Comprehensive heat dissipation module

Abstract

The invention relates to the technical field of computer accessories, and discloses a comprehensive heat dissipation module which comprises a heat conduction pipe, a first heat conduction plate and a second heat conduction plate. A heat conduction column is arranged outside the heat conduction block, and the heat conduction block and the heat conduction column are both installed in the middle of the first heat conduction plate and make contact with the outer wall of the heat conduction pipe; and a second extension plate is arranged on one side of the exterior of the first extension plate, the first extension plate and the second extension plate are located on the two sides of the top face of the first heat conduction plate correspondingly, and the first extension plate and the second extension plate are connected with the exterior of the heat conduction column and used for guiding heat of the first heat conduction plate to the heat conduction pipe through the first extension plate, the second extension plate and the heat conduction column. Multi-path heat conduction can be formed through the heat conduction block, the heat conduction column, the first extension plate and the second extension plate, so that heat can be dispersed and conducted to the heat conduction pipe, the problem of heat concentration of a single channel is avoided, the overall heat dissipation process is accelerated, the heat load of the heat dissipation assembly is effectively reduced, and the service life of electronic elements is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of computer accessories, in particular to a comprehensive heat dissipation module. Background Art

[0002] The integrated heat dissipation module is a device that integrates multiple heat conduction and heat dissipation components, and is mainly used for heat dissipation management of electronic equipment. With the continuous improvement of the performance of computers and electronic equipment, the power and heat output of components have increased significantly. In order to ensure the continuous and stable operation of the equipment in a high temperature environment, the heat dissipation module is particularly critical in terms of heat dissipation efficiency and structural design. The integrated heat dissipation module ensures efficient heat transfer and release by optimizing the heat conduction path and increasing the heat dissipation surface area, preventing the performance degradation or damage of the equipment due to overheating. It is widely used in electronic products with high heat dissipation requirements such as computers, servers, and communication equipment.

[0003] At present, heat dissipation modules are usually composed of components such as heat pipes, heat conduction plates and heat conduction blocks. These components form a complete heat conduction path in structure, transferring heat from the heat source to the heat pipe through the heat conduction plate, and then dissipating the heat into the air through structures such as fins to achieve rapid heat dissipation. Heat pipes and heat conduction plates are the main heat conduction components, fins are responsible for increasing the heat dissipation area, and heat conduction blocks help increase the contact area with the heat source, thereby improving heat dissipation efficiency.

[0004] In existing heat dissipation module technology, the contact area between the heat conducting plate and the heat conducting pipe is usually small, which limits the effective transfer of heat. Since the heat conducting plate and the heat conducting pipe often rely on the contact of only some areas for heat conduction in structure, the thermal resistance increases and the heat cannot be smoothly transferred to various parts of the heat dissipation component. Especially under high heat load conditions, heat accumulation will occur, reducing the heat dissipation efficiency. In addition, due to the lack of a multi-path conduction structure, the heat is concentrated in a single conduction path, which further limits the heat diffusion rate and heat dissipation uniformity, making the existing heat dissipation module obviously insufficient in terms of efficient heat dissipation. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a comprehensive heat dissipation module, which solves the problems in the prior art that the contact between the heat conductive plate and the heat conductive pipe in a partial area causes heat accumulation and reduces the heat dissipation efficiency, and due to the lack of a multi-path conduction structure, the heat is concentrated in a single conduction path, limiting the heat diffusion rate and heat dissipation uniformity.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a comprehensive heat dissipation module, comprising:

[0007] A heat conducting pipe, wherein a heat conducting plate 1 is arranged in the middle thereof and a heat conducting plate 2 is arranged on one side thereof, wherein the heat conducting plate 1 and the heat conducting plate 2 are used to guide heat to be transferred to the heat conducting pipe;

[0008] A heat-conducting block, with a heat-conducting column disposed outside thereof, and the heat-conducting block and the heat-conducting column are both installed in the middle of the heat-conducting plate 1, and the heat-conducting block and the heat-conducting column are in contact with the outer wall of the heat-conducting pipe;

[0009] Extension plate 1 has extension plate 2 on its outer side, and extension plate 1 and extension plate 2 are respectively located on both sides of the top surface of heat conducting plate 1, and extension plate 1 and extension plate 2 are connected to the outside of the heat conducting column, so as to guide the heat of heat conducting plate 1 to the heat conducting pipe through extension plate 1, extension plate 2 and the heat conducting column.

[0010] Preferably, a cover plate is provided on the top surface of one side of the heat pipe, the cover plate is fixedly connected to the top surface of the first heat conducting plate, a second groove is provided on the bottom surface of the cover plate, and the top surface of one side of the heat pipe is located inside the second groove.

[0011] Preferably, a groove one is opened in the middle of the top surface of the heat conducting plate one, the bottom surface of one side of the heat conducting pipe is fixedly connected to the inside of the groove one, the heat conducting block is fixed in the middle of the groove one, and the heat conducting column is fixed to the side wall of the groove one.

[0012] Preferably, a mounting plate is fixedly connected to the bottom of the outer wall of the cover plate, a screw 1 is provided in the middle of the mounting plate, and the screw 1 is threadedly connected to a heat conducting plate 1.

[0013] Preferably, a curved plate is fixedly connected to the middle of the two top surfaces of the heat conducting plate, and the curved plate is in contact with the outer wall of the middle of the heat conducting tube.

[0014] Preferably, an embedding groove is provided in the middle of the two top surfaces of the heat conducting plate, and the bottom surface of the outer wall in the middle of the heat conducting pipe is fixedly connected to the bottom surface of the inner wall of the embedding groove.

[0015] Preferably, a horizontal plate is arranged above the top surface of the second heat conducting plate, and fins are fixedly connected to both sides of the bottom surface of the horizontal plate, the bottom surfaces of the fins on both sides are in contact with both sides of the top surface of the second heat conducting plate, and the middle part of the bottom surface of the horizontal plate is in contact with the top surface of the middle part of the heat conducting tube.

[0016] Preferably, the height of the arc-shaped plate is the same as the height of the fin, and the side wall of the fin is in contact with the outer wall of the arc-shaped plate.

[0017] Preferably, a plurality of fins are provided, and the plurality of fins are evenly distributed on both sides of the bottom surface of the transverse plate.

[0018] Preferably, a side plate is fixedly connected to the outer side of the middle portion of the bottom surface of the transverse plate, and a second screw is provided at the bottom of the side plate, and the second screw is threadedly connected to the top surface of the second heat conducting plate.

[0019] Working principle: When in use, after heat conducting plate 1 and heat conducting plate 2 absorb heat, heat conducting plate 1 will transfer the heat directly to the heat conducting pipe, and the heat will also enter the heat conducting pipe along the heat conducting block and the heat conducting column. At the same time, extension plate 1 and extension plate 2 will also guide the heat of heat conducting plate 1 to absorb, and then enter the heat conducting pipe along the heat conducting column, thereby increasing the contact area between the heat conducting pipe and heat conducting plate 1, and the heat can be directly transferred to the heat conducting pipe, and the heat can be transferred along the extension plate, the heat conducting block and the heat conducting column, so the effect of multi-path heat transfer can be achieved, thereby accelerating the heat transfer, and when heat conducting plate 2 receives the heat, the heat will also be directly transferred to the middle part of the heat conducting pipe, and the heat will also enter the heat conducting pipe along the arc plate, finally, the heat can also enter the cross plate along the fins and finally be transferred to the heat conducting pipe, thereby realizing multi-path transfer of heat of heat conducting plate 2, and multiple fins are provided, so multi-point contact between the cross plate and heat conducting plate 2 can be achieved, thereby accelerating the speed of heat transfer.

[0020] The present invention provides a comprehensive heat dissipation module. It has the following beneficial effects:

[0021] 1. The present invention can transfer heat to the heat pipe through the heat conducting plate 1 and the heat conducting plate 2, and can form multi-path heat conduction through the heat conducting block, the heat conducting column, and the extension plate 1 and the extension plate 2, so that the heat can be dispersedly conducted to the heat pipe, thereby avoiding the problem of heat concentration in a single channel, thereby accelerating the overall heat dissipation process, effectively reducing the heat load of the heat dissipation component, and extending the service life of the electronic components.

[0022] 2. The present invention can fix one side of the heat pipe through the cover plate, and the cover plate, heat conducting plate 1 and the heat conducting pipe can be engaged with each other through groove 1 and groove 2, thereby ensuring that the connection between the components is tight and not easy to loosen, which not only improves the heat dissipation efficiency of the heat dissipation module, but also improves the durability and reliability of the product during use.

[0023] 3. The present invention can transfer heat to the heat pipe through the arc plate, and can also transfer heat to the heat pipe through the fins and the cross plate, thereby realizing multi-path heat transfer of the second heat conducting plate, and multiple fins are in contact with the second heat conducting plate, thereby further improving the efficiency of heat transfer and thus improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 This is a partial structural diagram of the cover plate of the present invention;

[0026] Figure 3 This is a partial structural diagram of the extension plate of the present invention;

[0027] Figure 4A bottom view of the cover plate of the present invention;

[0028] Figure 5 The fin part structure of the present invention is split;

[0029] Figure 6 It is a schematic diagram of the structure of the arc plate part of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the side plate of the present invention;

[0031] Figure 8 It is a partial structural schematic diagram of the heat conduction pipe of the present invention.

[0032] Among them, 1. heat pipe; 2. heat conduction plate 1; 3. heat conduction plate 2; 4. heat conduction block; 5. heat conduction column; 6. extension plate 1; 7. extension plate 2; 8. cover plate; 9. groove 1; 10. groove 2; 11. mounting plate; 12. screw 1; 13. curved plate; 14. embedded groove; 15. horizontal plate; 16. fin; 17. side plate; 18. screw 2. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the specification of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Please see attached Figure 1 , Figure 2 , Figure 3 and Figure 8 The embodiment of the present invention provides a comprehensive heat dissipation module, including: a heat pipe 1, wherein a heat conducting plate 2 is arranged in the middle, and a heat conducting plate 2 3 is arranged on one side, and the heat conducting plate 2 and the heat conducting plate 2 3 are used to guide the heat to be transferred to the heat pipe 1; a heat conducting block 4, wherein a heat conducting column 5 is arranged on the outside, and the heat conducting block 4 and the heat conducting column 5 are both installed in the middle of the heat conducting plate 2, and the heat conducting block 4 and the heat conducting column 5 are in contact with the outer wall of the heat conducting pipe 1; an extension plate 6, wherein an extension plate 2 7 is arranged on one side of the outside, and the extension plate 1 6 and the extension plate 2 7 are respectively located on both sides of the top surface of the heat conducting plate 2, and the extension plate 1 6 and the extension plate 2 7 are connected to the outside of the heat conducting column 5, and are used to guide the heat of the heat conducting plate 2 through the extension plate 1 6, the extension plate 2 7 and the heat conducting column 5 to the heat conducting pipe 1.

[0035] In the present invention, the synergistic effect of the heat pipe 1, the heat plate 1 2, the heat plate 2 3, the heat block 4, the heat column 5, the extension plate 1 6 and the extension plate 2 7 is relied upon to achieve efficient heat conduction and dispersion. First, when the heat generated inside the device is transferred to the heat dissipation module through the heat plate 1 2 and the heat plate 2 3, the heat plate 1 2 and the heat plate 2 3 respectively undertake the tasks of preliminary heat collection and conduction. After the heat plate 1 2 and the heat plate 2 3 absorb the heat from the electronic components, they transfer part of the heat to the heat pipe 1 through direct contact with the heat pipe 1. At this time, the heat block 4 can also transfer heat to the outer wall of the heat pipe 1. At the same time, the heat column 5, as an auxiliary structure for heat conduction, further optimizes the heat flow path between the heat block 4 and the heat pipe 1, so that the heat can be smoothly transferred from the heat plate 1 2 to the inside of the heat pipe 1, thereby accelerating the heat dissipation process.

[0036] In addition, the extension plate 1 6 and the extension plate 2 7 are connected to the heat-conducting column 5 to further improve the efficiency of heat conduction. After the heat-conducting plate 1 absorbs heat, this part of the heat is not only transferred along the direct contact surface between the heat-conducting plate and the heat-conducting tube 1, but also through the extension structure of the extension plate 1 6 and the extension plate 2 7, and through the heat-conducting column 5 to achieve multi-path conduction. Specifically, the extension plate 1 6 and the extension plate 2 7 are respectively located on both sides of the top surface of the heat-conducting plate 2, forming an extended path for heat conduction. When the heat passes through the extension plate, the heat-conducting column 5, as an important connecting component, further guides the heat conducted by the extension plate to the outer wall of the heat-conducting tube 1. This multi-path heat conduction design effectively avoids the heat accumulation phenomenon in a single path, so that the heat can be evenly distributed throughout the entire heat dissipation module, improving the overall efficiency of the heat dissipation system, while also ensuring the stability and reliability of the heat dissipation module under high temperature load.

[0037] Please see attached Figure 1-Figure 4 , a cover plate 8 is provided on the top surface of one side of the heat conducting pipe 1, and the cover plate 8 is fixedly connected to the top surface of the heat conducting plate 2, and a groove 10 is provided on the bottom surface of the cover plate 8, and the top surface of one side of the heat conducting pipe 1 is located inside the groove 10. A groove 9 is provided in the middle of the top surface of the heat conducting plate 2, and the bottom surface of one side of the heat conducting pipe 1 is fixedly connected inside the groove 9, and the heat conducting block 4 is fixed in the middle of the groove 9, and the heat conducting column 5 is fixed on the side wall of the groove 9. A mounting plate 11 is fixedly connected to the bottom of the outer wall of the cover plate 8, and a screw 12 is provided in the middle of the mounting plate 11, and the screw 12 is threadedly connected to the heat conducting plate 2.

[0038] In the present invention, a cover plate 8 is provided on the top surface of one side of the heat pipe 1, and the cover plate 8 is connected to the top surface of the heat conducting plate 2 in a tightly fixed manner. Therefore, the overall stability of the heat dissipation module is improved, and the close contact between the heat pipe 1, the heat conducting plate 2 and the cover plate 8 is ensured, thereby improving the heat conduction efficiency. A groove 2 10 is designed on the bottom surface of the cover plate 8, and the top surface of one side of the heat pipe 1 is embedded in the groove 2 10. This embedded structural design effectively increases the contact area between the heat pipe 1 and the cover plate 8, so that the heat can be more efficiently conducted to the cover plate 8 and other parts of the heat dissipation system. In addition, a groove 9 is also provided in the middle of the top surface of the heat conducting plate 2, and the bottom surface of one side of the heat pipe 1 is embedded in the groove 9 in a fixed manner, which not only improves the stability of the heat pipe 1, but also ensures that the heat can be directly conducted from the bottom surface of the heat pipe 1 to the heat conducting plate 2, thereby achieving faster heat transfer.

[0039] At the same time, the design of groove 9 also provides an installation position for the heat conducting block 4 and the heat conducting column 5, further optimizing the heat conduction path. The heat conducting block 4 is fixed in the middle of the groove 9, and is in close contact with the heat conducting pipe 1, which can quickly absorb and conduct the heat from the heat conducting plate 2, so that the heat can be transferred to the inside of the heat conducting pipe 1 in a more efficient manner, avoiding the problem of local heat accumulation. In addition, a heat conducting column 5 is fixed on the side wall of the groove 9, which not only plays the role of connecting support, but also further optimizes the path of heat transfer. The heat conducting column 5 forms an effective heat channel with the heat conducting block 4 through the side wall, so that the heat can be more evenly distributed to the surface of the heat conducting pipe 1, thereby improving the overall heat dissipation efficiency of the heat dissipation module. Therefore, it not only improves the connection strength between the components, but also greatly optimizes the heat conduction efficiency, providing a more stable and reliable heat dissipation effect for the equipment.

[0040] Please see attached Figure 1 , Figure 5 and Figure 6 The middle of the top surface of the heat conducting plate 2 3 is fixedly connected with an arc plate 13, and the arc plate 13 contacts the outer wall of the middle part of the heat conducting tube 1. The middle of the top surface of the heat conducting plate 2 3 is provided with an embedding groove 14, and the bottom surface of the outer wall of the middle part of the heat conducting tube 1 is fixedly connected to the bottom surface of the inner wall of the embedding groove 14.

[0041] In the present invention, the arc plate 13 is close to the outer wall of the middle part of the heat pipe 1, so the contact area between the arc plate 13 and the heat pipe 1 can be maximized, and the efficiency of heat transfer from the heat plate 23 to the heat pipe 1 is effectively improved. And the arc structure has good fit, which can ensure that the heat dissipation efficiency will not be reduced due to poor contact during the heat transfer process, and the heat can be distributed more evenly to the middle part of the heat pipe 1, and the problem of local heat concentration that may occur due to the short heat conduction path is avoided. In addition, a groove 14 is opened in the middle of the top surface of the heat plate 23, and the inner wall of the groove 14 is fixedly connected to the bottom surface of the outer wall of the heat pipe 1, so that a stable support structure can be provided for the heat pipe 1, and at the same time, the close combination between the heat plate 23 and the heat pipe 1 is ensured, and the gaps and voids that may be generated during the installation process are reduced, and the thermal resistance is further reduced. At the same time, the heat can smoothly enter the middle part of the heat pipe 1 through the arc plate 13, and quickly diffuse to the entire heat dissipation module. While improving the heat dissipation effect, the overall stability and durability of the module are also increased.

[0042] Please see attached Figure 1 , Figure 5 , Figure 6 , Figure 7 and Figure 8 A horizontal plate 15 is provided above the top surface of the heat conducting plate 23, and fins 16 are fixedly connected to both sides of the bottom surface of the horizontal plate 15. The bottom surfaces of the fins 16 on both sides are in contact with both sides of the top surface of the heat conducting plate 23, and the middle part of the bottom surface of the horizontal plate 15 is in contact with the top surface of the middle part of the heat conducting pipe 1. The height of the arc plate 13 is the same as the height of the fin 16, and the side wall of the fin 16 is in contact with the outer wall of the arc plate 13. There are multiple fins 16, and the multiple fins 16 are evenly distributed on both sides of the bottom surface of the horizontal plate 15. A side plate 17 is fixedly connected to the outer side of the middle part of the bottom surface of the horizontal plate 15, and a screw 2 18 is provided at the bottom of the side plate 17, and the screw 2 18 is threadedly connected to the top surface of the heat conducting plate 23.

[0043] In the present invention, fins 16 are fixedly connected to both sides of the bottom surface of the cross plate 15 so that they are in close contact with the top surfaces of both sides of the heat conducting plate 23. Therefore, after the heat conducting plate 23 absorbs heat, the heat can be quickly transferred to the cross plate 15 through the fins 16. The existence of the fins 16 not only increases the heat conduction path, but also increases the heat dissipation surface area, so that the heat can be more quickly conducted from the heat conducting plate 23 to the cross plate 15. The middle part of the bottom surface of the cross plate 15 is in direct contact with the top surface of the middle part of the heat conducting pipe 1, so that the heat from the heat conducting plate 23 can be transferred to the heat conducting pipe 1 in a multi-path manner through the fins 16 and the cross plate 15, ensuring that the heat can be quickly and efficiently conducted to the heat dissipation module. Therefore, the heat can not only be smoothly conducted to the heat conducting pipe 1, but also form multiple heat dissipation paths between the heat conducting plate, the fins 16 and the cross plate 15, thereby significantly improving the overall heat dissipation efficiency.

[0044] In addition, the height of the curved plate 13 is the same as the height of the fin 16, so that the side wall of the fin 16 can fit closely to the outer wall of the curved plate 13, forming a continuous heat-conducting structure, avoiding interruptions in the heat dissipation path, and multiple fins 16 are evenly distributed on both sides of the bottom surface of the horizontal plate 15, which helps to evenly transfer and dissipate heat and prevent the heat accumulation problem caused by local temperature rise. The close contact between the fin 16 and the curved plate 13 can also form additional conduction nodes on the heat dissipation path, allowing the heat to be more evenly diffused to the horizontal plate 15 and the heat pipe 1, thereby improving the overall heat conduction efficiency of the heat dissipation module. Therefore, a stable support effect is formed between the horizontal plate 15, the fin 16 and the curved plate 13, further improving the structural stability and reliability of the heat dissipation module during use, and providing effective heat dissipation guarantee for the long-term operation of the equipment in a high-temperature environment.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Comprehensive heat dissipation module, characterized in that: include: A heat conducting pipe (1), wherein a heat conducting plate 1 (2) is arranged in the middle thereof and a heat conducting plate 2 (3) is arranged on one side thereof, wherein the heat conducting plate 1 (2) and the heat conducting plate 2 (3) are used to guide heat to be transferred to the heat conducting pipe (1); A heat conducting block (4) is provided with a heat conducting column (5) on the outside thereof, and the heat conducting block (4) and the heat conducting column (5) are both installed in the middle of the heat conducting plate (2), and the heat conducting block (4) and the heat conducting column (5) are in contact with the outer wall of the heat conducting pipe (1); The extension plate 1 (6) has an extension plate 2 (7) on one side of its exterior. The extension plate 1 (6) and the extension plate 2 (7) are respectively located on both sides of the top surface of the heat conducting plate 1 (2), and the extension plate 1 (6) and the extension plate 2 (7) are connected to the outside of the heat conducting column (5) to guide the heat of the heat conducting plate 1 (2) to the heat conducting pipe (1) through the extension plate 1 (6), the extension plate 2 (7) and the heat conducting column (5).

2. The integrated heat dissipation module according to claim 1, characterized in that: A cover plate (8) is provided on the top surface of one side of the heat-conducting pipe (1), and the cover plate (8) is fixedly connected to the top surface of the first heat-conducting plate (2). A second groove (10) is provided on the bottom surface of the cover plate (8), and the top surface of one side of the heat-conducting pipe (1) is located inside the second groove (10).

3. The integrated heat dissipation module according to claim 1, characterized in that: A groove (9) is provided in the middle of the top surface of the heat conducting plate (2), the bottom surface of one side of the heat conducting pipe (1) is fixedly connected to the inside of the groove (9), the heat conducting block (4) is fixed in the middle of the groove (9), and the heat conducting column (5) is fixed to the side wall of the groove (9).

4. The integrated heat dissipation module according to claim 2, characterized in that: A mounting plate (11) is fixedly connected to the bottom of the outer wall of the cover plate (8), a screw (12) is provided in the middle of the mounting plate (11), and the screw (12) is threadedly connected to the heat conducting plate (2).

5. The integrated heat dissipation module according to claim 1, characterized in that: An arc-shaped plate (13) is fixedly connected to the middle of the top surface of the second heat-conducting plate (3), and the arc-shaped plate (13) is in contact with the outer wall of the middle of the heat-conducting pipe (1).

6. The integrated heat dissipation module according to claim 5, characterized in that: An embedding groove (14) is provided in the middle of the top surface of the second heat conducting plate (3), and the bottom surface of the outer wall of the middle part of the heat conducting pipe (1) is fixedly connected to the bottom surface of the inner wall of the embedding groove (14).

7. The integrated heat dissipation module according to claim 5, characterized in that: A transverse plate (15) is arranged above the top surface of the second heat conducting plate (3), and fins (16) are fixedly connected to both sides of the bottom surface of the transverse plate (15), the bottom surfaces of the fins (16) on both sides are in contact with both sides of the top surface of the second heat conducting plate (3), and the middle part of the bottom surface of the transverse plate (15) is in contact with the top surface of the middle part of the heat conducting pipe (1).

8. The integrated heat dissipation module according to claim 7, characterized in that: The height of the arc-shaped plate (13) is the same as the height of the fin (16), and the side wall of the fin (16) is in contact with the outer wall of the arc-shaped plate (13).

9. The integrated heat dissipation module according to claim 8, characterized in that: A plurality of fins (16) are provided, and the plurality of fins (16) are evenly distributed on both sides of the bottom surface of the transverse plate (15).

10. The integrated heat dissipation module according to claim 8, characterized in that: A side plate (17) is fixedly connected to the outer middle part of the bottom surface of the transverse plate (15), and a second screw (18) is provided at the bottom of the side plate (17), and the second screw (18) is threadedly connected to the top surface of the second heat conducting plate (3).

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