Refrigeration chip glue filling packaging device and method

Abstract

The invention relates to the technical field of chip glue filling and packaging, in particular to a refrigeration chip glue filling and packaging device and method.The refrigeration chip glue filling and packaging device comprises a fixing mechanism and a glue injection and packaging mechanism, the fixing mechanism comprises a fixing base provided with a plurality of fixing heads, the glue injection and packaging mechanism comprises moving bases, the moving bases are distributed in a rectangular shape and correspond to the four edges of a chip body respectively, and the fixing heads are arranged on the moving bases; a glue injection cylinder and a plurality of accelerated curing heads are arranged on the moving seat, and a plurality of glue injection heads are arranged on the glue injection cylinder. According to the invention, the fixing mechanism is matched with the glue injection packaging machine to accurately fix a plurality of chip bodies at the same time, glue injection packaging is synchronously carried out after fixation, and glue injection packaging is synchronously carried out on four side edges of each chip body, so that the glue injection packaging efficiency is effectively improved, the chip bodies do not need to move in the whole packaging process, and the production cost is reduced. And the glue injection packaging mechanism only moves linearly, so that the filling and packaging machining precision can be conveniently controlled, the stability of the glue injection packaging process is correspondingly improved, and continuous and stable glue injection packaging work is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of chip glue potting and packaging, and in particular to a refrigeration chip glue potting and packaging device and method. Background Art

[0002] Refrigeration chip, also known as thermoelectric cooler or Peltier device, is a solid-state electronic refrigeration device based on the Peltier effect. It is driven by direct current and can transfer heat energy without mechanical movement, thereby achieving the effect of cooling or heating. It has the advantages of small size, light weight, no noise, no vibration, and no pollution. It is widely used in electronic equipment heat dissipation, medical equipment, food and beverage preservation, semiconductor manufacturing and other fields. During the manufacturing process of the refrigeration chip, the edges need to be filled with glue and sealed. The purpose of filling and sealing is to improve the mechanical stability, sealing performance, insulation performance and thermal management performance of the refrigeration chip.

[0003] At present, the glue filling and packaging of the refrigeration chip is usually performed by a glue dispensing machine that rotates the refrigeration chip 90 degrees and intermittently performs glue filling and packaging; the refrigeration chip is a rectangular structure and a concave gap is set on the peripheral side, and then the whole is in an I-shape. During the packaging process, the refrigeration chip is fixed on the rotating head in a vertical state, and the glue injection port is located above the refrigeration chip and faces the concave gap on the top side of the refrigeration chip. The glue injection port is moved horizontally to inject the glue into the gap of the refrigeration chip, and the rotating head is rotated 90 degrees, so that the gap on the corresponding side of the refrigeration chip is facing the glue injection port in turn and the glue injection work is completed. During the entire glue injection process, the refrigeration chip needs to be rotated intermittently and the glue injection port is moved back and forth, which places high requirements on the matching accuracy of the equipment and is easy to reduce the quality of glue filling and packaging; secondly, because the curing of the glue liquid takes a certain amount of time, if the refrigeration chip is rotated immediately after the glue filling on one side is completed, it is easy for the glue liquid to not be completely cured and flow under the action of centrifugal force and gravity, reducing the problem of uniformity of glue distribution, thereby affecting the quality of glue filling and packaging, but if the glue liquid is waited for to solidify before rotating, the efficiency of glue filling and packaging will be reduced. Summary of the invention

[0004] The present invention provides a device and method for gluing and packaging a refrigeration chip, so as to solve the problems in the related art that the gluing and packaging processing efficiency of the refrigeration chip is low and the processing precision control is difficult, which easily affects the packaging quality.

[0005] The present invention provides a refrigeration chip glue filling and packaging device, which comprises a fixing mechanism for fixing a plurality of chip bodies at the same time, wherein the fixing mechanism comprises a fixing seat provided with a plurality of fixing heads, which are distributed from top to bottom and correspond to the chip bodies one by one; a glue injection and packaging mechanism, wherein the glue injection and packaging mechanism comprises a moving seat, which is distributed in a rectangular shape and corresponds to the four sides of the chip body respectively, and the moving seat reciprocates along the side edges corresponding to the chip body, wherein a glue injection cylinder and a plurality of accelerating curing heads are provided on the moving seat, wherein a plurality of glue injection heads are provided on the glue injection cylinder, and the plurality of glue injection heads are distributed from top to bottom and correspond to the chip bodies one by one; wherein any three moving seats A reference limit head is arranged on the top, and there are several reference limit heads on the moving seat, and two of them form a reference limit unit. The reference limit unit on the moving seat corresponds to the chip body one by one, and the reference limit heads in the reference limit unit are symmetrically distributed and are respectively located on both sides of the corresponding injection head; several accelerated curing heads on the moving seat are evenly arranged from top to bottom, and two accelerated curing heads form a curing unit as a group, and the curing unit corresponds to the chip body one by one, the accelerated curing heads in the fixed unit are symmetrically distributed and are respectively located on both sides of the injection head, and the accelerated curing heads in the fixed unit are not in working state at the same time; the moving seat can complete a glue injection packaging process with a single movement.

[0006] In a possible implementation, the reference limit head includes a connecting member and a reference member, the reference member is in direct contact with the corresponding chip body and limits the chip body, and the reference member is a cylindrical structure and is rotatably connected to the connecting member, and the connecting member is connected to the movable seat.

[0007] In one possible implementation, the number of the fixed heads is at least three, a connecting arm is provided between the fixed head and the fixed seat, the fixed seat is fixedly mounted on the processing platform, the fixed seat is located on one side of the chip body, and an extension joint is provided between the glue injection head corresponding to the side and the corresponding glue injection cylinder, the fixed head is located below the chip body, and during the glue injection process, the corresponding glue injection cylinder does not need to pass through the connecting arm, and the extension joint passes over the corresponding connecting arm to enable the corresponding glue injection head to move along the side of the chip body until the glue injection is completed.

[0008] In a possible implementation, a baffle is provided between the accelerated curing head and the corresponding glue injection head.

[0009] In a possible implementation, the fixing head fixes the chip body by adsorption.

[0010] In one possible implementation, the glue injection packaging mechanism also includes a synchronous drive component, which includes a driving screw and a bevel gear group. The driving screw is rotatably connected to the processing platform. The driving screw corresponds to the moving seat one by one and the driving screw is threadedly connected to the corresponding moving seat. Two adjacent driving screws in the circumferential direction of the chip body are connected together through the bevel gear group and rotate synchronously.

[0011] In a possible implementation, during the glue injection process, the glue outlet nozzle of the glue injection head is located at an upper position inside the gap of the corresponding side edge of the chip body.

[0012] The present invention also provides a refrigeration chip encapsulation method, comprising the following steps: S1: placing the material; placing the chip body on a fixing head, and making the corresponding three sides of the chip body under the limit of the corresponding reference limit head, and fixing the chip body by a fixing mechanism.

[0013] S2: Glue injection packaging; synchronously move the moving seat to move the glue injection head along the corresponding side of the chip body fixed in S1 and inject glue into the gap of the corresponding side of the chip body.

[0014] S3: taking the material; after the glue in the gap on the chip body in S3 is solidified, the chip body is first moved upward so that the chip body is staggered with the glue injection head in the horizontal direction, and then the chip body is moved forward to be taken down.

[0015] S4: the above three steps are repeated cyclically to continuously perform the glue injection and packaging work of the chip body 1 .

[0016] The above one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects: 1. The present invention utilizes a fixing mechanism to cooperate with a glue injection packaging machine to accurately fix multiple chip bodies at the same time and synchronously perform glue injection packaging after fixation, and the four sides of each chip body are simultaneously injected with glue and packaged, which effectively improves the efficiency of glue injection packaging. During the entire packaging process, the chip body does not need to move, and the glue injection packaging mechanism only performs linear motion, which is convenient for controlling the filling and packaging processing accuracy, and correspondingly improves the stability of the glue injection packaging process, which is conducive to continuous and stable glue filling and packaging work.

[0017] 2. The reference limit head in the present invention performs reference limit on the chip body during the process of placing and fixing the chip body, thereby improving the accuracy of the chip body processing position. In the process of glue injection, the reference limit head moves along with the movement of the moving seat, continuously providing a stable working reference for the glue injection head, thereby improving the stability and reliability of the glue injection work.

[0018] 3. The present invention utilizes symmetrically arranged reference parts to form two limit references on both sides of the glue injection head, so that the movable seat can stably complete a glue injection process in a single stroke. During the continuous processing, there is no need to perform resetting work, which further improves the efficiency of continuous processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a partial structural schematic diagram of a rotating head and a glue injection port of an existing glue dispensing machine.

[0020] Figure 2The present invention is a schematic structural diagram of a refrigeration chip glue potting and packaging device provided by an embodiment of the present invention when a chip body is placed therein.

[0021] Figure 3 The present invention is a schematic structural diagram of a refrigeration chip glue potting and packaging device provided by an embodiment of the present invention when no chip body is placed.

[0022] Figure 4 yes Figure 3 Top view of the .

[0023] Figure 5 It is a structural schematic diagram of a synchronous drive component of a refrigeration chip glue potting and packaging device provided by an embodiment of the present invention.

[0024] Figure 6 The present invention is a schematic structural diagram of a glue injection head and a chip body of a refrigeration chip glue injection and packaging device provided by an embodiment of the present invention.

[0025] Figure 7 The present invention is a schematic diagram of the position change of an extension joint of a refrigeration chip glue potting and packaging device provided by an embodiment of the present invention when it moves relative to a fixing mechanism.

[0026] In the figure: 1. chip body; 2. fixing mechanism; 21. fixing head; 22. fixing seat; 23. connecting arm; 3. glue injection packaging mechanism; 31. moving seat; 32. glue injection cylinder; 33. accelerating curing head; 34. glue injection head; 35. reference limit head; 351. connecting part; 352. reference part; 36. extension joint; 37. synchronous drive assembly; 371. driving screw; 372. bevel gear set; 38. baffle; 4. rotating head; 5. glue injection port; 6. processing platform. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0028] See also Figure 1 , Figure 2 and Figure 3 A refrigeration chip glue filling and packaging device comprises a fixing mechanism 2, a glue filling and packaging mechanism 3 and a processing platform 6, wherein the fixing mechanism 2 is used to fix a plurality of chip bodies 1 and distribute the chip bodies 1 from top to bottom, such as Figure 2As shown, the fixing mechanism 2 fixes four chip bodies 1 at the same time, and the four chip bodies 1 are evenly distributed from top to bottom; after fixing, the glue injection and packaging mechanism 3 synchronously performs glue injection and packaging on the four chip bodies 1, and the four sides of each chip body 1 are simultaneously injected and packaged, which effectively improves the efficiency of the overall glue injection and packaging. Secondly, during the entire packaging process, the chip body 1 does not need to move, and the glue injection and packaging mechanism 3 only performs linear motion. Compared with the existing glue injection and packaging method, on the basis of improving the packaging efficiency, the control difficulty of the glue injection and packaging processing accuracy is effectively reduced, which is conducive to fully improving the quality of the glue injection and packaging.

[0029] See also Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The glue injection packaging mechanism 3 includes a moving seat 31 slidably connected to the processing platform 6. The moving seats 31 are distributed in a rectangular shape and correspond to the four sides of the chip body 1 respectively. The moving seats 31 reciprocate along the corresponding sides of the chip body 1. A glue injection cylinder 32 is provided on the moving seat 31. A plurality of glue injection heads 34 are provided on the glue injection cylinder 32. The glue injection heads 34 are evenly distributed from top to bottom and correspond to the chip body 1 one by one. Among them, the three moving seats 31 on the right front side, the left rear side and the right rear side are provided with reference limit heads 35. The chip body 1 is placed in the fixing mechanism 2 from the front side, which is convenient for taking and placing the chip body 1. The moving seat There are several reference limit heads 35 on 31, and two of them form a reference limit unit. The reference limit units on the movable seat 31 correspond to the chip body 1 one by one, and the reference limit heads 35 in the reference limit unit are symmetrically distributed and respectively located on both sides of the corresponding glue injection head 34. In the process of placing and fixing the chip body 1, the two reference limit heads 35 in the reference limit unit limit the chip body 1 at different times. The reference limit head 35 located on one side of the moving feed direction of the glue injection head 34 limits the chip body 1 during the process of placing and fixing the chip body 1, so as to facilitate the accurate fixing of the chip body 1 in the glue injection processing position. Figure 4 As shown, taking the right movable seat 31 as an example, when the movable seat 31 moves backward to allow the glue injection head 34 to perform glue injection, the reference limit head 35 on the rear side of the glue injection head 34 limits the chip body 1 during the process of placing and fixing it, and when the right movable seat 31 moves forward to allow the glue injection head 34 to perform glue injection, the reference limit head 35 on the front side of the glue injection head 34 limits the chip body 1 during the process of placing and fixing it; wherein, as Figure 6 As shown, the glue outlet nozzle of the glue injection head 34 is located at an upper position inside the gap of the corresponding side of the chip body 1. Because the glue has a certain fluidity, the glue outlet nozzle is set at an upper position, which is beneficial to a certain extent to make the glue fully and evenly fill the gap, thereby improving the quality of glue filling and packaging. In the actual glue filling and packaging process, the angle of the glue injection head 34 can be set as needed.

[0030] See also Figure 2 , Figure 3 and Figure 4 , a plurality of accelerated curing heads 33 are arranged on the movable seat 31, and the plurality of accelerated curing heads 33 are evenly arranged from top to bottom and two accelerated curing heads 33 form a curing unit. The curing units on the movable seat 31 correspond to the chip body 1 one by one. The accelerated curing heads 33 in the fixed unit are symmetrically distributed and are respectively located on both sides of the injection head 34. The accelerated curing heads 33 in the curing unit are not in working state at the same time, and the reference limit head 35 moves. Figure 4 As shown, taking the right movable seat 31 as an example, when the right movable seat 31 moves backward, the processing acceleration curing head 33 on the front side of the glue injection head 34 works to quickly solidify the glue injected into the gap of the chip body 1, and when the right movable seat 31 moves forward, the processing acceleration curing head 33 on the rear side of the glue injection head 34 works to quickly solidify the glue injected into the gap of the chip body 1; on the one hand, the efficiency of the glue filling and packaging of the chip body 1 is improved, and on the other hand, it can effectively prevent the glue in the chip body 1 from adhering to the reference limit head 35 and affecting the limiting accuracy of the reference limit head 35, and the movable seat 31 can complete a glue filling and packaging process with a single movement. In the process of continuous glue filling and packaging, there is no need to reset the movable seat 31 before performing glue filling and packaging, which further improves the efficiency of the continuous glue filling and packaging process of the present invention; wherein, the acceleration curing head 33 is an existing structure, which is an execution structure corresponding to the glue accelerated curing method.

[0031] See also Figure 2 , Figure 3 , Figure 4 and Figure 7 The fixing mechanism 2 includes a fixing seat 22 provided with a plurality of fixing heads 21, the fixing heads 21 are distributed from top to bottom and correspond to the chip body 1 one by one, and are combined with Figure 2 and Figure 3As shown, the chip body 1 is placed on the corresponding fixed head 21, and the fixed head 21 is an existing electrically controlled adsorption structure, which fixes the chip body 1 in an adsorption and fixing manner. The fixed seat 22 is fixedly installed on the processing platform 6, and a connecting arm 23 is arranged between the fixed head 21 and the fixed seat 22; the fixed head 21 is fixedly connected to the connecting arm 23, and the connecting arm 23 is fixedly connected to the fixed seat 22. The fixed seat 22 is located on the rear side of the chip body 1, and an extension joint 36 is arranged between the glue injection cylinder 32 on the movable seat 31 on the right rear side and the corresponding glue injection head 34, and the extension joint 36 is connected to the corresponding glue injection head 34 and the glue injection cylinder 32. During the glue injection process, the glue injection cylinder 32 does not need to pass through the connecting arm 23. The extension joint 36 passes over the corresponding connecting arm 23 to move the corresponding glue injection head 34 along the side of the chip body 1 to complete the glue injection work. That is, the extension joint 36 is used to compensate for the moving path length of the glue injection head 34 to avoid the situation where the moving seat 31 is blocked by the connecting arm 23 and cannot continue to move, and the glue injection head 34 does not completely pass through the side of the chip body 1.

[0032] See also Figure 2 , Figure 3 , Figure 4 and Figure 7 The reference limit head 35 includes a connecting piece 351 and a reference piece 352. The reference piece 352 is in direct contact with the corresponding chip body 1 and limits the chip body 1. The reference piece 352 is a cylindrical structure and is rotatably connected to the connecting piece 351. The left rear side and the right front side moving seat 31 are respectively fixedly connected to the corresponding connecting piece 351. The connecting piece 351 on the right rear side moving seat 31 is fixedly connected to the extension joint 36. The rotatably arranged reference piece 352 can effectively reduce the friction force during the contact process between the reference limit head 35 and the chip body 1, thereby effectively avoiding damage to the chip body 1. The reference limit head 35 corresponds one-to-one to the accelerating curing head 33 on the moving seat 31 where it is located, and the accelerating curing head 33 is installed on the corresponding connecting piece 351 (such as Figure 4 As shown), a baffle 38 is provided on the connecting member 351, and the baffle 38 is located between the accelerated curing head 33 and the corresponding glue injection head 34 to prevent the accelerated curing head 33 from affecting the operation of the glue injection head 34 during operation.

[0033] See also Figure 2 , Figure 3 , Figure 4 and Figure 5The glue injection packaging mechanism 3 also includes a synchronous drive component 37, which includes a drive screw 371 and a bevel gear set 372. The drive screw 371 is rotatably connected to the processing platform 6. The drive screw 371 corresponds to the moving seat 31 one by one and the drive screw 371 is threadedly connected to the corresponding moving seat 31. Two adjacent drive screws 371 in the circumferential direction of the chip body 1 are connected together through the bevel gear set 372 and rotate synchronously. By connecting a drive to any one of the drive screws 371, the drive screw 371 can be driven to rotate synchronously, thereby synchronously controlling the synchronous movement of the four moving seats 31.

[0034] See also Figure 1-Figure 7 The present invention also provides a method for encapsulating a refrigeration chip by glue, comprising the following steps: S1: placing the material; placing the chip body 1 on the fixing head 21, and making the corresponding three sides of the chip body 1 under the limit of the corresponding reference limit head 35, and fixing the chip body 1 by the fixing mechanism 2.

[0035] S2: Glue injection packaging; synchronously move the movable seat 31, so that the glue injection head 34 moves along the corresponding side of the chip body 1 fixed in S1 and injects the glue into the gap of the corresponding side of the chip body 1.

[0036] S3: taking the material; after the glue in the gap on the chip body 1 in S3 is solidified, the chip body 1 is first moved upward so that the chip body 1 is staggered with the glue injection head 34 in the horizontal direction, and then the chip body 1 is moved forward to be removed.

[0037] S4: the above three steps are repeated cyclically to continuously perform the glue injection and packaging work of the chip body 1 .

[0038] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, or a sliding connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A refrigeration chip glue encapsulation device, characterized in that: It comprises a fixing mechanism (2) for fixing a plurality of chip bodies (1) at the same time, the fixing mechanism (2) comprising a fixing seat (22) provided with a plurality of fixing heads (21), the fixing heads (21) being distributed from top to bottom and corresponding one to one with the chip bodies (1); A glue injection packaging mechanism (3), the glue injection packaging mechanism (3) comprising a movable seat (31), the movable seat (31) being arranged in a rectangular shape and corresponding to the four sides of the chip body (1), and the movable seat (31) reciprocating along the corresponding side of the chip body (1), the movable seat (31) being provided with a glue injection cylinder (32) and a plurality of accelerated curing heads (33), the glue injection cylinder (32) being provided with a plurality of glue injection heads (34), the plurality of glue injection heads (34) being arranged from top to bottom and corresponding one to one with the chip body (1); Any three of the movable seats (31) are provided with reference limit heads (35), the reference limit heads (35) on the movable seats (31) are of a certain number and a group of two constitutes a reference limit unit, the reference limit units on the movable seats (31) correspond to the chip bodies (1) one by one, and the reference limit heads (35) in the reference limit units are symmetrically distributed and respectively located on both sides of the corresponding glue injection heads (34); The plurality of accelerated curing heads (33) on the movable seat (31) are evenly arranged from top to bottom, and two accelerated curing heads (33) form a group to form a curing unit, and the curing unit corresponds to the chip body (1) one by one. The accelerated curing heads (33) in the fixed unit are symmetrically distributed and respectively located on both sides of the glue injection head (34), and the accelerated curing heads (33) in the fixed unit are not in a working state at the same time; The movable seat (31) can complete one injection and packaging process by a single movement.

2. A refrigeration chip glue potting packaging device according to claim 1, characterized in that: The reference limit head (35) comprises a connecting piece (351) and a reference piece (352); the reference piece (352) is in direct contact with the corresponding chip body (1) and limits the chip body (1); the reference piece (352) is a cylindrical structure and is rotatably connected to the connecting piece (351); and the connecting piece (351) is connected to the movable seat (31).

3. A refrigeration chip glue potting packaging device according to claim 1 or 2, characterized in that: The number of the fixed heads (21) is at least three, a connecting arm (23) is provided between the fixed head (21) and the fixed seat (22), the fixed seat (22) is fixedly mounted on the processing platform (6), the fixed seat (22) is located on one side of the chip body (1), and an extension joint (36) is provided between the glue injection head (34) corresponding to the side and the corresponding glue injection cylinder (32), the fixed head (21) is located below the chip body (1), during the glue injection process, the corresponding glue injection cylinder (32) does not need to pass through the connecting arm (23), and the extension joint (36) passes over the corresponding connecting arm (23) to enable the corresponding glue injection head (34) to move along the side of the chip body (1) until the glue injection is completed.

4. A refrigeration chip glue potting packaging device according to claim 1, characterized in that: A baffle (38) is provided between the accelerated curing head (33) and the corresponding glue injection head (34).

5. The refrigeration chip glue potting packaging device according to claim 3, characterized in that: The fixing head (21) fixes the chip body (1) in an adsorption fixing manner.

6. A refrigeration chip glue potting packaging device according to claim 1 or 2, characterized in that: The injection packaging mechanism (3) further comprises a synchronous drive assembly (37), wherein the synchronous drive assembly (37) comprises a driving screw (371) and a bevel gear set (372), wherein the driving screw (371) is rotatably connected to the processing platform (6), the driving screw (371) corresponds to the moving seat (31) one by one and the driving screw (371) is threadedly connected to the corresponding moving seat (31), and two driving screws (371) adjacent to each other in the circumferential direction of the chip body (1) are connected together via the bevel gear set (372) and rotate synchronously.

7. The refrigeration chip glue potting packaging device according to claim 1, characterized in that: During the glue injection process, the glue outlet nozzle of the glue injection head (34) is located at an upper position inside the gap of the corresponding side edge of the chip body (1).

8. A method for encapsulating a refrigeration chip by using a device for encapsulating a refrigeration chip by using a glue potting method according to claim 1, characterized in that: The following steps are involved: S1: placing the chip body (1) on the fixing head (21), and making the corresponding three sides of the chip body (1) all under the limit of the corresponding reference limit heads (35), and fixing the chip body (1) by the fixing mechanism (2); S2: Glue injection packaging; synchronously moving the movable seat (31) so that the glue injection head (34) moves along the corresponding side of the chip body (1) in S1 and injects glue into the gap of the corresponding side of the chip body (1); S3: taking the material; after the glue in the gap on the chip body (1) in S2 is solidified under the action of the accelerated curing head (33), the chip body (1) is taken out; S4: The above three steps are repeated cyclically to continue the glue injection and packaging work of the chip body (1).

Images