Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus which can avoid excessive increase of sliding resistance when a heat treatment plate is made to slide. The guide plate (151) is fixed to the main body frame (11) and extends in the X direction. The first plate (153) can slide in the X direction with respect to the guide plate (151). The second plate (155) is fixed with respect to the heat plate (20), and is capable of sliding in the X direction with respect to the first plate (153). The interlocking / separating mechanism (70) interlocks the first plate (153) and the second plate when the heat plate (20) moves from the processing position (P1) to the intermediate position (P3), and separates the second plate (155) from the first plate (153) when the heat plate (20) moves from the intermediate position (P3) to the maintenance position (P2).

Description

Technical Field

[0001] The subject matter disclosed in this specification relates to a substrate processing apparatus. Background Art

[0002] For example, in a processing step of various substrates such as a glass substrate for a display device, a process is sometimes performed in which a coating liquid is applied to a substrate and then the substrate is heated to volatilize components contained in the coating liquid.

[0003] In addition, Patent Document 1 discloses a substrate processing apparatus in which a plurality of processing chambers including cooling plates for cooling substrates are stacked in a vertical direction. Also disclosed is a multi-stage substrate processing apparatus in which the processing chambers can be withdrawn to facilitate maintenance of the processing chambers.

[0004] More specifically, the cooling plate is arranged on a sliding unit that can be pulled out to the front relative to the outer cover. The sliding unit includes a pair of sliding members, and the sliding member includes a fixed side part installed on the outer cover, a movable side part installed on a slider of the sliding unit, and an intermediate part provided between the fixed side part and the movable side part.

[0005] A ball holder for holding a plurality of balls is provided between the fixed side component and the intermediate component and between the movable side component and the intermediate component, so that the intermediate component can slide relative to the fixed side component along a sliding direction, and the movable side component can slide relative to the intermediate component along a sliding direction.

[0006] With this structure, the movable-side member can be slid relative to the fixed-side member, so the slide unit and the cooling plate can be pulled out from the outer casing to which the fixed-side member is fixed.

[0007] [Prior art literature]

[0008] [Patent Document]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 2000-012448 Summary of the invention

[0010] [Problems to be solved by the invention]

[0011] However, in the prior art, when the cooling plate is pulled out from the processing position in the outer cover to the outside of the outer cover, sometimes only the moving side member moves first, and then the intermediate member moves with a delay. In this case, since the intermediate member moves from a position away from the cooling plate, an excessive load is applied to the intermediate member. As a result, the sliding resistance increases, and it may be difficult to pull it out smoothly.

[0012] An object of the present invention is to provide a technology that can prevent the sliding resistance from becoming excessively large when a heat treatment plate is slidably moved.

[0013] [Technical means to solve the problem]

[0014] In order to solve the problem, the first embodiment includes: a heat treatment plate for heat treating a substrate; a main frame for supporting the heat treatment plate; and at least one sliding member for moving the heat treatment plate from a treatment position inside the main frame to a maintenance position along a first direction intersecting a vertical direction, the sliding member comprising: a guide plate fixed to the main frame and extending along the first direction; a first plate capable of sliding relative to the guide plate along the first direction; a second plate fixed relative to the heat treatment plate and capable of sliding relative to the first plate along the first direction; and a linkage separation mechanism for linking the first plate with the second plate when the heat treatment plate moves from the treatment position to an intermediate position between the treatment position and the maintenance position, and for separating the second plate from the first plate when the heat treatment plate moves from the intermediate position to the maintenance position.

[0015] The second embodiment is a substrate processing apparatus according to the first embodiment, further comprising a processing chamber for accommodating the heat treatment plate, and the second plate is fixed to the processing chamber.

[0016] The third embodiment is a substrate processing device according to the first embodiment or the second embodiment, wherein the guide plate has a guide rail extending along the first direction, the first plate has a guide block engaged with the guide rail and capable of sliding along the guide rail, and the guide block is fixed in the middle of the first plate in the first direction.

[0017] A fourth embodiment is a substrate processing apparatus according to any one of the first to third embodiments, comprising a pair of sliding members separated from each other in a second direction intersecting the first direction and the vertical direction.

[0018] A fifth embodiment is the substrate processing apparatus according to the fourth embodiment, wherein the heat treating plate is located between the pair of sliding members in the second direction.

[0019] The sixth embodiment is a substrate processing device according to the fifth embodiment, wherein the first plate is arranged between the guide plate and the second plate in the second direction, and the linkage separation mechanism includes: a movable pressing member, which is provided on the first plate and can move along the second direction; a limiting protrusion, which is provided on the first plate and protrudes toward the second plate; a movable engaging protrusion, which is provided on the second plate and can engage with the limiting protrusion and can move along the second direction; an elastic member, which is provided on the second plate and applies force to the movable engaging protrusion toward the first plate side; and a cam member, which is provided on the guide plate and protrudes toward the first plate side, and when the heat treatment plate moves from the treatment position to the intermediate position, in the first direction, the movable engaging protrusion engages with the limiting protrusion, and when the heat treatment plate reaches the intermediate position, the movable pressing member is pressed by the cam member, so that the movable pressing member moves toward the second plate side, and the movable engaging protrusion is pressed by the movable pressing member, so that the movable engaging protrusion moves to the second plate side closer to the limiting protrusion.

[0020] The seventh embodiment is a substrate processing device according to the fifth embodiment, and further includes: a stopping mechanism, which stops the first plate moved to a predetermined stop position relative to the guide plate, and the linkage separation mechanism has a locking component that locks the second plate with the first plate, and when the second plate moves along the first direction after the first plate is stopped at the stop position by the stopping mechanism, the locking component releases the locking of the first plate and the second plate.

[0021] The eighth embodiment is a substrate processing device according to any one of the first to seventh embodiments, further comprising: a substrate lifting mechanism for lifting and lowering the substrate above the heat treatment plate, and the sliding component can pull out the heat treatment plate and the substrate lifting mechanism as a whole.

[0022] [Effects of the Invention]

[0023] According to the substrate processing apparatus of the first to eighth embodiments, when the heat treatment plate is moved from the processing position to the intermediate position, the first plate can be moved following the heat treatment plate. Thus, the first plate can be prevented from being separated from the heat treatment plate, and thus the load applied to the first plate can be reduced. As a result, since the sliding resistance of the sliding member can be reduced, the heat treatment plate can be well pulled out.

[0024] According to the substrate processing apparatus of the second embodiment, even if the load corresponding to the processing chamber is increased, the sliding resistance of the sliding member can be reduced, so the heat treatment plate and the processing chamber can be properly pulled out.

[0025] According to the substrate processing apparatus of the third embodiment, the guide block can be brought close to the heat treating plate, and thus the load applied to the guide block can be reduced.

[0026] According to the substrate processing apparatus of the fourth embodiment, the load of the heat processing plate can be applied to the pair of sliding members, so the heat processing plate can be pulled out well.

[0027] According to the substrate processing apparatus of the fifth embodiment, the pair of slide members are arranged so as not to overlap with the heat treatment plate in the vertical direction, so the size of the apparatus in the vertical direction can be reduced.

[0028] According to the substrate processing device of the sixth embodiment, during the period when the heat treatment plate moves from the processing position to the intermediate position, the movable engaging protrusion of the second plate engages with the limiting protrusion of the first plate. Thus, the first plate and the second plate can be linked. In addition, when the heat treatment plate reaches the intermediate position, the movable engaging protrusion of the second plate moves to the side closer to the second plate than the limiting protrusion of the first plate. Thus, the engagement is released. Therefore, since the second plate can be separated from the first plate and moved, the heat treatment plate can be moved from the intermediate position to the maintenance position together with the second plate.

[0029] According to the substrate processing apparatus of the seventh embodiment, the linkage and separation of the first plate and the second plate can be realized with a relatively simple structure.

[0030] According to the substrate processing apparatus of the eighth embodiment, even if the load of the substrate lifting mechanism is increased by an amount corresponding to that of the substrate lifting mechanism, the sliding resistance of the sliding member can be reduced, so that the heat treatment plate and the substrate lifting mechanism can be properly withdrawn. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a perspective view of the substrate processing apparatus according to the first embodiment.

[0032] Figure 2 Yes means Figure 1 A perspective view of a processing unit of a substrate processing apparatus is shown.

[0033] Figure 3 Yes means Figure 2 A schematic cross-sectional view of the structure of the processing unit shown.

[0034] Figure 4 It is a magnified representation Figure 2 A perspective view of a portion of a sliding member included in the processing unit is shown.

[0035] Figure 5 Yes means Figure 1 A top view of a stopping mechanism included in the substrate processing apparatus shown.

[0036] Figure 6 (A)~ Figure 6(C) is a diagram showing a state where the processing unit is pulled out by a sliding member.

[0037] Figure 7 (A)~ Figure 7 (D) means Figure 1 FIG. 2 is a diagram showing the operation of the interlocking separation mechanism included in the substrate processing apparatus shown.

[0038] Figure 8 (A)~ Figure 8 (D) is a graph showing the load (kgf) applied to the sliding member during the process of pulling out the processing unit.

[0039] Fig. 9 It is a perspective view showing a linkage separation mechanism of a substrate processing apparatus according to a second embodiment.

[0040] [Explanation of Symbols]

[0041] 1: Substrate processing equipment

[0042] 8: Control Department

[0043] 9: Substrate

[0044] 11: Main frame

[0045] 13: Processing Unit

[0046] 15: Sliding member

[0047] 17: Processing chamber

[0048] 20: Hot Plate

[0049] 20a: Upper surface

[0050] 30: Substrate lifting mechanism

[0051] 31: Lifting pin

[0052] 33: Lifting pin lifting part

[0053] 40: Frame

[0054] 41: Opening

[0055] 43: Sealing part

[0056] 50: cover

[0057] 61: First rail

[0058] 62: First boot block

[0059] 63: Second rail

[0060] 64: Second boot block

[0061] 65: Stop Agency

[0062] 70, 70a: Linkage separation mechanism

[0063] 71: Movable pressing member

[0064] 72: Restriction protrusion

[0065] 73: Movable engagement protrusion

[0066] 74: Elastic member

[0067] 75: Cam member

[0068] 76: Engagement protrusion (engagement member)

[0069] 77: Engagement recess (engagement member)

[0070] 151: Guide plate

[0071] 153: First board

[0072] 155: Second board

[0073] 651: Stop protrusion

[0074] 653: Contact protrusion

[0075] 721: Limit the slope

[0076] 751: Cam ramp

[0077] P1: Processing position

[0078] P2: Maintenance position

[0079] P3: Middle position

[0080] X, Y, Z: direction DETAILED DESCRIPTION

[0081] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the constituent elements described in the embodiments are merely examples and do not mean that the scope of the present invention is limited to these. In the drawings, for ease of understanding, the size or number of each part is sometimes exaggerated or simplified as required.

[0082] In addition, in order to make the positional relationship of each element easier to understand, arrows representing XYZ orthogonal coordinate axes are sometimes marked in the drawings. In the XYZ coordinate system, the Z axis corresponds to the vertical axis, and the XY plane intersecting the Z axis at right angles corresponds to the horizontal plane. In addition, the (-Z) direction corresponds to the vertical downward direction. In the following description, the vertical upward direction is sometimes referred to as "upward" or "above", and the vertical downward direction is sometimes referred to as "downward" or "below".

[0083] <1. First embodiment>

[0084] Figure 1 1 is a perspective view of a substrate processing apparatus 1 according to the first embodiment. The substrate processing apparatus 1 is a processing chamber 17 (see Figure 2 ) accommodates a substrate 9 coated with a coating liquid such as a photoresist on the surface thereof, and heats the substrate 9, thereby volatilizing the solvent component in the coating liquid. The substrate processing device 1 can be used, for example, for the purpose of forming a photoresist film on the surface of the substrate 9. The substrate 9 is, for example, various substrates to be processed for electronic devices, specifically, semiconductor wafers, glass substrates for liquid crystal displays or plasma displays, glass or ceramic substrates for magnetic disks or optical disks, glass substrates for organic electroluminescence (EL), glass or silicon substrates for solar cells, flexible substrates, printed substrates, etc.

[0085] The substrate processing apparatus 1 includes a main frame 11, a plurality of (five in this embodiment) processing units 13, and a control unit 8. Figure 1 As shown, a plurality of processing units 13 are stacked in multiple stages along the Z direction. The main frame 11 supports the processing units 13. The processing units 13 are devices for performing a heating process on the substrate 9.

[0086] The control unit 8 is, for example, a computer, and has a processor such as a central processing unit (CPU) and a memory electrically connected to the processor and storing a program. The processor executes the program stored in the memory to control the operation of each unit in the substrate processing apparatus 1. Thus, various processes such as heat treatment are performed in the substrate processing apparatus 1.

[0087] Figure 2 Yes means Figure 1 3D diagram of the processing unit 13 of the substrate processing device 1 shown in FIG. Figure 2 As shown, the substrate processing device 1 includes a pair of sliding members 15 for each processing unit 13. The processing unit 13 is arranged between the pair of sliding members 15 in the Y direction. The pair of sliding members 15 is a mechanism for moving the processing unit 13 along the X direction. More specifically, the pair of sliding members 15 is moved between a processing position P1 for performing a heat treatment on the processing unit 13 and a maintenance position P2 for performing maintenance on the processing unit 13. The processing position P1 is the inner side of the main frame 11 when viewed from above, and the maintenance position P2 is the outer side (+X side) of the main frame 11 when viewed from above.

[0088] Figure 3 Yes means Figure 2 The schematic cross-sectional view of the structure of the processing unit 13 is shown. Figure 3 As shown, the processing unit 13 includes a processing chamber 17 , a hot plate 20 and a substrate lifting mechanism 30 .

[0089] The processing chamber 17 has a substantially rectangular parallelepiped shape. The processing chamber 17 has a frame 40 and a cover 50. The frame 40 has an opening 41 at the top. The frame 40 accommodates the hot plate 20 inside.

[0090] The cover 50 has a substantially plate shape that can close the opening 41 at the upper portion of the frame 40. The cover 50 is detachable from the upper portion of the frame 40. The cover 50 is mounted on the upper portion of the frame 40 via a sealing portion 43. The sealing portion 43 is a member that seals the gap between the frame 40 and the cover 50.

[0091] When the cover 50 is removed from the frame 40, the inner surface of the frame 40 is exposed to the outside through the opening 41 of the frame 40. In this state, maintenance work such as replacement of parts or cleaning inside the frame 40 is performed through the opening 41 of the frame 40.

[0092] The hot plate 20 is accommodated inside the processing chamber 17. The hot plate 20 has a flat upper surface 20a. A heater such as a heating wire is built into the hot plate 20. By driving the heater, the upper surface 20a of the hot plate 20 is heated to a predetermined temperature. As a result, the substrate 9 disposed above and near the upper surface 20a is heated. The heater is controlled by the control unit 8.

[0093] The substrate lifting mechanism 30 lifts the substrate 9 up and down above the hot plate 20. The substrate lifting mechanism 30 has a plurality of lifting pins 31 and a lifting pin lifting portion 33. The substrate lifting mechanism 30 is supported by a support frame (not shown). The support frame is a component connected to the processing chamber 17. That is, the substrate lifting mechanism 30 is connected to the processing chamber 17 via the support frame. In addition, the so-called "connection" includes not only a case where components are directly connected by contact with each other, but also a case where components are indirectly connected via other components.

[0094] The plurality of lift pins 31 extend in the vertical direction and are dispersedly arranged in the horizontal direction. The plurality of lift pins 31 are inserted into the bottom wall of the frame 40 in the processing chamber 17 and a plurality of through holes provided on the hot plate 20, and penetrate the bottom wall of the frame 40 and the hot plate 20. The plurality of lift pins 31 are held by the lift pin lifter 33 in a state of protruding upward from the upper surface 20a of the hot plate 20.

[0095] The lift pin lifter 33 lifts the plurality of lift pins 31 up and down in unison. The lift pin lifter 33 is disposed outside and below the processing chamber 17. The lift pin lifter 33 includes, for example, a rack and pinion mechanism including a motor or a ball screw mechanism.

[0096] The substrate 9 is supported by the upper ends of the plurality of lift pins 31. The lift pin lifter 33 moves the plurality of lift pins 31 between a proximity position where the substrate 9 is close to the upper surface 20a of the hot plate 20 and an upper position above the proximity position. The operation of the lift pin lifter 33 is controlled by the control unit 8.

[0097] <Sliding member 15>

[0098] Next, the structure of the sliding member 15 is described. In the following description, the sliding member 15 located on the +Y side of the pair of sliding members 15 is described, and the sliding member 15 on the -Y side also has the same structure. The pair of sliding members 15 are arranged symmetrically about a symmetry axis parallel to the Z axis passing therebetween.

[0099] Figure 4 It is a magnified representation Figure 2 1 is a perspective view of a portion of the slide member 15 included in the processing unit 13. The slide member 15 has a guide plate 151, a first plate 153, and a second plate 155. The first plate 153 is located between the guide plate 151 and the second plate 155 in the Y direction.

[0100] <Guide plate 151>

[0101] The guide plate 151 is fixed to the main frame 11. The guide plate 151 is a plate-shaped member extending in the X direction. The guide plate 151 has approximately the same size as the processing chamber 17 in the X direction. A plurality of (two in this example) first guide rails 61 extending in the X direction are fixed to the surface of the guide plate 151 facing the first plate 153 (the side surface on the -Y side). In addition, the first guide rail 61 may also be one.

[0102] <First Plate 153>

[0103] The first plate 153 is a plate-shaped member extending in the X direction. In the X direction, the size of the first plate 153 is substantially the same as that of the second plate 155. The first plate 153 is configured to be able to slide relative to the guide plate 151 in the X direction. In detail, a plurality of first guide blocks 62 are fixed to the surface of the first plate 153 facing the guide plate 151 (the surface on the +Y side). The first guide block 62 is engaged with the first guide rail 61 and can move along the first guide rail 61. One of the plurality of first guide blocks 62 is preferably fixed to the middle of the first plate 153 in the X direction, and more preferably fixed to the center of the first plate 153.

[0104] A plurality of (two in this example) second guide rails 63 extending in the X direction are fixed vertically and spaced apart from each other on the surface (the side surface at the −Y side) of the first plate 153 facing the second plate 155. Alternatively, the number of second guide rails 63 may be one.

[0105] <Second board 155>

[0106] The second plate 155 is a plate-shaped member extending in the X direction. In the X direction, the size of the second plate 155 is substantially the same as that of the guide plate 151 and the first plate 153. The second plate 155 is provided to be able to slide relative to the first plate 153 in the X direction. In detail, a plurality of second guide blocks 64 are fixed to the surface of the second plate 155 facing the first plate 153 (the surface on the +Y side). The second guide blocks 64 are engaged with the second guide rails 63 of the first plate 153 and can move along the second guide rails 63.

[0107] In addition, the first guide rail 61 may be disposed on the first plate 153, and the first guide block 62 may be disposed on the guide plate 151. In addition, the second guide rail 63 may be disposed on the second plate 155, and the second guide block 64 may be disposed on the first plate 153.

[0108] Figure 5 Yes means Figure 1 The stopping mechanism 65 is a mechanism for stopping the first plate 153 moved to a predetermined stop position relative to the guide plate 151 when the processing unit 13 including the hot plate 20 moves from the processing position P1 to the maintenance position P2.

[0109] like Figure 5 As shown in FIG. 1 , the stop mechanism 65 includes a stop protrusion 651 and a contact protrusion 653. The stop protrusion 651 is provided on the guide plate 151 and protrudes toward the first plate 153. The contact protrusion 653 is provided on the first plate 153 and protrudes toward the guide plate 151. When the first plate 153 moves in the +X direction relative to the guide plate 151 and reaches the stop position, the contact protrusion 653 collides with the stop protrusion 651. As a result, the movement of the first plate 153 toward the +X side beyond the stop position is restricted.

[0110] In addition, a stop mechanism (not shown) for limiting the movement of the second plate 155 in the X direction is also provided on the first plate 153. The stop mechanism includes, for example, a stop protrusion provided on the first plate 153 and a contact protrusion provided on the second plate 155. When the second plate 155 reaches a predetermined position by moving toward the +X side relative to the first plate 153, the contact protrusion contacts the stop protrusion. Thus, the movement of the second plate 155 toward the +X side is limited.

[0111] Figure 6 (A)~ Figure 6 (C) is a diagram showing a state where the processing unit 13 is pulled out by the sliding member 15 . Figure 6 (A) is a schematic plan view showing a state where the processing unit 13 is located at the processing position P1. Figure 6(B) is a schematic plan view showing a state where the processing unit 13 is located at the intermediate position P3. Figure 6 (C) is a schematic top view showing a state where the processing unit 13 is located at the maintenance position P2. The intermediate position P3 is a position between the processing position P1 and the maintenance position P2 in the X direction. Figure 6 (A)~ Figure 6 In (C), only the sliding member 15 on the +Y side of the pair of sliding members 15 is shown.

[0112] like Figure 6 (A)~ Figure 6 As shown in (C), the slide member 15 has a linkage separation mechanism 70. When the processing unit 13 including the hot plate 20 moves from the processing position P1 to the intermediate position P3, the linkage separation mechanism 70 links the first plate 153 and the second plate 155 so that the first plate 153 and the second plate 155 move integrally. Figure 6 (A) and Figure 6 As shown in FIG. 2(B), while the processing unit 13 moves from the processing position P1 to the intermediate position P3, the first plate 153 and the second plate 155 move toward the +X side together with the processing unit 13 .

[0113] In addition, the linkage separation mechanism 70 releases the connection between the second plate 155 and the first plate 153 when the processing unit 13 including the heat plate 20 moves from the intermediate position P3 to the maintenance position P2. Figure 6 (B) and Figure 6 As shown in (C), the second plate 155 separates from the first plate 153 and moves toward the +X side. In addition, when the processing unit 13 is located at the intermediate position P3, the movement of the first plate 153 toward the X side is restricted by the stop mechanism 65. As a result, only the second plate 155 moves toward the +X side together with the processing unit 13.

[0114] In addition, it is desirable that each of the pair of sliding members 15 has the interlocking separation mechanism 70 . However, only one of the pair of sliding members 15 may have the interlocking separation mechanism 70 .

[0115] Figure 7 (A)~ Figure 7 (D) means Figure 1 FIG. 2 is a diagram showing the operation of the interlocking separation mechanism 70 included in the substrate processing apparatus 1 . Figure 7 (A) is a partial plan view showing a state in which the interlocking separation mechanism 70 interlocks the first plate 153 and the second plate 155 . Figure 7 (B) and Figure 7 (C) is a partial top view showing the process in which the linkage separation mechanism 70 separates the first plate 153 from the second plate 155 . Figure 7(D) is a partial plan view showing a state in which the interlocking separation mechanism 70 separates the first plate 153 from the second plate 155 .

[0116] like Figure 7 (A)~ Figure 7 As shown in FIG. 2 (D), the interlocking release mechanism 70 includes a movable pressing member 71 , a restricting protrusion 72 , a movable engaging protrusion 73 , an elastic member 74 , and a cam member 75 .

[0117] The movable pressing member 71 is a rod-shaped member provided on the first plate 153 and extending in the Y direction. The movable pressing member 71 is inserted into a through hole provided in the first plate 153 and is held so as to be movable in the Y direction relative to the insertion hole.

[0118] The limiting protrusion 72 is provided on the side of the first plate 153 that faces the second plate 155 (at Figure 7 (A)~ Figure 7 The limiting protrusion 72 is formed in a substantially right-angled trapezoidal shape when viewed from above. The surface of the limiting protrusion 72 facing the second plate 155 side (+Y side) has a limiting slope 721 inclined toward the guide plate 151 side (-Y side) in the +X direction.

[0119] The movable engaging protrusion 73 is provided on the second plate 155 and is held so as to be movable in the Y direction relative to the second plate 155. The movable engaging protrusion 73 is provided so as to be movable from the second plate 155 to the first plate 153 side (at Figure 7 (A)~ Figure 7 (D) (-Y side) protrudes, and the movable engaging protrusion 73 can engage with the limiting protrusion 72.

[0120] The elastic member 74 is provided on the second plate 155, and urges the movable engagement protrusion 73 toward the first plate 153. The elastic member 74 is, for example, a spring disposed in a concave hole provided in the second plate 155.

[0121] like Figure 7 (B)~ Figure 7 As shown in (D), the cam member 75 is provided on the guide plate 151, extending from the guide plate 151 toward the first plate 153 side (at Figure 7 (A)~ Figure 7 The cam member 75 is substantially in the shape of a right-angled trapezoid when viewed from above. The surface of the cam member 75 facing the first plate 153 side (+Y side) has a cam slope 751 that is inclined toward the first plate 153 side (+Y side) in the +X direction. Figure 6 (A)~ Figure 6As shown in FIG. 1 (C), the cam member 75 is provided in the middle of the guide plate 151 in the X direction, and more preferably, in the center of the guide plate 151.

[0122] In the processing unit 13 including the hot plate 20, from the processing position P1 (refer to Figure 6 (A)) to the middle position P3 (refer to Figure 6 (B)) during the movement, such as Figure 7 As shown in (A), the movable engaging protrusion 73 is placed in the protruding position by being pressed by the elastic member 74. Moreover, the movable engaging protrusion 73 in the protruding position contacts the limiting protrusion 72 in the X direction. That is, the movable engaging protrusion 73 is engaged with the limiting protrusion 72. Therefore, when the second plate 155 moves in the +X direction together with the processing unit 13, the first plate 153 also moves in the +X direction in conjunction.

[0123] When the processing unit 13 including the heat plate 20 reaches the intermediate position P3 (refer to Figure 6 (B)), such as Figure 7 As shown in (B), the movable pressing member 71 moves toward the +X side while sliding in contact with the cam slope 751 of the cam member 75. As a result, the movable pressing member 71 is pressed by the cam member 75, so that the movable pressing member 71 moves toward the second plate 155. Figure 7 As shown in (C), the movable engaging protrusion 73 is pressed by the movable pressing member 71, so that the movable engaging protrusion 73 moves to the second plate 155 side (+Y side) relative to the limiting protrusion 72. As a result, the engagement between the movable engaging protrusion 73 and the limiting protrusion 72 is released. Then, as shown in FIG. Figure 7 As shown in (D), the movable pressing member 71 passes over the limiting protrusion 72 and moves in the +X direction. As a result, the second plate 155 can move in the +X direction relative to the first plate 153. In addition, the movement of the first plate 153 in the X direction is limited by the stop mechanism 65. As a result, the movement of the movable pressing member 71 to the +X side of the cam member 75 is limited.

[0124] In addition, when the processing unit 13 at the maintenance position P2 is returned to the processing position P1, the movable engaging protrusion 73 moves in the -X direction while slidingly contacting the limiting slope 721 of the limiting protrusion 72. Thus, the movable engaging protrusion 73 can move to the -X side over the limiting protrusion 72. Thus, when the processing unit 13 is pulled out to the maintenance position P2 again, the movable engaging protrusion 73 can be engaged with the limiting protrusion 72.

[0125] <Effects of the interlocking separation mechanism 70>

[0126] Figure 8 (A)~ Figure 8(D) is a diagram showing the load (kgf) applied to the sliding member 15 in each process of extracting the processing unit 13. Figure 8 (A)~ Figure 8 In (D), the weight of the processing unit 13 is set to 200 kg, and the center of gravity of the processing unit 13 is located at the center of the processing unit 13 in the X direction. In addition, the second plate 155 is set as a member having the second guide block 64 at the center position in the X direction and the -X side end. In addition, the first plate 153 is set as a member having the first guide block 62 at the center position in the X direction and the -X side end.

[0127] Figure 8 (A) is a diagram showing the load when the processing unit 13 is located at the processing position P1. Figure 8 (B) is a diagram showing the load when the processing unit 13 is located at the intermediate position P3. Figure 8 (C) is a diagram showing the load when the processing unit 13 is located at the maintenance position P2. Figure 8 (D) is a diagram showing the load when the processing unit 13 is located at the middle position P3. Figure 8 (D) shows a comparative example in which the first plate 153 and the second plate 155 are not linked together.

[0128] like Figure 8 As shown in (A), when the processing unit 13 is located at the processing position P1, the positions of the first guide block 62 and the second guide block 64 in the center coincide with the center of gravity. Therefore, a load of 100 kgf (= 980 N) is applied downwardly evenly. In addition, the load applied to the first guide block 62 and the second guide block 64 at the -X side end is 0 kgf.

[0129] In addition, if Figure 8 As shown in (C), when the processing unit 13 is located at the maintenance position P2, a downward load of 200 kgf (= 1960 N) is applied to the first guide block 62 at the center of the first plate 153, and an upward load of 100 kgf is applied to the first guide block 62 at the -X side end. This is because the center of gravity of the processing unit 13 is away from the first plate 153 in the X direction, and thus each first guide block 62 is subjected to a rotational force.

[0130] In addition, if Figure 8 As shown in (B), when the processing unit 13 is located at the intermediate position P3, the load applied to each first guide block 62 and each second guide block 64 is Figure 8That is, a downward load of 100 kgf is applied to the first guide block 62 and the second guide block 64 at the center, and no load is applied to the first guide block 62 and the second guide block 64 at the -X side end. Therefore, the sliding resistance applied to the first plate 153 is constant during the period when the processing unit 13 moves from the processing position P1 to the intermediate position P3. Moreover, as the processing unit 13 moves from the maintenance position P2 to the intermediate position P3, the sliding resistance gradually increases.

[0131] On the other hand, Figure 8 As shown in (D), when the first plate 153 and the second plate 155 are not linked by the linkage separation mechanism 70, when the processing unit 13 reaches the middle position P3, a downward load of 200kgf is applied to the central first guide block 62, and an upward load of 100kgf is applied to the first guide block 62 at the -X side end. That is, the same load as when the processing unit 13 is located at the maintenance position P2 is applied to each first guide block 62. In the initial stage of extraction, the sliding resistance of the first plate 153 immediately increases. In the initial stage of extraction, since sufficient power is not given to the processing unit 13, a relatively large force is required to extract the processing unit 13.

[0132] As described above, when the processing unit 13 including the hot plate 20 is started to be pulled out, the first plate 153 and the second plate 155 are linked by the linkage separation mechanism 70, so that it can be pulled out with a small force. In addition, after the processing unit 13 passes the intermediate position P3, although the sliding resistance becomes large, sufficient power can be given to the processing unit 13 before that. Therefore, the processing unit 13 can be easily pulled out to the maintenance position P2.

[0133] In addition, if Figure 8 (A)~ Figure 8 As shown in (D), when the processing unit 13 is pulled out from the processing position P1 to the maintenance position P2, a greater load is applied to the first plate 153 than to the second plate 155. Therefore, if the rigidity of the first plate 153 is low, it may be deformed by stress. In addition, if the first plate 153 is deformed during the sliding movement, the sliding resistance may increase. Therefore, Figure 4 As shown, the rigidity of the first plate 153 may be increased by making the thickness (dimension in the Y direction) of the first plate 153 thicker than the second plate 155 .

[0134] As described above, the substrate processing device 1 has a heat plate 20 as a heat treatment plate, a main frame 11, and at least one sliding member 15. The heat plate 20 performs heat treatment on the substrate 9. The main frame 11 supports the heat plate 20. The sliding member 15 moves the heat plate 20 from the processing position P1 inside the main frame 11 to the maintenance position P2 along the X direction, which is a first direction intersecting the vertical direction. The sliding member 15 has a guide plate 151, a first plate 153, a second plate 155, and a linkage separation mechanism 70. The guide plate 151 is fixed to the main frame 11 and extends along the X direction. The first plate 153 can slide relative to the guide plate 151 in the X direction. The second plate 155 is fixed relative to the heat plate 20 and can slide relative to the first plate 153 in the X direction. When the heat plate 20 moves from the processing position P1 to the intermediate position P3 between the processing position P1 and the maintenance position P2, the linkage separation mechanism 70 links the first plate 153 with the second plate 155. When the hot plate 20 moves from the intermediate position P3 to the maintenance position P2, the interlocking separation mechanism 70 separates the second plate 155 from the first plate 153. According to the above structure, when the hot plate 20 is moved from the processing position P1 to the intermediate position P3, the first plate 153 can be moved following the hot plate 20. As a result, the first plate 153 can be prevented from moving away from the hot plate 20, so the load applied to the first plate 153 can be reduced. As a result, since the sliding resistance of the sliding member 15 can be reduced, the hot plate 20 can be well pulled out.

[0135] The substrate processing apparatus 1 further includes a processing chamber 17. The processing chamber 17 accommodates the hot plate 20. The second plate 155 is fixed to the processing chamber 17. According to the above structure, even if the load corresponding to the processing chamber 17 increases, the sliding resistance of the sliding member 15 can be reduced, so that the hot plate 20 and the processing chamber 17 can be well extracted.

[0136] The guide plate 151 has a first guide rail 61 extending in the X direction. The first plate 153 has a first guide block 62. The first guide block 62 is engaged with the first guide rail 61 and can slide and move along the first guide rail 61. The first guide block 62 is fixed to the middle of the first plate 153 in the X direction. According to the above structure, since the first guide rail 61 can be close to the heat plate 20, the load applied to the first guide block 62 can be reduced.

[0137] The substrate processing apparatus 1 includes a pair of slide members 15. The pair of slide members 15 are separated from each other in the Y direction which is a second direction intersecting the X direction and the vertical direction. According to the above structure, since the load of the hot plate 20 can be applied to the pair of slide members 15, the hot plate 20 can be pulled out well.

[0138] The heat plate 20 is located between the pair of slide members 15 in the Y direction. According to the above configuration, since the pair of slide members 15 are arranged so as not to overlap with the heat plate 20 in the vertical direction, the device size in the vertical direction can be reduced.

[0139] The first plate 153 is arranged between the guide plate 151 and the second plate 155 in the Y direction. The linkage separation mechanism 70 includes a movable pressing member 71, a limiting protrusion 72, a movable engaging protrusion 73, an elastic member 74, and a cam member 75. The movable pressing member 71 is provided on the first plate 153 and is movable in the Y direction. The limiting protrusion 72 is provided on the first plate 153 and protrudes toward the second plate 155 side. The movable engaging protrusion 73 is provided on the second plate 155, is engageable with the limiting protrusion 72, and is movable in the Y direction. The elastic member 74 is provided on the second plate 155 and applies force to the movable engaging protrusion 73 toward the first plate 153 side. The cam member 75 is provided on the guide plate 151 and protrudes toward the first plate 153 side. When the hot plate 20 moves from the processing position P1 to the intermediate position P3, the movable engaging protrusion 73 engages with the limiting protrusion 72 in the X direction. When the hot plate 20 reaches the intermediate position P3, the movable pressing member 71 is pressed by the cam member 75, so that the movable pressing member 71 moves to the second plate 155 side, and the movable engaging protrusion 73 is pressed by the movable pressing member 71, so that the movable engaging protrusion 73 moves to the second plate 155 side closer than the limiting protrusion 72. According to the structure, during the period when the hot plate 20 moves from the processing position P1 to the maintenance position P2, the movable engaging protrusion 73 of the second plate 155 is engaged with the limiting protrusion 72 of the first plate 153. Thus, the first plate 153 and the second plate 155 can be linked. In addition, when the hot plate 20 reaches the intermediate position P3, the movable engaging protrusion 73 of the second plate 155 moves to the second plate 155 side closer than the limiting protrusion 72 of the first plate 153. Thus, the engagement is released. Therefore, since the second plate 155 can be separated from the first plate 153 and moved, the second plate 155 can be moved from the intermediate position P3 to the maintenance position P2 together with the heat plate 20 .

[0140] The substrate processing apparatus 1 further includes a substrate lifting mechanism 30 for lifting the substrate 9 above the hot plate 20. The hot plate 20 and the substrate lifting mechanism 30 can be integrally pulled out by the sliding member 15. According to the above structure, even if the load corresponding to the substrate lifting mechanism 30 increases, the sliding resistance of the sliding member 15 can be reduced, so that the hot plate 20 and the substrate lifting mechanism 30 can be well pulled out.

[0141] <2. Second Embodiment>

[0142] Fig. 91 is a perspective view showing an interlocking separation mechanism 70a of a substrate processing apparatus 1 according to the second embodiment. The slide member 15 according to the second embodiment includes an interlocking separation mechanism 70a instead of the interlocking separation mechanism 70. The interlocking separation mechanism 70a includes an engagement protrusion 76 and an engagement recess 77.

[0143] The engaging protrusion 76 is provided on the second plate 155. In this example, the engaging protrusion 76 is fixed to the +X side end of the second plate 155. The engaging protrusion 76 protrudes from the second plate 155 to the first plate 153 side. The engaging recess 77 is provided on the first plate 153. In this example, the engaging recess 77 is fixed to the +X side end of the first plate 153. The engaging recess 77 is recessed to the second plate 155 side. In addition, the engaging protrusion 76 may be provided on the first plate 153, and the engaging recess 77 may be provided on the second plate 155.

[0144] During the period when the processing unit 13 moves from the processing position P1 to the intermediate position P3, the front end of the engaging protrusion 76 is arranged inside the engaging recess 77. Thus, the engaging protrusion 76 is hooked on the engaging recess 77, and the second plate 155 is engaged with the first plate 153. In this state, when the second plate 155 moves to the +X side together with the processing unit 13 at the processing position P1, the second plate 155 moves in conjunction with the first plate 153. The engaging protrusion 76 and the engaging recess 77 are an example of an engaging member that engages the second plate 155 with the first plate 153.

[0145] When the processing unit 13 reaches the intermediate position P3, the first plate 153 is stopped at the stop position by the stop mechanism 65. When the second plate 155 moves in the +X direction after the first plate 153 stops at the stop position, the engaging protrusion 76 is disengaged from the engaging recess 77, thereby releasing the engagement between the first plate 153 and the second plate 155. Therefore, the second plate 155 can be separated from the first plate 153 and move in the +X direction.

[0146] In addition, at least one of the engagement protrusion 76 and the engagement recess 77 may be formed to be elastically deformable. In this case, the engagement protrusion 76 and the engagement recess 77 can be easily engaged and disengaged by moving the engagement protrusion 76 relative to the engagement recess 77 in the X direction.

[0147] As described above, the substrate processing apparatus 1 includes the stop mechanism 65. The stop mechanism 65 stops the first plate 153 that has moved to a predetermined stop position relative to the guide plate 151. The linkage separation mechanism 70a has a locking protrusion 76 and a locking recess 77 as locking members. The locking protrusion 76 and the locking recess 77 lock the second plate 155 with the first plate 153. When the second plate 155 moves in the +X direction after the first plate 153 is stopped at the stop position by the stop mechanism 65, the locking of the first plate 153 and the second plate 155 by the locking protrusion 76 and the locking recess 77 is released. According to the structure, the linkage of the first plate 153 and the second plate 153 and the separation of the first plate 153 and the second plate 155 can be achieved with a relatively simple structure.

[0148] <3. Modifications>

[0149] Although several embodiments have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.

[0150] For example, the linkage separation mechanism 70 and the linkage separation mechanism 70a can be linked by engaging the first plate 153 with the second plate 155. However, the linkage structure is not limited to this structure. For example, the first plate 153 and the second plate 155 can also be linked by using the magnetic force of a magnet.

[0151] In addition, the substrate processing apparatus 1 is configured to perform a heating process on the substrate 9 by the hot plate 20. However, the substrate processing apparatus 1 may also be configured to perform a cooling process on the substrate 9. In this case, the substrate processing apparatus 1 may also include a heat treatment plate (cooling plate) without a heater, or a heat treatment plate (cooling plate) with a cooling mechanism such as a cooling water flow path or a Peltier element instead of the hot plate 20. In addition, the processing chamber 17 may not exist.

[0152] The present invention has been described in detail, but the description is illustrative in all aspects and the present invention is not limited thereto. It can be interpreted that numerous modifications not illustrated can be envisioned without departing from the scope of the present invention. The structures described in the embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A substrate processing device, comprising: Heat treatment plate, heat treatment of the substrate; A main frame, supporting the heat treatment plate; as well as at least one sliding member moves the heat treatment plate from a treatment position inside the main frame to a maintenance position along a first direction intersecting the vertical direction, The sliding member has: A guide plate, fixed to the main frame and extending along the first direction; A first plate capable of sliding relative to the guide plate along the first direction; A second plate, fixed relative to the heat treatment plate and capable of sliding relative to the first plate along the first direction; as well as The interlocking separation mechanism interlocks the first plate with the second plate when the heat treatment plate moves from the treatment position to an intermediate position between the treatment position and the maintenance position, and separates the second plate from the first plate when the heat treatment plate moves from the intermediate position to the maintenance position.

2. The substrate processing apparatus according to claim 1, further comprising: a processing chamber for accommodating the heat treatment plate; The second plate is fixed to the processing chamber.

3. The substrate processing apparatus according to claim 1 or 2, wherein: The guide plate has a guide rail extending along the first direction, The first plate has a guide block that engages with the guide rail and can slide along the guide rail. The guide block is fixed to the middle of the first plate in a first direction.

4. The substrate processing apparatus according to claim 1 or 2, comprising a pair of the sliding members, The pair of sliding members are separated from each other in a second direction intersecting the first direction and the vertical direction.

5. The substrate processing apparatus according to claim 4, wherein: The heat treatment plate is located between the pair of sliding members in the second direction.

6. The substrate processing apparatus according to claim 5, wherein: The first plate is arranged between the guide plate and the second plate in the second direction, The linkage separation mechanism comprises: a movable pressing member, disposed on the first plate and capable of moving along the second direction; a limiting protrusion, which is provided on the first plate and protrudes toward the second plate; A movable engaging protrusion, provided on the second plate, capable of engaging with the limiting protrusion and capable of moving along the second direction; an elastic member provided on the second plate and biasing the movable engaging protrusion toward the first plate side; and a cam member provided on the guide plate and protruding toward the first plate side, When the heat treatment plate moves from the treatment position to the intermediate position, the movable engagement protrusion engages with the restriction protrusion in the first direction. When the heat treatment plate reaches the intermediate position, the movable pressing member is pressed by the cam member, so that the movable pressing member moves toward the second plate side, and the movable engaging protrusion is pressed by the movable pressing member, so that the movable engaging protrusion moves closer to the second plate side than the limiting protrusion.

7. The substrate processing apparatus according to claim 5, further comprising: a stop mechanism for stopping the first plate moved to a predetermined stop position relative to the guide plate, The linkage separation mechanism includes an engaging member for engaging the second plate with the first plate. When the second plate moves in the first direction after the first plate is stopped at the stop position by the stop mechanism, the engagement of the first plate and the second plate by the engagement member is released.

8. The substrate processing apparatus according to claim 1 or 2, further comprising: A substrate lifting mechanism is used to lift the substrate above the heat treatment plate. The sliding member can integrally pull out the heat treatment plate and the substrate lifting mechanism.

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