Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a heat source, a heat dissipation device and a vibration assembly. The heat dissipation device is arranged towards the heat source and comprises a shell, the shell is provided with a first air inlet and an air outlet, and the air outlet faces the heat source; the vibration assembly is arranged in the shell; the vibration assembly can generate vibration so as to drive gas to enter the shell from the first gas inlet, then flow out of the shell from the gas outlet and flow towards the heat source. The vibration assembly drives the gas in the shell to flow, the gas outside the electronic equipment enters the shell from the gas inlet, the gas flows through the shell and then flows out from the gas outlet, and the gas outlet faces the heat source, so that the heat source is directly cooled by the low-temperature gas flow, the heat conduction path between the heat source and the gas outlet is shortened, and the heat conduction efficiency is improved. And the heat dissipation efficiency of the electronic equipment is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] In the related technology, electronic equipment uses centrifugal fans for heat dissipation. The centrifugal fans are overlapped on the metal shielding cover of the back device of the system-on-chip (SOC). The heat emitted by the device needs to pass through the air layer, the metal shielding cover, and the thermal conductive gel before being transferred to the casing of the centrifugal fan. The casing of the centrifugal fan is in contact with the cold air inside the centrifugal fan, thereby realizing the heat dissipation of the system-on-chip. However, due to the long heat conduction path between the system-on-chip and the fan module, the heat conduction efficiency is not high, which in turn affects the heat dissipation effect of the electronic equipment. Summary of the invention

[0003] The present application aims to provide an electronic device, which at least solves the problem of low heat dissipation efficiency of the electronic device.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In the first aspect, the present application proposes an electronic device, comprising: a heat source, a heat dissipation device and a vibration component. The heat dissipation device is arranged toward the heat source, and the heat dissipation device comprises a housing, the housing has a first air inlet and an air outlet, and the air outlet faces the heat source; the vibration component is arranged in the housing; wherein the vibration component can generate vibration to drive the gas to enter the interior of the housing through the first air inlet, and then flow out of the housing through the air outlet and toward the heat source.

[0006] The present application proposes an electronic device, including a heat source, a heat dissipation device and a vibration component. The heat source is an electronic component of the electronic device, and the heat source generates heat when the electronic device is used. The heat dissipation device is arranged toward the heat source so that the heat source can dissipate heat quickly. The heat dissipation device includes a shell, and the shell is provided with a first air inlet and an air outlet, and the air outlet is arranged toward the heat source. A vibration component is arranged in the shell, and the vibration component can generate vibration. When the vibration component vibrates, the driving gas enters the shell from the first air inlet and then flows out of the shell from the air outlet, and the gas flows toward the heat source when it flows out of the air outlet. The heat dissipation device is arranged toward the heat source, and the gas flow inside the shell is driven by the vibration component, the gas outside the electronic device enters the shell from the air inlet, the gas flows through the shell and then flows out from the air outlet, and the air outlet is arranged toward the heat source, so that the gas with a lower temperature flows toward the heat source, so that the gas is more fully in contact with the heat source to be dissipated, and the gas after heat exchange carries more heat to be discharged from the electronic device, thereby improving the heat dissipation effect of the electronic device. At the same time, the gas with lower temperature flows toward the heat source, shortening the transfer path between the heat source and the outlet, further improving the heat dissipation effect of the electronic equipment.

[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 is one of the structural schematic diagrams of the heat dissipation device according to an embodiment of the present application;

[0010] Figure 2 is a partial structural diagram of an electronic device according to an embodiment of the present application;

[0011] Figure 3 is a schematic diagram of wind flow when dissipating heat from an electronic device according to an embodiment of the present application;

[0012] Figure 4 is a second structural schematic diagram of the heat dissipation device according to an embodiment of the present application;

[0013] Figure 5 This is a third structural schematic diagram of the heat dissipation device according to an embodiment of the present application;

[0014] Figure 6 is one of the waveform diagrams of the voltage applied to the vibration component according to an embodiment of the present application;

[0015] Figure 7 is a second waveform diagram of a voltage applied to a vibration component according to an embodiment of the present application;

[0016] Figure 8 This is one of the schematic diagrams of wind direction flow when heat is dissipated from a heat conducting plate according to an embodiment of the present application;

[0017] Fig. 9 This is a second schematic diagram of wind flow when heat is dissipated from a heat conducting plate according to an embodiment of the present application;

[0018] Fig.10 This is the fourth structural schematic diagram of the heat dissipation device according to the embodiment of the present application.

[0019] Reference numerals:

[0020] 200 heat source, 201 heat dissipation device, 202 circuit board, 204 processor, 300 shell, 302 first air duct, 304 first air inlet, 306 air outlet, 308 first cavity, 310 second cavity, 400 vibration component, 402 elastic conductive sheet, 404 piezoelectric component, 406 second air inlet, 408 gap, 500 first one-way valve, 502 first spring clip, 600 second one-way valve, 602 second spring clip, 700 heat conductive plate, the surface of the heat conductive plate 702 away from the heat source, 800 second air duct. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0022] Combine the following Figures 1 to 10 An electronic device according to an embodiment of the present application is described.

[0023] like Figure 1 , Figure 2 and Figure 3 As shown, the present application proposes an electronic device, including a heat source 200, a heat dissipation device 201 and a vibration component 400. The heat dissipation device 201 is arranged toward the heat source 200, and the heat dissipation device 201 includes a housing 300, and the housing 300 has a first air inlet 304 and an air outlet 306, and the air outlet 306 faces the heat source 200; the vibration component 400 is arranged in the housing 300; the vibration component 400 can generate vibration to drive the gas to enter the interior of the housing 300 from the first air inlet 304, and then flow out of the housing 300 from the air outlet 306 and flow toward the heat source 200.

[0024] The present application proposes an electronic device, including a heat source 200, a heat dissipation device 201 and a vibration component 400. The heat source 200 is an electronic component of the electronic device, and the heat source 200 generates heat when the electronic device is in use. The heat dissipation device 201 is arranged toward the heat source 200, so that the heat source 200 can dissipate heat quickly. The heat dissipation device 201 includes a shell 300, and a first air inlet 304 and an air outlet 306 are arranged in the shell 300, and the air outlet 306 is arranged toward the heat source 200. A vibration component 400 is arranged in the shell 300, and the vibration component 400 can generate vibration. When the vibration component 400 vibrates, the driving gas enters the shell 300 from the first air inlet 304, and then flows out of the shell 300 from the air outlet 306, and the gas flows toward the heat source 200 when it flows out of the air outlet 306. The heat dissipation device 201 is arranged toward the heat source 200, and the gas flow in the housing 300 is driven by the vibration component 400. The gas outside the electronic device enters the housing 300 through the air inlet, and the gas flows through the housing 300 and then flows out through the air outlet 306. The air outlet 306 faces the heat source 200, so that the gas with a lower temperature flows toward the heat source 200, so that the gas and the heat source 200 to be dissipated are more fully contacted. The gas after heat exchange carries more heat out of the electronic device, thereby improving the heat dissipation effect of the electronic device. At the same time, the gas with a lower temperature flows toward the heat source 200, shortening the transfer path between the heat source 200 and the air outlet 306, further improving the heat dissipation effect of the electronic device.

[0025] The vibration component 400 is provided in the electronic device to replace the centrifugal fan, thereby reducing the space occupied by the centrifugal fan and realizing a light and thin design of the electronic device.

[0026] For example, when the vibration component 400 is used, the heat dissipation structure of the electronic device is 2 mm thick, while when the centrifugal fan is used, the centrifugal fan is 3.5 mm thick. The design of the present application reduces the space required for the centrifugal fan and realizes a light and thin design of the electronic device.

[0027] The vibration component 400 is provided in the electronic device to replace the centrifugal fan, thereby reducing the noise generated when the centrifugal fan runs at high speed, making the operation noise of the electronic device smaller, thereby improving the user experience of the electronic device.

[0028] The vibration assembly 400 is provided in the electronic device to replace the centrifugal fan, so that the vibration assembly 400 reduces the area of ​​the opening of the electronic device appearance, which is conducive to maintaining the integrity and simplicity of the electronic device appearance design. At the same time, since the opening area of ​​the appearance is reduced, dust and water protection measures are easier to implement, thereby improving the waterproof and dustproof stability of the entire electronic device.

[0029] Specifically, when the vibration assembly 400 vibrates, external air flows from the outside into the housing 300 (eg, Figure 3 The gas enters the housing 300 and flows from the gas outlet 306 toward the heat source 200 (as shown by arrow A). Figure 1 , Figure 3 , Figure 4 and Figure 5 The gas is discharged to the outside of the electronic device after heat exchange with the heat source 200 (as shown by the arrow C in the middle). Figure 1 , Figure 3 , Figure 4 and Figure 5 direction indicated by arrow D).

[0030] In addition, the electronic device in the above embodiments provided by the present application may also have the following additional technical features:

[0031] In some embodiments of the present application, Figure 4 and Figure 5 As shown, optionally, the electronic device also includes a first one-way valve 500, the first one-way valve 500 includes a first spring 502, the first spring 502 covers the first air inlet 304, and is located on the side of the first air inlet 304 close to the interior of the shell 300, one side of the first spring 502 is connected to the shell 300, and the other side of the first spring 502 is a free side, so that the first air inlet 304 is unidirectionally conductive from the outside of the shell 300 to the inside of the shell 300.

[0032] In this embodiment, the electronic device also includes a first one-way valve 500, which includes a first spring clip 502. The first spring clip 502 is used to cover the first air inlet 304, and the first spring clip 502 is arranged on the side of the first air inlet 304 close to the interior of the shell 300. The side of the first spring clip 502 close to the interior of the shell 300 is connected to the shell 300, and the other side of the first spring clip 502 is a free side. The first one-way valve 500 controls the gas to enter the interior of the shell 300 from the outside of the shell 300, and the gas cannot flow from the inside of the shell 300 to the outside of the shell 300, thereby preventing the gas from flowing in the opposite direction at the first air inlet 304.

[0033] Specifically, when the gas pressure in the housing 300 is lower than the external gas pressure, the external gas enters the housing 300 (eg Figure 4 The other side of the first elastic sheet 502 is in an open state, so that the external air enters the housing 300 through the first air inlet 304. When the gas pressure in the first air duct 302 is consistent with or greater than the external gas pressure, the external air no longer enters the housing 300, and the other side of the first elastic sheet 502 is in a closed state, so that the gas in the first air duct 302 is prevented from flowing in the reverse direction at the first air inlet 304.

[0034] In some embodiments of the present application, Figure 4 and Figure 5 As shown, optionally, the vibration assembly 400 includes an elastic conductive sheet 402 and a piezoelectric component 404. The elastic conductive sheet 402 is disposed in the housing 300, and the interior of the housing 300 is separated into a first cavity 308 and a second cavity 310. The first cavity 308 is closer to the heat source 200 than the second cavity 310. The first cavity 308 is connected to the second cavity 310, the first cavity 308 is connected to the air outlet 306, and the second cavity 310 is connected to the first air inlet 304; the piezoelectric component 404 is disposed on the elastic conductive sheet 402; wherein, when the elastic conductive sheet 402 is energized, the piezoelectric component 404 can drive the elastic conductive sheet 402 to vibrate.

[0035] In this embodiment, the vibration assembly 400 includes: an elastic conductive sheet 402 and a piezoelectric component 404. The elastic conductive sheet 402 is disposed in the housing 300, and the housing 300 is partitioned into a first cavity 308 and a second cavity 310 by the elastic conductive sheet 402, and the first cavity 308 is connected to the second cavity 310. The first cavity 308 is close to the heat source 200 and is connected to the air outlet 306, and the second cavity 310 is close to the first air inlet 304 and is connected to the air inlet. The piezoelectric component 404 is disposed on the elastic conductive sheet 402, and when the elastic conductive sheet 402 is energized, the piezoelectric component 404 can drive the elastic conductive sheet 402 to vibrate.

[0036] Specifically, the lower surface of the piezoelectric component 404 is connected to the elastic conductive sheet 402. When the elastic conductive sheet 402 is energized, the elastic conductive sheet 402 provides a driving voltage for the piezoelectric component 404; alternatively, the lower surface of the piezoelectric component 404 can also be connected to the circuit board 202 through a specific wiring design, so that the piezoelectric component 404 can obtain the driving voltage. The upper and lower surfaces of the energized piezoelectric component 404 generate alternating voltages, so that the piezoelectric component 404 generates alternating deformation, and the piezoelectric component 404 can drive the elastic conductive sheet 402 to vibrate. Furthermore, the upper surface of the piezoelectric component 404 can also be connected to the elastic conductive sheet 402.

[0037] Specifically, the vibration component 400 is a piezoelectric pump. The piezoelectric pump is a micro pump made by using the inverse piezoelectric effect of piezoelectric ceramics. It has no motor and rotating parts, and is driven by piezoelectric ceramic sheets, thereby replacing the traditional centrifugal fan design. By integrating the piezoelectric pump with the elastic conductive sheet 402, the space of the housing 300 is used as the pump chamber, so that the external cold air can directly contact the heating device here, thereby improving the heat dissipation efficiency of the electronic equipment. Specifically, as Figure 6 and Figure 7 As shown, the voltage applied to the vibration assembly 400 can be an alternating voltage in different forms.

[0038] In some embodiments of the present application, Figure 4 , Figure 5 and Fig.10 As shown, optionally, the elastic conductive sheet 402 is provided with a second air inlet 406, and the first cavity 308 is connected to the second cavity 310 through the second air inlet 406; or at least two opposite edges of the elastic conductive sheet 402 are connected to the shell 300, and there is a gap 408 between at least one edge of the elastic conductive sheet 402 and the shell 300, and the first cavity 308 is connected to the second cavity 310 through the gap 408.

[0039] In this embodiment, the elastic conductive sheet 402 is provided with a second air inlet 406, and the first cavity 308 is communicated with the second cavity 310 through the second air inlet 406, so that the gas flows between the first cavity 308 and the second cavity 310. Alternatively, at least two opposite edges of the elastic conductive sheet 402 are connected and fixed to the housing 300, and a gap 408 is provided between the remaining at least one edge and the housing 300, so that the first cavity 308 and the second cavity 310 are communicated through the gap 408, so that the gas in the first cavity can flow into the second cavity.

[0040] In some embodiments of the present application, Figure 4 and Figure 5 As shown, optionally, the electronic device also includes a second one-way valve 600, the second one-way valve 600 includes a second spring 602, the second spring 602 covers the side of the second air inlet 406 close to the air outlet 306, one side of the second spring 602 is connected to the elastic conductive sheet 402, and the other side of the second spring 602 is a free side, so that the second air inlet 406 is unidirectionally conductive from the second cavity 310 to the first cavity 308.

[0041] In this embodiment, the electronic device further includes a second one-way valve 600, and the second one-way valve 600 includes a second spring 602. The second spring 602 is installed at the second air inlet 406 in the housing 300, and the second spring 602 covers the second air inlet 406, so that the second spring 602 can completely seal the second air inlet 406 to prevent gas from flowing out of the second air inlet 406. One side of the second spring 602 is connected to the elastic conductive sheet 402, and the other side of the second spring 602 is a free side. Specifically, when the gas pressure in the first cavity 308 is less than the gas pressure in the second cavity 310, the gas in the second cavity 310 enters the first cavity 308 (such as Figure 5The other side of the second elastic sheet 602 is in an open state, so that the gas in the second cavity 310 enters the first cavity 308 through the second gas inlet 406. When the gas pressure in the first cavity 308 is the same as or greater than the gas pressure in the second cavity 310, the gas in the second cavity 310 no longer enters the first cavity 308, and the other side of the second elastic sheet 602 is in a closed state, so that the gas in the first cavity 308 does not flow in the reverse direction through the second gas inlet 406, and the gas in the first cavity 308 flows out through the gas outlet 306 (along the Figure 4 The housing 300 is provided with a cover (direction indicated by arrow B).

[0042] Specifically, after applying an alternating electric field to the vibration component 400, the vibration component 400 will periodically stretch and shrink. When the vibration component 400 stretches, it will drive the elastic conductive sheet 402 to bulge toward the side of the second cavity 310, the volume of the second cavity 310 is compressed, the gas pressure increases, the second one-way valve 600 opens, the first one-way valve 500 of the second cavity 310 closes, and the air flows into the first cavity 308 and is discharged from the air outlet of the first cavity 308. When the vibration component 400 shrinks, it will drive the elastic conductive sheet 402 to be concave toward the side of the first cavity 308, the volume of the upper air cavity is expanded, the gas pressure decreases, the first one-way valve 500 opens, the external air enters the second cavity 310, and at the same time the volume of the first cavity 308 is compressed, the gas pressure increases, the second one-way valve 600 closes, and the gas in the first cavity 308 is discharged from the air outlet. This cycle repeats itself, and under the action of the high-frequency alternating voltage, the vibration component 400 vibrates at a high speed, generating a continuous and stable airflow in the electronic device.

[0043] In some embodiments of the present application, optionally, Figure 1 and Figure 3 As shown, the electronic device further includes a heat conducting plate 700 , which contacts the heat source 200 and is located between the heat source 200 and the housing 300 ; and a plurality of air outlets 306 face toward the heat conducting plate 700 .

[0044] In this embodiment, the electronic device further includes a heat conducting plate 700, the function of which is to quickly conduct the heat generated by the heat source 200 to the heat conducting plate 700, and then dissipate the heat through the heat conducting plate 700. Specifically, the heat conducting plate 700 can be a heat conducting gel or other heat conducting materials. One side of the heat conducting plate 700 is against the heat source 200, and the heat conducting plate 700 is located between the heat source 200 and the housing 300. The multiple air outlets 306 of the housing 300 face the heat conducting plate 700, so that the gas in the housing 300 directly cools the heat conducting plate 700, thereby accelerating the heat dissipation speed of the heat source 200.

[0045] In this embodiment, illustratively, the electronic device may not be provided with the heat conducting plate 700 , so that the gas in the first air duct 302 directly dissipates the heat from the heat source 200 through the air outlet 306 .

[0046] In some embodiments of the present application, optionally, the heat source 200 includes a circuit board 202 and a processor 204 , the processor 204 is disposed on the circuit board 202 , and a side of the processor 204 away from the circuit board 202 is in contact with the heat conducting plate 700 .

[0047] In this embodiment, the heat source 200 includes a circuit board 202 and a processor 204. One side of the processor 204 is set on the circuit board 202, and the other side of the processor 204 is in contact with the heat conductive plate 700, so that the heat of the processor 204 is quickly dissipated through the heat conductive plate 700, thereby improving the heat dissipation effect of the electronic device.

[0048] In some embodiments of the present application, Figure 4 and Figure 5 As shown, optionally, the housing 300 is provided with a first air duct 302, a second air duct 800 is provided between the heat conducting plate 700 and the housing 300, the first air duct 302 is connected to the second air duct 800 through a plurality of air outlets 306, and the second air duct 800 is connected to the outside of the electronic device.

[0049] In this embodiment, the housing 300 is provided with a first air duct 302, and a second air duct 800 is provided between the heat conducting plate 700 and the housing 300. The first air duct 302 is connected to the second air duct 800 through a plurality of air outlets 306, and the second air duct 800 is connected to the outside of the electronic device. Specifically, the external air enters the second cavity 310 of the first air duct 302 through the first air inlet 304, and the air then flows from the second cavity 310 of the first air duct 302 through the second air inlet 406 to the first cavity 308 of the first air duct 302, and then the air flows from the first cavity 308 of the first air duct 302 through the air outlet 306 to the second air duct 800, and then the air converts the heat of the heat conducting plate 700, so that the heat of the heat conducting plate 700 is quickly reduced, thereby reducing the temperature of the heat source 200 and improving the heat dissipation effect of the electronic device.

[0050] In some embodiments of the present application, Figure 8 and Fig. 9 As shown, optionally, the first air inlet 304 is located on a side of the housing 300 away from the heat conducting plate 700 , and the air outlet 306 is located on a side of the housing 300 close to the heat conducting plate 700 .

[0051] In this embodiment, the first air inlet 304 is arranged on the housing 300 away from the heat conducting plate 700, and the air outlet 306 is arranged on the housing 300 close to the heat conducting plate 700, so that the first air inlet 304 is far away from the heat conducting plate 700. This solution reduces the probability that the gas entering the cavity is affected by the heat of the heat conducting plate 700, so that the gas with a lower temperature enters the housing 300, thereby achieving a better heat dissipation effect on the heat source 200.

[0052] In some embodiments of the present application, Figure 1 , Figure 8 and Fig. 9 As shown, optionally, the air outlet direction of the air outlet 306 is perpendicular to the surface 702 of the heat conducting plate 700 on the side away from the heat source 200 .

[0053] In this embodiment, the outlet direction of the air outlet 306 (eg Fig. 9 The direction indicated by arrow C is perpendicular to the surface 702 of the heat conducting plate 700 away from the heat source 200. When the heat conducting plate 700 has a heat source, the gas discharged from the gas outlet 306 impacts the heat conducting plate 700, increasing the contact amount between the airflow and the heat conducting plate 700, further improving the heat dissipation efficiency of the electronic device.

[0054] For example, the design of the vibration assembly 400 is adopted, the processor 204 heat source is installed on the back of the mainboard, and the air outlet 306 is directly installed on the surface of the processor 204 heat source. This scheme adopts the outlet direction of the air outlet 306 to be perpendicular to the heat conducting plate 700 for heat exchange, and the gas flow rate can reach more than 20 meters per second, and the gas heat exchange coefficient can reach more than 150 watts per square meter Kelvin. The airflow enters the housing 300 from the opening of the back cover of the mobile phone, and after the gas heat exchange, it turns 90 degrees and is discharged from the opening on the side of the electronic device.

[0055] In some embodiments of the present application, illustratively, Fig. 9 As shown, multiple air ducts connected in parallel can make the gas flow form a state in which the gas outlet direction is perpendicular to the heat conducting plate 700, and the heat conducting plate 700 is impacted to dissipate heat, thereby increasing the ventilation volume in the electronic device and meeting the heat dissipation demand of large air volume. When the electronic device is working, air enters from the first air inlet 304, and after the gas flow of the first air duct 302 is driven by the vibration component 400, the gas flows out of the air outlet 306 (as shown in FIG. Figure 8 and Fig. 9 The heat conducting plate 700 is cooled in the form of an outlet direction perpendicular to the heat conducting plate 700, and after the heat exchange is completed on the heat conducting plate 700, the heat is discharged from the outlet of the shell 300 (as shown by the arrow C). Figure 8 and Fig. 9In the application, the heat conducting plate 700 is mounted on the heat source 200 to dissipate heat from the heat source 200 with the shortest heat transfer path and the most efficient convection heat transfer coefficient, thus solving the heat dissipation problem of electronic equipment under high power consumption density.

[0056] In some embodiments of the present application, illustratively, by adopting the design of the vibration component 400, the heat dissipation structure of the electronic device reaches 2 mm, the noise level is lower than 28 decibels, the air volume can adjust the size of the two air ducts according to the needs, the structure is simple and the reliability is high, which has great advantages over the traditional centrifugal fan and is an efficient heat exchange solution close to the heat source. The solution can be integrated on the processor 204 of the electronic device for heat dissipation. It can also be adsorbed on the back cover of the electronic device as an external accessory to dissipate the heat of the projection area of ​​the processor 204 of the electronic device, which has little impact on the design architecture of the mobile phone and has high usability.

[0057] The electronic device defined in this application can be applied not only to mobile phone products, but also to other electronic products, such as tablet computers, e-books, smart watches, music players, car screens, projectors, televisions, advertising screens, etc.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0059] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Heat source; A heat dissipation device, the heat dissipation device is arranged toward the heat source, the heat dissipation device comprises a shell, the shell has a first air inlet and an air outlet, the air outlet faces the heat source; a vibration component, wherein the vibration component is disposed in the housing; The vibration component is capable of generating vibrations to drive the gas to enter the interior of the shell through the first air inlet, then flow out of the shell through the air outlet and toward the heat source.

2. The electronic device according to claim 1, characterized in that: Also includes: A first one-way valve, the first one-way valve includes a first spring sheet, the first spring sheet covers the first air inlet, and is located on a side of the first air inlet close to the interior of the shell, one side of the first spring sheet is connected to the shell, and the other side of the first spring sheet is a free side, so that the first air inlet is unidirectionally conductive from the outside of the shell to the inside of the shell.

3. The electronic device according to claim 1, characterized in that: The vibration assembly comprises: an elastic conductive sheet, the elastic conductive sheet being arranged in the housing, dividing the interior of the housing into a first cavity and a second cavity, the first cavity being closer to the heat source than the second cavity, the first cavity being communicated with the second cavity, the first cavity being communicated with the air outlet, and the second cavity being communicated with the first air inlet; A piezoelectric component, wherein the piezoelectric component is disposed on the elastic conductive sheet; When the elastic conductive sheet is energized, the piezoelectric component can drive the elastic conductive sheet to vibrate.

4. The electronic device according to claim 3, characterized in that: The elastic conductive sheet is provided with a second air inlet, and the first cavity is connected with the second cavity through the second air inlet; or At least two opposite edges of the elastic conductive sheet are connected to the shell, a gap is provided between at least one edge of the elastic conductive sheet and the shell, and the first cavity is connected to the second cavity through the gap.

5. The electronic device according to claim 4, characterized in that: Also includes: A second one-way valve, the second one-way valve includes a second spring sheet, the second spring sheet covers a side of the second air inlet close to the air outlet, one side of the second spring sheet is connected to the elastic conductive sheet, and the other side of the second spring sheet is a free side, so that the second air inlet is unidirectionally conductive from the second cavity to the first cavity.

6. The electronic device according to any one of claims 1 to 5, characterized in that: Also includes: a heat conducting plate, the heat conducting plate being in contact with the heat source and being located between the heat source and the shell; The plurality of air outlets face the heat conducting plate.

7. The electronic device according to claim 6, characterized in that: The heat source comprises: Circuit boards; A processor is disposed on the circuit board, and a side of the processor away from the circuit board is in contact with the heat conducting plate.

8. The electronic device according to claim 6, characterized in that: The shell is provided with a first air duct, and a second air duct is provided between the heat conducting plate and the shell. The first air duct is communicated with the second air duct through a plurality of the air outlets, and the second air duct is communicated with the outside of the electronic device.

9. The electronic device according to claim 6, characterized in that: The first air inlet is located at a side of the shell away from the heat conducting plate, and the air outlet is located at a side of the shell close to the heat conducting plate.

10. The electronic device according to claim 6, characterized in that: The air outlet direction of the air outlet is perpendicular to the surface of the heat conducting plate on a side away from the heat source.

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