Packaging equipment for chip processing

Abstract

The invention discloses packaging equipment for chip processing, and belongs to the technical field of chip packaging. Packaging equipment for chip processing comprises a conveying frame, two sets of transmission shafts are symmetrically arranged above the conveying frame, a conveying belt is in transmission connection between the two sets of transmission shafts, the packaging equipment further comprises a driving assembly used for driving the conveying belt to convey chips, ventilation holes are formed in the conveying belt, and protruding blocks are arranged between the adjacent ventilation holes; the chip conveying stability is improved, dust on chips can be removed and adsorbed in time in cooperation with a dust removal assembly, dust falling is prevented, and it is guaranteed that dust at the bottoms of the chips can be completely removed; the chip is not required to be clamped by a clamping mechanism, so that the problem that the working efficiency is reduced due to the setting of the error-tolerant rate is avoided, and when the position of the chip is calibrated, dust is further removed, the cleanliness of the chip is improved, and the packaging quality is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to packaging equipment for chip processing. Background Art

[0002] The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It also serves as a bridge to communicate the internal world of the chip with the external circuit. The contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board.

[0003] Most of the existing technologies achieve the clamping of chip substrates by setting flexible clamps, top frames and flexible clamps on the conveyor body. However, in actual use, it is difficult to ensure that the chip is in a centered state every time during transportation and chip placement. When the chip position is offset, it is necessary to ensure that the clamping mechanism has a large fault tolerance rate to ensure its own work efficiency. When the clamping mechanism has a small fault tolerance rate, the chip at the edge position is difficult to be clamped, resulting in a decrease in work efficiency. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that when the fault tolerance of the clamping mechanism is small, the chip at the edge position is difficult to be clamped, resulting in reduced work efficiency, and to propose a chip processing packaging device.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A packaging device for chip processing comprises a conveying frame, two groups of transmission shafts are symmetrically arranged above the conveying frame, a conveyor belt is transmission-connected between the two groups of transmission shafts, and also comprises: a driving component for driving the conveyor belt to convey the chips, ventilation holes are opened in the conveyor belt, and bumps are arranged between adjacent ventilation holes; a first limiting wheel and a second limiting wheel for positioning the chip before packaging are arranged above the conveying component, the first limiting wheel is arranged to move in the vertical direction, the second limiting wheel is arranged to move in the horizontal direction, and the second limiting wheel is symmetrically arranged on both sides of the conveyor belt.

[0007] Preferably, the driving assembly includes a traction air nozzle, which is slidably installed in the conveyor belt, and one side of the traction air nozzle is connected to an air duct, and the air duct is connected to an external fan. A connecting platform is provided in the conveyor belt, and the traction air nozzle and the connecting platform are slidably connected, and the air inlet of the traction air nozzle is arranged to fit the bottom of the conveyor belt.

[0008] In order to ensure the stability of the conveyor belt movement and minimize the chip displacement as much as possible, the driving assembly further includes a driving block and a moving block, and a first screw rod and an optical axis are symmetrically arranged on both sides of the connecting platform. The first screw rod is connected to the driving block through an internal threaded sleeve, and the optical axis is connected to the moving block through a linear bearing. A synchronous pulley is fixedly installed at one end of the first screw rod, and a first motor is arranged on one side of the conveying frame. A synchronous pulley is also fixedly installed at the output shaft end of the first motor, and the two sets of synchronous pulleys are connected by a transmission belt.

[0009] Preferably, a dust removal assembly for cleaning the chips is arranged above the conveying assembly, and the dust removal assembly includes a fixed bracket, a guide frame is fixedly connected to the center of the fixed bracket, a bellows is slidably arranged at the bottom of the guide frame, the bottom of the bellows is connected to an air outlet, and bristles are arranged on the bottom surface of the bellows around the air outlet.

[0010] In order to ensure that the traction structure of the traction nozzle has high horizontality and good balance performance, further, a second screw is rotatably installed in the guide frame, and a second motor is arranged on the top of the guide frame, the output shaft end of the second motor is transmission connected to the guide frame, the surface of the second screw is connected with a sliding sleeve through an internal threaded sleeve, and sliders are symmetrically connected on both sides of the sliding sleeve, a sliding groove is opened in the guide frame, the slider and the sliding groove are slidably connected, a synchronization rod is connected between the bellows and the slider, and the bellows is connected to an external blowing fan.

[0011] Preferably, brackets are symmetrically arranged on both sides of the connecting platform, an electric slide is fixedly mounted on the bracket, a moving frame is connected to the electric slide, and the second limiting wheel is arranged on the bottom surface of the moving frame.

[0012] Preferably, fixed frames are symmetrically arranged on both sides of the connecting platform, a cylinder is fixedly installed on the fixed frame, a connecting plate is fixedly connected to the top of the cylinder, a positioning plate is connected between the two groups of connecting plates, the first limiting wheel is arranged at the bottom of the positioning plate, and the first limiting wheel and the second limiting wheel are respectively arranged on both sides of the chip.

[0013] In order to utilize the link structure of the first limiting wheel to support the rotation of the rotating shaft, further, a sleeve is fixedly installed at the bottom of the positioning plate, and the first limiting wheel is rotatably connected to the outer wall of the sleeve.

[0014] In order to ensure that the air flows into the positioning plate to be used as a driving force, further, the positioning plate is provided with a cavity, and the positioning plate is connected to the bellows through a connecting hose.

[0015] In order to utilize air flow to drive the brush head to rotate on the surface of the conveyor belt to remove dust, further, a rotating shaft is rotatably installed in the sleeve, an impeller is arranged on the surface of the rotating shaft in the positioning plate, the rotating shaft extends to the bottom of the first limiting wheel, and a brush head is fixedly installed on the bottom end of the rotating shaft.

[0016] Compared with the prior art, the present invention provides a chip processing packaging device, which has the following beneficial effects:

[0017] 1. The chip processing packaging equipment is provided with a conveyor belt and a traction nozzle adsorbed and attached to the conveyor belt. The traction nozzle is driven to move on both sides of the connecting platform to drive the conveyor belt, thereby driving the chips above the conveyor belt to be transported, thereby ensuring the stability of chip transportation;

[0018] 2. The chip processing packaging equipment can not only adsorb the chip carrier for transportation by setting a traction nozzle under the chip, but also cooperate with the dust removal component to remove and adsorb the dust on the chip in time, so as to prevent the dust from falling back and affecting the insufficient adsorption traction force, thereby ensuring the chip positioning accuracy during the transportation process;

[0019] 3. The chip processing packaging equipment calibrates the position of the chip by setting the first limiting wheel and the second limiting wheel in the moving direction of the chip through lifting and positioning and pushing left and right, and does not need a clamping mechanism to clamp the chip, thereby avoiding the problem of reduced work efficiency caused by setting the fault tolerance rate;

[0020] 4. The chip processing packaging equipment is provided with a rotatable brush head under the first limiting wheel. The rotating axis of the brush head extends into the positioning plate, and an impeller is installed on the top of the rotating axis. The positioning plate and the bellows are connected. The fan is used to supply air, and the air flows to move the impeller to drive the brush head to rotate. When the chip is calibrated, dust is further removed to improve the cleanliness of the chip and ensure the packaging quality.

[0021] The parts not involved in the device are the same as the prior art or can be implemented by the prior art. The present invention improves the chip transportation stability. It can not only adsorb the chip carrier for transportation, but also cooperate with the dust removal component to remove the dust on the chip and adsorb it in time to prevent the dust from falling back and ensure that the dust on the bottom of the chip can be cleaned up. There is no need for a clamping mechanism to clamp the chip, avoiding the problem of reduced work efficiency due to the setting of the fault tolerance rate. When the chip is calibrated, dust is further removed to improve the cleanliness of the chip and ensure the packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the main three-dimensional structure of a chip processing packaging device proposed by the present invention;

[0023] Figure 2This is a rear perspective structural diagram of a chip processing packaging device proposed by the present invention;

[0024] Figure 3 A chip processing packaging device proposed by the present invention Figure 2 The enlarged structural diagram of part A in the middle;

[0025] Figure 4 This is a schematic diagram of the exploded structure of a chip processing packaging device proposed by the present invention;

[0026] Figure 5 This is a schematic diagram of the bottom structure of a bellows of a chip processing packaging device proposed by the present invention;

[0027] Figure 6 A schematic diagram of the internal structure of a positioning plate of a chip processing packaging device proposed by the present invention;

[0028] Figure 7 This is a schematic diagram of the conveyor belt and traction nozzle adsorption and bonding structure of a chip processing packaging device proposed by the present invention.

[0029] In the figure: 1. conveying frame; 2. connecting platform; 3. first screw rod; 4. conveyor belt; 5. optical axis; 6. first motor; 7. synchronous pulley; 8. transmission belt; 9. ventilation hole; 10. bump; 11. fixed bracket; 12. second motor; 13. guide frame; 14. second screw rod; 15. sliding sleeve; 16. slider; 17. slide groove; 18. synchronous rod; 19. bellows; 20. air outlet; 21. bristles; 22. connecting hose; 23. positioning plate; 24. sleeve; 25. first limiting wheel; 26. rotating shaft; 27. impeller; 28. brush head; 29. ​​driving block; 30. traction nozzle; 31. induced draft duct; 32. moving block; 33. transmission shaft; 34. bracket; 35. electric slide; 36. moving frame; 37. second limiting wheel; 38. fixed frame; 39. cylinder; 40. connecting plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] Example:

[0033] Reference Figure 1-Figure 7 A chip processing packaging device includes a conveying frame 1, two sets of transmission shafts 33 are symmetrically arranged above the conveying frame 1, a conveying belt 4 is transmission-connected between the two sets of transmission shafts 33, and a connecting platform 2 is arranged inside the conveying belt 4.

[0034] In this embodiment, a conveying frame 1 and a connecting platform 2 are provided to form a supporting structure for auxiliary packaging, a transmission shaft 33 is provided on both sides of the connecting platform 2, the transmission shaft 33 is rotatably provided on both sides above the conveying frame 1, and the conveyor belt 4 is wrapped around the surface of the two groups of transmission shafts 33 and is transmitted between the two groups of transmission shafts 33.

[0035] It should be noted that the conveying frame 1 includes legs, which adopt a hollow tube structure and are connected through a connecting platform 2. Ear plates are installed on both sides of the connecting platform 2, and the transmission shaft 33 is rotatably connected between the ear plates.

[0036] It also includes a driving assembly for driving the conveyor belt 4 to convey the chips. The conveyor belt 4 is provided with ventilation holes 9, and bumps 10 are provided between adjacent ventilation holes 9.

[0037] In this embodiment, a driving component is used to pull the conveyor belt 4 to drive the chips for transportation. Specifically, the driving component includes a traction air nozzle 30, which is slidably installed in the conveyor belt 4. One side of the traction air nozzle 30 is connected to an air duct 31, and the air duct 31 is connected to an external fan. A connecting platform 2 is provided in the conveyor belt 4. The traction air nozzle 30 and the connecting platform 2 are slidably connected, and the air inlet of the traction air nozzle 30 is fitted to the bottom of the conveyor belt 4. The traction air nozzle 30 adsorbs and fits the conveyor belt 4, thereby driving the chips above the conveyor belt 4 to be transported, thereby ensuring the stability of chip transportation.

[0038] It should be noted that in this example, the bump 10 provided includes a columnar structure at the bottom and a spherical structure connected to the top of the columnar structure, which can not only reduce the contact area between the bump 10 and the chip but also ensure the adsorption force.

[0039] The traction air nozzle 30 and the bottom surface of the conveyor belt 4 are attracted to each other. Considering that if the chip is completely attached to the upper surface of the conveyor belt 4, the dust on the bottom surface still cannot be completely removed, a bump 10 is provided on the upper surface of the conveyor belt 4, which can ensure that a gap is formed between the chip and the upper surface of the conveyor belt 4, and can ensure that the traction air nozzle 30 adsorbs the conveyor belt 4, so that the chip and the conveyor belt 4 are transported synchronously without setting up other clamping mechanisms, thereby avoiding the displacement of the chip caused by the clamping mechanism during the picking / flipping process; at the same time, the traction air nozzle 30 and the conveyor belt 4 are used for adsorption and traction, and the dust removal component can be cooperated to timely remove the floating dust. The driving assembly also includes a driving block 29 and a moving block 32. A first screw rod 3 and an optical axis 5 are symmetrically arranged on both sides of the connecting platform 2. The first screw rod 3 is connected to the driving block 29 through an internal threaded sleeve, and the optical axis 5 is connected to the moving block 32 through a linear bearing. A synchronous pulley 7 is fixedly installed at one end of the first screw rod 3, and a first motor 6 is arranged on one side of the conveying frame 1. A synchronous pulley 7 is also fixedly installed at the output shaft end of the first motor 6. The two sets of synchronous pulleys 7 are connected by a transmission belt 8.

[0040] In this embodiment, in the process of driving the conveyor belt 4 to move, the first motor 6 is started, and the first motor 6 drives the first screw rod 3 to rotate through the synchronous pulley 7 and the transmission belt 8. The surface of the first screw rod 3 drives the driving block 29 to move axially along the first screw rod 3 through the internal threaded sleeve. The driving block 29 and the moving block 32 are connected to the traction nozzle 30. Therefore, the traction nozzle 30 can absorb the conveyor belt 4 and pull it to move, thereby driving the chip to move to the bottom of the dust removal component.

[0041] A dust removal assembly for cleaning chips is provided above the conveying assembly, and the dust removal assembly includes a fixed bracket 11, a guide frame 13 is fixedly connected to the center position of the fixed bracket 11, a bellows 19 is slidably provided at the bottom of the guide frame 13, the bellows 19 is connected to an external blower, and the bottom of the bellows 19 is connected to an air outlet 20, and bristles 21 are provided on the bottom surface of the bellows 19 around the air outlet 20.

[0042] In this embodiment, a bellows 19 is connected to the bottom of the guide frame 13. After the external blower is started, the dust on the surface of the chip is blown away through the air outlet 20 connected to the bottom of the bellows 19. At the same time, when the chip continues to move forward, the bristles 21 act on the upper surface of the chip, thereby further improving the dust removal efficiency.

[0043] The traction nozzle 30 is used for adsorption and traction, and the traction nozzle 30 can cooperate with the dust removal component to remove and adsorb the dust on the chip in time to prevent the dust from falling back and ensure that the dust at the bottom of the chip can be cleaned.

[0044] A second screw rod 14 is rotatably installed in the guide frame 13, and a second motor 12 is arranged on the top of the guide frame 13. The output shaft end of the second motor 12 is transmission-connected to the guide frame 13. A sliding sleeve 15 is connected to the surface of the second screw rod 14 through an internal threaded sleeve. Slide blocks 16 are symmetrically connected to both sides of the sliding sleeve 15. A sliding groove 17 is provided in the guide frame 13. The slide blocks 16 and the sliding groove 17 are slidably connected. A synchronization rod 18 is connected between the bellows 19 and the slide block 16.

[0045] In this embodiment, a bellows 19 capable of being raised and lowered is provided. The height of the bellows 19 can be adjusted for chips of different sizes to blow air and remove dust. Specifically, the second motor 12 is started to drive the second screw rod 14 to rotate. A sleeve 15 is provided on the surface of the second screw rod 14. Both sides of the sleeve 15 are connected to sliders 16. Therefore, the rotation of the second screw rod 14 can drive the sleeve 15 to drive the slider 16 to slide vertically in the slide groove 17, thereby connecting the bellows 19 through the synchronization rod 18 to realize the up and down movement of the bellows 19.

[0046] A first limiting wheel 25 and a second limiting wheel 37 are arranged above the conveying assembly for positioning the chip before packaging. The first limiting wheel 25 is arranged to move in the vertical direction, and the second limiting wheel 37 is arranged to move in the horizontal reverse direction. The second limiting wheel 37 is symmetrically arranged on both sides of the conveyor belt 4.

[0047] Fixed frames 38 are symmetrically arranged on both sides of the connecting platform 2, and a cylinder 39 is fixedly installed on the fixed frame 38. A connecting plate 40 is fixedly connected to the top of the cylinder 39. A positioning plate 23 is connected between the two groups of connecting plates 40. The first limiting wheel 25 is arranged at the bottom of the positioning plate 23, and the first limiting wheel 25 and the second limiting wheel 37 are respectively arranged on both sides of the chip.

[0048] A first limiting wheel 25 is provided on one side of the fixed bracket 11, and is used to limit and align after moving out of the dust removal area below the fixed bracket 11, so as to eliminate the displacement generated during the dust removal process. Specifically, the cylinder 39 drives the positioning plate 23 between the two sets of connecting plates 40 to move downward, and the first limiting wheel 25 is rotated and arranged at the bottom of the positioning plate 23, and the outer ring of the first limiting wheel 25 after falling is in contact with one side of the chip.

[0049] It should be noted that the rotating setting of the first limiting wheel 25 can minimize the friction between the first limiting wheel 25 and the side wall of the chip. Due to the adsorption of the traction nozzle 30 and the conveyor belt 4, the chip is affected by the adsorption force and only has displacement in the conveying direction. Therefore, the first limiting wheel 25 is set in the conveying direction of the chip to perform positioning processing before packaging.

[0050] A sleeve 24 is fixedly installed at the bottom of the positioning plate 23, and a first limiting wheel 25 is rotatably connected to the outer wall of the sleeve 24. The positioning plate 23 is provided with a cavity, and the positioning plate 23 is connected to the bellows 19 through a connecting hose 22. A rotating shaft 26 is rotatably installed in the sleeve 24, and an impeller 27 is arranged on the surface of the rotating shaft 26 located in the positioning plate 23. The rotating shaft 26 extends to the bottom of the first limiting wheel 25, and a brush head 28 is fixedly installed at the bottom end of the rotating shaft 26.

[0051] In this embodiment, a cavity is opened in the positioning plate 23, and the positioning plate 23 and the bellows 19 are connected by a connecting hose 22. During the blowing process, the wind drives the air flow in the cavity of the positioning plate 23, and the pulsating impeller 27 drives the rotating shaft 26 to rotate in the sleeve 24. A brush head 28 is fixedly connected to the bottom end of the rotating shaft 26. During the rotation process, the brush head 28 can further clean the floating dust remaining on the dough sheet on the conveyor belt 4, which is promptly sucked away by the traction nozzle 30 to prevent the dust from affecting the adsorption strength between the chip and the traction nozzle 30, thereby ensuring that the chip is adsorbed by the traction force of the traction nozzle 30, maintaining the positioning accuracy during the transportation process, and ultimately ensuring the packaging quality.

[0052] Brackets 34 are symmetrically arranged on both sides of the connecting platform 2 , an electric slide 35 is fixedly mounted on the bracket 34 , a moving frame 36 is connected to the electric slide 35 , and a second limiting wheel 37 is arranged on the bottom surface of the moving frame 36 .

[0053] A movable frame 36 is provided on the other side of the fixed bracket 11. When the chip is cleaned and dusted, the electric slide 35 is started to slide the second limiting wheel 37 toward the center of the chip. The outer ring of the second limiting wheel 37 moves in contact with one side of the chip. During the movement, since the other side of the chip is in contact with the first limiting wheel 25, the second limiting wheel 37 can keep the chip in the packaging position unchanged on the upper surface of the conveyor belt 4 during the pushing process.

[0054] It should be noted that the bracket 34 and the connecting platform 2 are movable and can be moved according to the specifications of the chip, driving the second limiting wheel 37 and the first limiting wheel 25 to cooperate to control the positioning of the chip before packaging.

[0055] In the present invention, the chip is placed on the upper surface of the conveyor belt 4, the bottom surface of the chip is in contact with the bump 10, the first motor 6 is started, the driving blocks 29 and the moving blocks 32 on both sides are driven to move synchronously, thereby driving the traction nozzle 30 between the driving block 29 and the moving block 32 to move, and the external suction fan is started to use the traction nozzle 30 to suck the conveyor belt 4, thereby driving the chip on the conveyor belt 4 to be transported;

[0056] Considering that if the chip is completely attached to the upper surface of the conveyor belt 4, the dust on the bottom surface still cannot be completely removed, a bump 10 is provided on the upper surface of the conveyor belt 4, so no other clamping mechanism is required, thereby avoiding displacement of the chip caused by the clamping mechanism during the process of taking / flipping; at the same time, the traction nozzle 30 and the conveyor belt 4 are used for adsorption and traction, and the dust removal component can be used to timely remove the floating dust;

[0057] Start the external blower to blow away the dust on the chip surface through the air outlet 20 connected to the bottom of the bellows 19. Meanwhile, as the chip continues to move forward, the bristles 21 act on the chip surface, thereby further improving the dust removal efficiency.

[0058] The second motor 12 is started to drive the second screw rod 14 to rotate. A sliding sleeve 15 is provided on the surface of the second screw rod 14. The sliding sleeve 15 is connected to the sliders 16 on both sides. Therefore, the second screw rod 14 rotates to drive the sliding sleeve 15 to drive the slider 16 to slide vertically in the slide groove 17, thereby connecting the bellows 19 through the synchronization rod 18 to realize the up and down movement of the bellows 19, which can be used for the lifting of chips of different sizes, thereby expanding the application range of the dust removal component;

[0059] The positioning plate 23 and the bellows 19 are connected by a connecting hose 22. During the blowing process, the wind force drives the air in the cavity of the positioning plate 23 to flow, and the pulsating impeller 27 drives the rotating shaft 26 to rotate in the sleeve 24. A brush head 28 is fixedly connected to the bottom end of the rotating shaft 26. During the rotation process, the brush head 28 can further clean the dust remaining on the dough sheet on the conveyor belt 4 and be sucked away by the traction nozzle 30 in time.

[0060] When the chip is cleaned and dusted, the electric slide 35 is started to slide the second limiting wheel 37 toward the center of the chip. The outer ring of the second limiting wheel 37 moves in contact with one side of the chip. During the movement, since the other side of the chip is in contact with the first limiting wheel 25, the second limiting wheel 37 can keep the chip in the packaging position unchanged on the upper surface of the conveyor belt 4 during the movement.

[0061] The operation steps of this embodiment are as follows:

[0062] Step 1: Conveying: Place the chip on the upper surface of the conveyor belt 4, with the bottom surface of the chip in contact with the bump 10, start the first motor 6, drive the driving blocks 29 and the moving blocks 32 on both sides to move synchronously, thereby driving the traction nozzle 30 between the driving block 29 and the moving block 32 to move, start the external suction fan to use the traction nozzle 30 to suck the conveyor belt 4, thereby driving the chip on the conveyor belt 4 to be transported;

[0063] Step 2: Dust removal: When the chip is transported to the bottom of the bellows 19, start the external blower to blow away the dust on the chip surface through the bellows 19, and at the same time cooperate with the brush 21 under the bellows 19 to assist in dust removal;

[0064] Step 3: Dust removal: Since there is a gap between the chip and the conveyor belt 4 through the bump 10, the dust on the chip will be blown up and then be sucked away in time through the traction nozzle 30;

[0065] Step 4: When the chip is transported to the bottom of the first limiting wheel 25, the cylinder 39 is started to drive the first limiting wheel 25 to move down until the first limiting wheel 25 and one side of the chip are in contact, and the limiting is performed to prevent the chip from being displaced during dust removal.

[0066] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip processing packaging device, comprising a conveying frame (1), two sets of transmission shafts (33) are symmetrically arranged above the conveying frame (1), and a conveyor belt (4) is connected between the two sets of transmission shafts (33), characterized in that: Also includes: A driving assembly for driving a conveyor belt (4) to convey the chips, wherein ventilation holes (9) are provided in the conveyor belt (4), and bumps (10) are provided between adjacent ventilation holes (9); A first limiting wheel (25) and a second limiting wheel (37) for positioning the chip before packaging are arranged above the conveying assembly; the first limiting wheel (25) is arranged to move in a vertical direction, the second limiting wheel (37) is arranged to move in a horizontal direction, and the second limiting wheel (37) is symmetrically arranged on both sides of the conveying belt (4).

2. A chip processing packaging equipment according to claim 1, characterized in that: The driving assembly comprises a traction air nozzle (30), the traction air nozzle (30) is slidably installed in the conveyor belt (4), one side of the traction air nozzle (30) is connected to an air duct (31), the air duct (31) is connected to an external fan, a connecting platform (2) is arranged in the conveyor belt (4), the traction air nozzle (30) and the connecting platform (2) are slidably connected, and the air inlet of the traction air nozzle (30) is arranged to fit the bottom of the conveyor belt (4).

3. A chip processing packaging equipment according to claim 2, characterized in that: The driving assembly also includes a driving block (29) and a moving block (32). A first screw rod (3) and an optical axis (5) are symmetrically arranged on both sides of the connecting platform (2). The first screw rod (3) is connected to the driving block (29) through an internal threaded sleeve, and the optical axis (5) is connected to the moving block (32) through a linear bearing. A synchronous pulley (7) is fixedly installed on one end of the first screw rod (3). A first motor (6) is arranged on one side of the conveying frame (1). A synchronous pulley (7) is also fixedly installed on the output shaft end of the first motor (6). The two sets of synchronous pulleys (7) are connected by a transmission belt (8).

4. The chip processing packaging equipment according to claim 1, characterized in that: A dust removal component for cleaning the chips is arranged above the conveying component, the dust removal component comprising a fixed bracket (11), a guide frame (13) is fixedly connected at a central position on the fixed bracket (11), a bellows (19) is slidably arranged at the bottom of the guide frame (13), the bottom of the bellows (19) is connected to an air outlet (20), and bristles (21) are arranged on the bottom surface of the bellows (19) around the air outlet (20).

5. The chip processing packaging equipment according to claim 4, characterized in that: A second screw rod (14) is rotatably installed in the guide frame (13), and a second motor (12) is arranged on the top of the guide frame (13); the output shaft end of the second motor (12) is transmission-connected to the guide frame (13); a sliding sleeve (15) is connected to the surface of the second screw rod (14) via an internal threaded sleeve; sliders (16) are symmetrically connected to both sides of the sliding sleeve (15); a sliding groove (17) is provided in the guide frame (13); the slider (16) and the sliding groove (17) are slidably connected; a synchronization rod (18) is connected between the bellows (19) and the slider (16); and the bellows (19) is connected to an external blower.

6. The chip processing packaging equipment according to claim 2, characterized in that: Brackets (34) are symmetrically arranged on both sides of the connection platform (2); an electric slide (35) is fixedly mounted on the bracket (34); a moving frame (36) is connected to the electric slide (35); and the second limiting wheel (37) is arranged on the bottom surface of the moving frame (36).

7. The chip processing packaging equipment according to claim 2, characterized in that: Fixed frames (38) are symmetrically arranged on both sides of the connection platform (2), a cylinder (39) is fixedly mounted on the fixed frame (38), a connecting plate (40) is fixedly connected to the top of the cylinder (39), a positioning plate (23) is connected between two groups of the connecting plates (40), the first limiting wheel (25) is arranged at the bottom of the positioning plate (23), and the first limiting wheel (25) and the second limiting wheel (37) are respectively arranged on both sides of the chip.

8. The chip processing packaging equipment according to claim 7, characterized in that: A sleeve (24) is fixedly mounted on the bottom of the positioning plate (23), and the first limiting wheel (25) is rotatably connected to the outer wall of the sleeve (24).

9. The chip processing packaging equipment according to claim 8, characterized in that: The positioning plate (23) is provided with a cavity, and the positioning plate (23) is connected to the bellows (19) via a connecting hose (22).

10. The chip processing packaging equipment according to claim 9, characterized in that: A rotating shaft (26) is rotatably mounted in the sleeve (24); an impeller (27) is arranged on the surface of the rotating shaft (26) and is located in the positioning plate (23); the rotating shaft (26) extends to the bottom of the first limiting wheel (25); and a brush head (28) is fixedly mounted at the bottom end of the rotating shaft (26).

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