Power panel structure of integrated circuit burn-in system

Abstract

The invention provides a power panel structure of an integrated circuit burn-in system, which comprises a power panel arranged on a burn-in substrate; the plurality of shunting modules are arranged on the power panel and are electrically connected with the power panel, and each shunting module at least comprises a current measuring circuit unit and a voltage measuring unit module; wherein each shunting module is used for being electrically connected with a corresponding to-be-tested assembly arranged on the burn-in substrate. Therefore, independent measuring circuits are provided for respective to-be-measured components, the to-be-measured components with different qualities are judged, and the to-be-measured components can be subjected to grade classification; the damage time point of the to-be-tested assembly can be known in the burn-in process; and then, the voltage levels of the components to be tested at the front, middle and rear positions of the whole burn-in substrate are relatively consistent by power supply shunting.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit burn-in test, and in particular to a power board structure of an integrated circuit burn-in system, wherein the power board structure provides a voltage measurement circuit unit and a current measurement unit to each corresponding component to be tested. Background Art

[0002] The IC Burn In System is an important device in the pre-burning process of the IC manufacturing process. The power board is used to supply power to the IC device under test (DUT). For a known IC burn in system power board structure 100 ', please refer to Figure 1 and Figure 2 The power board 1' (which can be electrically connected to a burn-in board 10') has only one set of current measurement circuit units 2' and voltage measurement circuit units 3', and is electrically connected to all the components under test (i.e., ICs), such as the components under test DUT1 to DUT6, through a single high-power (high-current) dynamic power supply 4' (DPS) disposed on the burn-in board 10', but is not limited thereto.

[0003] The power board structure 100' of the conventional integrated circuit burn-in system adopts a large capacity and centralized type. The voltage drop of the DUT (i.e., IC) on the burn-in board 10' is easily inconsistent at the front and rear ends. Because there is only one detection voltage point, it is impossible to achieve the same problem for the entire burn-in board 10'. The disadvantages are briefly listed as follows. First, multiple DUTs (i.e., ICs) are connected to the same power supply 4' at the same time. If there is a DUT of poor quality, it will be damaged; secondly, DUTs (i.e., ICs) of different quality cannot be distinguished, that is, the current consumption of each DUT (i.e., IC) cannot be detected; in addition, only the measurement function of the entire power board 1' can be used, and it is impossible to know whether a single DUT (i.e., IC) has a problem during the burn-in process; finally, the entire power board uses a whole group output mode, which will cause different problems to occur in the voltage level of the DUTs (i.e., ICs) at the front, middle, and back of a burn-in board. Summary of the invention

[0004] The purpose of the present invention is to provide a power board structure of an integrated circuit burn-in system, which uses a group of high-power (high-current) power modules to supply the entire burn-in substrate with a small current shunt output at the output part, that is, a plurality of shunt modules are arranged on the power board, and each shunt module has a current measurement circuit unit, an overcurrent detection unit, an output switch and a voltage measurement circuit unit. Compared with the aforementioned known power board structure of the integrated circuit burn-in system, it has the following advantages, which are briefly described as follows. First, each independent measurement circuit can disconnect (OFF) the corresponding power supply of a poor-quality DUT (i.e. IC) when it is damaged without burning out its IC socket; secondly, by providing an independent measurement circuit for each DUT, DUTs (i.e. ICs) of different quality can be identified and IC products can be classified by grade; in addition, by providing an independent measurement circuit for each DUT (i.e. IC), the time point when the DUT is damaged can be known during the burn-in process; then, the power shunt output method will make the voltage level of the DUT (i.e. IC) at the front, middle and back positions of the entire burn-in substrate more consistent; finally, each DUT (i.e. IC) has an independent measurement circuit that can collect data from each DUT (i.e. IC), allowing the product to have the function of product compliance.

[0005] According to the above-mentioned purpose, the present invention provides a power board structure of an integrated circuit burn-in system, comprising a power board electrically connected to a burn-in substrate; and a plurality of shunt modules disposed on the power board and electrically connected to the power board, wherein each of the shunt modules at least comprises a current measurement circuit unit and a voltage measurement unit module; wherein each of the shunt modules is used to electrically connect to a corresponding component to be tested disposed on the burn-in substrate.

[0006] In some embodiments, each of the current shunt modules further includes an overcurrent detection unit electrically connected to the current measurement circuit unit.

[0007] In some embodiments, each of the current shunt modules further includes an output switch electrically connected to the over-current detection unit.

[0008] In some embodiments, the over-current detection unit is configured to detect whether a current provided by the current measurement unit exceeds a preset threshold value.

[0009] In some embodiments, the output switch is configured to short-circuit or open-circuit to turn on or off the current output to the corresponding device under test.

[0010] In some embodiments, when the current is less than the preset critical value, the output switch is short-circuited to conduct the current and output it to the corresponding component under test.

[0011] In some embodiments, when the current is greater than the preset critical value, the output switch is disconnected to cut off the current and the current will not be output to the corresponding component under test.

[0012] In some embodiments, the voltage measurement circuit unit is electrically connected to the corresponding device under test and provides a voltage to the corresponding device under test.

[0013] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments listed below are described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The present invention is a schematic diagram of a structure in which a power board structure of a known integrated circuit burn-in system is connected to a plurality of components to be tested.

[0015] Figure 2 The present invention is a detailed structural diagram of a power board structure of a known integrated circuit burn-in system connected to multiple components to be tested.

[0016] Figure 3 The schematic diagram is a schematic diagram of a structure in which a power board structure of an integrated circuit burn-in system of the present invention is connected to a plurality of components to be tested.

[0017] Figure 4 The invention is a detailed structural schematic diagram of the power board structure of the integrated circuit burn-in system connected to multiple components to be tested.

[0018] Figure 5 The figure is a schematic structural block diagram of the power board structure of the integrated circuit burn-in system of the present invention.

[0019] Explanation of symbols:

[0020] 100: Power board structure

[0021] 1: Power board

[0022] 2: Diversion module

[0023] 21: Current measurement circuit unit

[0024] 22: Overcurrent detection unit

[0025] 23: Output switch

[0026] 24: Voltage measurement circuit unit

[0027] 200: Burn-in substrate

[0028] 100': Power board structure

[0029] 1': Power board

[0030] 10': Burn-in substrate

[0031] 2': Current measurement circuit unit

[0032] 3': Voltage measurement circuit unit

[0033] 4': Dynamic Power Supply

[0034] DUT1~DUT6: Components under test

[0035] MV:Measurement voltage DETAILED DESCRIPTION

[0036] The advantages, features and technical methods achieved by the present invention will be described in more detail with reference to exemplary embodiments and the accompanying drawings so as to be more easily understood, and the present invention can be implemented in different forms, so it should not be understood that the present invention is limited to the embodiments described herein. On the contrary, for those with ordinary knowledge in the relevant technical field, the provided embodiments will make the present disclosure more thorough and comprehensive and fully convey the scope of the present invention, and the present invention will only be defined by the scope of the attached patent application.

[0037] In addition, the terms "include" and / or "comprising" refer to the presence of stated features, regions, wholes, steps, operations, components and / or parts, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, components, parts and / or combinations thereof.

[0038] In order to make it easier for you, the review committee, to understand the content of the present invention and the effects that can be achieved, various specific embodiments listed in conjunction with the accompanying drawings are described in detail as follows.

[0039] Figure 3 The schematic diagram is a schematic diagram of a structure in which a power board structure of an integrated circuit burn-in system of the present invention is connected to a plurality of components to be tested. Figure 4 The invention is a detailed structural schematic diagram of the power board structure of the integrated circuit burn-in system connected to multiple components to be tested. Figure 5 The figure is a schematic structural block diagram of the power board structure of the integrated circuit burn-in system of the present invention.

[0040] Please refer to Figures 3 to 5 The power board structure 100 of the integrated circuit burn-in system of the present invention may include a power board 1 and a plurality of shunt modules 2 .

[0041] The power board 1 can be electrically connected to a burn-in substrate 200 .

[0042] Each shunt module 2 is disposed on the power board 1 and is electrically connected to the power board 1. In some embodiments, each shunt module 2 is used to electrically connect a corresponding DUT (i.e., DUT1 to DUT6) disposed on the burn-in substrate 200. Figure 5Each current shunt module 2 may include a current measurement circuit unit 21, an overcurrent detection unit 22, an output switch 23, and a voltage measurement circuit unit 24. The overcurrent detection unit 22 is electrically connected to the current measurement circuit unit 21. The output switch 23 is electrically connected to the overcurrent detection unit 22. The voltage measurement circuit unit 24 is electrically connected to the corresponding device under test (i.e., DUT1-DUT6) and provides a voltage to the corresponding device under test (i.e., DUT1-DUT6), and measures a measurement voltage MV of the corresponding device under test (i.e., DUT1-DUT6).

[0043] In some embodiments, the overcurrent detection unit 22 is configured to detect whether a current provided by the current measurement circuit unit 21 exceeds a preset critical value. The output switch 23 is configured to short-circuit (turn on) or open-circuit (turn off) to conduct or disconnect the current output to the corresponding device under test (i.e., DUT1-DUT6). That is, when the current is less than the preset critical value, the output switch 23 is short-circuited to conduct the current and output it to the corresponding device under test (i.e., DUT1-DUT6); and when the current is greater than the preset critical value, the output switch is open-circuited to disconnect the current and the current will not be output to the corresponding device under test (i.e., DUT1-DUT6).

[0044] In summary, the power board structure 100 of the integrated circuit burn-in system of the present invention uses a group of high-power (high-current) power modules to supply the entire burn-in substrate. The output part is designed to output in a small current shunt mode, that is, a plurality of shunt modules are arranged on the power board, and each shunt module has a current measurement circuit unit, an overcurrent detection unit, an output switch and a voltage measurement circuit unit. Compared with the power board structure of the known integrated circuit burn-in system mentioned above, it has the following advantages, which are briefly described as follows. First, each independent measurement circuit can disconnect (OFF) the corresponding power supply of a poor-quality DUT (i.e. IC) when it is damaged without burning out its IC socket; secondly, by providing an independent measurement circuit for each DUT, DUTs (i.e. ICs) of different quality can be identified and IC products can be classified by grade; in addition, by providing an independent measurement circuit for each DUT (i.e. IC), the time point when the DUT is damaged can be known during the burn-in process; then, the power shunt output method will make the voltage level of the DUT (i.e. IC) at the front, middle and back positions of the entire burn-in substrate more consistent; finally, each DUT (i.e. IC) has an independent measurement circuit that can collect data from each DUT (i.e. IC), allowing the product to have the function of product compliance.

[0045] It should be noted here that the above-mentioned device provided in the embodiment of the present invention can implement all the method steps implemented in the above-mentioned method embodiment, and can achieve the same technical effect. The parts and beneficial effects that are the same as the method embodiment in this embodiment will not be described in detail here.

[0046] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A power board structure of an integrated circuit burn-in system, characterized in that: include: A power board electrically connected to a burn-in substrate; as well as A plurality of shunt modules are arranged on the power board and electrically connected to the power board, wherein each of the shunt modules at least includes a current measurement circuit unit and a voltage measurement unit module; Each of the current shunt modules is used to electrically connect to a corresponding component to be tested which is arranged on the burn-in substrate.

2. The power board structure of the integrated circuit burn-in system according to claim 1, characterized in that: Each of the current shunt modules further includes an overcurrent detection unit electrically connected to the current measurement circuit unit.

3. The power board structure of the integrated circuit burn-in system according to claim 2, characterized in that: Each of the current shunt modules further includes an output switch electrically connected to the over-current detection unit.

4. The power board structure of the integrated circuit burn-in system according to claim 3, characterized in that: The over-current detection unit is configured to detect whether a current provided by the current measurement circuit unit exceeds a preset critical value.

5. The power board structure of the integrated circuit burn-in system according to claim 4, characterized in that: The output switch is configured to short-circuit or open-circuit to turn on or off the current output to the corresponding device under test.

6. The power board structure of the integrated circuit burn-in system according to claim 5, characterized in that: When the current is less than the preset critical value, the output switch is short-circuited to conduct the current and output it to the corresponding component under test.

7. The power board structure of the integrated circuit burn-in system according to claim 6, characterized in that: When the current is greater than the preset critical value, the output switch is disconnected to cut off the current and the current will not be output to the corresponding component under test.

8. The power board structure of the integrated circuit burn-in system according to claim 1, characterized in that: The voltage measurement circuit unit is electrically connected to the corresponding component under test and provides a voltage to the corresponding component under test.

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