoring positions.

[0085] According to some embodiments, which can be combined with other embodiments described herein, a common test area or a common monitoring location may be provided, wherein two or more materials are deposited in the common test area.

[0086] According to some embodiments, the method may further include: before depositing the first material layer, loading the substrate onto a substrate carrier. Figure 3A and Figure 3B The mask and the movable gate are moved relative to the carrier body of the substrate carrier in the x-direction and the z-direction shown in , so as to set the mask and the movable gate above the substrate. The substrate is fixed to the substrate carrier using the force of the electrostatic chuck. In addition, the mask can be fixed to the substrate carrier by the force of the electrostatic chuck. The method as described herein may include embodiments of the mask module and the substrate carrier according to any of the embodiments of the present disclosure. Operations for implementing, utilizing or operating the mask module or the substrate carrier may be provided in the method described herein.

[0087] According to further embodiments, the method of processing a substrate as described herein may provide a method for manufacturing a layer stack of a device, in particular an OLED display device.

[0088] In view of the above, embodiments of the present disclosure may provide one or more of the following advantages. Material properties and material layer properties may be monitored individually. For example, the layer thickness of individual layers may be determined. Deposition source conditions may be monitored individually. The substrate carrier may be modified to be a "smart carrier". The "smart carrier" may be used during mass production to assess manufacturing conditions during normal operation of a substrate processing system.

[0089] While the foregoing is directed to certain embodiments, other and further embodiments may be devised without departing from the scope, which is determined by the appended claims.

Claims

1. A mask module configured to be coupled to a substrate carrier; The mask module comprises: main body; a mask coupled to the body, the mask comprising one or more first openings; a movable gate including one or more second openings; and An actuator is coupled to the movable gate and is configured to move the one or more second openings to align at least one of the one or more second openings over at least one of the one or more first openings. 2 . The mask module of claim 1 , wherein the mask module is detachable from and attachable to the substrate carrier.

3. The mask module according to any one of claims 1 to 2, wherein at least a portion of the mask module is movable relative to the substrate carrier. 4 . The mask module according to claim 1 , wherein the mask module further comprises an actuator configured to move at least a portion of the mask module relative to the carrier. 5 .

5. The mask module according to any one of claims 1 to 4, wherein the mask comprises a mask bar or a mask strip. 6 . The mask module according to claim 1 , wherein the mask comprises a metal sheet, in particular, wherein the metal sheet is configured to be attracted by an electrostatic chuck of the substrate carrier. 7 . The mask module according to claim 1 , wherein the one or more first openings are a plurality of first openings arranged to form a line.

8. The mask module according to claim 7, wherein the plurality of first openings are equally spaced apart at a first distance, and in particular, wherein the one or more second openings are a plurality of second openings equally spaced apart at a second distance, the second distance being N times the first distance, wherein N is an integer >1. 9 . The mask module according to claim 1 , wherein the one or more second openings are smaller than each of the one or more first openings.

10. A mask module configured to be coupled to a substrate carrier for carrying a substrate; The mask module comprises: main body; a movable gate, the movable gate comprising one or more second openings; one or more spacers disposed on one side of the movable shutter and configured to be disposed between the movable shutter and the substrate; and An actuator is coupled to the movable shutter and is configured to move the one or more second openings to align at least one of the one or more second openings over a test element on a substrate. 11 . The mask module of claim 10 , wherein the one or more spacers are coupled to or integrally formed with the movable shutter.

12. A substrate carrier; The substrate carrier comprises: A carrier body; Electrostatic chuck; a substrate receiving surface, the substrate receiving surface being provided in particular by the carrier body and / or the electrostatic chuck; and The mask module according to any one of claims 1 to 11.

13. The substrate carrier of claim 12; wherein at least the mask and the shutter are movable relative to the substrate receiving surface in the following directions: (i) a first movement direction perpendicular to the substrate receiving surface and a second direction parallel to the substrate receiving surface; (ii) a combined moving direction, the combined moving direction being a combination of the first moving direction and the second moving direction; or (iii) the first moving direction, the second moving direction and the combined moving direction.

14. The substrate carrier according to any one of claims 12 to 13, wherein at least the mask and the shutter are movable by a drive unit or the actuator.

15. The substrate carrier of any one of claims 12 to 14, wherein the movable shutter is movable parallel to the substrate receiving surface.

16. The substrate carrier of any one of claims 12 to 15, wherein the actuator is configured to move the movable shutter to a position in which at least one of the one or more second openings is aligned over at least one of the one or more first openings.

17. The substrate carrier according to any one of claims 12 to 16, wherein the actuator is configured to move the movable shutter to different monitoring positions, the different monitoring positions comprising at least a first monitoring position and a second monitoring position, Wherein, in the first monitoring position, the one or more second openings are aligned over a first subset or a first sub-region of the one or more first openings, and in the second monitoring position, the one or more second openings are aligned over a second subset or a second sub-region of the one or more first openings that is different from the first subset or the first sub-region.

18. A substrate processing system, comprising: one or more vacuum chambers; a plurality of deposition sources, the plurality of deposition sources being disposed in the one or more vacuum chambers; a substrate transport track configured to move a substrate of a plurality of substrates subsequently past the plurality of deposition sources to deposit different material layers on the substrate; and One or more substrate carriers according to any one of claims 12 to 17.

19. A method for processing a substrate; the method comprising: Depositing a first material layer on the substrate, the first material being deposited in a device region and a first test region among a plurality of test regions, wherein the first material is deposited in the first test region through one or more first openings in the mask and through one or more second openings in the movable shutter; moving the one or more second openings relative to the one or more first openings; as well as A second material layer is deposited on the substrate, the second material being deposited in the device region and a second test region among the plurality of test regions, wherein the second material is deposited in the second test region through the one or more first openings in the mask and through the one or more second openings in the movable shutter.

20. The method of claim 19, wherein moving the one or more second openings comprises: The movable gate is moved to different monitoring positions by an actuator, wherein the different monitoring positions include at least a first monitoring position and a second monitoring position, Wherein, in the first monitoring position, the one or more second openings are aligned over a first subset or a first sub-region of the one or more first openings, and in the second monitoring position, the one or more second openings are aligned over a second subset or a second sub-region of the one or more first openings that is different from the first subset or the first sub-region.

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