Packaging shell of optical communication device and preparation method of packaging shell

Abstract

The embodiment of the invention provides a packaging shell of an optical communication device and a preparation method thereof, and the packaging shell of the optical communication device comprises a packaging pedestal; the packaging base comprises a packaging substrate and an annular wall body, and a first opening of the annular wall body is sealed on the surface of the packaging substrate; a packaging cover plate; the packaging cover plate is connected to the second opening of the annular wall body in a sealing mode. The second opening and the first opening are two opposite openings of the annular wall body in the extension direction of the annular wall body; a tail pipe device; the tail pipe device penetrates through and is fixedly arranged on the packaging cover plate; the extension direction of the tail tube device is perpendicular to the surface of the packaging substrate; when the optical communication device is arranged in the packaging base, optical signals of the optical communication device are transmitted in the direction perpendicular to the surface of the packaging substrate through the tail tube device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic packaging, and in particular to a packaging shell of an optical communication device and a preparation method thereof. Background Art

[0002] With the development of electronic packaging technology, the packaging shell of optical communication devices has become an indispensable part of this field. Among them, the packaging shell provides physical protection and electrical connection for the device. The so-called physical protection refers to the packaging shell isolating the device from the outside world to prevent impurities in the air from corroding the circuit in the device. The so-called electrical connection refers to the packaging shell adjusting the fine electrode spacing of the device to the size spacing of the mounting substrate. The packaging shell has a wide range of uses in various fields of military and national economy.

[0003] However, due to the different light emission modes of optical communication devices, the requirements of optical communication devices for packaging shells are also different. Summary of the invention

[0004] In order to solve one or more of the above problems, the embodiments of the present disclosure propose a packaging shell of an optical communication device and a preparation method thereof. In one aspect, the packaging shell of the optical communication device includes: a packaging base; the packaging base includes a packaging substrate and an annular wall, the first opening of the annular wall is sealed to the surface of the packaging substrate; a packaging cover; the packaging cover is sealed to the second opening of the annular wall; the second opening and the first opening are two openings of the annular wall opposite to each other in its extension direction; a tail pipe device; the tail pipe device penetrates and is fixedly arranged on the packaging cover; the extension direction of the tail pipe device is perpendicular to the surface of the packaging substrate; wherein, when the optical communication device is arranged in the packaging base, the optical signal of the optical communication device is transmitted through the tail pipe device in a direction perpendicular to the surface of the packaging substrate.

[0005] In some embodiments, the number of the optical communication devices is the same as the number of the tail pipe devices, and the optical communication devices correspond to the tail pipe devices one by one.

[0006] In some embodiments, an optical lens is disposed in the tail pipe device.

[0007] In some embodiments, the material of the packaging substrate includes ceramic or metal; the material of the annular wall includes ceramic or metal; the material of the packaging cover includes metal; and the material of the tail pipe device includes metal.

[0008] In some embodiments, the packaging shell further includes: a sealing ring; the sealing ring is arranged between the packaging cover plate and the annular wall.

[0009] In some embodiments, the projection shape of the outer contour of the annular wall on the surface of the packaging substrate includes one of a square, a rectangle, a diamond, a circle, and a triangle.

[0010] In some embodiments, a metallized connection area is provided in the packaging substrate and / or the annular wall.

[0011] In some embodiments, the optical communication device includes a semiconductor laser or a semiconductor detector.

[0012] On the other hand, a method for preparing a packaging shell of an optical communication device includes: forming a packaging substrate and an annular wall sealed to the surface of the packaging substrate to form a packaging base; the first opening of the annular wall is sealed to the surface of the packaging substrate; forming a packaging cover plate with a second opening sealed to the annular wall; the second opening and the first opening are two openings of the annular wall arranged opposite to each other in its extension direction; forming a tail pipe device that penetrates and is fixedly arranged on the packaging cover plate; the extension direction of the tail pipe device is perpendicular to the surface of the packaging substrate; wherein, when an optical communication device is arranged in the packaging base, the optical signal of the optical communication device is transmitted through the tail pipe device in a direction perpendicular to the surface of the packaging substrate.

[0013] In some embodiments, the method further includes: forming a sealing ring between the annular wall and the packaging cover plate.

[0014] In the embodiments of the present disclosure, the packaging shell of the optical communication device can be suitable for an optical communication device that emits light in a direction perpendicular to the surface of the packaging substrate. In this way, the optical communication device can be directly sealed on the packaging substrate in the horizontal direction, and the optical signal of the optical communication device can be transmitted in the vertical direction, thereby providing a matching packaging shell for the optical communication device that emits light vertically, thereby improving the packaging reliability of the optical communication device; on this basis, the optical signal of the optical communication device can interact with external devices through a tail pipe device extending in a direction perpendicular to the surface of the packaging substrate, thereby making the optical path transmission of the optical communication device with vertical light output / input more stable, thereby improving the transmission reliability of the optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional schematic diagram of a packaging shell of an optical communication device provided by an embodiment of the present disclosure;

[0016] Figure 2 for Figure 1 A schematic cross-sectional view of the package housing in the XZ plane is shown;

[0017] Figure 3 A schematic diagram of a three-dimensional structure after a ring-shaped wall provided in an embodiment of the present disclosure is sealed to the surface of a packaging substrate;

[0018] Figure 4 A schematic diagram of a top view of a package tail pipe and a package cover plate on an XY plane provided in an embodiment of the present disclosure;

[0019] Figure 5 A schematic diagram of a three-dimensional structure of a package tail pipe and a package cover plate provided in an embodiment of the present disclosure;

[0020] Figure 6 A schematic cross-sectional view of a packaging housing with a sealing ring provided in an embodiment of the present disclosure on an XZ plane;

[0021] Figure 7 A schematic flow chart of a method for preparing a packaging shell according to an embodiment of the present disclosure;

[0022] Figure 8 Schematic diagram of different structures in a process of preparing a packaging shell provided by an embodiment of the present disclosure.

[0023] Reference numerals

[0024] 100-packaging shell; 101-packaging base; 1011-packaging substrate; 1011a-bottom surface; 1011b-top surface; 1012-annular wall; 1012a-first opening; 1012b-second opening; 1013-first metallized connection area; 102-packaging cover; 103-tail pipe device; 104-sealing ring; 800-packaging shell of optical communication device; 801-multilayer raw ceramic sheet; 802-target hole; 803-interconnection structure; 804-wiring; 805-cavity structure; 806-packaging base; 807-metallized sealing area; 808-sealing ring; 809-packaging cover; 810-tail pipe device.

[0025] In the above drawings (which are not necessarily drawn to scale), similar reference numerals may describe similar components in different views. Similar reference numerals with different letter suffixes may represent different examples of similar components. The accompanying drawings generally illustrate various embodiments discussed herein by way of example and not limitation. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the present disclosure and the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0027] In the following description, a large number of specific details are given to provide a more thorough understanding of the present disclosure. However, it is obvious to those skilled in the art that the present disclosure can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present disclosure, some technical features known in the art are not described; that is, all features of actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0028] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0029] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present disclosure necessarily has the first element, component, region, layer or part.

[0030] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0031] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be a limitation of the present disclosure. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0032] In order to thoroughly understand the present disclosure, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present disclosure. The preferred embodiments of the present disclosure are described in detail below, but in addition to these detailed descriptions, the present disclosure may also have other implementations.

[0033] The package shell of an optical communication device is a type of electronic package, which usually has a tail pipe, a light window (such as an optical lens), and other structures for transmitting optical signals. The tail pipe is often used to fix the optical fiber, which is connected to the optical communication device. The optical signal of the optical communication device is imported or exported through the optical fiber. In practical applications, the light window can usually be used to change the optical path, capture optical signals, etc.

[0034] Optical communication devices have multiple light emission modes. For example, semiconductor lasers can be divided into two modes: surface emission and edge emission. Therefore, semiconductor lasers require different types of optical communication packaging shells to achieve the transmission of optical signals in different light emission modes. In actual operation, semiconductor lasers usually use packaging shells in edge emission mode to achieve the transmission of optical signals in edge emission mode. However, there are still many problems to be solved in the packaging shells in surface emission mode.

[0035] In view of one or more of the above problems, the present disclosure provides a packaging shell of an optical communication device, referring to Figure 1 , Figure 1 , a three-dimensional schematic diagram of a package shell of an optical communication device in an embodiment of the present disclosure is shown. The package shell 100 includes: a package base 101; the package base 101 includes a package substrate and an annular wall, and the first opening of the annular wall is sealed to the surface of the package substrate; a package cover plate 102; the package cover plate 102 is sealed to the second opening of the annular wall; the second opening and the first opening are two openings of the annular wall opposite to each other in its extension direction; a tail pipe device 103; the tail pipe device 103 penetrates and is fixedly arranged on the package cover plate 102; the extension direction of the tail pipe device 103 is perpendicular to the surface of the package substrate; when an optical communication device is arranged in the package base 101, the optical signal of the optical communication device is transmitted in a direction perpendicular to the surface of the package substrate through the tail pipe device 103.

[0036] In the embodiments of the present disclosure, the packaging shell of the optical communication device can be suitable for an optical communication device that emits light in a direction perpendicular to the surface of the packaging substrate. In this way, the optical communication device can be directly sealed on the packaging substrate in the horizontal direction, and the optical signal of the optical communication device can be transmitted in the vertical direction, thereby providing a matching packaging shell for the optical communication device that emits light vertically, thereby improving the packaging reliability of the optical communication device; on this basis, the optical signal of the optical communication device can interact with external devices through a tail pipe device extending in a direction perpendicular to the surface of the packaging substrate, thereby making the optical path transmission of the optical communication device with vertical light output / input more stable, thereby improving the transmission reliability of the optical signal.

[0037] In the detailed introduction Figure 1 Before illustrating the encapsulation shell, various directions that may be used in the following description are defined. In the present disclosure, the thickness direction of the encapsulation substrate in the encapsulation shell is defined as the first direction (i.e., the Z-axis direction). The intersecting second direction (i.e., the X-axis direction) and the third direction (i.e., the Y-axis direction) are defined in a plane perpendicular to the Z-direction. In some embodiments, the X-axis direction, the Y-axis direction, and the Z-axis direction may be perpendicular to each other. It should be noted that the horizontal direction mentioned in the text may be understood as the X-axis direction and / or the Y-direction, and the vertical direction / perpendicular direction may be understood as the Z-axis direction.

[0038] refer to Figure 2 , Figure 2 for Figure 1 The schematic cross-sectional view of the package housing in the XZ plane is shown, wherein the package base 101 includes a package substrate 1011 and an annular wall 1012. The shape of the package substrate 1011 can be one of a square, a rectangle, a rhombus, a circle, a triangle or any other suitable shape. In the embodiment disclosed in the present invention, the shape of the package substrate is a square as an example for illustration. Here, the package substrate 1011 includes two surfaces arranged opposite to each other in the Z-axis direction, such as a bottom surface 1011a and a top surface 1011b; the annular wall 1012 is sealed to a surface of the package substrate 1011, such as the top surface 1011b. The thickness of the package substrate 1011 in the Z-axis direction can be selected and set according to actual needs. For example, the thickness of the package substrate 1011 in the Z-axis direction ranges from 0.5 to 1.5 millimeters (mm). The material of the packaging substrate 1011 can be ceramic material, metal material, a combination of ceramic and metal material or any other suitable material; wherein the ceramic material includes, for example, alumina (Al2O3) ceramic, aluminum nitride (AlN) ceramic, etc.; the metal material can be a Kovar alloy material, for example, it can be one of 4J29 alloy (iron-nickel-cobalt glass sealing alloy) or 4J42 alloy (iron-nickel based alloy), molybdenum-copper alloy, and tungsten-copper alloy.

[0039] In some specific embodiments, the method for forming the packaging substrate 1011 may be, but is not limited to, a tape casting method. Exemplarily, a specific method for forming a packaging substrate made of alumina ceramic material may include: mixing ceramic powder, adhesive, plasticizer and solvent evenly to form a raw ceramic slurry, and then tape casting and cutting the raw ceramic slurry to obtain a plurality of raw ceramic sheets by a tape casting method, and after laminating the plurality of raw ceramic sheets, placing them in a high temperature environment for firing, so that the plurality of laminates have a fixed volume and obtain specific physical and chemical properties. Here, the ceramic powder may include, but is not limited to, a mixed powder of alumina powder and glass powder; the adhesive may include, but is not limited to, polyvinyl butyral; the plasticizer may include, but is not limited to, dibutyl phthalate; the solvent may include, but is not limited to, ethanol, isopropanol and ethyl acetate, etc.

[0040] Continue to refer Figure 2 , the annular wall 1012 can extend along the Z-axis direction, and its height in the Z-axis direction can be set according to actual needs, such as being set according to the height of the optical communication device in the Z-axis, and the present disclosure does not limit this. The annular wall 1012 has two openings that are relatively arranged in the Z-axis direction, namely a first opening 1012a and a second opening 1012b. Here, the first opening 1012a and the second opening 1012b have the same width in the X-axis direction. In this way, the internal environment of the packaging base can be a regular space, which is conducive to the placement or packaging of optical communication devices. In the embodiment of the present disclosure, the first opening 1012a of the annular wall is sealed to the surface of the packaging substrate 1011, such as the top surface 1011b. The second opening 1012b of the annular wall is sealed to the packaging cover plate 102. For example, refer to Figure 3 , Figure 3 It is a schematic diagram of the three-dimensional structure after the annular wall 1012 is sealed to the surface of the packaging substrate 1011.

[0041] It should be understood that the annular wall 1012 is a hollow structure, and the hollow part can be used to place optical communication devices; here, the projection shape of the outer contour of the annular wall 1012 on the surface of the packaging substrate 1011 can include one of a square, a rectangle, a rhombus, a circle, and a triangle. Exemplarily, when the projection shape of the outer contour of the annular wall 1012 on the surface of the packaging substrate 1011 includes a rectangle or a square, the annular wall 1012 can include four sequentially connected first wall panels, second wall panels, third wall panels, and fourth wall panels, and the first wall panels, second wall panels, third wall panels, and fourth wall panels can be surrounded in a ring shape. It should be noted that the projection area of ​​the outer contour of the annular wall 1012 on the XY plane is less than or equal to the projection area of ​​the packaging substrate 1011 on the XY plane, so that a closed cavity can be formed after the packaging substrate and the annular wall are sealed.

[0042] The material of the annular wall 1012 can be the same as that of the package substrate 1011; this can enhance the bonding strength between the package substrate and the annular wall. For example, the material of the annular wall 1012 can include ceramic or metal, and the ceramics include, for example, aluminum oxide (Al2O3) ceramics, aluminum nitride (AlN) ceramics, etc.; the metal can be a kovar alloy material, for example, one of 4J29 alloy or 4J42 alloy, molybdenum copper alloy, and tungsten copper alloy. In some embodiments, the annular wall 1012 can be sealed to the surface (such as the top surface) of the package substrate 1011 by welding, firing in the same process, etc.

[0043] It should be understood that the height of the annular wall in the Z-axis direction and the internal cavity space of the packaging base surrounded by the annular wall, i.e., the height of the optical communication device in the Z-axis direction and the size of the optical communication device in the XY plane can be adjusted to make the packaging base more compatible with the optical communication device.

[0044] In some specific embodiments, when the material of the annular wall is ceramic, the method of forming the annular wall 1012 may include: forming a plurality of raw ceramic sheets, laminating the plurality of raw ceramic sheets, and then performing a cavity opening operation on the plurality of raw ceramic sheets to form the annular wall after removing part of the raw ceramic material and firing at high temperature. It should be noted that the firing process for forming the annular wall and the firing process for forming the packaging substrate may be the same firing process, which can improve the bonding force between the annular wall and the packaging substrate, and can also reduce the process steps and improve the preparation efficiency.

[0045] In some embodiments, a metallized connection area may also be provided in the package base, specifically, a metallized connection area may be provided in the package substrate and / or the annular wall. In other words, the metallized connection area may be provided only in the package substrate, or only in the annular wall, or in both the package substrate and the annular wall. Here, one end of the metallized connection area may be used for welding leads, and the leads may be used for connecting to external devices; the other end of the metallized connection area may be connected to an optical communication device, so that the optical communication device can be connected to an external device through the metallized connection area. It should be noted that in some specific embodiments, the metallized connection area may also be referred to as a pad or a pin, etc.

[0046] In some specific embodiments, reference Figure 1 and Figure 2, a first metallized connection area 1013 is provided in the package substrate, and the first metallized connection area 1013 is used for welding leads, and the leads can be used to connect to external devices, so that the first metallized connection area is connected to the external device. It should be noted that the package shell can be a plug-in package shell, a flat package shell, or a leadless chip package shell; in other words, when the package shell is a leadless chip package shell, the first metallized connection area in the package substrate can be directly connected to the pin of the external device without welding leads. Here, the material of the first metallized connection area 1013 includes but is not limited to conductive materials, such as copper (Cu), gold (Au), silver (Ag), aluminum (Al), etc.

[0047] In some specific embodiments, the method for forming a first metallization connection area includes: in the process of preparing a packaging substrate made of ceramic material, after cutting to obtain multiple raw ceramic sheets, punching the raw ceramic sheets, filling the holes, and forming an interconnection structure in the holes, and then, after completing the hole filling operation, performing a printing process on the surface of the raw ceramic sheets to form wiring; wherein the interconnection structure and the wiring constitute the first metallization connection area after high-temperature firing.

[0048] In some other specific embodiments, the annular wall 1012 is further provided with a second metallization connection area ( Figure 1 and Figure 2 The second metallized connection area may also be used for welding wires to connect the second metallized connection area to an external device. It should be noted that the first metallized connection area may be connected to the second metallized connection area or not.

[0049] The method for forming a second metallized connection area includes: in the process of preparing an annular wall made of ceramic material, punching holes in a ceramic block used to form the annular wall, filling the holes, forming an interconnection structure in the holes, and performing a printing process on the surface of the ceramic block to form wiring; wherein the interconnection structure and the wiring constitute a second metallized connection area after high-temperature firing.

[0050] In the embodiment of the present disclosure, the surface of the package cover plate 102 is parallel to the surface of the package substrate 1011. The shape of the package cover plate 102 needs to be compatible with the second opening of the annular wall 1012. Exemplarily, the shape of the package cover plate 102 can be one of a square, a rectangle, a diamond, a circle, a triangle or any other suitable shape, and the projection shape of the package cover plate 102 on the XY plane is greater than or equal to the projection area of ​​the outer contour of the annular wall 1012 on the XY plane, so that the package cover plate 102 and the annular wall 1012 can be sealed. The material of the package cover plate 102 includes metal, for example, it can be one of 4J29 alloy or 4J42 alloy, molybdenum copper alloy, tungsten copper alloy, or other suitable materials. In some specific embodiments, the package cover plate 102 can be sealed on the annular wall 1012 by welding, firing in the same process, etc. to form a closed cavity.

[0051] The tail pipe device 103 penetrates and is fixedly arranged on the package cover plate 102, and the tail pipe device 103 is a hollow structure, and is used to dock with the optical communication device packaged in the package base to serve as an interface for the light output or light input of the optical signal of the optical communication device. In some specific embodiments, when the optical communication device includes an optical fiber, the tail pipe device 103 can be used to fix the optical fiber and allow the optical signal of the optical communication device to be introduced or exported through the optical fiber.

[0052] refer to Figure 4 and Figure 5 , Figure 4 It is a schematic diagram of the top view of the tail pipe device and the packaging cover plate on the XY plane; Figure 5 It is a schematic diagram of the three-dimensional structure of the tail pipe device and the packaging cover plate; wherein, the extension direction of the tail pipe device 103 is perpendicular to the surface of the packaging cover plate 102, that is, the extension direction of the tail pipe device 103 is perpendicular to the surface of the packaging substrate 1011. After the optical communication device is sealed on the packaging substrate 1011 in the horizontal direction, the light output / light input direction of the optical communication device is the vertical direction / vertical direction. The tail pipe device 103 is configured in this way so that the optical signal of the optical communication device can be transmitted in the vertical direction through the tail pipe device, that is, the packaging shell is adapted to the optical communication device with vertical light output. Here, the material of the tail pipe device 103 includes metal, for example, it can be one of 4J29 alloy or 4J42 alloy, molybdenum-copper alloy, tungsten-copper alloy, or any other suitable material.

[0053] In some embodiments, an optical lens may be further provided in the tail pipe device. The optical lens may be used to gather light, diverge light, shape the beam, correct axial aberration, correct chromatic aberration, etc. in the transmission path (or light path) of the optical signal. In this way, the optical signal of the optical communication device may be refracted, reflected, etc. during the transmission process to improve the brightness, luminosity and focusing effect of the optical signal, thereby improving the utilization rate of light in the optical communication device.

[0054] In the disclosed embodiment, the tail pipe device 103 and the package cover plate 102 can be formed in the same process technology, which can reduce the process time and improve the process efficiency. In other embodiments, the tail pipe device 103 and the package cover plate 102 can also be formed in different process technologies, so that the process parameters in the corresponding process can be adjusted according to different needs, so that the process environment is more suitable for the corresponding structure (such as the tail pipe device 103, the package cover plate 102), thereby improving the reliability of the structure.

[0055] It should be noted that the packaging cover plate 102 can be directly sealed to the second opening 1012b of the annular wall, or can be indirectly sealed to the second opening 1012b of the annular wall. Figure 2 When the height of the optical communication device in the Z-axis direction is smaller than the height of the packaging base 101 in the Z-axis direction, the packaging cover 102 can be directly sealed to the second opening 1012b of the annular wall. Figure 6 When the height of the optical communication device in the Z-axis direction is greater than the height of the packaging base 101 in the Z-axis direction, the packaging cover 102 can be indirectly sealed to the second opening 1012b of the annular wall by increasing the height of the packaging base, that is, a height-increasing structure such as a sealing ring is set between the packaging cover 102 and the annular wall 1012.

[0056] Based on this, in some embodiments, reference Figure 6 , Figure 6 It is a schematic cross-sectional view of a packaging shell with a sealing ring in the XZ plane; wherein the packaging shell also includes: a sealing ring 104, which is arranged between the packaging cover plate 102 and the annular wall to increase the internal space of the packaging base in the Z-axis direction. It should be noted that the sealing ring can also be used to enhance the adhesion and airtightness between the packaging cover plate and the annular wall. Here, the material of the sealing ring 104 includes metal, for example, it can be one of 4J29 alloy or 4J42 alloy, molybdenum-copper alloy, tungsten-copper alloy, or any other suitable material.

[0057] In some embodiments, the sealing ring is an annular structure, and the sealing ring and the annular wall have a common central axis, that is, the sealing ring and the annular wall are in a concentric axis relationship.

[0058] It should be noted that the related art usually adopts a packaging shell with side light emission, that is, the tail pipe device penetrates and is fixedly sealed on the annular wall, and the extension direction of the tail pipe device is parallel to the surface of the packaging substrate, such as the horizontal direction. The light emission direction of the optical communication device is usually perpendicular to the structural extension direction of the optical communication device, and the structural extension direction of the optical communication device is usually horizontal (such as the X-axis direction or the Y-axis direction), that is, the light emission direction of the optical communication device is usually vertical. Therefore, when the optical communication device is packaged in the packaging base, the optical communication device needs to be placed in the vertical direction so that the optical signal of the optical communication device can be emitted or incident along the extension direction of the tail pipe device. In the process of placing the optical communication device vertically, it may have a certain impact on the reliability of the optical communication device, reducing the performance and utilization of the optical signal.

[0059] In the embodiment of the present disclosure, the optical communication device can be sealed on the packaging substrate of the packaging base in the horizontal direction, and the optical signal (outgoing light or incoming light) of the optical communication device can be transmitted in a direction perpendicular to the surface of the packaging substrate through the tail pipe device. In other words, the packaging shell provided in the embodiment of the present disclosure can be used for optical communication devices that emit light in a direction perpendicular to the surface of the packaging substrate. In this way, on the one hand, a matching packaging shell can be provided for optical communication devices that emit light vertically, thereby improving the packaging reliability of the optical communication device; on the other hand, the tail pipe device is designed to extend in a direction perpendicular to the surface of the packaging substrate, so that the optical signal of the optical communication device can interact with the external device in the same direction through the tail pipe device, so that the optical path transmission of the optical communication device with vertical light output / incoming light is more stable and the light output efficiency is higher, thereby improving the transmission reliability of the optical signal.

[0060] In some embodiments, the optical communication device may include a semiconductor laser or a semiconductor detector. After the semiconductor laser is sealed on the packaging substrate in the horizontal direction, the optical signal of the semiconductor laser is vertically emitted in a direction perpendicular to the surface of the packaging substrate; after the semiconductor detector is sealed on the packaging substrate in the horizontal direction, the optical signal of the semiconductor detector is vertically incident in a direction perpendicular to the surface of the packaging substrate.

[0061] In some embodiments, the number of tail pipe devices is the same as the number of optical communication devices, and the optical communication devices correspond to the tail pipe devices one by one.

[0062] Among them, based on the different sizes in the packaging base, one or more optical communication devices can be packaged in the packaging base; when an optical communication device is packaged in the packaging base, a tail pipe device can be set on the packaging cover plate, so that the adaptability of the optical communication device and the tail pipe device can be improved, the flexibility of the optical communication device can be improved, and the manufacturing difficulty can be reduced. When multiple optical communication devices are packaged in the packaging base, multiple tail pipe devices can be set on the packaging cover plate, wherein the multiple tail pipe devices correspond to the multiple optical communication devices one by one; in this way, the manufacturing cost can be reduced without affecting the transmission of optical signals. In addition, when the multiple optical communication devices are different devices, the adaptability range of the optical communication device packaging shell can also be improved.

[0063] Based on the above-mentioned packaging shell of the optical communication device, the embodiment of the present disclosure also provides a method for preparing the packaging shell of the optical communication device, wherein, with reference to Figure 7 , Figure 7 A method for preparing a packaging shell of an optical communication device is provided, the method comprising the following steps:

[0064] Step S701: forming a packaging substrate and an annular wall sealed to the surface of the packaging substrate to form a packaging base; a first opening of the annular wall is sealed to the surface of the packaging substrate.

[0065] Step S702: forming a packaging cover plate sealed to a second opening of the annular wall; the second opening and the first opening are two openings of the annular wall that are oppositely arranged in the extending direction thereof.

[0066] Step S703: forming a tail pipe device that penetrates and is fixedly disposed on the package cover plate; the extension direction of the tail pipe device is perpendicular to the surface of the package substrate;

[0067] Wherein, when an optical communication device is arranged in the package base, an optical signal of the optical communication device is transmitted in a direction perpendicular to the surface of the package substrate through the tail pipe device.

[0068] It should be understood that Figure 7 The steps shown in the operation are not exclusive, and other steps may be performed before, after or between any steps in the operation shown; Figure 7 The steps shown in the figure can be adjusted in sequence according to actual needs. Figure 8 The schematic diagram of the structure corresponding to different stages in the preparation process of the package shell of the optical communication device provided in the embodiment of the present disclosure is as follows. Figures 7 and 8 A method for preparing a packaging shell of an optical communication device provided in an embodiment of the present disclosure is introduced in detail.

[0069] In step S701, refer to Figure 8In (1), when the material of the packaging substrate is a ceramic material, a plurality of single-layer green ceramic sheets can be formed by tape casting, and the plurality of single-layer green ceramic sheets are stacked in the Z-axis direction to form a multi-layer green ceramic sheet 801 (the multi-layer green ceramic sheets are fired to obtain a packaging substrate). One method of forming a single-layer green ceramic sheet by tape casting has been described above and will not be repeated here.

[0070] refer to Figure 8 In (2), the multi-layer raw ceramic sheet 801 is punched, such as by laser punching, to form the desired target hole 802; here, the target hole penetrates the multi-layer raw ceramic sheet, and the shape of the target hole is, for example, circular, elliptical, etc. In some embodiments, the order of lamination and punching can be reversed, for example, after punching each single-layer raw ceramic sheet, the punched single-layer raw ceramic sheets are stacked in the Z-axis direction, and the present disclosure is not limited to this.

[0071] refer to Figure 8 In (3), the target hole is filled to form an interconnection structure 803. The material of the interconnection structure includes but is not limited to a conductive material, such as tungsten (W), Cu, Au, Ag, Al, etc. The filling process includes but is not limited to a coating process. Figure 8 In (4), the surface of the multilayer green ceramic sheet is printed to form wiring 804 (wiring 804 and interconnection structure 803 form a metallized connection area after firing). Wiring 804 is connected to interconnection structure 803. The printing process is relatively mature and will not be described in detail here.

[0072] refer to Figure 8 In (5), when the material of the annular wall is ceramic, a plurality of single-layer raw porcelain sheets can be formed by a casting method, and the plurality of single-layer raw porcelain sheets are stacked to form a multi-layer raw porcelain sheet; the multi-layer raw porcelain sheet is subjected to a cavity opening operation to form a plurality of cavity structures 805 (the cavity structure 805 is fired to form an annular wall).

[0073] refer to Figure 8 In (6), a plurality of cavity structures 805 are sealed on a multilayer green ceramic sheet 801 having interconnection structures and wiring. Figure 8 In (7), the plurality of cavity structures 805 and the corresponding multi-layer green ceramic sheet 801 are thermally cut to form a plurality of independent cavity structures 805. Figure 8 In (8), side printing is performed on the side of the cavity structure 805, and then degreasing and sintering are performed, so that an independent package base 806 can be formed. Here, the package base 806 includes a package substrate and a ring wall, and the package base 806 has a metallized connection area. Figure 8 In (9), the package base 806 is nickel plated to form a metallized sealing area 807 on the top surface of the package base 806. The metallized sealing area can improve solderability.

[0074] In step S702 and step S703, refer to Figure 8 In (10), a sealing ring 808 is formed on the package base 806. Specifically, the metallized sealing area 807 is located between the sealing ring 808 and the package base 806. Here, the sealing ring 808 and the annular wall in the package base 806 are both hollow structures, and the sealing ring and the annular wall are in a coaxial relationship. The sealing ring can be fixed to the package base by welding.

[0075] A packaging cover plate 809 and a tail pipe device 810 that penetrates the packaging cover plate 809 and is fixedly disposed in the packaging cover plate 809 are formed. The extension direction of the tail pipe device 810 is perpendicular to the surface of the packaging cover plate 809. The tail pipe device 810 is a hollow structure that can pass through a connecting structure or device, such as an optical fiber. Then, the packaging cover plate 809 fixed with the tail pipe device 810 is sealed on the sealing ring 808 to form a packaging shell 800 of the optical communication device. The packaging cover plate 809 can be sealed on the sealing ring 808 by welding.

[0076] It should be noted that before the packaging cover is sealed to the sealing ring, the optical communication device is packaged in the packaging base, and the light emitting / light incident direction of the optical communication device is perpendicular to the surface of the packaging substrate.

[0077] In some embodiments, the method further comprises: performing a gold plating operation on the entire package shell 800 of the optical communication device to form a gold layer on the entire surface of the package shell. The gold layer can be used to prevent oxidation and corrosion, enhance corrosion resistance, improve aesthetics and reliability.

[0078] Based on this, the packaging shell of the optical communication device prepared by the above method can be suitable for optical communication devices that emit light in a direction perpendicular to the surface of the packaging substrate. In this way, the optical communication device can be directly sealed on the packaging substrate in the horizontal direction, and the optical signal of the optical communication device can be transmitted in the vertical direction, thereby providing a matching packaging shell for the optical communication device that emits light vertically, thereby improving the packaging reliability of the optical communication device; on this basis, the optical signal of the optical communication device can interact with external devices through the tail pipe device extending in a direction perpendicular to the surface of the packaging substrate, thereby making the optical path transmission of the optical communication device with vertical light output / input more stable, thereby improving the transmission reliability of the optical signal.

[0079] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present disclosure. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present disclosure, the size of the serial number of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure. The serial numbers of the embodiments of the present disclosure are for description only and do not represent the advantages and disadvantages of the embodiments.

[0080] The above description is only a preferred embodiment of the present disclosure, and does not limit the patent scope of the present disclosure. All equivalent structural changes made by using the contents of the present disclosure and the drawings under the inventive concept of the present disclosure, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present disclosure.

Claims

1. A packaging shell for an optical communication device, characterized in that: The packaging shell comprises: A packaging base; the packaging base comprises a packaging substrate and an annular wall, wherein a first opening of the annular wall is sealed to a surface of the packaging substrate; A packaging cover plate; the packaging cover plate is sealed to the second opening of the annular wall; the second opening and the first opening are two openings of the annular wall opposite to each other in its extending direction; Tail pipe device; the tail pipe device penetrates and is fixedly arranged on the packaging cover plate; the extension direction of the tail pipe device is perpendicular to the surface of the packaging substrate; Wherein, when the optical communication device is arranged in the packaging base, the optical signal of the optical communication device is transmitted through the tail pipe device in a direction perpendicular to the surface of the packaging substrate.

2. The packaging shell according to claim 1, characterized in that: The number of the optical communication devices is the same as the number of the tail pipe devices, and the optical communication devices correspond to the tail pipe devices one by one.

3. The packaging shell according to claim 2, characterized in that: An optical lens is arranged in the tail pipe device.

4. The packaging shell according to claim 1, characterized in that: The material of the packaging substrate includes ceramic or metal; the material of the annular wall includes ceramic or metal; the material of the packaging cover includes metal; and the material of the tail pipe device includes metal.

5. The packaging shell according to claim 1, characterized in that: The packaging shell further includes: a sealing ring; the sealing ring is arranged between the packaging cover plate and the annular wall.

6. The packaging shell according to claim 1, characterized in that: The projection shape of the outer contour of the annular wall on the surface of the packaging substrate includes one of a square, a rectangle, a diamond, a circle, and a triangle.

7. The packaging shell according to claim 1, characterized in that: A metallized connection area is provided in the packaging substrate and / or the annular wall.

8. The packaging shell according to claim 1, characterized in that: The optical communication device includes a semiconductor laser or a semiconductor detector.

9. A method for preparing a packaging shell of an optical communication device, characterized in that: The method comprises: A packaging substrate and an annular wall sealed to the surface of the packaging substrate are formed to form a packaging base; the first opening of the annular wall is sealed to the surface of the packaging substrate; A packaging cover plate is formed and sealed to a second opening of the annular wall; the second opening and the first opening are two openings of the annular wall that are arranged opposite to each other in the extending direction thereof; A tail pipe device is formed to penetrate and be fixedly arranged on the package cover plate; the extension direction of the tail pipe device is perpendicular to the surface of the package substrate; Wherein, when an optical communication device is arranged in the packaging base, an optical signal of the optical communication device is transmitted through the tail pipe device in a direction perpendicular to the surface of the packaging substrate.

10. The preparation method according to claim 9, characterized in that: The method further comprises: A sealing ring is formed between the annular wall and the packaging cover plate.

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