Stamping die detection and adjustment method and system based on use working conditions

Abstract

The invention relates to the technical field of die detection, and discloses a stamping die detection and adjustment method and system based on use working conditions, and the method comprises the steps: obtaining a design drawing to create a stamping structure model, importing the stamping structure model into a physical field simulation platform, generating a stamping simulation model, and analyzing a standard power time curve of various stamping processing tasks; operation detection parameters of the stamping mechanism are obtained in real time, an actually-measured power time curve is drawn and compared with a standard power time curve, and stamping sub-action line segments with the power parameter deviation rate larger than a power deviation threshold value are recognized to generate resistance abnormal signals; a cooling suppression signal is generated based on the resistance abnormal signal and sent to a cooling assembly, and a temperature measurement sensor is controlled to detect abnormal temperature measurement data of the stamping structure; when the temperature deviation ratio of the abnormal temperature measurement data relative to the theoretical temperature data is greater than a temperature deviation threshold value, generating fault handling information; the method has the effect of improving the timeliness of stamping machining quality detection.

Description

Technical Field

[0001] The present application relates to the technical field of mold detection, and in particular to a stamping mold detection and adjustment method and system based on usage conditions. Background Art

[0002] Stamping is a widely used metal forming process, mainly used for forming metal sheets. It has technical advantages such as high production efficiency, good product consistency, and high material utilization rate. However, stamping requires the use of stamping dies, which may be damaged or have positioning deviations during use, thereby affecting the product processing quality and producing unqualified products. If too many unqualified products are produced, it will cause significant economic losses. Currently, stamping quality inspection is mainly carried out on products produced by stamping. Therefore, the above-mentioned related technologies have the problem of poor timeliness of stamping quality inspection. Summary of the invention

[0003] In order to improve the timeliness of stamping process quality inspection, the present application provides a stamping die inspection and adjustment method and system based on usage conditions.

[0004] The first invention objective of this application is achieved by adopting the following technical solution:

[0005] The stamping die detection and adjustment method based on the working conditions includes:

[0006] Obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, analyze the standard power-time curves of various stamping processing tasks;

[0007] Acquire the running detection parameters of the punching mechanism in real time to draw the measured power-time curve and compare it with the corresponding standard power-time curve, identify the punching sub-action line segment with a power parameter deviation rate greater than the power deviation threshold to generate a resistance abnormality signal;

[0008] A cooling inhibition signal is generated based on the abnormal resistance signal and sent to the cooling component, and a temperature measurement control signal is generated to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure;

[0009] When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated;

[0010] The operation detection parameters include power consumption parameters.

[0011] By adopting the above technical solution, the design drawings of the stamping mechanism and the stamping die are obtained, so as to create a stamping structure model, which is convenient for knowing the structure of the equipment used for stamping processing and completing the modeling, and importing the stamping structure model into the physical field simulation platform to generate a stamping simulation model, so as to facilitate the analysis of the standard power curve of the stamping machine when performing various stamping processing tasks through physical field simulation; the operation detection parameters of the stamping mechanism are obtained in real time, the power time curve is plotted according to the power parameters and compared with the corresponding standard power time curve, and the stamping sub-action line segments with a power parameter deviation rate greater than the power deviation threshold are identified to generate a resistance abnormality signal, thereby realizing the preliminary investigation of whether the stamping die has any problems by detecting the power parameters. The function of abnormal working phenomenon; based on the abnormal resistance signal, a cooling inhibition signal is generated and sent to the cooling component to control the cooling component of the stamping machine to suspend operation, so as to reduce the impact on subsequent temperature detection, and further generate a temperature measurement control signal and send it to the temperature sensor to control the temperature sensor to detect the abnormal temperature measurement data of the stamping structure, so as to facilitate the subsequent judgment of whether there is a fault problem according to the temperature change of the stamping structure; calculate the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data. When the temperature deviation rate is greater than the corresponding temperature deviation threshold, it is considered that there is a problem of excessive extrusion of the workpiece or insufficient extrusion of the workpiece at the fault location, and generate fault handling information, which improves the timeliness of stamping process quality detection.

[0012] In a preferred example of the present application: the stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component;

[0013] The standard power-time curves of various stamping processing tasks analyzed based on the stamping simulation model include:

[0014] Determine the task information of the target stamping task and input it into the stamping simulation model, evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping task;

[0015] Based on the power requirements of the target stamping task at each time point in several action cycles and the die degradation correction data, a standard power-time curve is generated;

[0016] The task information includes initial workpiece drawings, finished workpiece drawings, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; the mold degradation correction data is correction data determined based on the average power changes of multiple action cycles in the measured power time curve of the same mold in the historical working state.

[0017] By adopting the above technical scheme, the task information of the target stamping task is determined and input into the stamping simulation model, so as to evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke during the execution of the target stamping task by the physical field simulation algorithm based on the known initial workpiece drawing, the finished workpiece drawing, the various workpiece parameters and the stamping parameters, and then calculate the power consumption of the stamping machine at each time point in an action cycle when the stamping machine executes the target stamping task; because during the use of the stamping machine, the stamping mechanism, the stamping die, etc. may have changes in the power demand for the execution of the target stamping task due to factors such as the gradual failure of the lubrication effect or the gradual wear of the mechanical parts, therefore, based on the power demand of the target stamping task at each time point in several action cycles, and the average power change of multiple action cycles in the measured power time curve of the historical working state of the same mold, the mold degradation correction data is determined to generate a standard power time curve, so as to facilitate the subsequent judgment of the working state of the stamping mold by monitoring the power demand of the stamping structure.

[0018] In a preferred example of the present application: the real-time acquisition of the operation detection parameters of the stamping mechanism to draw the measured power time curve and compare it with the corresponding standard power time curve, identify the stamping sub-action line segment whose power parameter deviation rate is greater than the power deviation threshold to generate a resistance abnormality signal, including:

[0019] Acquire the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes;

[0020] Calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power; calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power;

[0021] The power parameter deviation rate is calculated based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, a resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action line segment;

[0022] Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve;

[0023] The calculation formula of the power parameter deviation rate is:

[0024]

[0025] By adopting the above technical scheme, the power consumption parameters of the stamping mechanism are obtained in real time, so as to draw a measured power time curve according to the power consumption parameters and the corresponding time nodes, so as to compare it with the standard power time curve later to detect possible faults of the stamping die; the average power of the most recent action cycle in the measured power time curve is calculated and defined as the measured cycle power, and the average power of the action cycle with the same cycle mark in the corresponding standard power time curve is calculated and defined as the comparison cycle power, so as to facilitate the subsequent comparison of the average power of the same action cycle, thereby improving the accuracy of detecting stamping die faults through power consumption; the power parameter deviation rate is calculated based on the measured cycle power and the comparison cycle power, and when the power parameter deviation rate is greater than the preset power deviation threshold, a resistance abnormality signal is generated based on the cycle mark of the stamping sub-action segment corresponding to the measured cycle power, so as to facilitate the acquisition of possible stamping die faults so as to perform further fault location and troubleshooting work in a timely manner.

[0026] In a preferred example of the present application, the generating of the temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure includes:

[0027] Generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform a temperature measurement task for the stamping structure;

[0028] Receive temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data based on the abnormal temperature measurement value, temperature measurement target point and temperature measurement time point in each temperature measurement information, and generate theoretical temperature data based on the temperature measurement target point and comparison temperature series in each temperature measurement information;

[0029] The temperature measurement information includes abnormal temperature measurement values, temperature measurement target points, temperature measurement time points and comparative temperature series; the comparative temperature series records the temperature values ​​measured at the temperature measurement target points during several action cycles of continuous stamping work when the stamping die and stamping mechanism are normal and the stamping machine cooling is suppressed.

[0030] By adopting the above technical scheme, after cooling suppression is performed on the stamping machine, a temperature measurement control signal is generated and sent to the temperature sensor to control the temperature sensor to perform the temperature measurement task for the stamping structure, so as to facilitate the subsequent analysis of possible fault types and fault locations by detecting the temperature value changes at various locations of the stamping die; receiving temperature measurement information from the target temperature sensor, and generating abnormal temperature measurement data based on the abnormal temperature measurement value, temperature measurement target point and temperature measurement time point in the target temperature measurement information, so as to know the actual temperature change of the stamping mechanism in the continuous stamping work after cooling suppression, and generating theoretical temperature data based on the temperature measurement target point and comparison temperature series in the temperature measurement information of the target temperature sensor, so as to know the theoretical temperature change of the stamping mechanism in the continuous stamping work after cooling suppression.

[0031] In a preferred example of the present application: the abnormal temperature measurement data includes a plurality of abnormal temperature measurement values, each of which is associated with a period identifier generated according to a corresponding temperature measurement time point; the comparative temperature series includes a plurality of comparative temperature values, each of which is associated with a period identifier;

[0032] When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated, including:

[0033] Acquire abnormal temperature measurement data and theoretical temperature data, and perform time alignment processing on abnormal temperature measurement values ​​in the abnormal temperature measurement data and comparative temperature values ​​in the theoretical temperature data; calculate the absolute value of the quotient of all abnormal temperature measurement values ​​and the corresponding comparative temperature values ​​to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the several temperature quotient values ​​and a preset temperature deviation calculation rule;

[0034] When the temperature deviation rate exceeds the corresponding preset temperature deviation threshold interval, fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor.

[0035] By adopting the above technical scheme, abnormal temperature measurement data and theoretical temperature data are obtained, and further time alignment processing is performed on the abnormal temperature measurement values ​​in the abnormal temperature measurement data and the comparison temperature values ​​in the theoretical temperature data according to the period identification; the absolute value of the quotient of all abnormal temperature measurement values ​​and the corresponding comparison temperature values ​​is calculated to obtain a number of temperature quotient values, and the temperature deviation rate is calculated based on the several temperature quotient values ​​and the preset temperature deviation calculation rules, so as to subsequently judge the degree of deviation between the actual measured temperature condition and the theoretical temperature condition for the stamping structure; when the temperature deviation rate exceeds the corresponding preset temperature deviation threshold interval, the task is that the degree of deviation between the actual measured temperature condition and the theoretical temperature condition for the stamping structure is large, and fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor, so that the staff can check whether there is a stamping die failure problem at the temperature measurement target point in a targeted manner.

[0036] The second invention objective of this application is achieved by the following technical solution:

[0037] The stamping die detection and adjustment system based on the use condition is applied to any of the above-mentioned stamping die detection and adjustment methods based on the use condition, comprising:

[0038] The standard power-time relationship analysis module is used to obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, the standard power-time curves of various stamping processing tasks are analyzed;

[0039] The resistance anomaly assessment module is used to obtain the operation detection parameters of the stamping mechanism in real time, to draw the measured power-time curve and compare it with the corresponding standard power-time curve, to identify the stamping sub-action line segments whose power parameter deviation rate is greater than the power deviation threshold to generate resistance anomaly signals;

[0040] An abnormal temperature measurement module is used to generate a cooling inhibition signal based on the abnormal resistance signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure;

[0041] A fault handling evaluation module is used to generate fault handling information when the temperature deviation rate of abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold;

[0042] The operation detection parameters include power consumption parameters.

[0043] In a preferred example of the present application: the standard power time relationship analysis module includes:

[0044] The stamping power evaluation submodule is used to determine the task information of the target stamping task and input it into the stamping simulation model. The action stroke of the stamping structure and the force required at each time point in the action stroke are evaluated through the physical field simulation algorithm, and then the power at each time point in an action cycle of the target stamping task is calculated;

[0045] A standard power-time curve generation submodule is used to generate a standard power-time curve based on the power requirements of the target stamping task at each time point in a number of action cycles and the die degradation correction data;

[0046] The stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component; the task information includes an initial workpiece drawing, a finished workpiece drawing, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; the mold degradation correction data is correction data determined based on the average power changes of multiple action cycles in the measured power time curve of the same mold in the historical working state.

[0047] In a preferred example of the present application: the resistance abnormality assessment module includes:

[0048] The measured power time curve generation submodule is used to obtain the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes;

[0049] The cycle power calculation submodule is used to calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power;

[0050] The resistance abnormality signal generating submodule is used to calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, the resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action line segment;

[0051] Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve;

[0052] The calculation formula of the power parameter deviation rate is:

[0053]

[0054] The third invention objective of this application is achieved by the following technical solution:

[0055] A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above-mentioned stamping die detection and adjustment method based on the use condition when executing the computer program.

[0056] The fourth invention objective of this application is achieved by the following technical solution:

[0057] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the above-mentioned stamping die detection and adjustment method based on usage conditions.

[0058] In summary, the present application includes at least one of the following beneficial technical effects:

[0059] 1. Obtain the design drawings of the stamping mechanism and stamping die, and create a stamping structure model to facilitate the understanding of the structure of the equipment used for stamping processing and complete the modeling. Import the stamping structure model into the physical field simulation platform to generate a stamping simulation model, so as to facilitate the analysis of the standard power curve of the stamping machine when performing various stamping processing tasks through physical field simulation; obtain the operation detection parameters of the stamping mechanism in real time, plot the power time curve according to the power parameters and compare it with the corresponding standard power time curve, and identify the stamping sub-action line segment with a power parameter deviation rate greater than the power deviation threshold to generate a resistance abnormality signal, thereby realizing the preliminary investigation of whether the stamping die has working abnormalities by detecting the power parameters. It can detect abnormal temperature of the stamping structure and determine whether there is a fault problem according to the temperature change of the stamping structure; it can calculate the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data. When the temperature deviation rate is greater than the corresponding temperature deviation threshold, it is considered that there is a problem of over-extrusion of the workpiece or insufficient extrusion of the workpiece at the fault location, and fault handling information is generated, which improves the timeliness of stamping process quality detection.

[0060] 2. Determine the task information of the target stamping task and input it into the stamping simulation model, based on the known initial workpiece drawings, finished workpiece drawings, various workpiece parameters and stamping parameters, so as to evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke during the execution of the target stamping task by the physical field simulation algorithm, and then calculate the power consumption of the stamping machine at each time point in an action cycle when the stamping machine executes the target stamping task; since the stamping mechanism, stamping die, etc. may experience changes in the power demand required for the execution of the target stamping task due to factors such as the gradual failure of the lubrication effect or the gradual wear of mechanical parts during the use of the stamping machine, therefore, based on the power demand of the target stamping task at each time point in several action cycles, and the average power change of multiple action cycles in the measured power time curve of the same mold in the historical working state, the mold degradation correction data is determined to generate a standard power time curve, so as to facilitate the subsequent judgment of the working state of the stamping mold by monitoring the power demand of the stamping structure.

[0061] 3. Obtain the power consumption parameters of the stamping mechanism in real time, and draw the measured power time curve according to the power consumption parameters and the corresponding time nodes, so as to compare it with the standard power time curve later to detect possible faults of the stamping die; calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power, so as to facilitate the subsequent comparison of the average power of the same action cycle, thereby improving the accuracy of detecting stamping die faults through power consumption; calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, generate a resistance abnormality signal based on the cycle mark of the stamping sub-action segment corresponding to the measured cycle power, so as to facilitate the understanding of possible stamping die faults, so as to perform further fault location and troubleshooting work in a timely manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] Figure 1 It is a flow chart of the stamping die detection and adjustment method based on the usage conditions in Example 1 of the present application.

[0063] Figure 2 It is a principle block diagram of the stamping die detection and adjustment system based on the operating conditions in the second embodiment of the present application.

[0064] Figure 3 It is a schematic diagram of the equipment in Example 3 of the present application. DETAILED DESCRIPTION

[0065] The following is combined with Figures 1 to 3 This application is described in further detail.

[0066] Embodiment 1

[0067] Reference Figure 1 The present application discloses a stamping die detection and adjustment method based on the use condition, which specifically includes the following steps:

[0068] S10: Obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, analyze the standard power-time curves of various stamping processing tasks.

[0069] In this embodiment, the physical field simulation platform is ANSYS; each stamping task corresponds to a stamping production task of a workpiece.

[0070] Specifically, the design drawings of the stamping mechanism and stamping die are obtained to create a stamping structure model, so as to understand the structure of the equipment used for the stamping process and complete the modeling. The stamping structure model is imported into the physical field simulation platform to generate a stamping simulation model, so as to analyze the standard power curve of the stamping machine when performing various stamping processing tasks through physical field simulation.

[0071] Wherein, in step S10, it includes:

[0072] S11: Determine the task information of the target stamping task and input it into the stamping simulation model, evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping task.

[0073] In this embodiment, the stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component. The electrical parameters are power parameters or parameters such as voltage and current that can be used to calculate electrical power; the task information includes an initial workpiece drawing, a finished workpiece drawing, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece, the material parameters include several performance parameters of the material, and the material parameters can also be stored in the form of a material model so as to automatically match several performance parameters of the material from relevant technical manuals, and the size parameters include the shape and size data of the workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; wherein the processing parameters correspond to the processing type, for example, when the processing type is a sharp-angle crease, the corresponding processing parameters include a bending angle and a springback angle; when the processing type is a rounded crease, the corresponding processing parameters include a bending arc, bending curve data, etc.; the processing parameters also include the position and deformation degree parameters of the tensile / compressive deformation area; the physical field simulation algorithm refers to the simulation algorithm built into the physical field simulation platform; the stamping structure includes a stamping mechanism and a stamping die.

[0074] Specifically, the task information of the target stamping processing task is determined and input into the stamping simulation model, so as to evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke during the execution of the target stamping processing task by the physical field simulation algorithm, based on the known initial workpiece drawings, finished workpiece drawings, various workpiece parameters and stamping parameters, and then calculate the power consumption of the stamping machine at each time point in an action cycle when performing the target stamping processing task.

[0075] S12: Generate a standard power-time curve based on the power requirements of the target stamping task at each time point in a number of action cycles and the mold degradation correction data.

[0076] In this embodiment, the mold degradation correction data is the correction data determined based on the average power changes of multiple action cycles in the actual measured power time curve of the same type of mold in the historical working state.

[0077] Specifically, during the use of the stamping machine, the stamping mechanism, stamping die, etc. may experience changes in the power demand for executing the target stamping processing task due to factors such as the gradual failure of lubrication or gradual wear of mechanical parts. Therefore, the power demand of the target stamping processing task at each time point in several action cycles is based on the power demand of the target stamping processing task, and the die degradation correction data is determined based on the average power changes of multiple action cycles in the measured power time curve of the same die in the historical working state, so as to generate a standard power time curve, which is convenient for subsequent judgment of the working state of the stamping die by monitoring the power demand of the stamping structure.

[0078] S20: Acquire the operation detection parameters of the stamping mechanism in real time to draw a measured power-time curve and compare it with the corresponding standard power-time curve, identify the stamping sub-action line segment whose power parameter deviation rate is greater than the power deviation threshold to generate a resistance abnormality signal.

[0079] In this embodiment, the operation detection parameters include power consumption parameters.

[0080] Specifically, when the stamping mold is worn or deformed, it is easy to cause abnormal resistance in the stamping process due to factors such as changes in the degree of extrusion and friction between the mold and the workpiece. Therefore, the operation detection parameters of the stamping mechanism are obtained in real time, and the power time curve is plotted according to the power parameters and compared with the corresponding standard power time curve. The stamping sub-action line segments with a power parameter deviation rate greater than the power deviation threshold are identified to generate an abnormal resistance signal, thereby realizing the function of preliminarily checking whether the stamping mold has working abnormalities by detecting the power parameters.

[0081] Wherein, in step S20, it includes:

[0082] S21: Acquire the power consumption parameters of the stamping mechanism in real time to draw a measured power-time curve according to the power consumption parameters and corresponding time nodes.

[0083] Specifically, the power consumption parameters of the stamping mechanism are acquired in real time to draw a measured power-time curve based on the power consumption parameters and corresponding time nodes, so as to compare it with the standard power-time curve later to detect possible faults in the stamping die.

[0084] S22: Calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power time curve and define it as the comparison cycle power.

[0085] In this embodiment, each action cycle is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping processing task.

[0086] Specifically, the average power of the most recent action cycle in the measured power-time curve is calculated and defined as the measured cycle power, and the average power of the action cycle with the same cycle mark in the corresponding standard power-time curve is calculated and defined as the comparison cycle power. This facilitates the subsequent comparison of the average power of the same action cycle, thereby improving the accuracy of detecting stamping die faults through power consumption.

[0087] S23: Calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than a preset power deviation threshold, generate a resistance abnormality signal based on the cycle mark corresponding to the punching sub-action line segment.

[0088] In this embodiment, the punching sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve;

[0089] The calculation formula of power parameter deviation rate is:

[0090]

[0091] Specifically, the power parameter deviation rate is calculated based on the measured cycle power and the comparative cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, an abnormal resistance signal is generated based on the cycle identifier of the stamping sub-action segment corresponding to the measured cycle power, so as to facilitate the detection of possible stamping die failures so as to promptly perform further fault location and troubleshooting work.

[0092] S30: generating a cooling inhibition signal based on the abnormal resistance signal and sending it to the cooling component, generating a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure.

[0093] Specifically, a cooling inhibition signal is generated based on the abnormal resistance signal and sent to the cooling component to control the cooling component of the stamping machine to suspend operation, so as to reduce the impact on subsequent temperature detection. A temperature measurement control signal is further generated and sent to the temperature sensor to control the temperature sensor to detect abnormal temperature measurement data of the stamping structure, so as to facilitate the subsequent judgment of whether there is a fault problem based on the temperature change of the stamping structure.

[0094] Wherein, in step S30, it includes:

[0095] S31: Generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform a temperature measurement task for the stamping structure.

[0096] Specifically, after cooling the stamping machine, a temperature measurement control signal is generated and sent to the temperature sensor to control the temperature sensor to perform the temperature measurement task for the stamping structure, so as to facilitate the subsequent analysis of possible fault types and fault locations by detecting changes in temperature values ​​at various locations of the stamping die.

[0097] S32: Receive temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data based on the abnormal temperature measurement value, temperature measurement target point and temperature measurement time point in each temperature measurement information, and generate theoretical temperature data based on the temperature measurement target point and comparison temperature series in each temperature measurement information.

[0098] In this embodiment, the temperature measurement information includes abnormal temperature measurement values, temperature measurement target points, temperature measurement time points and comparison temperature series; the comparison temperature series records the temperature values ​​measured at the temperature measurement target points during several action cycles of continuous stamping work when the stamping die and stamping mechanism are normal and the cooling of the stamping machine is suppressed; the comparison temperature series is specifically obtained by regular analysis of data after simulation by experiments or multi-physical field simulation platforms.

[0099] Specifically, temperature measurement information is received from a target temperature sensor, and abnormal temperature measurement data is generated after summarizing the abnormal temperature measurement values, temperature measurement target points and temperature measurement time points in the target temperature measurement information, so as to obtain the actual temperature changes of the stamping mechanism in continuous stamping work after cooling suppression, and theoretical temperature data is generated after summarizing the temperature measurement target points and comparison temperature series in the temperature measurement information of the target temperature sensor, so as to obtain the theoretical temperature changes of the stamping mechanism in continuous stamping work after cooling suppression.

[0100] S40: When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated.

[0101] Specifically, the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is calculated. When the temperature deviation rate is greater than the corresponding temperature deviation threshold, it is considered that there is a problem of excessive extrusion of the workpiece or insufficient extrusion of the workpiece at the fault location, and fault handling information is generated, thereby improving the timeliness of stamping process quality detection.

[0102] Wherein, in step S40, it includes:

[0103] S41: Acquire abnormal temperature measurement data and theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement value in the abnormal temperature measurement data and the comparison temperature value in the theoretical temperature data.

[0104] In this embodiment, the abnormal temperature measurement data includes several abnormal temperature measurement values, each of which is associated with a period identifier generated according to the corresponding temperature measurement time point; the comparison temperature series includes several comparison temperature values, each of which is associated with a period identifier.

[0105] Specifically, abnormal temperature measurement data and theoretical temperature data are acquired, and further, according to the period identifier, time alignment processing is performed on the abnormal temperature measurement value in the abnormal temperature measurement data and the comparison temperature value in the theoretical temperature data.

[0106] S42: Calculate the absolute values ​​of the quotients of all abnormal temperature measurement values ​​and the corresponding comparison temperature values ​​to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values ​​and a preset temperature deviation calculation rule.

[0107] In this embodiment, the temperature deviation calculation rule can be set and adjusted according to actual needs. Preferably, a temperature deviation calculation rule is to take the latest N temperature quotient values ​​of the period identifier, and calculate the average of the M maximum / minimum temperature quotient values ​​to obtain the temperature deviation rate.

[0108] Specifically, the absolute values ​​of the quotients of all abnormal temperature measurement values ​​and the corresponding comparison temperature values ​​are calculated to obtain several temperature quotient values, and the temperature deviation rate is calculated based on the several temperature quotient values ​​and the preset temperature deviation calculation rules, so as to subsequently judge the degree of deviation between the actual measured temperature conditions and the theoretical temperature conditions for the stamping structure.

[0109] S43: When the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor.

[0110] Specifically, when the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, the deviation between the actual measured temperature of the stamping structure and the theoretical temperature is large. Based on the temperature measurement target point of the target temperature sensor, fault handling information is generated so that the staff can check whether there is any stamping die failure problem at the temperature measurement target point.

[0111] It should be understood that the serial numbers of the steps in the above embodiments do not imply a sequence of execution. The execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0112] Embodiment 2

[0113] A stamping die detection and adjustment system based on usage conditions, which corresponds to the stamping die detection and adjustment method based on usage conditions in the above-mentioned embodiment.

[0114] like Figure 2As shown in the figure, the stamping die detection and adjustment system based on the working condition includes a standard power-time relationship analysis module, a resistance abnormality assessment module, an abnormal temperature measurement module and a fault handling assessment module. The detailed description of each functional module is as follows:

[0115] The standard power-time relationship analysis module is used to obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, the standard power-time curves of various stamping processing tasks are analyzed;

[0116] The resistance anomaly assessment module is used to obtain the operation detection parameters of the stamping mechanism in real time, to draw the measured power-time curve and compare it with the corresponding standard power-time curve, to identify the stamping sub-action line segments whose power parameter deviation rate is greater than the power deviation threshold to generate resistance anomaly signals;

[0117] An abnormal temperature measurement module is used to generate a cooling inhibition signal based on the abnormal resistance signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure;

[0118] The fault handling assessment module is used to generate fault handling information when the temperature deviation rate of abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold.

[0119] Among them, the standard power time relationship analysis module also includes:

[0120] The stamping power evaluation submodule is used to determine the task information of the target stamping task and input it into the stamping simulation model. The action stroke of the stamping structure and the force required at each time point in the action stroke are evaluated through the physical field simulation algorithm, and then the power at each time point in an action cycle of the target stamping task is calculated;

[0121] The standard power-time curve generation submodule is used to generate a standard power-time curve based on the power requirements of the target stamping processing task at each time point in several action cycles and the mold degradation correction data.

[0122] Among them, the resistance abnormality assessment module also includes:

[0123] The measured power time curve generation submodule is used to obtain the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes;

[0124] The cycle power calculation submodule is used to calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power;

[0125] The resistance abnormality signal generating submodule is used to calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, a resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action segment.

[0126] Among them, the abnormal temperature measurement module also includes:

[0127] The temperature measurement task execution submodule is used to generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform the temperature measurement task for the stamping structure;

[0128] The comparative temperature data summary submodule is used to receive temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data based on the abnormal temperature measurement values, temperature measurement target points and temperature measurement time points in each temperature measurement information, and generate theoretical temperature data based on the temperature measurement target points and comparative temperature series in each temperature measurement information.

[0129] The fault handling assessment module also includes:

[0130] The time alignment processing submodule is used to obtain abnormal temperature measurement data and theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement value in the abnormal temperature measurement data and the comparison temperature value in the theoretical temperature data;

[0131] The temperature deviation rate calculation submodule is used to calculate the absolute value of the quotient of all abnormal temperature measurement values ​​and the corresponding comparison temperature values ​​to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the several temperature quotient values ​​and a preset temperature deviation calculation rule;

[0132] The temperature deviation rate comparison submodule is used to generate fault handling information based on the temperature measurement target point of the target temperature measurement sensor when the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range.

[0133] For the specific limitations of the stamping die detection and adjustment system based on usage conditions, please refer to the limitations of the stamping die detection and adjustment method based on usage conditions in the above text, which will not be repeated here; each module in the above-mentioned stamping die detection and adjustment system based on usage conditions can be fully or partially implemented by software, hardware and their combination; each of the above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each of the above modules.

[0134] Embodiment 3

[0135] A computer device, which may be a server, may have an internal structure as shown in Figure 3As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as stamping mechanisms, design drawings of stamping dies, stamping structure models, physical field simulation platforms, stamping simulation models, standard power time curves, operation detection parameters, measured power time curves, standard power time curves, power parameter deviation rates, power deviation thresholds, stamping sub-action segments, resistance abnormality signals, cooling inhibition signals, temperature measurement control signals, abnormal temperature measurement data, theoretical temperature data, temperature deviation rates, temperature deviation thresholds and fault handling information. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a stamping die detection and adjustment method based on the use condition is implemented.

[0136] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program:

[0137] S10: Obtain design drawings of stamping mechanism and stamping die to create stamping structure model and import it into physical field simulation platform to generate stamping simulation model, and analyze standard power-time curves of various stamping processing tasks based on the stamping simulation model;

[0138] S20: acquiring the operation detection parameters of the stamping mechanism in real time, drawing the measured power time curve and comparing it with the corresponding standard power time curve, identifying the stamping sub-action line segment whose power parameter deviation rate is greater than the power deviation threshold to generate a resistance abnormality signal;

[0139] S30: generating a cooling inhibition signal based on the abnormal resistance signal and sending it to the cooling component, generating a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure;

[0140] S40: When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated.

[0141] In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0142] S10: Obtain design drawings of stamping mechanism and stamping die to create stamping structure model and import it into physical field simulation platform to generate stamping simulation model, and analyze standard power-time curves of various stamping processing tasks based on the stamping simulation model;

[0143] S20: acquiring the operation detection parameters of the stamping mechanism in real time, drawing the measured power time curve and comparing it with the corresponding standard power time curve, identifying the stamping sub-action line segment whose power parameter deviation rate is greater than the power deviation threshold to generate a resistance abnormality signal;

[0144] S30: generating a cooling inhibition signal based on the abnormal resistance signal and sending it to the cooling component, generating a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure;

[0145] S40: When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated.

[0146] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in the present application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink), DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0147] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0148] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, it should be understood by those skilled in the art that the technical solutions described in the aforementioned embodiments may still be modified, or some of the features thereof may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A stamping die detection and adjustment method based on working conditions, characterized in that: include: Obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, analyze the standard power-time curves of various stamping processing tasks; Acquire the running detection parameters of the punching mechanism in real time to draw the measured power-time curve and compare it with the corresponding standard power-time curve, identify the punching sub-action line segment with a power parameter deviation rate greater than the power deviation threshold to generate a resistance abnormality signal; A cooling inhibition signal is generated based on the abnormal resistance signal and sent to the cooling component, and a temperature measurement control signal is generated to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure; When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated; The operation detection parameters include power consumption parameters.

2. The method for detecting and adjusting a stamping die based on working conditions according to claim 1 is characterized in that: The stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component; The standard power-time curves of various stamping processing tasks analyzed based on the stamping simulation model include: Determine the task information of the target stamping task and input it into the stamping simulation model, evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping task; Based on the power requirements of the target stamping task at each time point in several action cycles and the die degradation correction data, a standard power-time curve is generated; The task information includes initial workpiece drawings, finished workpiece drawings, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; the mold degradation correction data is correction data determined based on the average power changes of multiple action cycles in the measured power time curve of the same mold in the historical working state.

3. The method for detecting and adjusting a stamping die based on working conditions according to claim 1, characterized in that: The real-time acquisition of the operation detection parameters of the stamping mechanism to draw the measured power time curve and compare it with the corresponding standard power time curve, identify the stamping sub-action line segment whose power parameter deviation rate is greater than the power deviation threshold to generate a resistance abnormality signal, including: Acquire the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes; Calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power; calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power; The power parameter deviation rate is calculated based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, a resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action line segment; Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve; The calculation formula of the power parameter deviation rate is:

4. The method for detecting and adjusting a stamping die based on working conditions according to claim 1, characterized in that: The step of generating a temperature measurement control signal to control a temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure includes: Generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform a temperature measurement task for the stamping structure; Receive temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data based on the abnormal temperature measurement value, temperature measurement target point and temperature measurement time point in each temperature measurement information, and generate theoretical temperature data based on the temperature measurement target point and comparison temperature series in each temperature measurement information; The temperature measurement information includes abnormal temperature measurement values, temperature measurement target points, temperature measurement time points and comparative temperature series; the comparative temperature series records the temperature values ​​measured at the temperature measurement target points during several action cycles of continuous stamping work when the stamping die and stamping mechanism are normal and the stamping machine cooling is suppressed.

5. The method for detecting and adjusting a stamping die based on working conditions according to claim 4 is characterized in that: The abnormal temperature measurement data includes a number of abnormal temperature measurement values, each of which is associated with a period identifier generated according to a corresponding temperature measurement time point; the comparative temperature series includes a number of comparative temperature values, each of which is associated with a period identifier; When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated, including: Acquire abnormal temperature measurement data and theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement value in the abnormal temperature measurement data and the comparison temperature value in the theoretical temperature data; Calculate the absolute values ​​of the quotients of all abnormal temperature measurement values ​​and the corresponding comparison temperature values ​​to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values ​​and a preset temperature deviation calculation rule; When the temperature deviation rate exceeds the corresponding preset temperature deviation threshold interval, fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor.

6. The stamping die detection and adjustment system based on the working conditions is characterized by: The stamping die detection and adjustment method based on the use condition as described in any one of claims 1 to 5 comprises: The standard power-time relationship analysis module is used to obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, the standard power-time curves of various stamping processing tasks are analyzed; The resistance anomaly assessment module is used to obtain the operation detection parameters of the stamping mechanism in real time, to draw the measured power-time curve and compare it with the corresponding standard power-time curve, to identify the stamping sub-action line segments whose power parameter deviation rate is greater than the power deviation threshold to generate resistance anomaly signals; An abnormal temperature measurement module is used to generate a cooling inhibition signal based on the abnormal resistance signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure; A fault handling evaluation module is used to generate fault handling information when the temperature deviation rate of abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold; The operation detection parameters include power consumption parameters.

7. The stamping die detection and adjustment system based on the use condition according to claim 6 is characterized in that: The standard power time relationship analysis module includes: The stamping power evaluation submodule is used to determine the task information of the target stamping task and input it into the stamping simulation model. The action stroke of the stamping structure and the force required at each time point in the action stroke are evaluated through the physical field simulation algorithm, and then the power at each time point in an action cycle of the target stamping task is calculated; A standard power-time curve generation submodule is used to generate a standard power-time curve based on the power requirements of the target stamping task at each time point in a number of action cycles and the die degradation correction data; The stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component; the task information includes an initial workpiece drawing, a finished workpiece drawing, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; the mold degradation correction data is correction data determined based on the average power changes of multiple action cycles in the measured power time curve of the same mold in the historical working state.

8. The stamping die detection and adjustment system based on the use condition according to claim 6 is characterized in that: The resistance abnormality assessment module comprises: The measured power time curve generation submodule is used to obtain the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes; The cycle power calculation submodule is used to calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power; The resistance abnormality signal generating submodule is used to calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, the resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action line segment; Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve; The calculation formula of the power parameter deviation rate is:

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the stamping die detection and adjustment method based on the usage conditions as described in any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the stamping die detection and adjustment method based on the usage conditions as described in any one of claims 1 to 5 are implemented.

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