Method and system for analyzing wafer angle in semiconductor integrated circuit manufacturing

Abstract

The invention discloses a wafer angle analysis method in semiconductor integrated circuit manufacturing. The wafer angle analysis method comprises the following steps: step 1, collecting machine table angle data on each machine table on a production line; and 2, predicting according to the machine angle data, and analyzing an angle trajectory diagram of the wafer in the technological process. Step 3, grouping the defective wafers in the analyzed batch for the first time according to defect types; and step 4, selecting a first group as a selected group in the first grouping, and performing second grouping on each defective wafer in the selected group according to the defect direction. And step 5, calculating the direction difference between the defect directions of each second group, and determining the station and the machine where the defects occur by combining the direction difference and the angle difference in the angle track diagram of each defect wafer in the selected group. The invention further discloses a system for analyzing the wafer angle in semiconductor integrated circuit manufacturing. According to the invention, the wafer angle and the station and the machine corresponding to the defect can be obtained through analysis according to different directions of the defect on the wafer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor integrated circuit manufacturing, and in particular to a method for analyzing wafer angles in semiconductor integrated circuit manufacturing. The present invention also relates to a system for analyzing wafer angles in semiconductor integrated circuit manufacturing. Background Art

[0002] In the semiconductor chip manufacturing process, due to the complexity of the process and the wide range of processes, a wide variety of process machines are required.

[0003] The existing method for analyzing wafer angles in semiconductor integrated circuit manufacturing is manual analysis, which includes the following steps:

[0004] Step 1: Problems occur on the production line. This is mainly detected through detection equipment. The defects of defective wafers in the batch (lot) corresponding to the production problem are manually visually classified. The sources of defects of the same type are often the same.

[0005] Step 2: Based on the defects on the defective wafer, for example, the defect direction, the machine that may have problems in the process loop is manually suspected based on experience, for example, 10 machines are listed.

[0006] Step three, manually check the relevant angle data of the 10 listed machines one by one to lock in the suspected machine. The relevant angle data of the machine include: the machine alignment angle, the angle associated with the loadport, the angle associated with the recipe, the angle associated with the airlock chamber, the angle associated with the product, and the angle associated with the process number. Therefore, according to the association situation, the machine usually includes multiple angles, such as angle 1, angle 2 and angle 3, and angle 1, angle 2 and angle 3 have independent values. In the existing method, it is necessary to manually check each relevant angle data one by one, which is a relatively large workload.

[0007] Therefore, in the existing method, after a defect occurs, the angle change of the production line machine in the process flow is manually screened. It is necessary to judge the possible sites based on experience and check the angle information of each machine end. As the time of manual investigation increases, the production line risk index increases, which will lead to greater production line accidents. Summary of the invention

[0008] The technical problem to be solved by the present invention is to provide a method for analyzing wafer angles in semiconductor integrated circuit manufacturing, which can obtain the wafer angles according to different defect directions on the wafer and thereby obtain the site and machine where the defect occurs. To this end, the present invention also provides a system for analyzing wafer angles in semiconductor integrated circuit manufacturing.

[0009] In order to solve the above technical problems, the present invention provides a method for analyzing wafer angles in semiconductor integrated circuit manufacturing, comprising the following steps:

[0010] Step 1: Collect machine angle data on each machine on a production line of a semiconductor integrated circuit. The machine angle is the angle of the wafer when the wafer is processed on the machine.

[0011] Step 2: predict and form an angle trajectory diagram of each analyzed wafer in the analyzed batch during the process based on the machine angle data, wherein the angle trajectory diagram is a distribution diagram of the wafer angles on the machine corresponding to each station of the analyzed wafer during the process.

[0012] Step three: let defective wafer be the analyzed wafer with defects, and perform a first grouping on the defective wafers in the analyzed batch according to the defect type. In the first grouping, the defective wafers with the same defect type are classified into the same first group.

[0013] Step 4: Select one of the first groups as a selected group in the first grouping, and perform a second grouping on the defective wafers in the selected group according to the direction of the defect. In the second grouping, the defective wafers in the selected group with the same defect direction are classified into the same second group.

[0014] Step 5: Calculate the direction difference between the defect directions of each of the second groups; and determine the site and the machine where the defect of each of the defective wafers in the selected group occurs by combining the direction difference and the angle difference in the angle trajectory diagram of each of the defective wafers in the selected group.

[0015] A further improvement is that in step one, the machine angle data also includes the data type of the machine angle, and the data type is defined using a portion associated with the machine angle, and the portion associated with the machine angle includes: a wafer loading port, a wafer loading lock chamber, an airlock chamber or a process chamber.

[0016] A further improvement is that, among the data types, the part associated with the machine angle also includes: process menu, product or process number.

[0017] A further improvement is that the machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

[0018] A further improvement is that, in step one, the machine angle data is automatically collected or manually input.

[0019] A further improvement is that the defects on the defective wafer are detected by testing equipment.

[0020] A further improvement is that in step three, when the first group has more than two, steps four and five are repeated to sequentially implement the sites and machines where the corresponding defects of each of the first groups occur.

[0021] A further improvement is that in step 2, the angle trajectory diagram includes the following changes in the wafer angle:

[0022] Dynamic transformation of up and down inheritance;

[0023] Fixed changes;

[0024] Angle regularity increases and decreases the angle;

[0025] Mirror image changes;

[0026] Diagonal changes.

[0027] In order to solve the above technical problems, the present invention provides a wafer angle analysis system in semiconductor integrated circuit manufacturing, comprising:

[0028] The machine angle data collection module is used to collect machine angle data on each machine on the production line of semiconductor integrated circuits. The machine angle is the angle of the wafer when the wafer is processed on the machine.

[0029] The angle trajectory diagram prediction module is used to predict and form an angle trajectory diagram of each analyzed wafer in the analyzed batch during the process according to the machine angle data. The angle trajectory diagram is a distribution diagram of the wafer angles on the machine corresponding to each station of the analyzed wafer during the process.

[0030] The first defect grouping module assumes that the defective wafer is the analyzed wafer with defects. The first defect grouping module performs a first grouping on the defective wafers in the analyzed batch according to the defect type. In the first grouping, the defective wafers with the same defect type are classified into the same first group.

[0031] The second defect grouping module is used to select one of the first groups as a selected group in the first grouping, and to perform a second grouping on the defective wafers in the selected group according to the direction of the defect. In the second grouping, the defective wafers in the selected group with the same defect direction are classified into the same second group.

[0032] A comprehensive analysis module is used to calculate the direction difference between the defect directions of each of the second groups and combine the direction difference with the angle difference in the angle trajectory diagram of each of the defective wafers in the selected group to determine the site and the machine where the defect of each of the defective wafers in the selected group occurs.

[0033] A further improvement is that the machine angle data also includes the data type of the machine angle, and the data type is defined using a part associated with the machine angle, and the part associated with the machine angle includes: a wafer loading port, a wafer loading locking chamber, an air lock chamber or a process chamber.

[0034] A further improvement is that, among the data types, the part associated with the machine angle also includes: process menu, product or process number.

[0035] A further improvement is that the machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

[0036] A further improvement is that the machine angle data is automatically collected or manually input.

[0037] A further improvement is that the defects on the defective wafer are detected by testing equipment.

[0038] A further improvement is that the angle trajectory diagram includes the following changes in the wafer angle:

[0039] Dynamic transformation of up and down inheritance;

[0040] Fixed changes;

[0041] Angle regularity increases and decreases the angle;

[0042] Mirror image changes;

[0043] Diagonal changes.

[0044] The present invention collects the machine angle data of each machine on the production line in advance, and then predicts the angle trajectory diagram of the corresponding analyzed wafer based on the machine angle data, and then performs a first grouping of defective wafers according to the defect type and a second grouping of a selected first group with the same defect type to obtain a second group, calculates the direction difference between the defect directions of each second group, and combines the direction difference and the angle difference obtained from the predicted angle trajectory diagram to analyze the wafer angle of each defective wafer in the second group when the defect occurs, and further determines the site and machine where the defect occurs from the wafer angle. Therefore, the wafer angle analysis of the present invention can be automatically realized without manual analysis, so it can greatly improve the analysis efficiency and accuracy, saving manpower and time consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments:

[0046] Figure 1 is a flow chart of a method for analyzing wafer angles in semiconductor integrated circuit manufacturing according to an embodiment of the present invention;

[0047] Figure 2A-2C It is a schematic diagram of defect directions of each second group in the second grouping in the method for analyzing wafer angles in semiconductor integrated circuit manufacturing according to an embodiment of the present invention;

[0048] Figure 3 It is a schematic diagram of the structure of a system for analyzing wafer angles in semiconductor integrated circuit manufacturing according to an embodiment of the present invention. DETAILED DESCRIPTION

[0049] like Figure 1 , which is a flow chart of a method for analyzing wafer angles in semiconductor integrated circuit manufacturing according to an embodiment of the present invention; the method for analyzing wafer angles in semiconductor integrated circuit manufacturing according to an embodiment of the present invention comprises the following steps:

[0050] Step 1: Collect machine angle data on each machine on a production line of a semiconductor integrated circuit. The machine angle is the angle of the wafer when the wafer is processed on the machine.

[0051] In the method of the embodiment of the present invention, the machine angle data also includes the data type of the machine angle, and the data type is defined using a part associated with the machine angle. The part associated with the machine angle includes: a wafer loading port, a wafer loading locking chamber, an air lock chamber or a process chamber.

[0052] In some embodiments, the data types that are associated with the machine angle also include: a process menu, a product or a process number.

[0053] In the method of the embodiment of the present invention, the machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

[0054] The machine angle data is collected automatically or input manually.

[0055] In some embodiments, the machine angle data can be created as an associated information table of machine, angle, data type and rule judgment, and the associated information table is filled with data according to the following Table 1:

[0056] Table 1

[0057] category department Equipment No. Is it aligned? angle condition angle Angle Description Flag To be filled To be filled To be filled To be filled To be filled To be filled To be filled To be filled

[0058] The first row in Table 1 corresponds to the names of the various types of data to be filled in the form, and the "to be filled in" in the second row indicates that specific content needs to be filled in. For example:

[0059] The "category" in the first row corresponds to category, which is the process category of the equipment, including process or metrology. In the column corresponding to "category", fill in the actual category according to the actual situation, such as process or metrology.

[0060] "Department" means module, that is, the department to which the equipment belongs, such as chemical mechanical polishing (CMP), etching (ETCH), ion implantation (IMP), chemical vapor deposition (CVD), metal, wafer acceptance test (WAT), diffusion (DIFF), yield enhancement (YE) and wet process (WET). In the column corresponding to "Department", each row is filled in according to the actual department.

[0061] "Equipment Number" indicates the number of the online machine generated. Please fill it out according to the actual situation.

[0062] "Whether aligned" indicates whether the machine with the corresponding number is aligned. Please fill it out according to the actual situation.

[0063] "Angle condition" refers to the situation in which the angle needs to be set in the corresponding machine, that is, the part related to the angle, such as: in the process layer (layer) of some products, airlock, process recipe (recipe), random (random), loadlock, loadport, loadport+airlock, batch (lot), process chamber, etc.

[0064] "Angle" indicates the angle corresponding to the machine, which can be filled in according to the actual situation.

[0065] "Angle description" describes the rules for changing angles, that is, it describes the rule judgment. For example: when there are two airlocks, when the "angle" is 330°, the "angle description" can be filled in as: airlock1 comes out at 330°, airlock2 comes out at 30°, that is, for the same wafer, the angles are different when it comes out of airlock1 and airlock2. In this way, the actual angle of the wafer can be judged based on whether the wafer comes out of airlock1 or airlock2. Similarly, when the machine has multiple loadlocks, the corresponding wafer angles will be different when entering or exiting from different loadlocks. Similarly, when there are multiple process layers of a product, the corresponding angles of different process layers are also different. Therefore, in the "angle description", it is necessary to fill in the corresponding wafer angles under various combination conditions according to the actual situation.

[0066] "Flag" is a simple description of some machine and angle-related components. For example, "Angle Condition" and "Angle Description" describe specific process layers, and the column corresponding to the flag only needs to describe the process layer; similarly, if the "Angle Description" describes various changes in the airlock, the flag only needs to describe the airlock.

[0067] In the method of the embodiment of the present invention, the machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

[0068] Step 2: predict and form an angle trajectory diagram of each analyzed wafer in the analyzed batch during the process based on the machine angle data, wherein the angle trajectory diagram is a distribution diagram of the wafer angles on the machine corresponding to each station of the analyzed wafer during the process.

[0069] In the method of the embodiment of the present invention, there are usually at most 25 wafers in a batch, and the angle trajectory diagrams of the 25 analyzed wafers in a batch can be placed in a table. In the same analyzed batch, the process steps experienced by each analyzed wafer are mostly similar. In the table corresponding to the angle trajectory diagram, it can be filled in according to the process step sequence (step sequence), step description (step description), machine name (equipment number), process menu, wafer list, alignment, angle description and predicted angle of each analyzed wafer. The predicted angles of each analyzed wafer formed in each process step sequence together constitute the corresponding angle trajectory diagram of the analyzed wafer.

[0070] In the method of the embodiment of the present invention, the angle trajectory diagram includes the following changes in the wafer angle:

[0071] Dynamic transformation of up and down inheritance;

[0072] Fixed changes;

[0073] Angle regularity increases and decreases the angle;

[0074] Mirror image changes;

[0075] Diagonal changes.

[0076] That is, by also counting the various change values ​​of the wafer angle into the angle trajectory diagram, the applicable range of the wafer angle in the angle trajectory diagram can be expanded, and the wafer angle analysis can be faster and more accurate.

[0077] Step three: let defective wafer be the analyzed wafer with defects, and perform a first grouping on the defective wafers in the analyzed batch according to the defect type. In the first grouping, the defective wafers with the same defect type are classified into the same first group.

[0078] In the method of the embodiment of the present invention, the defects on the defective wafer are obtained by testing with testing equipment.

[0079] Step 4: Select one of the first groups as a selected group in the first grouping, and perform a second grouping on the defective wafers in the selected group according to the direction of the defect. In the second grouping, the defective wafers in the selected group with the same defect direction are classified into the same second group.

[0080] like FIG. 2A to FIG. 2C , which is a schematic diagram of defect directions of each second group in the second grouping in the method for analyzing wafer angles in semiconductor integrated circuit manufacturing according to an embodiment of the present invention; Figure 2A-2C A total of four defective wafers are shown, which are represented by marks 101a, 101b, 101c and 101d respectively. It can be seen that the four defective wafers all have the defect corresponding to the same mark 102, and the four wafers are obtained through the first grouping.

[0081] In the second grouping, Figure 2A The defective wafers 101a and 101b are grouped together. Figure 2B The defective wafers 101c are divided into a group, and the Figure 2C The defective wafers 101d shown in FIG. 1 are grouped together.

[0082] Step 5, calculating the direction difference between the defect directions of each of the second groups;

[0083] Compare Figure 2A and Figure 2BAs shown, when comparing, the notch 103 in the defective wafers 101a and 101b is used as a reference. Figure 2B The defect direction and Figure 2A The direction difference between the defect directions is angle α1, Figure 2C The defect direction and Figure 2A The direction difference between the defect directions is angle α2.

[0084] The site and the machine where the defect of each defective wafer in the selected group occurs are determined by combining the direction difference and the angle difference in the angle trajectory diagram of each defective wafer in the selected group. Usually, one site corresponds to the implementation of a process, and one site includes more than one machine, and each machine can implement the process of the site. However, in the actual process, after a batch of wafers enters the corresponding site, they usually enter the selected machine at the same time to implement the corresponding process. When the machine has a problem that causes defects in the wafer, the relative position of the defect inside the machine is fixed, but the wafer angle of the wafer inside the machine may be different, so there will be a situation where the defect type is the same but the defect direction is different. The angle trajectory diagram can display the wafer angle of each defective wafer at each site and the corresponding machine in each site, and the corresponding machine can be obtained by comparing the angle difference of the wafer angle and the direction difference of the defect direction.

[0085] In the method of the embodiment of the present invention, in step three, when the first group has more than two, steps four and five are repeated to sequentially implement the sites and machines where the corresponding defects of each of the first groups occur.

[0086] The embodiment of the present invention collects the machine angle data of each machine on the production line in advance, and then predicts the angle trajectory diagram of the corresponding analyzed wafer based on the machine angle data, and then performs a first grouping of defective wafers according to the defect type and a second grouping of a selected first group with the same defect type to obtain a second group, calculates the direction difference between the defect directions of each second group, and combines the direction difference and the angle difference obtained from the predicted angle trajectory diagram to analyze the wafer angle of each defective wafer in the second group when the defect occurs, and further determines the site and machine where the defect occurs from the wafer angle. Therefore, the wafer angle analysis of the embodiment of the present invention can be automatically realized without manual analysis, so it can greatly improve the analysis efficiency and accuracy, and save manpower and time.

[0087] like Figure 3 , which is a schematic diagram of the structure of a wafer angle analysis system in semiconductor integrated circuit manufacturing according to an embodiment of the present invention; the wafer angle analysis system in semiconductor integrated circuit manufacturing according to an embodiment of the present invention comprises:

[0088] The machine angle data collection module 201 is used to collect machine angle data on each machine on the production line of semiconductor integrated circuits. The machine angle is the angle of the wafer when the wafer is processed on the machine.

[0089] In an embodiment of the present invention, the machine angle data also includes data types of the machine angle, and the data types are defined using a portion associated with the machine angle, and the portion associated with the machine angle includes: a wafer loading port, a wafer loading locking chamber, an air lock chamber or a process chamber.

[0090] Among the data types, the part associated with the machine angle also includes: process menu, product or process number.

[0091] The machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

[0092] The machine angle data is collected automatically or input manually.

[0093] The angle trajectory diagram prediction module 202 is used to predict and form an angle trajectory diagram of each analyzed wafer in the analyzed batch during the process according to the machine angle data. The angle trajectory diagram is a distribution diagram of the wafer angles on the machine corresponding to each station of the analyzed wafer during the process.

[0094] The angle trajectory diagram includes the following changes in the wafer angle:

[0095] Dynamic transformation of up and down inheritance;

[0096] Fixed changes;

[0097] Angle regularity increases and decreases the angle;

[0098] Mirror image changes;

[0099] Diagonal changes.

[0100] The first defect grouping module 203 assumes that the defective wafer is the analyzed wafer with defects. The first defect grouping module 203 performs a first grouping on the defective wafers in the analyzed batch according to the defect type. In the first grouping, the defective wafers with the same defect type are classified into the same first group.

[0101] In the embodiment of the present invention, the defects on the defective wafer are obtained by testing with testing equipment.

[0102] The second defect grouping module 204 is used to select one of the first groups as a selected group in the first grouping, and to perform a second grouping on each of the defective wafers in the selected group according to the direction of the defect. In the second grouping, each of the defective wafers in the selected group with the same defect direction is classified into the same second group.

[0103] The comprehensive analysis module 205 is used to calculate the direction difference between the defect directions of each of the second groups and combine the direction difference with the angle difference in the angle trajectory diagram of each of the defective wafers in the selected group to determine the site and the machine where the defect of each of the defective wafers in the selected group occurs.

[0104] The wafer angle analysis system in semiconductor integrated circuit manufacturing of the embodiment of the present invention has been verified by experiments and can provide defect occurrence directions for multiple batches of goods without false alarms. In terms of manpower and time consumption, a single person needs more than 40 minutes to do it manually, while the system only needs 1 minute, which improves efficiency by 40 times.

[0105] The present invention has been described in detail above through specific embodiments, but these do not constitute limitations of the present invention. Without departing from the principle of the present invention, those skilled in the art may also make many variations and improvements, which should also be considered as the protection scope of the present invention.

Claims

1. A method for analyzing wafer angles in semiconductor integrated circuit manufacturing, characterized in that , including the following steps: Step 1, collecting machine angle data on each machine on a production line of a semiconductor integrated circuit, where the machine angle is the angle of the wafer when the wafer is processed on the machine; Step 2: predicting and forming an angle trajectory diagram of each analyzed wafer of the analyzed batch during the process according to the machine angle data, wherein the angle trajectory diagram is a distribution diagram of the wafer angles on the machine corresponding to each station of the analyzed wafer during the process; Step 3: Let the defective wafer be the analyzed wafer with defects, and perform a first grouping on the defective wafers in the analyzed batch according to the defect type. In the first grouping, the defective wafers with the same defect type are grouped into the same first group; Step 4: selecting one of the first groups as a selected group in the first grouping, and performing a second grouping on the defective wafers in the selected group according to the direction of the defect, wherein the defective wafers in the selected group with the same defect direction are grouped into the same second group in the second grouping; Step 5, calculating the direction difference between the defect directions of each of the second groups; The site and the tool where the defect of each defective wafer in the selected group occurs are determined by combining the direction difference and the angle difference in the angle trajectory diagram of each defective wafer in the selected group.

2. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing according to claim 1, characterized in that: In step one, the machine angle data also includes the data type of the machine angle, and the data type is defined using a portion associated with the machine angle, and the portion associated with the machine angle includes: a wafer loading port, a wafer loading lock chamber, an air lock chamber or a process chamber.

3. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing as claimed in claim 2, characterized in that: Among the data types, the part associated with the machine angle also includes: process menu, product or process number.

4. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing as claimed in claim 3, characterized in that: The machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

5. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing as claimed in claim 3, characterized in that: In step 1, the machine angle data is automatically collected or manually input.

6. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing as claimed in claim 1, characterized in that: The defects on the defective wafer are obtained by testing with testing equipment.

7. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing as claimed in claim 1, characterized in that: In step three, when the first group has more than two, steps four and five are repeated to sequentially implement the sites and machines where the corresponding defects of each of the first groups occur.

8. The method for analyzing wafer angle in semiconductor integrated circuit manufacturing as claimed in claim 1, characterized in that: In step 2, the angle trajectory diagram includes the following changes in the wafer angle: Dynamic transformation of up and down inheritance; Fixed changes; Angle regularity increases and decreases the angle; Mirror image changes; Diagonal changes.

9. A system for analyzing wafer angles in semiconductor integrated circuit manufacturing, characterized in that ,include: A machine angle data collection module is used to collect machine angle data on each machine on a production line of a semiconductor integrated circuit, where the machine angle is the angle of the wafer when the wafer is processed on the machine; An angle trajectory diagram prediction module, used to predict and form an angle trajectory diagram of each analyzed wafer of the analyzed batch during the process according to the machine angle data, wherein the angle trajectory diagram is a distribution diagram of the wafer angles on the machine corresponding to each station of the analyzed wafer during the process; a first defect grouping module, wherein the defective wafer is the analyzed wafer with defects, and the first defect grouping module performs a first grouping on the defective wafers in the analyzed batch according to the defect type, and in the first grouping, the defective wafers with the same defect type are classified into the same first group; A second defect grouping module is used to select one of the first groups as a selected group in the first grouping, and to perform a second grouping on the defective wafers in the selected group according to the direction of the defect, wherein the defective wafers in the selected group with the same defect direction are grouped into the same second group in the second grouping; A comprehensive analysis module is used to calculate the direction difference between the defect directions of each of the second groups and combine the direction difference with the angle difference in the angle trajectory diagram of each of the defective wafers in the selected group to determine the site and the machine where the defect of each of the defective wafers in the selected group occurs.

10. The wafer angle analysis system in semiconductor integrated circuit manufacturing as claimed in claim 9, characterized in that: The machine angle data also includes the data type of the machine angle, and the data type is defined using a portion associated with the machine angle. The portion associated with the machine angle includes: a wafer loading port, a wafer loading lock chamber, an air lock chamber or a process chamber.

11. The wafer angle analysis system in semiconductor integrated circuit manufacturing as claimed in claim 10, characterized in that: Among the data types, the part associated with the machine angle also includes: process menu, product or process number.

12. The wafer angle analysis system in semiconductor integrated circuit manufacturing as claimed in claim 11, characterized in that: The machine angle data also includes rule judgments assigned according to the data type, and the rule judgments assigned to the same data type are the same.

13. The wafer angle analysis system in semiconductor integrated circuit manufacturing as claimed in claim 11, characterized in that: The machine angle data is collected automatically or input manually.

14. The wafer angle analysis system in semiconductor integrated circuit manufacturing as claimed in claim 9, characterized in that: The defects on the defective wafer are obtained by testing with testing equipment.

15. The wafer angle analysis system in semiconductor integrated circuit manufacturing as claimed in claim 9, characterized in that: The angle trajectory diagram includes the following changes in the wafer angle: Dynamic transformation of up and down inheritance; Fixed changes; Angle regularity increases and decreases the angle; Mirror image changes; Diagonal changes.

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