Fault positioning method and device, electronic equipment, storage medium and product

Abstract

The invention provides a fault positioning method and device, electronic equipment, a storage medium and a product, and the method comprises the steps: obtaining an acoustic signal of to-be-tested equipment, the acoustic signal being a sound signal generated by the to-be-tested equipment due to a device fault; based on the acoustic signal, utilizing an acoustic imager to display a sound pressure distribution image of the to-be-tested equipment; and determining an area corresponding to the first identifier in the sound pressure distribution image as a fault area of the to-be-detected equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of fault location, and in particular to a fault location method, device, electronic device, storage medium and product. Background Art

[0002] In the related art, an infrared thermal imager is usually used to locate the fault of the device under test.

[0003] Infrared thermal imagers use infrared detectors, optical imaging lenses and optical scanning systems to receive the infrared radiation energy distribution graph of the device under test, and then reflect the infrared radiation energy distribution graph to the photosensitive element of the infrared detector to obtain an infrared thermal image. The infrared thermal image corresponds to the heat distribution field on the surface of the device under test and can display different temperature areas. The working principle of infrared thermal imagers is based on the characteristics of infrared radiation. Infrared radiation is a kind of electromagnetic wave that is ubiquitous in nature. All objects with a temperature higher than absolute zero (-273°C) will emit infrared radiation. Infrared thermal imagers receive infrared radiation and use photoelectric equipment to convert radiation energy into electrical signals, ultimately forming a visual infrared thermal image. In infrared thermal images, different colors represent different temperatures of the device under test, which can help people observe and analyze the temperature distribution of the device under test, and then locate the fault of the device under test. For example, the fault location of a high-voltage insulator is discharged, and the temperature of the fault location is higher. Therefore, the position with the highest temperature in the infrared thermal image is the fault location.

[0004] However, using infrared thermal imagers to locate faults in equipment under test has the following drawbacks:

[0005] First, the fault location accuracy is low. Since infrared thermal imagers rely on temperature difference to form images, and the temperature difference between the fault location and the non-fault location of the equipment under test is generally not large, the contrast of the infrared thermal image is low, resulting in low fault location accuracy.

[0006] Second, infrared thermal imagers cannot see targets clearly through transparent obstacles such as window glass, and their adaptability range is limited. Summary of the invention

[0007] The present disclosure provides a fault location method, device, electronic device, storage medium and product to solve the problems in the related art.

[0008] A first aspect of the present disclosure provides a fault location method, the method comprising:

[0009] Acquiring an acoustic signal of the device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a device failure;

[0010] Based on the acoustic signal, using an acoustic imager to display a sound pressure distribution image of the device under test;

[0011] Determine that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

[0012] In one embodiment, displaying the sound pressure distribution image of the device under test using an acoustic imager based on the acoustic signal includes:

[0013] Preprocessing the acoustic signal to obtain a preprocessed acoustic signal; the preprocessing includes at least one of signal filtering and signal enhancement;

[0014] Converting the preprocessed acoustic signal into a sound pressure level curve;

[0015] Based on the sound pressure level curve, an acoustic imager is used to display a sound pressure distribution image of the device under test.

[0016] In one embodiment, the sound pressure distribution image includes at least one marker, each marker corresponds to a different sound pressure, different markers are represented by different colors, and the color corresponding to the first marker is red.

[0017] In one embodiment, determining that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test includes:

[0018] Based on the color corresponding to the first identifier, using an image segmentation algorithm, selecting a first area corresponding to the first identifier in the sound pressure distribution image;

[0019] The first area is determined to be a fault area of ​​the device under test.

[0020] In one embodiment, the method further comprises: displaying the sound pressure distribution image of the device under test by using an acoustic imager based on the acoustic signal;

[0021] The sound pressure threshold of the acoustic imager is adjusted.

[0022] A second aspect of the present disclosure provides a fault location device, the device comprising:

[0023] An acquisition unit, used for acquiring an acoustic signal of the device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a device failure;

[0024] An imaging unit, configured to display a sound pressure distribution image of the device under test using an acoustic imager based on the acoustic signal;

[0025] A determination unit is used to determine that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

[0026] In one embodiment, the imaging unit comprises:

[0027] A preprocessing module, used for preprocessing the acoustic signal to obtain a preprocessed acoustic signal; the preprocessing includes at least one of signal filtering and signal enhancement;

[0028] A conversion module, used for converting the preprocessed acoustic signal into a sound pressure level curve;

[0029] A display module is used to display a sound pressure distribution image of the device under test using an acoustic imager based on the sound pressure level curve.

[0030] A third aspect of the present disclosure provides an electronic device, including:

[0031] At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method described in the embodiment of the first aspect of the present disclosure.

[0032] The fourth aspect embodiment of the present disclosure proposes a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute the method described in the first aspect embodiment of the present disclosure.

[0033] A fifth aspect embodiment of the present disclosure provides a computer program product, including a computer program, which implements the method described in the first aspect embodiment of the present disclosure when executed by a processor.

[0034] In summary, the present disclosure proposes a fault location method, device, electronic device, storage medium and product, the method comprising: obtaining an acoustic signal of a device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a component failure; based on the acoustic signal, displaying a sound pressure distribution image of the device under test using an acoustic imager; and determining that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

[0035] The solution provided by the present disclosure first obtains the acoustic signal of the device under test, uses an acoustic imager to generate a sound pressure distribution image of the device under test according to the acoustic signal of the device under test, and determines the fault area according to the sound pressure distribution image; compared with the method of using an infrared thermal imager to locate the fault in the related art, the acoustic signal has a higher sensitivity than the temperature difference, and ignores the obstruction of obstacles, has a wider range of application, and has a higher fault location accuracy.

[0036] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the description are used to explain the principles of the present disclosure, and do not constitute improper limitations on the present disclosure.

[0038] Figure 1 A flowchart of a fault location method provided by an embodiment of the present disclosure;

[0039] Figure 2 A schematic diagram of a flow chart of a method for displaying a sound pressure distribution image provided by an embodiment of the present disclosure;

[0040] Figure 3 A schematic diagram of the structure of a fault location device provided in an embodiment of the present disclosure;

[0041] Figure 4 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] Embodiments of the present disclosure are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0043] The thermal power equipment in a thermal power plant may have generator hydrogen leakage faults, high-voltage insulator partial discharge faults, high-voltage natural gas pipeline leakage faults, etc. In order to ensure the normal operation of the thermal equipment and realize the rapid repair of the fault, it is necessary to quickly locate the fault position of the equipment.

[0044] In the related art, an infrared thermal imager is usually used to locate the fault of the device under test.

[0045] Infrared thermal imagers use infrared detectors, optical imaging lenses and optical scanning systems to receive the infrared radiation energy distribution graph of the device under test, and then reflect the infrared radiation energy distribution graph to the photosensitive element of the infrared detector to obtain an infrared thermal image. The infrared thermal image corresponds to the heat distribution field on the surface of the device under test and can display different temperature areas. The working principle of infrared thermal imagers is based on the characteristics of infrared radiation. Infrared radiation is a kind of electromagnetic wave that is ubiquitous in nature. All objects with a temperature higher than absolute zero (-273°C) will emit infrared radiation. Infrared thermal imagers receive infrared radiation and use photoelectric equipment to convert radiation energy into electrical signals, ultimately forming a visual infrared thermal image. In infrared thermal images, different colors represent different temperatures of the device under test, which can help people observe and analyze the temperature distribution of the device under test, and then locate the fault of the device under test. For example, the fault location of a high-voltage insulator is discharged, and the temperature of the fault location is higher. Therefore, the position with the highest temperature in the infrared thermal image is the fault location.

[0046] However, using infrared thermal imagers to locate faults in equipment under test has the following drawbacks:

[0047] First, the fault location accuracy is low. Since infrared thermal imagers rely on temperature difference to form images, and the temperature difference between the fault location and the non-fault location of the equipment under test is generally not large, the contrast of the infrared thermal image is low, resulting in low fault location accuracy.

[0048] Second, infrared thermal imagers cannot see targets clearly through transparent obstacles such as window glass, and their adaptability range is limited.

[0049] Third, since the infrared radiation attenuation increases with the distance, infrared thermal imagers cannot locate faults at long distances.

[0050] Fourth, after long-term use, water droplets often appear on the objective lens of the infrared thermal imager due to the high internal temperature, so the service life of the infrared thermal imager is short.

[0051] Fifth, the imaging effect of infrared thermal imagers is poor at night, which further limits the scope of application of infrared thermal imagers.

[0052] In order to solve the defects in the related art, the solution provided by the present invention first obtains the acoustic signal of the device under test, uses an acoustic imager to generate a sound pressure distribution image of the device under test according to the acoustic signal of the device under test, and determines the fault area according to the sound pressure distribution image; compared with the method of using an infrared thermal imager to locate the fault in the related art, the acoustic signal has a higher sensitivity than the temperature difference, and ignores the obstruction of obstacles, has a wider range of application, and has a higher fault location accuracy.

[0053] The present disclosure is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0054] like Figure 1 As shown, Figure 1 A schematic diagram of a flow chart of a fault location method provided in an embodiment of the present disclosure. The fault location method provided in an embodiment of the present disclosure comprises the following steps:

[0055] Step 101, obtaining an acoustic signal of a device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a device failure;

[0056] In one embodiment, the device to be tested may be a generator, a high-voltage insulator, a high-pressure natural gas pipeline, etc. of a thermal power plant; the fault of the device to be tested may be a generator hydrogen leakage fault, a high-voltage insulator partial discharge fault, a high-pressure natural gas pipeline leakage fault, etc.

[0057] In one embodiment, the hydrogen leakage fault of the generator and the leakage fault of the compressed natural gas pipeline belong to the gas leakage fault of the sealed container. When the high-pressure gas leaks, a gas leakage sound will be emitted, generating a sound signal. Similarly, when the high-voltage insulator has a partial discharge fault, a current pulse sound will appear, generating a sound signal.

[0058] In one embodiment, a sound signal may be acquired using a sound collection device such as a microphone.

[0059] Step 102, based on the acoustic signal, using an acoustic imager to display a sound pressure distribution image of the device under test;

[0060] In one embodiment, the acoustic imager is an acoustic imager with a seven-inch touch screen, powered by an external power supply, and its main interface can display a sound pressure distribution image, a sound signal power spectrum, a sound pressure level curve, etc.

[0061] In one embodiment, the acoustic imager includes a microphone array for collecting sound signals, a visible light camera, a processor, and a seven-inch touch screen.

[0062] In one embodiment, the microphone array is a group of microphones arranged in a specific pattern. The imager obtains acoustic signals from all microphones and obtains an image of the device under test from the visible light camera. The processor uses the acoustic imager to display a sound pressure distribution image of the device under test based on the acoustic signals, wherein the sound pressure distribution in the sound pressure distribution image matches the sound source of the sound emitted by the device under test.

[0063] Step 103: determine that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

[0064] In one embodiment, the processor may generate different identifiers on the image of the device under test according to the sound pressure at different positions of the device under test.

[0065] In one embodiment, the sound pressure distribution image includes at least one mark, each mark corresponds to a different sound pressure, and different marks are represented by different colors, and the color corresponding to the first mark is red. Generally, red, yellow, green, blue, and purple represent the sound pressure level from large to small.

[0066] In one embodiment, according to the position of the red area in the sound pressure distribution image, the fault position of the device under test can be accurately determined to achieve fault location.

[0067] In summary, the fault location method proposed in the present disclosure includes: obtaining an acoustic signal of the device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a component failure; based on the acoustic signal, using an acoustic imager to display a sound pressure distribution image of the device under test; and determining that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

[0068] The solution provided by the present disclosure first obtains the acoustic signal of the device under test, uses an acoustic imager to generate a sound pressure distribution image of the device under test according to the acoustic signal of the device under test, and determines the fault area according to the sound pressure distribution image; compared with the method of using an infrared thermal imager to locate the fault in the related art, the acoustic signal has a higher sensitivity than the temperature difference, and ignores the obstruction of obstacles, has a wider range of application, and has a higher fault location accuracy.

[0069] In one embodiment, if Figure 2 As shown, the method of displaying the sound pressure distribution image of the device under test by using an acoustic imager based on the acoustic signal includes:

[0070] Step 201, preprocessing the acoustic signal to obtain a preprocessed acoustic signal; the preprocessing includes at least one of signal filtering and signal enhancement;

[0071] Step 202, converting the preprocessed acoustic signal into a sound pressure level curve;

[0072] Step 203: Based on the sound pressure level curve, use an acoustic imager to display a sound pressure distribution image of the device under test.

[0073] In one embodiment, since the acquired acoustic signal is affected by the environmental noise, the fault location result may be inaccurate. Therefore, the acoustic signal needs to be pre-processed, such as signal filtering, so that the acoustic signal is more stable and closer to the real fault sound. Furthermore, when the amplitude of the acoustic signal is small, the fault location cannot be accurately performed. At this time, the acoustic signal needs to be enhanced, such as using an amplifier to enhance the acoustic signal, to obtain a more accurate fault location result.

[0074] In one embodiment, determining that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test includes:

[0075] Based on the color corresponding to the first identifier, using an image segmentation algorithm, selecting a first area corresponding to the first identifier in the sound pressure distribution image;

[0076] The first area is determined to be a fault area of ​​the device under test.

[0077] In one embodiment, the image segmentation algorithm can extract the region of interest, such as the region corresponding to the first marker, from the sound pressure distribution image, thereby accurately locating the fault.

[0078] In one embodiment, the image segmentation algorithm is an existing mature technology and will not be described in detail in this disclosure.

[0079] In one embodiment, the method further comprises: displaying the sound pressure distribution image of the device under test by using an acoustic imager based on the acoustic signal;

[0080] The sound pressure threshold of the acoustic imager is adjusted.

[0081] In one embodiment, when acquiring an acoustic signal, the acoustic signal is usually mixed with environmental noise of the device under test. The amplitude of the environmental noise is generally low. Therefore, the environmental noise can be filtered by adjusting the sound pressure threshold of the acoustic imager to obtain a more accurate fault location result.

[0082] In order to implement the fault location method provided by the embodiment of the present disclosure, the embodiment of the present disclosure also provides a fault location device, such as Figure 3 shown. Figure 3 This is a schematic diagram of the structure of a fault location device provided in an embodiment of the present disclosure. The fault location device 300 includes:

[0083] An acquisition unit 301 is used to acquire an acoustic signal of a device under test, where the acoustic signal refers to a sound signal generated by the device under test due to a device failure;

[0084] An imaging unit 302 is used to display a sound pressure distribution image of the device under test using an acoustic imager based on the acoustic signal;

[0085] The determination unit 303 is configured to determine that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

[0086] In one embodiment, the imaging unit 302 includes:

[0087] A preprocessing module, used for preprocessing the acoustic signal to obtain a preprocessed acoustic signal; the preprocessing includes at least one of signal filtering and signal enhancement;

[0088] A conversion module, used for converting the preprocessed acoustic signal into a sound pressure level curve;

[0089] A display module is used to display a sound pressure distribution image of the device under test using an acoustic imager based on the sound pressure level curve.

[0090] In one embodiment, the sound pressure distribution image includes at least one marker, each marker corresponds to a different sound pressure, different markers are represented by different colors, and the color corresponding to the first marker is red.

[0091] In one embodiment, the determining unit 303 is specifically configured to:

[0092] Based on the color corresponding to the first identifier, using an image segmentation algorithm, selecting a first area corresponding to the first identifier in the sound pressure distribution image;

[0093] The first area is determined to be a fault area of ​​the device under test.

[0094] In one embodiment, the fault location device 300 further includes an adjustment unit, which is used to:

[0095] The sound pressure threshold of the acoustic imager is adjusted.

[0096] It should be noted that: the fault location device provided in the above embodiment only uses the division of the above program modules as an example when performing fault location. In actual applications, the above processing can be assigned to different program modules as needed, that is, the internal structure of the fault location device is divided into different program modules to complete all or part of the processing described above. In addition, the fault location device provided in the above embodiment and the fault location method embodiment provided in the embodiment of the present disclosure belong to the same concept. The specific implementation process is detailed in the method embodiment and will not be repeated here.

[0097] Figure 4 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the electronic device 400 includes at least one processor 402; and a memory 401 communicatively connected to the at least one processor 402; wherein the memory 401 stores instructions that can be executed by the at least one processor 402, and the instructions are executed by the at least one processor 402 to implement the steps of the fault location method described in the embodiment of the present disclosure.

[0098] Optionally, the electronic device may specifically be the fault location device of the embodiment of the present application, and the electronic device may implement the corresponding processes implemented by the fault location device in each method of the embodiment of the present application, which will not be described in detail here for the sake of brevity.

[0099] It is understood that the electronic device also includes a communication interface 403. The various components in the electronic device are coupled together through a bus system 404. It is understood that the bus system 404 is used to achieve connection and communication between these components. In addition to the data bus, the bus system 404 also includes a power bus, a control bus, and a status signal bus. However, for the sake of clarity, Figure 4 Various buses are labeled as bus system 404 .

[0100] It can be understood that the memory 401 can be a volatile memory or a non-volatile memory, and can also include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic random access memory (FRAM), a flash memory, a magnetic surface memory, an optical disc, or a compact disc read-only memory (CD-ROM); the magnetic surface memory can be a disk memory or a tape memory. The volatile memory can be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM, SyncLink Dynamic Random Access Memory), and direct RAM bus random access memory (DRRAM, Direct Rambus Random Access Memory).The memory 401 described in the embodiment of the present invention is intended to include but is not limited to these and any other suitable types of memories.

[0101] The method disclosed in the above embodiment of the present disclosure can be applied to the processor 402, or implemented by the processor 402. The processor 402 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit in the processor 402 or the instruction in the form of software. The above processor 402 may be a general-purpose processor, a DSP, or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor 402 can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or any conventional processor, etc. In combination with the steps of the method disclosed in the embodiment of the present invention, it can be directly embodied as a hardware decoding processor to execute, or it can be executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium, which is located in the memory 401, and the processor 402 reads the information in the memory 401 and completes the steps of the above method in combination with its hardware.

[0102] In an exemplary embodiment, the electronic device may be implemented by one or more application specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), FPGAs, general purpose processors, controllers, MCUs, microprocessors, or other electronic components to execute the aforementioned method.

[0103] The embodiment of the present disclosure further provides a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable the computer to implement the steps of the fault location method described in the embodiment of the present disclosure when executed.

[0104] The embodiment of the present disclosure further provides a computer program product, including a computer program, which implements the steps of the fault location method described in the embodiment of the present disclosure when executed by a processor.

[0105] Optionally, the computer-readable storage medium may be applied to the fault location device in the embodiments of the present application, and the computer instructions enable the computer to execute the corresponding processes implemented by the fault location device in the various methods of the embodiments of the present application, which will not be described in detail here for the sake of brevity.

[0106] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0107] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0108] In addition, all functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0109] A person of ordinary skill in the art can understand that: all or part of the steps of implementing the above-mentioned method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium, which, when executed, executes the steps of the above-mentioned method embodiment; and the aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROM, RAM, disks or optical disks.

[0110] Alternatively, if the above-mentioned integrated unit of the present invention is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present invention can be essentially or partly reflected in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROM, RAM, magnetic disks or optical disks.

[0111] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A fault location method, characterized in that: include: Acquiring an acoustic signal of the device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a device failure; Based on the acoustic signal, using an acoustic imager to display a sound pressure distribution image of the device under test; Determine that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

2. The method according to claim 1, characterized in that The method of displaying a sound pressure distribution image of the device under test by using an acoustic imager based on the acoustic signal includes: Preprocessing the acoustic signal to obtain a preprocessed acoustic signal; the preprocessing includes at least one of signal filtering and signal enhancement; Converting the preprocessed acoustic signal into a sound pressure level curve; Based on the sound pressure level curve, an acoustic imager is used to display a sound pressure distribution image of the device under test.

3. The method according to claim 1, characterized in that The sound pressure distribution image includes at least one mark, each mark corresponds to a different sound pressure, and different marks are represented by different colors. The color corresponding to the first mark is red.

4. The method according to claim 3, characterized in that The determining that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test includes: Based on the color corresponding to the first identifier, using an image segmentation algorithm, selecting a first area corresponding to the first identifier in the sound pressure distribution image; The first area is determined to be a fault area of ​​the device under test.

5. The method according to claim 1, characterized in that The method further comprises: displaying the sound pressure distribution image of the device under test by using an acoustic imager based on the acoustic signal; The sound pressure threshold of the acoustic imager is adjusted.

6. A fault location device, characterized in that: include: An acquisition unit, used for acquiring an acoustic signal of the device under test, wherein the acoustic signal refers to a sound signal generated by the device under test due to a device failure; An imaging unit, configured to display a sound pressure distribution image of the device under test using an acoustic imager based on the acoustic signal; A determination unit is used to determine that the area corresponding to the first mark in the sound pressure distribution image is the fault area of ​​the device under test.

7. The device according to claim 6, characterized in that The imaging unit comprises: A preprocessing module, used for preprocessing the acoustic signal to obtain a preprocessed acoustic signal; the preprocessing includes at least one of signal filtering and signal enhancement; A conversion module, used for converting the preprocessed acoustic signal into a sound pressure level curve; A display module is used to display a sound pressure distribution image of the device under test using an acoustic imager based on the sound pressure level curve.

8. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 5.

9. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to cause the computer to execute the method according to any one of claims 1 to 5.

10. A computer program product, characterized in that A computer program is included which, when executed by a processor, implements the method according to any one of claims 1 to 5.

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