Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment, the circuit board assembly comprises a first circuit board, a first electronic component and a buffer structure, the buffer structure is arranged on the periphery of the first electronic component, and the distance from the top of the buffer structure to the first circuit board is greater than the distance from the top end of the first electronic component to the first circuit board. When the circuit board assembly is subjected to external force, the buffer structure can bear the acting force acting on the first electronic component, the internal stress of the first electronic component is smaller, the probability of deformation failure is smaller, and the stress at the connection position between the first electronic component and the first circuit board is smaller. The probability that the first electronic component is separated from the first circuit board is smaller, and the reliability and the stability of the circuit board assembly and the electronic equipment are higher.

Description

Technical Field

[0001] The present application relates to the field of terminal device hardware, and in particular, to a circuit board assembly and an electronic device. Background Art

[0002] Electronic devices such as mobile phones and tablet computers have limited internal space. Electronic components on the circuit boards inside the electronic devices are prone to being squeezed or collided with adjacent components (for example, another circuit board), resulting in deformation and failure, especially when the electronic devices are dropped or subjected to external forces.

[0003] How to improve the reliability of electronic components on circuit boards is a question worth considering. Summary of the invention

[0004] The present application provides a circuit board assembly, wherein a buffer structure is provided on the periphery of the electronic components on the circuit board assembly, and the buffer structure can bear the force acting on the electronic components, thereby reducing the probability of failure of the electronic components and increasing reliability.

[0005] In a first aspect, a circuit board assembly is provided, comprising: a first circuit board, a first electronic component and a buffer structure, wherein the first electronic component is mounted on the first circuit board, the buffer structure is arranged at the periphery of the first electronic component, and the distance from the top of the buffer structure to the first circuit board is greater than the distance from the top of the first electronic component to the first circuit board.

[0006] The top of the first electronic component is the end of the first electronic component away from the first circuit board. When the distances from different areas of the top of the first electronic component to the first circuit board are equal, or when the top of the first electronic component forms a plane parallel to the plane where the first circuit board is located, the top of the first electronic component may refer to the top surface of the first electronic component or any area on the top surface. When the distances from different parts of the top of the first electronic component to the first circuit board are unequal, the top of the first electronic component may refer to one or more parts of the top of the first electronic component that are farthest from the first circuit board.

[0007] In a possible implementation manner, the shape of the buffer structure may be determined according to the shape of the first electronic component.

[0008] Here, the outer periphery of the first electronic component includes the top end and at least part of the periphery (all four sides) of the first electronic component.

[0009] When the circuit board assembly is subjected to external force, the buffer structure located on the top of the first electronic component can bear the force that originally directly acts on the first electronic component. The buffer structure can convert part of the mechanical energy into internal energy, reducing the magnitude of the external force directly acting on the first electronic component. The probability of failure of the first electronic component due to internal stress is lower, the probability of internal stress generated at the connection position between the first electronic component and the first circuit board is lower, and the reliability and stability of the first electronic component and the circuit board assembly are higher.

[0010] In combination with the first aspect, in some implementations of the first aspect, the first buffer structure includes a first receiving portion, the first receiving portion is attached to the top of the first electronic component, and the top of the first buffer structure includes the first receiving portion.

[0011] In a possible implementation, one end of the first electronic component away from the first circuit board is a plane. For example, the first electronic component is a chip.

[0012] The first receiving portion of the buffer structure can be directly attached to the top of the first electronic component. The buffer structure has a simple shape and is easy to install and disassemble, which is beneficial to improving the installation and maintenance efficiency of the first electronic component.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the buffer structure includes a side wall, which is arranged around the first electronic component, the first end of the side wall is abutted against the first circuit board, the second end of the side wall is arranged away from the first circuit board, and the top of the first buffer structure includes the second end of the side wall.

[0014] In a possible implementation manner, the side wall includes an extension portion, which extends from the side wall toward a middle area of ​​the first electronic component, and the extension portion is located above the first electronic component.

[0015] The extension portion located above the electronic component can be regarded as a limiting structure. When the circuit board assembly falls, the first electronic component can be confined in the space below the extension portion, which is beneficial to improve the protection level of the first electronic component.

[0016] One end of the side wall surrounding the outside of the first electronic component is supported on the first circuit board, and the other end is located above the top of the first electronic component. When the circuit board assembly is subjected to external force, the side wall located above the top of the first electronic component can bear the force that originally directly acts on the first electronic component. This technical solution is conducive to reducing the probability of failure of the first electronic component and the circuit board assembly, and improving the reliability and stability of the first electronic component and the circuit board assembly.

[0017] The buffer structure provided with a receiving portion and a side wall can basically completely surround the periphery of the first electronic component. The forces from various directions may originally act directly on the first electronic component. In this solution, these forces will act on the buffer structure, and the probability of the first electronic component being affected by external forces is smaller, and the reliability of the circuit board assembly and the first electronic component is higher.

[0018] In combination with the first aspect, in certain implementations of the first aspect, the second end of the side wall is connected to and flush with the first receiving portion.

[0019] In a possible implementation, the side wall and the first receiving portion can be manufactured in one processing step.

[0020] The buffer structure including the side wall and the first receiving portion at the same time has a better protection effect on the first electronic component, and setting the second end of the side wall to be connected and flush with the first receiving portion is conducive to improving the processing efficiency of the buffer structure.

[0021] In combination with the first aspect, in some implementations of the first aspect, the circuit board assembly further includes a heat-conducting medium, and the heat-conducting medium is disposed on a top end of the first electronic component.

[0022] In a possible implementation, the heat-conducting medium may be a heat-conducting gel, and the thermal conductivity of the heat-conducting gel is greater than a preset threshold value. For example, the thermal conductivity of the heat-conducting gel may be: 0.3w / (Km) to 0.9w / (Km), 0.6w / (Km), etc.

[0023] In a possible implementation, the side of the heat conducting medium away from the first electronic component can contact the receiving portion of the buffer structure, the second circuit board arranged opposite to the first circuit board, the shielding cover and other components located above the top of the first electronic component.

[0024] When the buffer structure includes a receiving portion, the heat conducting medium may be disposed between the buffer structure and the top end of the first circuit board. Alternatively, the heat conducting medium may be disposed on a side of the receiving portion of the buffer structure away from the top end of the first electronic component.

[0025] When the buffer structure does not include the receiving portion, the heat conducting medium may be disposed on the top of the first electronic component.

[0026] In the present technical solution, a heat-conducting medium is also arranged on the top of the first electronic component. The heat-conducting medium can conduct the heat generated by the first electronic component to the external space of the first electronic component, which is beneficial to reduce the adverse effect of high temperature on the performance of the first electronic component and the probability of the first electronic component's performance being reduced or its function failing due to high temperature.

[0027] In combination with the first aspect, in certain implementations of the first aspect, the buffer structure further includes at least one extension portion, the at least one extension portion is connected to the first end of the side wall, and the at least one extension portion is fixedly connected to the first circuit board.

[0028] The shape of the extension portion can be determined according to the shape of the first electronic component. For example, if the first electronic component is a rectangular parallelepiped, the extension portion can be a square ring sleeved outside the first electronic component, or the extension portion can be a separate sheet arranged on one or more sides of the first electronic component. For another example, if the first electronic component is cylindrical, the extension portion can be a circular ring sleeved outside the first electronic component.

[0029] By providing the buffer structure with an extension portion fixed relatively to the first circuit board, when the circuit board assembly shakes, the buffer structure can still be fixed on the outside of the first electronic component to protect the first electronic component. The implementation of this technical solution is conducive to improving the stability of the circuit board assembly and the first electronic component.

[0030] Compared with the method of using bottom filling glue to reinforce the connection between electronic components and circuit boards, the buffer structure provided by the present application will not have an adverse effect on the solder joints between the electronic components and the circuit board, and is conducive to the disassembly and repair of circuit board assemblies and electronic components.

[0031] In combination with the first aspect, in some implementations of the first aspect, a surface of at least one extension portion close to the first circuit board is bonded to the first circuit board.

[0032] The extension portion is fixed relative to the first circuit board by bonding. This technical solution is conducive to simplifying the structure of the circuit board assembly, improving the utilization rate of the internal space of the circuit board assembly, and simplifying the installation and disassembly process of the circuit board assembly.

[0033] In combination with the first aspect, in certain implementations of the first aspect, the circuit board assembly also includes a second circuit board and a connecting board, the first circuit board and the second circuit board are stacked and connected by the connecting board, and at least one extension portion is clamped between the first circuit board and the connecting board.

[0034] In some scenarios, the portion sandwiched between the first circuit board and the connecting plate may be referred to as a fixing portion on at least one extension portion.

[0035] In combination with the first aspect, in certain implementations of the first aspect, the circuit board assembly also includes a first connecting member, at least one extension portion has a first opening, the first circuit board has a second opening, the connecting plate has a third opening, and the first connecting member passes through the first opening, the second opening and the third opening.

[0036] In a possible implementation manner, the first circuit board and the connecting plate may be connected by one or more of screws, rivets, pins, and the like.

[0037] When the first circuit board and the connecting plate are fixedly connected by means of screws or the like, the extended portion of the buffer structure sandwiched between the two will also be relatively fixed to the first circuit board, which is beneficial to improving the reliability of the buffer structure in protecting the first electronic components, and is beneficial to improving the reliability of the circuit board assembly and the first electronic components, and is also beneficial to improving the space utilization of the circuit board assembly to a certain extent.

[0038] The circuit board assembly provided in the present application may be a "sandwich" structure circuit board assembly. When the circuit board assembly is deformed by external force, the buffer structure arranged outside the first electronic component is conducive to reducing the squeezing and collision of the second circuit board and the electronic components thereon on the first electronic component.

[0039] In a possible implementation, electronic components are also mounted on a side of the second circuit board that is close to the first circuit board.

[0040] The circuit board assembly provided in the present application may be a "four-piece" structure circuit board assembly. When the circuit board assembly is deformed by external force, the buffer structure arranged outside the first electronic component is conducive to reducing the squeezing and collision of the second circuit board and the electronic components thereon on the first electronic component.

[0041] In combination with the first aspect, in some implementations of the first aspect, the circuit board assembly further includes a shielding cover, and an end of the shielding cover close to the first circuit board is pressed onto the at least one extension portion.

[0042] A shielding cover can be set on the outside of the first electronic component. When the circuit board assembly is subjected to external force, the shielding cover may be squeezed or collided with the first electronic component. In this technical solution, the buffer structure is arranged between the shielding cover and the first electronic component, which is conducive to reducing the probability of squeezing and collision between the shielding cover and the first electronic component.

[0043] When the buffer structure is provided with an extension portion, the shielding cover can be pressed on the extension portion, and when the shielding cover is relatively fixed to the first circuit board, the extension portion can also be relatively fixed to the first circuit board. The implementation of this technical solution is conducive to improving the reliability of the effect of the buffer structure in protecting the first electronic components, is conducive to improving the functional reliability of the circuit board assembly and the first electronic components, and is also conducive to improving the space utilization inside the circuit board assembly to a certain extent and simplifying the structure of the circuit board assembly.

[0044] In a possible implementation, one of the first circuit board and the second circuit board is a main board, and the other is a radio frequency board.

[0045] The main board, also known as the application processor board, refers to the circuit board on which the application processor is installed. The RF board refers to the circuit board used to process RF signals.

[0046] In combination with the first aspect, in certain implementations of the first aspect, the buffer structure is formed by solidifying a thin film, the thin film includes a first protective layer and a main adhesive layer, the first protective layer is far away from the first electronic component, the main adhesive layer is close to the first electronic component, the first protective layer is composed of a material with an electrical conductivity less than a first threshold value, and the main adhesive layer is composed of a thermosetting polymer material.

[0047] The buffer structure is formed by curing a thermosetting polymer material. The thermosetting polymer material is not easy to soften or deform when heated again after curing. This technical solution is conducive to reducing the difficulty of repairing the circuit board assembly. The protective layer arranged on the outside of the buffer structure is conducive to preventing the conductive gas and other media in the external space of the first electronic component from entering the interior of the first electronic component, causing short circuit damage to the first electronic component.

[0048] In combination with the first aspect, in some implementations of the first aspect, the film further includes a second protective layer, and the second protective layer is composed of a material having an electrical conductivity less than a second threshold value.

[0049] In a possible implementation manner, the first protective layer and the second protective layer may be made of the same material.

[0050] The implementation of this technical solution is beneficial to further reduce the probability of failure of the first electronic component due to the influence of the conductive medium in the environment.

[0051] In combination with the first aspect, in some implementations of the first aspect, the film further includes an adhesive layer, and the adhesive layer is bonded to the first circuit board and / or an end of the first electronic component away from the first circuit board.

[0052] In a possible implementation, the adhesive layer may be disposed on a side of the main adhesive layer away from the first protective layer.

[0053] In a possible implementation, the adhesive layer may be disposed on a side of the second protective layer away from the main adhesive layer.

[0054] In a possible implementation, the adhesive layer may be a main adhesive layer.

[0055] In the present technical solution, an adhesive layer is provided at the end of the film close to the first circuit board and / or the end of the first electronic component away from the circuit board. The adhesive layer can adhere the film (buffer structure) to the first circuit board and / or the end of the first electronic component away from the first circuit board, thereby achieving relative fixation of the buffer structure and the first circuit board and / or the first electronic component. When the circuit board assembly shakes, the buffer structure is not easily displaced and can still play a role in protecting the first electronic component.

[0056] In combination with the first aspect, in certain implementations of the first aspect, the circuit board assembly also includes a second electronic component, the second electronic component and the first electronic component are mounted on the same surface of the first circuit board, the height of the second electronic component is less than the height of the first electronic component, and the first buffer structure is also arranged on the periphery of the second electronic component.

[0057] The height of the first electronic component and the height of the second electronic component can be understood as the distance from the top of the first electronic component to the first circuit board and the distance from the top of the second electronic component to the first circuit board, respectively.

[0058] When multiple electronic components are simultaneously arranged on one side of the first circuit board, different parts of the buffer structure can protect different electronic components, so that multiple electronic components can be protected by setting up one buffer structure, which is conducive to simplifying the structure of the circuit board assembly and improving the space utilization within the circuit board assembly.

[0059] In combination with the first aspect, in some implementations of the first aspect, the first electronic component is a glass chip.

[0060] The existing bottom filling glue is less suitable for reinforcing the connection between the glass chip and the circuit board. In comparison, the buffer structure provided in the present application can reduce the probability of internal stress generated at the connection position between the glass chip and the circuit board, resulting in separation of the glass chip and the circuit board, which is beneficial to improving the reliability of the glass chip performance and facilitating the promotion and application of glass chips.

[0061] In combination with the first aspect, in some implementations of the first aspect, the circuit board assembly further includes a second buffer structure, and the second buffer structure is wrapped around the outside of the circuit board assembly.

[0062] Wrapping the second buffer structure on the outside of the circuit board assembly can reduce the force directly acting on the circuit board assembly and protect the circuit board assembly. At the same time, the second buffer structure is conducive to further reducing the probability of damage and failure of electronic components in the circuit board assembly.

[0063] In a second aspect, an electronic device is provided. The electronic device includes a middle frame and a circuit board assembly in the first aspect and any possible implementation thereof, wherein the circuit board assembly is fixedly connected to the middle frame.

[0064] According to a third aspect, an electronic device is provided, which includes a middle frame, a circuit board assembly and a second connecting member, wherein the middle frame has a fourth opening, the first circuit board of the circuit board assembly has a fifth opening, and at least one extension of the buffer structure of the circuit board assembly has a sixth opening, and the second connecting member passes through the fourth opening, the fifth opening and the sixth opening and fixedly connects the middle frame, the first circuit board and at least one extension.

[0065] Among them, the first buffer structure of the circuit board assembly includes a side wall and at least one extension portion, the side wall is arranged around the first electronic component, the first end of the side wall is abutted against the first circuit board, the second end of the side wall is arranged away from the first circuit board, the distance from the second end of the side wall to the first circuit board is greater than the distance from the top of the first electronic component to the first circuit board, and the at least one extension portion is connected to the first end of the side wall.

[0066] In a possible implementation, the second connecting member includes but is not limited to a screw, a pin, and a rivet.

[0067] The connecting piece for fixing the circuit board assembly and the middle frame is used to simultaneously realize the relative fixation of the extension part and the first circuit board. This technical solution is conducive to improving the firmness of the connection between the buffer structure and the first circuit board. In addition, the multiple use of the same connecting piece is conducive to simplifying the structure of the circuit board assembly and improving the space utilization rate of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0069] Figure 2 It is a structural schematic diagram of a circuit board assembly provided in an embodiment of the present application.

[0070] Figure 3 It is a structural schematic diagram of another circuit board assembly provided in an embodiment of the present application.

[0071] Figure 4 This is a schematic diagram of the structure of another circuit board assembly provided in an embodiment of the present application.

[0072] Figures 5 to 13 It is a structural schematic diagram of a circuit board assembly including a buffer structure provided in an embodiment of the present application.

[0073] Figures 14 to 17 It is a schematic diagram of the structure of the buffer film provided in an embodiment of the present application.

[0074] Figures 18 to 20 It is a schematic diagram of an assembly process of a circuit board assembly provided in an embodiment of the present application.

[0075] Figures 21 to 23This is a schematic diagram of the assembly process of another circuit board assembly provided in an embodiment of the present application.

[0076] Fig.24 yes Fig.23 A top view of the buffer structure in FIG.

[0077] Fig.25 yes Fig.24 OO cross-sectional schematic diagram of the buffer structure in FIG.

[0078] Figures 26 to 28 This is a schematic diagram of the assembly process of another circuit board assembly provided in an embodiment of the present application.

[0079] Fig.29 yes Fig.28 A top view of the third circuit board and the buffer structure.

[0080] Fig.30 yes Fig.29 AA cross-section diagram of the buffer structure.

[0081] Fig.31 yes Fig.28 Lateral view of the mid-CC region.

[0082] Figures 32 to 34 This is a schematic diagram of the assembly process of another circuit board assembly provided in an embodiment of the present application.

[0083] Fig.35 yes Fig.34 A top view of the third circuit board and the buffer structure.

[0084] Fig.36 yes Fig.35 Schematic diagram of the BB cross section of the buffer structure.

[0085] Figures 37 to 39 This is a schematic diagram of the assembly process of another circuit board assembly provided in an embodiment of the present application.

[0086] Fig.40 yes Fig.39 A top view of the shielding cover, the buffer structure and the third circuit board.

[0087] Figures 41 to 45 This is a schematic diagram of the assembly process of another circuit board assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0088] Embodiments of the present application are described in detail below, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0089] Unless otherwise defined, the technical terms or scientific terms used below shall have the usual meanings understood by persons with ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0090] Before introducing the embodiments of the present application, some professional terms that may be used in the following content are first explained.

[0091] A printed circuit board (PCB), also known as a printed circuit board, is a support for electronic components. The printed circuit board has metal conductors inside as lines connecting electronic components. A printed circuit board assembly (PCBA) is a PCB with one or more electronic components installed.

[0092] An application processor board (AP board, mainboard) refers to a circuit board on which an application processor is installed. The application processor may be a system on a chip (SOC) processor.

[0093] Radio frequency board, also known as RF board, is a circuit board used to process radio frequency signals.

[0094] A frame board is used to connect two circuit boards that are spaced apart along the thickness direction of the circuit boards.

[0095] Underfill glue is an organic adhesive used to reinforce the solder joints of electronic components on circuit boards, such as epoxy resin.

[0096] Glass chip is a microcircuit board made of glass material. It can be used in microelectromechanical systems (MEMS), microfluidics, optoelectronics, radio frequency and biomedicine. It has the advantages of high transparency, low electrical loss, good temperature resistance and easy modification.

[0097] Surface-mount technology (SMT) is an electronic assembly technology used to mount electronic components, such as resistors, capacitors, transistors, integrated circuits, etc., onto PCBs and form electrical connections through soldering.

[0098] Figure 1 An electronic device 10 provided in an embodiment of the present application is shown, and the electronic device 10 may include a middle frame 11 and a circuit board assembly 12. The middle frame 11 may be used to fix other components included in the electronic device 10, such as a display screen, a mainboard, a battery, a camera, etc. In some examples, the circuit board assembly 12 may be fixedly connected to the middle frame 11, or the circuit board assembly 12 may be mounted on the middle frame 11. One or more electronic components may be mounted on the circuit board assembly 12, and the electronic components may be a glass chip, a central processing unit (CPU), a resistor, a capacitor, a diode, a transistor, etc.

[0099] Figures 2 to 4 Some possible structures of the circuit board assembly 12 are shown. Among them, Figure 2 The first circuit board assembly 20 may include a first circuit board 21 and one or more electronic components 22 mounted on the first circuit board 21. Specifically, the first circuit board 21 may include two mounting surfaces arranged opposite to each other in the thickness direction, for example, referred to as mounting surface #A and mounting surface #B. A first soldering pad may be provided on mounting surface #A and / or mounting surface #B, and the electronic component 22 may be provided with a second soldering pad on a side close to the mounting surface. The first soldering pad corresponds to the second soldering pad, and the corresponding solder joints on the two soldering pads are connected by soldering to achieve conduction between the electronic component 22 and the first circuit board 21, or in other words, the electronic component 22 can be mounted on the first circuit board 21.

[0100] In some examples, a side of the electronic component 22 used for connecting to the mounting surface may be referred to as a connecting surface, and the other side opposite to the connecting surface may be referred to as an exposed surface.

[0101] In some scenarios, a shielding cover 23 may also be installed on the first circuit board assembly 20. The shielding cover 23 may be set on the outside of the electronic components 22. The shielding cover 23 may be used to prevent the electronic components located outside the shielding cover 23 from electromagnetic interference with the electronic components 22 inside the shielding cover 23.

[0102] Figure 3 The second circuit board assembly 30 includes a second circuit board 31 and a third circuit board 32 spaced apart in the thickness direction, and a connecting board 33 for connecting the second circuit board 31 and the third circuit board 32. The number of the connecting boards 33 may be one or more. Exemplarily, Figure 3In the embodiment, the second circuit board assembly 30 includes two connecting boards 33. A certain gap can be set between the second circuit board 31 and the third circuit board 32, so that a closed or semi-closed accommodation space can be formed between the second circuit board 31, the third circuit board 32 and the connecting board 33.

[0103] and Figure 2 Similar to the first circuit board 21 shown, the second circuit board 31 and the third circuit board 32 each include two mounting surfaces arranged opposite to each other in the thickness direction, and the second circuit board 31 can mount one or more electronic components on any of the two mounting surfaces, or the second circuit board 31 can also mount one or more electronic components on both mounting surfaces at the same time. The third circuit board 32 can mount one or more electronic components on any of the two mounting surfaces, or the third circuit board 32 can also mount one or more electronic components on both mounting surfaces at the same time.

[0104] In some examples, such as Figure 3 As shown, in the second circuit board assembly 30, electronic components are mounted on one of the first mounting surface 31A and the second mounting surface 32A of the second circuit board 31 and the third circuit board 32, which are close to each other. This structure of the circuit board assembly can be called a "sandwich" structure circuit board assembly.

[0105] In some examples, such as Figure 4 As shown, in the second circuit board assembly 30, the first mounting surface 31A and the second mounting surface 32A of the second circuit board 31 and the third circuit board 32, which are close to each other, are both mounted with electronic components. This structure of the circuit board assembly can be called a "four-step" structure circuit board assembly.

[0106] In some scenarios, the second circuit board 31 may be a main board, the third circuit board 32 may be a radio frequency board, and the connecting board 33 may be a frame board.

[0107] In some scenarios, the second circuit board 31 may be a radio frequency board, the third circuit board 32 may be a main board, and the connecting board 33 may be a frame board.

[0108] During use, the electronic device 10 may be subjected to a force perpendicular to the plane where the middle frame 11 is located (for example, Figure 1The force F in the middle frame 11 may cause the middle frame 11 to bend and deform, and the circuit board assembly 12 mounted on the middle frame 11 may also bend and deform to a certain extent due to the force. The deformation of the circuit board assembly 12 may cause internal stress inside the electronic components on the circuit board assembly 12, at the connection between the electronic components and the circuit board assembly 12, and other locations. The internal stress inside the electronic components may cause the electronic components to be damaged or fail, and the internal stress at the connection between the electronic components and the circuit board 12 may cause the solder joints of the electronic components to fall off, and the electronic components cannot be connected to the circuit board 12, which may also cause the electronic components to fail in function.

[0109] In addition, for Figure 2 In the case where the shielding cover 23 is provided on the outer side of the first electronic component 21, the bending deformation of the first circuit board assembly 20 will shorten the distance between the first electronic component 21 and the shielding cover 23, and the shielding cover 23 may directly collide with the first electronic component 21. For the circuit board assembly with the "sandwich" structure and the circuit board assembly with the "four-in-one" structure as mentioned above, the bending deformation of the circuit board assembly will shorten the distance between the second circuit board 31 and the third circuit board 32, and the electronic components installed on the first mounting surface 31A or the second mounting surface 32A may directly collide with the electronic components or circuit boards on the opposite surface, which will also cause damage and failure of the electronic components on the circuit board assembly.

[0110] In order to improve the functional reliability and stability of electronic components on the circuit board assembly, the present application provides a third circuit board assembly 500, and a buffer structure can be provided in the third circuit board assembly 500, which can protect one or more electronic components in the third circuit board assembly 500 to a certain extent.

[0111] Figure 5 3 is an example of a third circuit board assembly 500, and the structure of the third circuit board assembly 500 is similar to the structure of the aforementioned second circuit board assembly 30. The third circuit board assembly 500 may include a second circuit board 31 and a third circuit board 32 spaced apart in the thickness direction, and two connecting plates 33 for connecting the second circuit board 31 and the third circuit board 32.

[0112] One or more electronic components are mounted on the second mounting surface 32A of the third circuit board 32 facing the second circuit board 31 . The side of the electronic component connected to the second mounting surface 32A can be called a connecting surface, and the other side opposite to the connecting surface can be called an exposed surface.

[0113] In some examples, an electronic component is mounted on the second mounting surface 32A, for example, Figure 5The second electronic component 510 in the circuit board assembly 500. The first buffer structure 410 may be provided on the exposed surface of the second electronic component 510. The area of ​​the projection of the first buffer structure 410 in the plane where the second circuit board 31 is located along the thickness direction of the third circuit board assembly 500 is A1, and the area of ​​the projection of the exposed surface of the second electronic component 510 in the plane where the second circuit board 31 is located along the thickness direction of the third circuit board assembly 500 is A2. The value of A1 may be less than A2, or the value of A1 may be greater than or equal to A2. In some examples, A1 is equal to A2.

[0114] A buffer structure with a larger area can convert more mechanical energy of external forces into internal energy, and the probability of electronic components failing due to external forces is lower.

[0115] The first buffer structure 410 has a certain thickness, and the top surface of the first buffer structure 410 is closest to the second circuit board 31. When the third circuit board assembly 500 is subjected to external force and the second circuit board 31 and the third circuit board 32 are close to each other, the second circuit board 31 will first contact the first buffer structure 410 located at the top of the second electronic component 510. If compression occurs between the second circuit board 31 and the first buffer structure 410, the first buffer structure 410 can be regarded as a receiving structure for receiving the external force and converting the mechanical energy of the external force into the internal energy of the buffer structure, so that less mechanical energy will be transmitted to the second electronic component 510, the probability of generating internal stress at the connection position between the second electronic component 510 and the second mounting surface 32A is smaller, and the reliability of the second electronic component 510 is higher.

[0116] In some examples, a plurality of electronic components may be mounted on the second mounting surface 32A, for example, Figure 5 The second electronic component 510, the third electronic component 520 and the fourth electronic component 530 are shown in FIG. The distance between the exposed surface of the second electronic component 510 and the second circuit board 31 is h1, the distance between the exposed surface of the third electronic component 520 and the second circuit board 31 is h2, and the distance between the fourth electronic component 530 and the second circuit board 31 is h3, where h1≤h2≤h3.

[0117] In this case, in the third circuit board assembly 500, a buffer structure may be provided only on the exposed surface of the second electronic component 510. Alternatively, in addition to providing a buffer structure on the exposed surface of the second electronic component 510, a buffer structure may be provided on any one of the exposed surfaces of the third electronic component 520 and the fourth electronic component 530. Alternatively, a buffer structure may be provided on the exposed surfaces of the second electronic component 510, the third electronic component 520, and the fourth electronic component 530 at the same time.

[0118] The present application does not limit the area of ​​the buffer structures provided on the exposed surface of the second electronic component 510, the exposed surface of the third electronic component 520, and the exposed surface of the fourth electronic component 530. In some examples, the areas of the three buffer structures may be equal to the areas of the exposed surfaces of the second electronic component 510, the exposed surfaces of the third electronic component 520, and the exposed surfaces of the fourth electronic component 530, respectively.

[0119] Compared with only setting a buffer structure on the electronic component closest to the second circuit board 31, setting a buffer structure on the exposed surfaces of multiple electronic components at the same time is beneficial to improving the protection effect of multiple electronic components on the circuit board assembly, and can protect the electronic components in different collision and extrusion scenarios.

[0120] In some examples, when multiple electronic components are mounted on the second mounting surface 32A at the same time, such as Figure 6 As shown, a whole second buffer structure 420 can be simultaneously covered on the exposed surfaces of multiple electronic components, and the second buffer structure 420 can cover the exposed surfaces of all electronic components installed on the second mounting surface 32A. In this case, the second buffer structure 420 can be regarded as a receiving structure for multiple protected electronic components, which is used to receive external forces to achieve the purpose of protecting the electronic components.

[0121] Compared with separately providing a buffer structure for each electronic component, providing a whole buffer structure to cover multiple electronic components is helpful in simplifying the internal structure of the circuit board assembly and improving the installation and disassembly efficiency of the circuit board assembly.

[0122] In some examples, one or more electronic components are disposed on the first mounting surface 31A and the second mounting surface 32A of the third circuit board assembly 500. That is, the third circuit board assembly 500 is Figure 4 The "four-piece" structure circuit board assembly shown in the figure. In this case, Figure 7 As shown, the second buffer structure 420 can be disposed between the electronic components mounted on the first mounting surface 31A and the electronic components mounted on the second mounting surface 32A. The second buffer structure 420 can cover the exposed surfaces of all electronic components mounted on the first mounting surface 31A, or the second buffer structure 420 can cover the exposed surfaces of all electronic components mounted on the second mounting surface 32A.

[0123] The shape of the second buffer structure 420 can be set according to the shape, size, height and other specific conditions of different electronic components, so that the second buffer structure 420 can fit the different electronic components as closely as possible, thereby better protecting the electronic components. Figure 7In the embodiment, the second buffer structure 420 may have a bending portion 422, and the bending portion 422 may be used to connect the first sub-buffer structure 421 and the second sub-buffer structure 423 above the exposed surfaces of the electronic components at two different heights on the first mounting surface 31A.

[0124] Figure 8 3 is another example of a third circuit board assembly 500, the structure of which is similar to that of the aforementioned second circuit board assembly 30. The third circuit board assembly 500 may include a second circuit board 31 and a third circuit board 32 spaced apart in the thickness direction, and two connecting plates 33 for connecting the second circuit board 31 and the third circuit board 32.

[0125] One or more electronic components are mounted on the second mounting surface 32A of the third circuit board 32 facing the second circuit board 31 . The side of the electronic component connected to the second mounting surface 32A can be called a connecting surface, and the other side opposite to the connecting surface can be called an exposed surface.

[0126] In some examples, an electronic component is mounted on the second mounting surface 32A, for example, Figure 8 The third circuit board assembly 500 may further include a third buffer structure 430, which may be disposed at the periphery of the second electronic component 510. The third buffer structure 430 is similar to a cover structure including a side wall, and the third buffer structure 430 may be covered on the second electronic component 510. A certain interval may be set between the inner wall of the third buffer structure 430 and the second electronic component 510.

[0127] The third buffer structure 430 may include a receiving portion and a side wall. The receiving portion of the third buffer structure 430 may be located directly above the exposed surface of the second electronic component 510, and the side wall may be considered to be formed by the extension of the periphery of the receiving portion. Exemplarily, the side wall may be formed by the periphery of the receiving portion extending along the normal direction of the plane where the receiving portion is located. In some examples, the third buffer structure 430 may also include an extension portion, which is arranged at one end of the side wall away from the receiving portion. When the third buffer structure 430 is covered on the second electronic component 510, the extension portion may abut against the second mounting surface 32A. Exemplarily, the plane where the extension portion is located may be parallel to the plane where the receiving portion is located. The receiving portion of the third buffer structure 430 and the side wall partially located above the exposed surface of the second electronic component 510 can be regarded as the top of the third buffer structure 430, which is used to receive external forces. When the third buffer structure 430 is acted upon by external forces, it can convert part of the mechanical energy into internal energy, thereby protecting the second electronic component 510 to a certain extent.

[0128] Compared with the method of only setting a buffer structure on the top of the electronic components, the buffer structure includes a supporting part, a side wall and an extension part, etc. On the one hand, it can protect the electronic components more comprehensively from all directions and angles; on the other hand, it can also make the buffer structure relatively fixed to the circuit board, which is more conducive to improving the protection effect of the buffer structure on the electronic components.

[0129] In some examples, a plurality of electronic components may be mounted on the second mounting surface 32A, for example, Figure 8 The second electronic component 510, the third electronic component 520 and the fourth electronic component 530 are shown in FIG. The distance between the exposed surface of the second electronic component 510 and the second circuit board 31 is h1, the distance between the exposed surface of the third electronic component 520 and the second circuit board 31 is h2, and the distance between the fourth electronic component 530 and the second circuit board 31 is h3, where h1≤h2≤h3.

[0130] In this case, in the third circuit board assembly 500, the third buffer structure 430 may be provided only on the second electronic component 510. Alternatively, in addition to providing the third buffer structure 430 on the second electronic component 510, the third buffer structure 430 may also be provided for any one of the third electronic component 520 and the fourth electronic component 530. Alternatively, the third buffer structure 430 may be provided for the second electronic component 510, the third electronic component 520, and the fourth electronic component 530 at the same time.

[0131] In some examples, when the third buffer structure 430 is provided for multiple electronic components on the same mounting surface, two adjacent third buffer structures 430 can be connected to each other to form an integral fourth buffer structure 440. In other words, when multiple electronic components are installed on the same mounting surface, a fourth buffer structure 440 can be provided inside the third circuit board assembly 500. Fig. 9 The fourth buffer structure 440 shown can be coated on the periphery of multiple electronic components at the same time. The fourth buffer structure 440 can include multiple third buffer structures 430, and the multiple third buffer structures 430 can be connected to each other.

[0132] Connecting multiple buffer structures for protecting electronic components to form a whole, or setting up a whole buffer structure to protect multiple electronic components, saves more internal space of the circuit board assembly compared to the solution of setting up a separate buffer structure for each electronic component. The structure of the circuit board assembly is simpler and convenient for disassembly and maintenance.

[0133] The third buffer structure 430 may include a receiving portion and a side wall, and the third buffer structure 430 may also include an extension portion. The detailed description of the third buffer structure 430 can be found in the previous text. Figure 8 For the sake of brevity, we will not go into details here.

[0134] In the case where a plurality of third buffer structures 430 are connected to each other to form a fourth buffer structure 440, the fourth buffer structure 440 may have different shapes. Fig. 9 and Fig.10 Two different fourth buffer structures 440 are provided illustratively.

[0135] Fig. 9 The fourth buffer structure 440 occupies a smaller space in the accommodation space between the second circuit board 31 and the third circuit board 32. Fig.10 The fourth buffer structure 440 occupies a larger space in the accommodation space between the second circuit board 31 and the third circuit board 32. The larger volume of the fourth buffer structure 440 can convert more mechanical energy into the internal energy of the buffer structure, thereby providing better protection for electronic components.

[0136] In some examples, Fig. 9 The fourth buffer structure 440 shown has a higher stiffness and a larger modulus. Fig.10 The fourth buffer structure 440 shown has a relatively small rigidity and a relatively small modulus. By making the buffer structure into different shapes, more buffer structures with different mechanical and material properties can be applied to the technical solution provided by the present application.

[0137] It should be understood that Fig. 9 and Fig.10 Two different shapes of the fourth buffer structure 440 are provided for example only. In addition to these two shapes, the fourth buffer structure 440 may also have more other shapes, which are not listed here. Similarly, the shape of the buffer structure provided in the embodiment of the present application is only for example description and should not be regarded as a limitation to the present application.

[0138] Fig.11 3 is another example of a third circuit board assembly 500, and the structure of the third circuit board assembly 500 is similar to that of the aforementioned second circuit board assembly 30. The third circuit board assembly 500 may include a second circuit board 31 and a third circuit board 32 spaced apart in the thickness direction, and two connecting plates 33 for connecting the second circuit board 31 and the third circuit board 32.

[0139] One or more electronic components are mounted on the second mounting surface 32A of the third circuit board 32 facing the second circuit board 31 . The side of the electronic component used for connecting to the second mounting surface 32A can be called a connecting surface, and the other side opposite to the connecting surface can be called an exposed surface.

[0140] In some examples, an electronic component is mounted on the second mounting surface 32A, for example, Fig.11The second electronic component 510 in the third circuit board assembly 500. The third circuit board assembly 500 may also include a fifth buffer structure 450 and a heat-conducting medium 1010. The fifth buffer structure 450 may be surrounded on the outside of the side wall of the second electronic component 510, and the distance between the fifth buffer structure 450 and the second mounting surface 32A may be greater than the distance between the exposed surface of the second electronic component 510 and the second mounting surface 32A. In other words, the height of the fifth buffer structure 450 may be higher than the height of the second electronic component 510. The portion of the fifth buffer structure 450 that is higher than the second electronic component 510 may be called the top of the fifth buffer structure. In the case of external force, the top may directly bear the external force (such as the squeezing effect of the second circuit board 31).

[0141] The heat conducting medium 1010 may be disposed in the space surrounded by the fifth buffer structure 450. For example, the heat conducting medium 1010 may be disposed on the exposed surface of the second electronic component 510. In some examples, the side of the heat conducting medium 1010 away from the exposed surface of the second electronic component 510 may contact the second circuit board 31, so that the heat generated by the second electronic component 510 may be conducted to the second circuit board 31 through the heat conducting medium 1010 and dissipated to the external space of the third circuit board assembly 500.

[0142] In some scenarios, the above technical solution can also be understood as that the fifth buffer structure 450 is obtained by hollowing out the receiving portion of the third buffer structure 430 (i.e., the portion directly above the exposed surface of the second electronic component 510), and the thermal conductive medium 1010 can be filled into the space vacated by the hollowed-out portion of the buffer structure 514. In some examples, the area of ​​the hollowed-out region of the receiving portion of the third buffer structure 430 can be less than or equal to the area of ​​the exposed surface of the second electronic component 510.

[0143] The fifth buffer structure 450 may include a side wall, and the side wall may surround the outside of the second electronic component 510. In some examples, one end of the side wall abuts against the third circuit board 32, or in other words, one end of the side wall is supported on the second mounting surface 32A. An extension portion 451 may be provided at one end of the side wall away from the third circuit board 32, and the extension portion 451 may be regarded as an extension of the end of the side wall away from the third circuit board 32 toward the central area of ​​the second electronic component 510. A contact surface may be provided on one side of the extension portion close to the second electronic component 510, and the contact surface may contact the exposed surface of the second electronic component 510.

[0144] In some scenarios, the above technical solution can also be understood as that the fifth buffer structure 450 may include a side wall and a receiving portion, the side wall is arranged at the periphery of the second electronic component 510, and the receiving portion is arranged above the exposed surface of the second electronic component 510. In some examples, the receiving portion may abut against the exposed surface of the second electronic component 510. The receiving portion may be provided with an opening, and the area of ​​the opening may be smaller than the area of ​​the exposed surface of the second electronic component 510. The exposed surface of the second electronic component 510 is exposed at the opening position of the receiving portion of the fifth buffer structure 450.

[0145] In some examples, the fifth buffer structure 450 may include an extension portion, which may be connected to the side wall on the side of the side wall close to the second mounting surface 32A, and the extension direction of the extension portion may be perpendicular to the direction of the plane where the side wall is located, or in other words, the extension portion may be obtained by extending from the side of the side wall close to the second mounting surface 32A in a direction perpendicular to the side wall to the outside of the space surrounded by the side wall. Exemplarily, the direction of the plane where the extension portion is located may be parallel to the second mounting surface 32A.

[0146] In some examples, a plurality of electronic components may be mounted on the second mounting surface 32A, for example, Fig.11 The second electronic component 510, the third electronic component 520 and the fourth electronic component 530 are shown in FIG. The distance between the exposed surface of the second electronic component 510 and the second circuit board 31 is h1, the distance between the exposed surface of the third electronic component 520 and the first circuit board is h2, and the distance between the fourth electronic component 530 and the first circuit board is h3, where h1≤h2≤h3.

[0147] In this case, in the third circuit board assembly 500, the fifth buffer structure 450 may be provided only on the second electronic component 510. Fig.12 As shown, in addition to providing the fifth buffer structure 450 and the heat-conducting medium 1010 on the second electronic component 510, the fifth buffer structure 450 and the heat-conducting medium 1010 may also be provided for any one of the third electronic component 520 and the fourth electronic component 530. Alternatively, the fifth buffer structure 450 and the heat-conducting medium 1010 may be provided for the second electronic component 510, the third electronic component 520 and the fourth electronic component 530 at the same time.

[0148] In some examples, the heat-conducting medium may be a heat-conducting gel, and the thermal conductivity of the heat-conducting gel is greater than or equal to a preset threshold value. For example, the thermal conductivity of the heat-conducting gel may be: 0.3w / (Km) to 0.9w / (Km), 0.6w / (Km), etc.

[0149] The provision of a heat-conducting medium is beneficial for transferring the heat of electronic components to the external space of the electronic components, and is beneficial for reducing the occurrence of performance degradation or even failure of electronic components due to high temperature or heat accumulation.

[0150] In some examples, when the fifth buffer structure 450 is provided for multiple electronic components on the same mounting surface, two adjacent fifth buffer structures 450 can be connected to each other to form an integral sixth buffer structure 460. In other words, when multiple electronic components are installed on the same mounting surface, a sixth buffer structure 460 can be provided inside the third circuit board assembly 500. Fig.12 The sixth buffer structure 460 shown can be coated on the periphery of multiple electronic components at the same time. The sixth buffer structure 460 can include multiple fifth buffer structures 450, and the multiple fifth buffer structures 450 can be connected to each other.

[0151] Connecting multiple buffer structures for protecting electronic components to form a whole, or setting up a whole buffer structure to protect multiple electronic components, saves more internal space of the circuit board assembly compared to the solution of setting up a separate buffer structure for each electronic component. The structure of the circuit board assembly is simpler and convenient for disassembly and maintenance.

[0152] The fifth buffer structure 450 may include a receiving portion and a side wall, and the receiving portion of the fifth buffer structure 450 may be provided with an opening. The fifth buffer structure 450 may also include an extension portion. The detailed description of the fifth buffer structure 450 may refer to the above Fig.11 For the sake of brevity, we will not go into details here.

[0153] In order to further improve the reliability of the performance of the third circuit board assembly 500, the third circuit board assembly 500 is protected. Fig.13 As shown, the outer side of the third circuit board assembly 500 may be wrapped with the seventh buffer structure 470, and the seventh buffer structure 470 may be wrapped around the outer periphery of the third circuit board assembly 500. When the third circuit board assembly 500 is subjected to external force, the seventh buffer structure 470 may absorb a portion of the mechanical energy, and the third circuit board assembly 500 located inside the seventh buffer structure 470 is less likely to be damaged. The electronic components located between the second circuit board 31 and the third circuit board 32 and provided with one or more of the first buffer structure 410, the second buffer structure 420 or the third buffer structure 430 are also protected by these buffer structures, and the probability of these electronic components being damaged is lower.

[0154] In some examples, the shape of the seventh buffer structure 470 can match the electronic components installed on the outer side of the third circuit board assembly 500, so that one or more electronic components located on the outer periphery of the third circuit board assembly 500 can also be covered by the seventh buffer structure 470. Exemplarily, the seventh buffer structure 470 can include one or more protrusions 471, which can be arranged at the position where the electronic components are installed on the outer periphery of the third circuit board assembly 500, and the protrusions 471 can be wrapped around the outer side of the corresponding electronic components.

[0155] The above mainly introduces some circuit board assemblies provided in the embodiments of the present application from the perspective of the shape of the buffer structure. The following further describes the above circuit board assemblies in combination with the manufacturing method of the buffer structure.

[0156] Fig.14 The first buffer film 600 provided in an embodiment of the present application is shown. The first buffer film 600 can be used to manufacture any of the aforementioned buffer structures, such as any of the first buffer structure 410 to the seventh buffer structure 470 .

[0157] The first buffer film 600 includes a protective layer 610 and a main adhesive layer 620 , wherein the protective layer 610 may be made of a highly insulating and low-viscosity material, such as polyimide (PI) or polyethylene terephthalate (PET).

[0158] In some examples, protective layer 610 is composed of a material having an electrical conductivity less than a first threshold.

[0159] The protective layer arranged on the outside of the buffer structure is helpful to prevent conductive gas or other media in the external space of the electronic component from entering the interior of the electronic component, causing short circuit damage to the electronic component.

[0160] The main adhesive layer 620 may be composed of a thermosetting polymer material, such as polymethylmethacrylate (PMMA) or phenolic resin, etc. Thermosetting polymer materials are not easily softened or deformed when heated again after curing, and the buffer structure formed by curing such materials is conducive to reducing the difficulty of circuit board assembly maintenance.

[0161] In some examples, the thermal deformation temperature T of the main adhesive layer 620 satisfies: T≤300° C., for example, T≤250° C., T=200° C., 150° C., or 100° C., etc.

[0162] In some examples, the thickness h of the first buffer film 600 satisfies: 16 μm≤h≤240 μm, for example, 20 μm≤h≤200 μm, h=160 μm, 120 μm, 80 μm, or 40 μm, etc.

[0163] In some examples, the modulus M of the first buffer film 600 satisfies: 800 MPa≤M≤7.2 GPa, for example, 1.0 GPa≤M≤6.0 GPa, M=4.8 GPa, 3.6 GPa, 2.4 GPa, or 1.2 GPa, etc.

[0164] Fig.15 The second buffer film 700 provided in an embodiment of the present application is shown. The second buffer film 700 can be used to manufacture any of the aforementioned buffer structures, such as any of the first buffer structure 410 to the seventh buffer structure 470 .

[0165] The second buffer film 700 includes a first protective layer 710, a main adhesive layer 720 and a second protective layer 730, wherein the main adhesive layer 720 is located between the first protective layer 710 and the second protective layer 730. The first protective layer 710 and the second protective layer 730 may be made of a highly insulating, low-viscosity material, such as PI or PET. The main adhesive layer 720 may be made of a thermosetting polymer material, such as PMMA or phenolic resin.

[0166] In some examples, the first protective layer 710 is composed of a material having an electrical conductivity less than a first threshold, and the second protective layer 720 is composed of a material having an electrical conductivity less than a second threshold.

[0167] Providing multiple layers of protective layers made of materials with low electrical conductivity is helpful to prevent conductive gases and other media in the external space of electronic components from entering the interior of electronic components, causing short circuit damage to electronic components. Thermosetting high-density materials are not easy to soften or deform when heated again after curing. The buffer structure formed by curing this material is helpful to reduce the difficulty of circuit board assembly maintenance.

[0168] In some examples, the thermal deformation temperature T of the main adhesive layer 720 satisfies: T≤300° C., for example, T≤250° C., T=200° C., 150° C., or 100° C., etc.

[0169] In some examples, the thickness h of the second buffer film 700 satisfies: 16 μm≤h≤240 μm, for example, 20 μm≤h≤200 μm, h=160 μm, 120 μm, 80 μm, or 40 μm, etc.

[0170] In some examples, the modulus M of the second buffer film 700 satisfies: 800 MPa≤M≤7.2 GPa, for example, 1.0 GPa≤M≤6.0 GPa, M=4.8 GPa, 3.6 GPa, 2.4 GPa, or 1.2 GPa, etc.

[0171] Fig.16 The third buffer film 800 provided in an embodiment of the present application is shown. The third buffer film 800 can be used to manufacture any of the aforementioned buffer structures, such as any of the first buffer structure 410 to the seventh buffer structure 470 .

[0172] The third buffer film 800 includes a protective layer 810, a main glue layer 820 and an adhesive layer 830, wherein the main glue layer 820 is located between the protective layer 810 and the adhesive layer 830. The protective layer 810 can be composed of a highly insulating, low-viscosity material, such as PI or PET. The main glue layer 820 can be composed of a thermosetting polymer material, such as PMMA or phenolic resin. The adhesive layer 830 can be composed of an adhesive or adhesive whose main component is acrylic acid or epoxy resin. The adhesive layer 830 can be used to bond the third buffer film 800 to the electronic components or circuit board components that need to be protected.

[0173] In some examples, protective layer 810 is composed of a material having an electrical conductivity less than a first threshold.

[0174] The protective layer arranged on the outside of the buffer structure is helpful to prevent the conductive gas and other media in the external space of the electronic components from entering the interior of the electronic components, causing short circuit damage to the electronic components. Thermosetting high-resolution materials are not easy to soften or deform when heated again after curing. The buffer structure formed by curing this material is helpful to reduce the difficulty of circuit board assembly maintenance. The setting of the adhesive layer is helpful to make the buffer structure relatively fixed to the circuit board or electronic components, which is helpful to improve the protective effect of the buffer structure on the electronic components.

[0175] In some examples, the thermal deformation temperature T of the main adhesive layer 820 satisfies: T≤300° C., for example, T≤250° C., T=200° C., 150° C., or 100° C., etc.

[0176] In some examples, the thickness h of the third buffer film 800 satisfies: 16 μm≤h≤240 μm, for example, 20 μm≤h≤200 μm, h=160 μm, 120 μm, 80 μm, or 40 μm, etc.

[0177] In some examples, the modulus M of the third buffer film 800 satisfies: 800 MPa≤M≤7.2 GPa, for example, 1.0 GPa≤M≤6.0 GPa, M=4.8 GPa, 3.6 GPa, 2.4 GPa or 1.2 GPa, etc.

[0178] Fig.17 The fourth buffer film 900 provided in an embodiment of the present application is shown. The fourth buffer film 900 can be used to manufacture any of the aforementioned buffer structures, such as any of the first buffer structure 410 to the seventh buffer structure 470 .

[0179] The fourth buffer film 900 includes a first protective layer 910, a main adhesive layer 920, a second protective layer 930 and an adhesive layer 940, wherein the main adhesive layer 920 is located between the first protective layer 910 and the second protective layer 930, and the adhesive layer 940 is arranged on a side of the second protective layer 930 away from the main adhesive layer 920. The first protective layer 910 and the second protective layer 930 can be composed of highly insulating and low-viscosity materials, such as PI or PET. The main adhesive layer 920 can be composed of a thermosetting polymer material, such as PMMA or phenolic resin. The adhesive layer 940 can be composed of an adhesive or a glue whose main component is acrylic acid or epoxy resin. The adhesive layer 940 can be used to bond the fourth buffer film 900 to the electronic components or circuit board assemblies that need to be protected.

[0180] In some examples, the first protective layer 910 is composed of a material having an electrical conductivity less than a first threshold, and the second protective layer 920 is composed of a material having an electrical conductivity less than a second threshold.

[0181] Providing multiple layers of protective layers made of materials with low electrical conductivity is helpful to prevent conductive gases and other media in the external space of electronic components from entering the interior of electronic components, causing short circuit damage to electronic components. Thermosetting high-density materials are not easy to soften or deform when heated again after curing. The buffer structure formed by curing this material is helpful to reduce the difficulty of circuit board assembly maintenance.

[0182] In some examples, the thermal deformation temperature T of the main adhesive layer 920 satisfies: T≤300° C., for example, T≤250° C., T=200° C., 150° C., or 100° C., etc.

[0183] In some examples, the thickness h of the fourth buffer film 900 satisfies: 16 μm≤h≤240 μm, for example, 20 μm≤h≤200 μm, h=160 μm, 120 μm, 80 μm, or 40 μm, etc.

[0184] In some examples, the modulus M of the fourth buffer film 900 satisfies: 800 MPa≤M≤7.2 GPa, for example, 1.0 GPa≤M≤6.0 GPa, M=4.8 GPa, 3.6 GPa, 2.4 GPa, or 1.2 GPa, etc.

[0185] Figures 14 to 17Some possible materials for making the buffer structure are provided only as examples. It should be understood that in addition to these materials, the buffer structure can also be made of more different materials, and the present application does not impose any limitation on this.

[0186] The preparation process of buffer structures of different structures is different, and the assembly method of circuit board components is also different, which is explained below.

[0187] by Figure 5 Taking the third circuit board assembly 500 in which only the first buffer structure 410 is provided on the second electronic component 510 as an example, Figures 18 to 20 An assembling process of the third circuit board assembly 500 is exemplarily provided.

[0188] S101 , mounting or attaching a buffer film 1700 on an exposed surface of the second electronic component 510 .

[0189] The buffer film 1700 may have a similar structure to the first buffer film 600, that is, it includes a protective layer and a main adhesive layer. Fig.18 As shown, the buffer film 1700 can be mounted on the exposed surface of the second electronic component 510 through the main adhesive layer of the buffer film 1700 .

[0190] The buffer film 1700 may have a similar structure to the aforementioned third buffer film 800, that is, it includes a protective layer, a main adhesive layer and an adhesive layer. Fig.18 As shown, the buffer film 1700 can be attached to the exposed surface of the second electronic component 510 through the adhesive layer of the buffer film 1700 .

[0191] In actual operation, in order to make the buffer film 1700 better adhere to the surface of the second electronic component 510 , the buffer film 1700 may be attached in a vacuum environment.

[0192] The buffer film 1700 may also be other structures, for example, an adhesive material is coated on the first protective layer or the second protective layer of the second buffer film 700 on the side away from the main adhesive layer, and the second buffer film 700 is attached to the exposed surface of the second electronic component 510 by the adhesive material. For the sake of brevity, it is not described here.

[0193] S102, assembling the third circuit board assembly 500.

[0194] like Fig.19 As shown, when the installation of electronic components is completed on the second circuit board 31 , the installation of electronic components is completed on the third circuit board 32 , and the installation of the buffer film 1700 is completed, the second circuit board 31 and the third circuit board 32 can be fixedly connected by the connecting plate 33 .

[0195] In some examples, one or more welding points are provided at one end of the connecting plate 33 close to the second circuit board 31 and one end of the connecting plate 33 close to the third circuit board 32, corresponding welding points are provided at the area close to the second circuit board 31 and the connecting plate 33, and corresponding welding points are provided at the area close to the third circuit board 32 and the connecting plate 33. In this way, the connecting plate 33 can be connected to the second circuit board 31 and the third circuit board 32 respectively by welding.

[0196] In some examples, the connection plate 33 is fixedly connected to the second circuit board 31 and / or the third circuit board 32 by means of a pin-pin hole matching method, a screw-thread matching method, etc. This application does not limit this.

[0197] S103 , heating and curing the buffer film 1700 to form the first buffer structure 410 .

[0198] One or more curing methods such as heat curing, pressure curing, and UV curing can cause the thermosetting polymer material in the buffer film 1700 to undergo a chemical reaction, and the organic molecules are cross-linked to complete the curing to form a Fig. 20 A first buffer structure 410 is shown.

[0199] by Figure 8 Taking the case where only the third buffer structure 430 is provided on the second electronic component 510 in the third circuit board assembly 500 as an example, several assembly processes of the circuit board assemblies are exemplarily provided below.

[0200] By using a heating tool 100 (or a hot pressing tool 100) to thermally deform the buffer film 1800 before curing, the buffer film 1800 can be formed into the shape of the third buffer structure 430. The thickness and area of ​​the buffer film 1800 before curing can be determined according to the area and height of the electronic components to be protected by the buffer structure. In some examples, the area of ​​the buffer film 1800 can be larger than the area of ​​the exposed surface of the electronic component.

[0201] Before the buffer film 1800 is completely solidified, the position of the buffer film 1800 on the top of the electronic component can be adjusted. For example, the length of the buffer film 1800 on one side of the electronic component can be adjusted to be greater than the length on the other side.

[0202] During the curing process of the buffer film 1800 , the environment where the film is located can be evacuated so that the buffer film 1800 can be better attached to the surface of the protected electronic component.

[0203] The shape of the third buffer structure 430 in the figure below is only an exemplary structure of the solidified buffer film 1800. In the actual production process, the third buffer structure 430 can be wrapped around the periphery of the protected electronic components. The present application does not limit the specific shape of the third buffer structure 430. For example, the receiving portion of the third buffer structure 430 and the side wall can be arranged vertically or at a certain angle (inclined), the side wall of the third buffer structure 430 and the extension portion can be arranged vertically or at a certain angle (inclined), the side wall of the third buffer structure 430 can be surrounded by multiple interconnected planes, and the side wall of the third buffer structure 430 can also be composed of multiple uneven surfaces connected to each other.

[0204] In the case of setting a buffer film to surround multiple protected electronic components at the same time, the heating tool 100 can be applied to the top of the protected component with the highest height, or by setting different grooves matching the shapes of the protected electronic components on the extrusion surface of the heating tool 100, pressure can be applied to the tops of multiple electronic components at the same time to improve the fit between the buffer film and the electronic components. Similarly, in this case, the fit between the buffer film and the electronic components can also be improved by applying negative pressure or vacuuming.

[0205] Figure 21 to Figure 23 The figure shows a schematic diagram of the assembly process of a circuit board assembly. Fig.24 Shown Fig.23 A top view of the buffer structure in FIG. Fig.25 for Fig.24 OO cross-section diagram of the buffer structure.

[0206] Combination Fig. 22 and Fig.24 The third buffer structure 430A includes a receiving portion 431, a side wall 432 and an extension portion 433. The receiving portion 431 is approximately located directly above the exposed surface of the second electronic component 510, and the side wall 432 is located at the periphery of the receiving portion 431 and connected to the receiving portion 431. The extension portion 433 extends from one end of the side wall 432 away from the receiving portion 431 to a direction away from the side wall 432. In some examples, the plane where the extension portion 433 is located can be parallel to the plane where the third circuit board 32 is located.

[0207] refer to Fig.24 In some examples, the extension 433 of the third buffer structure 430A may include a first sub-extension 4331, a second sub-extension 4332, a third sub-extension 4333A, and a fourth sub-extension 4334. The widths of the four sub-extensions of the extension 433 of the third buffer structure 430A may be equal, that is, the closest distances from the edges of the four sub-extensions to the sidewalls 432 connected thereto are equal.

[0208] In some examples, the buffer film 1800 may be Fig.14 The structure of the first buffer film 600 shown is similar, that is, it includes a protective layer and a main adhesive layer. Fig. 22 As shown, the side of the extension portion 433 facing the third circuit board 32 can be bonded to the third circuit board 32 through the main adhesive layer in the buffer film 1800, so that Fig.23 As shown, the third buffer structure 430A can be adhered to the surface of the third circuit board 32 , that is, fixed to the third circuit board 32 .

[0209] In some examples, the buffer film 1800 may be Fig.16 The structure of the third buffer film 800 is similar, that is, it includes a protective layer, a main adhesive layer and an adhesive layer. Fig. 22 As shown, the side of the extension portion 433 facing the third circuit board 32 can be bonded to the third circuit board 32 through the adhesive layer of the buffer film 1800, so that Fig.23 As shown, the third buffer structure 430A can be adhered to the surface of the third circuit board 32 , that is, fixed to the third circuit board 32 .

[0210] The buffer film 1800 may also be other structures. As long as adhesive material is provided on the side of the extension portion 433 facing the third circuit board 32, the cured third buffer structure 430A can be fixedly connected to the third circuit board 32. For the sake of brevity, it will not be elaborated here.

[0211] Figure 26 to Figure 28 This is another schematic diagram of the assembly process of a circuit board assembly. Fig.29 yes Fig.28 A top view of the second circuit board 31 and the third buffer structure 430B, Fig.30 yes Fig.29 A schematic diagram of the AA section of the third buffer structure 430B, Fig.31 yes Fig.28 Lateral view of the mid-CC region.

[0212] The third buffer structure 430B is substantially similar to the third buffer structure 430A, and includes a receiving portion 431, a sidewall 432, and an extension portion 433. The extension portion 433 of the third buffer structure 430B may include a first sub-extension portion 4331, a second sub-extension portion 4332, a third sub-extension portion 4333B, and a fourth sub-extension portion 4334. Among the four sub-extension portions of the extension portion 433 of the third buffer structure 430B, the third sub-extension portion 4333B has the largest width, that is, the closest distance from the edge of the third sub-extension portion 4333B to the sidewall 432 connected thereto is the largest among the four sub-extension portions.

[0213] refer to Fig. 27 and Fig.28As shown, the width of the third sub-extension portion 4333B can satisfy: the third sub-extension portion 4333B can extend to the position where the connecting plate 33 is connected to the third circuit board 32.

[0214] In some examples, a first opening is set at the connection position between the second circuit board 31 and the connecting plate 33, and correspondingly, a second opening is set at the connection position between the connecting plate 33 and the second circuit board 31. The first opening and the second opening can be connected to each other by screws, pins, etc., thereby realizing the connection between the second circuit board 31 and the connecting plate 33.

[0215] In some examples, such as Fig.30 As shown, the fixing portion 4335 of the third sub-extension portion 4333B of the third buffer structure 430B is provided with a first through hole 2201. When the third circuit board 32 and the connecting plate 33 are connected by screws / screw holes or pins / pin holes, the fixing portion 4335 of the third sub-extension portion 4333B is clamped between the third circuit board 32 and the connecting plate 33, and the screws or pins for connecting the first opening and the second opening can pass through the first through hole 2201 at the same time, so that when the third circuit board 32 and the connecting plate 33 are fixedly connected, the third sub-extension portion 4333B is also relatively fixed to the third circuit board 32.

[0216] A third opening may be provided at the connection position between the third circuit board 32 and the connecting plate 33, and correspondingly, a fourth opening may be provided at the connection position between the connecting plate 33 and the third circuit board 32, and the third opening and the fourth opening may be connected to each other by a first connecting member 34, thereby realizing the connection between the third circuit board 32 and the connecting plate 33. The first connecting member 34 may be a screw, a pin, etc.

[0217] In some examples, the first opening on the second circuit board 31, the third opening on the third circuit board 32, the second opening and the fourth opening on the connecting plate 33 may be interconnected, and the second circuit board 31, the connecting plate 33 and the third circuit board 32 may be relatively fixed by the same screw or pin. This is equivalent to providing a connecting channel on the connecting plate 33, through which the screw or pin may connect the second circuit board 31, the connecting plate 33 and the third circuit board 32.

[0218] Combination Fig.29 and Fig.31 Corresponding solder joints 35 can be provided between the second circuit board 31 and the connecting plate 33, and between the third circuit board 32 and the connecting plate 33. The connection positions of the solder joints 35 avoid the fixing portion 4335 of the third buffer structure 430B sandwiched between the third circuit board 32 and the connecting plate. The solder joints 35 can realize mutual connection between the circuit boards and the connecting plates.

[0219] It should also be noted that the other several sub-extensions of the third buffer structure 430B may also extend to other locations where the third circuit board 32 and the connecting board 33 are connected (for example, Fig.28 The fixing method of other sub-extension parts is similar to the fixing method of the third sub-extension part 4333B, and will not be described here for the sake of brevity.

[0220] Figure 32 to Figure 34 This is another schematic diagram of the assembly process of a circuit board assembly. Fig.35 yes Fig.28 A top view of the second circuit board 31 and the third buffer structure 430C, Fig.36 yes Fig.30 Schematic diagram of the BB cross section of the third buffer structure 430C.

[0221] The third buffer structure 430C is substantially similar to the third buffer structure 430A, and includes a receiving portion 431, a sidewall 432, and an extension portion 433. The extension portion 433 of the third buffer structure 430C may include a first sub-extension portion 4331, a second sub-extension portion 4332, a third sub-extension portion 4333C, and a fourth sub-extension portion 4334. Among the four sub-extension portions of the extension portion 433 of the third buffer structure 430C, the third sub-extension portion 4333C has the largest width, that is, the closest distance from the edge of the third sub-extension portion 4333C to the sidewall 432 connected thereto is the largest among the four sub-extension portions.

[0222] In some examples, such as Fig.34 As shown, when the second circuit board 31, the connecting plate 33 and the third circuit board 32 are fixedly connected to each other, the third sub-extension portion 4333C can pass through the connection position between the third circuit board 32 and the connecting plate 33 and extend to the fixed position of the third circuit board 32 and the middle frame 11.

[0223] The portion of the third sub-extension portion 4333C extending to the fixed position of the third circuit board 32 and the middle frame 11 can be referred to as a fixing portion 4335. In some examples, such as Fig.36 As shown, the fixing portion 4335 may be provided with a second through hole 2202 , and the second through hole 2202 may be used for fixing and connecting the third buffer structure 430C to the third circuit board 32 .

[0224] In some examples, the third circuit board 32 and the middle frame 11 can be connected through the second connecting member 36, and the position of the second through hole 2202 on the third sub-extension 4333C corresponds to the position of the opening on the third circuit board 32 for connecting with the middle frame 11. When the third circuit board 32 and the middle frame 11 are relatively fixed through the second connecting member 36, the second connecting member 36 can simultaneously pass through the second through hole 2202 on the third sub-extension 4333C, and the third sub-extension 4333C can be relatively fixed to the third circuit board 32 through the screw.

[0225] refer to Fig.35 Corresponding solder joints 35 can be provided between the second circuit board 31 and the connecting plate 33, and between the third circuit board 32 and the connecting plate 33. The connection positions of the solder joints 35 avoid the fixing portions 4335 of the third buffer structure 430B extending from between the third circuit board 32 and the connecting plate, so that the circuit boards and the connecting plates can be connected to each other through the solder joints 35.

[0226] It should also be noted that other structures for relative fixing may be provided between the third circuit board 32 and the middle frame 11, and the other several sub-extensions of the third buffer structure 430C may also extend to these structures for relative fixing between the third circuit board 32 and the middle frame 11 (for example, Fig.34 The third circuit board 32 may also be provided with a screw hole on the left side for fixed connection with the middle frame 11. The fixing method of other sub-extensions is similar to that of the third sub-extension 4333C, and will not be described here for brevity.

[0227] Figure 37 to Figure 39 This is another schematic diagram of the assembly process of a circuit board assembly. Fig.40 yes Fig.39 FIG. 4 is a top view of the second circuit board 31 and the third buffer structure 430D.

[0228] In the case where the shielding cover 23 is provided on the second circuit board assembly 20, a third buffer structure 430D may also be provided on the second circuit board assembly 20. The structure of the third buffer structure 430D is substantially similar to that of the third buffer structure 430A, and includes a receiving portion 431, a side wall 432, and an extension portion 433. The extension portion 433 of the third buffer structure 430D may include a first sub-extension portion 4331, a second sub-extension portion 4332, a third sub-extension portion 4333D, and a fourth sub-extension portion 4334. The widths of the four sub-extension portions may be equal.

[0229] In some examples, the buffer film 1800 may be Fig.14 The structure of the first buffer film 600 is similar, that is, it includes a protective layer and a main adhesive layer. Fig.38As shown, the side of the extension portion 433 facing the first circuit board 21 can be bonded to the first circuit board 21 through the main adhesive layer in the buffer film 1800, so that Fig.39 As shown, the third buffer structure 430D can be adhered to the surface of the first circuit board 21 , that is, relatively fixed to the first circuit board 21 .

[0230] In some examples, the buffer film 1800 may be Fig.16 The structure of the third buffer film 800 is similar, that is, it includes a protective layer, a main adhesive layer and an adhesive layer. Fig.38 As shown, the side of the extension portion 433 facing the first circuit board 21 can be bonded to the first circuit board 21 through the adhesive layer of the buffer film 1800, so that Fig.39 As shown, the third buffer structure 430D can be adhered to the surface of the first circuit board 21 , that is, relatively fixed to the first circuit board 21 .

[0231] In some examples, a shielding cover 23 is disposed outside the first electronic component 22, and one or more of the four sub-extensions of the third buffer structure 430D can extend to the fixed position of the side wall of the shielding cover 23 and the first circuit board 21, or in other words, one or more of the four sub-extensions of the third buffer structure 430D can be pressed on the surface of the first circuit board 21 by the side wall of the shielding cover 23. For example, Fig.39 and Fig.40 As shown, the first sub-extension 4331 , the second sub-extension 4332 , the third sub-extension 4333D and the fourth sub-extension 4334 can all be pressed onto the surface of the first circuit board 21 by the side wall of the shielding cover 23 to achieve relative fixation with the first circuit board 21 .

[0232] by Fig.11 Taking the third circuit board assembly 500 in the example where only the fifth buffer structure 450 is provided on the second electronic component 510, Figure 41 to Figure 45 An assembling process corresponding to the third circuit board assembly 500 is exemplarily provided.

[0233] Any of the above-mentioned assembly methods can be applied to the assembly process of the third circuit board assembly 500 for setting the fifth buffer structure 450 , and the relevant contents can refer to the above-mentioned description.

[0234] Compared with the assembly process of setting the third buffer structure 430, the main difference between the assembly process of the third circuit board assembly 500 with the fifth buffer structure 450 is that when the buffer film 1800 is cured under the action of heat and pressure to form a Fig.42After the third buffer structure 430 is formed, it is necessary to perform a hollowing operation on the receiving portion of the third buffer structure 430, and specifically, the hollowing of the receiving portion of the third buffer structure 430 can be achieved by laser engraving, chemical etching, etc. The depth of laser engraving or chemical etching can be determined according to the thickness of the third buffer structure 430. The area of ​​the hollowed-out area can be smaller than the area of ​​the exposed surface of the electronic component.

[0235] After the receiving portion of the third buffer structure 430 is hollowed out, the space enclosed by the side wall of the third buffer structure 430 and the exposed surface of the second electronic component 510 can be filled with a heat-conducting medium 1010. The heat-conducting medium 1010 can be in contact with the second electronic component 510 and the second circuit board 31, respectively. Thus, the heat generated during the operation of the second electronic component 510 can be conducted to the second circuit board 31 via the heat-conducting medium 1010, and then conducted to the external space of the third circuit board assembly 500 via the second circuit board 31, thereby improving the heat dissipation capacity of the second electronic component 510.

[0236] It should be noted that the fifth buffer structure 450 may also be provided with an extension portion, which may extend to the position where the connecting plate 33 is connected to the third circuit board 32 and be clamped between the connecting plate 33 and the third circuit board 32. When the connecting plate 33 and the third circuit board 32 are relatively fixed, the fifth buffer structure 450 may also be relatively fixed to the third circuit board 32. For details, please refer to Fig.19 Description of the relevant content in .

[0237] The extension of the fifth buffer structure 450 can also extend to a relatively fixed structural position between the third circuit board 32 and the middle frame 11. When the third circuit board 32 and the middle frame 11 are relatively fixed, the fifth buffer structure 450 can also be relatively fixed to the third circuit board 32. For details, please refer to Fig. 20 Description of the relevant content in .

[0238] In the case where a shielding cover is provided outside the second electronic component 510, the extension of the fifth buffer structure 450 can also be pressed under the side wall of the shielding cover, thereby achieving relative fixation with the third circuit board 32. For details, please refer to Fig.21 Description of the relevant content in .

[0239] by Figure 5Taking the third circuit board assembly 500 in the example, when a pressure perpendicular to the thickness direction of the second circuit board 31 is applied to the third circuit board assembly 500, the strain of the second electronic component 510 and the strain of the third electronic component 520 are detected during the process of the second circuit board 31 and the second electronic component 510 approaching each other. Table 1 shows the maximum strains of the two electronic components when the first buffer structure 410 is provided and when the first buffer structure 410 is not provided. The magnitude of the applied force is 25N.

[0240] Table 1

[0241] Maximum strain Setting the first buffer structure 410 The first buffer structure 410 is not provided First Electronic Components 510 <![CDATA[3.01×10 -5 ]]> <![CDATA[4.20×10 -5 ]]> Second electronic component 520 <![CDATA[4.27×10 -5 ]]> <![CDATA[3.24×10 -4 ]]>

[0242] Comparing the data in Table 1, it can be seen that when the same external pressure is applied to the third circuit board assembly 500, compared with the case where the first buffer structure 410 is not provided, if the first buffer structure 410 is provided on the exposed surface of the second electronic component 510, the maximum strain generated by the second electronic component 510 is smaller, and the maximum strain generated by the third electronic component 520 adjacent to the second electronic component 510 is also relatively smaller. Therefore, the probability of the second electronic component 510 failing due to external force is smaller, and the probability of the third electronic component 520 failing due to external force is also reduced. The first buffer structure 410 can not only improve the reliability and stability of the second electronic component 510, but also to a certain extent improve the reliability and stability of other electronic components located on the same mounting surface 32A as the second electronic component 510.

[0243] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0244] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that: include: a first circuit board, a first electronic component and a first buffer structure, The first electronic component is mounted on the first circuit board, the first buffer structure is arranged at the periphery of the first electronic component, and the distance from the top of the first buffer structure to the first circuit board is greater than the distance from the top of the first electronic component to the first circuit board.

2. The circuit board assembly according to claim 1, characterized in that: The first buffer structure includes a first receiving portion, the first receiving portion is attached to the top of the first electronic component, and the top of the first buffer structure includes the first receiving portion.

3. The circuit board assembly according to claim 1 or 2, characterized in that: The first buffer structure includes a side wall, which is arranged around the first electronic component, a first end of the side wall abuts against the first circuit board, a second end of the side wall is arranged away from the first circuit board, and the top of the first buffer structure includes the second end of the side wall.

4. The circuit board assembly according to claim 3, characterized in that: The second end of the side wall is connected to and flush with the first receiving portion.

5. The circuit board assembly according to claim 3 or 4, characterized in that: The circuit board assembly further includes a heat-conducting medium, and the heat-conducting medium is disposed on the top of the first electronic component.

6. The circuit board assembly according to any one of claims 3 to 5, characterized in that: The first buffer structure further includes at least one extension portion, the at least one extension portion is connected to the first end of the side wall, and the at least one extension portion is fixedly connected to the first circuit board.

7. The circuit board assembly according to claim 6, characterized in that: A surface of the at least one extension portion close to the first circuit board is bonded to the first circuit board.

8. The circuit board assembly according to claim 6 or 7, characterized in that: The circuit board assembly further includes a second circuit board and a connecting board. The first circuit board and the second circuit board are stacked and connected via the connecting board. The at least one extension portion is sandwiched between the first circuit board and the connecting board.

9. The circuit board assembly according to claim 8, characterized in that: The circuit board assembly also includes a first connecting member, the at least one extension portion has a first opening, the first circuit board has a second opening, the connecting board has a third opening, and the first connecting member passes through the first opening, the second opening and the third opening.

10. The circuit board assembly according to claim 6, characterized in that: The circuit board assembly further comprises a shielding cover, wherein one end of the shielding cover close to the first circuit board is pressed on the at least one extension portion.

11. The circuit board assembly according to any one of claims 1 to 10, characterized in that: The first buffer structure is formed by solidifying a thin film, the thin film includes a first protective layer and a main adhesive layer, the first protective layer is far away from the first electronic component, the main adhesive layer is close to the first electronic component, the first protective layer is composed of a material with an electrical conductivity less than a first threshold, and the main adhesive layer is composed of a thermosetting polymer material.

12. The circuit board assembly according to claim 11, characterized in that: The film further includes a second protective layer composed of a material having an electrical conductivity less than a second threshold value.

13. The circuit board assembly according to claim 11 or 12, characterized in that: The film further comprises an adhesive layer, and the adhesive layer is bonded to the top of the first circuit board and / or the first electronic component.

14. The circuit board assembly according to any one of claims 1 to 13, characterized in that: The circuit board assembly further includes a second electronic component, the second electronic component and the first electronic component are mounted on the same surface of the first circuit board, and the height of the second electronic component is smaller than the height of the first electronic component; The first buffer structure is also arranged on the periphery of the second electronic component.

15. The circuit board assembly according to any one of claims 1 to 14, characterized in that: The first electronic component is a glass chip.

16. The circuit board assembly according to any one of claims 1 to 15, characterized in that: The circuit board assembly further includes a second buffer structure, which is wrapped around the outer side of the circuit board assembly.

17. An electronic device, characterized in that: The electronic device comprises a middle frame and a circuit board assembly according to any one of claims 1 to 16, wherein the circuit board assembly is fixedly connected to the middle frame.

18. An electronic device, characterized in that: The electronic device comprises a middle frame and the circuit board assembly according to claim 6, wherein the circuit board assembly is fixedly connected to the middle frame, and is characterized in that the electronic device further comprises a second connecting member, the middle frame has a fourth opening, the first circuit board of the circuit board assembly has a fifth opening, and the at least one extension has a sixth opening, The second connecting member passes through the fourth opening, the fifth opening, and the sixth opening and fixedly connects the middle frame, the first circuit board, and the at least one extension portion.

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