Device and method for checking silicon wafer packaging box

Abstract

The invention relates to the technical field of silicon wafer packaging and transportation, in particular to a device and a method for checking a silicon wafer packaging box, and the device comprises a camera device and a display device connected with the camera device; the camera device is arranged above the packaging box to be detected; the camera shooting device can shoot a to-be-detected packaging box and send a picture to the display device, and the display device is used for displaying the picture; the method adopts the device. The photographing angle of the camera device for each to-be-detected packaging box can be kept basically consistent, and the situation that the visual angle is incorrect during manual inspection can be avoided. The to-be-detected packaging box is photographed through the camera device, the state information of the silicon wafers in the to-be-detected packaging box can be fed back comprehensively, and omission can be avoided. Through the shooting feedback of the camera device, a worker can see the state of the silicon wafer in the packaging box to be detected more clearly, so that the detection of the packaging box to be detected is more accurate and rapid.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer packaging and transportation, and in particular to a device and method for inspecting a silicon wafer packaging box. Background Art

[0002] The silicon wafer packaging box generally includes a packaging box body and a packaging box cover. The packaging box body is provided with 25 placement slots. When packaging, the silicon wafers in sheet form are placed in the placement slots so that each packaging box can hold 25 silicon wafers. After 25 silicon wafers are placed in the packaging box body, when the packaging box cover is placed on the packaging box body, the packaging box body is not properly covered, causing the silicon wafers to be tilted and misaligned.

[0003] The existing packaging box cover is made of translucent material. When the packaging box cover is put on the packaging box body, the staff needs to pick up the packaging box with both hands and visually check through the packaging box cover at a certain angle to see whether the packaging box cover is in place and whether the silicon wafer is tilted or misaligned.

[0004] However, there is a risk of missing detection through manual visual inspection, and if the visual angle is not correct, the tilt and misalignment of the silicon wafer may not be detected. Summary of the invention

[0005] In view of the above problems existing in the prior art, the present invention provides a device and method for inspecting a silicon wafer packaging box.

[0006] In order to solve the above technical problems, the present invention is solved by the following technical solutions:

[0007] In a first aspect, a device for inspecting a silicon wafer packaging box is provided, which includes a camera device and a display device connected to the camera device; the camera device is arranged above the packaging box to be inspected;

[0008] The camera device can take a picture of the packaging box to be detected and send the picture to the display device, and the display device is used to display the picture.

[0009] Preferably, the camera device is a high-magnification camera.

[0010] Preferably, the camera device and the display device are connected via a processor host.

[0011] Preferably, a switch is provided on the processor host.

[0012] Preferably, at least one of the camera device, the processor host and the display device is provided with an alarm.

[0013] In a second aspect, a method for inspecting a silicon wafer packaging box is provided, using the above-mentioned device, comprising:

[0014] Place the package box to be inspected under the camera device;

[0015] The camera device takes a picture of the packaging box to be inspected and sends the picture to the processor host;

[0016] The processor host sends the processed photos to a display device, and the display device displays the photos.

[0017] Preferably, the camera device sends the photo to the processor host, and the processor host denoises the photo and sends it to the display device.

[0018] Preferably, after the processor host denoises the photo, the processor marks the positions of the silicon wafers in the photo where there are tilted and misaligned wafers.

[0019] Preferably, when the silicon wafer in the photo is tilted or misaligned, at least one of the camera device, the processor host and the display device issues an alarm.

[0020] The present invention has at least the following beneficial effects:

[0021] 1. Since the position of the camera device is fixed and there is a photographing area when photographing the package box to be inspected, the camera device can maintain a basically consistent photographing angle for each package box to be inspected, thereby avoiding the situation where the visual angle is incorrect during manual inspection.

[0022] 2. By taking a picture of the packaging box to be inspected through a camera device, the status information of the silicon wafers in the packaging box to be inspected can be fed back more comprehensively to avoid omissions.

[0023] 3. Through the shooting feedback of the camera device, the staff can see the status of the silicon wafers in the packaging box to be tested more clearly, making the inspection of the packaging box to be tested more accurate and quick.

[0024] 4. Due to the shooting of the camera device, there will be no missed inspections, which can assist the staff to conduct a more comprehensive inspection of the packaging boxes to be inspected.

[0025] 5. It can avoid the staff from picking up and observing the packaging boxes to be tested, which can reduce labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram showing a device for inspecting a silicon wafer packaging box in some embodiments of the present application is shown;

[0027] Figure 2A flow chart of a method for inspecting a silicon wafer packaging box in some embodiments of the present application is shown.

[0028] The parts indicated by the numbers in the accompanying drawings are as follows:

[0029] 10. Package box to be inspected; 100. Camera device; 200. Display device; 300. Processor host; 400. Switch. DETAILED DESCRIPTION

[0030] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are only for explaining the present invention and are not intended to limit it.

[0031] First, as Figure 1 As shown, this embodiment provides a device for inspecting a silicon wafer packaging box, the device comprising a camera device 100 and a display device 200, wherein the camera device 100 and the display device 200 are connected in communication, the camera device 100 can send the photographed photos to the display device 200, so that the display device 200 can display the photos taken by the camera device 100. Further, the camera device 100 is fixedly installed at a position with a certain height, and when in use, it is only necessary to place the packaging box 10 to be inspected under the camera device 100, and after starting the camera device 100, the camera device 100 can take photos of the packaging box 10 to be inspected under it.

[0032] It should be noted that the packaging box 10 to be inspected mentioned in this embodiment is a packaging box body in which silicon wafers are placed, and a packaging box cover is provided on the packaging box body.

[0033] It can be understood that, through the arrangement of the camera device 100 and the display device 200 in this embodiment, after the staff places the packaging box 10 to be inspected under the camera device 100, the camera device 100 is controlled to take a picture of the packaging box 10 to be inspected below, and then the camera device 100 sends the taken picture to the display device 200, so that the display device 200 displays the picture, and then the staff can check the packaging box 10 to be inspected through the picture displayed on the display device 200.

[0034] In this embodiment, since the position of the camera device 100 is fixed and there is a photographing area when photographing the package box 10 to be inspected, the camera device 100 can maintain a basically consistent photographing angle for each package box 10 to be inspected, which can avoid the situation where the visual angle is incorrect during manual inspection, and then the situation of the silicon wafers in the package box 10 to be inspected can be accurately fed back through the photographed photos. At the same time, by taking photos of the package box 10 to be inspected by the camera device 100, the status information of the silicon wafers in the package box 10 to be inspected can be fed back more comprehensively, which can avoid omissions.

[0035] In some embodiments, the camera device 100 uses a high-power camera. It is understandable that the high-power camera can take high-definition images. When the high-power camera is used to take pictures of the packaging box 10 to be inspected, the status information of the silicon wafers in the packaging box 10 to be inspected can be fed back more clearly, so that the display device 200 can display high-definition photos, which is convenient for the staff to observe the photos and distinguish whether the silicon wafers in the packaging box 10 to be inspected are tilted, stuck or misplaced.

[0036] It is understandable that, through the shooting feedback of the camera device 100, the staff can more clearly see the state of the silicon wafers in the package box 10 to be inspected, making the inspection of the package box 10 to be inspected more accurate and quick. At the same time, due to the shooting of the camera device 100, there will be no missed inspection, which can assist the staff to conduct a more comprehensive inspection of the package box 10 to be inspected. Furthermore, it can also avoid the staff from picking up the package box 10 to be inspected for observation, which can reduce labor costs.

[0037] In some embodiments, a processor host 300 is further provided between the camera device 100 and the display device 200. Specifically, the camera device 100 is communicatively connected to the processor host 300, and the processor host 300 is communicatively connected to the display device 200. When the camera device 100 takes a picture of the package box 10 to be inspected, the camera device 100 sends the picture to the processor host 300, and the processor host 300 sends the picture to the display device 200, so that the display device 200 displays the picture.

[0038] It can be further understood that after the camera device 100 sends the taken photos to the processor host 300, the processor host 300 can process the photos. Specifically, it can denoise the photos to make them clearer, and it can also mark the positions where the silicon wafers shown in the photos are tilted or misplaced, so that they can be directly presented to the staff through the display device 200, realizing automatic recognition of the machine, and further improving the accuracy and speed of inspecting the packaging box 10 to be inspected.

[0039] In some embodiments, a switch 400 is provided on the processor host 300, and the processor host 300 can be turned on or off by the switch 400, thereby realizing the operation of the processor host 300. Further, both the camera device 100 and the display device 200 can be controlled by the processor host 300.

[0040] In some embodiments, an alarm may be provided on the camera device 100, the processor host 300, and the display device 200. When the camera device 100 sends the photographed photo to the processor host 300, the processor host 300 identifies and marks the position where the silicon wafer shown in the photo is tilted or misaligned, and the processor host 300 can control the alarm to sound an alarm, thereby alerting the staff.

[0041] It is worth mentioning that, through the setting of the processor host 300 and the alarm, the fully automatic inspection of the packaging box 10 to be inspected can be better realized, the mistakes of manual inspection can be avoided, and the accuracy and speed of the inspection of the packaging box 10 to be inspected can be further improved.

[0042] Furthermore, the alarm emitted by the alarm device may be a sound alarm or a light alarm, and there is no particular limitation on this, as long as it can serve to remind the staff.

[0043] Second, combining Figure 2 As shown, this embodiment provides a method for inspecting a silicon wafer packaging box. The method adopts the above-mentioned device for inspecting a silicon wafer packaging box, and specifically includes:

[0044] Step S100 : placing the package box 10 to be inspected under the camera device 100 .

[0045] In this step, multiple silicon wafers are placed in the packaging box body, and then the packaging box cover is covered on the packaging box body to form the packaging box 10 to be inspected; then the packaging box 10 to be inspected is placed under the camera device 100, so that the camera device 100 can shoot the packaging box 10 to be inspected.

[0046] Step S200 , controlling the camera device 100 to take a picture of the packaging box 10 to be inspected, and sending the taken picture to the processor host 300 .

[0047] In this step, the camera device 100 is used to photograph the packaging box 10 to be inspected placed below the camera device 100 , and then the camera device 100 sends the photographed photo to the processor host 300 .

[0048] Step S300: The processor host 300 sends the processed photo to the display device 200, and the display device 200 displays the photo.

[0049] In this step, after receiving the photo sent by the camera device 100, the processor host 300 processes the photo and then sends the photo to the display device 200, so that the processed photo is displayed to the staff through the display device 200.

[0050] In some embodiments, after the camera device 100 sends the taken photos to the processor host 300, the processor host 300 denoises the photos to make the photos clearer, and then sends the photos to the display device 200, so that the display device 200 can display clearer photos for the staff to facilitate the staff's observation and identification.

[0051] In some embodiments, after the camera device 100 sends the captured photo to the processor host 300, the processor host 300 denoises the photo and further analyzes the photo, marks the positions where the silicon wafers are tilted and misaligned in the photo, and then sends the marked photo to the display device 200, so that the display device 200 displays the photo, so that the staff does not need to distinguish it, and the staff can directly determine the location of the problem of the packaging box 10 to be inspected through the mark, so that the inspection of the packaging box 10 to be inspected is more accurate and quick.

[0052] It should be noted that the premise for the processor host 300 to analyze the photo and mark the locations where the silicon wafer is tilted and misaligned in the photo is that a photo of the silicon wafer with no problems is preset in the processor host 300, so that the processor host 300 can compare the two photos, and then find the location where the silicon wafer has problems and mark it.

[0053] In some embodiments, when the processor host 300 marks the positions where the silicon wafers are skewed or misaligned in the photo and sends them to the display device 200, the processor host 300 can control the alarm to sound an alarm, thereby reminding the staff to check the display device 200 to understand the positions where the silicon wafers in the packaging box 10 to be inspected are skewed or misaligned.

[0054] In conclusion, the above is only a preferred embodiment of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the patent of the present invention.

Claims

1. A device for inspecting silicon wafer packaging boxes, characterized in that: It includes a camera device and a display device connected to the camera device; the camera device is arranged above the packaging box to be inspected; The camera device can take a picture of the packaging box to be detected and send the picture to the display device, and the display device is used to display the picture.

2. The device according to claim 1, characterized in that: The camera device is a high-power camera.

3. The device according to claim 1, characterized in that: The camera device is connected to the display device via a processor host.

4. The device according to claim 3, characterized in that: The processor host is provided with a switch.

5. The device according to claim 3, characterized in that: At least one of the camera device, the processor host, and the display device is provided with an alarm.

6. A method for inspecting a silicon wafer packaging box, characterized in that: The device according to any one of claims 1 to 5 comprises: Place the packaging box to be inspected under the camera device; The camera device takes a picture of the packaging box to be inspected and sends the picture to the processor host; The processor host sends the processed photos to a display device, and the display device displays the photos.

7. The method according to claim 6, characterized in that: The camera device sends the photo to the processor host, and the processor host denoises the photo and sends it to the display device.

8. The method according to claim 7, characterized in that: After the processor host denoises the photo, the positions where the silicon wafers in the photo are tilted or misaligned are marked.

9. The method according to claim 8, characterized in that: When the silicon wafer in the photo is tilted or misaligned, at least one of the camera device, the processor host, and the display device issues an alarm.

Images