Method and device for determining temperature, electronic equipment and storage medium

Abstract

The invention provides a temperature determination method and device, electronic equipment and a storage medium. When the electronic equipment is used, a user can hold the electronic equipment into different postures. When the electronic equipment is in different postures, the contact positions of the user and the surface of the electronic equipment are different, and the contact frequencies of the user to different positions are different. When different positions are in different contact frequencies, the influence of the surface temperatures of the different positions on the heat feeling of a user is different, and the importance degrees of the surface temperatures of the different positions relative to the surface temperature of the electronic equipment are different. Therefore, the surface temperature of the electronic equipment is determined by determining the temperature weighting coefficients corresponding to the plurality of positions on the surface of the electronic equipment and the surface temperatures of the plurality of positions. Namely, temperature weighting coefficients of different positions are output by researching the influence of the surface temperatures of the different positions on the thermal feeling of a user, and the surface temperatures of the different positions are weighted to obtain the surface temperature of the electronic equipment which is closer to the actual experience of the user.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment technology, and more specifically, to a method, device, electronic device and storage medium for determining temperature in the field of electronic equipment technology. Background Art

[0002] With the rapid improvement of the performance of handheld electronic devices and the continuous demand from the market, the device specifications of handheld electronic devices are constantly improved, resulting in more opportunities for handheld electronic devices to have excessive power consumption, resulting in increased heat generation of the device, and thus causing a higher surface temperature of the handheld electronic device.

[0003] In the prior art, the surface temperature of the handheld electronic device is characterized by the average temperature of multiple thermistors built into the handheld electronic device. Obviously, the surface temperature of the handheld electronic device obtained in the above manner is inaccurate. Summary of the invention

[0004] The present application provides a method, device, electronic device and storage medium for determining temperature. The method can output temperature weighting coefficients of different locations by studying the impact of surface temperatures at different locations on the user's thermal perception, and weight the surface temperatures at different locations to obtain a weighted temperature value (surface temperature of the electronic device) that is closer to the user's actual experience.

[0005] In a first aspect, a method for determining temperature is provided, the method comprising: determining temperature weighting coefficients corresponding to multiple positions on the surface of an electronic device, the multiple positions being positions corresponding to when the electronic device is in a target posture, the target posture being a horizontal posture or a vertical posture, the temperature weighting coefficient being used to indicate the importance of the surface temperature of any position relative to the surface temperature of the electronic device; weightedly fusing the surface temperatures of each position in the multiple positions based on the temperature weighting coefficient corresponding to each position to obtain the surface temperature of the electronic device.

[0006] In the above technical solution, in the process of actually using the electronic device, the user usually holds the electronic device in different postures (horizontal posture or vertical posture). When the electronic device is in different postures, the contact position between the user and the surface of the electronic device is different, and the user's contact frequency for different positions is different. Since different positions have different contact frequencies, the surface temperature of different positions has different effects on the user's thermal perception, and the importance of the surface temperature of different positions relative to the surface temperature of the electronic device is also different. That is to say, for the position where the user contacts more, the surface temperature of the position has a greater impact on the user's thermal perception. The importance of the surface temperature of the position relative to the surface temperature of the electronic device is greater. For the position where the user contacts less, the surface temperature of the position has a smaller impact on the user's thermal perception. The importance of the surface temperature of the position relative to the surface temperature of the electronic device is smaller. Therefore, the present application determines the temperature weighting coefficient corresponding to each of the multiple positions on the surface of the electronic device. The surface temperature of the electronic device is determined by using the weighted results of the surface temperature of different positions and the corresponding temperature weighting coefficient. By studying the influence of the surface temperature of different positions on the user's thermal perception, the temperature weighting coefficient of different positions is output, and the surface temperature of different positions is weighted to obtain a weighted temperature value (surface temperature of the electronic device) that is closer to the actual experience of the user.

[0007] In a second aspect, a device for determining temperature is provided, the device comprising: a determination module, used to determine temperature weighting coefficients corresponding to multiple positions on the surface of an electronic device, the multiple positions being positions corresponding to when the electronic device is in a target posture, the target posture being a horizontal posture or a vertical posture, the temperature weighting coefficient being used to indicate the importance of the surface temperature of any position relative to the surface temperature of the electronic device; a fusion module, used to weightedly fuse the surface temperatures of each of the multiple positions based on the temperature weighting coefficients corresponding to each position, to obtain the surface temperature of the electronic device.

[0008] In a third aspect, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein when the processor executes the computer program, the electronic device executes the method in the above-mentioned first aspect or any possible implementation manner of the first aspect.

[0009] In a fourth aspect, a computer-readable storage medium is provided, which stores instructions. When the instructions are executed on a computer or a processor, the computer or the processor executes the method in the first aspect or any possible implementation of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0011] Figure 2 is a schematic flow chart of a method for determining temperature provided in an embodiment of the present application;

[0012] Figure 3 is a schematic diagram of determining a target posture of an electronic device provided by an embodiment of the present application;

[0013] Figure 4 is a schematic diagram of determining a target weighting coefficient corresponding to a reference temperature measurement point provided by an embodiment of the present application;

[0014] Figure 5 is a hardware structure block diagram of determining surface temperature provided in an embodiment of the present application;

[0015] Figure 6 is a schematic diagram of the structure of a device for determining temperature provided in an embodiment of the present application;

[0016] Figure 7 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The technical solutions in the present application will be described clearly and in detail below in conjunction with the accompanying drawings. In the description of the embodiments of the present application, "multiple" means two or more than two. The terms "first" and "second" are used for descriptive purposes only and should not be understood as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0018] Figure 1 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0019] In some embodiments, the electronic device in the present application is a user terminal, including but not limited to: a personal computer, a tablet computer, and a handheld device, etc. The handheld device may be a mobile phone.

[0020] It should be understood that in the normal use of electronic devices, users can hold the electronic device in a horizontal posture or a vertical posture based on their own needs. In some embodiments, when users play large-scale mobile games, in order to see a wider game content area within the limited electronic device screen, conveniently use two hands to coordinate the operation of game content, and achieve cooler game skills, users usually hold the electronic device in a horizontal posture. In other embodiments, when users communicate through chat applications, in order to facilitate browsing chat information up and down and enhance the overall chat experience, users usually hold the electronic device in a vertical posture. It should be understood that the horizontal posture refers to the electronic device being placed horizontally, and the vertical posture refers to the electronic device being placed vertically. In some embodiments, when the electronic device is in a horizontal posture, the screen state of the electronic device is a horizontal screen state; when the electronic device is in a vertical posture, the screen state of the electronic device is a vertical screen state.

[0021] For example, the process of using the electronic device is described by taking a mobile phone as an example. Figure 1 As shown in (a) in FIG. 1 , when the mobile phone is in a horizontal position, the user can use the left hand to manipulate the turn key B in the game A interface to control the character C to move forward in different directions, so that the character C increases its own length. Specifically, the character C can increase its own length by defeating other characters (for example, the character D and the character E). The user can also use the right hand to manipulate the speed key F to change the speed of the character C. Figure 1 As shown in (a) of FIG. 1 , during the running of game A, the interface of game A also shows the length 1231 of character C and the real-time ranking list. Figure 1 As shown in (b) in FIG. 1 , when the mobile phone is in a vertical posture, the user can input voice by clicking the voice key in the chat application interface with the right hand; input chat information by clicking the chat information input bar in the chat application interface with the right hand; add chat emoticons by clicking the emoticon key in the chat application interface with the right hand; and enable other functions by clicking the plus key in the chat application interface with the right hand. The user can also slide the chat information in the chat information browsing bar up and down with the right hand to view chat information at different times.

[0022] For the above exemplary embodiment, when the electronic device is in a horizontal posture, the high frequency area corresponding to the electronic device is the lower left area and the lower right area of ​​the electronic device, and the high frequency area refers to the area with a high contact frequency when the user uses the electronic device. When the electronic device is in a vertical posture, the high frequency area corresponding to the electronic device is the lower area of ​​the electronic device.

[0023] Figure 2 It is a schematic flow chart of a method for determining temperature provided in an embodiment of the present application.

[0024] It should be understood that the method for determining temperature provided in the embodiment of the present application can be applied to Figure 1 Specifically, the method for determining temperature can be applied to a controller in the electronic device.

[0025] For example, Figure 2 As shown, the method 200 includes:

[0026] Step 201, the electronic device determines temperature weighting coefficients corresponding to multiple positions on the surface of the electronic device, the multiple positions are positions corresponding to when the electronic device is in a target posture, the target posture is a horizontal posture or a vertical posture, and the temperature weighting coefficient is used to indicate the importance of the surface temperature of any position relative to the surface temperature of the electronic device.

[0027] In some embodiments, the surface of the electronic device is the front, back and side of the electronic device. It should also be understood that the front of the electronic device is the side where the screen is located, the back of the electronic device is the side where the battery cover is located, and the side of the electronic device is the other side except the front and back.

[0028] It should be understood that the "multiple positions on the surface of the electronic device" in step 201 can be specifically understood as the positions where the user touches the surface of the electronic device when the electronic device is in a horizontal posture or a vertical posture. It should also be understood that the multiple positions on the surface of the electronic device in this application are based on the actual habits of most users in using the electronic device during the test process.

[0029] In an embodiment where the electronic device is a mobile phone, when the mobile phone is in a horizontal posture, multiple positions in the lower left area and multiple positions in the lower right area of ​​the front of the mobile phone, multiple positions in the left area and multiple positions in the right area of ​​the back of the mobile phone, and multiple positions in the first side and multiple positions in the second side of the mobile phone are determined as multiple positions on the surface of the mobile phone, wherein the first side and the second side are the surfaces corresponding to the short side of the mobile phone. When the mobile phone is in a vertical posture, multiple positions in the lower area of ​​the front of the mobile phone, multiple positions in the lower area of ​​the back of the mobile phone, and multiple positions in the third side and multiple positions in the fourth side of the mobile phone are determined as multiple positions on the surface of the mobile phone, wherein the third side is the surface where the power button of the mobile phone is located, and the fourth side is the surface corresponding to one of the short sides of the mobile phone.

[0030] It should also be understood that in the process of using an electronic device, the user's contact frequency with the multiple locations is different. For a location that the user contacts more, the surface temperature of the location has a greater impact on the user's thermal perception. The surface temperature of the location is more important than the surface temperature of the electronic device. In this regard, in the process of calculating the surface temperature of an electronic device by the surface temperatures of multiple locations, for a location with a higher contact frequency, the surface temperature of the location can be multiplied by a larger weight, and for a location with a lower contact frequency, the surface temperature of the location can be multiplied by a smaller weight to obtain a more accurate surface temperature of the electronic device.

[0031] It should also be understood that the "temperature weighting coefficient is used to indicate the importance of the surface temperature of any position relative to the surface temperature of the electronic device" in the above step 201 can be simply understood as: the degree of contribution that the surface temperature of the position can make in the process of determining the surface temperature of the electronic device. Specifically, the more frequent the contact at the position, the greater the temperature weighting coefficient corresponding to the position, and in the process of determining the surface temperature of the electronic device based on the surface temperature of each position and the corresponding temperature weighting coefficient, the result of multiplying the surface temperature of the position by the temperature weighting coefficient of the position has a greater impact on the surface temperature of the electronic device.

[0032] The process of “determining temperature weighting coefficients corresponding to multiple locations on the surface of an electronic device” is discussed as follows.

[0033] The first method: Determine the temperature weighting coefficient corresponding to each position based on the contact time of multiple users at each position during the test

[0034] In one possible implementation, step 201 includes: when the electronic device is in the target posture, the electronic device obtains the multiple positions where multiple users are in contact with the surface of the electronic device within a first time period; the electronic device determines the temperature weighting coefficient corresponding to each position based on the first time period and the contact time between the multiple users and each position.

[0035] It should be understood that when a user uses an electronic device, he or she can touch any surface of the electronic device. Therefore, for the above solution, the surface of the electronic device is the front, back or side of the electronic device.

[0036] In the above technical solution, the multiple positions in step 201 and the temperature weighted coefficients corresponding to each position are determined by the use of the electronic device by multiple users during the test process. Specifically, when the electronic device is in a horizontal posture or a vertical posture, the positions where the multiple users contact the surface of the electronic device within a first time period are obtained to determine the multiple positions in step 201. Based on the first time period and the contact time between the multiple users and each position, the temperature weighted coefficient corresponding to each position is determined.

[0037] The target posture of the electronic device is further explained in two ways as follows.

[0038] Method 1

[0039] In some embodiments, a method for determining that an electronic device is in the target posture includes: the electronic device obtains, by means of an acceleration sensor in the electronic device, the linear acceleration of the electronic device in an XYZ three-axis coordinate system, respectively, wherein when the top of the electronic device is facing upward, the direction to the right along the screen of the electronic device is the positive direction of the X-axis, and the direction to the left is the negative direction of the X-axis; the direction upward along the top of the screen of the electronic device is the positive direction of the Y-axis, and the direction downward is the negative direction of the Y-axis; when facing the electronic device, the direction perpendicular to the screen of the electronic device is the positive direction of the Z-axis, and the direction perpendicular to the screen of the electronic device is the negative direction of the Z-axis; when the linear acceleration of the X-axis is ±1, the linear acceleration of the Y-axis is 0, and the linear acceleration of the Z-axis is 0, or the linear acceleration of the X-axis is 0, the linear acceleration of the Y-axis is 0, and the linear acceleration of the Z-axis is ±1, the electronic device determines that the target posture is a horizontal posture; when the linear acceleration of the X-axis is 0, the linear acceleration of the Y-axis is ±1, and the linear acceleration of the Z-axis is 0, the electronic device determines that the target posture is a longitudinal posture.

[0040] It should be understood that the above judgment on whether the electronic device is in the target posture is performed when the electronic device is relatively stationary, and the value range of the linear acceleration of the electronic device is [-1, 1].

[0041] In the above technical solution, the linear acceleration of the electronic device in three directions is acquired by an acceleration sensor in the electronic device, and the target posture of the electronic device is accurately and quickly determined by the values ​​of the three linear accelerations.

[0042] Figure 3 It is a schematic diagram of determining a target posture of an electronic device provided in an embodiment of the present application.

[0043] like Figure 3 As shown in (a) in , when the linear accelerations of the XYZ axes are 0, -1, and 0 respectively, the target posture is the longitudinal posture; Figure 3 As shown in (b) in , when the linear accelerations of the three axes X, Y, and Z are 0, 1, and 0 respectively, the target posture is the longitudinal posture; Figure 3 As shown in (c) in , when the linear accelerations of the XYZ axes are 1, 0, and 0 respectively, the target posture is a lateral posture; Figure 3 As shown in (d) in , when the linear accelerations of the XYZ axes are -1, 0, and 0 respectively, the target posture is a lateral posture; Figure 3As shown in (e) in FIG. 1 , when the linear accelerations of the three axes X, Y, and Z are 0, 0, and -1 respectively, the target posture is a horizontal posture and the screen of the electronic device is facing upward; Figure 3 As shown in (f) in FIG. 8 , when the linear accelerations of the three axes X, Y, and Z are 0, 0, and 1 respectively, the target posture is a horizontal posture and the screen of the electronic device is facing downward.

[0044] Method 2

[0045] In other embodiments, the method for determining that the electronic device is in the target posture includes: the electronic device senses the screen state of the electronic device through a gyroscope sensor in the electronic device; when the screen state is a horizontal state, the electronic device determines that the target posture is a horizontal posture; when the screen state is a vertical state, the electronic device determines that the target posture is a vertical posture.

[0046] It should be understood that in the above solution, the screen rotation function of the electronic device is enabled by default.

[0047] In the above technical solution, the screen state of the electronic device is obtained by the gyroscope sensor in the electronic device, so that the target posture of the electronic device can be indirectly and accurately determined.

[0048] In some embodiments, the electronic device determines the temperature weighting coefficient corresponding to each position based on the first duration and the contact duration between the multiple users and each position, including any of the following: for any one of the multiple positions, the electronic device determines the temperature weighting coefficient corresponding to the position by the ratio between the first contact duration and the first duration, and the first contact duration is the average contact duration between the multiple users and the position; for any one of the multiple positions, the electronic device determines the temperature weighting coefficient corresponding to the position by the ratio between the second contact duration and the third contact duration, and the second contact duration is the sum of the contact durations between the multiple users and the position, and the third contact duration is the product of the first duration and the number of users.

[0049] It should be understood that the first method mentioned above is equivalent to using multiple positions in the test process to equate multiple positions in step 201, and using the contact time of most users at each position during the test process to determine the temperature weighting coefficient corresponding to each position in step 201.

[0050] The second method: Determine the temperature weighting coefficient corresponding to each position by the user's pressing frequency at each position during actual use

[0051] In a possible implementation, the surface of the electronic device is the front side of the electronic device, and step 201 includes: the electronic device determines the pressing frequency of the multiple positions; the electronic device determines the temperature weighting coefficient corresponding to each position based on the pressing frequency of each position.

[0052] It should be understood that the "pressing frequency" in the above scheme is used to indicate how fast the user presses any position on the front of the electronic device. The electronic device determines the pressing frequency as the ratio of the number of times the position is pressed within a preset time period to the preset time period.

[0053] In one possible implementation, the electronic device determines the pressing frequency of the multiple positions, including: for any one of the multiple positions, the electronic device obtains the number of times the pressure used to press the position meets a preset condition within a preset time length; the electronic device determines the ratio between the number of times and the preset time length as the pressing frequency of the position.

[0054] In the above technical solution, for any one of the multiple positions, the pressing frequency of the position is determined by the ratio between the number of times the pressure of pressing the position meets the preset conditions within the preset time and the preset time. The number is the number of times the pressure corresponding to the position meets the preset conditions, which is to exclude some behaviors of pressing the surface of the electronic device that do not meet the conditions, such as accidentally touching the surface of the electronic device. Therefore, through the above method, a relatively accurate pressing frequency of multiple positions can be obtained.

[0055] In some embodiments, the preset condition in the above scheme is that the pressure used to press the position is within a preset pressure range.

[0056] In the above technical solution, during the actual use of the electronic device, the pressure with which the user presses the surface of the electronic device is within a certain pressure range. In this process, there is a phenomenon that the user accidentally touches the surface of the electronic device, and the pressure with which the user presses a certain position on the surface of the electronic device may be very small. Therefore, this application does not count the number of times the pressure corresponds to the accidental touch. In this way, a relatively accurate pressing frequency of multiple positions can be obtained.

[0057] In some embodiments, the electronic device obtains the number of times the pressure used to press the position meets the preset condition within a preset time period, including: the electronic device uses a counter in the electronic device to add 1 to the number of times each detected pressure meets the preset condition within the preset time period to obtain the number of times the pressure used to press the position meets the preset condition.

[0058] In some embodiments, the surface of the electronic device is wrapped with pressure-sensitive paper, and the electronic device senses the pressure used to press the position through the pressure-sensitive paper.

[0059] In one possible implementation, the electronic device determines the temperature weighting coefficient corresponding to each position based on the pressing frequency of each position, including: the electronic device determines the sum of the pressing frequencies of the multiple positions as the total pressing frequency of the multiple positions; for any position of the multiple positions, the electronic device determines the ratio between the pressing frequency of the position and the total pressing frequency as the temperature weighting coefficient corresponding to the position.

[0060] In the above technical solution, the temperature weighting coefficient corresponding to any position is obtained by the proportion of the pressing frequency of the position to the total pressing frequency. In other words, the temperature weighting coefficient corresponding to the position is positively correlated with the pressing frequency of the position.

[0061] It should be understood that the second method described above is equivalent to determining the temperature weighting coefficient corresponding to each position in step 201 by using the pressing frequency of each position by any user in the actual use of the electronic device.

[0062] The third method: Combine the first method and the second method to determine the temperature weighting coefficient corresponding to each position

[0063] In some embodiments, step 201 includes: the electronic device obtains a first temperature weighting coefficient corresponding to each position of the multiple positions, the first temperature weighting coefficient corresponding to each position is determined based on the first duration and the contact duration of the multiple users at each position during the test; the electronic device determines a second temperature weighting coefficient corresponding to each position of the multiple positions, the second temperature weighting coefficient corresponding to each position is determined based on the pressing frequency of each position; the electronic device determines the average value of the first temperature weighting coefficient corresponding to each position and the sum of the second temperature weighting coefficients corresponding to each position as the temperature weighting coefficient corresponding to each position.

[0064] In the above technical solution, the process of determining the temperature weighted coefficients corresponding to multiple positions is described. Specifically, the temperature weighted coefficient (first temperature weighted coefficient) corresponding to each position in the multiple positions is first determined by the first duration and the contact duration of the multiple users at each position during the test process, and then the temperature weighted coefficient (second temperature weighted coefficient) corresponding to each position in the multiple positions is determined by the pressing frequency of each position, and finally based on the first temperature weighted coefficient and the second temperature weighted coefficient, the temperature weighted coefficient corresponding to each position in the multiple positions is determined. In other words, the first temperature weighted coefficient obtained in the test process is adjusted by actually using the pressing frequency on the surface of the electronic device, and finally the temperature weighted coefficient corresponding to each position is obtained. In this way, a more accurate temperature weighted coefficient corresponding to each position can be obtained.

[0065] Step 202 : The electronic device weights and fuses the surface temperatures of each position in the plurality of positions based on the temperature weighting coefficient corresponding to each position to obtain the surface temperature of the electronic device.

[0066] It should be understood that for the above step 202, the surface temperature of each position in the multiple positions needs to be determined first. In order to more clearly explain the implementation of the surface temperature of each position, the process of determining the surface temperature of any position is described below.

[0067] In one possible implementation, before step 202, the method 200 further includes: for any position among the multiple positions, the electronic device fuses the temperatures of multiple reference temperature measurement points around the position in the electronic device to obtain the surface temperature of the position, and the distance between the position and the multiple reference temperature measurement points is less than a first preset distance.

[0068] In the above technical solution, for any one of the multiple positions, since the distance between the position and the multiple reference temperature measurement points is very close, the surface temperature of the position can be more accurately inferred by the temperatures of the multiple reference temperature measurement points. Specifically, the fusion result of the temperatures of the multiple reference temperature measurement points around the position is used as the surface temperature of the position.

[0069] Optionally, the temperatures of the multiple reference temperature measurement points in the above solution are the temperatures of multiple thermistors, wherein the distances between the positions and the multiple thermistors are all less than a first preset distance.

[0070] In some embodiments, the temperature of the reference temperature measurement point is the temperature of a thermistor, and the method for determining the temperature of the thermistor includes: the electronic device obtains the resistance value of the thermistor; the electronic device determines the temperature of the thermistor based on the following formula (1);

[0071]

[0072] Among them, R is the resistance value of the thermistor, R0 is the corresponding resistance value at a temperature of 25°C, which can be different specifications such as KΩ and 10KΩ, B is the material constant, which is about 3950, T is the temperature of the thermistor, T0 is absolute zero, and the value is 273.15°C.

[0073] In some embodiments, the method 200 further includes: the electronic device simplifies the formula (1) to obtain the formula (2); the electronic device determines the temperature of the thermistor based on the formula (2).

[0074]

[0075] The determination process of "surface temperature at any position" is discussed in detail as follows.

[0076] In a possible implementation, the electronic device fuses the temperatures of multiple reference temperature measurement points around the position in the electronic device to obtain the surface temperature of the position, including: the electronic device determines the target weighting coefficient corresponding to each reference temperature measurement point based on the distance between each reference temperature measurement point in the multiple reference temperature measurement points and the position, and the distance between the reference temperature measurement point and the position is negatively correlated with the target weighting coefficient; the electronic device weightedly fuses the temperatures of each reference temperature measurement point based on the target weighting coefficient corresponding to each reference temperature measurement point to obtain the surface temperature of the position; or, the electronic device weightedly fuses the temperatures of each reference temperature measurement point based on the preset weighting coefficient corresponding to each reference temperature measurement point to obtain the reference surface temperature of the position; the electronic device determines the temperature deviation corresponding to the reference surface temperature based on the temperature difference between the reference surface temperature and the temperature of each reference temperature measurement point; when the temperature deviation is less than the preset temperature deviation, the electronic device determines the reference surface temperature as the surface temperature of the position.

[0077] It should be understood that the "negative correlation between the distance between the reference temperature measurement point and the position and the target weighting coefficient" in the above scheme can be simply understood as: the smaller the distance between the reference temperature measurement point and the position, the larger the target weighting coefficient corresponding to the reference temperature measurement point; the larger the distance between the reference temperature measurement point and the position, the smaller the target weighting coefficient corresponding to the reference temperature measurement point.

[0078] It should also be understood that the above scheme describes the process of determining the surface temperature of any position in two ways. The first way: first determine the target weighting coefficient corresponding to each reference temperature measurement point, and then weight the temperature of each reference temperature measurement point based on the target weighting coefficient corresponding to each reference temperature measurement point to obtain the surface temperature of the position (any position); the second way: first determine the reference surface temperature of the position based on the temperature of multiple reference temperature measurement points, and then measure the reference surface temperature based on the temperature deviation between the reference surface temperature and the temperature of each reference temperature measurement point to determine whether the reference surface temperature meets the preset condition (the temperature deviation is less than the preset temperature deviation); when the temperature deviation is less than the preset temperature deviation, the reference surface temperature is determined as the surface temperature of the position. It should also be understood that the first way is equivalent to determining the surface temperature of the position by the distance difference between the position and multiple reference temperature measurement points and the temperature of multiple reference temperature measurement points; the second way is equivalent to determining the surface temperature of the position by linear regression.

[0079] In the above technical solution, the surface temperature of the position is determined by the distance difference between the position and multiple reference temperature measurement points and the temperatures of the multiple reference temperature measurement points, as well as by linear regression. This not only enriches the method of obtaining the surface temperatures of multiple positions, but also can more accurately determine the surface temperatures of multiple positions.

[0080] The process corresponding to the "first method" is further explained as follows.

[0081] In a possible implementation, the electronic device determines a target weighting coefficient corresponding to each reference temperature measurement point based on the distance between each reference temperature measurement point in the multiple reference temperature measurement points and the position, including: the electronic device determines multiple distances between the position and each reference temperature measurement point in the multiple reference temperature measurement points, and determines the sum of the multiple distances as the total distance; for any reference temperature measurement point in the multiple reference temperature measurement points, the electronic device determines a reference distance between the reference temperature measurement point and the position; the electronic device determines a distance deviation corresponding to the reference distance based on a distance difference between the total distance and the reference distance; the electronic device determines the target weighting coefficient corresponding to the reference temperature measurement point based on the distance deviation, the total distance and the number of reference temperature measurement points.

[0082] In the above technical solution, for any reference temperature measurement point among multiple reference temperature measurement points, based on the distance deviation between the reference temperature measurement point and the position relative to the total distance (the sum of the distances between the position and each reference temperature measurement point), the total distance and the reference temperature measurement point, the target weighting coefficient corresponding to the reference temperature measurement point can be accurately determined.

[0083] In some embodiments, the electronic device determines the target weighting coefficient corresponding to the reference temperature measurement point based on the distance deviation, the total distance and the number of reference temperature measurement points, including: the electronic device determines the target weighting coefficient corresponding to the reference temperature measurement point based on the following formula (3);

[0084]

[0085] Among them, ρ i is the target weighting coefficient of the reference temperature measurement point i, d0 is the total distance, d i is the reference distance between the reference temperature measurement point and the position, (d0-d i ) is the distance deviation corresponding to the reference distance, and N is the number of reference temperature measurement points.

[0086] Figure 4 It is a schematic diagram of determining a target weighting coefficient corresponding to a reference temperature measurement point provided in an embodiment of the present application.

[0087] Exemplarily, taking the electronic device being in a horizontal posture, any position among the multiple positions being position Q, N being 3, that is, the three reference temperature measurement points being reference temperature measurement point 1, reference temperature measurement point 2, and reference temperature measurement point 3, the distance between reference temperature measurement point 1 and position Q being d1, the distance between reference temperature measurement point 2 and position Q being d2, and the distance between reference temperature measurement point 3 and position Q being d3 as an example, the process of the electronic device determining the target weighting coefficients corresponding to the three reference temperature measurement points is described. The electronic device adds d1, d2 and d3 to obtain the total distance d0; the electronic device substitutes d1, d0 and N into formula (3) to obtain the target weighting coefficient corresponding to the reference temperature measurement point 1 as ρ1=(d2+d3) / 2d0; the electronic device substitutes d2, d0 and N into formula (3) to obtain the target weighting coefficient corresponding to the reference temperature measurement point 2 as ρ2=(d1+d3) / 2d0; the electronic device substitutes d3, d0 and N into formula (3) to obtain the target weighting coefficient corresponding to the reference temperature measurement point 3 as ρ3=(d1+d2) / 2d0.

[0088] The process corresponding to the "second method" is further explained as follows.

[0089] In some embodiments, the electronic device determines the temperature deviation corresponding to the reference surface temperature based on the temperature difference between the reference surface temperature and the temperature of each reference temperature measurement point, including: the electronic device determines the temperature deviation corresponding to the reference surface temperature based on the following formula (4);

[0090]

[0091] Where J is the temperature deviation corresponding to the reference surface temperature, N is the number of reference temperature measurement points, t0 is the reference surface temperature, t k is the temperature of the kth reference temperature measurement point among the multiple reference temperature measurement points.

[0092] In some other embodiments, the electronic device determines the temperature deviation corresponding to the reference surface temperature based on the temperature difference between the reference surface temperature and the temperature of each reference temperature measurement point, including: the electronic device determines the temperature deviation corresponding to the reference surface temperature based on the following formula (5);

[0093]

[0094] Where J is the temperature deviation corresponding to the reference surface temperature, N is the number of reference temperature measurement points, t0 is the reference surface temperature, t k is the temperature of the kth reference temperature measurement point among the multiple reference temperature measurement points.

[0095] Figure 5This is a hardware structure block diagram for determining surface temperature provided in an embodiment of the present application.

[0096] For example, Figure 5 As shown, the core layer of the electronic device is provided with pressure-sensitive paper, attitude sensor (which may be an acceleration sensor and a gyroscope sensor, etc.), counter and thermistor. Among them, the attitude sensor obtains the target attitude (horizontal attitude or vertical attitude) of the electronic device, the pressure-sensitive paper and the counter obtain the pressing frequency of a user pressing a certain position on the surface of the electronic device, and the thermistor is used to reflect the temperature of different positions in the electronic device. The hardware abstraction layer of the electronic device can obtain the data corresponding to each sensor in the core layer, and pre-process the data. The application framework layer of the electronic device obtains the target attitude of the electronic device based on the attitude sensor; determines multiple positions on the surface of the electronic device corresponding to the target attitude based on the target attitude and the corresponding relationship between the attitude and the position; obtains the pressing frequency of the user pressing the multiple positions based on the pressure-sensitive paper and the counter, and then determines the temperature weighting coefficient corresponding to each position; obtains the surface temperature of each position (replaced by the temperature of the thermistor); and weights and fuses the surface temperature of each position in the multiple positions based on the temperature weighting coefficient corresponding to each position to obtain the surface temperature of the electronic device.

[0097] In one possible implementation, after obtaining the surface temperature of the electronic device in step 202, the method 200 further includes: when the surface temperature of the electronic device is greater than a preset temperature, the electronic device controls the running process of at least one application in the electronic device to perform overheat protection on the electronic device.

[0098] In the above technical solution, when the surface temperature of the electronic device is relatively high, the temperature of various components built into the electronic device is also relatively high. In this regard, it is necessary to take overheat protection measures for the electronic device to avoid burning various components in the electronic device when the surface temperature is too high.

[0099] In some embodiments, the electronic device controls the running process of at least one application in the electronic device, including: the electronic device obtains at least one application currently running in the electronic device; the electronic device sorts the at least one application according to the usage frequency corresponding to the application to obtain at least one sorted application, and the ranking position of any application is negatively correlated with the usage frequency corresponding to the application; the electronic device controls a preset number of applications in the front position of the at least one sorted application to stop running.

[0100] It should be understood that the "ranking of any application is negatively correlated with the usage frequency corresponding to the application" in the above scheme can be simply understood as: the greater the usage frequency corresponding to the application, the lower the ranking of the application; the smaller the usage frequency corresponding to the application, the higher the ranking of the application.

[0101] In the above technical solution, when the surface temperature of an electronic device is too high, a preset number (can be multiple) of applications that are running in the electronic device and are not frequently used are stopped. This not only ensures that the user can use the electronic device normally, but also avoids the problem of various components being burned out due to excessive surface temperature of the electronic device.

[0102] Figure 6 It is a structural schematic diagram of a device for determining temperature provided in an embodiment of the present application.

[0103] For example, Figure 6 As shown, the device 600 includes:

[0104] A determination module 601 is used to determine temperature weighting coefficients corresponding to a plurality of positions on the surface of an electronic device, where the plurality of positions are positions corresponding to when the electronic device is in a target posture, where the target posture is a horizontal posture or a vertical posture, and the temperature weighting coefficient is used to indicate the importance of the surface temperature of any position relative to the surface temperature of the electronic device;

[0105] The fusion module 602 is used to perform weighted fusion of the surface temperatures of each position in the multiple positions based on the temperature weight coefficient corresponding to each position to obtain the surface temperature of the electronic device.

[0106] Optionally, the determination module 601 is specifically used to: when the electronic device is in the target posture, obtain the multiple positions where multiple users are in contact with the surface of the electronic device within a first time period; based on the first time period and the contact time between the multiple users and each position, determine the temperature weighting coefficient corresponding to each position.

[0107] Optionally, the surface of the electronic device is the front side of the electronic device, and the determination module 601 is further specifically used to: determine the pressing frequency of the multiple positions; and determine the temperature weighting coefficient corresponding to each position based on the pressing frequency of each position.

[0108] Optionally, the determination module is further specifically used to: for any position among the multiple positions, obtain the number of times the pressure used to press the position meets a preset condition within a preset time length; and determine the ratio between the number of times and the preset time length as the pressing frequency of the position.

[0109] Optionally, the determination module is further specifically used to: determine the sum of the pressing frequencies of the multiple positions as the total pressing frequency of the multiple positions; for any position among the multiple positions, determine the ratio between the pressing frequency of the position and the total pressing frequency as the temperature weighting coefficient corresponding to the position.

[0110] Optionally, before weighted fusion of the surface temperatures of each position among the multiple positions is performed based on the temperature weighting coefficient corresponding to each position to obtain the surface temperature of the electronic device, the fusion module 602 is further used to fuse the temperatures of multiple reference temperature measurement points around any position among the multiple positions in the electronic device to obtain the surface temperature of the position, and the distance between the position and the multiple reference temperature measurement points is less than a first preset distance.

[0111] Optionally, the fusion module 602 is specifically used to: determine a target weighting coefficient corresponding to each reference temperature measurement point based on the distance between each reference temperature measurement point in the multiple reference temperature measurement points and the position, and the distance between the reference temperature measurement point and the position is negatively correlated with the target weighting coefficient; weightedly fuse the temperatures of each reference temperature measurement point based on the target weighting coefficient corresponding to each reference temperature measurement point to obtain the surface temperature of the position; or, weightedly fuse the temperatures of each reference temperature measurement point based on a preset weighting coefficient corresponding to each reference temperature measurement point to obtain the reference surface temperature of the position; determine a temperature deviation corresponding to the reference surface temperature based on a temperature difference between the reference surface temperature and the temperature of each reference temperature measurement point; and when the temperature deviation is less than a preset temperature deviation, determine the reference surface temperature as the surface temperature of the position.

[0112] Optionally, the determination module 601 is further specifically used to: determine multiple distances between the position and each of the multiple reference temperature measurement points, and determine the sum of the multiple distances as the total distance; for any reference temperature measurement point among the multiple reference temperature measurement points, determine the reference distance between the reference temperature measurement point and the position; based on the distance difference between the total distance and the reference distance, determine the distance deviation corresponding to the reference distance; based on the distance deviation, the total distance and the number of reference temperature measurement points, determine the target weighting coefficient corresponding to the reference temperature measurement point.

[0113] Optionally, after obtaining the surface temperature of the electronic device, the device 600 further includes: a control module, configured to control the operation process of at least one application in the electronic device to perform overheat protection on the electronic device when the surface temperature of the electronic device is greater than a preset temperature.

[0114] Figure 7 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0115] For example, Figure 7As shown, the electronic device 700 includes: a memory 701, a processor 702, and a computer program 703 stored in the memory 701 and running on the processor 702, wherein when the processor 702 executes the computer program 703, the electronic device can execute any one of the methods for determining temperature described above.

[0116] In this embodiment, the electronic device can be divided into functional modules according to the above method example. For example, each functional module can be corresponded to, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware. It should be noted that the division of modules in this embodiment is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0117] In the case of dividing each functional module according to each function, the electronic device may include: a determination module, a fusion module, a control module, etc. It should be noted that all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional module, which will not be repeated here.

[0118] The electronic device provided in this embodiment is used to execute the above-mentioned method for determining temperature, and thus can achieve the same effect as the above-mentioned implementation method.

[0119] In the case of an integrated unit, the electronic device may include a processing module and a storage module. The processing module may be used to control and manage the actions of the electronic device. The storage module may be used for the electronic device to execute mutual program codes and data.

[0120] The processing module may be a processor or a controller, which may implement or execute various exemplary logic blocks, modules and circuits disclosed in the present application. The processor may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of digital signal processing (DSP) and a microprocessor, etc. The storage module may be a memory.

[0121] The electronic device provided in the embodiments of the present application may specifically be a chip, a component or a module, and the electronic device may include a connected processor and a memory; wherein the memory is used to store instructions, and when the electronic device is running, the processor may call and execute instructions so that the chip executes any one of the methods for determining temperature described above.

[0122] This embodiment provides a computer-readable storage medium, in which instructions are stored. When the instructions are executed on a computer or a processor, the computer or the processor executes any one of the temperature determination methods described above.

[0123] This embodiment also provides a computer program product including instructions. When the computer program product is executed on a computer or a processor, the computer or the processor executes the above-mentioned related steps to implement any one of the temperature determination methods described above.

[0124] Among them, the electronic device, computer-readable storage medium, computer program product or chip containing instructions provided in this embodiment are all used to execute the corresponding methods provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above, and will not be repeated here.

[0125] Through the description of the above implementation methods, technical personnel in the relevant field can understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0126] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0127] The above contents are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for determining temperature, characterized in that The method comprises: Determining temperature weighting coefficients corresponding to a plurality of positions on a surface of an electronic device, the plurality of positions being positions corresponding to when the electronic device is in a target posture, the target posture being a horizontal posture or a vertical posture, the temperature weighting coefficient being used to indicate the importance of a surface temperature at any position relative to a surface temperature of the electronic device; The surface temperature of each of the plurality of positions is weighted and merged based on the temperature weighting coefficient corresponding to each of the positions to obtain the surface temperature of the electronic device.

2. The method according to claim 1, characterized in that The step of determining temperature weighted coefficients corresponding to a plurality of positions on the surface of the electronic device includes: When the electronic device is in the target posture, acquiring the multiple positions where multiple users contact the surface of the electronic device within a first time period; Based on the first duration and the contact durations between the multiple users and the respective locations, a temperature weighting coefficient corresponding to each of the locations is determined.

3. The method according to claim 1, characterized in that The electronic device surface is the front side of the electronic device, and determining the temperature weighted coefficients corresponding to a plurality of positions on the electronic device surface includes: determining compression frequencies of the plurality of locations; Based on the pressing frequency of each of the positions, a temperature weighting coefficient corresponding to each of the positions is determined.

4. The method according to claim 3, characterized in that The determining the pressing frequencies of the plurality of positions comprises: For any one of the multiple positions, obtaining the number of times the pressure used to press the position satisfies a preset condition within a preset time period; The ratio between the number of times and the preset duration is determined as the pressing frequency of the position.

5. The method according to claim 3, characterized in that: The step of determining the temperature weighting coefficient corresponding to each of the positions based on the pressing frequency of each of the positions includes: Determining the sum of the pressing frequencies at the multiple positions as the total pressing frequency at the multiple positions; For any position among the multiple positions, the ratio between the pressing frequency of the position and the total pressing frequency is determined as the temperature weighting coefficient corresponding to the position.

6. The method according to claim 1, characterized in that Before weighting and fusing the surface temperatures of each of the plurality of positions based on the temperature weighting coefficients corresponding to each of the positions to obtain the surface temperature of the electronic device, the method further includes: For any position among the multiple positions, the temperatures of multiple reference temperature measurement points around the position in the electronic device are merged to obtain the surface temperature of the position, and the distance between the position and the multiple reference temperature measurement points is less than a first preset distance.

7. The method according to claim 6, characterized in that The step of fusing the temperatures of a plurality of reference temperature measurement points around the position in the electronic device to obtain the surface temperature of the position includes: Determine a target weighting coefficient corresponding to each of the reference temperature measurement points based on a distance between each of the multiple reference temperature measurement points and the position, wherein the distance between the reference temperature measurement point and the position is negatively correlated with the target weighting coefficient; The temperatures of the reference temperature measurement points are weighted and merged based on the target weight coefficients corresponding to the reference temperature measurement points to obtain the surface temperature of the position; or, The temperatures of the reference temperature measurement points are weighted and merged based on the preset weighting coefficients corresponding to the reference temperature measurement points to obtain the reference surface temperature of the position; Determining a temperature deviation corresponding to the reference surface temperature based on a temperature difference between the reference surface temperature and the temperature of each of the reference temperature measurement points; In a case where the temperature deviation is less than a preset temperature deviation, the reference surface temperature is determined as the surface temperature of the position.

8. The method according to claim 7, characterized in that The determining, based on the distance between each of the reference temperature measurement points and the position, a target weighting coefficient corresponding to each of the reference temperature measurement points comprises: Determine a plurality of distances between the position and each of the plurality of reference temperature measurement points, and determine the sum of the plurality of distances as a total distance; For any reference temperature measurement point among the plurality of reference temperature measurement points, determining a reference distance between the reference temperature measurement point and the position; Determining a distance deviation corresponding to the reference distance based on a distance difference between the total distance and the reference distance; Based on the distance deviation, the total distance and the number of reference temperature measurement points, a target weighting coefficient corresponding to the reference temperature measurement point is determined.

9. The method according to any one of claims 1 to 8, characterized in that: After obtaining the surface temperature of the electronic device, the method further includes: When the surface temperature of the electronic device is greater than a preset temperature, the running process of at least one application in the electronic device is controlled to perform overheat protection on the electronic device.

10. A device for determining temperature, characterized in that The device comprises: a determination module, configured to determine temperature weighting coefficients corresponding to a plurality of positions on a surface of an electronic device, wherein the plurality of positions are positions corresponding to when the electronic device is in a target posture, wherein the target posture is a horizontal posture or a vertical posture, and the temperature weighting coefficient is used to indicate the importance of the surface temperature of any position relative to the surface temperature of the electronic device; The fusion module is used to perform weighted fusion of the surface temperatures of each of the multiple positions based on the temperature weight coefficient corresponding to each of the positions to obtain the surface temperature of the electronic device.

11. An electronic device, characterized in that: The electronic device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the electronic device executes the method for determining temperature as described in any one of claims 1 to 9.

12. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, and when the instructions are executed on a computer or a processor, the computer or the processor executes the method for determining temperature according to any one of claims 1 to 9.

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