Camera module and electronic equipment

Abstract

The embodiment of the invention provides a camera module and electronic equipment, and the camera module comprises a support which is internally provided with an accommodation cavity; the light sensing chip is located in the containing cavity, and the light sensing chip is provided with a light sensing area; the lens is connected to the support, at least part of the lens is communicated with the containing cavity, and the lens is used for focusing external light on the photosensitive area; the camera module comprises a containing cavity and a shielding mechanism, the shielding mechanism is movably connected in the containing cavity, when the camera module is in a laser environment, the shielding mechanism shields at least part of the photosensitive area, and when the camera module is in a non-laser environment, the shielding mechanism relieves shielding of the photosensitive area.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a camera module and an electronic device. Background Art

[0002] As users pursue the ultimate user experience, the functions of electronic devices such as mobile phones and tablets are becoming more and more abundant, and the frequency of use of electronic devices is also increasing. For example, the camera module in electronic devices, as a function that can enable the shooting function, is used more and more frequently in various shooting scenes.

[0003] However, in some shooting scenes with lasers, such as the official light show of a major festival or the light show of a star's concert, the camera module may be damaged due to the high power density of the laser during shooting, thus affecting the imaging quality of the camera module and reducing the user experience of the electronic device. Summary of the invention

[0004] The present application aims to provide a camera module and an electronic device to solve the problem that the photosensitive chip in the existing camera module is easily damaged by laser.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, the present application discloses a camera module, the camera module comprising:

[0007] A bracket, wherein a receiving cavity is provided in the bracket;

[0008] A photosensitive chip, the photosensitive chip is located in the accommodating cavity, and the photosensitive chip has a photosensitive area;

[0009] A lens, which is connected to the bracket and at least partially communicated with the accommodating cavity, and is used to focus external light on the photosensitive area;

[0010] And a shielding mechanism, which is movably connected in the accommodating cavity. When the camera module is in a laser environment, the shielding mechanism shields at least a portion of the photosensitive area. When the camera module is in a non-laser environment, the shielding mechanism releases the shielding of the photosensitive area.

[0011] In a second aspect, the present application further discloses an electronic device, the electronic device comprising: a camera module as described in any one of the above

[0012] In an embodiment of the present application, the camera module may be provided with a movable shielding mechanism in the accommodating cavity of the bracket. When the camera module is in a laser environment, the shielding mechanism may shield at least part of the photosensitive area to reduce the amount of light projected from the external laser to the photosensitive area, reduce the surface temperature of the photosensitive area, and avoid damage to the photosensitive chip to a certain extent. When the camera module is in a non-laser environment, the shielding mechanism may move in the accommodating cavity to release the shielding of the photosensitive area, so that the photosensitive chip is in a better imaging state. Moreover, the movement of the shielding mechanism in the accommodating cavity can drive airflow to dissipate heat, further reduce the surface temperature of the photosensitive chip, and avoid damage to the photosensitive chip due to laser irradiation, thereby improving the shooting quality of the camera module and correspondingly improving the user experience of the electronic device using the camera module.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0015] Figure 1 is a structural schematic diagram of a shielding mechanism of a camera module in an initial state according to an embodiment of the present application;

[0016] Figure 2 yes Figure 1 The structural schematic diagram of the camera module shown is in a blocked state;

[0017] Figure 3 is a schematic diagram of the exposure process of the photosensitive pixels on the photosensitive chip described in the embodiment of the present application;

[0018] Figure 4 This is an exposure timing diagram of the photosensitive pixels on the photosensitive chip described in the embodiment of the present application.

[0019] Figure numerals: 10 - bracket, 100 - accommodating cavity, 11 - photosensitive chip, 110 - photosensitive area, 111 - photosensitive pixel, 12 - lens, 13 - shielding mechanism, 131 - movable part, 132 - coil, 133 - magnetic part, 134 - shielding plate, 14 - light-transmitting sheet, 15 - circuit board, 16 - wire, 17 - laser detection mechanism, 18 - controller. DETAILED DESCRIPTION

[0020] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0021] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0022] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] Reference Figure 1 , showing a schematic structural diagram of a shielding mechanism of a camera module in an initial state according to an embodiment of the present application, referring to Figure 2 , showing Figure 1 The structural schematic diagram of the camera module shown is in a blocked state.

[0025] like Figure 1 and Figure 2As shown, the camera module may specifically include: a bracket 10, in which a receiving cavity 100 is provided; a photosensitive chip 11, which is located in the receiving cavity 100 and has a photosensitive area 110; a lens 12, which is connected to the bracket 10 and at least partially communicated with the receiving cavity 100, and can be used to focus external light on the photosensitive area 110; and a shielding mechanism 13, which is movably connected in the receiving cavity 100. Figure 2 As shown, when the camera module is in a laser environment, the shielding mechanism 13 shields at least part of the photosensitive area 110, such as Figure 1 As shown, when the camera module is in a non-laser environment, the shielding mechanism 13 can release the shielding of the photosensitive area 110.

[0026] In the embodiment of the present application, the camera module can be provided with a movable shielding mechanism 13 in the accommodating cavity 100 of the bracket 10. When the camera module is in a laser environment, the shielding mechanism 13 can shield at least part of the photosensitive area 110 to reduce the amount of light projected from the external laser to the photosensitive area 110, reduce the surface temperature of the photosensitive area 110, and avoid damage to the photosensitive chip 11 to a certain extent. When the camera module is in a non-laser environment, the shielding mechanism 13 can move in the accommodating cavity 100 to remove the shielding of the photosensitive area 110, so that the photosensitive chip 11 is in a better imaging state. Moreover, the movement of the shielding mechanism 13 in the accommodating cavity 100 can drive the airflow to dissipate heat, further reduce the surface temperature of the photosensitive chip 11, and avoid damage to the photosensitive chip 11 caused by laser irradiation, thereby improving the shooting quality of the camera module and correspondingly improving the user experience of the electronic device using the camera module.

[0027] In a specific application, the bracket 10 can be used as a support member of the camera module to support the functional components in the camera module. A housing cavity 100 can be provided in the bracket 10, and the housing cavity 100 can be used to accommodate functional components such as a photosensitive chip 11, a filter (not shown in the figure), and a transparent sheet 14. The lens 12 is connected to the bracket 10. After the external light enters the lens 12, since the lens 12 has the function of converging light, the lens 12 can focus the light on the photosensitive area 110 of the photosensitive chip 11. The photosensitive area 110 of the photosensitive chip 11 can be provided with a plurality of photosensitive pixels 111, and the photosensitive pixels 111 can be photosensitive and exposed to form an image. In practical applications, when the camera module is in a laser environment, for example, laser pen irradiation, laser irradiation in a light show, etc., the lens 12 can focus the external laser to the photosensitive area 110. The laser focus on the photosensitive area 110 is prone to form a continuous high temperature (greater than 300°C). When the temperature at the laser focus on the photosensitive area 110 exceeds the threshold of damage to the photosensitive chip 11, the surface of the photosensitive chip 11 will be burned, thereby causing laser damage to the photosensitive chip 11 and affecting the imaging effect of the photosensitive chip 11. For example, point-shaped, cross-shaped or vertical line-shaped damage may occur during the shooting process.

[0028] like Figure 1 and Figure 2 As shown, the camera module may further include a circuit board 15, which may be disposed at the bottom of the bracket 10 and enclosed with the bracket 10 to form a receiving cavity 100. The photosensitive chip 11 may be disposed on the circuit board 15. Figure 1 and Figure 2 As shown, the circuit board 15 can be electrically connected to the circuit board 15 through the wire 16.

[0029] like Figure 3 As shown, the photosensitive area 110 is provided with a plurality of photosensitive pixels 111, and the photosensitive pixels 111 may include an exposure state and a non-exposure state; wherein, when the camera module is in the laser environment, the shielding mechanism 13 shields at least part of the photosensitive pixels 111 that are in the non-exposure state.

[0030] In a specific application, the exposure mode of the photosensitive pixel 111 may include row-by-row exposure and global exposure. Row-by-row exposure is a common mode of the existing photosensitive pixel 111. The embodiment of the present application is only described by taking the exposure mode of the photosensitive pixel 111 as row-by-row exposure. The exposure mode of the photosensitive pixel 111 as global exposure can be referred to for execution.

[0031] like Figure 3As shown, the exposure of the photosensitive pixels 111 row by row means that the exposure starts from the first row, and the second row starts to be exposed after a row cycle ends. And so on, after n-1 rows, the nth row starts to be exposed. After the exposure of the first row is completed, the data is read out, as shown in FIG. Figure 4 As shown, it takes a row cycle time T0 (including row exposure time T1 and row blanking time T2) to read out a row of photosensitive pixels 111. After the first row of photosensitive pixels 111 is completely read out, the second row just starts to be read out, and so on. After the n-1th row of photosensitive pixels 111 is read out, the nth row starts to be read out, until the entire image is completely read out. The exposure time of each row of the row-by-row exposure is expected to be in the microsecond level, but since the entire row of photosensitive pixels 111 generally exceeds 1000 rows, it is expected that the entire photosensitive pixels 111 complete one exposure in milliseconds.

[0032] In the present application embodiment, Figure 3 As shown, exposure starts from the first row of photosensitive pixels 111, and after the exposure of the third row of photosensitive pixels 111 is completed, the exposure of the fourth row of photosensitive pixels 111 can be started. At this time, the fourth row of photosensitive pixels 111 are photosensitive pixels 111 in an exposed state, and the photosensitive pixels 111 outside the fourth row are photosensitive pixels 111 in a non-exposed state. Figure 3 As shown, when the camera module is in a laser environment, the shielding mechanism 13 can only shield the photosensitive pixels 111 outside the 4th row to avoid the shielding mechanism 13 shielding the 4th row of pixels in an exposed state and affecting the imaging of the 4th row of photosensitive pixels 111.

[0033] In a specific application, when the photosensitive pixel 111 is in an exposure state, the photosensitive pixel 111 can convert the optical signal into an electrical signal, and then convert the electrical signal into an image. When the photosensitive pixel 111 is in a non-exposure state, the optical signal will not be converted into an electrical signal when irradiated on the photosensitive chip 11, and no image will be formed. When the photosensitive pixel 111 is in the exposure state, the photosensitive pixel 111 cannot be blocked because of the need for imaging. When the photosensitive pixel 111 is in a non-exposure state, since the photosensitive pixel 111 does not need to be imaged, even if it is blocked, it will not affect the imaging of the photosensitive chip 11. Therefore, while not affecting the imaging of the photosensitive chip 11, the temperature of the photosensitive area 110 can also be reduced to avoid laser damage to the photosensitive chip 11.

[0034] In some optional embodiments of the present application, the camera module may further include: a laser detection mechanism 17, the laser detection mechanism 17 is connected to the bracket 10, the laser detection mechanism 17 can be used to detect laser intensity, when the laser intensity is greater than a first threshold value, the environment of the camera module is a laser environment, when the laser intensity is less than or equal to the first threshold value, the environment of the camera module is a non-laser environment.

[0035] In specific applications, the first threshold value can be determined based on the laser damage failure mechanism and the characteristics of the laser. When the laser intensity in the environment is less than or equal to the first threshold value, it can be considered that there is no laser in the environment, or although there is laser, it does not affect the normal use of the camera module, nor does it damage the photosensitive chip 11 of the camera module. Therefore, there is no need to start the shielding mechanism 13 to shield the photosensitive area 110. When the laser intensity in the environment is greater than the first threshold value, it can be considered that the laser in the environment may affect the normal use of the camera module, or damage the photosensitive chip 11 in the camera module. Therefore, it is necessary to start the shielding mechanism 13 to shield at least part of the photosensitive area 110 to avoid the photosensitive area 110 having an overly high temperature area causing damage to the photosensitive chip 11, affecting the imaging quality of the camera module.

[0036] For example, the laser detection mechanism 17 can be made of a composite material of photonic crystals and liquid crystal monomers. The potential difference across the laser detection mechanism 17 increases with the increase of light intensity, so it has the function of detecting laser intensity in real time. Compared with ordinary light, the main feature of laser is its high power density. Therefore, a power density threshold can be set. When the power density of ambient light exceeds the power density threshold, it can be considered that there is laser in the ambient light, and the laser intensity is greater than the first threshold, that is, the camera module is in the laser environment. At this time, the laser detection mechanism 17 can feed back an electrical signal to the shielding mechanism 13 to control the shielding mechanism 13 to shield at least part of the photosensitive area 110.

[0037] Optionally, the laser detection mechanism 17 is at least partially exposed to the bracket 10 and is arranged close to the lens 12 so that the laser detection mechanism 17 can detect the laser intensity in the environment. In a specific application, only the detection end of the laser detection mechanism 17 can be exposed to the bracket 10 so that the detection end is exposed to the environment described by the camera module. Alternatively, the entire laser detection mechanism 17 can be exposed to the bracket 10 so that the entire laser detection mechanism 17 is exposed to the environment described by the camera module. The embodiment of the present application does not specifically limit the setting and exposure method of the laser detection mechanism 17.

[0038] It should be noted that, in actual applications, the laser detection mechanism 17 can also be set at other positions in the camera module according to actual needs, for example, close to the photosensitive chip 11, or on the side of the bracket 10, etc. The embodiment of the present application does not limit the specific position of the laser detection mechanism 17.

[0039] In some optional embodiments of the present application, the camera module may further include a controller 18, which is electrically connected to the laser detection mechanism 17 and the shielding mechanism 13, respectively. The controller 18 can be used to control the shielding mechanism 13 to shield at least part of the photosensitive area 110 when the laser detection mechanism 17 detects that the camera module is in the laser environment, and to control the shielding mechanism 13 to release the shielding of the photosensitive area 110 when the laser detection mechanism 17 detects that the camera module is in the non-laser environment.

[0040] like Figure 1 and Figure 2 As shown, the controller 18 can be set on the circuit board 15 and electrically connected to the laser detection mechanism 17 and the shielding mechanism 13 respectively. When the laser detection mechanism 17 detects that the laser intensity in the ambient light is greater than the first threshold value, an electrical signal can be sent to the controller 18. Based on the electrical signal, the controller 18 can control the shielding mechanism 13 to shield at least part of the photosensitive area 110 to reduce the amount of light projected by the external laser to the photosensitive area 110, thereby avoiding the phenomenon of overheating of the photosensitive area 110. When the laser detection mechanism 17 detects that the laser intensity in the ambient light is less than or equal to the first threshold value, another electrical signal can be sent to the controller 18. Based on the electrical signal, the controller 18 can control the shielding mechanism 13 to release the shielding of the photosensitive area 110, so that the photosensitive area 110 can obtain sufficient light input, thereby improving the imaging quality of the photosensitive area 110.

[0041] like Figure 1 and Figure 2 As shown, the camera module may further include a circuit board 15, the circuit board 15 is connected to the bracket 10 and encloses the bracket 10 to form a receiving cavity 100, the photosensitive chip 11 is connected to the circuit board 15; the shielding mechanism 13 may specifically include a movable part 131, a coil 132, a magnetic part 133 and a shielding plate 134, the movable part 131 is movably connected to the circuit board 15, the shielding plate 134 is connected to the movable part 131, one of the coil 132 and the magnetic part 133 is connected to the shielding plate 134, and the other of the coil 132 and the magnetic part 133 is connected to the shielding plate 134. It is connected to the circuit board 15, and the coil 132 and the magnetic component 133 are arranged opposite to each other; wherein, when the camera module is in a laser environment, based on the electromagnetic induction between the coil 132 and the magnetic component 133, the coil 132 or the magnetic component 133 drives the baffle 134 to block at least part of the photosensitive area 110; and when the camera module is in a non-laser environment, based on the electromagnetic induction between the coil 132 and the magnetic component 133, the coil 132 or the magnetic component 133 drives the baffle 134 to release the blocking of the photosensitive area 110.

[0042] That is, the movable part 131 can move relative to the photosensitive chip 11, so that the shielding plate 134 connected to the movable part 131 can move relative to the photosensitive chip 11 under the drive of the coil 132 or the magnetic part 133, so as to achieve the function of shielding the photosensitive area 110 or removing the shielding of the photosensitive area 110. In practical applications, during the movement of the shielding plate 134, the airflow in the accommodating chamber 100 can also be disturbed to increase the speed of the airflow in the accommodating chamber 100, thereby reducing the surface temperature of the photosensitive chip 11 and avoiding laser damage to the photosensitive area 110. In practical applications, the coil 132 can be electrically connected to the controller 18, and the controller 18 can be used to control the direction and size of the current in the coil 132 to change the interaction force between the coil 132 and the magnetic part 133, so as to adjust the movement range of the shielding plate 134, so as to achieve the purpose of adjusting the shielding plate 134 to shield the photosensitive area 110.

[0043] The following is one Figure 1 and Figure 2 An example of the working process of the camera module shown:

[0044] First, when the laser detection mechanism 17 detects that the environment in which the camera module is located is a non-laser environment, the shielding mechanism 13 can be Figure 1 The initial state shown is that the shielding plate 134 does not block the photosensitive area 110 at all. At this time, the camera module can be used normally.

[0045] Next, when the camera module switches to the laser environment, the laser detection mechanism 17 can detect that the laser intensity in the environment is greater than the first threshold, that is, the environment described by the camera module is a laser environment. At this time, the laser detection mechanism 17 can send a control signal to the controller 18, and the controller 18 can control the current direction and magnitude of the coil 132 so that an electromagnetic induction effect is generated between the coil 132 and the magnetic member 133. The magnetic force of the magnetic member 133 acting on the coil 132 can push the coil 132 to drive the shielding plate 134 to reach a specified position to shield part of the photosensitive area 110.

[0046] As the exposure of the photosensitive chip 11 is transferred line by line and the gap between the exposure time TI and the line blanking time T2 of the photosensitive chip 11 changes, the shielding mechanism 13 can change its position accordingly, thereby reducing the surface temperature of the photosensitive chip 11, and ultimately avoiding damage to the photosensitive chip 11 in the camera module. Since the shielded photosensitive pixels 111 are in an unexposed state and do not need to be exposed, they do not affect the normal photography of the camera module.

[0047] Next, when the camera module moves from the laser environment to the non-laser environment, if the laser detection mechanism 17 detects that the light power density is lower than the set threshold for a long time, it can be considered that the environment described by the camera module is a laser environment. At this time, the laser detection mechanism 17 will again feed back an electrical signal to the controller 18, and the controller 18 will control the coil 132 to be energized, and by adjusting the current direction and magnitude of the coil 132, the shielding plate 134 can be driven back under the action of the Ampere force. Figure 1 The initial position shown, at this time, the camera module can still work normally.

[0048] In actual applications, when the shielding mechanism 13 uses a combination of coils 132 and magnetic parts 133 to drive the shielding plate 134 to move, with existing technology, the shielding plate 134 can stably change its position within 10ms (where 10ms is the exposure time from the first row of photosensitive pixels 111 to the last row of photosensitive pixels 111).

[0049] For example, assuming that the photosensitive area 110 of the photosensitive chip 11 is provided with 4000 rows of photosensitive pixels 111, the exposure time of each row of photosensitive pixels 111 is 1um, the corresponding average movement speed is 0.4um / us, and the control accuracy can be less than the exposure time of 2 rows of photosensitive pixels 111 (about 2um), the actual control accuracy requirements can be confirmed in combination with the actual design, and it is estimated that the accuracy control is 10um (about the exposure time of 10 rows of photosensitive pixels 111) which can fully meet the requirements. That is, the use of coils 132 and magnetic parts 133 to drive the shielding plate 134 to switch positions can meet the requirements of stable position change within a specified time.

[0050] It should be noted that the drawings described in the embodiments of the present application only show the case where the coil 132 is connected to the shielding plate 134 and the magnetic member 133 is connected to the circuit board 15. In actual applications, the coil 132 may also be connected to the circuit board 15, and the magnetic member 133 may be connected to the shielding plate 134. The embodiments of the present application do not limit the specific positions of the coil 132 and the magnetic member 133.

[0051] Optionally, the movable member 131 may include an elastic member, one end of which is connected to the circuit board 15, and the other end of which is connected to the shielding plate 134. The shielding plate 134 may be driven to move in a certain direction through elastic deformation of the elastic member. Figure 1 The initial state shown and Figure 2 Switches between the occlusion states shown.

[0052] For example, the elastic member may include but is not limited to any one of a spring and a spring, and the specific type of the elastic member may not be limited in the embodiment of the present application. Since the elastic member has a simple structure and stable performance, when the movable member 131 is the elastic member, the shielding mechanism 13 may have the advantages of simple structure and stable performance.

[0053] Alternatively, the movable member 131 may further include a ball, which is connected between the circuit board 15 and the shielding plate 134. The rolling of the ball on the circuit board 15 can drive the shielding plate 134 to move in a certain direction. Figure 1 The initial state shown and Figure 2 Since the ball has the advantage of smooth movement, when the movable member 131 is the ball, the shielding mechanism 13 can also have the advantage of smooth movement.

[0054] It should be noted that Figure 1 and Figure 2 Only the case where the movable part 131 is an elastic part is shown in the figure, and the case where the movable part 131 is a ball or other parts can be implemented by reference.

[0055] In another optional embodiment of the present application, the shielding plate 134 can be tilted relative to the circuit board 15. In this way, when the shielding plate 134 moves relative to the photosensitive chip 11 to shield the photosensitive area 110 or remove the shielding of the photosensitive area 110, the shielding plate 134 can increase the disturbing effect of the airflow in the accommodating cavity 100, increase the flow speed of the airflow in the accommodating cavity 100, so as to further reduce the surface temperature of the photosensitive chip 11 and avoid laser damage caused by overheating of the photosensitive area 110.

[0056] It should be noted that the inclination angle of the shielding plate 134 relative to the circuit board 15 can be 5 degrees, 8 degrees or 15 degrees, etc., and the embodiment of the present application does not limit the inclination angle of the shielding plate 134 relative to the circuit board 15. Moreover, in some embodiments, the shielding plate 134 can also be arranged parallel to the circuit board 15, and the embodiment of the present application does not limit this.

[0057] In some other optional embodiments of the present application, the shielding mechanism 13 may also include a piezoelectric mechanism or a memory metal mechanism. Specifically, the piezoelectric mechanism and the memory metal mechanism can both change shape when powered on, so that the shielding mechanism 13 switches between a state of shielding the photosensitive area 110 and a state of releasing the shielding of the photosensitive area 110, so as to avoid laser damage to the photosensitive area 110.

[0058] It should be noted that in specific applications, technical personnel in this field can set the shielding mechanism 13 to one or more of an electromagnetic + elastic part mechanism, an electromagnetic + ball mechanism, a piezoelectric mechanism or a memory metal mechanism according to actual needs, and the embodiments of the present application are not limited to this.

[0059] In summary, the camera module described in the embodiments of the present application may at least include the following advantages:

[0060] In an embodiment of the present application, the camera module may be provided with a movable shielding mechanism in the accommodating cavity of the bracket. When the camera module is in a laser environment, the shielding mechanism may shield at least part of the photosensitive area to reduce the amount of light projected from the external laser to the photosensitive area, reduce the surface temperature of the photosensitive area, and avoid damage to the photosensitive chip to a certain extent. When the camera module is in a non-laser environment, the shielding mechanism may move in the accommodating cavity to release the shielding of the photosensitive area, so that the photosensitive chip is in a better imaging state. Moreover, the movement of the shielding mechanism in the accommodating cavity can drive airflow to dissipate heat, further reduce the surface temperature of the photosensitive chip, and avoid damage to the photosensitive chip due to laser irradiation, thereby improving the shooting quality of the camera module and correspondingly improving the user experience of the electronic device using the camera module.

[0061] An embodiment of the present application provides an electronic device, which may include but is not limited to at least one of a mobile phone, a tablet computer, and a wearable device. The embodiment of the present application may not limit the specific type of the electronic device.

[0062] It should be noted that in the embodiment of the present application, the camera module in the electronic device has the same structure as the camera module in the above embodiments, and its beneficial effects are also similar, which is not limited here.

[0063] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0064] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that: The camera module comprises: A support (10), wherein a receiving cavity (100) is provided in the support (10); A photosensitive chip (11), the photosensitive chip (11) being located in the accommodating cavity (100), and the photosensitive chip (11) having a photosensitive area (110); a lens (12), the lens (12) being connected to the bracket (10) and at least partially communicating with the accommodating cavity (100), the lens (12) being used to focus external light onto the photosensitive area (110); and a shielding mechanism (13), wherein the shielding mechanism (13) is movably connected in the accommodating cavity (100), and when the camera module is in a laser environment, the shielding mechanism (13) shields at least a portion of the photosensitive area (110), and when the camera module is in a non-laser environment, the shielding mechanism (13) releases the shielding of the photosensitive area (110).

2. The camera module according to claim 1, characterized in that: The camera module further comprises: a laser detection mechanism (17), the laser detection mechanism (17) being connected to the bracket (10), the laser detection mechanism (17) being used to detect laser intensity; when the laser intensity is greater than a first threshold, the environment in which the camera module is located is a laser environment; and when the laser intensity is less than or equal to the first threshold, the environment in which the camera module is located is a non-laser environment.

3. The camera module according to claim 2, characterized in that: The laser detection device is at least partially exposed from the bracket (10) and is arranged close to the lens (12).

4. The camera module according to claim 2, characterized in that: The camera module further comprises a controller (18), wherein the controller (18) is electrically connected to the laser detection mechanism (17) and the shielding mechanism (13), respectively. The controller (18) is used to control the shielding mechanism (13) to shield at least a portion of the photosensitive area (110) when the laser detection mechanism (17) detects that the camera module is in the laser environment, and to control the shielding mechanism (13) to release the shielding of the photosensitive area (110) when the laser detection mechanism (17) detects that the camera module is in the non-laser environment.

5. The camera module according to claim 1, characterized in that: The photosensitive area (110) is provided with a plurality of photosensitive pixels (111), and the photosensitive pixels (111) include an exposure state and a non-exposure state; wherein, When the camera module is in the laser environment, the shielding mechanism (13) shields at least part of the photosensitive pixels (111) that are in the non-exposed state.

6. The camera module according to claim 1, characterized in that: The camera module further comprises a circuit board (15), wherein the circuit board (15) is connected to the bracket (10) and encloses the bracket (10) to form the accommodating cavity (100), and the photosensitive chip (11) is connected to the circuit board (15); The shielding mechanism (13) comprises a movable part (131), a coil (132), a magnetic part (133) and a shielding plate (134); the movable part (131) is movably connected to the circuit board (15); the shielding plate (134) is connected to the movable part (131); one of the coil (132) and the magnetic part (133) is connected to the shielding plate (134); the other of the coil (132) and the magnetic part (133) is connected to the circuit board (15); and the coil (132) and the magnetic part (133) are arranged opposite to each other; Wherein, when the camera module is in a laser environment, based on the electromagnetic induction between the coil (132) and the magnetic component (133), the coil (132) or the magnetic component (133) drives the shielding plate (134) to shield at least a portion of the photosensitive area (110); when the camera module is in a non-laser environment, based on the electromagnetic induction between the coil (132) and the magnetic component (133), the coil (132) or the magnetic component (133) drives the shielding plate (134) to release the shielding of the photosensitive area (110).

7. The camera module according to claim 6, characterized in that: The movable member (131) comprises an elastic member, one end of which is connected to the circuit board (15), and the other end of which is connected to the shielding plate (134); Alternatively, the movable member (131) comprises a ball bearing, and the ball bearing is connected between the circuit board (15) and the shielding plate (134).

8. The camera module according to claim 6, characterized in that: The shielding plate (134) is inclined relative to the circuit board (15).

9. The camera module according to claim 1, characterized in that: The shielding mechanism (13) comprises a piezoelectric mechanism or a memory metal mechanism.

10. An electronic device, characterized in that: The electronic device comprises: the camera module according to any one of claims 1 to 9.

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