Heat dissipation module

Abstract

The invention relates to a heat dissipation module which is used for being arranged between two circuit boards, and the two circuit boards are respectively provided with a high-power chip and a low-power chip. The plurality of shielding covers are respectively covered on the chips; the heat dissipation module comprises a heat pipe; one side surface of each heat-conducting sheet is attached to each high-power chip and each low-power chip, and the other side surface of each heat-conducting sheet is used for being attached to each shielding cover; the radiating fin group is arranged at one end of the heat pipe; the heat pipe is in direct contact with the shielding cover above each high-power chip, so that high heat can be directly and quickly conducted to the heat dissipation fin group for heat dissipation, the chip with lower power is far away from the heat pipe, and the heat dissipation efficiency can be improved by configuring the chips with different powers in a proper heat dissipation manner, so that the heat dissipation efficiency is improved. And the overall size and weight of the product are reduced.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, in particular to a chip heat dissipation module provided with a shielding cover. Background Art

[0002] Nowadays, due to the advancement of wireless transmission technology, wireless networks have entered the WIFI 7 era. In order to cope with the high-speed transmission rate, the chips used in the signal amplifiers for WIFI 7 also have relatively high computing speeds, so the heat generated by the chips is even greater. Please refer to Fig. 9 As shown, the heat dissipation device provided for the signal amplifier of WIFI 7 in the prior art mainly comprises a copper plate 90 and a heat dissipation fin block 91. The shape of the copper plate 90 corresponds to the shape of the circuit board of the signal amplifier. The heat dissipation fin block 91 is arranged on one side of the copper plate 90. The heat dissipation effect is achieved by covering the copper plate 90 on the circuit board and abutting against each chip.

[0003] However, the circuit board of the signal amplifier mainly includes a main board and a WIFI board. During assembly, the main board and the WIFI board are relatively combined and the heat sink is sandwiched therebetween. However, since the chip on the main board and the chip on the WIFI board are configured at different positions and thicknesses, the contact surface between the chip and the copper plate 90 is easily uneven during the combination process, resulting in a reduction in the contact area and a decrease in the thermal conductivity, thereby increasing the thermal resistance and affecting the heat dissipation performance. In addition, since the copper plate 90 used has a large area, it will also increase the overall weight of the signal amplifier. Therefore, the heat sink of the prior art has the above-mentioned problems and shortcomings in its overall structure, which really needs to be improved. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a heat dissipation module, which achieves the purpose of improving heat dissipation performance and reducing costs by combining heat pipes with high-power chips and low-power chips on a circuit board.

[0005] In order to achieve the above-mentioned invention object, the technical means adopted by the present invention is to design a heat dissipation module, which is used to be arranged between a first circuit board and a second circuit board arranged at intervals, the first circuit board and the second circuit board are electrically connected, the first circuit board is provided with a plurality of first main chips and a plurality of first chips, the second circuit board is provided with a plurality of second main chips and a plurality of second chips, and also has a plurality of shielding covers, wherein the shielding cover is provided on one side of the first circuit board and is respectively covered and attached to each of the first main chips and each of the first chips, the shielding cover is provided on one side of the second circuit board and is respectively covered and attached to each of the second main chips and each of the second chips, the side of the first circuit board provided with each of the first main chips and each of the first chips and the side of the second circuit board provided with each of the second main chips and each of the second chips are adjacent sides, the power of each of the first main chips is higher than the power of each of the first chips, and the power of each of the second main chips is higher than the power of each of the second chips, and the heat dissipation module comprises:

[0006] a heat pipe, located between the first circuit board and the second circuit board and abutting against each of the shielding covers;

[0007] A plurality of heat conducting sheets, each of which is disposed between each of the first main chips, each of the first sub-chips, each of the second main chips, each of the second sub-chips and each of the shielding covers;

[0008] A heat dissipation fin group is arranged at one end of the heat pipe.

[0009] Furthermore, in the heat dissipation module, the bending shape of the heat pipe corresponds to the arrangement position of each of the first main chips and each of the second main chips.

[0010] Furthermore, in the heat dissipation module, the heat dissipation fin group includes a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and forms a plurality of air guide ports.

[0011] Furthermore, in the heat dissipation module, the first circuit board and the second circuit board are disposed in a shell, a fan is disposed in the shell, and the air outlet of the fan is aligned with each of the air guide ports of the heat dissipation fin group.

[0012] Furthermore, in the heat dissipation module, each of the heat conductive sheets is a silicone heat conductive sheet.

[0013] The advantage of the present invention is that by contacting the shielding cover above each first main chip and each second main chip with higher power or lower temperature limit through the heat pipe, high heat can be directly and quickly conducted to the heat dissipation fin group for heat dissipation, and the first chip and the second chip with lower power or higher temperature limit can indirectly conduct low heat to the heat pipe and then transfer it to the heat dissipation fin group for heat dissipation. In addition to the advantage of reducing the overall volume and weight of the product, the heat dissipation performance can be improved by configuring the chips of different power with appropriate heat dissipation methods, and the chips set at different heights can all have a complete close-fitting state to reduce thermal resistance and improve heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional appearance diagram of the present invention.

[0015] Figure 2 It is an exploded view of the main components of the present invention.

[0016] Figure 3 This is an exploded view of the main components of the present invention from another angle.

[0017] Figure 4 It is a side view of the present invention.

[0018] Figure 5 It is another side view of the present invention.

[0019] Figure 6 This is a cross-sectional view of the present invention.

[0020] Figure 7 It is a schematic diagram of assembling the first circuit board and the second circuit board of the present invention.

[0021] Figure 8 It is a configuration schematic diagram of the present invention.

[0022] Fig. 9 It is a schematic diagram of the prior art. DETAILED DESCRIPTION

[0023] The following further describes the technical means adopted by the present invention to achieve the predetermined purpose of the invention in conjunction with the accompanying drawings and preferred embodiments of the present invention.

[0024] See also Figure 1 and Figure 7As shown, the heat dissipation module of the present invention is used to be arranged between a first circuit board 60 and a second circuit board 70 arranged at intervals. The first circuit board 60 and the second circuit board 70 are electrically connected. The first circuit board 60 is provided with a plurality of first main chips 61 and a plurality of first sub-chips 62. The second circuit board 70 is provided with a plurality of second main chips 71 and a plurality of second sub-chips 72. It also has a plurality of shielding covers 80, wherein the shielding cover 80 is provided on one side of the first circuit board 60 and is respectively covered on each of the first main chips 61 and each of the first sub-chips 62. The shielding cover 80 may also be provided on the other side of the first circuit board 60. A shielding cover 80 is provided on one side of the circuit board 70 and is respectively covered on each second main chip 71 and each second secondary chip 72. A shielding cover 80 may also be provided on the other side of the second circuit board 70. The side of the first circuit board 60 on which each first main chip 61 and each first secondary chip 62 are provided and the side of the second circuit board 70 on which each second main chip 71 and each second secondary chip 72 are adjacent sides. The power of each first main chip 61 is higher than the power of each first secondary chip 62, and the power of each second main chip 71 is higher than the power of each second secondary chip 72. The heat dissipation module includes a heat pipe 10, a plurality of heat conductive sheets 30 and a heat dissipation fin group 40.

[0025] See also Figure 2 , Figure 3 and Figure 7 As shown, the heat pipe 10 is a bent flat tube having a top surface 11 and a bottom surface 12. The top surface 11 and the bottom surface 12 are two side surfaces that are opposite to each other. The bent shape of the heat pipe 10 corresponds to the arrangement position of each first main chip 61 and each second main chip 71, but is not limited to this. The shape of the heat pipe 10 can be changed according to user needs.

[0026] Each thermal pad 30 is a silicone thermal pad 30 (Thermal Pad), which is respectively disposed between each first main chip 61, each first sub-chip 62, each second main chip 71, each second sub-chip 72 and each shielding cover 80, but is not limited thereto and may not be disposed.

[0027] The heat sink fin group 40 is a block structure composed of a plurality of heat sink fins 41. The heat sink fins 41 are arranged at intervals and form a plurality of air guide ports 42. The heat sink fin group 40 is disposed on the top surface 11 of one end of the heat pipe 10, but is not limited to this. The form of the heat sink fin group 40 can be changed according to user needs, and the heat sink fin group 40 may not be disposed.

[0028] When assembling the present invention, please refer to Figures 6 to 8As shown, the signal amplifier is applied to an example, but not limited thereto. The signal amplifier has a shell 81, and the shell 81 surrounds and forms an internal space. The first circuit board 60 and the second circuit board 70 are arranged in the shell 81 with an interval from top to bottom. The first circuit board 60 is a main board, and the second circuit board 70 is a WIFI board. The first main chips 61 and the first sub-chips 62 of the first circuit board 60, and the second main chips 71 and the second sub-chips 72 of the second circuit board 70 are shielded by a shielding cover 80 to block electromagnetic interference. The present invention is arranged between the first circuit board 60 and the second circuit board 70, and the heat pipe 10 and the heat conductive sheets 30 are stacked to form a layered structure. The heat conductive sheets 30 are attached to the shielding covers 80. A fan 50 is fixed in the shell 81 and the air outlet is aligned with the air guide ports 42 of the heat dissipation fin group 40, but not limited thereto. The setting position of the fan 50 can be changed according to user needs, such as being directly set on the first circuit board 60 or the second circuit board 70, or the fan 50 may not be set.

[0029] Thus, by utilizing the heat pipe 10 to contact the shielding cover 80 located above each first main chip 61 and each second main chip 71 with higher power or lower temperature limit, high heat can be directly and quickly conducted to the heat sink fin group 40 for heat dissipation, and by utilizing the shielding cover 80 outside the setting position of the heat pipe 10 to contact the first chip 62 and the second chip 72 with lower power or higher temperature limit, low heat can be guided to the heat pipe 10 over a longer conduction distance and then transferred to the heat sink fin group 40 for heat dissipation. Compared with the prior art, in addition to having the advantages of reducing the overall volume and weight of the product, the heat dissipation performance can be improved by configuring the chips of different power with appropriate heat dissipation methods, and the chips set at different heights can all have a complete close-fitting state to reduce thermal resistance and improve heat conduction efficiency.

[0030] The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician in the relevant technical field can make some changes or modifications to the technical contents disclosed above as equivalent embodiments of equivalent changes without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A heat dissipation module, which is used to be arranged between a first circuit board and a second circuit board which are arranged at intervals, the first circuit board and the second circuit board are electrically connected, the first circuit board is provided with a plurality of first main chips and a plurality of first chips, the second circuit board is provided with a plurality of second main chips and a plurality of second chips, and also has a plurality of shielding covers, wherein the shielding covers are provided on one side of the first circuit board and are respectively covered and attached to each of the first main chips and each of the first chips, the shielding covers are provided on one side of the second circuit board and are respectively covered and attached to each of the second main chips and each of the second chips, the side of the first circuit board on which each of the first main chips and each of the first chips is provided is adjacent to the side of the second circuit board on which each of the second main chips and each of the second chips is provided, the power of each of the first main chips is higher than the power of each of the first chips, and the power of each of the second main chips is higher than the power of each of the second chips, and the heat dissipation module comprises: a heat pipe, located between the first circuit board and the second circuit board and abutting against each of the shielding covers; A plurality of heat conducting sheets, each of which is disposed between each of the first main chips, each of the first sub-chips, each of the second main chips, each of the second sub-chips and each of the shielding covers; A heat dissipation fin group is arranged at one end of the heat pipe. 2 . The heat dissipation module as claimed in claim 1 , wherein a bent shape of the heat pipe corresponds to an arrangement position of each of the first main chips and each of the second main chips.

3. The heat dissipation module as claimed in claim 1 or 2, wherein the heat dissipation fin group comprises a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and forms a plurality of air guide ports.

4. The heat dissipation module as claimed in claim 3, wherein the first circuit board and the second circuit board are disposed in a shell, a fan is disposed in the shell, and an air outlet of the fan is aligned with each of the air guide ports of the heat dissipation fin group. 5 . The heat dissipation module as claimed in claim 4 , wherein each of the heat conductive sheets is a silicone heat conductive sheet.

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