UV curing light source equipment, UV curing equipment and light intensity real-time measurement method

Abstract

The invention provides UV curing light source equipment, UV curing equipment and a light intensity real-time measurement method. The UV curing light source equipment comprises a light-emitting assembly and a power supply controller. The light-emitting assembly comprises a lamp tube, an optical probe and a light detection plate. The optical probe comprises a high-temperature area acquisition unit, a low-temperature area acquisition unit and a transmission medium; the high-temperature area acquisition unit is fixed in a light-emitting area of the lamp tube and is used for acquiring a signal of a required spectrum section emitted by the lamp tube; the transmission medium transmits signals acquired by the high-temperature area acquisition unit to the low-temperature area acquisition unit; the low-temperature area acquisition unit and the optical detection board are integrated through a circuit; and the light detection plate feeds back a light intensity value obtained by the low-temperature area acquisition unit to the power supply controller. The power supply controller displays and monitors the light intensity value fed back by the light detection plate in real time, and when the light intensity value is lower than a preset value, the output power of the power supply is adjusted in a self-feedback mode so as to adjust the light intensity of the light emitting assembly.

Description

Technical Field

[0001] The invention relates to the field of semiconductor equipment manufacturing, and in particular to an ultraviolet light curing device. Background Art

[0002] With the continuous advancement of semiconductor process technology, when semiconductor devices are reduced to the deep submicron range, low dielectric materials are needed to reduce the RC delay time caused by parasitic capacitance. Currently, the formation process of low dielectric materials is usually achieved by ultraviolet (UV) curing process.

[0003] The wavelength of industrial ultraviolet light is 200nm to 450nm. The process of using ultraviolet light to irradiate hardenable materials to harden them is called UV light curing process. UV light curing process requires the use of UV curing equipment, but the light intensity of UV curing equipment fluctuates. Currently, there is no equipment or solution that can stably measure the light intensity or measure the light intensity in real time. When the process results are unstable, it cannot be predicted in advance, resulting in a large number of wafers and time being wasted.

[0004] The above technical problems are embodied in the following three problems:

[0005] First, when the UV curing equipment is performing process processing, the light intensity cannot be measured in real time. It can only measure the reflected light intensity from the side, but this light intensity does not directly act on the silicon wafer;

[0006] Secondly, during measurement, the rotation of the second-layer reflector will intermittently block the probe, causing the measured light intensity to be intermittent, making it impossible to effectively determine whether it is usable.

[0007] Thirdly, the existing equipment cannot automatically adjust the power of the measured light and needs manual modification. This method has the problems of untimely response and waste of human resources. Summary of the invention

[0008] In order to overcome the above technical problems in the prior art, the present invention provides a UV curing light source device, a UV curing device and a real-time light intensity measurement method.

[0009] The invention provides a UV curing light source device, comprising a light emitting component and a power supply controller.

[0010] The light-emitting component includes a lamp tube, an optical probe, and a light detection board.

[0011] The optical probe includes a high temperature zone collection unit, a low temperature zone collection unit and a transmission medium; the high temperature zone collection unit is fixed in the light-emitting area of ​​the lamp tube to collect signals of the required spectral band emitted by the lamp tube; the transmission medium transmits the signals collected by the high temperature zone collection unit to the low temperature zone collection unit; the low temperature zone collection unit is integrated with the light detection board circuit; the light detection board feeds back the light intensity value obtained by the low temperature zone collection unit to the power controller.

[0012] The power supply controller displays and monitors the light intensity value fed back by the light detection board in real time. When the light intensity value is lower than a preset value, the power supply output power is adjusted by self-feedback to adjust the light intensity of the light-emitting component.

[0013] In one embodiment, the high temperature zone collection unit is a fiber optic probe, the low temperature zone collection unit is a photoelectric sensor, and the transmission medium is an optical fiber.

[0014] In one embodiment, the light emitting assembly further comprises a microwave cavity within the light emitting region, the optical fiber probe is mounted on a probe mounting hole on the microwave cavity, and the optical fiber probe directly receives direct light emitted by the lamp tube.

[0015] In one embodiment, the probe mounting hole is a mounting hole specially opened on the microwave cavity.

[0016] In one embodiment, the probe mounting hole utilizes one of a plurality of existing heat dissipation holes on the microwave cavity as a mounting hole.

[0017] In one embodiment, the optical fiber transmits the optical signal collected by the optical fiber probe to the photoelectric sensor, and the photoelectric sensor converts the optical signal into an electrical signal to obtain the light intensity value and sends it to the light detection board.

[0018] In one embodiment, a reflecting device is further included, wherein the reflecting device comprises:

[0019] A first reflection module, used for reflecting a portion of the light in a required spectrum band emitted by the lamp tube; and

[0020] The second reflection module has an upper surface with a fine polishing coating area for reflecting the direct light of the lamp tube and the reflected light from the first reflection module to converge the direct light and the reflected light into a range.

[0021] In one embodiment, the probe mounting hole of the optical fiber probe is within the light emitting area, outside the first reflection module, and above the second reflection module, and the position of the probe mounting hole is set to align with the range so as to receive all light within the range.

[0022] In one embodiment, the upper surface of the second reflective module has a fine polishing coating area for screening out the required spectral band.

[0023] In one embodiment, the first reflective module is arc-shaped and has a coating layer on a surface facing the lamp tube.

[0024] In one embodiment, the desired spectral band is ultraviolet light.

[0025] In one embodiment, when the required spectrum segment is not ultraviolet light, the light intensity value of the ultraviolet light is calculated based on the light intensity value measured by the light emitting component.

[0026] The present invention also provides a UV curing device, comprising the UV curing light source device as described above.

[0027] The present invention also provides a real-time measurement method for the light intensity of the UV curing light source device as described above.

[0028] The light intensity real-time measurement method comprises:

[0029] Setting the light intensity value of the required spectral band corresponding to the process operation to a preset value;

[0030] The optical probe is used to collect the light signal of the required spectral band and obtain the light intensity value of the light emitting component;

[0031] Feeding back the light intensity value to the power controller for real-time display and monitoring;

[0032] Determining whether the light intensity value is lower than the preset value;

[0033] When the light intensity value is lower than the preset value, the power controller adjusts the output power of the power supply to adjust the light intensity value of the light-emitting component;

[0034] When the output power of the power controller is adjusted to the maximum value, and the light intensity value is still lower than the preset value, a prompt is given to replace the consumable parts.

[0035] The technical solution of the present invention has the following technical effects:

[0036] First, the optical probe of the present invention is designed to be split, that is, it includes two parts: a high temperature zone collection unit (fiber optic probe in the high temperature zone) and a high temperature zone collection unit (photoelectric sensor in the low temperature zone). The reason is that, usually, the light emitting area around the lamp tube usually has a very high temperature, for example, ≥100°C. The light processing area, such as the light detection board, belongs to the low temperature zone, for example, around 47°C. Therefore, the present invention uses high temperature resistant fiber optic probes and optical fibers as devices for receiving and transmitting light, and transmits the optical signal to the low temperature zone for photoelectric conversion and light intensity detection and other processing. Compared with the traditional method of using photoelectric sensors only in the low temperature zone to receive optical signals, the present invention can measure the light intensity directly acting on the silicon wafer in the high temperature zone of the lamp tube, so the light intensity measurement is more accurate.

[0037] Secondly, the traditional external light intensity measurement device can only measure from the side, and the rotation of the reflector will intermittently block the probe during measurement, making the measured light intensity intermittent, and it is impossible to effectively judge whether it is usable. The fiber optic probe of the present invention can be fixed in the light emitting component, and the optical probe rotates with the lamp head (lamp tube), so the measured light intensity is continuous and real-time.

[0038] Thirdly, the present invention integrates the photoelectric converter of the optical probe adapted to the low temperature zone with the circuit board (such as the light detection board) inside the lamp head. It converts the optical signal into an electrical signal and transmits the electrical signal to the power controller through the circuit board, thereby optimizing the spatial structure and saving costs.

[0039] Fourthly, since light intensity is the core parameter of the UV curing process, the present invention can change the chip film preparation method by controlling power to the chip film preparation method by controlling light intensity.

[0040] Fifth, the optical probe is set in the UV curing light source equipment, and is powered and controlled by the power controller to achieve self-feedback control of the light intensity on the equipment power, which can ensure the stability of the light source energy of the curing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above invention content and the following specific embodiments of the present invention will be better understood when read in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are only examples of the claimed invention. In the accompanying drawings, the same reference numerals represent the same or similar elements.

[0042] Figure 1 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown;

[0043] Figure 2 Show Figure 1 The probe mounting hole position on the microwave cavity;

[0044] Figure 3A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown;

[0045] Figure 4 Shows the location of the mounting hole of the optical fiber probe according to one embodiment of the present invention;

[0046] Figure 5 A top view of a second reflection module according to an embodiment of the present invention is shown;

[0047] Figure 6 The fine polishing coating area in the reflection area on both sides of the second reflection module according to one embodiment of the present invention is shown;

[0048] Figure 7 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown;

[0049] Figure 8 A flow chart of a method for real-time measurement of light intensity according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0050] The detailed features and advantages of the present invention are described in detail in the specific embodiments below, and the content is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the description, claims and drawings disclosed in this specification, those skilled in the art can easily understand the relevant purposes and advantages of the present invention. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0051] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0053] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, channels, components, regions, layers and / or parts, these components, channels, components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, components, regions, layers and / or parts. In addition, the terms "first", "second", "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0054] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0055] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0056] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0057] Figure 1 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown. The UV curing light source device includes a power controller (not shown) and a light emitting component. In addition, the UV curing light source device also includes a reflecting device.

[0058] The light-emitting component includes a lamp tube 101 , an optical probe, a microwave cavity 102 , and a light detection board 103 .

[0059] The power controller provides power to the light-emitting component (the optical probe is also powered by the power controller), displays and monitors the light intensity value obtained by the light detection board in real time, and when the light intensity value is lower than the preset value, self-feedback adjusts the output power of the power supply to adjust the light intensity of the light-emitting component.

[0060] The lamp tube 101 is used to provide a light source, which includes visible light, infrared light and / or ultraviolet light.

[0061] In one embodiment, the lamp 101 emits ultraviolet light.

[0062] The optical probe is used to collect the optical signal of the required spectrum band emitted by the lamp tube 101 and convert the optical signal into an electrical signal. The optical probe is fixed in the light emitting assembly so that the optical probe rotates together with the light emitting assembly.

[0063] In one embodiment, the required spectral band is ultraviolet light. Of course, the optical probe of the present invention can also collect non-ultraviolet light, such as infrared light, and then the intensity of ultraviolet light can be calculated based on the ratio between the intensity of the infrared light and the intensity of ultraviolet light. Therefore, although the following description is based on the measurement of ultraviolet light as an example, those skilled in the art should understand that the UV curing light source device, UV curing device and real-time light intensity measurement method of the present invention can also be applied to the intensity measurement of other lights besides ultraviolet light, and the final ultraviolet light intensity can be calculated by the ratio between the intensity of the other lights and the intensity of ultraviolet light.

[0064] The microwave cavity 102 is a sheet metal structure that can conduct microwaves. It conducts the microwaves emitted by the magnetron to the location of the lamp tube to resonate. There are heat dissipation holes designed on it, such as Figure 2 shown.

[0065] The light detection board 103 is connected to the power controller of the UV curing light source device. The light detection board 103 is used to feed back the light intensity value of the required spectral band (e.g., ultraviolet rays) measured by the optical probe to the power controller, and display and monitor in real time through the power controller. When the detected light intensity value is lower than the preset value, the power controller self-feedback adjusts the output power of the power supply (e.g., increases the output power) to further adjust the light intensity of the light-emitting component.

[0066] The optical probe includes a high temperature area collection unit 104, a low temperature area collection unit 106 and a transmission medium 105. The low temperature area collection unit 106 is located in the light processing area 109 of the light emitting component and is integrated with the circuit board of the light detection board 103. The high temperature area collection unit 104 is fixed to the light emitting area 108 of the lamp tube 101 and rotates with the lamp tube. The transmission medium 105 transmits the signal collected by the high temperature area collection unit 104 to the low temperature area collection unit 106.

[0067] In one embodiment, the high temperature area collection unit 104 is a fiber optic probe.

[0068] In one embodiment, the transmission medium 105 is an optical fiber.

[0069] In one embodiment, the low temperature area acquisition unit 106 is a photoelectric sensor.

[0070] In one embodiment, the optical fiber probe 104 can directly receive the direct light emitted by the lamp tube 101 and transmit the optical signal to the photoelectric sensor 106 through the optical fiber 105 .

[0071] In one embodiment, the fiber optic probe 104 is mounted on a probe mounting hole 107 on the microwave cavity 102 .

[0072] In one embodiment, the probe mounting hole 107 may be Figure 2 The microwave cavity 102 is shown with a mounting hole 107 specially provided therein.

[0073] In one embodiment, the probe mounting hole 107 can utilize one of the multiple heat dissipation holes of the existing microwave cavity 102 as a mounting hole.

[0074] In one embodiment, the optical fiber 105 transmits the optical signal of the desired spectral segment (e.g., ultraviolet light) collected by the optical fiber probe 104 to the photoelectric sensor 106. The photoelectric sensor 106 converts the optical signal into an electrical signal to obtain a light intensity value and sends it to the light detection board 103. The light detection board 103 is integrated with the optical sensor 106 to feed back the light intensity value to the power controller in real time.

[0075] The technical effects of the above structure are as follows:

[0076] First, the optical probe of the present invention is designed to be split, that is, it includes two parts: a high temperature zone collection unit (fiber optic probe in the high temperature zone) and a high temperature zone collection unit (photoelectric sensor in the low temperature zone). The reason is that, usually, the light emitting area 108 around the lamp tube is usually at a very high temperature, for example, ≥100°C. The light processing area 109, such as the light detection board, belongs to the low temperature zone, for example, around 47°C. Therefore, the present invention uses high temperature resistant fiber optic probes and optical fibers as devices for receiving and transmitting light, and transmits the optical signal to the low temperature zone for photoelectric conversion and light intensity detection and other processing. Compared with the traditional use of only photoelectric sensors to collect ultraviolet light signals, the present invention can measure the light signal directly acting on the silicon wafer in the high temperature zone of the lamp tube, so the light intensity measurement is also more accurate.

[0077] Secondly, the traditional external light intensity measurement device can only measure from the side, and the rotation of the reflector will intermittently block the probe during measurement, making the measured light intensity intermittent, and it is impossible to effectively judge whether it is usable. The fiber optic probe of the present invention can be fixed in the light emitting component, and the optical probe rotates with the lamp head (lamp tube), so the measured light intensity is continuous and real-time.

[0078] Thirdly, the present invention integrates the photoelectric converter of the optical probe adapted to the low temperature zone with the circuit board (such as the light detection board) inside the lamp head. It converts the optical signal into an electrical signal and transmits the electrical signal to the power controller through the circuit board, thereby optimizing the spatial structure and saving costs.

[0079] Fourthly, since light intensity is the core parameter of the UV curing process, the present invention can change the chip film preparation method by controlling power to the chip film preparation method by controlling light intensity.

[0080] Fifth, the optical probe is set in the UV curing light source equipment, and is powered and controlled by the power controller to achieve self-feedback control of the light intensity on the equipment power, which can ensure the stability of the light source energy of the curing equipment.

[0081] Figure 3 A schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown. The UV curing light source device includes a power controller (not shown), a light emitting component and a reflecting device.

[0082] The light-emitting component includes a lamp tube 301 , an optical probe, a microwave cavity, and a light detection board 303 .

[0083] The power controller provides power to the light-emitting component (the optical probe is also powered by the power controller), displays and monitors the light intensity value fed back by the light detection board in real time, and when the light intensity value is lower than the preset value, the output power of the power supply is self-feedback adjusted to adjust the light intensity of the light-emitting component.

[0084] The lamp tube 301 is used to provide a light source, which includes visible light, infrared light and / or ultraviolet light.

[0085] In one embodiment, the lamp 301 emits ultraviolet light.

[0086] The optical probe is used to collect the optical signal of the required spectrum band emitted by the lamp tube 301 and convert the optical signal into an electrical signal. The optical probe is fixed in the light emitting assembly so that the optical probe rotates together with the light emitting assembly.

[0087] In one embodiment, the required spectral band is ultraviolet light. Of course, the optical probe of the present invention can also collect non-ultraviolet light, such as infrared light, and then the intensity of ultraviolet light can be calculated based on the ratio between the intensity of the infrared light and the intensity of ultraviolet light. Therefore, although the following description is based on the measurement of ultraviolet light as an example, those skilled in the art should understand that the UV curing light source device, UV curing device and real-time light intensity measurement method of the present invention can also be applied to the intensity measurement of other lights besides ultraviolet light, and the final ultraviolet light intensity can be calculated by the ratio between the intensity of the other lights and the intensity of ultraviolet light.

[0088] The microwave cavity is a sheet metal structure that can conduct microwaves. It transmits the microwaves emitted by the magnetron to the location of the lamp tube to cause resonance, and is designed with heat dissipation holes.

[0089] The light detection board 303 is connected to the power controller of the UV curing light source device. The light detection board 303 is used to feed back the light intensity value of the required spectral band (e.g., ultraviolet rays) measured by the optical probe to the power controller, and display and monitor in real time through the power controller. When the detected light intensity value is lower than the preset value, the power controller self-feedback adjusts the output power of the power supply (e.g., increases the output power) to further adjust the light intensity of the light-emitting component.

[0090] The optical probe includes a high temperature area collection unit 304, a low temperature area collection unit 306 and a transmission medium 305. The low temperature area collection unit 306 is located in the light processing area of ​​the light emitting component and is integrated with the circuit board of the light detection board 303. The high temperature area collection unit 304 is fixed in the light emitting area of ​​the lamp tube 301 and rotates with the lamp tube. The transmission medium 305 transmits the signal collected by the high temperature area collection unit 304 to the low temperature area collection unit 306.

[0091] In one embodiment, the high temperature area collection unit 304 is a fiber optic probe.

[0092] In one embodiment, transmission medium 305 is optical fiber.

[0093] In one embodiment, the low temperature area acquisition unit 306 is a photoelectric sensor.

[0094] In one embodiment, the optical fiber 305 transmits the optical signal of the required spectral segment (e.g., ultraviolet light) collected by the optical fiber probe 304 to the photoelectric sensor 306. The photoelectric sensor 306 converts the optical signal into an electrical signal to obtain a light intensity value and sends it to the light detection board 303. The light detection board 103 is integrated with the light sensor 106 to feed back the light intensity value to the power controller in real time.

[0095] The reflection device includes a first reflection module 308 and a second reflection module 302 .

[0096] The first reflection module 308 is used to reflect a portion of the light in a required spectrum band (eg, ultraviolet light) emitted by the lamp.

[0097] In one embodiment, the first reflective module 308 is arc-shaped, and has a coating layer on the side facing the lamp tube. The coating layer is a special reflective film, which is used to filter out light in non-required spectral bands and obtain reflected light 310 in required spectral bands.

[0098] It should be understood that the light emitted by the lamp tube 301 is divided into two parts, one part is the direct light 309 emitted directly from the lamp tube, and the other part is the reflected light 310 reflected after the light hits the first reflection module 308. Due to the special reflection film on the first reflection module, the direct light 309 and the reflected light 310 have different spectra.

[0099] The second reflection module 302 generally reflects light beyond the wafer range into the wafer range. Specifically, the second reflection module 302 has an upper surface, and the upper surface has a fine polishing coating area to filter out light of a desired spectral band. The fine polishing coating area is used to reflect the direct light 309 of the lamp tube and the reflected light 310 reflected from the first reflection module 308, so as to converge the direct light 309 and the reflected light 310 into a range.

[0100] The probe mounting hole of the optical fiber probe 304 is within the light-emitting area of ​​the lamp tube 301, outside the first reflection module 308, and above the second reflection module 302, and the position of the probe mounting hole 307 is aligned with the range so that the optical fiber probe 304 can receive all the light within the range.

[0101] Figure 4 FIG. 2 shows the position of the mounting hole of the optical fiber probe according to an embodiment of the present invention. Figure 1 As shown, in this embodiment, the optical fiber probe 304 is arranged outside the first reflection module and above the second reflection module. Specifically, the position of the mounting hole 307 of the optical fiber probe is arranged to receive all the light reflected and focused by the fine polishing coating area of ​​the second reflection module.

[0102] It should be understood that the light intensity detected in this embodiment includes the direct light and reflected light emitted by the lamp tube, so the light intensity value is greater than Figure 1 The light intensity values ​​of the embodiment shown ( Figure 1 The embodiment shown is measured as direct light intensity value).

[0103] Figure 5 FIG. 2 shows a top view of a second reflection module according to an embodiment of the present invention. Figure 5 As shown, the two sides of the second reflection module 302 are reflection areas 501. The area of ​​the reflection area 501 is enough to receive the direct light 309 and the reflected light 310. The direct light 309 and the reflected light 310 are reflected after being irradiated to the reflection area, and the reflected light is converged in the direction of the optical fiber probe installation hole 307.

[0104] Figure 6 The polished coating area of ​​the reflection area 501 on both sides of the second reflection module according to an embodiment of the present invention is shown. The upper surface of the reflection area has a polished coating area 601, and the coating is used to filter out the required specific band to effectively reflect the light of the required spectral band (such as ultraviolet light).

[0105] The technical effects of the above structure are as follows:

[0106] First, the optical probe of the present invention is designed to be split, that is, it includes two parts: an optical fiber probe in a high temperature zone and a photoelectric sensor in a low temperature zone. The reason is that, usually, the light emitting area 108 around the lamp tube usually has a very high temperature, for example, ≥100°C. The light processing area 109, such as the light detection board, belongs to the low temperature zone, for example, around 47°C. Therefore, the present invention uses high temperature resistant optical fiber probes and optical fibers as devices for receiving and transmitting light, and transmits optical signals to the low temperature zone for photoelectric conversion and light intensity detection and other processing. Compared with the traditional method of using photoelectric sensors only in the low temperature zone to receive optical signals, the present invention can measure the light intensity directly acting on the silicon wafer in the high temperature zone of the lamp tube, so the light intensity measurement is more accurate.

[0107] Secondly, the traditional external light intensity measurement device can only measure from the side, and the rotation of the reflector will intermittently block the probe during measurement, making the measured light intensity intermittent, and it is impossible to effectively judge whether it is usable. The optical fiber probe of the present invention can be fixed in the light emitting component, and the optical probe rotates with the rotation of the second reflector module, so the measured light intensity is continuous and real-time.

[0108] Thirdly, the present invention integrates the photoelectric converter of the optical probe adapted to the low temperature zone with the circuit board (such as the light detection board) inside the lamp head. It converts the optical signal into an electrical signal and transmits the electrical signal to the power controller through the circuit board, thereby optimizing the spatial structure and saving costs.

[0109] Fourthly, since light intensity is the core parameter of the UV curing process, the present invention can change the chip film preparation method by controlling power to the chip film preparation method by controlling light intensity.

[0110] Fifth, the optical probe is set in the UV curing light source equipment, and is powered and controlled by the power controller to achieve self-feedback control of the light intensity on the equipment power, which can ensure the stability of the light source energy of the curing equipment.

[0111] Sixth, compared with the present invention Figure 1 The fiber optic probe only measures the direct light from the lamp. Figure 3 The embodiment shown can detect direct light and reflected light emitted by the light source, and the measured light intensity value is greater than Figure 1 The measured light intensity value is also Figure 1 The measured light intensity value is more accurate.

[0112] Figure 7 The schematic diagram of a UV curing light source device according to an embodiment of the present invention is shown. The UV curing light source device includes a power controller 701 , a light emitting component 702 and a reflecting device 703 .

[0113] The light intensity signal of the light emitting component 702 can be displayed and monitored by the power controller 701. The power controller 701 has a control unit. The light intensity signal detected is fed back to the control unit, and the power controller displays and adjusts the light intensity of the light emitting component. Specifically, when the detected light intensity value is lower than the preset value, the power controller increases the output power of the power supply by self-feedback to further increase the light intensity of the light emitting component.

[0114] The present invention also provides a UV curing device, comprising the UV curing light source device as described above.

[0115] Figure 8 A flow chart of a method for real-time measurement of light intensity according to an embodiment of the present invention is shown. The method comprises the following steps:

[0116] Step 801: Set the light intensity value of the required spectral band (eg, ultraviolet light) corresponding to the process operation to a preset value.

[0117] Step 802: Perform process run, i.e. produce chips.

[0118] Step 803: Determine whether the light intensity of the light emitting component is lower than a preset value. If so (for example, the light emitting component attenuation occurs), execute step 804; if not, the process result is stable.

[0119] Step 804: The power controller automatically adjusts the output power of the power supply to further increase the light intensity of the light-emitting component.

[0120] Step 805: Display and record the light intensity value and the part replacement prompt via the display screen (or GUI).

[0121] Step 806 : The power controller increases the output power until the output power reaches 100%. If the light intensity is still less than the preset value, step 807 is executed.

[0122] Step 807: Replace consumable parts.

[0123] Those skilled in the art will appreciate that the various illustrative components, modules, blocks, units, circuits, systems, and steps described in conjunction with the embodiments disclosed herein may be implemented by hardware, software (including firmware, resident software, microcode, etc.), or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, modules, blocks, units, circuits, systems, and steps are described above in general terms in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as resulting in a departure from the scope of the present invention.

[0124] Flowcharts are used in the present application to illustrate the operations or steps performed by the system according to the embodiments of the present application. It should be understood that the preceding or following operations or steps are not necessarily performed accurately in order. On the contrary, various operations or steps may be processed in reverse order or simultaneously. At the same time, other operations or steps may be added to these processes, or one or more operations or steps may be removed from these processes.

[0125] Unless explicitly stated in the claims, the order of the processing elements and sequences, the use of alphanumeric characters, or the use of other names described in the present application are not intended to limit the order of the processes and methods of the present application.

[0126] Furthermore, aspects of the present application may take the form of a computer product embodied in one or more computer-readable media including computer-readable program code.

[0127] A computer readable signal medium may include a propagated data signal containing computer program code, such as in baseband or as part of a carrier wave. The propagated signal may have a variety of forms, including electromagnetic, optical, etc., or a suitable combination. A computer readable signal medium may be any computer readable medium other than a computer readable storage medium, which may be connected to an instruction execution system, device or apparatus to communicate, propagate or transmit a program for use. The program code on the computer readable signal medium may be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0128] The computer program coding required for the operation of each part of the application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby and Groovy, or other programming languages, etc. The program coding can be run completely on the user's computer, or run on the user's computer as an independent software package, or run partly on the user's computer and partly on the remote computer, or run completely on the remote computer or server. In the latter case, the remote computer can be connected to the user's computer through any network form, such as a local area network (LAN) or a wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as software as a service (SaaS).

[0129] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0130] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. In an alternative, a processor and a storage medium may reside in a user terminal as discrete components.

[0131] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0132] The terms and expressions used above are for descriptive purposes only, and the present invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean to exclude any equivalent features of the illustrations and descriptions (or parts thereof), and it should be recognized that various modifications that may exist should also be included in the scope of the claims. Other modifications, changes and substitutions may also exist. Accordingly, the claims should be deemed to cover all such equivalents.

[0133] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus facilitate the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of this application, multiple features are sometimes combined into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims.

[0134] Similarly, it should be pointed out that although the present invention has been described with reference to the current specific embodiments, ordinary technicians in this technical field should realize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions may be made without departing from the spirit of the present invention. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the essential spirit of the present invention, they will fall within the scope of the claims of this application.

Claims

1. A UV curing light source device, characterized in that: Including: light emitting components and power controller; The light-emitting assembly includes a lamp tube, an optical probe, and a light detection board; The optical probe comprises a high temperature area collection unit, a low temperature area collection unit and a transmission medium; the high temperature area collection unit is fixed in the light emitting area of ​​the lamp tube to collect the signal of the required spectrum band emitted by the lamp tube; The transmission medium transmits the signal collected by the high temperature area collection unit to the low temperature area collection unit; the low temperature area collection unit is integrated with the light detection board circuit; the light detection board feeds back the light intensity value obtained by the low temperature area collection unit to the power controller; The power supply controller displays and monitors the light intensity value fed back by the light detection board in real time. When the light intensity value is lower than a preset value, the power supply output power is adjusted by self-feedback to adjust the light intensity of the light-emitting component.

2. The UV curing light source device according to claim 1, characterized in that: The high temperature zone collection unit is an optical fiber probe, the low temperature zone collection unit is a photoelectric sensor, and the transmission medium is an optical fiber.

3. The UV curing light source device according to claim 2, characterized in that: The light-emitting component further comprises a microwave cavity in the light-emitting area. The optical fiber probe is mounted on a probe mounting hole on the microwave cavity. The optical fiber probe directly receives direct light emitted by the lamp tube.

4. The UV curing light source device according to claim 3, characterized in that: The probe mounting hole is a mounting hole specially opened on the microwave cavity.

5. The UV curing light source device according to claim 3, characterized in that: The probe mounting hole utilizes one of the existing multiple heat dissipation holes on the microwave cavity as a mounting hole.

6. The UV curing light source device according to claim 2, characterized in that: The optical fiber transmits the optical signal collected by the optical fiber probe to the photoelectric sensor, and the photoelectric sensor converts the optical signal into an electrical signal to obtain the light intensity value and sends it to the light detection board.

7. The UV curing light source device according to claim 2, characterized in that: Also included is a reflecting device, the reflecting device comprising: A first reflection module, used for reflecting a portion of the light in a required spectrum band emitted by the lamp tube; and The second reflection module has an upper surface with a fine polishing coating area for reflecting the direct light of the lamp tube and the reflected light from the first reflection module to converge the direct light and the reflected light into a range.

8. The UV curing light source device according to claim 7, characterized in that: The probe mounting hole of the optical fiber probe is within the light emitting area, outside the first reflection module, and above the second reflection module, and the position of the probe mounting hole is set to align with the range so as to receive all the light within the range.

9. The UV curing light source device according to claim 7, characterized in that: The upper surface of the second reflection module has a fine polishing coating area for screening out the required spectral band.

10. The UV curing light source device according to claim 7, characterized in that: The first reflective module is arc-shaped and has a coating layer on a surface facing the lamp tube.

11. The UV curing light source device according to claim 1, characterized in that: The required spectrum segment is ultraviolet light.

12. The UV curing light source device according to claim 1, characterized in that: When the required spectrum segment is not ultraviolet light, the light intensity value of the ultraviolet light is calculated based on the light intensity value measured by the light-emitting component.

13. A UV curing device, comprising the UV curing light source device according to any one of claims 1 to 12.

14. A method for real-time measurement of light intensity of a UV curing light source device as claimed in any one of claims 1 to 12, characterized in that: The method comprises: Setting the light intensity value of the required spectral band corresponding to the process operation to a preset value; The optical probe is used to collect the light signal of the required spectral band and obtain the light intensity value of the light emitting component; Feeding back the light intensity value to the power controller for real-time display and monitoring; Determining whether the light intensity value is lower than the preset value; When the light intensity value is lower than the preset value, the power controller adjusts the output power of the power supply to adjust the light intensity value of the light-emitting component; When the output power of the power controller is adjusted to the maximum value, and the light intensity value is still lower than the preset value, a prompt is given to replace the consumable parts.

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