Film connecting device

Abstract

The invention provides a thin film connecting device. The thin film connecting device comprises a first thin film substrate and a plurality of elastic probes, the first thin film substrate comprises a plurality of first openings penetrating through the first thin film substrate. The elastic probes respectively pass through the first openings. Each elastic probe comprises a first end and a second end. The first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

Description

Technical Field

[0001] The present invention relates to a thin film connection device, and more particularly to a thin film connection device with an elastic probe. Background Art

[0002] During the manufacturing process of integrated circuits, electrical testing is an important step to ensure that the device functions properly. For some test devices formed by using conductive glue (for example, adding conductive particles, metal pillars or metal needles to silicone), the aging degree of the test device increases significantly depending on the number of times it is used. In addition, the metal pillars or metal needles lack elasticity, and the contact stress generated on the object to be tested is also difficult to control, which can easily damage the contacts of the object to be tested. Furthermore, if a conductive glue made of silicone is used, unevenness may occur during the curing process of the silicone, and the curing process is also more complicated. Therefore, how to solve the above problems has become an important issue in this field.

[0003] The above “background technology” description is only to provide background technology, and does not admit that the above “background technology” description reveals the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above “background technology” should not be regarded as any part of this case. Summary of the invention

[0004] In view of this, in order to solve the problems of the background technology, an object of the present disclosure is to provide a thin film connecting device.

[0005] One embodiment of the present disclosure provides a thin film connection device, comprising a first thin film substrate and a plurality of elastic probes. The first thin film substrate comprises a plurality of first openings penetrating the first thin film substrate. The elastic probes respectively pass through the first openings. The elastic probes respectively comprise a first end and a second end. The first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

[0006] Accordingly, due to the thin film connection device disclosed in the present invention, the flatness of the probe, the test results of the electrical test and the service life of the thin film connection device can be improved.

[0007] The above has been a fairly broad overview of the technical features and advantages of the present disclosure, so that the detailed description of the present disclosure below can be better understood. Other technical features and advantages that constitute the subject matter of the patent application scope of the present disclosure will be described below. Those with ordinary knowledge in the technical field to which the present disclosure belongs should understand that the concepts and specific embodiments disclosed below can be used to modify or design other structures or processes to achieve the same purpose as the present disclosure. Those with ordinary knowledge in the technical field to which the present disclosure belongs should also understand that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined in the attached patent application scope. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] When referring to the embodiments and the claims in conjunction with the drawings, a more comprehensive understanding of the disclosure of the present application can be obtained, in which the same reference numerals refer to the same elements.

[0009] Figure 1 is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0010] Figure 2 and Figure 3 is a schematic diagram of a thin film substrate according to some embodiments of the present disclosure.

[0011] Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F is a schematic diagram of an opening according to some embodiments of the present disclosure.

[0012] Figure 5A and Figure 5B Schematic diagram of an opening and an elastic probe according to some embodiments of the present disclosure.

[0013] Figure 6 , Figure 7 , Figure 8 and Fig. 9 is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0014] Description of Reference Numerals

[0015] 1. Test system; 2. Test system; 3. Test system; 10. Test device; 20. Object to be tested; 21. Contact; 100. Test socket; 102. Contact piece; 200. Thin film connection device; 210. Thin film substrate; 211. Thin film substrate; 212. Thin film substrate; 210A. First surface; 210B. Second surface; 220. Elastic probe; 221. First end; 222. Second end; 300. Reinforcement member; 321. First end; 322. Second end; 323. Shell; 324. Spring; 421. Needle body; 422. Hollow part; L. Spacing; X. Direction; Y. Direction; Z. Direction; R1. Aperture; R2. Aperture; T1. Thickness; O1. Opening; SL1. Slot; SL2. Slot; SL3. Slot; SL4. Slot. DETAILED DESCRIPTION

[0016] The following description of the present disclosure is accompanied by the drawings which are incorporated into and constitute a part of the specification, and illustrates an embodiment of the present disclosure, but the present disclosure is not limited to the embodiment. In addition, the following embodiments can be properly integrated to complete another embodiment.

[0017] "One embodiment", "an embodiment", "illustrative embodiment", "another embodiment", "another embodiment", etc. mean that the embodiments described in the present disclosure may include specific features, structures or characteristics, but not every embodiment must include the specific features, structures or characteristics. Furthermore, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but may refer to the same embodiment.

[0018] In order to make the present disclosure fully understandable, the following description provides detailed steps and structures. Obviously, the implementation of the present disclosure will not be limited to the specific details known to those skilled in the art. In addition, the known structures and steps are no longer described in detail to avoid unnecessarily limiting the present disclosure. The preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the content of the detailed description, but is defined by the scope of the patent application.

[0019] It should be understood that the following disclosure provides many different embodiments or examples for implementing the different features of the present disclosure. The following describes specific embodiments or examples of components and arrangements to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, the size of the element is not limited to the disclosed range or value, but may depend on the process conditions and / or the desired properties of the device. In addition, the following description of forming a first feature "on" or "on" a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. For the sake of simplicity and clarity, various features may be drawn arbitrarily at different scales. In the accompanying drawings, some layers / features may be omitted for simplicity.

[0020] Furthermore, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the figures. The spatially relative terms are intended to encompass different orientations of the components in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0021] Figure 11 is a schematic diagram of a test system 1 of some embodiments of the present disclosure. The test system 1 includes a test device 10 and a DUT 20. In some embodiments, the test device 10 is a probe test device, including a test socket 100, a thin film connection device 200 and a reinforcement member 300. The test device 10 is used to perform electrical tests on the DUT 20. In some embodiments, the DUT 20 is an integrated circuit on a die or a wafer-level integrated circuit. However, the present disclosure is not limited thereto, and various electronic components that can transmit electrical signals can be the DUT 20 described in the present disclosure.

[0022] The thin film connection device 200 is disposed on the test socket 100 via the reinforcement member 300. In some embodiments, the test socket 100 is a printed circuit board for transmitting electrical signals between a tester (not shown) and the thin film connection device 200. In some embodiments, the reinforcement member 300 is a metal sheet or a metal block. In some embodiments, the reinforcement member 300 is an insulating material.

[0023] The thin film connection device 200 includes a thin film substrate 210 and a plurality of elastic probes 220. The elastic probes 220 are disposed in the thin film substrate 210. In some embodiments, the elastic probes 220 are vertical probes. The elastic probes 220 have a first end 221 and a second end 222, and the first end 221 and the second end 222 protrude from two opposite surfaces of the thin film substrate 210, respectively. The first end 221 of each of the elastic probes 220 abuts against the contact 102 on the test socket 100. The second end 222 of each of the elastic probes 220 is used to contact the contact 21 on the object to be tested 20. In some embodiments, the first end 221 of each of the elastic probes 220 is coplanar. In some embodiments, the second end 222 of each of the elastic probes 220 is coplanar. In some embodiments, the first end 221 and the second end 222 of each of the elastic probes 220 are located on the same axis, and the axis is a normal to the surface of the test socket 100. In some embodiments, the surface of the thin film substrate 210 (e.g. Figure 2 The normal line of the first surface 210A and / or the second surface 210B shown is parallel to the normal line of the surface of the test socket 100. For ease of understanding, Figure 1 The Z direction is shown parallel to the normal line of the surface of the test socket 100 , and the first end 221 and the second end 222 of each spring probe 220 are aligned along the Z direction.

[0024] When the test device 10 approaches the DUT 20 and contacts the contact 21 , the elastic probe 220 provides axial (e.g., Z-direction) compressive stress through the contact member 102 and the contact 21 , so that the elastic probe 220 can stably contact the contact member 102 and the contact 21 to serve as a transmission path for electrical signals between the DUT 20 and the test socket 100 .

[0025] It should be understood that the arrangement of the elastic probes 220 shown in the present disclosure is only for illustration and the present disclosure is not limited thereto. The number and arrangement of the elastic probes 220 can be set according to the requirements of the object to be tested 20 .

[0026] Figure 2 A cross-sectional view (side view) of the film substrate 210 along a plane defined by the X-direction and the Z-direction is shown. In some embodiments, the film substrate 210 includes a plurality of openings O1, and the openings penetrate the film substrate 210. The openings O1 are used to accommodate the elastic probe 220. In some embodiments, the openings O1 have substantially the same aperture on the first surface 210A and the second surface 210B of the film substrate 210, that is, the aperture R1 is equal to the aperture R2. In some embodiments, the aperture R1 is not equal to the aperture R2. In some embodiments, the aperture R1 is smaller than the aperture R2, wherein the second surface 210B is the surface closer to the object to be measured 20.

[0027] Figure 3 The cross-sectional view (top view) of the film substrate 210 along the plane defined by the X direction and the Y direction is shown. The openings O1 are arranged in a matrix and have a rectangular outline in a top view, but the present disclosure is not limited thereto, and the arrangement of the openings O1 can be changed according to the requirements of the object to be tested 20. In some embodiments, the shape of the openings O1 is the same as the cross-sectional shape of the elastic probe 220. In some embodiments, as Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F As shown, the opening O1 has other contours in a top view.

[0028] refer to Figure 4A and Figure 4B . In some embodiments, the opening O1 is circular, and the film substrate 210 further includes a plurality of slots SL1 connecting the opening O1. More specifically, the slot SL1 can be regarded as a cross-section on the film substrate 210, and the lateral dimension of the slot SL1 is very small relative to the longitudinal dimension. The slot SL1 runs through the film substrate 210, that is, the slot SL1 extends from the first surface 210A to the second surface 210B. The film substrate 210 on both sides of the slot SL1 is discontinuous and is two parts that can be displaced with each other. One opening O1 can be configured with 2 slots SL1 or 8 slots SL1. However, the present disclosure is not limited to this, and various configuration numbers of slots SL1 are all within the consideration and scope of the present disclosure.

[0029] In some embodiments, the area of ​​the opening O1 is less than or equal to the widest cross-sectional area of ​​the elastic probe 220. Therefore, when the elastic probe 220 is disposed in the opening O1, the periphery of the opening O1 is squeezed by the elastic probe 220, and the slot SL1 provides a space for the film substrate 210 to deform, so that the opening O1 expands along the direction of the slot SL1. The opening O1 can therefore provide a centripetal stress to the elastic probe 220 to clamp the elastic probe 220. Figure 5A and Figure 5B As shown, when the elastic probe 220 is placed in the opening O1, the elastic probe 220 squeezes the film substrate 210, causing the film substrate 210 near the opening O1 to deform downward (bend along the Z direction), and expand the slot SL1 (expand on the plane defined by the X direction and the Y direction), thereby expanding the area of ​​the opening O1. In other words, after the elastic probe 220 is placed in the opening O1, the opening O1 is squeezed and the slot SL1 connected to the opening O1 is expanded. Because the slot SL1 expands, the area of ​​the opening O1 expands along the slot SL1.

[0030] refer to Figure 4C In some embodiments, the opening O1 is a pentagon, and the film substrate 210 further includes a plurality of slots SL2 connecting the opening O1. The slots SL2 can be regarded as cross sections on the film substrate 210. The slots SL2 penetrate the film substrate 210, that is, the slots SL2 extend from the first surface 210A to the second surface 210B. The function of the slots SL2 is similar to that of the slots SL1, and will not be described in detail here.

[0031] refer to Figure 4D In some embodiments, the opening O1 is a parallelogram, and the film substrate 210 further includes a plurality of slots SL3 connecting the opening O1. The slots SL3 can be regarded as a cross section on the film substrate 210. The slots SL3 penetrate the film substrate 210, that is, the slots SL3 extend from the first surface 210A to the second surface 210B. The function of the slots SL3 is similar to that of the slots SL1, and will not be described in detail here.

[0032] It should be understood that the opening O1 is not limited to a pentagon or a quadrilateral, and the opening O1 may also be a convex polygon.

[0033] refer to Figure 4E In some embodiments, the opening O1 is a polygon including straight lines and curves, and the film substrate 210 further includes a plurality of slots SL4 connecting the opening O1. The slots SL4 can be regarded as a cross section on the film substrate 210. The slots SL4 penetrate the film substrate 210, that is, the slots SL3 extend from the first surface 210A to the second surface 210B. In some embodiments, the slots SL4 are curves. The function of the slots SL4 is similar to that of the slots SL1, and will not be described in detail here.

[0034] refer to Figure 4F In some embodiments, the opening O1 is an arbitrary polygon, such as a star shape.

[0035] In some embodiments, the film substrate 210 may have Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E , Figure 4F or a combination thereof. For example, the film substrate 210 includes two Figure 4A The opening O1 and the three Figure 4D In some embodiments, the shape of the opening O1 corresponds to the cross-sectional shape of the elastic probe 220, for example, they have a similar shape or have the same shape but different sizes. In some embodiments, the shape of the opening O1 depends on the cross-sectional shape of the elastic probe 220, for example, a probe with a rectangular cross-section is more suitable. Figure 4D , Figure 4E The opening O1 of the probe is more suitable for Figure 4A , Figure 4B , Figure 4C , Figure 4F If the slot is closer to the inside of the opening O1, a round probe can also be used. Figure 4E In some embodiments, the shape of the opening is the same as the cross-sectional shape of the probe. The opening and the slot are provided to form one or more protrusions in the opening O1. These protrusions are deformable because of the slots. When the probe is placed in the opening O1, these protrusions are pushed and deformed, thereby generating interference force on the probe, thereby fixing the probe. It should be understood that Figure 4A to Figure 4F These are just some possible implementations that can utilize the arrangement of openings and slots to form one or more protrusions to generate interference forces on the probes to fix the probes, and all of them do not depart from the scope of the present disclosure.

[0036] In some embodiments, the film substrate 210 comprises Mylar. In other embodiments, the film substrate 210 comprises glass. In some embodiments, the thickness T1 (thickness along the Z direction) of the film substrate 210 is less than 0.75 mm. In some embodiments, the thickness T1 of the film substrate 210 is greater than or equal to 0.75 mm.

[0037] In some prior arts, silicone rubber is used as a substrate material for a thin film connection device. However, in the process of making a silicone rubber substrate, the silicone rubber is coated with a probe in a liquid state at a relatively high temperature, and then the silicone rubber is cooled and solidified to form an insulator around the probe. The flatness of the cured silicone rubber is not easy to control, so that the contact point where the probe contacts the object to be tested is not easy to maintain on the same plane, thereby reducing the accuracy of the test. Furthermore, when silicone rubber is used as a substrate, the thickness of the substrate is limited by process technology and materials. In the prior art, the thickness of the substrate made of silicone rubber generally exceeds 0.75 mm, which results in the selected elastic probe length being only greater than 0.75 mm. In high-frequency testing, the path length of signal transmission significantly affects the test accuracy. When the substrate is thicker, the elastic probe used is longer, the path of signal transmission is longer, the impedance will increase, and the signal is easily interfered, so that the test accuracy will decrease accordingly. Moreover, the scalability of silicone rubber gradually ages with the number of uses, and the reasons include external factors such as temperature and pressure, such as high-temperature testing. Before the silicone rubber fatigues, the silicone rubber substrate may be no longer usable. However, it is difficult to predict the type and number of tests a silicone rubber substrate will participate in, so it is difficult to accurately estimate the service life of the silicone rubber substrate.

[0038] Compared to the prior art, the thin film connection device 200 provided in the present invention uses Mylar or glass as the thin film substrate 210 to overcome the problems encountered in the background art. First, the thin film substrate 210 using Mylar or glass can accurately control the flatness. Second, the thickness of the thin film substrate 210 made of Mylar or glass can be controlled below 0.75 mm, so a shorter elastic probe 220 can be used. Third, the service life of the thin film substrate 210 using Mylar or glass is much better than that of the silicone rubber substrate. In addition, compared to silicone rubber, Mylar and glass are not elastic, but have better rigidity and support, so they can still provide good support at a smaller thickness.

[0039] In some embodiments, Figure 6 As shown, the elastic probe 220 is a pogo pin. Figure 6In an embodiment of the present invention, the elastic probe 220 includes a first end 321, a second end 322, a housing 323 and a spring 324. The housing 323 is disposed in the film substrate 210. The first end 321 and the second end 322 are connected to the upper and lower sides of the housing 323, and protrude from the first surface 210A and the second surface 210B of the film substrate 210 respectively. The spring 324 is disposed in the housing 323 and abuts against the first end 321 and the second end 322 to provide elastic force. In some embodiments, the film substrate 210 may be glass, and one end of the elastic probe 220 may form a protrusion (not shown), which is used to make the elastic probe 220 stuck on the glass film substrate 210 and not fall off.

[0040] In some embodiments, the spring constants of the springs 324 in the plurality of elastic probes 220 in the thin film connecting device 200 are the same. In some embodiments, the spring constants of the springs 324 in at least two of the plurality of elastic probes 220 in the thin film connecting device 200 are different.

[0041] In some embodiments, Figure 7 As shown, the elastic probe 220 is a micro electromechanical system (MEMS) probe. Figure 7 In the embodiment of the present invention, the elastic probe 220 includes a needle body 421 and at least one hollow portion 422. The hollow portion 422 is used to provide a space when the elastic probe 220 is compressed. The needle body 421 is a monolithic structure. In other words, the elastic probe 220 is an integrally formed structure.

[0042] In some embodiments, the elastic probe 220 includes a plurality of hollow portions 422, and each hollow portion 422 is identical. In some embodiments, the hollow portions 422 of different elastic probes 220 are identical to each other. In some embodiments, the hollow portions 422 of at least two of the plurality of elastic probes 220 in the thin film connection device 200 are different.

[0043] Figure 8 is a schematic diagram of a test system 2 of some embodiments of the present disclosure. The test system 2 is similar to the test system 1, and includes a test device 10 and a test object 20. The test device 10 includes a test socket 100, a thin film connection device 200 and a reinforcement member 300. The difference from the test system 1 is that the thin film connection device 200 includes a plurality of thin film substrates 210. For ease of description, Figure 7 The two film substrates 210 are respectively denoted as a film substrate 211 and a film substrate 212 .

[0044] In the test system 2, the thin film connection device 200 is provided with two thin film substrates 211 and 212 to keep the elastic probe 220 stable according to the requirements of the elastic probe 220 (for example, when the elastic probe 220 is too long). Figure 8 As shown, the film substrate 211 and the film substrate 212 are in contact with each other, that is, the distance between the film substrate 211 and the film substrate 212 is equal to 0.

[0045] The film substrate 211 has a plurality of openings O1, and the film substrate 212 has a plurality of openings O1 of the same number as the film substrate 211, wherein the openings O1 of the film substrate 211 and the film substrate 212 are arranged corresponding to each other in a manner that allows the elastic probe 220 to pass through, forming a plurality of groups of corresponding openings. In some embodiments, at least one group of corresponding openings in the plurality of groups of corresponding openings has the same shape. In some embodiments, at least one group of corresponding openings in the plurality of groups of corresponding openings has a different shape. In some embodiments, at least two of the plurality of openings O1 of the film substrate 211 have the same shape. In some embodiments, at least two of the plurality of openings O1 of the film substrate 211 have different shapes. In some embodiments, at least two of the plurality of openings O1 of the film substrate 212 have the same shape. In some embodiments, at least two of the plurality of openings O1 of the film substrate 212 have different shapes.

[0046] Fig. 9 is a schematic diagram of a test system 3 of some embodiments of the present disclosure. The test system 3 is similar to the test system 2, and includes a test device 10 and a test object 20. The test device 10 includes a test socket 100, a thin film connection device 200, and a reinforcement member 300. The difference from the test system 2 is that the spacing L between the thin film substrate 211 and the thin film substrate 212 of the thin film connection device 200 is greater than 0.

[0047] The film substrate 211 has a plurality of openings O1, and the film substrate 212 has a plurality of openings O1 of the same number as the film substrate 211, wherein the openings O1 of the film substrate 211 and the film substrate 212 are arranged corresponding to each other in a manner that allows the elastic probe 220 to pass through, forming a plurality of groups of corresponding openings. In some embodiments, at least one group of corresponding openings in the plurality of groups of corresponding openings has the same shape. In some embodiments, at least one group of corresponding openings in the plurality of groups of corresponding openings has a different shape. In some embodiments, at least two of the plurality of openings O1 of the film substrate 211 have the same shape. In some embodiments, at least two of the plurality of openings O1 of the film substrate 211 have different shapes. In some embodiments, at least two of the plurality of openings O1 of the film substrate 212 have the same shape. In some embodiments, at least two of the plurality of openings O1 of the film substrate 212 have different shapes.

[0048] It should be understood that the number of film substrates 210 in the test system 2 and the test system 3 is only for illustration, and any number of film substrates 210 is within the consideration and scope of the present disclosure. For example, in other embodiments, the test system 2 and the test system 3 include 3 and 4 film substrates 210 respectively.

[0049] In summary, the thin film connection device of the embodiment of the present disclosure uses a Mylar or glass thin film substrate, so that the flatness of the probe, the test results of the electrical test and the service life of the thin film connection device can be improved.

[0050] Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and replacements may be made without departing from the spirit and scope of the present disclosure as defined in the claims. For example, many of the above processes may be implemented in different ways, and other processes or combinations thereof may be used to replace many of the above processes.

[0051] Furthermore, the scope of the present application is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. A person skilled in the art can understand from the disclosure of the present disclosure that existing or future developed processes, machines, manufactures, compositions of matter, means, methods, or steps that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used according to the present disclosure. Accordingly, such processes, machines, manufactures, compositions of matter, means, methods, or steps are included in the claims of the present application.

Claims

1. A thin film connecting device, comprising: The first film substrate comprises A plurality of first openings penetrate the first film substrate; as well as A plurality of elastic probes pass through the first openings respectively, wherein the elastic probes respectively include a first end and a second end, wherein the first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

2. The thin film connection device of claim 1, wherein the first thin film substrate comprises Mylar.

3. The thin film connection device according to claim 2, wherein the first thin film substrate further comprises: A plurality of slots are provided, wherein the slots penetrate the first film substrate and connect the first openings. 4 . The thin film connection device as claimed in claim 3 , wherein the grooves form at least one protruding portion of the first thin film substrate toward the first openings.

5. The thin film connection device as claimed in claim 4, wherein the area of ​​each of the first openings is smaller than the widest cross-sectional area of ​​each of the elastic probes, When the elastic probes pass through the first openings, the area of ​​each of the first openings is squeezed and expanded by the corresponding elastic probes. 6 . The thin film connection device as claimed in claim 1 , wherein the first openings have a circular shape, a convex polygonal shape, a star shape or a combination thereof. 7 . The thin film connection device as claimed in claim 1 , wherein shapes of the first openings correspond to cross-sectional shapes of the elastic probes. 8 . The thin film connection device as claimed in claim 7 , wherein the shapes of the first openings are the same as the cross-sectional shapes of the elastic probes.

9. The thin film connecting device according to claim 1, further comprising: The second film substrate comprises a plurality of second openings penetrating the second film substrate, wherein the elastic probes pass through the second openings respectively. 10 . The thin film connection device as claimed in claim 9 , wherein a distance between the first thin film substrate and the second thin film substrate is greater than 0. 11 . The thin film connection device as claimed in claim 9 , wherein a distance between the first thin film substrate and the second thin film substrate is equal to 0. 12 . The thin film connection device as claimed in claim 9 , wherein the first openings are respectively arranged to correspond to the second openings to form a plurality of groups of corresponding openings. 13 . The thin film connecting device as claimed in claim 12 , wherein the first opening and the second opening of at least one group of corresponding openings among the groups of corresponding openings are the same. 14 . The thin film connecting device as claimed in claim 12 , wherein the first opening and the second opening of at least one group of corresponding openings among the groups of corresponding openings are different.

15. The thin film connection device as claimed in claim 1, wherein the elastic probes respectively comprise springs. 16 . The thin film connection device as claimed in claim 1 , wherein the elastic probes are micro-electromechanical system probes, each comprising at least one hollow portion.

17. The thin film connection device as claimed in claim 1, wherein the thin film connection device is used to be disposed on a test socket. 18 . The thin film connection device as claimed in claim 1 , wherein the first end and the second end of each of the elastic probes are located on the same axis, wherein the axis is a normal line of a surface of the first thin film substrate.

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