Gluing device for diode processing

Abstract

The invention relates to the technical field of diode gluing, in particular to a gluing device for diode processing, a glue layer is shifted through a soft rod, so that the glue layer flows again to cover the inner wall of a mold frame, and the problem that the inner wall of the mold frame is insufficiently filled with glue is avoided. Therefore, the problem that the glue layer insufficiently covers the diode is avoided, and meanwhile, when the soft rod is in contact with the diode, the soft rod can generate adaptive deformation to pass through the diode, so that the collision phenomenon is avoided, and the diode is prevented from being damaged; a gluing device for diode processing comprises a cylinder, a piston, a first hard rod, a soft rod, a sealing assembly and a lifting assembly. The dispensing head is communicated with a cylinder, and the cylinder is screwed with the connector; at least two round holes are formed in the cylinder, and the round holes are communicated with the corresponding channels I; a piston is slidably connected to the cylinder; a first hard rod is fixedly connected to the piston and located on the inner side of the dispensing head.

Description

Technical Field

[0001] The present invention relates to the technical field of diode glue coating, and more specifically, to a glue coating device for diode processing. Background Art

[0002] A diode is an electronic device made of semiconductor materials. After multiple diodes are assembled on the same circuit board, glue needs to be applied to the outer surface of the diode. In the prior art, when applying glue to the outer surface of the diode, a rectangular mold frame is first glued to the surface of the circuit board to form a rectangular groove between the rectangular mold frame and the circuit board, and the diode is located in the groove. Then, glue is injected into the groove through a glue dispenser to fill the groove with glue, so that the glue covers the diode. In this process, due to the relatively weak fluidity of the glue and the combined influence of the surface tension of the glue, the edge of the inner wall of the mold frame may not contact the glue, resulting in the glue layer being too thin, thereby resulting in insufficient coverage of the diode. Summary of the invention

[0003] In order to overcome the disadvantage that the inner wall edge of the mold frame part does not contact the glue, resulting in insufficient coverage of the diode, the present invention provides a glue coating device for diode processing.

[0004] Technical solution: A glue coating device for diode processing, comprising a glue dispenser, a connector and a glue dispensing head; the output end of the glue dispenser is fixedly connected to the connector; at least two channels 1 are provided on the connector, and the channels 1 are connected to the output end of the glue dispenser; the glue dispensing head is connected to the connector; it also includes a cylinder, a piston, a hard rod 1, a soft rod, a sealing component and a lifting component; the glue dispensing head is connected to the cylinder, and the cylinder is screwed to the connector; at least two round holes are provided on the cylinder, and the round holes are connected to the corresponding channels 1; the cylinder is slidably connected to the piston; the piston A hard rod 1 is fixedly connected and is located on the inner side of the dispensing head; a soft rod is fixedly connected to the hard rod 1 and is located on the inner side of the dispensing head; a cavity is formed between the cylinder and the piston; a channel 2 is opened on the connecting head and is connected with the cavity; a sealing assembly is connected to the cylinder; the sealing assembly is used to seal the outer side of the connection between the channel 1 and the circular hole, and the sealing assembly is also used to seal the outer side of the connection between the channel 2 and the cavity; a lifting assembly is connected to the dispensing device; the lifting assembly is used to drive the dispensing device to move vertically.

[0005] Further description, the edge of the upper side of the cylinder is chamfered.

[0006] To further explain, an outer ring surface of the hard rod is set to be a smooth surface.

[0007] To further explain, the sealing assembly includes sealing ring 1 and sealing ring 2; sealing ring 1 is fixedly connected to the cylinder and contacts the connecting head; sealing ring 2 is fixedly connected to the connecting head and contacts the cylinder.

[0008] Further description, the lifting assembly includes a connecting plate, an electric slide rail, an electric slider and a connecting block; a connecting plate is arranged on the side of the glue dispenser; at least two electric slide rails are fixedly connected to the connecting plate; each electric slide rail is slidably connected to an electric slider; all the electric sliders are commonly fixed to a connecting block, and the connecting block is detachably connected to the glue dispenser.

[0009] Further description, it also includes a clamping assembly, which includes a base, a stepper motor, a carrier plate, a mounting frame, a pneumatic push rod and a clamp; a base is arranged under the dispenser; a stepper motor is installed on the base; the output end of the stepper motor is fixedly connected to the carrier plate; the carrier plate is rotatably connected to the base; two mounting frames are fixedly connected to the carrier plate; a pneumatic push rod is installed on each mounting frame; each pneumatic push rod output end is fixedly connected to a clamp, and a buffer pad is provided on the lower side of the clamp.

[0010] Further description, it also includes a support component; the support component is connected to the connecting head; the support component includes a threaded column, a hard rod 2, a protrusion and a fixing unit; the threaded column is screwed on the connecting head, and the threaded column is slidably connected to the cylinder; the hard rod 2 is fixedly connected to the threaded column, the hard rod 2 contacts the inner wall of the hard rod 1, and the hard rod 2 contacts the inner wall of the soft rod; a protrusion is fixedly connected to the piston; the hard rod 2 is slidably connected to the protrusion; the hard rod 2 is slidably connected to the piston; the fixing unit is connected to the piston, and the fixing unit is used to fix the threaded column.

[0011] Further description, the edge of the upper side surface of the threaded column is chamfered.

[0012] To further explain, a groove is provided on the second hard rod, and the protrusion is located in the groove.

[0013] Further explanation: the fixing unit includes a cylinder and a cover; the cylinder is fixedly connected to the piston, and the cylinder is in contact with the cylinder; the cover is screwed onto the dispensing head, and the cover is in contact with the soft rod.

[0014] The beneficial effects of the present invention are: 1. The glue layer is moved by the soft rod to make the glue layer flow again to cover the inner wall of the mold frame, thereby avoiding the problem of insufficient glue filling at the inner wall of the mold frame, thereby avoiding the problem of insufficient glue layer covering the diode. At the same time, when the soft rod contacts the diode, the soft rod can be adaptively deformed to skip the diode, avoiding collision and preventing damage to the diode; Second, when the soft rod is extended into the inner side of the dispensing head, the hard rod supports the soft rod sleeve, which avoids the problem of the soft rod shaking during the glue delivery process, thereby avoiding the problem of interference with the diode coating operation caused by a large number of bubbles in the glue layer. At the same time, the piston used to control the downward movement of the soft rod is also used to scrape off the glue adhering to the inner wall of the dispensing head, so as to facilitate manual cleaning of the dispensing head.

[0015] The present invention also has the following beneficial effects: The outer ring surface of the hard rod is set as a smooth surface, so that the glue flows more smoothly on the surface of the hard rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The schematic diagram of the structure of the glue coating device used for diode processing of the present invention is shown; Figure 2 The schematic diagram of the structure of the glue dispenser, the connector and the lifting assembly of the present invention is shown; Figure 3 A schematic diagram of the structure of the connector and the dispensing head combination of the present invention is shown; Figure 4 A cross-sectional view of a connector and a dispensing head combination of the present invention is shown; Figure 5 A cross-sectional view of the dispensing head, the first hard rod, the soft rod, the second hard rod and the cover assembly of the present invention is shown; Figure 6 A schematic diagram of the structure of the inner side of the connector of the present invention is shown; Figure 7 The present invention is shown Figure 6 The enlarged view of point A in the middle; Figure 8 A schematic diagram of the structure of the inner side of the cylinder of the present invention is shown; Fig. 9 A schematic structural diagram of the clamping assembly of the present invention is shown.

[0017] In the above figures: 1-dispenser, 2-connector, 3-dispensing head, 4-cylinder, 5-piston, 6-hard rod one, 7-soft rod, 201-sealing ring one, 202-sealing ring two, 203-connecting plate, 204-electric slide rail, 205-electric slider, 206-connecting block, 207-threaded column, 208-hard rod two, 209-bump, 2010-cylinder, 2011-cover, 301-base, 302-stepping motor, 303-carrier plate, 304-mounting frame, 305-pneumatic push rod, 306-clamp, 001-circuit board, 91-channel one, 92-round hole, 93-channel two, 94-cavity, 95-groove. DETAILED DESCRIPTION

[0018] The present invention will be further described below in conjunction with specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention. Example 1

[0019] A glue coating device for diode processing, such as Figure 1-Figure 7 and Fig. 9 As shown, it includes a glue dispenser 1, a connector 2 and a glue dispensing head 3; the output end of the glue dispenser 1 is bolted with the connector 2; the connector 2 is provided with two channels 91, and the channels 91 are connected to the output end of the glue dispenser 1; the connector 2 is connected to the glue dispensing head 3; it also includes a cylinder 4, a piston 5, a hard rod 6, a soft rod 7, a sealing component and a lifting component; the glue dispensing head 3 is connected and welded with a cylinder 4, and the cylinder 4 is screwed to the connector 2; the cylinder 4 is provided with two circular holes 92, and the circular holes 92 are connected to the corresponding channels 91; the cylinder 4 is slidably connected with a piston 5; the piston 5 is fixed with a hard Rod 1 6, and the hard rod 1 6 is located on the inner side of the dispensing head 3; a soft rod 7 is fixedly connected to the hard rod 6, and the soft rod 7 is located on the inner side of the dispensing head 3; a cavity 94 is formed between the cylinder 4 and the piston 5; a channel 2 93 is opened on the connecting head 2, and the channel 2 93 is connected to the cavity 94; a sealing component is connected to the cylinder 4; the sealing component is used to seal the outer side of the connection between the channel 1 91 and the circular hole 92, and the sealing component is also used to seal the outer side of the connection between the channel 2 93 and the cavity 94; a lifting component is connected to the dispensing device 1; the lifting component is used to drive the dispensing device 1 to move vertically.

[0020] The edge of the upper side of the cylinder 4 is chamfered, so that the cylinder 4 is easier to screw into the connector 2 .

[0021] The outer ring surface of the hard rod 6 is set to be a smooth surface.

[0022] The sealing assembly includes a sealing ring 1 201 and a sealing ring 202; the sealing ring 1 201 is fixedly connected to the cylinder 4, the sealing ring 1 201 is in contact with the connecting head 2, and the sealing ring 1 201 is set to be made of rubber material; the sealing ring 202 is fixedly connected to the connecting head 2, and the sealing ring 202 is in contact with the cylinder 4.

[0023] The lifting assembly includes a connecting plate 203, an electric slide rail 204, an electric slider 205 and a connecting block 206; a connecting plate 203 is arranged on the side of the glue dispenser 1, and the connecting plate 203 is made of metal; two electric slide rails 204 are bolted to the connecting plate 203; each electric slide rail 204 is slidably connected to an electric slider 205; all electric sliders 205 are commonly fixed with a connecting block 206, and the connecting block 206 is detachably connected to the glue dispenser 1, the electric slider 205 drives the connecting block 206 to move upward or downward, and the connecting block 206 drives the glue dispenser 1 and the parts thereon to move upward or downward.

[0024] It also includes a clamping assembly, which includes a base 301, a stepper motor 302, a carrier plate 303, a mounting frame 304, a pneumatic push rod 305 and a clamp plate 306; a base 301 is arranged below the dispenser 1; a stepper motor 302 is installed on the front side of the base 301; the output end of the stepper motor 302 is fixedly connected to the carrier plate 303; the carrier plate 303 is rotatably connected to the base 301; two left-right symmetrical mounting frames 304 are fixedly connected to the carrier plate 303; a pneumatic push rod 305 is installed on each mounting frame 304; a clamp plate 306 is fixedly connected to the output end of each pneumatic push rod 305, and a buffer pad is provided on the lower side of the clamp plate 306 to prevent the circuit board 001 from being clamped.

[0025] The working principle of the above embodiment is as follows: The external air supply pipe is connected to channel 2 93, the connecting plate 203 is fixed on the external conveying mechanism by bolts, the base 301 is fixed on the dispensing machine workbench by bolts, and the dispensing device 1 is set directly above the base 301, by placing the circuit board 001 with the mold frame glued on the carrier 303, and controlling the two pneumatic push rods 305 to drive the clamping plate 306 to descend, the circuit board 001 is clamped and fixed by the clamping plate 306 and the carrier 303, and then the electric slide rail 204 and the electric slider 205 are started, the electric slider 205 drives the connecting block 206 to move downward, and the connecting block 206 drives the dispensing device 1 and the parts thereon to move downward, so that the dispensing head 3 is close to the top of the mold frame, and then the dispensing device 1 delivers glue to channel 1 91, and the glue flows into the inner side of the dispensing head 3 through the channel 1 91, the circular hole 92 and the cylinder 4 in turn, and then is injected into the mold frame through the dispensing head 3, and then is sealed. The sealing ring 202 seals the connecting position between the channel 1 91 and the circular hole 92. During this process, the connecting plate 203 and the parts thereon are driven to move horizontally through the external conveying mechanism, so that the lower port of the dispensing head 3 moves above the inner side of the mold frame, so that the dispensing head 3 evenly fills the glue at various positions inside the mold frame to cover the diode, and then the electric slider 205 is controlled to drive the dispensing device 1 and the parts thereon to move upward and reset. At this time, the stepper motor 302 is started, and the carrier plate 303 and the circuit board 001 thereon are driven to rotate 15° clockwise based on the view from front to back, so that the circuit board 001 is slightly tilted to the right, even if the glue in the mold frame flows to the right, and then the circuit board 001 is controlled to rotate 30° counterclockwise, so that the circuit board 001 is slightly tilted to the left, even if the glue in the mold frame flows to the left, thereby ensuring that the glue in the mold frame completely covers the diode.

[0026] In order to avoid pouring glue into the outside of the mold frame, the movement trajectory range of the lower port of the glue dispensing head 3 should be smaller than the range of the inner area of ​​the mold frame. Due to the poor fluidity of the glue and the high surface tension, the glue on the inner side of the mold frame cannot fully flow to the inner wall of the mold frame, resulting in that some positions of the inner wall of the mold frame are not fully filled with glue. Therefore, after the glue injection is completed, the glue dispensing head 3 is controlled to move to the top of the mold frame through the external conveying mechanism, and then the external air pipe conveys air to the channel 2 93, and the air flows into the cavity 94 through the channel 2 93, so that the air pressure in the cavity 94 increases, thereby pushing the piston 5 to move downward, and the connection position between the channel 2 93 and the cavity 94 is sealed through the sealing ring 1 201. Sealing, piston 5 drives hard rod 6 to move downward, hard rod 6 drives soft rod 7 to move downward, so that soft rod 7 extends from dispensing head 3 and is inserted into the glue layer of mold frame. At the same time, piston 5 will squeeze part of the glue in dispensing head 3 to the inside of mold frame, replenish glue to the inside of mold frame, and then control soft rod 7 to move along the inner edge of mold frame through external conveying mechanism, so that soft rod 7 moves the outer edge of glue layer, so that glue flows to cover the inner wall of mold frame, and then glue fully covers diode, and then external air pipe draws air into channel 2 93, so that piston 5 drives hard rod 6 and soft rod 7 to move upward back to original position, and completes diode coating operation.

[0027] The height of some diodes in the mold frame is relatively high. If the hard rod 6 is used directly to move the glue layer, the hard rod 6 may collide with the diode. Therefore, the soft rod 7 is used to move the glue layer. When the soft rod 7 contacts the diode, the soft rod 7 can be adaptively deformed to skip over the diode, avoiding collision and preventing damage to the diode.

[0028] According to the above working principle, we know that the present invention has the following effects: The glue layer is moved by the soft rod 7 so that it flows again to cover the inner wall of the mold frame, thereby avoiding the problem of insufficient glue filling on the inner wall of the mold frame, thereby avoiding the problem of insufficient glue layer covering the diode. At the same time, when the soft rod 7 contacts the diode, the soft rod 7 can undergo adaptive deformation to pass over the diode, avoiding collision and preventing damage to the diode.

[0029] On the basis of the above technical effects, the present invention also has the following advantages: The outer ring surface of the hard rod 6 is set to a smooth surface, so that the glue can flow more smoothly on the surface of the hard rod 6. Example 2

[0030] On the basis of Example 1, Figure 5-Figure 8As shown, it also includes a support component; the support component is connected to the connecting head 2; the support component includes a threaded column 207, a hard rod 208, a protrusion 209 and a fixing unit; the threaded column 207 is screwed on the connecting head 2, the threaded column 207 is slidably connected to the cylinder 4, and the threaded column 207 is set to an alloy material; a hard rod 208 is welded on the threaded column 207, the hard rod 208 is in contact with the inner wall of the hard rod 1 6, the hard rod 208 is in contact with the inner wall of the soft rod 7, and the soft rod 7 is supported by the hard rod 208; a protrusion 209 is welded on the piston 5; the hard rod 208 is slidably connected to the protrusion 209; the hard rod 208 is slidably connected to the piston 5; a fixing unit is connected to the piston 5, and the fixing unit is used to fix the threaded column 207.

[0031] The upper side edge of the threaded column 207 is chamfered, so that the threaded column 207 is easier to screw into the connector 2 .

[0032] A groove 95 is formed on the hard rod 208 , and a protrusion 209 is located in the groove 95 . The protrusion 209 and the groove 95 cooperate with each other to limit the moving piston 5 .

[0033] The working principle of the above embodiment is as follows: In the process of the dispensing head 3 injecting glue into the mold frame described in Example 1: When the glue flows through the dispensing head 3, it will disturb the flexible soft rod 7 inside it, causing the soft rod 7 to shake, resulting in bubbles in the glue. After the dispensing head 3 injects the glue containing bubbles into the mold frame, a large number of bubbles are mixed in the glue layer in the mold frame, which interferes with the diode coating and affects the structural stability of the glue layer after hardening. Therefore, when the glue is injected into the mold frame through the dispensing head 3, the soft rod 7 is sleeved on the outer side of the lower end of the hard rod 208, and the hard rod 208 is used to support the soft rod 7 sleeve to prevent the soft rod 7 sleeve from shaking. When the soft rod 7 is extended from the dispensing head 3, the piston 5 drives the hard rod 1 6 and the soft rod 7 to move downward, so that the soft rod 7 moves downward and stops contacting the hard rod 208, and then the glue layer is moved by the soft rod 7.

[0034] After the dispensing head 3 is used for a long time, some glue will adhere to the inner wall of the dispensing head 3. In order to avoid clogging of the dispensing head 3, the dispensing head 3 should be cleaned regularly. When cleaning, the dispensing head 3 is manually twisted downward, and the dispensing head 3 drives the cylinder 4 to rotate, and the cylinder 4 drives the threaded column 207 to rotate, and the threaded column 207 is screwed out of the connecting head 2, and then the soft rod 7 is manually pulled downward to move, and the soft rod 7 pulls the hard rod 16 downward to move, and the hard rod 16 drives the piston 5 downward to move, and the piston 5 drives the protrusion 209 to slide downward in the groove 95. When the protrusion 209 slides to the lowermost end of the groove 95, the protrusion 209 drives the hard rod 208 to move downward, and the hard rod 208 drives the threaded column 207 moves downward, thereby pulling out the piston 5, hard rod 1 6, soft rod 7, threaded column 207, hard rod 208 and bump 209 from the dispensing head 3. During this process, the piston 5 slides downward on the inner wall of the dispensing head 3, thereby scraping off the glue adhering to the inner side of the dispensing head 3. After that, the dispensing head 3 is manually twisted downward to remove the dispensing head 3 and its parts from the connecting head 2, and then the dispensing head 3 and its parts are cleaned. When the dispensing head 3 and its parts are installed back to their original position after cleaning, the threaded column 207 is fixed to the cylinder 4 by the fixing unit, so that the threaded column 207 can be manually screwed back into the connecting head 2 by rotating the dispensing head 3 and the cylinder 4.

[0035] According to the above working principle, we know that the present invention has the following effects: When the soft rod 7 extends into the inner side of the glue dispensing head 3, the hard rod 208 supports the soft rod 7, thereby preventing the soft rod 7 from shaking during the glue delivery process, thereby preventing the diode coating operation from being interfered with by a large number of bubbles in the glue layer. At the same time, the piston 5 for controlling the downward movement of the soft rod 7 is also used to scrape off the glue adhering to the inner wall of the glue dispensing head 3, so as to facilitate manual cleaning of the glue dispensing head 3. Example 3

[0036] On the basis of Example 2, Figure 5 and Figure 8 As shown, the fixing unit includes a cylinder 2010 and a cover 2011; the cylinder 2010 is welded on the piston 5, and the cylinder 2010 is in contact with the cylinder 4; the cover 2011 is screwed on the dispensing head 3, and the cover 2011 is in contact with the soft rod 7.

[0037] The working principle of the above embodiment is as follows: After the cleaning operation described in Example 2 is completed: First, manually push the piston 5 to slide upward on the surface of the hard rod 208, and the piston 5 drives the hard rod 1 6 and the soft rod 7 to move, so that the soft rod 7 is sleeved on the outer side of the lower end of the hard rod 208. At this time, the protrusion 209 just moves to the uppermost end of the groove 95, and then manually insert the piston 5 and the parts on it into the inner side of the dispensing head 3 and the cylinder 4, and make the threaded column 207 pass through the cylinder 4, and continue to push the piston 5 and the parts on it to move upward until the cylinder 2010 on the piston 5 contacts the top of the inner side of the cylinder 4. At this time, the lower side of the soft rod 7 is flush with the lower side of the dispensing head 3, and then manually screw the cover 2011 It is inserted into the lower end of the dispensing head 3 and contacts with the lower end of the soft rod 7. At this time, the cover 2011 and the cylinder 2010 cooperate to limit and fix the piston 5, the hard rod 1 6 and the soft rod 7, and the lower end of the hard rod 208 is limited by the soft rod 7, and the upper end of the hard rod 208 is limited by the protrusion 209, thereby limiting and fixing the threaded column 207 and the hard rod 208, and then manually screwing the dispensing head 3 and the parts thereon into the connecting head 2, the dispensing head 3 drives the cylinder 4 to rotate, and the cylinder 4 drives the threaded column 207 to rotate, thereby screwing the threaded column 207 into the connecting head 2 to complete the replacement operation.

[0038] It should be understood that the above description is only for exemplary purposes and is not meant to limit the present invention. Those skilled in the art will appreciate that variations of the present invention will be included within the scope of the claims herein.

Claims

1. A glue coating device for diode processing, comprising a glue dispenser (1); a connector (2) is fixedly connected to the output end of the glue dispenser (1); at least two channels (91) are provided on the connector (2), and the channels (91) are connected to the output end of the glue dispenser (1); a glue dispensing head (3) is connected to the connector (2); the characteristics are: The dispensing head (3) is connected to a cylinder (4), which is screwed to the connecting head (2); at least two circular holes (92) are formed on the cylinder (4), which are connected to corresponding channels (91); a piston (5) is slidably connected to the cylinder (4); a hard rod (6) is fixedly connected to the piston (5), and the hard rod (6) is located inside the dispensing head (3); a soft rod (7) is fixedly connected to the hard rod (6), and the soft rod (7) is located inside the dispensing head (3); the cylinder (4) A cavity (94) is formed between the piston (5); a second channel (93) is formed on the connector (2), and the second channel (93) is connected to the cavity (94); a sealing component is connected to the cylinder (4); the sealing component is used to seal the outer side of the connection between the first channel (91) and the circular hole (92), and the sealing component is also used to seal the outer side of the connection between the second channel (93) and the cavity (94); a lifting component is connected to the glue dispenser (1); the lifting component is used to drive the glue dispenser (1) to move vertically.

2. The glue coating device for diode processing according to claim 1 is characterized in that: The edge of the upper side of the cylinder (4) is chamfered.

3. The glue coating device for diode processing according to claim 1 is characterized in that: The outer ring surface of the hard rod (6) is set to be a smooth surface.

4. The glue coating device for diode processing according to claim 3 is characterized in that: The sealing assembly comprises a sealing ring 1 (201); the sealing ring 1 (201) is fixedly connected to the cylinder (4), and the sealing ring 1 (201) is in contact with the connecting head (2); the sealing ring 2 (202) is fixedly connected to the connecting head (2), and the sealing ring 2 (202) is in contact with the cylinder (4).

5. The glue coating device for diode processing according to claim 4 is characterized in that: The lifting assembly comprises a connecting plate (203); a connecting plate (203) is arranged on the side of the glue dispenser (1); at least two electric slide rails (204) are fixedly connected to the connecting plate (203); each electric slide rail (204) is slidably connected to an electric slider (205); all the electric sliders (205) are commonly fixedly connected to a connecting block (206), and the connecting block (206) is detachably connected to the glue dispenser (1).

6. The glue coating device for diode processing according to claim 1 is characterized in that: The device also includes a clamping assembly, which includes a base (301), a stepper motor (302), a carrier plate (303), a mounting frame (304), a pneumatic push rod (305) and a clamping plate (306); a base (301) is arranged below the glue dispenser (1); a stepper motor (302) is mounted on the base (301); the output end of the stepper motor (302) is fixedly connected to the carrier plate (303); the carrier plate (303) is rotatably connected to the base (301); two mounting frames (304) are fixedly connected to the carrier plate (303); each mounting frame (304) is mounted with a pneumatic push rod (305); the output end of each pneumatic push rod (305) is fixedly connected to the clamping plate (306), and a buffer pad is provided on the lower side of the clamping plate (306).

7. The glue coating device for diode processing according to claim 5 is characterized in that: The invention also comprises a support assembly; the support assembly is connected to the connecting head (2); the support assembly comprises a threaded column (207); the threaded column (207) is screwed onto the connecting head (2), and the threaded column (207) is slidably connected to the cylinder (4); a second hard rod (208) is fixedly connected to the threaded column (207), the second hard rod (208) contacts the inner wall of the first hard rod (6), and the second hard rod (208) contacts the inner wall of the soft rod (7); a protrusion (209) is fixedly connected to the piston (5); the second hard rod (208) is slidably connected to the protrusion (209); the second hard rod (208) is slidably connected to the piston (5); a fixing unit is connected to the piston (5), and the fixing unit is used to fix the threaded column (207).

8. The glue coating device for diode processing according to claim 7 is characterized in that: The upper side edge of the threaded column (207) is provided with a chamfer.

9. A glue coating device for diode processing according to any one of claims 7-8, characterized in that: A groove (95) is formed on the second hard rod (208), and the protrusion (209) is located in the groove (95).

10. The glue coating device for diode processing according to claim 9, characterized in that: The fixing unit comprises a cylinder (2010); the cylinder (2010) is fixedly connected to the piston (5), and the cylinder (2010) is in contact with the cylinder (4); a cover (2011) is screwed onto the dispensing head (3), and the cover (2011) is in contact with the soft rod (7).

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