Thin ventilation jet pump

Abstract

Belongs to an improved design of a jet pump, the thin ventilation jet pump is used for ventilation and heat dissipation of thin electronic equipment, a shell of the cooled electronic equipment serves as a shell and a jet hole of the jet pump and even serves as a whole or part of an air interlayer, and the total installation thickness of the equipment and the jet pump is effectively reduced.

Description

Technical Field

[0001] The invention belongs to the improved design of the jet pump. The thin ventilation jet pump is used for the ventilation and heat dissipation of thin electronic equipment. The shell of the electronic equipment to be cooled is used as the shell and jet hole of the jet pump, or even as all or part of the air barrier, which effectively reduces the total installation thickness of the equipment and the jet pump. Background Art

[0002] A jet pump is a pump that is driven by an electromagnetic force to compress and expand the pump chamber, and the fluid in the pump chamber, such as air, is driven to flow out of the opening on the pump chamber at high speed, through the air barrier and the jet holes on the pump shell, and pumped out to the outside world. During air intake, the air in the air barrier is sucked into the pump chamber, thus isolating the intake and exhaust, and achieving high pumping efficiency. The thickness of a jet pump using an electromagnetically driven actuator such as piezoelectric material is very small, about 2 mm, such as 1.4 mm. It can effectively solve the heat dissipation requirements of thin electronic devices under thin design. The shell thickness of the jet pump is about 0.3 mm, and the thickness of the air barrier is about 0.5 mm. The thickness of these two components adds up to 0.8 mm, which is more than half of the total thickness of the pump of 1.4 mm. Summary of the invention

[0003] Although the thickness of the jet pump is already very thin, about 1 to 2 mm, thin electronic devices still need a thinner design to meet the market demand for thinness and lightness. Thinness is the key factor in market success, so thinner electronic devices are needed, which also requires thinner components. Reducing the thickness of the jet pump is a necessary technical improvement goal. When the jet pump is used for ventilation heat dissipation of electronic equipment, such as Figure 1 As shown, the jet pump is attached and fixed on the device housing, and the air intake is from one or more sides of the pump and / or the bottom of the pump, and from the inside of the device, while the air outlet path is: pump chamber - pump chamber opening - through the interlayer - through the pump housing through the housing jet hole - through the device housing through the corresponding opening of the device housing - into the outside. At the same time, the openings in other positions of the device housing (omitted and not drawn) supplement the low-temperature air from the outside to enter the device, realize the exchange of hot air in the device and cold air from the outside, take out the heat in the device, and realize heat dissipation.

[0004] In order to reduce the thickness, and thus reduce the thickness of the equipment or to be used for thinner equipment, it is proposed to omit the pump housing and / or the jet holes on the housing, and directly use the equipment housing as the pump housing, and set the jet holes at the corresponding positions on the equipment housing as needed, so as to achieve the technical effect of omitting a pump housing and reducing the thickness of the pump housing by about 0.3 mm, while still retaining the improved design of all the functions of the pump. The 0.3 mm thickness reduction is a significant thinning effect in the total thickness of the jet pump of about 1 to 2 mm. In the prior art, it often takes years of effort to reduce the thickness by 0.3 mm. Although this design is simple, it has significant technical effects and retains all functions.

[0005] For positioning and installation, a positioning hole or other common positioning mechanism may be provided on the device housing to ensure that the jet hole on the device housing and the pump are correctly positioned after the pump is installed.

[0006] In order to further reduce the installation thickness of the jet pump and achieve thinness, such as Figure 3 As shown, the air barrier is further incorporated into the device housing, or as Figure 4 As shown in the figure, putting part of the thickness of the air barrier into the device shell can further reduce the thickness by about 0.5 mm. The specific reduction depends on the thickness and strength of the device shell. When the device shell is thick enough and the material strength is sufficient, the air barrier can be completely put into the device shell. At this time, the total pump thickness can be reduced by about 0.8 mm, which is very significant compared to the original thickness of the jet pump of about 1.4 mm. In addition, the pump has fewer parts and the cost is lower, and the technical effect is significant. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a schematic diagram of the jet pump installed on the equipment casing for ventilation.

[0008] Figure 2 This is a schematic diagram of omitting the jet pump housing in this application.

[0009] Figure 3 This is a schematic diagram of omitting the jet pump housing and air barrier in the present application.

[0010] Figure 4 This is a schematic diagram of the present application omitting the jet pump housing and part of the air barrier and integrating it into the device housing.

[0011] Figure 5 is a schematic diagram of a piezoelectric jet pump.

[0012] In the figure, 1 is a jet pump, wherein 1.1 is a piezoelectric ceramic, 1.2 is a metal gasket, 1.3 is a diaphragm, 1.4 is a jet pump cavity, 1.5 is an upper wall of the cavity or a second diaphragm, 1.6 is an air barrier, 1.7 is a shell of the jet pump, 1.8 is an opening on the jet pump cavity, i.e., a jet hole on the second diaphragm, 1.9 is a jet hole on the shell of the jet pump, and 1.10 is an air inlet of the jet pump. 2 is a part of the device shell, and 2.1 is an opening on the device shell. DETAILED DESCRIPTION

[0013] Example 1 Figure 2 As shown, the jet pump is omitted Figure 5 The jet pump housing 1.7 and the jet hole 1.9 thereon directly replace the device housing and the opening on the device housing. When the jet pump is working, when the electromagnetic drive or other actuator compresses the pump chamber, the fluid in the pump chamber, such as air, is driven to flow out of the opening of the pump chamber at a high speed (the pump chamber is closed around, Figure 5 The schematic diagram of the medium-voltage electric pump is a principle diagram. The pump chamber is closed around, and the interlayer 1.6 is also closed except for the air inlet 1.10. The closing mechanism and the installation and positioning mechanism between the pump and the equipment housing are omitted (not shown), forming a high-speed jet, passing through the air interlayer 1.6 and the jet hole 1.9 on the equipment housing, and flowing into the external space, as indicated by the arrow. When the pump chamber expands, the air in the air interlayer 1.6 is sucked in. At least one side of the outer side of the air interlayer 1.6 is open, or there is a flow channel connected to the internal space of the equipment. The air inside the equipment is replenished into the air interlayer 1.6 through the air inlet 1.10, as indicated by the arrow. In this way, the jet pump continuously sucks the hot air inside the equipment into the jet pump and discharges it to the outside through the jet hole, while the air inlets (omitted and not shown) set at other positions of the equipment suck in the cooler air from the outside, forming an air circulation to achieve the effect of heat dissipation. The advantage of this example is that after the jet pump is installed on the inner surface of the equipment casing, the thickness is smaller, and the protrusion height is only the full height of the pump minus the thickness of the pump casing. The thickness is reduced by about 0.3 mm, from the original 1.4 mm to 1.1 mm.

[0014] Example 2 Figure 3 As shown in the figure, under the premise that the thickness and strength of the equipment shell are sufficient, the air barrier of the jet pump is completely set on the equipment shell. The jet pump only retains the pump cavity part, which is installed on the equipment shell through the installation and positioning mechanism, and is accurately positioned with the jet hole and the air barrier concave position on the equipment shell. In this example, the height of the protrusion on the equipment shell is only about 0.6 mm of the thickness of the pump cavity, which is consistent with the Figure 1 Compared with the previous method, the thickness of the pump housing and air barrier is reduced by about 0.3 and 0.5 mm, and the total raised installation thickness is reduced by Figure 1The 1.4 mm in the figure is reduced to 0.6 mm. The overall function of the jet pump remains unchanged, and the processing cost is reduced due to the reduction of parts. The air inlet 1.10 in the figure is on the side of the equipment housing close to the pump, and is formed by the air barrier concave position on the equipment housing extending out of the pump.

[0015] Example 3 Figure 4 As shown, in the case where the thickness or strength of the device shell is not enough, a partial air barrier can be set on the device shell as in this example, for example, the thickness of the air barrier is 0.5 mm, a longer concave position or groove with a depth of 0.2 mm is set on the device shell, and another partial air barrier with a thickness of 0.3 mm is set on the pump body. When the pump is positioned and installed on the device shell, the two parts are combined into one to form a complete 0.5 thick air barrier and a side air inlet 1.10. In this example, the thickness of 0.3+0.2 is omitted, which is about 0.5 mm. The installation thickness of the protrusion on the device shell is only 0.9 mm, which is still a significant improvement compared to the 1.4 mm of the prior art in Example 4, while the pump performance remains unchanged and the cost is slightly lower.

[0016] Example 4 Figure 1 As shown, in contrast, the piezoelectric jet pump of the prior art is installed on the inner surface of the device housing, can be installed close to the heating element, and the air inlet 1.10 is installed close to the heating element or its heat sink, so that the hot air is pumped out of the device by the pump, and the cooler air at the far end or around the heating element is supplemented to form a heat dissipation enhancement for the heating element. The total thickness of the pump is 1.4 mm, which completely protrudes from the device housing, which is not conducive to designing thin electronic devices that meet market requirements.

[0017] This design can be easily transferred to other fluid pump applications, using the structure or housing of the device to be cooled, or the mounting base as the pump housing and / or air barrier to reduce the installation thickness and achieve a thinning technical effect.

Claims

1. A thin ventilation jet pump, which is composed of a pump chamber, a partition, a shell, a pump chamber and a jet hole on the shell, etc., and is installed on a thin electronic device shell to realize ventilation and heat dissipation functions, characterized in that: The housing of the electronic device is used as the housing of the jet pump and / or the jet hole of the pump housing, thereby achieving the technical effect of reducing the installation thickness.

2. The thin ventilation jet pump according to claim 1 is further characterized in that: The air intake partition of the jet pump is formed by utilizing the concave position on the housing of the electronic device, and the thickness of the pump partition is further omitted in the installation thickness.

3. The thin ventilation jet pump according to claim 1 is further characterized in that: The concave position on the housing of the electronic device is used to form part of the air intake partition of the jet pump, and part of the thickness of the partition of the pump is further omitted in the installation thickness.

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